本發明係關於雷射加工裝置。This invention relates to a laser processing device.
在專利文獻1，記載有一雷射加工裝置，其具備有：保持工件之保持機構；及對保持於保持機構的工件照射雷射光之雷射光照射機構。在專利文獻1所記載的雷射加工裝置，具有聚光鏡之雷射光照射機構是對基台固定，沿著與聚光透鏡的光軸垂直的方向之工件的移動，是藉由保持機構實施。Patent Document 1 describes a laser processing device comprising: a holding mechanism for holding a workpiece; and a laser irradiation mechanism for irradiating the workpiece held by the holding mechanism with laser light. In the laser processing device described in Patent Document 1, the laser irradiation mechanism, which includes a focusing lens, is fixed to a base, and movement of the workpiece in a direction perpendicular to the optical axis of the focusing lens is achieved by the holding mechanism.
[專利文獻1]日本專利第5456510公報[Patent Document 1] Japanese Patent No. 5456510
又，在前述這樣的雷射加工裝置，期望可使加工速度提升。因此，考量增大藉由保持機構之工件的移動速度。但，在藉由保持機構之工件的移動速度的增大上存有界限。相對於此，例如考量與進行藉由保持機構之工件的移動，也朝相反方向使雷射光照射機構移動，藉此，使雷射光的聚光點對工件之移動速度提升。但，如前述般，在專利文獻1所記載的雷射加工裝置，由於雷射光照射機構對基台固定，故，不易使雷射光照射機構移動。因此，在專利文獻1所記載的雷射加工裝置，更不易提升加工速度。Furthermore, in laser processing devices such as the one described above, it is desirable to increase the processing speed. Therefore, consideration has been given to increasing the speed at which the workpiece is moved by the holding mechanism. However, there are limits to how fast the workpiece can be moved by the holding mechanism. Alternatively, consideration could be given to moving the laser irradiation mechanism in the opposite direction to the movement of the workpiece by the holding mechanism, thereby increasing the speed at which the laser beam's focal point on the workpiece moves. However, as mentioned above, in the laser processing device described in Patent Document 1, since the laser irradiation mechanism is fixed to the base, it is difficult to move the laser irradiation mechanism. Therefore, increasing the processing speed is even more difficult with the laser processing device described in Patent Document 1.
因此，本發明的目的係在於提供可使加工速度提升的雷射加工裝置。Therefore, the object of the present invention is to provide a laser processing device that can increase the processing speed.
本發明的雷射加工裝置，係用來藉由對設定有延著第1方向延伸並且沿著與第1方向交叉的第2方向排列的複數個線之對象物，沿著線照射雷射光，使得在對象物沿著線形成改質區域之雷射加工裝置，其特徵為具備：支承部，其係用來支承對象物；第1雷射加工頭，其係用來對支承於支承部的對象物照射前述雷射光；照相機，其係用來對支承於支承部的對象物進行攝像；第1移動機構，其係用來使支承部沿著第1方向移動；第2移動機構，其係至少使第1雷射加工頭沿著第1方向及第2方向移動；控制部，其係在從第1雷射加工頭輸出雷射光的狀態，藉由控制第1移動機構及第2移動機構，沿著第1方向使支承部與第1雷射加工頭互相朝相反方向移動，實施沿著線對對象物照射前述雷射光之照射處理，第2移動機構係包含：第1移動部，其係沿著第1方向延伸並且安裝有第1雷射加工頭，用來使第1雷射加工頭沿著第1方向移動；及第2移動機構係包含：第2移動部，其係沿著第2方向延伸並且安裝有第1移動部，用來使第1移動部沿著第2方向移動；及照相機係經由與第1移動部不同的構件，安裝於第2移動部。The laser processing device of the present invention is used to irradiate laser light along the lines to an object provided with a plurality of lines extending along a first direction and arranged along a second direction intersecting the first direction, so as to form a modified area along the lines on the object. The laser processing device is characterized by comprising: a support portion for supporting the object; a first laser processing head for irradiating the object supported by the support portion with the aforementioned laser light; a camera for photographing the object supported by the support portion; a first moving mechanism for moving the support portion along the first direction; a second moving mechanism for moving the first laser processing head along at least the first direction and the second direction; and a control portion. While the first laser processing head is outputting laser light, the support portion and the first laser processing head are moved in opposite directions along a first direction by controlling a first moving mechanism and a second moving mechanism to perform the aforementioned irradiation treatment of the object along a line. The second moving mechanism includes: a first moving portion extending along the first direction and having the first laser processing head mounted thereon, for moving the first laser processing head along the first direction; and a second moving mechanism including: a second moving portion extending along the second direction and having the first moving portion mounted thereon, for moving the first moving portion along the second direction; and a camera mounted on the second moving portion via a separate component from the first moving portion.
在此雷射加工裝置，用來支承對象物的支承部是藉由第1移動機構至少可朝第1方向移動，且用來對支承於支承部的對象物照射雷射光之第1雷射加工頭是藉由第2移動機構可朝第1方向及第2方向移動。第1方向係為設定有被設定在對象物的加工預定的線的延伸方向之方向，第2方向係為設定於該線的排列方向之方向。藉此，在此雷射加工裝置，藉由控制部的控制，可實施一邊沿著第1方向使支承部與第1雷射加工頭互相朝相反方向移動，一邊沿著該線朝對象物照射雷射光之照射處理。因此，當進行雷射光的照射時，比起僅使對象物側移動的情況，可使加工速度提升。In this laser processing device, a support portion for supporting an object is movable in at least a first direction by a first moving mechanism, and a first laser processing head for irradiating the object supported by the support portion with laser light is movable in both the first and second directions by a second moving mechanism. The first direction is the direction along which a predetermined line defined for processing the object extends, and the second direction is the direction along which the predetermined line is aligned. Thus, under control of a control unit, this laser processing device can perform an irradiation process in which the support portion and the first laser processing head are moved in opposite directions along the first direction while irradiating the object with laser light along the predetermined line. Consequently, when irradiating the object with laser light, the processing speed can be increased compared to a case where the object is merely moved laterally.
特別是在此雷射加工裝置，用來對對象物進行攝像的照相機是經由與負責第1雷射加工頭的第1方向的移動之第1移動部不同的其他構件，安裝於第2移動部。因此，當進行照射處理時，不會追隨照相機，可僅使第1雷射加工頭(及支承部)沿著第1方向移動。因此，可使第1雷射加工頭沿著第1方向之移動速度進一步提升，能夠使加工速度確實地提升。In particular, in this laser processing device, the camera used to capture images of the object is attached to the second moving unit via a separate component from the first moving unit responsible for moving the first laser processing head in the first direction. Therefore, during irradiation, the camera does not follow the camera, and only the first laser processing head (and its support unit) moves in the first direction. This allows the first laser processing head's movement speed in the first direction to be further increased, reliably improving processing speed.
再者，在此雷射加工裝置，如前述般，藉由在進行照射處理時，使支承部與第1雷射加工頭互相朝相反方向移動，可使雷射光的聚光點對對象物之移動速度提升。換言之，聚光點之目標的移動速度被支承部及第1雷射加工頭各別分擔。因此，比起使支承部及第1雷射加工頭中的一方移動的情況，可抑制各自的移動速度。其結果，能夠削減支承部及第1雷射加工頭的加減速之時間及距離。Furthermore, in this laser processing device, by moving the support and the first laser processing head in opposite directions during irradiation, as described above, the speed at which the laser beam's focal point moves relative to the object can be increased. In other words, the target movement speed of the focal point is shared equally between the support and the first laser processing head. Therefore, compared to moving only one of the support and the first laser processing head, the movement speeds of both can be suppressed. Consequently, the time and distance required for acceleration and deceleration of the support and the first laser processing head can be reduced.
且，若依據雷射加工裝置，可削減關於第1方向之軌跡。亦即，當進行照射處理時，僅使支承部移動的情況，支承部的移動距離係至少形成為支承於支承部的對象物之線的長度以上。另外，如上述般，當進行照射處理時，使支承部及第1雷射加工頭互相朝相反方向移動的情況，支承部的移動距離係可減少成直到該線的長度減支承部的移動距離之距離為止。換言之，在此情況，支承部的移動距離與第1雷射加工頭的移動距離之總和形成為該線的長度以上即可。因此，若依據雷射加工裝置，關於第1方向，可謀求軌跡之削減。Furthermore, the laser processing apparatus can reduce the trajectory in the first direction. Specifically, when only the support member is moved during irradiation, the support member's movement distance is at least equal to or greater than the length of the line of the object supported by the support member. Furthermore, as described above, when the support member and the first laser processing head are moved in opposite directions during irradiation, the support member's movement distance can be reduced to a distance equal to the length of the line minus the support member's movement distance. In other words, in this case, the sum of the movement distances of the support member and the first laser processing head is sufficient to be equal to or greater than the length of the line. Therefore, the laser processing apparatus can achieve a reduction in the trajectory in the first direction.
在本發明的雷射加工裝置，亦可為第2移動機構係包含在第1方向上互相對向而配置之一對第2移動部，第1移動部係掛設支承於一對第2移動部。在此情況，可確實地支承第1雷射加工頭。In the laser processing apparatus of the present invention, the second moving mechanism may include a pair of second moving parts arranged to face each other in the first direction, with the first moving part being suspended and supported by the pair of second moving parts. In this case, the first laser processing head can be reliably supported.
在此，雷射加工頭的重量，一般是較支承部的重量輕。因此，考量當使聚光點以目標的移動速度移動時，會使第1雷射加工頭較支承部更快速地移動(亦即，使第1雷射加工頭的速度之負擔相對地增大)。The laser machining head is generally lighter than the support. Therefore, when the focal point is moved at the target speed, the first laser machining head will move faster than the support (in other words, the speed burden of the first laser machining head will increase relatively).
相對於此，在本發明的雷射加工裝置，亦可為在第1雷射加工頭，連接有用來導入自光源輸出的雷射光之光纖，控制部係在照射處理，使沿著第1方向之第1雷射加工頭的速度作成為較沿著第1方向之支承部的速度小。如此，在對第1雷射加工頭，連接有用來從光源導入雷射光的光纖之情況，不論第1雷射加工頭與支承部的重量之關係如何，藉由使第1雷射加工頭相對地變慢(亦即，使第1雷射加工頭的速度之負擔相對地縮小)，可謀求保護光纖。In contrast, the laser processing apparatus of the present invention may also be configured such that an optical fiber for guiding laser light output from a light source is connected to the first laser processing head, and the control unit controls the speed of the first laser processing head along a first direction to be slower than the speed of the support unit along the first direction during irradiation processing. In this manner, by connecting the optical fiber for guiding laser light from the light source to the first laser processing head, the optical fiber can be protected by relatively slowing the first laser processing head (i.e., reducing the burden of the first laser processing head's speed) regardless of the weight relationship between the first laser processing head and the support unit.
在本發明的雷射加工裝置，亦可為第2移動機構係包含作為前述不同的構件之第3移動部，該第3移動部是沿著第1方向延伸並且安裝有照相機，用來使照相機沿著第1方向移動。在此情況，照相機可朝第1方向及第2方向移動。In the laser processing apparatus of the present invention, the second moving mechanism may include a third moving portion as a different member than the aforementioned member, the third moving portion extending along the first direction and having a camera mounted thereon for moving the camera along the first direction. In this case, the camera can move in both the first and second directions.
在本發明的雷射加工裝置，亦可為還具備第2雷射加工頭，其係用來對支承於支承部的對象物照射雷射光，第2移動機構係包含：第4移動部，其係沿著第1方向延伸並且安裝有第2雷射加工頭，用來使第2雷射加工頭沿著第1方向移動，第2移動部，係安裝有第4移動部，具有用來使第4移動部沿著第2方向移動之功能，控制部係在照射處理，以在至少一部分的時間重複的方式實施第1處理和第2處理，該第1處理是對複數個線中的一個線，照射來自於第1雷射加工頭之雷射光，該第2處理是對複數個線中的其他的線，照射來自於第2雷射加工頭之雷射光，在第1處理，控制部係控制第1移動機構及第2移動機構，沿著第1方向使支承部與第1雷射加工頭互相朝相反方向移動，在第2處理，控制部係控制第1移動機構及第2移動機構，沿著第1方向使支承部與第2雷射加工頭互相朝相反方向移動。在此情況，藉由使第1雷射加工頭與第2雷射加工頭在至少一部分的時間進行協調作用，可使產出量提升。The laser processing device of the present invention may further include a second laser processing head for irradiating an object supported by a support portion with laser light. The second moving mechanism may include a fourth moving portion extending in the first direction and having the second laser processing head mounted thereon, for moving the second laser processing head in the first direction. The second moving portion may include a fourth moving portion mounted thereon, for moving the fourth moving portion in the second direction. The control unit may repeat the first and second processes at least partially during the irradiation process. The first process involves irradiating one of the plurality of lines with laser light from a first laser processing head, and the second process involves irradiating the other lines of the plurality of lines with laser light from a second laser processing head. During the first process, the control unit controls the first and second moving mechanisms to move the support unit and the first laser processing head in opposite directions along a first direction. During the second process, the control unit controls the first and second moving mechanisms to move the support unit and the second laser processing head in opposite directions along the first direction. In this case, by having the first and second laser processing heads coordinate at least partially during operation, throughput can be improved.
若依據本發明，能夠提供可使加工速度提升的雷射加工裝置。According to the present invention, a laser processing device capable of increasing processing speed can be provided.
1:雷射加工裝置1: Laser processing equipment
5:移動機構(第l移動機構)5: Moving mechanism (first moving mechanism)
6:移動機構(第2移動機構)6: Moving mechanism (second moving mechanism)
7:支承部7: Supporting part
9:控制部9: Control Department
10A:雷射加工頭(第l雷射加工頭)10A: Laser processing head (first laser processing head)
10B:雷射加工頭(第2雷射加工頭)10B: Laser processing head (second laser processing head)
61:Y軸移動部(第2移動部)61: Y-axis moving part (second moving part)
62A:X軸移動部(第l移動部)62A: X-axis moving part (first moving part)
62B:X軸移動部(第4移動部)62B: X-axis moving part (4th moving part)
62C:X軸移動部(第3移動部)62C: X-axis moving part (third moving part)
100:對象物100: Object
AC:照相機AC:Camera
[圖1]係一實施形態之雷射加工裝置的平面圖。[Figure 1] is a plan view of a laser processing device in one embodiment.
[圖2]係為圖1中所示之雷射加工裝置的一部分之側面圖。[Figure 2] is a side view of a portion of the laser processing device shown in Figure 1.
[圖3]係為圖1中所示之雷射加工裝置的雷射加工頭之正面圖。[Figure 3] is a front view of the laser processing head of the laser processing device shown in Figure 1.
[圖4]係為圖3中所示之雷射加工頭之側面圖。[Figure 4] is a side view of the laser processing head shown in Figure 3.
[圖5]為圖3中所示之雷射加工頭的光學系統之構成圖。[Figure 5] shows the optical system configuration of the laser processing head shown in Figure 3.
[圖6]係變形例之雷射加工頭的光學系統之構成圖。[Figure 6] is a diagram showing the optical system configuration of a modified laser processing head.
[圖7]係變形例之雷射加工頭的光學系統之構成圖。[Figure 7] is a diagram showing the optical system configuration of a modified laser processing head.
[圖8]係顯示雷射加工裝置的動作之示意上面圖。[Figure 8] is a schematic diagram showing the operation of the laser processing device.
[圖9]係顯示雷射加工裝置的動作之示意上面圖。[Figure 9] is a schematic diagram showing the operation of the laser processing device.
[圖10]係顯示雷射加工裝置的動作之示意上面圖。[Figure 10] is a schematic diagram showing the operation of the laser processing device.
[圖11]係顯示變形例的雷射加工裝置之示意上面圖。[Figure 11] is a schematic top view of a modified laser processing device.
[圖12]係顯示變形例的雷射加工裝置之示意上面圖。[Figure 12] is a schematic top view of a modified laser processing device.
[圖13]係顯示變形例的雷射加工裝置之示意上面圖。[Figure 13] is a schematic top view of a modified laser processing device.
以下，參照圖面，詳細地說明關於本發明的實施形態。再者，在各圖中，會有對相同或相當的部分賦予相同的符號，並省略重複之說明之情況。再者，在各圖中，有顯示藉由X軸、Y軸及Z軸所規定的正交坐標系的情況。X方向係第1方向的一例，為第1水平方向。Y方向係與第1方向交叉的第2方向的一例，為第2水平方向。Z方向係與第1方向及第2方向交叉的第3方向的一例，為垂直方向。The following describes embodiments of the present invention in detail with reference to the drawings. Identical or corresponding parts are designated by the same reference numerals in the various figures, and repeated descriptions may be omitted. In some figures, an orthogonal coordinate system defined by the X-axis, Y-axis, and Z-axis is shown. The X-direction is an example of a first direction and is a first horizontal direction. The Y-direction is an example of a second direction intersecting the first direction and is a second horizontal direction. The Z-direction is an example of a third direction intersecting the first and second directions and is a vertical direction.
如圖1及圖2所示，雷射加工裝置1具備：移動機構5(第1移動機構)、移動機構6(第2移動機構)、支承部7、光源單元8、控制部9、雷射加工頭10A(第1雷射加工頭)、雷射加工頭10B(第2雷射加工頭)、及照相機單元10C。As shown in Figures 1 and 2, the laser processing device 1 includes a moving mechanism 5 (first moving mechanism), a moving mechanism 6 (second moving mechanism), a support unit 7, a light source unit 8, a control unit 9, a laser processing head 10A (first laser processing head), a laser processing head 10B (second laser processing head), and a camera unit 10C.
移動機構5係具有固定部51、移動部53及安裝部55。固定部51係安裝於裝置框架1a。移動部53係安裝於設在固定部51的軌道，可沿著Y方向移動。安裝部55係安裝於設在移動部53的軌道，可沿著X方向移動。支承部7係安裝於設在安裝部55之旋轉軸，能以與Z方向平行的軸線作為中心而進行旋轉。亦即，移動機構5係具有使支承部7沿著X方向及Y方向移動的功能、及繞著沿著Z方向之軸旋轉的功能。The moving mechanism 5 comprises a fixed portion 51, a moving portion 53, and a mounting portion 55. The fixed portion 51 is mounted on the device frame 1a. The moving portion 53 is mounted on a rail provided on the fixed portion 51 and is movable in the Y direction. The mounting portion 55 is mounted on a rail provided on the moving portion 53 and is movable in the X direction. The support portion 7 is mounted on a rotation axis provided on the mounting portion 55 and is rotatable about an axis parallel to the Z direction. In other words, the moving mechanism 5 has the function of moving the support portion 7 in the X and Y directions, as well as rotating about an axis in the Z direction.
移動機構6係具有：Y軸移動部(第2移動部)61；X軸移動部(第1移動部)62A；X軸移動部(第4移動部)62B；X軸移動部(第3移動部)62C；Z軸移動部63、64、68；及安裝部65、66、67A、67B、67C、69。一對Y軸移動部61係在X方向上互相對向配置，沿著Y方向(在此，略平行地)延伸。X軸移動部62A係沿著X方向延伸，在X方向的兩端，經由安裝部67A安裝於設在Y軸移動部61的軌道。亦即，X軸移動部62A係掛設支承於一對Y軸移動部61。藉此，X軸移動部62A係可藉由Y軸移動部61，沿著Y方向移動。亦即，Y軸移動部61係具有使X軸移動部62A朝Y方向移動之功能。The moving mechanism 6 comprises a Y-axis moving portion (second moving portion) 61; an X-axis moving portion (first moving portion) 62A; an X-axis moving portion (fourth moving portion) 62B; an X-axis moving portion (third moving portion) 62C; Z-axis moving portions 63, 64, and 68; and mounting portions 65, 66, 67A, 67B, 67C, and 69. The pair of Y-axis moving portions 61 are arranged opposite each other in the X-direction and extend in the Y-direction (here, approximately parallel). The X-axis moving portion 62A extends in the X-direction and is attached to rails provided on the Y-axis moving portion 61 at both ends in the X-direction via mounting portions 67A. In other words, the X-axis moving portion 62A is suspended and supported by the pair of Y-axis moving portions 61. Thus, the X-axis moving portion 62A can be moved along the Y direction via the Y-axis moving portion 61. In other words, the Y-axis moving portion 61 has the function of moving the X-axis moving portion 62A in the Y direction.
Z軸移動部63係沿著Z方向延伸，安裝於設在X軸移動部62A的軌道。藉此，Z軸移動部63係可藉由X軸移動部62A，沿著X方向移動。在Z軸移動部63，經由安裝部65安裝有雷射加工頭10A。因此，X軸移動部62A係具有使整個Z軸移動部63與雷射加工頭10A一同沿著X方向移動的功能。雷射加工頭10A係經由安裝部65，安裝於設在Z軸移動部63的軌道。藉此，雷射加工頭10A係藉由Z軸移動部63，可沿著Z方向移動。亦即，Z軸移動部63係具有使雷射加工頭10A沿著Z方向移動的功能。如此，移動機構6係將雷射加工頭10A保持成可沿著X方向、Y方向、及Z方向三維地移動。The Z-axis moving portion 63 extends along the Z direction and is mounted on a track provided on the X-axis moving portion 62A. Thus, the Z-axis moving portion 63 can be moved along the X direction via the X-axis moving portion 62A. The laser processing head 10A is mounted on the Z-axis moving portion 63 via the mounting portion 65. Therefore, the X-axis moving portion 62A has the function of moving the entire Z-axis moving portion 63 and the laser processing head 10A together along the X direction. The laser processing head 10A is mounted on the track provided on the Z-axis moving portion 63 via the mounting portion 65. Thus, the laser processing head 10A can be moved along the Z direction via the Z-axis moving portion 63. In other words, the Z-axis moving portion 63 has the function of moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10A so that it can move three-dimensionally along the X, Y, and Z directions.
X軸移動部62B係沿著X方向延伸，在X方向的兩端，經由安裝部67B安裝於設在Y軸移動部61的軌道。亦即，X軸移動部62B係掛設支承於一對Y軸移動部61。藉此，X軸移動部62B係可藉由Y軸移動部61，沿著Y方向移動。亦即，Y軸移動部61係具有使X軸移動部62B朝Y方向移動之功能。The X-axis moving portion 62B extends along the X-direction and is mounted at both ends in the X-direction on rails provided on the Y-axis moving portion 61 via mounting portions 67B. In other words, the X-axis moving portion 62B is suspended and supported by a pair of Y-axis moving portions 61. This allows the X-axis moving portion 62B to move in the Y-direction via the Y-axis moving portions 61. In other words, the Y-axis moving portion 61 functions to move the X-axis moving portion 62B in the Y-direction.
Z軸移動部64係沿著Z方向延伸，安裝於設在X軸移動部62B的軌道。藉此，Z軸移動部64係可藉由X軸移動部62B，沿著X方向移動。在Z軸移動部64，經由安裝部66安裝有雷射加工頭10B。因此，X軸移動部62B係具有使整個Z軸移動部64與雷射加工頭10B一同沿著X方向移動的功能。雷射加工頭10B係經由安裝部66，安裝於設在Z軸移動部64的軌道。藉此，雷射加工頭10B係藉由Z軸移動部64，可沿著Z方向移動。亦即，Z軸移動部64係具有使雷射加工頭10B沿著Z方向移動的功能。如此，移動機構6係將雷射加工頭10B保持成可沿著X方向、Y方向、及Z方向三維地移動。The Z-axis moving section 64 extends in the Z direction and is mounted on a track provided on the X-axis moving section 62B. This allows the Z-axis moving section 64 to move in the X direction via the X-axis moving section 62B. The laser machining head 10B is mounted on the Z-axis moving section 64 via a mounting portion 66. Therefore, the X-axis moving section 62B functions to move the entire Z-axis moving section 64 and the laser machining head 10B in the X direction. The laser machining head 10B is mounted on the track provided on the Z-axis moving section 64 via a mounting portion 66. This allows the laser machining head 10B to move in the Z direction via the Z-axis moving section 64. In other words, the Z-axis moving section 64 functions to move the laser machining head 10B in the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10B so that it can move three-dimensionally along the X, Y, and Z directions.
X軸移動部62C係沿著X方向延伸，在X方向的兩端，經由安裝部67C安裝於設在Y軸移動部61的軌道。亦即，X軸移動部62C係掛設支承於一對Y軸移動部61。藉此，X軸移動部62C係可藉由Y軸移動部61，沿著Y方向移動。亦即，Y軸移動部61係具有使X軸移動部62C朝Y方向移動之功能。The X-axis moving portion 62C extends along the X-direction and is mounted at both ends in the X-direction on rails provided on the Y-axis moving portion 61 via mounting portions 67C. In other words, the X-axis moving portion 62C is suspended and supported by a pair of Y-axis moving portions 61. This allows the X-axis moving portion 62C to move in the Y-direction via the Y-axis moving portions 61. In other words, the Y-axis moving portion 61 functions to move the X-axis moving portion 62C in the Y-direction.
Z軸移動部68係沿著Z方向延伸，安裝於設在X軸移動部62C的軌道。藉此，Z軸移動部68係可藉由X軸移動部62C，沿著X方向移動。在Z軸移動部68，經由安裝部69安裝有照相機單元10C。因此，X軸移動部62C係具有使整個Z軸移動部68與照相機單元10C一同沿著X方向移動的功能。照相機單元10C係經由安裝部69，安裝於設在Z軸移動部68的軌道。藉此，照相機單元10C係藉由Z軸移動部68，可沿著Z方向移動。亦即，Z軸移動部68係具有使照相機單元10C沿著Z方向移動的功能。如此，移動機構6係將照相機單元10C保持成可沿著X方向、Y方向、及Z方向三維地移動。The Z-axis moving portion 68 extends in the Z direction and is mounted on a track provided on the X-axis moving portion 62C. This allows the Z-axis moving portion 68 to be moved in the X direction via the X-axis moving portion 62C. The camera unit 10C is mounted on the Z-axis moving portion 68 via a mounting portion 69. Therefore, the X-axis moving portion 62C has the function of moving the entire Z-axis moving portion 68 along with the camera unit 10C in the X direction. The camera unit 10C is mounted on the track provided on the Z-axis moving portion 68 via a mounting portion 69. This allows the camera unit 10C to be moved in the Z direction via the Z-axis moving portion 68. In other words, the Z-axis moving portion 68 has the function of moving the camera unit 10C in the Z direction. Thus, the moving mechanism 6 holds the camera unit 10C so that it can move three-dimensionally in the X, Y, and Z directions.
在此，X軸移動部62A、X軸移動部62B、及X軸移動部62C係沿著Y方向依序排列。因此，當從Z方向觀看時，雷射加工頭10A、雷射加工頭10B、及照相機單元10C也是沿著Y方向依序排列。因此，在雷射加工裝置1，照相機單元10C不會中介於中間，針對Y方向，移動成使雷射加工頭10A與雷射加工頭10B互相接近。Here, the X-axis moving portion 62A, the X-axis moving portion 62B, and the X-axis moving portion 62C are arranged sequentially along the Y direction. Therefore, when viewed from the Z direction, the laser processing head 10A, the laser processing head 10B, and the camera unit 10C are also arranged sequentially along the Y direction. Therefore, in the laser processing apparatus 1, the camera unit 10C is not interposed between them and moves in the Y direction to bring the laser processing head 10A and the laser processing head 10B closer to each other.
支承部7係如前述般，安裝於設在移動機構5的安裝部55之旋轉軸，能以與Z方向平行的軸線作為中心線而進行旋轉。亦即，支承部7係可分別沿著X方向及Y方向移動，能以與Z方向平行的軸線作為中心線而進行旋轉。支承部7係用來沿著X方向及Y方向，支承對象物100。對象物100，例如為晶圓。As previously mentioned, the support portion 7 is mounted on the rotation axis of the mounting portion 55 of the moving mechanism 5 and is rotatable about an axis parallel to the Z direction. In other words, the support portion 7 is movable in both the X and Y directions and rotatable about an axis parallel to the Z direction. The support portion 7 is used to support the object 100 in the X and Y directions. The object 100 is, for example, a wafer.
雷射加工頭10A係在Z方向上與支承部7相對向的狀態下，對支承於支承部7之對象物100照射雷射光L1。雷射加工頭10B係在z方向上與支承部7相對向的狀態下，對支承於支承部7之對象物100照射雷射光L2。The laser machining head 10A irradiates the object 100 supported by the support 7 with laser light L1 while facing the support 7 in the Z direction. The laser machining head 10B irradiates the object 100 supported by the support 7 with laser light L2 while facing the support 7 in the Z direction.
照相機單元10C係包含一對照相機AC。一對照相機AC係具有互相不同的倍率，在Z方向上與支承部7相對向的狀態下，對支承於支承部7之對象物100進行攝像。照相機AC係例如可使用透過對象物100之光，對對象物100的裝置圖案、改質區域及從改質區域延伸的龜裂之形成狀態等進行攝像。藉此，藉由照相機AC所獲得的圖像係例如被提供於雷射光L1、L2對對象物100的照射位置之對準、雷射光L1、L2的照射條件之調整等。The camera unit 10C includes a pair of cameras AC. The pair of cameras AC have different magnifications and photograph the object 100 supported by the support 7 while facing the support 7 in the Z direction. The cameras AC, for example, use light transmitted through the object 100 to capture the device pattern, the modified area, and the formation of cracks extending from the modified area. The images captured by the cameras AC are used, for example, to align the irradiation positions of the laser beams L1 and L2 on the object 100 and adjust the irradiation conditions of the laser beams L1 and L2.
光源單元8具有1對光源81、82。光源81係輸出雷射光L1。雷射光L1係自光源81的射出部81a射出，藉由光纖2導引至雷射加工頭10A。亦即，在雷射加工頭10A，連接有用來導入自光源81輸出的雷射光L1之光纖2。光源82係輸出雷射光L2。雷射光L2係自光源82的射出部82a射出，藉由其他光纖2導引至雷射加工頭10B。亦即，在雷射加工頭10B，連接有用來導入自光源82輸出的雷射光L2之光纖2。The light source unit 8 includes a pair of light sources 81 and 82. Light source 81 outputs laser light L1. Laser light L1 is emitted from the emission portion 81a of light source 81 and guided to the laser processing head 10A via optical fiber 2. Specifically, optical fiber 2 is connected to the laser processing head 10A for receiving laser light L1 from light source 81. Light source 82 outputs laser light L2. Laser light L2 is emitted from the emission portion 82a of light source 82 and guided to the laser processing head 10B via another optical fiber 2. Specifically, optical fiber 2 is connected to the laser processing head 10B for receiving laser light L2 from light source 82.
控制部9係用來控制雷射加工裝置1的各部(複數個移動機構5、6、雷射加工頭10A、10B、照相機單元10C及光源單元8等)。控制部9係作為包含處理器、記憶體、儲存器及通訊裝置等之電腦裝置構成。在控制部9，加載於記憶體等的軟體(程式)是藉由處理器執行，記憶體及儲存器之資料的讀取及寫入以及藉由通訊裝置之通訊是藉由處理器控制。藉此，控制部9能夠達到各種功能。The control unit 9 is used to control the various components of the laser processing device 1 (such as the multiple moving mechanisms 5 and 6, the laser processing heads 10A and 10B, the camera unit 10C, and the light source unit 8). The control unit 9 is composed of a computer device that includes a processor, memory, storage, and a communication device. In the control unit 9, the software (programs) loaded into the memory are executed by the processor, and the reading and writing of data in the memory and storage, as well as communication via the communication device, are controlled by the processor. This enables the control unit 9 to achieve various functions.
說明關於藉由如以上所構成的雷射加工裝置1進行加工的一例。該加工的一例，係為了將作為晶圓的對象物100裁切成複數個晶片，分別沿著設定成格子狀的複數個線，在對象物100的內部形成改質區域之例子。An example of processing performed using the laser processing apparatus 1 configured as described above will be described. This example of processing involves forming modified regions within the object 100 along a plurality of lines arranged in a grid pattern in order to cut the object 100, which is a wafer, into a plurality of chips.
首先，移動機構5使支承部7分別沿著X方向及Y方向移動，讓支承對象物100之支承部7在Z方向上與1對雷射加工頭10A、10B相對向。接著，移動機構5以與Z方向平行的軸線作為中心線而使支承部7旋轉，讓在對象物100上朝一方向延伸存在的複數個線沿著X方向。藉此，在對象物100，設定有沿著X方向延伸並且沿著Y方向排列之複數個線(如圖1所示的線C)。First, the moving mechanism 5 moves the support 7 in the X and Y directions, respectively, so that the support 7 supporting the object 100 faces the pair of laser processing heads 10A and 10B in the Z direction. Next, the moving mechanism 5 rotates the support 7 about an axis parallel to the Z direction, aligning the plurality of lines extending in one direction on the object 100 along the X direction. This creates a plurality of lines extending in the X direction and aligned in the Y direction on the object 100 (such as line C in Figure 1).
然後，移動機構6使雷射加工頭10A沿著Y方向移動，使雷射光L1的聚光點位在朝一方向延伸存在的一條線上。另外，為了讓雷射光L2的聚光點位於朝一方向延伸存在的其他線上，移動機構6使雷射加工頭10B沿著Y方向移動。然後，移動機構6使雷射加工頭10A沿著Z方向移動，使雷射光L1的聚光點位於對象物100的內部。另外，移動機構6使雷射加工頭10B沿著Z方向移動，使雷射光L2的聚光點位於對象物100的內部。Then, the moving mechanism 6 moves the laser machining head 10A in the Y direction, positioning the focal point of the laser beam L1 on a line extending in one direction. Furthermore, the moving mechanism 6 moves the laser machining head 10B in the Y direction, positioning the focal point of the laser beam L2 on another line extending in one direction. Then, the moving mechanism 6 moves the laser machining head 10A in the Z direction, positioning the focal point of the laser beam L1 inside the object 100. Furthermore, the moving mechanism 6 moves the laser machining head 10B in the Z direction, positioning the focal point of the laser beam L2 inside the object 100.
接著，光源81輸出雷射光L1而雷射加工頭10A對對象物100照射雷射光L1，並且光源82輸出雷射光L2而雷射加工頭10B對對象物100照射雷射光L2。與此同時，移動機構5使支承部7沿著X方向移動並且移動機構6使雷射加工頭10A、10B沿著X方向朝支承部7相反方向移動，使雷射光L1的聚光點沿著朝一方向延伸存在的一條線相對地移動(雷射光L1被掃描)，且，使雷射光L2的聚光點沿著朝一方向延伸存在的其他線相對地移動(雷射光L2被掃描)。如此，雷射加工裝置1係在對象物100內，分別沿著朝一方向延伸存在的複數個線，在對象物100的至少內部形成改質區域。Next, light source 81 outputs laser light L1, and laser machining head 10A irradiates object 100 with laser light L1. Light source 82 outputs laser light L2, and laser machining head 10B irradiates object 100 with laser light L2. Simultaneously, moving mechanism 5 moves support 7 in the X direction, and moving mechanism 6 moves laser machining heads 10A and 10B in directions opposite to support 7 in the X direction. This causes the focal point of laser light L1 to move relative to one another along a line extending in one direction (laser light L1 is scanned), and the focal point of laser light L2 to move relative to one another along another line extending in one direction (laser light L2 is scanned). In this manner, the laser processing device 1 forms a modified region at least inside the object 100 along a plurality of lines extending in one direction within the object 100.
接著，移動機構5以與Z方向平行的軸線作為中心線而使支承部7旋轉，讓在對象物100上朝與一方向正交的另一方向延伸存在的複數個線沿著X方向。藉此，在對象物100，設定有沿著X方向延伸並且沿著Y方向排列之複數個其他線(如圖1所示的線C)。Next, the moving mechanism 5 rotates the support portion 7 about an axis parallel to the Z direction, aligning the multiple lines extending in a direction perpendicular to the first direction on the object 100 along the X direction. This creates multiple additional lines (such as line C in Figure 1 ) extending in the X direction and arranged in the Y direction on the object 100.
然後，移動機構6使雷射加工頭10A沿著Y方向移動，使雷射光L1的聚光點位在朝另一方向延伸存在的一條線上。另外，為了讓雷射光L2的聚光點位於朝另一方向延伸存在的其他線上，移動機構6使雷射加工頭10B沿著Y方向移動。然後，移動機構6使雷射加工頭10A沿著Z方向移動，使雷射光L1的聚光點位於對象物100的內部。另外，移動機構6使雷射加工頭10B沿著Z方向移動，使雷射光L2的聚光點位於對象物100的內部。Then, the moving mechanism 6 moves the laser machining head 10A in the Y direction, positioning the focal point of the laser beam L1 on a line extending in another direction. Furthermore, the moving mechanism 6 moves the laser machining head 10B in the Y direction, positioning the focal point of the laser beam L2 on another line extending in another direction. Then, the moving mechanism 6 moves the laser machining head 10A in the Z direction, positioning the focal point of the laser beam L1 inside the object 100. Furthermore, the moving mechanism 6 moves the laser machining head 10B in the Z direction, positioning the focal point of the laser beam L2 inside the object 100.
接著，光源81輸出雷射光L1而雷射加工頭10A對對象物100照射雷射光L1，並且光源82輸出雷射光L2而雷射加工頭10B對對象物100照射雷射光L2。與此同時，移動機構5使支承部7沿著X方向移動並且移動機構6使雷射加工頭10A、10B沿著X方向朝支承部7相反方向移動，使雷射光L1的聚光點沿著朝另一方向延伸存在的一條線相對地移動(雷射光L1被掃描)，且，使雷射光L2的聚光點沿著朝另一方向延伸存在的其他線相對地移動(雷射光L2被掃描)。如此，雷射加工裝置1係在對象物100內，分別沿著朝與一方向正交的另一方向延伸存在的複數個線，在對象物100的至少內部形成改質區域。Next, light source 81 outputs laser light L1, and laser machining head 10A irradiates object 100 with laser light L1. Light source 82 outputs laser light L2, and laser machining head 10B irradiates object 100 with laser light L2. Simultaneously, moving mechanism 5 moves support 7 in the X direction, and moving mechanism 6 moves laser machining heads 10A and 10B in directions opposite to support 7 in the X direction. This causes the focal point of laser light L1 to move relative to one another along a line extending in another direction (laser light L1 is scanned), and the focal point of laser light L2 to move relative to one another along another line extending in another direction (laser light L2 is scanned). In this manner, the laser processing device 1 forms a modified region at least inside the object 100 along a plurality of lines extending in another direction perpendicular to one direction within the object 100.
再者，在前述加工的一例，光源81係藉由例如脈衝振盪方式，對對象物100，輸出具有透過性之雷射光L1，光源82係藉由例如脈衝振盪方式，對對象物100，輸出具有透過性之雷射光L2。若這樣的雷射光聚光於對象物100的內部的話，則在與雷射光的聚光點對應之部分，特別是雷射光被吸收，在對象物100的內部形成改質區域。改質區域係密度、折射率、機械性強度、其他的物理特性等形成為與周圍的非改質區域不同之區域。作為改質區域，具有例如熔融處理區域、龜裂區域、絕緣破壞區域、折射率變化區域等。Furthermore, in the aforementioned processing example, light source 81 outputs translucent laser light L1 toward object 100, for example, using a pulse oscillation method, and light source 82 outputs translucent laser light L2 toward object 100, for example, using a pulse oscillation method. When this laser light is focused within object 100, the laser light is absorbed, particularly in the area corresponding to the focal point, forming a modified region within object 100. A modified region is a region whose density, refractive index, mechanical strength, and other physical properties differ from those of the surrounding unmodified region. Examples of modified regions include melt-processed regions, gore crack regions, insulation failure regions, and regions with altered refractive index.
藉由脈衝振盪方式所輸出的雷射光照射至對象物100，沿著設定於對象物100的線，使雷射光的聚光點相對地移動的話，則複數個改質點形成為沿著線排列成1列。1個改質點係藉由1脈衝的雷射光的照射所形成。1列的改質區域係為排列成1列之複數個改質點的集合。相鄰的改質點係藉由雷射光的聚光點對對象物100之相對的移動速度及雷射光的反覆頻率，即使在相連的情況或分離的情況皆存在。Laser light output using a pulsed oscillation method is irradiated onto the object 100. By moving the laser light's focal point relative to a line set on the object 100, multiple modified spots are formed, arranged in a row along the line. One modified spot is formed by irradiation with one pulse of laser light. A row of modified areas is the collection of multiple modified spots arranged in a row. Adjacent modified spots exist regardless of whether they are connected or separated, depending on the relative movement speed of the laser light's focal point relative to the object 100 and the repetition frequency of the laser light.
接著，具體地說明關於雷射加工頭的結構。如圖3及圖4所示，雷射加工頭10A具備框體11、射入部12、雷射光調整部13及聚光部14。框體11具有第1壁部21及第2壁部22、第3壁部23及第4壁部24、以及第5壁部25及第6壁部26。第1壁部21及第2壁部22係在X方向上互相對向。第3壁部23及第4壁部24係在Y方向上互相對向。第5壁部25及第6壁部26係在Z方向上互相對向。Next, the structure of the laser machining head will be described in detail. As shown in Figures 3 and 4, the laser machining head 10A includes a housing 11, an incident portion 12, a laser beam adjustment portion 13, and a focusing portion 14. The housing 11 has a first wall 21, a second wall 22, a third wall 23, a fourth wall 24, and a fifth wall 25 and a sixth wall 26. The first wall 21 and the second wall 22 face each other in the X direction. The third wall 23 and the fourth wall 24 face each other in the Y direction. The fifth wall 25 and the sixth wall 26 face each other in the Z direction.
第3壁部23與第4壁部24之距離係較第1壁部21與第2壁部22之距離小。第1壁部21與第2壁部22之距離係較第5壁部25與第6壁部26之距離小。再者，第1壁部21與第2壁部22之距離，可與第5壁部25與第6壁部26之距離相等，或者，亦可較第5壁部25與第6壁部26之距離大。The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22. The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26. Furthermore, the distance between the first wall portion 21 and the second wall portion 22 may be equal to the distance between the fifth wall portion 25 and the sixth wall portion 26, or may be larger than the distance between the fifth wall portion 25 and the sixth wall portion 26.
在雷射加工頭10A，第1壁部21係位於移動機構6的Y軸移動部61側相反側，第2壁部22係位於Y軸移動部61側。第3壁部23係位於移動機構6的安裝部65側，第4壁部24係為於安裝部65相反側亦即雷射加工頭10B側(參照圖2)。亦即，第4壁部24係為與雷射加工頭10B的框體(第2框體)沿著Y方向相對向之對向壁部。第5壁部25係位於支承部7相反側，第6壁部26係位於支承部7側。In the laser machining head 10A, the first wall 21 is located on the side opposite the Y-axis moving portion 61 of the moving mechanism 6, and the second wall 22 is located on the Y-axis moving portion 61 side. The third wall 23 is located on the mounting portion 65 side of the moving mechanism 6, and the fourth wall 24 is located on the side opposite the mounting portion 65, i.e., on the laser machining head 10B side (see Figure 2). In other words, the fourth wall 24 is the wall facing the frame (second frame) of the laser machining head 10B along the Y direction. The fifth wall 25 is located on the side opposite the support portion 7, and the sixth wall 26 is located on the support portion 7 side.
框體11係在第3壁部23配置於移動機構6的安裝部65側之狀態下，框體11安裝於安裝部65。具體而言，如以下所述。安裝部65具有座板65a和安裝板65b。座板65a係安裝於設在Z軸移動部63的軌道(參照圖2)。安裝板65b係立設於座板65a之雷射加工頭10B側的端部(參照圖2)。框體11係在第3壁部23接觸於安裝板65b之狀態下，經由台座27，將螺栓28螺合於安裝板65b，藉此安裝於安裝部65。台座27係分別設在第1壁部21及第2壁部22。框體11係對安裝部65可進行裝卸。The frame 11 is attached to the mounting portion 65 of the moving mechanism 6 with the third wall 23 positioned on the mounting portion 65 side. Specifically, the mounting portion 65 comprises a base plate 65a and a mounting plate 65b. The base plate 65a is mounted on a track provided on the Z-axis moving portion 63 (see Figure 2). The mounting plate 65b is erected on the end of the base plate 65a on the laser processing head 10B side (see Figure 2). With the third wall 23 in contact with the mounting plate 65b, the frame 11 is attached to the mounting portion 65 by screwing bolts 28 into the mounting plate 65b via bases 27. The bases 27 are provided on the first wall 21 and the second wall 22. The frame 11 is removable from the mounting portion 65.
射入部12係安裝於第5壁部25上。射入部12係對框體11內射入雷射光L1。射入部12係在X方向上朝第1壁部21側偏移，在Y方向上朝第4壁部24側偏移。也就是X方向之射入部12與第1壁部21之距離，係較X方向上之射入部12與第2壁部22之距離小，Y方向上之射入部12與第4壁部24之距離，係較X方向上之射入部12與第3壁部23之距離小。The incident portion 12 is mounted on the fifth wall 25. It injects laser light L1 into the housing 11. The incident portion 12 is offset toward the first wall 21 in the X direction and toward the fourth wall 24 in the Y direction. In other words, the distance between the incident portion 12 and the first wall 21 in the X direction is smaller than the distance between the incident portion 12 and the second wall 22 in the X direction, and the distance between the incident portion 12 and the fourth wall 24 in the Y direction is smaller than the distance between the incident portion 12 and the third wall 23 in the X direction.
射入部12係連接有光纖2的射出端部2a。具體而言，射入部12係為包含形成於第5壁部25的孔25a之部分。在第5壁部25，設有安裝部25b。在安裝部25b，藉由螺栓等安裝有射出端部2a的本體部分2b在此狀態下，射出端部2a的前端部分2c插通於孔25a。藉此，光纖2的射出端部2a係可對射入部12進行裝卸。在第5壁部25與本體部分2b之間，配置有蓋25c。蓋25c係覆蓋形成於孔25a與前端部分2c之間的間隙。作為一例，在射出端部2a，抑制返回光之隔離器是配置於本體部分2b內，將雷射光L1進行準直之準直透鏡是配置於前端部分2c內。再者，射入部12亦可為可與光纖2的射出端部2a連接之連接器。The incident portion 12 is connected to the emitting end portion 2a of the optical fiber 2. Specifically, the incident portion 12 includes the hole 25a formed in the fifth wall portion 25. The fifth wall portion 25 is provided with a mounting portion 25b. The main body portion 2b of the emitting end portion 2a is mounted to the mounting portion 25b using bolts or the like. In this state, the tip portion 2c of the emitting end portion 2a is inserted into the hole 25a. This allows the emitting end portion 2a of the optical fiber 2 to be attached to and detached from the incident portion 12. A cover 25c is disposed between the fifth wall portion 25 and the main body portion 2b. The cover 25c covers the gap formed between the hole 25a and the tip portion 2c. For example, at the output end 2a, an isolator that suppresses return light is located within the main body 2b, and a collimating lens that collimates the laser light L1 is located within the tip 2c. Furthermore, the input portion 12 may also be a connector that can be connected to the output end 2a of the optical fiber 2.
雷射光調整部13配置在框體11內。雷射光調整部13係用來調整自射入部12射入的雷射光L1。雷射光調整部13係在框體11內，對區隔壁部29配置於第4壁部24側。雷射光調整部13係安裝於區隔壁部29。區隔壁部29係設在框體11內，將框體11內的區域區隔成第3壁部23側的區域與第4壁部24側的區域。區隔壁部29係構成作為框體11的一部分。雷射光調整部13所具有的各結構係在第4壁部24側，安裝於區隔壁部29。區隔壁部29係作為支承雷射光調整部13所具有的各結構之光學基座發揮功能。The laser beam adjuster 13 is disposed within the housing 11. It adjusts the laser beam L1 incident from the incident portion 12. The laser beam adjuster 13 is disposed within the housing 11 on the fourth wall 24 side relative to the partition wall 29. The laser beam adjuster 13 is attached to the partition wall 29. The partition wall 29 is provided within the housing 11 and divides the interior of the housing 11 into an area on the third wall 23 side and an area on the fourth wall 24 side. The partition wall 29 constitutes a portion of the housing 11. The various components of the laser beam adjuster 13 are attached to the partition wall 29 on the fourth wall 24 side. The partition wall 29 functions as an optical base that supports the various structures of the laser light adjustment unit 13.
聚光部14係安裝於第6壁部26上。具體而言，聚光部14係在插通於形成在第6壁部26的孔26a之狀態下，配置於第6壁部26。聚光部14係一邊將藉由雷射光調整部13所調整的雷射光L1聚光一邊朝框體11外射出。聚光部14係在X方向上朝第2壁部22側偏移，在Y方向上朝第4壁部24側偏移。也就是X方向上之聚光部14與第2壁部22之距離，係較X方向上之聚光部14與第1壁部21之距離小，Y方向上之聚光部14與第4壁部24之距離，係較X方向上之聚光部14與第3壁部23之距離小。The focusing unit 14 is mounted on the sixth wall 26. Specifically, the focusing unit 14 is positioned on the sixth wall 26 while being inserted through a hole 26a formed in the sixth wall 26. The focusing unit 14 focuses the laser light L1 adjusted by the laser light adjustment unit 13 while emitting it out of the housing 11. The focusing unit 14 is offset toward the second wall 22 in the X direction and toward the fourth wall 24 in the Y direction. In other words, the distance between the focusing unit 14 and the second wall 22 in the X direction is smaller than the distance between the focusing unit 14 and the first wall 21 in the X direction, and the distance between the focusing unit 14 and the fourth wall 24 in the Y direction is smaller than the distance between the focusing unit 14 and the third wall 23 in the X direction.
如圖5所示，雷射光調整部13係具有反射部(第1反射部)31、衰減器32、及光軸調整部33。反射部31、衰減器32及光軸調整部33係配置於沿著X方向延伸存在的第1直線A1上。反射部31係在Z方向上，與射入部12相對向。亦即，反射部31係在Z方向上，與光纖2的射出端部2a相對向。反射部31係用來將自射入部12射入的雷射光L1朝第2壁部22側反射。反射部31係為例如鏡子或棱鏡。衰減器32係用來調整被反射部31反射的雷射光L1之輸出。光軸調整部33係將藉由衰減器32調整輸出後的雷射光L1朝第6壁部26側反射。As shown in FIG5 , the laser light adjustment section 13 includes a reflector (first reflector) 31, an attenuator 32, and an optical axis adjustment section 33. The reflector 31, the attenuator 32, and the optical axis adjustment section 33 are arranged on a first straight line A1 extending along the X direction. The reflector 31 is opposite to the incident section 12 in the Z direction. That is, the reflector 31 is opposite to the emission end 2a of the optical fiber 2 in the Z direction. The reflector 31 is used to reflect the laser light L1 incident from the incident section 12 toward the second wall 22. The reflector 31 is, for example, a mirror or a prism. The attenuator 32 is used to adjust the output of the laser light L1 reflected by the reflector 31. The optical axis adjustment unit 33 reflects the laser light L1, whose output has been adjusted by the attenuator 32, toward the sixth wall portion 26.
光軸調整部33係為用來調整自射入部12射入的雷射光L1的光軸之部分。在本實施形態，光軸調整部33係具有第1轉向鏡331、反射構件332、及第2轉向鏡333。The optical axis adjustment unit 33 is used to adjust the optical axis of the laser light L1 incident from the incident portion 12. In this embodiment, the optical axis adjustment unit 33 includes a first turning mirror 331, a reflective member 332, and a second turning mirror 333.
第1轉向鏡331係配置於第1直線A1上。第1轉向鏡331係藉由鏡子331a及基座331b所構成。鏡子331a係安裝於基座331b。基座331b係安裝於區隔壁部29。基座331b係以可調整鏡子331a的方向的方式，保持鏡子331a。第1轉向鏡331係將藉由衰減器32調整輸出後的雷射光L1朝第6壁部26側反射。The first bend mirror 331 is positioned on the first straight line A1. It consists of a mirror 331a and a base 331b. Mirror 331a is mounted on base 331b. Base 331b is mounted on partition wall 29. Base 331b holds mirror 331a in an adjustable orientation. The first bend mirror 331 reflects the laser light L1, whose output has been adjusted by the attenuator 32, toward the sixth wall 26.
反射構件332係將被第1轉向鏡331反射的雷射光L1朝第2壁部22側反射。反射構件332係為例如鏡子或棱鏡。The reflective member 332 reflects the laser light L1 reflected by the first deflecting mirror 331 toward the second wall 22. The reflective member 332 is, for example, a mirror or a prism.
第2轉向鏡333係配置於第2直線A2上。第2轉向鏡333係藉由鏡子333a及基座333b所構成。鏡子333a係安裝於基座333b。基座333b係安裝於區隔壁部29。基座333b係以可調整鏡子333a的方向的方式，保持鏡子333a。第2轉向鏡333係將被反射構件332反射的雷射光L1朝第6壁部26側反射。The second bend mirror 333 is positioned on the second straight line A2. It consists of a mirror 333a and a base 333b. Mirror 333a is mounted on base 333b. Base 333b is mounted on partition wall 29. Base 333b holds mirror 333a in an adjustable orientation. The second bend mirror 333 reflects the laser light L1 reflected by the reflective member 332 toward the sixth wall 26.
作為一例，對於各基座331b、333b，經由形成於第2壁部22的具有蓋子之開口(未圖示)的工具可進行連結。藉此，藉由一般觀看以後述的觀察部17所取得的圖像等一邊操作工具，可調整各鏡子331a、333a的方向，使射入到聚光部14的雷射光L1之光軸與聚光部14的光軸一致。For example, the bases 331b and 333b can be connected via a tool with a cover opening (not shown) formed in the second wall portion 22. This allows the direction of the mirrors 331a and 333a to be adjusted by operating the tool while observing an image obtained by the observation unit 17 (described later) so that the optical axis of the laser light L1 incident on the focusing unit 14 is aligned with the optical axis of the focusing unit 14.
雷射光調整部13還具有擴束器34、及反射部(第2反射部)35。光軸調整部33、擴束器34及反射部35係配置於沿著Z方向延伸存在的第2直線A2上。擴束器34係將被光軸調整部33反射的雷射光L1的直徑擴大。反射部35係用來將以擴束器34擴大了直徑之雷射光L1朝第1壁部21側且第5壁部25側反射。反射部35係為例如鏡子或棱鏡。The laser beam adjuster 13 also includes a beam expander 34 and a reflector (second reflector) 35. The optical axis adjuster 33, beam expander 34, and reflector 35 are arranged on a second straight line A2 extending in the Z direction. The beam expander 34 expands the diameter of the laser beam L1 reflected by the optical axis adjuster 33. The reflector 35 reflects the laser beam L1, whose diameter has been expanded by the beam expander 34, toward the first wall 21 and the fifth wall 25. The reflector 35 is, for example, a mirror or a prism.
雷射光調整部13還具有反射型空間光調變器36、和成像光學系統37。反射型空間光調變器36、成像光學系統37、以及聚光部14係配置於沿著Z方向延伸存在的第3直線A3上。反射型空間光調變器36係一邊將被反射部35反射的的雷射光L1進行調變一邊朝第6壁部26側反射。反射型空間光調變器36係例如反射型液晶(LCOS：Liquid Crystal on Silicon)的空間光調變器(SLM：Spatial Light Modulator)。成像光學系統37係構成反射型空間光調變器36的反射面36a與聚光部14的入瞳面14a處於成像關係之雙邊遠心光學系統。成像光學系統37係藉由3個以上的透鏡所構成。The laser light modulator 13 also includes a reflective spatial light modulator 36 and an imaging optical system 37. The reflective spatial light modulator 36, the imaging optical system 37, and the focusing unit 14 are arranged on a third straight line A3 extending along the Z direction. The reflective spatial light modulator 36 modulates the laser light L1 reflected by the reflecting unit 35 while reflecting it toward the sixth wall 26. The reflective spatial light modulator 36 is, for example, a spatial light modulator (SLM) using a reflective liquid crystal on silicon (LCOS). The imaging optical system 37 is a bilaterally telecentric optical system in which the reflecting surface 36a of the reflective spatial light modulator 36 and the entrance pupil plane 14a of the focusing unit 14 are in an imaging relationship. The imaging optical system 37 is composed of three or more lenses.
第1直線A1、第2直線A2及第3直線A3係位於與Y方向垂直的平面上。第2直線A2係對於第3直線A3，位於第2壁部22側。在雷射加工頭10A，沿著Z方向從射入部12射入至框體11內的雷射光L1係在反射部31被反射，在第1直線A1上行進。在第1直線A1上行進的雷射光L1在光軸調整部33被反射，使得在第2直線A2上行進。在第2直線A2上行進的雷射光L1在反射部35及反射型空間光調變器36依次被反射，使得在第3直線A3上行進。在第3直線A3上行進的雷射光L1係沿著Z方向，從聚光部14朝框體11外射出。The first straight line A1, the second straight line A2, and the third straight line A3 lie on a plane perpendicular to the Y direction. The second straight line A2 is located on the second wall portion 22 side relative to the third straight line A3. In the laser machining head 10A, laser light L1 incident from the incident portion 12 into the housing 11 in the Z direction is reflected by the reflecting portion 31 and travels along the first straight line A1. The laser light L1 traveling along the first straight line A1 is reflected by the optical axis adjusting portion 33, traveling along the second straight line A2. The laser light L1 traveling along the second straight line A2 is sequentially reflected by the reflecting portion 35 and the reflective spatial light modulator 36, traveling along the third straight line A3. The laser light L1 traveling along the third straight line A3 is emitted from the focusing portion 14 out of the housing 11 in the Z direction.
雷射加工頭10A還具備分光鏡15、測定部16、觀察部17、驅動部18及電路部19。The laser processing head 10A also includes a spectroscope 15, a measuring unit 16, an observation unit 17, a driving unit 18, and a circuit unit 19.
分光鏡15係在第3直線A3上，配置於成像光學系統37與聚光部14之間。亦即，分光鏡15係在框體11內，配置於雷射光調整部13與聚光部14之間。分光鏡15係在第4壁部24側，安裝於區隔壁部29。分光鏡15係使雷射光L1透過。分光鏡15係在抑制散光的觀點，可為例如立方體形，亦可為配置成具有扭曲的關係之2片板型。The spectrometer 15 is positioned on the third straight line A3 between the imaging optical system 37 and the focusing unit 14. Specifically, the spectrometer 15 is positioned within the housing 11 between the laser light adjustment unit 13 and the focusing unit 14. The spectrometer 15 is attached to the partition wall 29 on the side of the fourth wall 24. The spectrometer 15 transmits the laser light L1. To suppress astigmatism, the spectrometer 15 can be, for example, a cubic shape or a two-piece plate configuration arranged in a twisted relationship.
測定部16係在框體11內，對第3直線A3，配置於第1壁部21側。也就是測定部16係在X方向，對聚光部14，配置於第1壁部21側。測定部16係在第4壁部24側，安裝於區隔壁部29。測定部16係輸出用來測定對象物100的表面(例如雷射光L1射入之側的表面)與聚光部14之距離的測定光L10，經由聚光部14，檢測被對象物100的表面所反射之測定光L10。也就是從測定部16所輸出的測定光L10是經由聚光部14照射至對象物100的表面，被對象物100的表面鎖反射之測定光L10是經由聚光部14，以測定部16進行檢測。The measuring unit 16 is located within the housing 11, on the side of the first wall 21 with respect to the third straight line A3. Specifically, the measuring unit 16 is located on the side of the first wall 21 with respect to the focusing unit 14 in the X direction. The measuring unit 16 is attached to the partition wall 29 on the side of the fourth wall 24. The measuring unit 16 outputs measurement light L10 for measuring the distance between the surface of the object 100 (e.g., the surface on the side where the laser light L1 is incident) and the focusing unit 14. The focusing unit 14 then detects the measurement light L10 reflected by the surface of the object 100. That is, the measurement light L10 output from the measuring unit 16 is irradiated onto the surface of the object 100 via the focusing unit 14. The measurement light L10 reflected by the surface of the object 100 passes through the focusing unit 14 and is detected by the measuring unit 16.
更具體而言，從測定部16輸出的測定光L10係在第4壁部24側，被安裝於區隔壁部29之光束分離器20及分光鏡15依次反射，再從聚光部14射出至框體11外。被對象物100的表面反射之測定光L10，係從聚光部14射入到框體11內，再以分光鏡15及光束分離器20依次反射，然後射入到測定部16而再以測定部16進行檢測。More specifically, the measurement light L10 output from the measuring section 16 is sequentially reflected by the beam splitter 20 and the spectroscope 15 mounted on the partition wall 29 on the fourth wall 24 side, and then emitted from the focusing section 14 to the outside of the housing 11. The measurement light L10, reflected by the surface of the object 100, enters the housing 11 from the focusing section 14, is sequentially reflected by the spectroscope 15 and the beam splitter 20, and then enters the measuring section 16 for detection.
觀察部17係在框體11內，對第3直線A3，配置於第1壁部21側。也就是觀察部17係在X方向，對聚光部14，配置於第1壁部21側。觀察部17係在第4壁部24側，安裝於區隔壁部29。觀察部17係輸出用來觀察對象物100的表面(例如雷射光L1射入之側的表面)之觀察光L20，經由聚光部14，檢測被對象物100的表面所反射之測定光L20。也就是從觀察部17所輸出的觀察光L20，係經由聚光部14而照射至對象物100的表面，被對象物100的表面反射之觀察光L20係經由聚光部14，以觀察部17進行檢測。The observation unit 17 is located within the housing 11, on the side of the first wall 21 facing the third straight line A3. Specifically, the observation unit 17 is located on the side of the first wall 21 facing the focusing unit 14 in the X direction. The observation unit 17 is attached to the partition wall 29 on the side of the fourth wall 24. The observation unit 17 outputs observation light L20 for observing the surface of the object 100 (e.g., the surface on the side where the laser light L1 is incident). The observation unit 17 detects the measurement light L20 reflected by the surface of the object 100 via the focusing unit 14. Specifically, the observation light L20 output from the observation unit 17 is irradiated onto the surface of the object 100 via the focusing unit 14, and the observation light L20 reflected by the surface of the object 100 is detected by the observation unit 17 via the focusing unit 14.
更具體而言，從觀察部17輸出的觀察光L20係透過光束分離器20而被分光鏡15反射，再從聚光部14射出至框體11外。被對象物100的表面反射之觀察光L20，係從聚光部14射入到框體11內，再以分光鏡15反射，然後透過光束分離器20射入觀察部17而再以觀察部17進行檢測。再者，雷射光L1、測定光L10及觀察光L20各自的波長係互相不同(至少各自的中心波長互相偏移)。More specifically, the observation light L20 output from the observation unit 17 passes through the beam splitter 20, is reflected by the spectroscope 15, and then is emitted from the focusing unit 14 to the outside of the housing 11. The observation light L20 reflected by the surface of the object 100 enters the housing 11 from the focusing unit 14, is reflected by the spectroscope 15, passes through the beam splitter 20, enters the observation unit 17, and is detected by the observation unit 17. Furthermore, the wavelengths of the laser light L1, the measurement light L10, and the observation light L20 differ from each other (at least their center wavelengths are offset from each other).
驅動部18係在第4壁部24側，安裝於區隔壁部29。驅動部18係藉由例如壓電元件之驅動力，使配置於第6壁部26之聚光部14沿著Z方向移動。The driver 18 is attached to the partition wall 29 on the side of the fourth wall 24. The driver 18 moves the focusing unit 14 disposed on the sixth wall 26 in the Z direction by the driving force of, for example, a piezoelectric element.
電路部19係在框體11內，對區隔壁部29配置於第3壁部23側。也就是電路部19係在框體11內，對雷射光調整部13、測定部16及觀察部17配置於第3壁部23側。電路部19係從區隔壁部29分離。電路部19為例如複數個電路基板。電路部19係處理自測定部16輸出的訊號及輸入至反射型空間光調變器36之訊號。電路部19係依據自測定部16輸出的訊號，控制驅動部18。作為一例，電路部19係依據自測定部16輸出的訊號，控制驅動部18，使對象物100的表面與聚光部14之距離維持成一定(亦即，對象物100的表面與雷射光L1的聚光點之距離維持成一定)。The circuit unit 19 is located within the housing 11, on the side of the third wall 23 facing the partition wall 29. Specifically, the circuit unit 19 is located within the housing 11, on the side of the third wall 23 facing the laser light adjustment unit 13, the measurement unit 16, and the observation unit 17. The circuit unit 19 is separated from the partition wall 29. The circuit unit 19 may be, for example, a plurality of circuit boards. The circuit unit 19 processes the signal output from the measurement unit 16 and the signal input to the reflective spatial light modulator 36. The circuit unit 19 controls the driver 18 based on the signal output from the measurement unit 16. For example, the circuit unit 19 controls the driver 18 based on the signal output from the measuring unit 16 to maintain a constant distance between the surface of the object 100 and the focusing unit 14 (that is, the distance between the surface of the object 100 and the focal point of the laser beam L1 is maintained constant).
再者，在區隔壁部29，形成有用來供將各自的測定部16、觀察部17、驅動部18及反射型空間光調變器36與電路部19電性連接的配線通過之缺口、孔等(未圖示)。又，在框體11，設有連接有用來將電路部19控制部9(參照圖1)電性連接之配線等的連接器(未圖示)。Furthermore, the partition wall 29 is formed with notches, holes, and the like (not shown) for passing wiring that electrically connects the measurement unit 16, observation unit 17, driver unit 18, and reflective spatial light modulator 36 to the circuit unit 19. Furthermore, the frame 11 is provided with connectors (not shown) for connecting wiring that electrically connects the circuit unit 19 to the control unit 9 (see FIG. 1 ).
雷射加工頭10B係與雷射加工頭10A同樣地，具備框體11、射入部12、雷射光調整部13、聚光部14、分光鏡15、測定部16、觀察部17、驅動部18及電路部19。但，雷射加工頭10B的各結構係如圖2所示，對通過1對安裝部65、66間的中心點且與Y方向垂直之虛擬平面，配置成具有與雷射加工頭10A之各結構呈面對稱的關係。Similar to the laser machining head 10A, the laser machining head 10B includes a housing 11, an incident portion 12, a laser beam adjustment portion 13, a focusing portion 14, a spectroscope 15, a measuring portion 16, an observation portion 17, a driver portion 18, and a circuit portion 19. However, as shown in Figure 2, the various components of the laser machining head 10B are arranged to be plane-symmetrical with those of the laser machining head 10A about a virtual plane passing through the center point between the pair of mounting portions 65 and 66 and perpendicular to the Y direction.
例如，雷射加工頭10A的框體11係以第4壁部24對第3壁部23位於雷射加工頭10B側、且第6壁部26對第5壁部25位於支承部7側的方式，安裝於安裝部65。相對於此，雷射加工頭10B的框體11，係以第4壁部24對第3壁部23位於雷射加工頭10A側、且第6壁部26對第5壁部25位於支承部7側的方式，安裝於安裝部66。For example, the frame 11 of the laser machining head 10A is mounted on the mounting portion 65 such that the fourth wall portion 24 is positioned on the laser machining head 10B side relative to the third wall portion 23, and the sixth wall portion 26 is positioned on the support portion 7 side relative to the fifth wall portion 25. Conversely, the frame 11 of the laser machining head 10B is mounted on the mounting portion 66 such that the fourth wall portion 24 is positioned on the laser machining head 10A side relative to the third wall portion 23, and the sixth wall portion 26 is positioned on the support portion 7 side relative to the fifth wall portion 25.
雷射加工頭10B的框體11構成為在第3壁部23配置於安裝部66側之狀態下，框體11安裝於安裝部66。具體而言，如以下所述。安裝部66具有座板66a和安裝板66b。座板66a係安裝於設在Z軸移動部63的軌道。安裝板66b係立設於座板66a之雷射加工頭10A側的端部。雷射加工頭10B的框體11為在第3壁部23接觸於安裝板66b之狀態下，安裝於安裝部66。雷射加工頭10B的框體11係對安裝部66可進行裝卸。The frame 11 of the laser machining head 10B is configured so that it is mounted on the mounting portion 66 with the third wall 23 positioned on the mounting portion 66 side. Specifically, the mounting portion 66 includes a base plate 66a and a mounting plate 66b. The base plate 66a is mounted on a rail provided on the Z-axis moving portion 63. The mounting plate 66b is erected on the end of the base plate 66a on the laser machining head 10A side. The frame 11 of the laser machining head 10B is mounted on the mounting portion 66 with the third wall 23 in contact with the mounting plate 66b. The frame 11 of the laser machining head 10B is removable from the mounting portion 66.
在雷射加工頭10A，於從射入部12到聚光部14之雷射光L1的光路上，配置有用來調整自射入部12射入的雷射光L1之光軸的光軸調整部33。藉此，例如，當為了維修等，將光纖2的射出端部2a從框體11卸下，再次將光纖2的射出端部2a連接至射入部12時，可使射入至聚光部14的雷射光L1之光軸與聚光部14之光軸一致。又，射入部12係在X方向朝框體11的第1壁部21側偏移，聚光部14係在X方向朝框體11的第2壁部22側偏移。藉此，可抑制從射入部12到光軸調整部33之雷射光L1的光路變長，其結果，能夠抑制射入到聚光部14的雷射光L1的光軸從聚光部14的光軸偏移。因此，若依據雷射加工頭10A的話，可將雷射光L1精度良好地聚光。In the laser machining head 10A, an optical axis adjustment portion 33 is disposed on the optical path of the laser light L1 from the incident portion 12 to the focusing portion 14. This adjusts the optical axis of the laser light L1 incident from the incident portion 12. This allows, for example, when the emitting end portion 2a of the optical fiber 2 is removed from the housing 11 for maintenance or the like and then reconnected to the incident portion 12, the optical axis of the laser light L1 incident on the focusing portion 14 can be aligned with the optical axis of the focusing portion 14. Furthermore, the incident portion 12 is offset in the X direction toward the first wall 21 of the housing 11, while the focusing portion 14 is offset in the X direction toward the second wall 22 of the housing 11. This prevents the optical path of the laser light L1 from the incident portion 12 to the optical axis adjustment portion 33 from becoming longer. Consequently, the optical axis of the laser light L1 incident on the focusing portion 14 can be prevented from deviating from the optical axis of the focusing portion 14. Therefore, the laser processing head 10A can accurately focus the laser light L1.
又，在雷射加工頭10A，射入部12配置於框體11的第5壁部25，在雷射光調整部13，光軸調整部33配置於反射部31及衰減器32的後段(雷射光L1的行進方向之下游側)、且擴束器34、反射部35、反射型空間光調變器36及成像光學系統37的前段(雷射光L1的行進方向之上游側)。配置於擴束器34、反射部35、反射型空間光調變器36及成像光學系統37的前段(雷射光L1的行進方向之上游側)。藉此，由於可調整射入到關於雷射光L1的成形之結構的[擴束器34、反射部35、反射型空間光調變器36、成像光學系統37及聚光部14]之雷射光L1的光軸，故，可將雷射光L1精度更佳地聚光。又，射入部12配置於第5壁部25，在雷射光調整部13，衰減器32配置於反射部31與光軸調整部33之間。藉此，可藉由因適用衰減器32所引起之框體11的大型化。Furthermore, in the laser processing head 10A, the incident portion 12 is located on the fifth wall 25 of the housing 11. In the laser beam adjustment unit 13, the optical axis adjustment unit 33 is located downstream of the reflector 31 and attenuator 32 (downstream of the direction of travel of the laser beam L1) and upstream of the beam expander 34, reflector 35, reflective spatial light modulator 36, and imaging optical system 37 (upstream of the direction of travel of the laser beam L1). This allows for adjustment of the optical axis of the laser light L1 incident on the beam expander 34, reflector 35, reflective spatial light modulator 36, imaging optical system 37, and focusing unit 14, which shape the laser light L1. This allows for more precise focusing of the laser light L1. Furthermore, the incident portion 12 is positioned on the fifth wall 25, and the attenuator 32 is positioned between the reflector 31 and the optical axis adjustment unit 33 in the laser light adjustment unit 13. This reduces the size of the housing 11 that would otherwise be required due to the use of the attenuator 32.
又，在雷射加工頭10A，由於輸出雷射光L1之光源未設在框體11內，故，可謀求框體11的小型化。且，在框體11，第3壁部23與第4壁部24之距離是較第1壁部21與第2壁部22之距離小，配置於第6壁部26之聚光部14在Y方向上朝第4壁部24側偏移。藉此，在沿著第3壁部23及第4壁部24互相對向的Y方向，使框體11移動之情況，例如即使在第4壁部24側存在有其他構件(例如雷射加工頭10B)，也能夠使聚光部14接近該其他構件。又，由於第3壁部23與第4壁部24之距離較第1壁部21與第2壁部22之距離小，故，在沿著第3壁部23及第4壁部24互相對向的Y方向，使框體11移動之情況，可縮小框體11所占有的空間。且，由於射入部12及聚光部14在Y方向朝第4壁部24側偏移，故，可在框體11內的區域中之對雷射光調整部13較靠近第3壁部23側之區域，配置其他構件(例如電路部19)等，可有效地利用該區域。Furthermore, in the laser machining head 10A, since the light source that outputs the laser light L1 is not located within the housing 11, the housing 11 can be made more compact. Furthermore, in the housing 11, the distance between the third wall 23 and the fourth wall 24 is smaller than the distance between the first wall 21 and the second wall 22. This allows the light-concentrating portion 14 located on the sixth wall 26 to be offset toward the fourth wall 24 in the Y direction. Consequently, when the housing 11 is moved in the Y direction, which is the direction in which the third and fourth walls 23 and 24 face each other, the light-concentrating portion 14 can be brought closer to other components, such as the laser machining head 10B, even if these components are located on the fourth wall 24 side. Furthermore, because the distance between the third wall 23 and the fourth wall 24 is smaller than the distance between the first wall 21 and the second wall 22, the space occupied by the frame 11 can be reduced when the frame 11 is moved along the Y direction, where the third and fourth walls 23 and 24 face each other. Furthermore, because the incident portion 12 and the focusing portion 14 are offset toward the fourth wall 24 in the Y direction, other components (such as the circuit portion 19) can be placed within the frame 11 closer to the third wall 23 than the laser beam adjustment portion 13, effectively utilizing this area.
又，在雷射加工頭10A，電路部19係在框體11內，對雷射光調整部13配置於第3壁部23側。藉此，可可有效地利用在框體11內的區域中之雷射光對調整部13較靠近第3壁部23側之區域。Furthermore, in the laser machining head 10A, the circuit unit 19 is located within the housing 11, with the laser beam adjustment unit 13 positioned on the third wall 23 side. This allows the laser beam within the housing 11 to be effectively utilized in the area closer to the third wall 23 side of the adjustment unit 13.
又，在雷射加工頭10A，雷射光調整部13係在框體11內，對區隔壁部29配置於第4壁部24側，電路部19係在框體11內，對區隔壁部29配置於第3壁部23側。藉此，由於在電路部19所產生的熱變得不易傳播到雷射光調整部13，故，可抑制因在電路部19產生的熱造成在雷射光調整部13產生應變的情況，能夠正確地調整雷射光L1。且，藉由例如空冷或水冷，可在框體11內的區域中之靠近第3壁部23側的區域，有效率地冷卻電路部19。Furthermore, in the laser machining head 10A, the laser beam adjustment unit 13 is located within the housing 11, on the side of the partition wall 29 relative to the fourth wall 24, while the circuit unit 19 is located within the housing 11, on the side of the partition wall 29 relative to the third wall 23. This prevents heat generated in the circuit unit 19 from being transferred to the laser beam adjustment unit 13, thereby suppressing strain in the laser beam adjustment unit 13 caused by heat generated in the circuit unit 19 and enabling accurate adjustment of the laser beam L1. Furthermore, the circuit unit 19 can be efficiently cooled in the area within the housing 11 near the third wall 23, for example, by air or water cooling.
又，在雷射加工頭10A，雷射光調整部13係安裝於區隔壁部29。藉此，可將雷射光調整部13確實且穩定地支承於框體11內。Furthermore, in the laser processing head 10A, the laser beam adjustment unit 13 is mounted on the partition wall 29. This ensures that the laser beam adjustment unit 13 is securely and stably supported within the frame 11.
又，在雷射加工頭10A，電路部19係從區隔壁部29分離。藉此，可更確實地抑制在電路部19產生的熱經由區隔壁部29傳播至雷射光調整部13。Furthermore, in the laser processing head 10A, the circuit section 19 is separated from the partition wall section 29. This more reliably prevents heat generated in the circuit section 19 from being transferred to the laser beam adjustment section 13 via the partition wall section 29.
又，在雷射加工頭10A，測定部16及觀察部17係在框體11內的區域中之對聚光部14靠近第1壁部21側之區域，電路部19係在框體11內的區域中之對雷射光調整部13配置於第3壁部23側，分光鏡15係在框體11內，配置於雷射光調整部13與聚光部14之間。藉此，可有效地利用框體11內的區域。且，在雷射加工裝置1，可依據對象物100的表面與聚光部14之距離的測定結果進行加工。又，在雷射加工裝置1，可依據對象物100的表面之觀察結果進行加工。Furthermore, in the laser processing head 10A, the measuring unit 16 and the observation unit 17 are located within the housing 11, on the side of the focusing unit 14 closer to the first wall 21. The circuit unit 19 is located within the housing 11, on the side of the third wall 23, relative to the laser light adjustment unit 13. The spectroscope 15 is located within the housing 11, between the laser light adjustment unit 13 and the focusing unit 14. This effectively utilizes the area within the housing 11. Furthermore, the laser processing apparatus 1 can perform processing based on the distance measurement results between the surface of the object 100 and the focusing unit 14. Furthermore, the laser processing apparatus 1 can perform processing based on the observation results of the surface of the object 100.
又，在雷射加工頭10A，電路部19係依據自測定部16輸出的訊號，控制驅動部18。藉此，可依據對象物100的表面與聚光部14之距離的測定結果，調整雷射光L1的聚光點之位置。Furthermore, in the laser processing head 10A, the circuit unit 19 controls the driver 18 based on the signal output from the measuring unit 16. This allows the position of the focal point of the laser beam L1 to be adjusted based on the distance measured between the surface of the object 100 and the focusing unit 14.
以上的作用及效果，藉由雷射加工頭10B也同樣地可以達到。The above functions and effects can also be achieved by the laser processing head 10B.
又，在雷射加工裝置1，由於藉由各雷射加工頭10A、10B將雷射光L1經度良好地聚光，故，能夠效率良好且精度良好地加工對象物100。Furthermore, in the laser processing apparatus 1, since the laser processing heads 10A and 10B accurately focus the laser light L1, the object 100 can be processed efficiently and accurately.
又，在雷射加工裝置1，一對安裝部65、66分別可沿著Y方向及Z方向移動。藉此，能夠效率更良好地加工對象物100。Furthermore, in the laser processing apparatus 1, a pair of mounting portions 65 and 66 are movable in the Y and Z directions, respectively. This allows for more efficient processing of the object 100.
又，在雷射加工裝置1，支承部7係可分別沿著X方向及Y方向移動，以與Z方向平行的軸線作為中心線而進行旋轉。藉此，能夠效率更良好地加工對象物100。Furthermore, in the laser processing apparatus 1, the support portion 7 is movable in the X and Y directions and rotates about an axis parallel to the Z direction. This allows for more efficient processing of the object 100.
亦可如圖6所示，射入部12配置於框體11的第1壁部21，在雷射光調整部13，光軸調整部33配置於衰減器32的後段、且擴束器34、反射部35、反射型空間光調變器36及成像光學系統37的前段。在如圖6所示的雷射加工頭10A，射入部12、衰減器32及光軸調整部33(具體而言，光軸調整部33的第1轉向鏡331)係配置於第1直線A1上(其他結構是與圖5所示的雷射加工頭10A相同)。在如圖6所示的雷射加工頭10A，衰減器32係用來調整自射入部12射入的雷射光L1之輸出。藉此，由於可調整射入到關於雷射光L1的成形之結構的[擴束器34、反射部35、反射型空間光調變器36、成像光學系統37及聚光部14]之雷射光L1的光軸，故，可將雷射光L1精度更佳地聚光。又，由於衰減器32配置在射入部12與光軸調整部33之間，故，可藉由因適用衰減器32所引起之框體11的大型化。且，能夠謀求雷射加工裝置1的矮背化。以上的結構亦可適用於雷射加工頭10B。Alternatively, as shown in Figure 6 , the incident portion 12 may be positioned on the first wall 21 of the housing 11. In the laser beam adjustment unit 13, the optical axis adjustment unit 33 may be positioned downstream of the attenuator 32 and upstream of the beam expander 34, reflector 35, reflective spatial light modulator 36, and imaging optical system 37. In the laser machining head 10A shown in Figure 6 , the incident portion 12, attenuator 32, and optical axis adjustment unit 33 (specifically, the first turning mirror 331 of the optical axis adjustment unit 33) are positioned along the first straight line A1 (the rest of the structure is the same as that of the laser machining head 10A shown in Figure 5 ). In the laser machining head 10A shown in Figure 6 , the attenuator 32 is used to adjust the output of the laser beam L1 incident from the incident portion 12. This allows the optical axis of the laser light L1 incident on the beam expander 34, reflector 35, reflective spatial light modulator 36, imaging optical system 37, and focusing unit 14, which shape the laser light L1, to be adjusted. This allows the laser light L1 to be focused with greater precision. Furthermore, since the attenuator 32 is positioned between the incident portion 12 and the optical axis adjustment unit 33, the increased size of the housing 11 due to the attenuator 32 can be mitigated. Furthermore, the laser processing apparatus 1 can be made shorter in height. The above structure is also applicable to the laser processing head 10B.
又，在雷射加工頭10A，亦可如圖7所示，射入部12配置於框體11的第5壁部25，在雷射光調整部13，光軸調整部33配置於衰減器32、反射部31、擴束器34、反射部35、反射型空間光調變器36及成像光學系統37的前段。在如圖7所示的雷射加工頭10A，光軸調整部33(具體而言，光軸調整部33的第2轉向鏡333)、衰減器32及反射部31配置於第1直線A1上，光軸調整部33(具體而言，光軸調整部33的第1轉向鏡331)在Z方向上與射入部12相對向，反射部31在Z方向上與擴束器34相對向(其他結構是與圖5所示的雷射加工頭10A相同)。在如圖7所示的雷射加工頭10A，光軸調整部33將自射入部12射入的雷射光L1朝框體11的第2壁部22側反射，衰減器32調整被光軸調整部33反射的雷射光L1之輸出，反射部31將藉由衰減器32調整輸出後的雷射光L1朝框體11的第6壁部26側反射，擴束器34將被反射部31反射的雷射光L1之直徑擴大。藉此，由於可調整射入到關於雷射光L1的成形之結構的[擴束器34、反射部35、反射型空間光調變器36、成像光學系統37及聚光部14]之雷射光L1的光軸，故，可將雷射光L1精度更佳地聚光。又，由於衰減器32配置在光軸調整部33與反射部31之間，故，可藉由因適用衰減器32所引起之框體11的大型化。以上的結構亦可適用於雷射加工頭10B。In addition, in the laser processing head 10A, as shown in Figure 7, the incident part 12 is arranged on the fifth wall 25 of the frame 11, and in the laser light adjustment part 13, the optical axis adjustment part 33 is arranged in the front section of the attenuator 32, the reflection part 31, the beam expander 34, the reflection part 35, the reflective spatial light modulator 36 and the imaging optical system 37. In the laser processing head 10A shown in Figure 7, the optical axis adjustment part 33 (specifically, the second turning mirror 333 of the optical axis adjustment part 33), the attenuator 32 and the reflection part 31 are arranged on the first straight line A1. The optical axis adjustment part 33 (specifically, the first turning mirror 331 of the optical axis adjustment part 33) is opposite to the incident part 12 in the Z direction, and the reflection part 31 is opposite to the beam expander 34 in the Z direction (the other structures are the same as those of the laser processing head 10A shown in Figure 5). In the laser machining head 10A shown in Figure 7, the optical axis adjustment unit 33 reflects the laser light L1 incident from the incident portion 12 toward the second wall 22 of the housing 11. The attenuator 32 adjusts the output of the laser light L1 reflected by the optical axis adjustment unit 33. The reflector 31 reflects the laser light L1, whose output has been adjusted by the attenuator 32, toward the sixth wall 26 of the housing 11. The beam expander 34 expands the diameter of the laser light L1 reflected by the reflector 31. This allows the optical axis of the laser light L1 incident on the beam expander 34, the reflector 35, the reflective spatial light modulator 36, the imaging optical system 37, and the focusing unit 14, which shape the laser light L1, to be adjusted, enabling the laser light L1 to be focused with greater precision. Furthermore, since the attenuator 32 is disposed between the optical axis adjustment section 33 and the reflector 31, the increased size of the housing 11 caused by the use of the attenuator 32 can be reduced. The above structure is also applicable to the laser processing head 10B.
又，在圖5及圖6各自所示的雷射加工頭10A，衰減器32亦可配置於光軸調整部33與擴束器34之間。又，在圖7所示的雷射加工頭10A，衰減器32亦可配置於反射部31與擴束器34之間。又，在圖5、圖6及圖7各自所示的雷射加工頭10A，衰減器32亦可配置於擴束器34的後段(例如，反射部35與反射型空間光調變器36之間)。以上各別的結構亦可適用於雷射加工頭10B。Furthermore, in the laser machining head 10A shown in Figures 5 and 6 , the attenuator 32 can be placed between the optical axis adjustment unit 33 and the beam expander 34. Furthermore, in the laser machining head 10A shown in Figure 7 , the attenuator 32 can be placed between the reflector 31 and the beam expander 34. Furthermore, in the laser machining head 10A shown in Figures 5 , 6 , and 7 , the attenuator 32 can be placed downstream of the beam expander 34 (for example, between the reflector 35 and the reflective spatial light modulator 36). The above structures are also applicable to the laser machining head 10B.
又，光軸調整部33不限於具有第1轉向鏡331、反射構件332、及第2轉向鏡333者。光軸調整部33係為具有用來調整自射入部12射入的雷射光L1的光軸之結構即可。作為一例，亦可為光軸調整部33具有：沿著X方向，將從第1壁部21側射入的雷射光L1朝第1壁部21側且朝第5壁部25側反射之第1轉向鏡331；及將被第1轉向鏡331反射的雷射光L1沿著Z方向朝第6壁部26側反射之第2轉向鏡333。又，亦可為第1轉向鏡331及第2轉向鏡333分別係以電動進行作動之電動鏡子。在該情況，第1轉向鏡331及第2轉向鏡333亦可為依據藉由觀察部17所取得的圖像，自動地調整各鏡子331a、333a的方向。Furthermore, the optical axis adjustment unit 33 is not limited to one comprising the first deflecting mirror 331, the reflective member 332, and the second deflecting mirror 333. The optical axis adjustment unit 33 may be configured to adjust the optical axis of the laser light L1 incident from the incident portion 12. For example, the optical axis adjustment unit 33 may include: the first deflecting mirror 331, which reflects the laser light L1 incident from the first wall 21 toward the first wall 21 and toward the fifth wall 25 in the X direction; and the second deflecting mirror 333, which reflects the laser light L1 reflected by the first deflecting mirror 331 toward the sixth wall 26 in the Z direction. Alternatively, the first and second turning mirrors 331 and 333 may each be electrically actuated motorized mirrors. In this case, the first and second turning mirrors 331 and 333 may automatically adjust their orientations based on the image captured by the observation unit 17.
又，框體11係構成為第1壁部21、第2壁部22、第3壁部23及第5壁部25中的至少1個配置於雷射加工裝置1的安裝部65(或安裝部66)側之狀態下，框體11安裝於安裝部65(或安裝部66)即可。Furthermore, the frame 11 is configured so that at least one of the first wall 21, the second wall 22, the third wall 23, and the fifth wall 25 is positioned on the side of the mounting portion 65 (or mounting portion 66) of the laser processing device 1. The frame 11 can be mounted on the mounting portion 65 (or mounting portion 66).
又，電路部19不限於處理自測定部16輸出的訊號及/或輸入至反射型空間光調變器36之訊號，在雷射加工頭可處理一些訊號即可。Furthermore, the circuit section 19 is not limited to processing the signal output from the measuring section 16 and/or the signal input to the reflective spatial light modulator 36; it is sufficient that the laser processing head processes some signals.
又，光源單元8亦可為具有1個光源者。在該情況，光源單元8係構成為將自1個光源所輸出的雷射光之一部分從射出部81a射出且將該雷射光的殘餘部分從射出部82a射出即可。Alternatively, light source unit 8 may include a single light source. In this case, light source unit 8 may be configured to emit a portion of the laser light output from the single light source from emission portion 81a and the remaining portion of the laser light from emission portion 82a.
接著，說明關於雷射加工裝置1的動作。圖8係顯示雷射加工裝置的動作之示意上面圖。在圖1及之後的圖，顯示雷射加工頭10A、10B之示意化的內部。如圖1、8所示，在支承部7支承對象物100。再者，圖中的圖號S係如前述測定部16、觀察部17這種，代表顯示用來形成改質區域的雷射光L1、L2之照射的光學系統以外之光學系統。Next, the operation of the laser processing device 1 will be described. Figure 8 is a schematic top view illustrating the operation of the laser processing device. Figures 1 and 10B schematically illustrate the interior of the laser processing heads 10A and 10B. As shown in Figures 1 and 8, the support unit 7 supports the object 100. Furthermore, reference numeral S in the figures represents an optical system other than the optical system that displays the irradiation of the laser beams L1 and L2 used to form the modified region, such as the aforementioned measuring unit 16 and observation unit 17.
在對象物100，如前述般，設定有沿著X方向延伸並且沿著Y方向排列之複數個線C。線C係為假想的線，但亦可為實際上劃出的線。再者，在對象物100，亦設定有沿著Y方向延伸並且沿著X方向排列之複數個線，但省略其圖示。As described above, object 100 is provided with a plurality of lines C extending in the X direction and arranged in the Y direction. Lines C are imaginary lines, but may be actually drawn lines. Furthermore, object 100 is also provided with a plurality of lines extending in the Y direction and arranged in the X direction, but these are not shown in the figure.
雷射加工裝置1係藉由控制部9之控制下，實施進行沿著各線C之雷射加工的照射處理。控制部9係在照射處理，至少控制藉由移動機構5之支承部7的移動、藉由移動機構6之雷射加工頭10A、10B的移動、以及來自於雷射加工頭10A及雷射加工頭10B之雷射光L1、L2的照射。在雷射加工裝置1，控制部9係執行作為照射處理之第1處理與第2處理(照射處理包含第1處理與第2處理)。Laser processing apparatus 1 performs irradiation processing along each line C under the control of control unit 9. During the irradiation processing, control unit 9 controls at least the movement of support unit 7 by movement mechanism 5, the movement of laser processing heads 10A and 10B by movement mechanism 6, and the irradiation of laser beams L1 and L2 from laser processing heads 10A and 10B. In laser processing apparatus 1, control unit 9 executes the first and second processes (the irradiation process includes the first and second processes) as irradiation processing.
第1處理係為對複數個線C中的一個線C，將來自於雷射加工頭10A之雷射光L1朝X方向掃描的處理。第2處理係為對複數個線C中的其他線C，將來自於雷射加工頭10B之雷射光L2朝X方向掃描的處理。The first process involves scanning one line C from the plurality of lines C in the X direction with laser light L1 from the laser processing head 10A. The second process involves scanning the remaining lines C from the plurality of lines C in the X direction with laser light L2 from the laser processing head 10B.
控制部9將雷射光L1、L2朝X方向掃描係指藉由以下的動作，將各自的聚光點沿著X方向移動一事。亦即，首先，經由移動機構6的Y軸移動部61、及Z軸移動部63、64，使雷射加工頭10A、10B朝Y方向及Z方向移動，將雷射光L1、L2的聚光點作成為位於各自的線C上且成為對象物100的內部之位置的狀態。又，在該狀態，經由移動機構5使支承部沿著X方向移動，並且經由X軸移動部62A、62B使雷射加工頭10A、10B沿著X方向，朝支承部7相反方向移動，藉此，在對象物100內沿著線C朝X方向使雷射光L1、L2的聚光點移動。The control unit 9 causes the laser beams L1 and L2 to scan in the X direction, which means that the respective focal points are moved in the X direction through the following operation. Specifically, the Y-axis moving unit 61 and the Z-axis moving units 63 and 64 of the moving mechanism 6 first move the laser machining heads 10A and 10B in the Y and Z directions, aligning the focal points of the laser beams L1 and L2 on their respective lines C within the object 100. Furthermore, in this state, the support unit is moved in the X direction via the moving mechanism 5, and the laser machining heads 10A and 10B are moved in the X direction away from the support unit 7 via the X-axis moving units 62A and 62B. This causes the focal points of the laser beams L1 and L2 to move in the X direction along the line C within the object 100.
尤其是在此，控制部9係以在至少一部分的時間重複的方式執行第1處理與第2處理。亦即，控制部9係同時地實現沿著一條線C將雷射光L1掃描的狀態、和沿著其他線C將雷射光L2掃描的狀態。也就是控制部9係使雷射加工頭10A與雷射加工頭10B同時地運轉。藉此，比起使用1個雷射加工頭之加工，可明確地謀求產出量的提升。In particular, the control unit 9 executes the first and second processes in a manner that repeats at least a portion of the time. Specifically, the control unit 9 simultaneously scans along one line C with laser light L1 and along another line C with laser light L2. In other words, the control unit 9 operates the laser processing head 10A and the laser processing head 10B simultaneously. This significantly improves throughput compared to processing using a single laser processing head.
控制部9係若完成沿著1條線C之雷射光L1、L2的掃描的話，分別使雷射加工頭10A、10B獨立朝Y方向(可因應需要，朝Z方向)移動相當於線C之間隔的距離，然後繼續進行沿著下一條線C之雷射光L1、L2的掃描(亦即，第1處理及第2處理)。控制部9係依據大約線C的條數的量，藉由持續進行此動作，沿著所有的線C形成改質區域M。After completing scanning of the laser beams L1 and L2 along one line C, the control unit 9 independently moves the laser processing heads 10A and 10B in the Y direction (or, if necessary, in the Z direction) by a distance corresponding to the interval between lines C. The control unit then continues scanning the laser beams L1 and L2 along the next line C (i.e., the first and second processes). The control unit 9 continues this operation for approximately the number of lines C, forming modified areas M along all lines C.
此時，控制部9係從複數個線C中之位於對象物100的Y方向之一方的端部的線C朝Y方向的內側之線C依次執行第1處理。與此同時，控制部9係從複數個線C中之位於對象物100的Y方向之另一方的端部的線C朝Y方向的內側之線C依次執行第2處理(將此稱為主加工處理)。位於Y方向的一方的端部之線C與位於Y方向的另一方的端部之線C係對於X方向，具有互相相同的長度。At this time, the control unit 9 sequentially performs the first processing from the line C located at one end of the object 100 in the Y direction toward the line C located inward in the Y direction. Simultaneously, the control unit 9 sequentially performs the second processing (referred to as the main processing) from the line C located at the other end of the object 100 in the Y direction toward the line C located inward in the Y direction. The line C located at one end in the Y direction and the line C located at the other end in the Y direction have the same length with respect to the X direction.
更詳細地說明關於這一點。在主加工處理，首先，控制部9藉由控制Y軸移動部61及Z軸移動部63，使雷射加工頭10A朝Y方向及Z方向移動。藉此，作成為使雷射光L1的聚光點處於位在對象物100的Y方向之一方的端部的線C上且成為對象物100的內部之位置的狀態。同時，控制部9藉由控制Y軸移動部61及Z軸移動部64，使雷射加工頭10B朝Y方向及Z方向移動。藉此，作成為使雷射光L2的聚光點處於位在對象物100的Y方向之另一方的端部的線C上且成為對象物100的內部之位置的狀態。此時，雷射光L1的聚光點的X方向之位置與雷射光L2的聚光點的X方向之位置係例如一致。This will be explained in more detail. In the main processing, first, the control unit 9 controls the Y-axis moving unit 61 and the Z-axis moving unit 63 to move the laser processing head 10A in the Y and Z directions. This creates a state in which the focal point of the laser light L1 is located on the line C at one end of the object 100 in the Y direction and is located inside the object 100. At the same time, the control unit 9 controls the Y-axis moving unit 61 and the Z-axis moving unit 64 to move the laser processing head 10B in the Y and Z directions. This creates a state in which the focal point of the laser light L2 is located on the line C at the other end of the object 100 in the Y direction and is located inside the object 100. At this time, the X-direction position of the focal point of the laser light L1 and the X-direction position of the focal point of the laser light L2 are, for example, identical.
在該狀態，控制部9藉由控制移動機構5的移動部53，使支承部7沿著X方向移動。又，在該狀態，控制部9藉由X軸移動部62A，使雷射加工頭10A沿著X方向朝支承部7相反方向移動。且，控制部9在該狀態，藉由X軸移動部62B，使雷射加工頭10B沿著X方向朝支承部7相反方向移動。藉此，在對象物100內，沿著各自的線C朝X方向使雷射光L1、L2之聚光點移動。In this state, the control unit 9 controls the moving unit 53 of the moving mechanism 5 to move the support unit 7 in the X direction. Furthermore, in this state, the control unit 9 controls the X-axis moving unit 62A to move the laser machining head 10A in the X direction, away from the support unit 7. Furthermore, in this state, the control unit 9 controls the X-axis moving unit 62B to move the laser machining head 10B in the X direction, away from the support unit 7. This causes the focal points of the laser beams L1 and L2 to move in the X direction along respective lines C within the object 100.
亦即，控制部9，其係在從雷射加工頭10A、10B輸出雷射光L1、L2的狀態，藉由控制移動機構5、6沿著X方向使支承部7與雷射加工頭10A、10B互相朝相反方向移動，再沿著各自的線C，對對象物100照射雷射光L1、L2(實施照射處理)。Specifically, the control unit 9 controls the moving mechanisms 5 and 6 along the X-direction to move the support unit 7 and the laser processing heads 10A and 10B in opposite directions while the laser processing heads 10A and 10B are outputting laser beams L1 and L2. This causes the laser processing to be performed on the object 100 along respective lines C.
特別是控制部9係作為第1處理，控制移動機構5及移動機構6(X軸移動部62A)，沿著X方向使支承部7與雷射加工頭10A互相朝相反方向移動，作為第2處理，在與第1處理相同的時間點，藉由控制移動機構5及移動機構6(X軸移動部62B)，沿著X方向使支承部7與雷射加工頭10B互相朝相反方向移動。藉此，對於各自的線C之第1處理與第2處理係同時開始進行且同時結束。亦即，在此，第1處理與第2處理在其全體形成重複。藉此，沿著線C，在對象物100的內部形成改質區域M。In particular, the control unit 9 controls the moving mechanism 5 and the moving mechanism 6 (X-axis moving unit 62A) as the first process to move the support unit 7 and the laser processing head 10A in opposite directions along the X direction. As the second process, at the same time as the first process, the control unit 9 controls the moving mechanism 5 and the moving mechanism 6 (X-axis moving unit 62B) to move the support unit 7 and the laser processing head 10B in opposite directions along the X direction. Consequently, the first and second processes for respective lines C start and end simultaneously. In other words, the first and second processes are repeated throughout the entire process. Consequently, a modified region M is formed within the object 100 along line C.
再者，照射處理之支承部7沿著X方向的移動的速度與雷射加工頭10A、10B沿著X方向的移動的速度之關係，在總和之速度到達聚光點的移動的速度之目標值的範圍，控制部9可任意地設定。作為一例，在此，控制部9將沿著X方向之雷射加工頭10A、10B的速度作成為較沿著X方向之支承部7的速度小。且，雷射加工頭10A的速度及雷射加工頭10B的速度，係在成為雷射光L1、L2照射的對向之線C的長度互相相同的情況，能夠作成相同。但，例如在成為雷射光L1照射的對象之線C的長度、與成為雷射光L2照射的對象之線C的長度互相不同的情況，亦可使雷射加工頭10A的速度與雷射加工頭10B的速度互相不同。Furthermore, the control unit 9 can arbitrarily set the relationship between the speed of movement of the support unit 7 in the X direction during irradiation and the speed of movement of the laser processing heads 10A and 10B in the X direction, within a range where the combined speed reaches the target value for the speed of movement of the focal point. For example, the control unit 9 sets the speed of the laser processing heads 10A and 10B in the X direction to be slower than the speed of the support unit 7 in the X direction. Furthermore, the speeds of the laser processing heads 10A and 10B can be made equal if the lengths of the opposing lines C irradiated by the laser beams L1 and L2 are the same. However, for example, if the length of the line C irradiated by the laser light L1 is different from the length of the line C irradiated by the laser light L2, the speed of the laser processing head 10A and the speed of the laser processing head 10B may be different.
接著，控制部9藉由控制Y軸移動部61，使雷射加工頭10A朝Y方向及Z方向移動。藉此，作成為使雷射光L1的聚光點處於位在從對象物100的Y方向之一方的端部起之內側的1條線C上且成為對象物100的內部之位置的狀態。同時，控制部9藉由控制Y軸移動部61，使雷射加工頭10B移動。藉此，作成為使雷射光L2的聚光點處於位在從對象物100的Y方向之另一方的端部起之內側的1條線C上且成為對象物100的內部之位置的狀態。此時，雷射光L1的聚光點的X方向之位置與雷射光L2的聚光點的X方向之位置係例如一致。Next, the control unit 9 controls the Y-axis motion unit 61 to move the laser machining head 10A in the Y and Z directions. This positions the laser beam L1 so that its focal point is located on a line C inward from one Y-direction end of the object 100 and within the object 100. Simultaneously, the control unit 9 controls the Y-axis motion unit 61 to move the laser machining head 10B. This positions the laser beam L2 so that its focal point is located on a line C inward from the other Y-direction end of the object 100 and within the object 100. At this point, the X-direction positions of the laser beam L1 and the laser beam L2 coincide with each other.
在該狀態，控制部9藉由控制移動機構5、6，使支承部7與雷射加工頭10A、10B沿著X方向互相朝相反方向移動，藉此，在對象物100內，使雷射光L1、L2的聚光點沿著各自的線C朝X方向移動。藉此，在此，對於各自的線C之第1處理與第2處理也是同時開始進行且同時結束。亦即，在此，第1處理與第2處理也是在其全體形成重複。藉由反覆進行此控制部9的動作，直到到達對象物100之更內側的線C為止，能使雷射加工頭10A與雷射加工頭10B同時地運轉而無浪費地進行雷射加工。In this state, the control unit 9 controls the movement mechanisms 5 and 6 to move the support unit 7 and the laser processing heads 10A and 10B in opposite directions along the X direction. This causes the focal points of the laser beams L1 and L2 to move along respective lines C within the object 100 in the X direction. Consequently, the first and second processing for the respective lines C also begin and end simultaneously. In other words, the first and second processing are repeated throughout the entire process. By repeating this operation of the control unit 9 until the line C further inward of the object 100 is reached, the laser processing heads 10A and 10B can be operated simultaneously, allowing laser processing to be performed efficiently.
再者，在各圖中，為了說明上的需要，以實線顯示改質區域M，但，實際上不需要從對象物100的表面可看見改質區域M。Furthermore, in each figure, the modified region M is shown with a solid line for explanatory purposes. However, the modified region M does not actually need to be visible from the surface of the object 100.
在此，如圖9所示，在反覆進行前述動作的當中，會有在對象物100之更內側的區域，雷射加工頭10A與雷射加工頭10B之位置關係會形成為彼此的距離在Y方向上無法進一步縮小的位置關係(例如互相即將接觸的狀態)，且在相當於各自的聚光部14之間的距離D的對象物100之區域，殘存有未加工的線C之情況。在此情況，如上述般，不易同時地執行第1處理與第2處理。因此，控制部9係在此情況，實行下述這樣的後加工處理。As shown in Figure 9, during the repetition of the aforementioned operation, the laser processing head 10A and the laser processing head 10B may reach a position where the distance between them in the Y direction cannot be reduced any further (e.g., they are nearly in contact with each other) in an area further inward of the object 100. Consequently, unprocessed lines C remain in an area of the object 100 corresponding to the distance D between their respective focusing units 14. In this case, as described above, it is difficult to perform the first and second processes simultaneously. Therefore, the control unit 9 performs the following post-processing in this situation.
亦即，如圖10所示，控制部9在主加工處理的結果，雷射加工頭10A與雷射加工頭10B對於Y方向形成最接近時，於對象物100之各自的聚光部14之間的區域，殘存有一部分之線C時，實行一邊使雷射加工頭10A從對象物100之該區域迴避，一邊將來自於雷射加工頭10B之雷射光L2對該一部分的線C朝X方向進行掃描(執行第2處理)之後加工處理。再者，雷射加工頭10A與雷射加工頭10B亦可為相反。Specifically, as shown in Figure 10 , when the laser machining heads 10A and 10B are closest to each other in the Y direction as a result of the primary processing, and a portion of line C remains in the area between the respective focusing portions 14 of the object 100, the control unit 9 performs a secondary processing operation by retracting the laser machining head 10A from that area of the object 100 while scanning the portion of line C in the X direction with the laser light L2 from the laser machining head 10B (performing the secondary processing). Furthermore, the laser machining heads 10A and 10B may also be arranged in opposite directions.
藉此，對所有的線C，完成雷射加工。然後，可因應需要，藉由使支承部7旋轉，將與線C交叉的線設定成沿著X方向，再反覆進行前述動作。In this way, laser processing is completed for all lines C. Then, as needed, the support 7 can be rotated to set the lines intersecting the lines C along the X direction, and the above operation can be repeated.
如以上所說明，在雷射加工裝置1，用來支承對象物100之支承部7係藉由移動機構5，可朝X方向移動，且，用來對支承於支承部7之對象物100照射雷射光L1之雷射加工頭10A係藉由移動機構6可朝X方向及Y方向移動。藉此，在此雷射加工裝置1，藉由控制部9的控制，可實施一邊沿著X方向使支承部7與雷射加工頭10A互相朝相反方向移動，一邊沿著線C朝對象物100照射雷射光L1之照射處理(第1處理)。因此，當進行雷射光L1的照射時，比起僅使對象物100側(支承部7)移動的情況，可使加工速度提升。As described above, in the laser processing apparatus 1, the support 7 for supporting the object 100 is movable in the X direction via the moving mechanism 5, and the laser processing head 10A for irradiating the object 100 supported by the support 7 with laser light L1 is movable in the X and Y directions via the moving mechanism 6. Consequently, the laser processing apparatus 1, under the control of the control unit 9, can perform an irradiation process (first process) in which the laser light L1 is irradiated onto the object 100 along line C while the support 7 and the laser processing head 10A are moved in opposite directions in the X direction. Therefore, when irradiating the object 100 with laser light L1, the processing speed can be increased compared to a case in which only the object 100 side (the support 7) is moved.
特別是在此雷射加工裝置1，用來對對象物100進行攝像的照相機AC是經由與負責雷射加工頭10A的X方向的移動之X軸移動部62A不同的其他構件(X軸移動部62C)，安裝於Y軸移動部61。因此，當進行照射處理時，不會追隨照相機AC，可僅使雷射加工頭10A(及支承部7)沿著X方向移動。因此，可使雷射加工頭10A沿著X方向之移動速度進一步提升，能夠使加工速度確實地提升。In particular, in this laser processing apparatus 1, the camera AC used to capture the object 100 is attached to the Y-axis moving section 61 via a separate component (X-axis moving section 62C) from the X-axis moving section 62A responsible for X-directional movement of the laser processing head 10A. Therefore, during irradiation processing, the camera AC does not follow the movement of the laser processing head 10A, and only the laser processing head 10A (and the support section 7) moves in the X-direction. This allows the X-direction movement speed of the laser processing head 10A to be further increased, reliably improving processing speed.
再者，在此雷射加工裝置1，如前述般，藉由在進行照射處理時，使支承部7與雷射加工頭10A互相朝相反方向移動，可使雷射光L1的聚光點對對象物100之移動速度提升。換言之，聚光點之目標的移動速度被支承部7及雷射加工頭10A各別分擔。因此，比起使支承部7及雷射加工頭10A中的一方移動的情況，可抑制各自的移動速度之最大值。其結果，能夠削減支承部7及雷射加工頭10A的加減速之時間及距離。Furthermore, in this laser processing apparatus 1, as described above, by moving the support 7 and the laser processing head 10A in opposite directions during irradiation, the speed at which the focal point of the laser light L1 moves relative to the object 100 can be increased. In other words, the target movement speed of the focal point is shared equally between the support 7 and the laser processing head 10A. Therefore, compared to the case where only one of the support 7 or the laser processing head 10A is moved, the maximum movement speed of each can be suppressed. Consequently, the time and distance required for acceleration and deceleration of the support 7 and the laser processing head 10A can be reduced.
又，在雷射加工裝置1，亦可為移動機構6係包含在X方向上互相對向配置之一對Y軸移動部61，X軸移動部62A係掛設支承於一對Y軸移動部61。在此情況，可確實地支承雷射加工頭10A。Alternatively, in the laser processing apparatus 1 , the moving mechanism 6 may include a pair of Y-axis moving parts 61 disposed opposite each other in the X-direction, with the X-axis moving part 62A being suspended and supported on the pair of Y-axis moving parts 61. In this case, the laser processing head 10A can be reliably supported.
在此，雷射加工頭10A的重量，一般是較支承部7的重量輕。因此，考量當使聚光點以目標的移動速度移動時，會使雷射加工頭10A較支承部7更快速地移動(亦即，使雷射加工頭10A的速度之負擔相對地增大)。Here, the laser machining head 10A is generally lighter than the support 7. Therefore, when the focal point is moved at the target movement speed, the laser machining head 10A will move faster than the support 7 (that is, the speed burden of the laser machining head 10A will be relatively increased).
相對於此，在此雷射加工裝置1，控制部9在照射處理，將沿著X方向之雷射加工頭10A的速度作成為較沿著X方向之支承部7的速度小。如此，在對雷射加工頭10A，連接有用來從光源81導入雷射光L1的光纖2之情況，不論雷射加工頭10A與支承部7的重量之關係如何，藉由使雷射加工頭10A相對地變慢(亦即，使雷射加工頭10A的速度之負擔相對地縮小)，可謀求保護光纖2。In contrast, in this laser processing device 1, the control unit 9 controls the speed of the laser processing head 10A in the X direction to be slower than the speed of the support unit 7 in the X direction during the irradiation process. This allows the laser processing head 10A to be connected to the optical fiber 2 that transmits the laser light L1 from the light source 81. Regardless of the weight relationship between the laser processing head 10A and the support unit 7, the relatively slower speed of the laser processing head 10A (i.e., the speed burden of the laser processing head 10A is relatively reduced) to protect the optical fiber 2.
且，在雷射加工裝置1，還具備雷射加工頭10B，其係用來對支承於支承部7的對象物100照射雷射光L2。移動機構6係包含X軸移動部62B，其係沿著X方向延伸並且安裝有雷射加工頭10B，用來使雷射加工頭10B沿著X方向移動。亦即，Y軸移動部61係安裝有X軸移動部62B，具有使X軸移動部62B朝Y方向移動之功能。又，控制部9係在照射處理，以在至少一部分的時間重複的方式，實施第1處理與第2處理，該第1處理是對複數個線C中的一條線C，照射來自於雷射加工頭10A之雷射光L1，該第2處理是對複數個線C中之其他線C，照射來自於雷射加工頭10B之雷射光L2。如此，藉由使雷射加工頭10A與雷射加工頭10B在至少一部分的時間同時運轉，可使產出量提升。The laser processing device 1 also includes a laser processing head 10B for irradiating the object 100 supported by the support 7 with laser light L2. The moving mechanism 6 includes an X-axis moving portion 62B extending in the X direction and mounted with the laser processing head 10B, thereby moving the laser processing head 10B in the X direction. Specifically, the Y-axis moving portion 61 is mounted with the X-axis moving portion 62B and functions to move the X-axis moving portion 62B in the Y direction. Furthermore, during the irradiation process, the control unit 9 repeats a first process and a second process for at least a portion of the time. The first process involves irradiating one line C of the plurality of lines C with laser light L1 from the laser processing head 10A, and the second process involves irradiating the other lines C of the plurality of lines C with laser light L2 from the laser processing head 10B. Thus, by operating the laser processing heads 10A and 10B simultaneously for at least a portion of the time, throughput can be improved.
再者，在第1處理，控制部9係控制移動機構5及移動機構6(X軸移動部62A)，使得沿著X方向讓支承部7與雷射加工頭10A互相朝相反方向移動，在第2處理，控制部9係控制移動機構5及移動機構6(X軸移動部62B)，使得沿著X方向讓支承部7與雷射加工頭10B互相朝相反方向移動。Furthermore, in the first process, the control unit 9 controls the moving mechanism 5 and the moving mechanism 6 (X-axis moving unit 62A) to move the support unit 7 and the laser processing head 10A in opposite directions along the X direction. In the second process, the control unit 9 controls the moving mechanism 5 and the moving mechanism 6 (X-axis moving unit 62B) to move the support unit 7 and the laser processing head 10B in opposite directions along the X direction.
以上的實施形態，係用來說明關於本發明的雷射加工裝置的一實施形態者。因此，前述雷射加工裝置1係可任意地加以變形實施。The above embodiment is used to illustrate one embodiment of the laser processing device of the present invention. Therefore, the laser processing device 1 can be arbitrarily modified.
例如，如圖11所示，雷射加工裝置1，亦可不具備個雷射加工頭10B。又，伴隨此，移動機構6亦可不包含用來使雷射加工頭10B移動之X軸移動部62B及Z軸移動部64等。即使在此情況，在照射處理，藉由一邊使支承部7與雷射加工頭10A互相朝相反方向移動，一邊照射雷射光L1，能夠謀求加工速度的提升。特別是即使在此情況，當進行照射處理時，不會追隨照相機AC，可僅使雷射加工頭10A(及支承部7)沿著X方向移動，因此，可使雷射加工頭10A之沿著X方向的移動速度提升，能夠更確實地提升加工速度。再者，在圖11~13，省略了安裝部55之圖式。For example, as shown in FIG11 , the laser processing device 1 may not include the laser processing head 10B. Furthermore, the moving mechanism 6 may not include the X-axis moving portion 62B and the Z-axis moving portion 64 for moving the laser processing head 10B. Even in this case, during the irradiation process, by moving the support portion 7 and the laser processing head 10A in opposite directions while irradiating the laser light L1, it is possible to increase the processing speed. In particular, even in this case, during the irradiation process, the laser processing head 10A (and the support portion 7) can be moved only in the X direction without tracking the camera AC. Therefore, the movement speed of the laser processing head 10A in the X direction can be increased, which can more reliably increase the processing speed. Furthermore, in Figures 11 to 13, the mounting portion 55 is omitted.
又，亦可如圖12及圖13所示，在雷射加工裝置1，照相機AC係與雷射加工頭10A一同安裝於用來使雷射加工頭10A沿著X方向移動之X軸移動部62A，能夠經由X軸移動部62A安裝於Y軸移動部61。在圖12的例子，不具備雷射加工頭10B，在圖13的例子，具備有雷射加工頭10B。在這些情況，不需要另外用來將照相機AC安裝於Y軸移動部61之結構，能夠謀求裝置結構的簡單化。關於此情況，可參照下述的附記。Alternatively, as shown in Figures 12 and 13 , in the laser processing apparatus 1 , the camera AC can be mounted together with the laser processing head 10A on an X-axis moving portion 62A for moving the laser processing head 10A in the X direction, and can be mounted on the Y-axis moving portion 61 via the X-axis moving portion 62A. In the example of Figure 12 , the laser processing head 10B is not included, while in the example of Figure 13 , the laser processing head 10B is included. In these cases, a separate structure for mounting the camera AC on the Y-axis moving portion 61 is not required, thus simplifying the apparatus structure. For details on this, please refer to the following supplementary note.
又，在以上的例子，顯示X軸移動部62A、62B、62C係掛設支承於一對Y軸移動部61。但，亦可為移動機構6係包含單一的Y軸移動部61，X軸移動部62A、62B、62C係以單臂懸樑的狀態支承於該單一的Y軸移動部61。In the above example, the X-axis moving parts 62A, 62B, and 62C are shown as being suspended and supported on a pair of Y-axis moving parts 61. However, the moving mechanism 6 may also include a single Y-axis moving part 61, with the X-axis moving parts 62A, 62B, and 62C being supported on the single Y-axis moving part 61 in a cantilevered manner.
又，在圖1的例子，顯示對於Y方向，在互相鄰接的X軸移動部62A、62B之外側設置X軸移動部62C的例子，亦即，當從Z方向觀看時，雷射加工頭10A、雷射加工頭10B、及照相機AC依此順序排列於Y方向的例子。但，X軸移動部62A~62C、雷射加工頭10A、10B、及照相機AC的排列不限於此。亦即，亦可為對於Y方向，在X軸移動部62A與X軸移動部62B之間配置X軸移動部62C。在此情況，當從Z方向觀看時，雷射加工頭10A、照相機AC、及、雷射加工頭10B是以此順序排列於Y方向。Furthermore, the example in FIG1 shows an example in which the X-axis moving unit 62C is provided outside the adjacent X-axis moving units 62A and 62B in the Y direction. That is, when viewed from the Z direction, the laser processing head 10A, the laser processing head 10B, and the camera AC are arranged in this order in the Y direction. However, the arrangement of the X-axis moving units 62A to 62C, the laser processing heads 10A and 10B, and the camera AC is not limited to this. That is, the X-axis moving unit 62C may be arranged between the X-axis moving unit 62A and the X-axis moving unit 62B in the Y direction. In this case, when viewed from the Z direction, the laser processing head 10A, the camera AC, and the laser processing head 10B are arranged in this order in the Y direction.
且，在前述實施形態，雷射加工裝置1(移動機構5)亦可不具備用來使支承部7朝Y方向移動之功能(移動部53)。在此情況，藉由支承部7側的輕量化，可謀求支承部7的加減速所需要之距離的削減、及支承部7的速度提升。藉此，如前述般，在將雷射加工頭10A、10B的速度作成為較支承部7的速度小的條件下，可使加工速度提升。Furthermore, in the aforementioned embodiment, the laser processing apparatus 1 (moving mechanism 5) may not include the function (moving portion 53) for moving the support 7 in the Y direction. In this case, by reducing the weight of the support 7, the distance required to accelerate or decelerate the support 7 can be reduced, thereby increasing the speed of the support 7. As described above, the processing speed can be increased while the speed of the laser processing heads 10A and 10B is lower than that of the support 7.
關於以上的實施形態，如以下所附加。Regarding the above implementation forms, please refer to the following.
[附加1][Appendix 1]
一種雷射加工裝置，係用來藉由對設定有延著第1方向延伸並且沿著與前述第1方向交叉的第2方向排列的複數個線之對象物，沿著前述線照射雷射光，使得在前述對象物沿著前述線形成改質區域之雷射加工裝置，其特徵為具備：支承部，其係用來支承前述對象物；第1雷射加工頭，其係用來對支承於前述支承部的前述對象物照射前述雷射光；第1移動機構，其係用來使前述支承部沿著第1方向移動；第2移動機構，其係至少使前述第1雷射加工頭沿著前述第1方向及前述第2方向移動；控制部，其係在從前述第1雷射加工頭輸出前述雷射光的狀態，藉由控制前述第1移動機構及前述第2移動機構，沿著前述第1方向使前述支承部與前述第1雷射加工頭互相朝相反方向移動，實施沿著前述線對前述對象物照射前述雷射光之照射處理，前述第2移動機構係包含：第1移動部，其係沿著前述第1方向延伸並且安裝有前述第1雷射加工頭，用來使前述第1雷射加工頭沿著前述第1方向移動；及第2移動部，其係沿著前述第2方向延伸並且安裝有前述第1移動部，用來使前述第1移動部沿著前述第2方向移動，在前述第1雷射加工頭，連接有用來導入自光源輸出的前述雷射光之光纖，前述控制部係在前述照射處理，使沿著前述第1方向之前述第1雷射加工頭的速度作成為較沿著前述第1方向之前述支承部的速度小。A laser processing device is used to irradiate a target object provided with a plurality of lines extending along a first direction and arranged along a second direction intersecting the first direction with laser light along the lines, so that a modified area is formed on the target object along the lines. The laser processing device is characterized by comprising: a support portion for supporting the target object; a first laser processing head for irradiating the target object supported by the support portion with the laser light; a first moving mechanism for moving the support portion along the first direction; a second moving mechanism for moving the first laser processing head along at least the first direction and the second direction; and a control portion for controlling the first moving mechanism and the second moving mechanism to move the target object along the first direction and the second direction when the laser light is output from the first laser processing head. The support portion and the first laser processing head are moved in opposite directions along the first direction to perform an irradiation process of irradiating the object with the laser light along the line. The second movement mechanism includes: a first movement portion extending along the first direction and having the first laser processing head mounted thereon, for moving the first laser processing head along the first direction; and a second movement portion extending along the second direction and having the first movement portion mounted thereon, for moving the first movement portion along the second direction. An optical fiber for guiding the laser light output from a light source is connected to the first laser processing head. During the irradiation process, the control portion controls the speed of the first laser processing head along the first direction to be slower than the speed of the support portion along the first direction.
[附加2][Additional 2]
如前述附加1之雷射加工裝置，其中，前述第2移動機構係包含在前述第1方向上互相對向而配置之一對前述第2移動部，前述第1移動部係掛設支承於一對前述第2移動部。In the laser processing device of the aforementioned supplementary item 1, the second moving mechanism includes a pair of second moving parts arranged opposite to each other in the first direction, and the first moving part is suspended and supported on the pair of second moving parts.
[附加3][Appendix 3]
如前述附加1或2之雷射加工裝置，其中，還具備照相機，其係用來對支承於前述支承部的前述對象物進行攝像，前述照相機係經由與前述第1移動部不同的構件，安裝於前述第2移動部。The laser processing apparatus according to the aforementioned additional 1 or 2 further comprises a camera for photographing the object supported by the support portion, wherein the camera is mounted on the second movable portion via a member separate from the first movable portion.
[附加4][Addition 4]
如前述附加3之雷射加工裝置，其中，前述第2移動機構係包含作為前述不同的構件之第3移動部，該第3移動部是沿著前述第1方向延伸並且安裝有前述照相機，用來使前述照相機沿著前述第1方向移動。In the laser processing apparatus according to the aforementioned additional item 3, the second moving mechanism includes a third moving portion as the aforementioned different component, the third moving portion extending along the aforementioned first direction and having the aforementioned camera mounted thereon for moving the aforementioned camera along the aforementioned first direction.
[附加5][Additional 5]
如前述附加1至4中任一者之雷射加工裝置，其中，還具備第2雷射加工頭，其係用來對支承於前述支承部的前述對象物照射雷射光，前述第2移動機構係包含第4移動部，其係沿著前述第1方向延伸並且安裝有前述第2雷射加工頭，用來使前述第2雷射加工頭沿著前述第1方向移動，前述第2移動部，係安裝有前述第4移動部，具有用來使前述第4移動部沿著前述第2方向移動之功能，前述控制部係在前述照射處理，以在至少一部分的時間重複的方式，實施第1處理與第2處理，該第1處理是對前述複數個線中的一個線，照射來自於前述第1雷射加工頭之前述雷射光，該第2處理是對前述複數個線中的其他線，照射來自於前述第2雷射加工頭之前述雷射光，在前述第1處理，前述控制部係控制前述第1移動機構及前述第2移動機構，沿著前述第1方向使前述支承部與前述第1雷射加工頭互相朝相反方向移動，在前述第2處理，前述控制部係控制前述第1移動機構及前述第2移動機構，沿著前述第1方向使前述支承部與前述第2雷射加工頭互相朝相反方向移動。A laser processing device as described in any one of the above additions 1 to 4, wherein the device further comprises a second laser processing head for irradiating the object supported by the support portion with laser light, the second moving mechanism comprises a fourth moving portion extending along the first direction and mounted with the second laser processing head for moving the second laser processing head along the first direction, the second moving portion is mounted with the fourth moving portion and has a function of moving the fourth moving portion along the second direction, the control portion performs the first treatment and the second treatment in a manner repeated at least part of the time during the irradiation treatment, The first process involves irradiating one of the plurality of lines with the aforementioned laser light from the first laser processing head, and the second process involves irradiating the other of the plurality of lines with the aforementioned laser light from the second laser processing head. In the first process, the control unit controls the first and second moving mechanisms to move the support unit and the first laser processing head in opposite directions along the first direction. In the second process, the control unit controls the first and second moving mechanisms to move the support unit and the second laser processing head in opposite directions along the first direction.
若依據本發明，能夠提供可使加工速度提升的雷射加工裝置。According to the present invention, a laser processing device capable of increasing processing speed can be provided.
1:雷射加工裝置1: Laser processing equipment
1a:裝置框架1a: Device frame
5:移動機構(第1移動機構)5: Moving mechanism (1st moving mechanism)
6:移動機構(第2移動機構)6: Moving mechanism (second moving mechanism)
7:支承部7: Supporting part
10A:雷射加工頭(第1雷射加工頭)10A: Laser processing head (first laser processing head)
10B:雷射加工頭(第2雷射加工頭)10B: Laser processing head (second laser processing head)
10C:照相機單元10C: Camera unit
14:聚光部14: Spotlight Department
19:電路部19: Circuit Department
51:固定部51: Fixed part
53:移動部53:Mobile Department
55:安裝部55: Installation Department
61:Y軸移動部(第2移動部)61: Y-axis moving part (second moving part)
62A:X軸移動部(第1移動部)62A: X-axis moving part (first moving part)
62B:X軸移動部(第4移動部)62B: X-axis moving part (4th moving part)
62C:X軸移動部(第3移動部)62C: X-axis moving part (third moving part)
63:Z軸移動部63: Z-axis moving part
64:Z軸移動部64: Z-axis moving part
65:安裝部65: Installation Department
66:安裝部66: Installation Department
67A:安裝部67A: Installation Department
67B:安裝部67B: Installation Department
67C:安裝部67C: Installation Department
68:Z軸移動部68: Z-axis moving part
69:安裝部69: Installation Department
100:對象物100: Object
AC:照相機AC:Camera
C:線C: Line
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020079497AJP7438009B2 (en) | 2020-04-28 | 2020-04-28 | laser processing equipment |
| JP2020-079497 | 2020-04-28 |
| Publication Number | Publication Date |
|---|---|
| TW202146143A TW202146143A (en) | 2021-12-16 |
| TWI890771Btrue TWI890771B (en) | 2025-07-21 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110112474ATWI890771B (en) | 2020-04-28 | 2021-04-07 | Laser processing equipment |
| Country | Link |
|---|---|
| JP (1) | JP7438009B2 (en) |
| KR (1) | KR20230002712A (en) |
| CN (1) | CN115551671A (en) |
| TW (1) | TWI890771B (en) |
| WO (1) | WO2021220710A1 (en) |
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| JP7655246B2 (en) | 2022-02-25 | 2025-04-02 | 株式会社デンソー | Measuring device and laser processing device |
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| WO2021220710A1 (en) | 2021-11-04 |
| JP7438009B2 (en) | 2024-02-26 |
| JP2021171803A (en) | 2021-11-01 |
| KR20230002712A (en) | 2023-01-05 |
| TW202146143A (en) | 2021-12-16 |
| CN115551671A (en) | 2022-12-30 |
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