本創作係有關一種導線架改良，尤指一種可將半導體晶片所產生的熱快速且有效地排出，並且有效的提高工作效率之導線架改良。The present invention relates to a lead frame improvement, and more particularly to a lead frame improvement that can quickly and efficiently discharge heat generated by a semiconductor wafer and effectively improve work efficiency.
已知發光二極體具有省電及高亮度的特性，並且已普遍使用於各種照明應用。為了因應高亮度的照明需求，進而提高發光二極體晶片的功率及配置密度，如此伴隨了產生光二極體晶片熱量積蓄的問題。若發光二極體晶片產生的熱無法有效排出，那麼在發光二極體晶片上積蓄的熱量，會嚴重的影響發光二極體晶片的發光性能。已知的發光二極體封裝結構，通常透過印刷電路板再將熱傳到散熱器上的方式，如此散熱效果欠佳，最終將有導致發光二極體晶片損壞縮短使用壽命之虞。Light-emitting diodes are known to have power-saving and high-brightness characteristics and are commonly used in various lighting applications. In order to increase the power and arrangement density of the light-emitting diode wafer in response to high-brightness illumination requirements, the problem of heat accumulation of the photodiode wafer is accompanied. If the heat generated by the light-emitting diode wafer cannot be effectively discharged, the heat accumulated on the light-emitting diode wafer may seriously affect the light-emitting performance of the light-emitting diode wafer. The known light-emitting diode package structure usually transmits heat to the heat sink through the printed circuit board, so that the heat dissipation effect is not good, and finally, the light-emitting diode wafer is damaged and the service life is shortened.
由於為發光二極體晶片所發出的光線具有點光源、亮度不均勻的特色，因此就有必要在光線的聚焦以及提高發光效率著手改進其缺失。Since the light emitted by the LED chip has the characteristics of a point light source and uneven brightness, it is necessary to improve the defect by focusing the light and improving the luminous efficiency.
有鑑於此，本創作係在提供一種導線架改良，尤指一種可將半導體晶片所產生的熱快速且有效地排出，並且有效的提高發光效率之導線架改良，為其主要目的者。In view of this, the present invention provides a lead frame improvement, and in particular, a lead frame improvement that can quickly and efficiently discharge heat generated by a semiconductor wafer and effectively improve luminous efficiency, is its main purpose.
為達上揭目的，本創作之導線架至少包含有：絕緣本體以及至少一第一、第二極性接腳，該絕緣本體係設有一內凹之功能區，該第一、第二極性接腳相互分離，且與該絕緣本體相固接，並由該功能區內分別向外延伸至絕緣本體外部，該第一極性接腳並於功能區內形成有散熱部，該散熱部之頂面係顯露於功能區，及底面係顯露於絕緣本體外，該第二極性接腳之厚度係小於該第一極性接腳之厚度。In order to achieve the goal, the lead frame of this creation contains at least: insulationThe body and the at least one first and second polarity pins, the insulating system is provided with a concave functional area, the first and second polarity pins are separated from each other and fixed to the insulating body, and the function is The first polarity pin extends outwardly to the outside of the insulating body, and the first polarity pin forms a heat dissipating portion in the functional area, the top surface of the heat dissipating portion is exposed in the functional area, and the bottom surface is exposed outside the insulating body, the first The thickness of the bipolar pin is less than the thickness of the first polarity pin.
其中，該散熱部上可供設置半導體晶片(例如可為發光二極體晶片)，可將半導體晶片所產生的熱快速且有效地排出，並且有效的提高工作效率。Wherein, the semiconductor wafer (for example, a light-emitting diode wafer) can be disposed on the heat dissipating portion, and the heat generated by the semiconductor wafer can be quickly and effectively discharged, and the working efficiency is effectively improved.
依據上述技術特徵，所述散熱部至少一側形成有預插端部，該預插端部係由該功能區內向外延伸至該絕緣本體外部。According to the above technical feature, at least one side of the heat dissipating portion is formed with a pre-inserted end portion extending outward from the functional region to the outside of the insulative housing.
上述之預插端部之厚度係小於該散熱部之厚度。The thickness of the pre-inserted end portion is smaller than the thickness of the heat dissipating portion.
依據上述技術特徵，所述散熱部可供至少一發光二極體晶片設置，該發光二極體晶片並利用至少一導線分別與該第一極性接腳或第二極性接腳形成電性連接。According to the above technical feature, the heat dissipating portion is disposed on the at least one light emitting diode chip, and the light emitting diode chip is electrically connected to the first polarity pin or the second polarity pin by using at least one wire.
依據上述技術特徵，所述導線架具有一第一極性接腳，而該第一極性接腳延伸至該絕緣本體外部形成有二接腳部。According to the above technical feature, the lead frame has a first polarity pin, and the first polarity pin extends to the outside of the insulating body to form two pins.
依據上述技術特徵，所述導線架具有二個相互分離之第二極性接腳，該第二極性接腳於該功能區內形成有一導接部，而延伸至該絕緣本體外部則形成有一接腳部。According to the above technical feature, the lead frame has two second polarity pins separated from each other, the second polarity pin forms a guiding portion in the functional area, and a pin is formed outside the insulating body. unit.
10‧‧‧絕緣本體10‧‧‧Insulated body
11‧‧‧功能區11‧‧‧ functional area
20‧‧‧第一極性接腳20‧‧‧First polarity pin
21‧‧‧散熱部21‧‧‧ Department of heat dissipation
211‧‧‧頂面211‧‧‧ top surface
212‧‧‧底面212‧‧‧ bottom
22‧‧‧預插端部22‧‧‧Pre-inserted end
23‧‧‧接腳部23‧‧‧foot
30‧‧‧第二極性接腳30‧‧‧Second polarity pin
31‧‧‧導接部31‧‧‧Guidance
32‧‧‧接腳部32‧‧‧foot
40‧‧‧金屬基板40‧‧‧Metal substrate
41‧‧‧功能區塊41‧‧‧ functional blocks
42‧‧‧連接區塊42‧‧‧Connected block
43‧‧‧固定支架43‧‧‧Fixed bracket
51‧‧‧半導體晶片51‧‧‧Semiconductor wafer
52‧‧‧導線52‧‧‧Wire
53‧‧‧膠體53‧‧‧colloid
第一圖係為本創作中導線架之結構立體圖。The first picture is a perspective view of the structure of the lead frame in the creation.
第二圖係為本創作中導線架之結構剖視圖。The second figure is a cross-sectional view of the structure of the lead frame in the present creation.
第三圖(A)~(E)係為本創作中製造導線架之結構立體圖。The third figure (A) ~ (E) is a perspective view of the structure of the lead frame manufactured in the creation.
第四圖係為本創作中導線架與發光二極體晶片之結構立體圖。The fourth picture is the three-dimensional structure of the lead frame and the light-emitting diode chip in the creation.Figure.
第五圖係為本創作中導線架與發光二極體晶片之結構剖視圖。The fifth figure is a cross-sectional view of the lead frame and the light emitting diode chip in the present creation.
本創作之特點，可參閱本案圖式及實施例之詳細說明而獲得清楚地瞭解。The characteristics of this creation can be clearly understood by referring to the detailed description of the drawings and the examples.
如第一圖為本創作導線架之結構立體圖所示，本創作之消費回饋裝置至少包含有：絕緣本體10、至少一第一極性接腳20以及至少一第二極性接腳30。As shown in the first figure, the structure of the lead frame of the present invention includes at least one insulative housing 10, at least one first polarity pin 20 and at least one second polarity pin 30.
該絕緣本體10係設有一內凹之功能區11；該第一極性接腳20與該絕緣本體10相固接，且係由該功能區11內分別向外延伸至絕緣本體10外部，其並於功能區11內形成有散熱部21，請同時參閱第二圖所示，該散熱部21之頂面211係顯露於功能區11，及其底面212係顯露於絕緣本體10外，該散熱部21至少一側形成有預插端部22，該預插端部22係由該功能區11內向外延伸至該絕緣本體10外部，該預插端部22之厚度係小於該散熱部21之厚度；如圖所示之實施例中，該導線架可具有一第一極性接腳20，而該第一極性接腳20延伸至該絕緣本體10外部形成有二接腳部23，可供焊接於電路板(圖未示)上。The insulative housing 10 is provided with a recessed functional area 11; the first polarity pin 20 is fixed to the insulative housing 10 and extends outwardly from the functional area 11 to the outside of the insulative housing 10, respectively. A heat dissipating portion 21 is formed in the functional area 11. Please refer to the second figure, the top surface 211 of the heat dissipating portion 21 is exposed in the functional area 11, and the bottom surface 212 is exposed outside the insulating body 10. The pre-inserted end portion 22 extends outwardly from the inside of the functional area 11 to the outside of the insulative housing 10, and the thickness of the pre-inserted end portion 22 is smaller than the thickness of the heat dissipating portion 21 In the embodiment shown in the figure, the lead frame may have a first polarity pin 20, and the first polarity pin 20 extends to the outside of the insulative housing 10 to form two legs 23 for soldering. On the circuit board (not shown).
該第二極性接腳30係與該第一極性接腳20相互分離，如圖所示之實施例中，係具有二個相互分離之第二極性接腳30且分別固接於該絕緣本體10，其係由該功能區11內分別向外延伸至絕緣本體10外部，該第二極性接腳30之厚度係小於該第一極性接腳20之厚度，而該第二極性接腳30於該功能區11內形成有一導接部31，而延伸至該絕緣本體10外部則形成有一接腳部32，同樣可供焊接於電路板(圖未示)上，而構成電性導通。The second polarity pin 30 is separated from the first polarity pin 20, and has two second polarity pins 30 separated from each other and fixed to the insulative housing 10 respectively. The thickness of the second polarity pin 30 is smaller than the thickness of the first polarity pin 20, and the second polarity pin 30 is formed by the function of the second polarity pin 30. A guiding portion 31 is formed in the functional area 11, and a pin portion 32 is formed on the outside of the insulating body 10. The soldering portion 32 is also soldered to the circuit board (not shown) to form electrical continuity.
具體實施時，先由一金屬基板40之至少一板面預先加工有複數條厚度較厚的功能區塊41，如第三圖(A)、(B)所示；之後以沖壓加工方式於各功能區塊41沖壓形成至少一第一極性接腳20及第二極性接腳30，以及於連接區塊41形成複數分別與各第一極性接腳20及各第二極性接腳30連接的固定支架43；最後於各功能區塊41處附加一構成各功能區塊41所屬之第一極性接腳20及其所對應之第二極性接腳30結合的絕緣本體10，最後以沖壓方式將各絕緣本體10外圍的固定支架43切除，而完成本創作之導線架。In a specific implementation, a plurality of thick functional blocks 41 are pre-processed from at least one surface of a metal substrate 40, as shown in the third figures (A) and (B); The functional block 41 is formed by stamping at least one first polarity pin 20 and the second polarity pin 30, and forming a plurality of fixings respectively connected to the first polarity pin 20 and each of the second polarity pins 30 in the connection block 41. The bracket 43 is finally attached to each of the functional blocks 41, and an insulating body 10 is formed, which is a combination of the first polarity pin 20 and the corresponding second polarity pin 30 of the functional block 41. The fixing bracket 43 on the periphery of the insulative housing 10 is cut off to complete the lead frame of the present invention.
另一實施例中，可先由一金屬基板40之至少一板面係加工形成複數功能區塊41，如第三圖(C)、(D)所示，以及相對包圍在各功能區塊41外圍的連接區塊42，且連接區塊42之厚度係相對小於各功能區塊41之厚度；之後以沖壓加工方式於各功能區塊41沖壓形成至少一第一極性接腳20，於連接區塊42形成複數分別對應於各第一極性接腳20的第二極性接腳30，以及於連接區塊41形成複數分別與各第一極性接腳20及各第二極性接腳30連接的固定支架43；最後於各功能區塊42處附加一構成各功能區塊41所屬之第一極性接腳20及其所對應之第二極性接腳30結合的絕緣本體10，最後以沖壓方式將各絕緣本體10外圍的固定支架43切除，而完成本創作之導線架。其中，將各固定支架需要被截斷的位置控制在位於厚度相對較薄的連接區塊處，不但可以有效降低下料製程之加工力道，更可防止絕緣本體在最後的下料製程遭受毀損。In another embodiment, the plurality of functional blocks 41 may be formed by at least one surface of a metal substrate 40, as shown in the third (C) and (D), and relatively enclosed in the functional blocks 41. The peripheral connection block 42 and the thickness of the connection block 42 are relatively smaller than the thickness of each functional block 41; then at least one first polarity pin 20 is stamped into each functional block 41 by press working, in the connection area. The block 42 forms a plurality of second polarity pins 30 respectively corresponding to the first polarity pins 20, and forms a plurality of fixed connections to the first polarity pins 20 and the second polarity pins 30 respectively in the connection block 41. The bracket 43 is finally attached to each of the functional blocks 42 to form an insulative body 10 constituting the first polarity pin 20 to which each functional block 41 belongs and the second polarity pin 30 corresponding thereto, and finally each is punched. The fixing bracket 43 on the periphery of the insulative housing 10 is cut off to complete the lead frame of the present invention. Wherein, the position where each fixing bracket needs to be cut off is controlled at a relatively thin connecting block, which not only can effectively reduce the processing force of the blanking process, but also prevent the insulating body from being damaged in the final unloading process.
再者，上述可用於大面積之金屬基板製作本創作之導線架，而小面積之金屬基板製作時，則可如第三圖(E)所示，由一金屬基板40之至少一板面直接以沖壓加工方式形成至少一第一極性接腳20、第二極性接腳30，以及形成複數分別與該第一極性接腳20及第二極性接腳30連接的固定支架43；再利用沖壓或模壓方式於該固定支架43靠近於該第一極性接腳20處打凹，形成厚度相對較薄之區段，以及將第二極性接腳30厚度削減；再附加一構成該第一極性接腳20及其所對應之第二極性接腳30結合的絕緣本體10，最後以沖壓方式將各絕緣本體10外圍的固定支架43切除，而完成本創作之導線架。Furthermore, the above-mentioned metal substrate for a large area can be used to fabricate the lead frame of the present invention, and when the metal substrate of a small area is fabricated, as shown in the third figure (E), at least one surface of a metal substrate 40 can be directly Forming at least one first by stampinga polarity pin 20, a second polarity pin 30, and a plurality of fixing brackets 43 respectively connected to the first polarity pin 20 and the second polarity pin 30; and then being pressed or molded to the fixing bracket 43 to be close to The first polarity pin 20 is recessed to form a relatively thin section, and the thickness of the second polarity pin 30 is reduced; and the first polarity pin 20 and the corresponding second polarity are further formed. The insulative housing 10 of the pin 30 is combined, and finally the fixing bracket 43 on the periphery of each insulative housing 10 is cut out by punching to complete the lead frame of the present invention.
本創作之散熱部21可供至少一半導體晶片51(例如可以為半導體感測元件或發光二極體晶片)設置，如第四圖及第五圖所示，該半導體晶片51並利用至少一導線52分別與該第一極性接腳之散熱部21以及第二極性接腳之導接部31形成電性連接，並有一膠體53封裝於該功能區內11以對半導體晶片51及導線52做封裝，即形成具特定功能(如用以產生感測訊號、用以構成訊號傳遞或用以產生預定光源)的表面黏著型電子元件。其中，該散熱部21可將半導體晶片51所產生的熱快速且有效地排出，並且有效的提高工作效率，並確保其使用壽命。The heat dissipating portion 21 of the present invention can be provided for at least one semiconductor wafer 51 (for example, a semiconductor sensing element or a light emitting diode wafer). As shown in the fourth and fifth figures, the semiconductor wafer 51 utilizes at least one wire. 52 is electrically connected to the heat dissipation portion 21 of the first polarity pin and the guiding portion 31 of the second polarity pin, and a glue 53 is encapsulated in the functional area 11 to encapsulate the semiconductor wafer 51 and the wire 52. That is, a surface-adhesive electronic component having a specific function (such as a sensing signal for generating a signal transmission or for generating a predetermined light source) is formed. The heat dissipating portion 21 can quickly and efficiently discharge the heat generated by the semiconductor wafer 51, and effectively improve work efficiency and ensure the service life thereof.
綜上所述，本創作提供一較佳可行之導線架改良，爰依法提呈新型專利之申請；本創作之技術內容及技術特點巳揭示如上，然而熟悉本項技術之人士仍可能基於本創作之揭示而作各種不背離本案創作精神之替換及修飾。因此，本創作之保護範圍應不限於實施例所揭示者，而應包括各種不背離本創作之替換及修飾，並為以下之申請專利範圍所涵蓋。In summary, the present invention provides a better and feasible lead frame improvement, and the application for a new patent is submitted according to law; the technical content and technical features of the present invention are disclosed above, but those skilled in the art may still be based on the present creation. The disclosure reveals various substitutions and modifications that do not depart from the spirit of the creation of the case. Therefore, the scope of the present invention is not limited to the embodiments disclosed, but includes various alternatives and modifications that do not depart from the present invention and are covered by the following claims.
10‧‧‧絕緣本體10‧‧‧Insulated body
11‧‧‧功能區11‧‧‧ functional area
20‧‧‧第一極性接腳20‧‧‧First polarity pin
21‧‧‧散熱部21‧‧‧ Department of heat dissipation
22‧‧‧預插端部22‧‧‧Pre-inserted end
23‧‧‧接腳部23‧‧‧foot
30‧‧‧第二極性接腳30‧‧‧Second polarity pin
31‧‧‧導接部31‧‧‧Guidance
32‧‧‧接腳部32‧‧‧foot
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103200414UTWM477678U (en) | 2014-01-09 | 2014-01-09 | Improvement of lead frame |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103200414UTWM477678U (en) | 2014-01-09 | 2014-01-09 | Improvement of lead frame |
| Publication Number | Publication Date |
|---|---|
| TWM477678Utrue TWM477678U (en) | 2014-05-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103200414UTWM477678U (en) | 2014-01-09 | 2014-01-09 | Improvement of lead frame |
| Country | Link |
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| TW (1) | TWM477678U (en) |
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