TWI877326B - Cover tape for packing electronic component and package - Google Patents
Cover tape for packing electronic component and packageDownload PDFInfo
- Publication number
- TWI877326B TWI877326BTW110109523ATW110109523ATWI877326BTW I877326 BTWI877326 BTW I877326BTW 110109523 ATW110109523 ATW 110109523ATW 110109523 ATW110109523 ATW 110109523ATW I877326 BTWI877326 BTW I877326B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- tape
- heat
- cover tape
- sealing layer
- Prior art date
Links
Classifications
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/34—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents and having several recesses to accommodate a series of articles or quantities of material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Wrappers (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Translated fromChinese本發明係關於一種電子零件包裝用覆蓋帶及使用其之包裝體。The present invention relates to a covering tape for packaging electronic components and a packaging body using the same.
近年來，IC(Integrated Circuit，積體電路)、電阻、電晶體、二極體、電容器、壓電元件暫存器等電子零件採用編帶包裝以供表面安裝。於編帶包裝中，將電子零件收納於具有供收納電子零件之複數個收納部之載帶，然後利用覆蓋帶將載帶熱密封，獲得用以存放或搬送電子零件之包裝體。又，安裝電子零件時，自載帶剝離覆蓋帶，將電子零件自動取出並表面安裝於基板。再者，覆蓋帶亦被稱為上帶。In recent years, electronic components such as IC (Integrated Circuit), resistors, transistors, diodes, capacitors, and piezoelectric components are packaged in tape for surface mounting. In tape packaging, electronic components are stored in a carrier tape having multiple storage sections for storing electronic components, and then the carrier tape is heat-sealed with a cover tape to obtain a package for storing or transporting electronic components. When installing electronic components, the cover tape is peeled off from the carrier tape, and the electronic components are automatically taken out and surface mounted on the substrate. Furthermore, the cover tape is also called the top tape.
於表面安裝時電子零件附著於覆蓋帶之問題被指出(例如參照專利文獻1~2)。The problem of electronic components adhering to the cover tape during surface mounting has been pointed out (see, for example, patent documents 1~2).
[專利文獻1]日本專利特開平10-95448號公報[Patent document 1] Japanese Patent Publication No. 10-95448
[專利文獻2]日本專利特開2004-25570號公報[Patent document 2] Japanese Patent Publication No. 2004-25570
本發明之發明人等發現，儘管包裝體於充分受到控制之常溫常濕環境下存放或搬送之情形時未產生問題，但於該包裝體在存放或搬送時曝露於高溫高濕環境下之情形時，存在將覆蓋帶自載帶剝離時電子零件附著於覆蓋帶之問題。The inventors of the present invention have found that although no problem occurs when the package is stored or transported in a fully controlled normal temperature and humidity environment, when the package is exposed to a high temperature and high humidity environment during storage or transportation, there is a problem that the electronic components adhere to the cover tape when the cover tape is peeled off from the carrier tape.
本發明之目的在於提供一種電子零件包裝用覆蓋帶，於包裝體在存放或搬送時曝露於高溫高濕環境下之情形時可抑制電子零件附著於覆蓋帶之現象(以下，有時稱為「因高溫高濕引起之附著現象」)。The purpose of the present invention is to provide a covering tape for packaging electronic components, which can suppress the phenomenon of electronic components adhering to the covering tape when the packaging body is exposed to a high temperature and high humidity environment during storage or transportation (hereinafter, sometimes referred to as "adhesion phenomenon caused by high temperature and high humidity").
本發明之一實施方式係一種電子零件包裝用覆蓋帶，其具有：基材層；熱密封層，其配置於上述基材層之一面側；及防靜電層，其配置於上述基材層之與上述熱密封層側之面相反之面側；且於以使用載帶之包裝體之狀態於60℃、95%RH(Relative Humidity，相對濕度)之環境下存放24小時之濕熱負載後，上述覆蓋帶之自上述防靜電層側測得之表面電阻率為1×1010Ω/□以下，於以使用載帶之包裝體之狀態於60℃、95%RH之環境下存放24小時之濕熱負載後，上述覆蓋帶之自上述熱密封層側測得之表面黏力為5gf以下。One embodiment of the present invention is a cover tape for packaging electronic components, which comprises: a substrate layer; a heat sealing layer disposed on one side of the substrate layer; and an antistatic layer disposed on the side of the substrate layer opposite to the side of the heat sealing layer; and after a package body using a carrier tape is stored in an environment of 60°C and 95%RH (Relative Humidity) for 24 hours, the surface resistivity of the cover tape measured from the side of the antistatic layer is 1×1010 Ω/□ or less. After the package body using the carrier tape is placed in a 60°C, 95%RH environment for 24 hours under a wet and hot load, the surface adhesion of the cover tape measured from the heat sealing layer side is less than 5gf.
本發明之一實施方式係上述電子零件包裝用覆蓋帶，其中於上述濕熱負載後上述覆蓋帶之自上述熱密封層側測得之表面黏力係於上述濕熱負載前上述覆蓋帶之自上述熱密封層側測得之表面黏力之80%以下。One embodiment of the present invention is the above-mentioned covering tape for packaging electronic components, wherein the surface adhesion of the covering tape measured from the side of the heat sealing layer after the above-mentioned wet heat load is less than 80% of the surface adhesion of the covering tape measured from the side of the heat sealing layer before the above-mentioned wet heat load.
本發明之一實施方式係一種包裝體，其具備：載帶，其具有供收納電子零件之複數個收納部；電子零件，其收納於上述收納部中；及上述電子零件包裝用覆蓋帶，其以覆蓋上述收納部之方式配置。One embodiment of the present invention is a packaging body, which comprises: a carrier tape having a plurality of storage sections for storing electronic components; electronic components stored in the storage sections; and the electronic component packaging covering tape, which is arranged in a manner to cover the storage sections.
根據本發明之電子零件包裝用覆蓋帶，可抑制因高溫高濕引起之附著現象。因此，藉由使用本發明之電子零件包裝用覆蓋帶或包裝體，可良好地安裝電子零件。According to the electronic component packaging covering tape of the present invention, the adhesion phenomenon caused by high temperature and high humidity can be suppressed. Therefore, by using the electronic component packaging covering tape or packaging body of the present invention, electronic components can be well installed.
1:覆蓋帶1: Covering tape
2:基材層2: Base material layer
3:熱密封層3: Heat sealing layer
3h:熱密封部3h: Heat sealing part
4:防靜電層4: Anti-static layer
5:中間層5: Middle layer
10:包裝體10:Packaging body
11:載帶11: Carrier tape
12:收納部12: Storage Department
13:電子零件13: Electronic parts
14:進給孔14: Feed hole
圖1係例示本發明之電子零件包裝用覆蓋帶之概略剖視圖。Figure 1 is a schematic cross-sectional view illustrating the cover tape for electronic component packaging of the present invention.
圖2係例示本發明之包裝體之概略俯視圖及剖視圖。Figure 2 is a schematic top view and cross-sectional view of the packaging body of the present invention.
圖3(a)、(b)係例示本發明之電子零件包裝用覆蓋帶之概略剖視圖。Figure 3 (a) and (b) are schematic cross-sectional views illustrating the cover tape for electronic component packaging of the present invention.
以下，參照圖式等，對本發明之實施方式進行說明。但是，本發明可以諸多不同態樣來實施，而不應將其解釋為限定於以下所例示之實施方式所記載之內容。又，圖式中，有時相較於實際形態，模式性地表示各部之寬度、厚度、形狀等，以使說明更明確，但此僅為例示，並不限定本發明之解釋。又，於本說明書及各圖中，對與已經呈現之圖中所描述之元件相同之元件標附同一符號，並適當省略詳細說明。The following describes the implementation of the present invention with reference to the drawings, etc. However, the present invention can be implemented in many different forms, and should not be interpreted as being limited to the contents described in the implementation described below. In addition, in the drawings, the width, thickness, shape, etc. of each part are sometimes schematically represented compared to the actual form to make the description clearer, but this is only an example and does not limit the explanation of the present invention. In addition, in this manual and each figure, the same symbol is attached to the same components as those described in the already presented figures, and the detailed description is appropriately omitted.
於本說明書中，當顯示在某構件之上配置其他構件之態樣時，簡單記載為「於…上」或者「於…下」之情形時，只要無特殊記載，便包括如下兩種情形，即，以與某構件相接之方式於正上方或正下方配置其他構件，及於某構件之上方或下方進而介隔另一構件配置其他構件。又，於本說明書中，當表現在某構件之面配置其他構件之態樣時，簡單記載為「於…面側」或「於…面」之情形時，只要無特殊記載，便包括如下兩種情形，即，以與某構件相接之方式於正上方或正下方配置其他構件，及於某構件之上方或下方進而介隔另一構件配置其他構件。又，於本說明書中，只要無特殊記載，數值便為排除特異值後之平均值。In this specification, when other components are arranged on a certain component, if it is simply described as "on..." or "below...", unless otherwise specified, the following two situations are included, namely, other components are arranged directly above or directly below in a manner of contact with a certain component, and other components are arranged above or below a certain component with another component interposed therebetween. In addition, in this specification, when other components are arranged on the surface of a certain component, if it is simply described as "on the side of..." or "on...", unless otherwise specified, the following two situations are included, namely, other components are arranged directly above or directly below in a manner of contact with a certain component, and other components are arranged above or below a certain component with another component interposed therebetween. In addition, in this specification, unless otherwise specified, the value is the average value after excluding the outlier.
以下，對本發明之電子零件包裝用覆蓋帶及包裝體進行詳細說明。再者，於本說明書中，有時將「電子零件包裝用覆蓋帶」簡稱為「覆蓋帶」。The following is a detailed description of the electronic component packaging cover tape and packaging body of the present invention. In addition, in this specification, the "electronic component packaging cover tape" is sometimes referred to as "cover tape".
本發明之覆蓋帶具有：基材層；熱密封層，其配置於上述基材層之一面側；及防靜電層，其配置於基材層之與熱密封層側之面相反之面側。覆蓋帶係於以使用載帶之包裝體之狀態於60℃、95%RH之環境下存放24小時之濕熱負載後，上述覆蓋帶之自上述防靜電層側測得之表面電阻率為1×1010Ω/□以下。覆蓋帶係於以使用載帶之包裝體之狀態於60℃、95%RH之環境下存放24小時之濕熱負載後，上述覆蓋帶之自上述熱密封層側測得之表面黏力為5gf以下。The cover tape of the present invention comprises: a substrate layer; a heat-sealing layer disposed on one side of the substrate layer; and an antistatic layer disposed on the side of the substrate layer opposite to the side of the heat-sealing layer. After the cover tape is placed in a package using a carrier tape under a wet heat load at 60°C and 95%RH for 24 hours, the surface resistivity of the cover tape measured from the side of the antistatic layer is less than 1×1010 Ω/□. After the cover tape is placed in a package using a carrier tape under a wet heat load at 60°C and 95%RH for 24 hours, the surface adhesion of the cover tape measured from the side of the heat-sealing layer is less than 5 gf.
參照圖式，對本發明之覆蓋帶進行說明。圖1係表示本發明之覆蓋帶之一例之概略剖視圖。如圖1所示，本發明之覆蓋帶1具有：基材層2；熱密封層3，其配置於基材層2之一面側；及防靜電層4，其配置於基材層2之與熱密封層3側之面相反之面側。The covering tape of the present invention is described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of the covering tape of the present invention. As shown in FIG. 1 , the covering tape 1 of the present invention has: a substrate layer 2; a heat sealing layer 3, which is arranged on one side of the substrate layer 2; and an antistatic layer 4, which is arranged on the side of the substrate layer 2 opposite to the side of the heat sealing layer 3.
於本發明中，例如亦可如圖2所示，視需要於基材層2及熱密封層3之間配置有中間層5。再者，亦可於基材層2與中間層5之間配置有接著劑層，但對此未進行圖示。又，亦可於熱密封層3之與基材層2側之面相反之面側配置有與防靜電層4不同之第二防靜電層或抗黏連層，但對此未進行圖示。In the present invention, for example, as shown in FIG. 2 , an intermediate layer 5 may be arranged between the substrate layer 2 and the heat sealing layer 3 as needed. Furthermore, an adhesive layer may be arranged between the substrate layer 2 and the intermediate layer 5, but this is not illustrated. Also, a second antistatic layer or anti-adhesion layer different from the antistatic layer 4 may be arranged on the side of the heat sealing layer 3 opposite to the side of the substrate layer 2, but this is not illustrated.
本發明之覆蓋帶1係於規定之濕熱負載後自防靜電層4側測得之表面電阻率為1×1010Ω/□以下，於規定之濕熱負載後自熱密封層3側測得之表面黏力為5gf以下。The cover tape 1 of the present invention has a surface resistivity of 1×1010 Ω/□ or less measured from the antistatic layer 4 side after a specified wet and hot load, and a surface adhesive force of 5 gf or less measured from the heat sealing layer 3 side after a specified wet and hot load.
表面電阻率係表面之每單位面積之電阻率，亦稱為薄片電阻率或面電阻率。表面電阻率藉由下述實施例之[表面電阻率之測定]中所說明之方法進行測定。於濕熱負載後自防靜電層側測得之表面電阻率係使覆蓋帶自下述濕熱負載後之包裝體剝離之後於覆蓋帶之未進行熱密封之部位之防靜電層側的表面測得之值。Surface resistivity is the resistivity per unit area of the surface, also known as sheet resistivity or surface resistivity. The surface resistivity is measured by the method described in [Measurement of surface resistivity] of the following embodiment. The surface resistivity measured from the antistatic layer side after wet heat loading is the value measured on the surface of the antistatic layer side of the covering tape where heat sealing is not performed after the covering tape is peeled off from the package after wet heat loading as described below.
表面黏力係表面之每單位面積之黏著力。表面黏力藉由下述實施例之[表面黏力之測定]中所說明之方法進行測定。於濕熱負載後自熱密封層側測得之表面黏力係使覆蓋帶自下述濕熱負載後之包裝體剝離之後於覆蓋帶之未進行熱密封之部位之熱密封層側的表面測得之值。Surface adhesion is the adhesion per unit area of the surface. The surface adhesion is measured by the method described in [Measurement of surface adhesion] of the following embodiment. The surface adhesion measured from the heat sealing layer side after wet heat loading is the value measured on the surface of the heat sealing layer side of the covering tape where heat sealing is not performed after the covering tape is peeled off from the package body after wet heat loading as described below.
於本發明中，濕熱負載係藉由以將覆蓋帶熱密封在紙載帶上所得之包裝體之狀態於60℃、95%RH之環境下存放24小時所賦予之負載。濕熱負載之條件將於下述實施例之[包裝體之製作方法]及[濕熱負載之方法]中進行說明。In the present invention, the wet heat load is a load applied by placing the package obtained by heat-sealing the cover tape on the paper carrier tape in an environment of 60°C and 95%RH for 24 hours. The conditions of the wet heat load will be described in the [Packaging Preparation Method] and [Wet Heat Load Method] of the following embodiments.
電子零件於電子零件之製造工場中以包裝體之形式被梱包。較為理想的是，期望包裝體於以不會成為高濕度環境之方式得到充分控制之常溫常濕環境下存放或搬送。然而，實際上，難以充分控制倉庫、運輸機構或容器內部、使用電子零件之工場等全部環境，於高溫多濕之地域或季節存放或運輸之情形時，有時包裝體會暴露在高溫高濕環境下。又，載帶大致分為塑膠製之塑膠載帶及紙製之紙載帶，紙載帶通常較塑膠載帶容易吸濕從而容易受到高溫高濕環境之影響。因此，應對因高溫高濕引起之附著現象係重要問題。Electronic components are packaged in the form of packaging bodies in electronic component manufacturing plants. Ideally, the packaging bodies are expected to be stored or transported in a normal temperature and normal humidity environment that is fully controlled in a way that does not become a high humidity environment. However, in reality, it is difficult to fully control the entire environment of warehouses, transportation mechanisms or containers, factories using electronic components, etc. When stored or transported in high temperature and humid areas or seasons, the packaging bodies are sometimes exposed to high temperature and high humidity environments. In addition, carriers are generally divided into plastic carriers made of plastic and paper carriers made of paper. Paper carriers are generally more hygroscopic than plastic carriers and are therefore more susceptible to high temperature and high humidity environments. Therefore, dealing with the adhesion phenomenon caused by high temperature and high humidity is an important issue.
本發明之發明人等面臨如下問題，即，儘管藉由對覆蓋帶賦予防靜電性能，可將因高溫高濕引起之附著現象減少至某種程度，但難以再進一步減少。因此，本發明之發明人等努力進行研究，結果發現，使於規定之濕熱負載後自熱密封層側測得之表面黏力成為5gf以下較為重要。再者，即便在防靜電性能不充分之狀態下僅使表面黏力降低，靜電之作用亦較大，故而無法實現因高溫高濕引起之附著現象減少。The inventors of the present invention faced the following problem: although the adhesion phenomenon caused by high temperature and high humidity can be reduced to a certain extent by giving the cover tape antistatic properties, it is difficult to reduce it further. Therefore, the inventors of the present invention have made great efforts to conduct research and found that it is more important to make the surface adhesion measured from the heat sealing layer side after the specified wet and hot load less than 5gf. Furthermore, even if the surface adhesion is only reduced in the state of insufficient antistatic performance, the effect of static electricity is also large, so it is impossible to achieve the reduction of adhesion caused by high temperature and high humidity.
進而，認為要想抑制將覆蓋帶與載帶剝離時產生靜電，最有效的是向成為剝離面之熱密封層中添加防靜電劑。然而，防靜電劑於高溫高濕環境下通常性能會下降，故而若欲抑制在高溫高濕環境下剝離時產生靜電，需要向熱密封層中大量添加通常之防靜電劑，或者向熱密封層中添加導電性高分子或導電性無機粒子等特別之防靜電劑。Furthermore, it is believed that the most effective way to suppress static electricity generated when peeling the cover tape and the carrier tape is to add an antistatic agent to the heat seal layer that becomes the peeling surface. However, the performance of antistatic agents generally decreases in high temperature and high humidity environments. Therefore, if you want to suppress static electricity generated when peeling in a high temperature and high humidity environment, you need to add a large amount of ordinary antistatic agents to the heat seal layer, or add special antistatic agents such as conductive polymers or conductive inorganic particles to the heat seal layer.
因此，本發明之發明人等面臨如下情況，即，於欲藉由僅向熱密封層中添加防靜電劑獲得所需防靜電性能之情形時，難以於確保所需熱密封性能之同時調整規定之濕熱負載後自熱密封層側測得之表面黏力。此時，發現，紙載帶通常相較於塑膠載帶，表面之凹凸更大，故而難以確保熱密封強度，且容易吸濕，故而容易因濕氣導致熱密封強度下降，結果上述問題更顯著。Therefore, the inventors of the present invention faced the following situation: when it is desired to obtain the required antistatic performance by simply adding an antistatic agent to the heat sealing layer, it is difficult to adjust the surface adhesion measured from the heat sealing layer side after the specified wet and hot load while ensuring the required heat sealing performance. At this time, it was found that the paper carrier tape usually has larger surface unevenness than the plastic carrier tape, so it is difficult to ensure the heat sealing strength, and it is easy to absorb moisture, so it is easy to cause the heat sealing strength to decrease due to moisture, and the above-mentioned problem is more significant.
因此，本發明之發明人等進一步進行努力研究，結果發現，於基材層之與熱密封層側之面相反之面側配置防靜電層，使於規定之濕熱負載後上述覆蓋帶之自防靜電層側測得之表面電阻率成為1×1010Ω/□以下較為重要。再者，即便在基材層之與熱密封層側之面相反之面側設置防靜電層之情形時，通常亦考慮著眼於覆蓋帶之自熱密封層側之面測得之表面電阻率，但本發明之發明人等發現，於確保所需熱密封性能之同時實現因高溫高濕引起之附著現象之減少時，應著眼於覆蓋帶之自防靜電層側之面測得之表面電阻率。Therefore, the inventors of the present invention have made further efforts to study and found that it is more important to configure an antistatic layer on the side of the substrate layer opposite to the heat sealing layer side so that the surface resistivity of the cover tape measured from the antistatic layer side after a specified wet heat load becomes less than 1×1010 Ω/□. Furthermore, even when an antistatic layer is provided on the side of the substrate layer opposite to the heat sealing layer side, the surface resistivity of the covering tape measured from the heat sealing layer side is usually considered. However, the inventors of the present invention have found that when ensuring the required heat sealing performance while reducing the adhesion phenomenon caused by high temperature and high humidity, attention should be paid to the surface resistivity of the covering tape measured from the antistatic layer side.
本發明之覆蓋帶1於基材層2之與熱密封層3側之面相反之面側配置防靜電層4，且於規定之濕熱負載後自防靜電層4側測得之表面電阻率為1×1010Ω/□以下。一般認為，若表面電阻率為1×1010Ω/□以下，則可獲得良好之防靜電性能。若使防靜電層4側之防靜電性能為該水準，則即便熱密封層3側之防靜電性能未達到該水準之情形時，亦可抑制因高溫高濕引起之附著現象，且向熱密封層3中添加之防靜電劑之使用制約消失或減少，故而變得容易調整表面黏力。於規定之濕熱負載後自防靜電層4側測得之表面電阻率亦可未達1×109Ω/□。The cover tape 1 of the present invention is provided with an antistatic layer 4 on the side of the substrate layer 2 opposite to the side of the heat sealing layer 3, and the surface resistivity measured from the side of the antistatic layer 4 after a prescribed wet and hot load is 1×1010 Ω/□ or less. It is generally believed that if the surface resistivity is 1×1010 Ω/□ or less, good antistatic performance can be obtained. If the antistatic performance on the side of the antistatic layer 4 is at this level, even if the antistatic performance on the side of the heat sealing layer 3 does not reach this level, the adhesion phenomenon caused by high temperature and high humidity can be suppressed, and the use restriction of the antistatic agent added to the heat sealing layer 3 disappears or decreases, so it becomes easy to adjust the surface adhesion. The surface resistivity measured from the 4th side of the antistatic layer after the specified wet and hot load can also be less than 1×109 Ω/□.
為了使規定之濕熱負載後自防靜電層4側測得之表面電阻率成為1×1010Ω/□以下，可藉由向防靜電層中添加不易因熱或濕度而發生分解或劣化之防靜電劑來進行調整。作為此種防靜電劑，例如可例舉：導電性高分子、高分子型界面活性劑、導電性無機粒子等。亦可僅由防靜電劑形成防靜電層。又，亦可向主要之防靜電層以外之層、例如基材層、熱密封層、下述中間層或接著劑層等中添加防靜電劑以輔助防靜電層。In order to make the surface resistivity measured from the antistatic layer 4 side after the specified wet and hot load become less than 1×1010 Ω/□, it can be adjusted by adding an antistatic agent that is not easily decomposed or degraded by heat or humidity to the antistatic layer. Examples of such antistatic agents include: conductive polymers, polymer-type surfactants, conductive inorganic particles, etc. The antistatic layer can also be formed only by the antistatic agent. In addition, the antistatic agent can also be added to layers other than the main antistatic layer, such as the substrate layer, the heat sealing layer, the intermediate layer described below, or the adhesive layer, etc., to assist the antistatic layer.
本發明之覆蓋帶1於基材層2之與防靜電層4側之面相反之面側配置有熱密封層3，且於規定之濕熱負載後自熱密封層3側測得之表面黏力為5gf以下。藉由在充分之防靜電性能之基礎上降低表面黏力，高溫高濕之附著現象得到抑制。The cover tape 1 of the present invention is provided with a heat seal layer 3 on the side of the substrate layer 2 opposite to the antistatic layer 4, and the surface adhesion measured from the heat seal layer 3 side after a specified wet and hot load is less than 5gf. By reducing the surface adhesion on the basis of sufficient antistatic performance, the adhesion phenomenon at high temperature and high humidity is suppressed.
為了使規定之濕熱負載後自熱密封層3側測得之表面黏力成為5gf以下，可藉由例如以下方法來進行調整：在熱密封層使用低黏性之材料或較硬之材料；使熱密封層硬化；對熱密封層之表面進行一定之粗面化；使熱密封層薄膜化等。In order to make the surface adhesion measured from the three sides of the heat sealing layer below 5gf after the specified wet and hot load, adjustments can be made by, for example, using low-viscosity materials or harder materials in the heat sealing layer; hardening the heat sealing layer; roughening the surface of the heat sealing layer to a certain extent; making the heat sealing layer thinner, etc.
通常，若進行上述方法，則有即便表面黏力有所降低，熱密封性能亦下降之趨勢。因此，為了既確保所需之熱密封性能又使表面黏力成為5gf以下，可將熱密封性更良好但黏性或硬度較高之材料與熱密封性相對較低但黏性或硬度較低之材料組合使用。作為此種材料之組合，例如可例舉：熔點或玻璃轉移溫度相對較低之材料與熔點或玻璃轉移溫度相對較高之材料之組合、低分子或中分子之材料與高分子材料之組合、樹脂材料與無機材料之組合等。Generally, if the above method is performed, there is a tendency that even if the surface adhesion is reduced, the heat sealing performance will also decrease. Therefore, in order to ensure the required heat sealing performance and make the surface adhesion below 5gf, a material with better heat sealing but higher viscosity or hardness can be used in combination with a material with relatively lower heat sealing but lower viscosity or hardness. Examples of such material combinations include: a combination of a material with a relatively low melting point or glass transition temperature and a material with a relatively high melting point or glass transition temperature, a combination of a low molecular or medium molecular material and a high molecular material, a combination of a resin material and an inorganic material, etc.
具體可例舉：乙酸乙烯酯含量比相對較高之乙烯-乙酸乙烯酯系共聚物與乙酸乙烯酯含量比相對較低之乙烯-乙酸乙烯酯系共聚物之組合、乙烯-乙酸乙烯酯系共聚物與聚乙烯(包含乙烯與α烯烴之共聚物)之組合、聚乙烯(包含乙烯與α烯烴之共聚物)與除聚乙烯以外之烯烴系樹脂之組合、烯烴系樹脂與除烯烴系樹脂以外之熱塑性樹脂之組合等。Specific examples include: a combination of an ethylene-vinyl acetate copolymer having a relatively high vinyl acetate content and an ethylene-vinyl acetate copolymer having a relatively low vinyl acetate content, a combination of an ethylene-vinyl acetate copolymer and polyethylene (including a copolymer of ethylene and α-olefin), a combination of polyethylene (including a copolymer of ethylene and α-olefin) and an olefin resin other than polyethylene, a combination of an olefin resin and a thermoplastic resin other than an olefin resin, etc.
或者，亦可熱密封層優先確保熱密封性能，且藉由熱密封層以外之層、例如下述中間層或接著劑層、基材層等調整表面黏力。例如，可藉由在熱密封層以外之層中使用較硬之材料或使熱密封層以外之層之厚度較薄，而降低表面黏力。Alternatively, the heat sealing layer may be prioritized to ensure heat sealing performance, and the surface adhesion may be adjusted by layers other than the heat sealing layer, such as the intermediate layer or adhesive layer described below, or the substrate layer. For example, the surface adhesion may be reduced by using a harder material in the layer other than the heat sealing layer or by making the layer other than the heat sealing layer thinner.
於濕熱負載後上述覆蓋帶之自上述熱密封層側測得之表面黏力可低於濕熱負載前之表面黏力。一般而言，濕熱負載會使構成覆蓋帶之層或材料軟化或劣化，由此容易產生高溫高濕之附著現象。相對於此，藉由在濕熱負載下黏著力降低，可抑制高溫高濕之附著現象。濕熱負載後之表面黏力可為濕熱負載前之表面黏力之80%。作為使濕熱負載後之表面黏力低於濕熱負載前之表面黏力之方法，例如可例舉如下方法，即，使用因濕熱負載而黏性降低之材料或變硬之材料。例如，乙烯-乙酸乙烯酯共聚物存在因濕熱負載而結晶性或配向性提高從而變硬之情形。或者，包含熱交聯劑之組合物存在因濕熱負載進行熱交聯反應而變硬之情形。The surface adhesion of the above-mentioned covering tape measured from the above-mentioned heat sealing layer side after the wet heat load may be lower than the surface adhesion before the wet heat load. Generally speaking, the wet heat load will soften or deteriorate the layers or materials constituting the covering tape, which is easy to produce high temperature and high humidity adhesion phenomenon. In contrast, by reducing the adhesion under the wet heat load, the high temperature and high humidity adhesion phenomenon can be suppressed. The surface adhesion after the wet heat load may be 80% of the surface adhesion before the wet heat load. As a method for making the surface adhesion after the wet heat load lower than the surface adhesion before the wet heat load, for example, the following method can be cited, that is, using a material whose viscosity is reduced or hardened due to the wet heat load. For example, ethylene-vinyl acetate copolymer may become hardened due to improved crystallinity or orientation under wet heat load. Alternatively, a composition containing a thermal crosslinking agent may become hardened due to thermal crosslinking reaction under wet heat load.
如此，本發明之發明人等所完成之本發明之電子零件包裝用覆蓋帶即便在包裝體存放及/或搬送時曝露於高溫高濕環境下之情形時，亦可抑制電子零件附著於覆蓋帶之現象(以下，有時稱為「因高溫高濕引起之附著現象」)。Thus, the electronic component packaging cover tape of the present invention completed by the inventors of the present invention can suppress the phenomenon of electronic components adhering to the cover tape even when the package is exposed to a high temperature and high humidity environment during storage and/or transportation (hereinafter, sometimes referred to as "adhesion phenomenon caused by high temperature and high humidity").
再者，與本發明之覆蓋帶組合使用之載帶可為塑膠載帶，又，亦可為紙載帶，但基於存在如上所述之較大之問題方面考慮，較佳為紙載帶。此處，於紙載帶中進行濕熱負載之原因在於，想要使用更容易受到濕度影響之載帶設為更嚴苛之條件。又，通常於實際之環境下，即便存在溫度成為60℃或濕度成為95%RH之情況，成為60℃、95%RH之情況亦較稀少，從而認為藉由在60℃、95%RH之環境下存放24小時，可加速實驗地確認濕度所造成之影響。Furthermore, the carrier used in combination with the cover tape of the present invention can be a plastic carrier or a paper carrier, but based on the consideration of the greater problem as mentioned above, a paper carrier is preferred. Here, the reason for performing the wet heat load on the paper carrier is to set a more severe condition using a carrier that is more susceptible to humidity. Also, usually in the actual environment, even if there is a situation where the temperature becomes 60°C or the humidity becomes 95%RH, the situation where it becomes 60°C and 95%RH is relatively rare, Therefore, it is believed that by storing it in an environment of 60°C and 95%RH for 24 hours, the effect of humidity can be confirmed experimentally faster.
以下，對本發明之覆蓋帶之各構成進行說明。The following describes the various components of the covering tape of the present invention.
熱密封層係配置於基材層之一面側之層。熱密封層係於使用本發明之覆蓋帶製造包裝體時，藉由對載帶進行熱密封而將覆蓋帶與載帶接著。The heat sealing layer is a layer disposed on one side of the base material layer. When the cover tape of the present invention is used to manufacture a package, the heat sealing layer connects the cover tape to the carrier tape by heat sealing the carrier tape.
熱密封層可包含熱塑性樹脂。可使用一種熱塑性樹脂，亦可使用複數種熱塑性樹脂。作為熱塑性樹脂，可例舉：乙烯-乙酸乙烯酯系共聚物、聚乙烯(包含乙烯與α烯烴之共聚物)或聚丙烯(包含聚丙烯與α烯烴之共聚物)等烯烴系樹脂、丙烯酸系樹脂、聚酯系樹脂、聚胺酯樹脂、氯乙烯-乙酸乙烯酯共聚物等。熱密封層中，視需要亦可包含例如黏著賦予劑、防靜電劑、抗黏連劑等添加劑。The heat sealing layer may include a thermoplastic resin. One thermoplastic resin may be used, or a plurality of thermoplastic resins may be used. Examples of thermoplastic resins include ethylene-vinyl acetate copolymers, polyethylene (including copolymers of ethylene and α-olefins) or polypropylene (including copolymers of polypropylene and α-olefins), acrylic resins, polyester resins, polyurethane resins, vinyl chloride-vinyl acetate copolymers, etc. The heat sealing layer may also include additives such as adhesion agents, antistatic agents, and anti-adhesion agents as needed.
對於使用乙烯-乙酸乙烯酯系共聚物與聚乙烯之組合作為熱密封層之具體例之一之情形進行說明。再者，視需要亦可包含除乙烯-乙酸乙烯酯系共聚物或聚乙烯以外之其他樹脂。The following describes a specific example of using a combination of ethylene-vinyl acetate copolymer and polyethylene as a heat-sealing layer. Furthermore, other resins other than ethylene-vinyl acetate copolymer or polyethylene may be included as needed.
乙烯-乙酸乙烯酯系共聚物係至少包含乙烯系單體單元及乙酸乙烯酯單體單元之共聚物。乙烯-乙酸乙烯酯系共聚物中之乙烯之含量並無特別限定，可設為60質量%以上97質量%以下，亦可設為80質量%以上95質量%以下。乙烯-乙酸乙烯酯系共聚物中之乙酸乙烯酯之含量並無特別限定，可設為3質量%以上40質量%以下，亦可設為5質量%以上20質量%以下。乙烯-乙酸乙烯酯系共聚物除包含乙烯系單體單元及乙酸乙烯酯單體單元以外，亦可包含第三單體單元。第三單體單元可包含具有防靜電性能之官能基。熱密封層中之乙烯-乙酸乙烯酯系共聚物之含量並無特別限定，可設為50質量%以上90質量%以下，亦可設為60質量%以上80質量%以下。若增加乙烯-乙酸乙烯酯系共聚物之含量，則呈熱密封性能提昇但表面黏力變高之趨勢。The ethylene-vinyl acetate copolymer is a copolymer containing at least ethylene monomer units and vinyl acetate monomer units. The ethylene content in the ethylene-vinyl acetate copolymer is not particularly limited, and can be set to 60 mass% or more and 97 mass% or less, or can be set to 80 mass% or more and 95 mass% or less. The vinyl acetate content in the ethylene-vinyl acetate copolymer is not particularly limited, and can be set to 3 mass% or more and 40 mass% or less, or can be set to 5 mass% or more and 20 mass% or less. In addition to the ethylene monomer units and the vinyl acetate monomer units, the ethylene-vinyl acetate copolymer can also contain a third monomer unit. The third monomer unit can contain a functional group having antistatic properties. The content of the ethylene-vinyl acetate copolymer in the heat sealing layer is not particularly limited, and can be set to 50 mass% or more and 90 mass% or less, or can be set to 60 mass% or more and 80 mass% or less. If the content of ethylene-vinyl acetate copolymer is increased, the heat sealing performance will be improved but the surface adhesion will increase.
聚乙烯可例舉：低密度聚乙烯、直鏈狀低密度聚乙烯、中密度聚乙烯、高密度聚乙烯等聚乙烯。要想容易與乙烯-乙酸乙烯酯系共聚物混合，可使用低密度聚乙烯(LDPE，密度0.910~未達0.930)或直鏈狀低密度聚乙烯(LLDPE，密度0.910~0.925)。熱密封層中之聚乙烯樹脂之含量並無特別限定，可設為10質量%以上且未達50質量%，亦可設為20質量%以上40質量%以下。若增加聚乙烯之含量，則呈熱密封性能下降但表面黏力變低之趨勢。Examples of polyethylene include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene. To facilitate mixing with ethylene-vinyl acetate copolymers, low-density polyethylene (LDPE, density 0.910 to less than 0.930) or linear low-density polyethylene (LLDPE, density 0.910 to 0.925) can be used. The content of polyethylene resin in the heat-sealing layer is not particularly limited and can be set to 10% by mass or more and less than 50% by mass, or 20% by mass or more and less than 40% by mass. If the content of polyethylene is increased, the heat-sealing performance tends to decrease but the surface adhesion becomes lower.
熱密封層之厚度例如可設為1μm以上60μm以下。於紙載帶之情形時，熱密封層之厚度例如亦可為10μm以上60μm以下。The thickness of the heat sealing layer can be set to, for example, 1 μm or more and 60 μm or less. In the case of a paper carrier tape, the thickness of the heat sealing layer can also be set to, for example, 10 μm or more and 60 μm or less.
作為熱密封層之形成方法，例如可例舉：塗佈法、吹脹法、T型模頭擠出法等。Examples of methods for forming the heat sealing layer include coating, inflation, and T-die extrusion.
防靜電層係配置於基材層之與熱密封層側之面相反之面側而用以防止覆蓋帶帶電之層。防靜電層可包含防靜電劑。作為防靜電劑，例如可例舉：導電性高分子、高分子型界面活性劑、低分子型界面活性劑、導電性無機粒子。作為導電性高分子，例如可例舉：聚噻吩、聚苯胺、聚吡咯、聚乙快、聚對苯、聚苯乙快、聚乙烯咔唑等。作為高分子型界面活性劑，可例舉高分子型四級銨鹽等。防靜電層中，例如亦可包含樹脂等黏合劑或抗黏連劑等添加劑。防靜電層之黏合劑可使用交聯之樹脂。防靜電層之厚度例如可設為0.02μm以上3μm以下。作為防靜電層之形成方法，例如可例舉塗佈法。The antistatic layer is a layer disposed on the side of the substrate layer opposite to the heat seal layer side to prevent the covering from being charged. The antistatic layer may contain an antistatic agent. Examples of the antistatic agent include: conductive polymers, polymer surfactants, low molecular surfactants, and conductive inorganic particles. Examples of conductive polymers include: polythiophene, polyaniline, polypyrrole, polyethylene, polyphenylene, polystyrene, polyvinyl carbazole, etc. Examples of polymer surfactants include polymer quaternary ammonium salts, etc. The antistatic layer may also include, for example, adhesives such as resins or additives such as anti-adhesive agents. A cross-linked resin can be used as the adhesive of the antistatic layer. The thickness of the antistatic layer can be set to, for example, 0.02 μm or more and 3 μm or less. As a method for forming the antistatic layer, a coating method can be cited, for example.
基材層係支持熱密封層或防靜電層之層。作為基材層，例如可例舉：聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯、聚對苯二甲酸-間苯二甲酸乙二酯共聚物、對苯二甲酸-環己烷二甲醇-乙二醇共聚物等聚酯、尼龍6、尼龍66、尼龍610等聚醯胺、聚乙烯、聚丙烯、聚甲基戊烯等聚烯烴等。基材層中，視需要亦可包含例如填充劑、塑化劑、著色劑、防靜電劑等添加劑。The substrate layer is a layer that supports the heat sealing layer or the antistatic layer. Examples of the substrate layer include polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, polyamides such as nylon 6, nylon 66, nylon 610, and polyolefins such as polyethylene, polypropylene, and polymethylpentene. The substrate layer may also contain additives such as fillers, plasticizers, colorants, and antistatic agents as needed.
基材層可為單層，亦可為同種或不同種類之複數層積層體。又，基材層可為延伸膜，亦可為未延伸膜。基材層亦可例如被實施電暈放電處理、電漿處理、臭氧處理、火焰處理、預熱處理、除塵埃處理、蒸鍍處理、鹼處理、噴砂處理等易接著處理。基材層之厚度例如可設為2.5μm以上300μm以下，亦可設為6μm以上100μm以下，亦可設為12μm以上50μm以下。The substrate layer may be a single layer or a laminate of multiple layers of the same or different types. In addition, the substrate layer may be a stretched film or an unstretched film. The substrate layer may also be subjected to easy-to-attach treatments such as corona discharge treatment, plasma treatment, ozone treatment, flame treatment, preheating treatment, dust removal treatment, evaporation treatment, alkaline treatment, sandblasting treatment, etc. The thickness of the substrate layer may be set to, for example, 2.5 μm to 300 μm, 6 μm to 100 μm, or 12 μm to 50 μm.
於基材層與熱密封層之間亦可具有中間層。藉由中間層，可提昇基材層及熱密封層之密接性。又，藉由中間層，提昇緩衝性，將覆蓋帶熱密封在載帶上時，可將熱更均勻地賦予至熱密封層。作為中間層之材料，例如可例舉：聚乙烯或聚丙烯等聚烯烴、聚胺基甲酸酯及聚酯等。中間層之厚度例如可設為5μm以上50μm以下。There may also be an intermediate layer between the base layer and the heat sealing layer. The intermediate layer can improve the adhesion between the base layer and the heat sealing layer. In addition, the intermediate layer can improve the cushioning property, and when the cover tape is heat-sealed on the carrier tape, heat can be more evenly applied to the heat sealing layer. Examples of the material of the intermediate layer include polyolefins such as polyethylene or polypropylene, polyurethane, and polyester. The thickness of the intermediate layer can be set to, for example, 5 μm or more and 50 μm or less.
於基材層與中間層之間亦可具有接著劑層。藉由在基材層形成接著劑層，即便在基材層缺乏接著力之情形時，基材層與中間層之間之密接性亦會提昇。作為接著劑層之材料，例如可例舉：丙烯酸系、異氰酸酯系、胺基甲酸酯系、酯系等接著劑。接著劑層之厚度例如可設為0.1μm以上1μm以下。There may also be an adhesive layer between the substrate layer and the intermediate layer. By forming the adhesive layer on the substrate layer, the adhesion between the substrate layer and the intermediate layer will be improved even when the substrate layer lacks adhesion. Examples of materials for the adhesive layer include acrylic, isocyanate, urethane, and ester adhesives. The thickness of the adhesive layer may be set to, for example, 0.1 μm or more and 1 μm or less.
於濕熱負載前覆蓋帶之自防靜電層側測得之表面電阻率可設為1×1010Ω/□以下，亦可設為未達1×109Ω/□。又，於濕熱負載前覆蓋帶之自熱密封層側測得之表面黏力可設為30gf以下，亦可設為20gf以下。The surface resistivity measured on the self-antistatic layer side of the cover tape before wet heat loading can be set to 1×1010 Ω/□ or less, or less than 1×109 Ω/□. In addition, the surface adhesion measured on the self-heat sealing layer side of the cover tape before wet heat loading can be set to 30 gf or less, or less than 20 gf.
覆蓋帶於濕熱負載前之熱密封強度可設為5gf以上50gf以下，亦可設為15gf以上40gf以下。又，覆蓋帶於濕熱負載後之熱密封強度可設為5gf以上50gf以下，亦可設為15gf以上40gf以下。可抑制電子零件包裝時產生剝離等不良情況之可能性、或者於存放過程中或搬送過程中覆蓋帶意外剝落之可能性。熱密封強度藉由下述實施例之[熱密封強度之測定]中所說明之方法進行測定。The heat seal strength of the cover tape before wet heat loading can be set to 5gf to 50gf, or 15gf to 40gf. In addition, the heat seal strength of the cover tape after wet heat loading can be set to 5gf to 50gf, or 15gf to 40gf. This can suppress the possibility of undesirable conditions such as peeling during electronic component packaging, or the possibility of accidental peeling of the cover tape during storage or transportation. The heat seal strength is measured by the method described in [Measurement of heat seal strength] of the following embodiment.
本發明之包裝體具備：載帶，其具有供收納電子零件之複數個收納部；電子零件，其收納於上述收納部中；及上述覆蓋帶，其以覆蓋上述收納部之方式配置。根據本發明之包裝體，可抑制因高溫高濕引起之附著現象。The packaging body of the present invention comprises: a carrier tape having a plurality of storage parts for storing electronic components; electronic components stored in the storage parts; and the covering tape arranged in a manner of covering the storage parts. According to the packaging body of the present invention, the adhesion phenomenon caused by high temperature and high humidity can be suppressed.
圖3(a)、(b)係表示本發明之電子零件包裝用覆蓋帶之包裝體之一例的概略俯視圖及剖視圖，圖3(b)係圖3(a)之A-A線剖視圖。如圖3(a)、(b)所示，包裝體10具備：載帶11，其具有供收納電子零件13之複數個收納部12；電子零件13，其收納於收納部12中；及覆蓋帶1，其以覆蓋收納部12之方式配置。覆蓋帶1被熱密封在載帶11上，於覆蓋帶1之熱密封層3之兩端以規定寬度呈線狀地設置有熱密封部3h。又，於包裝體10中，載帶11可具有於一方向上以間距a排列之進給孔14。Figures 3(a) and (b) are schematic top views and cross-sectional views of an example of a package body of the cover tape for electronic component packaging of the present invention, and Figure 3(b) is a cross-sectional view of line A-A of Figure 3(a). As shown in Figures 3(a) and (b), the package body 10 comprises: a carrier tape 11 having a plurality of storage portions 12 for storing electronic components 13; electronic components 13 stored in the storage portions 12; and a cover tape 1 arranged to cover the storage portions 12. The cover tape 1 is heat-sealed on the carrier tape 11, and heat-sealed portions 3h are provided linearly at both ends of the heat-sealed layer 3 of the cover tape 1 with a predetermined width. In addition, in the package body 10, the carrier tape 11 may have feed holes 14 arranged at a spacing a in one direction.
以下，對包裝體之各構成進行說明。The following is an explanation of the various components of the packaging body.
關於覆蓋帶，由於記載於上述「A.電子零件包裝用覆蓋帶」之項中，故而此處省略說明。Regarding the cover tape, since it is mentioned in the above "A. Cover tape for electronic component packaging", the description is omitted here.
於包裝體中，覆蓋帶之熱密封層與載帶係藉由熱密封部接著。熱密封部例如可配置於覆蓋帶之熱密封層與載帶相接之部分之一部分上。即，熱密封層亦可具有熱密封部及非熱密封部。藉此，可使覆蓋帶對於載帶之剝離性變得良好。In the package body, the heat-sealing layer of the covering tape and the carrier tape are connected by a heat-sealing portion. The heat-sealing portion can be arranged, for example, on a portion where the heat-sealing layer of the covering tape and the carrier tape are connected. That is, the heat-sealing layer can also have a heat-sealing portion and a non-heat-sealing portion. In this way, the peeling property of the covering tape from the carrier tape can be improved.
載帶係具有供收納電子零件之複數個收納部之構件。作為載帶，只要具有複數個收納部即可，例如可使用壓紋載帶、沖孔載帶、衝壓載帶中之任一者。作為載帶之材質，例如可例舉：聚氯乙烯、聚苯乙烯、聚酯、聚丙烯、聚碳酸酯、聚丙烯腈、ABS(Acrylonitrile-Butadiene-Styrene，丙烯腈-丁二烯-苯乙烯)樹脂等塑膠，或紙等。於本發明中，紙係指以纖維素為主成分者，亦可進而包含樹脂成分、或者糊漿或填料等低分子成分。The carrier is a component having a plurality of storage sections for storing electronic components. As a carrier, any carrier having a plurality of storage sections may be used, for example, an embossed carrier, a punched carrier, or a stamped carrier. As the material of the carrier, for example, plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, ABS (Acrylonitrile-Butadiene-Styrene) resin, or paper, etc. may be cited. In the present invention, paper refers to a material having cellulose as the main component, and may further contain a resin component, or a low molecular weight component such as a paste or a filler.
作為電子零件，並無特別限定，例如可例舉：IC、電阻、電容器、電感器、電晶體、二極體、LED(發光二極體)、液晶、壓電元件暫存器、濾波器、水晶振盪子、水晶振子、連接器、開關、電位器、繼電器等。There is no particular limitation on electronic parts, and examples thereof include: IC, resistor, capacitor, inductor, transistor, diode, LED (light emitting diode), liquid crystal, piezoelectric element register, filter, crystal oscillator, crystal resonator, connector, switch, potentiometer, relay, etc.
再者，本發明並不限定於上述實施方式。上述實施方式係例示，具有與本發明之申請專利範圍所記載之技術思想實質上相同之構成且發揮相同之作用效果者均包含於本發明之技術範圍內。Furthermore, the present invention is not limited to the above-mentioned embodiments. The above-mentioned embodiments are illustrative, and those having substantially the same structure and exerting the same effects as the technical ideas described in the patent application scope of the present invention are all included in the technical scope of the present invention.
以下表示實施例及比較例，對本發明進一步詳細地進行說明。The following are examples and comparative examples to further illustrate the present invention.
作為基材層，準備厚度為25μm且兩面實施過電暈處理之雙軸延伸聚對苯二甲酸乙二酯膜(FUTAMURA CHEMICAL公司製造之FE2002，以下稱為PET膜)。將防靜電塗佈劑(包含PEDOT作為導電性高分子且包含氮丙啶作為硬化劑之ARACOAT AS601D/CL910(質量比)=10/1，荒川化學公司製造。固形物成分濃度3.0%)塗佈(濕潤(Wet)塗佈量3.5g/m2)於PET膜之一面側，藉此形成防靜電層。於PET膜之與形成有防靜電層之面相反之面側，塗佈胺基甲酸酯系增黏塗佈劑(Takenate A-3075/Takelac A-3210(質量比)=3/1，用乙酸乙酯進行5%稀釋，濕潤塗佈量1.0g/m2)，形成接著劑層。繼而，藉由熔融擠出加工，將聚乙烯(CE4009，住友化學公司製造)及聚乙烯(SUMIKATHENE L705，住友化學公司製造)與具有防靜電性能之乙烯-乙酸乙烯酯共聚物(MELTHENE(註冊商標)M(MX53C)，東曹公司製造)以40/60(質量比)混合，將所得之材料積層為各20μm之厚度，從而分別形成中間層及熱密封層。藉此，製作實施例1之覆蓋帶。As a base layer, a biaxially stretched polyethylene terephthalate film (FE2002 manufactured by FUTAMURA CHEMICAL, hereinafter referred to as PET film) with a thickness of 25 μm and corona treated on both sides was prepared. An antistatic coating agent (ARACOAT AS601D/CL910 (mass ratio) = 10/1 containing PEDOT as a conductive polymer and aziridine as a curing agent, manufactured by Arakawa Chemical Co., Ltd. Solid content concentration 3.0%) was applied (wet application amount 3.5 g/m2 ) on one side of the PET film to form an antistatic layer. A urethane-based adhesion promoter (Takenate A-3075/Takelac A-3210 (mass ratio) = 3/1, diluted 5% with ethyl acetate, wet coating amount 1.0 g/m2 ) was applied on the side of the PET film opposite to the side on which the antistatic layer was formed to form an adhesive layer. Then, polyethylene (CE4009, manufactured by Sumitomo Chemical Co., Ltd.) and polyethylene (SUMIKATHENE L705, manufactured by Sumitomo Chemical Co., Ltd.) were mixed with ethylene-vinyl acetate copolymer (MELTHENE (registered trademark) M (MX53C), manufactured by Tosoh Corporation) having antistatic properties at a mass ratio of 40/60 by melt extrusion, and the resulting materials were laminated to a thickness of 20 μm each to form an intermediate layer and a heat sealing layer, respectively. Thus, the cover tape of Example 1 was prepared.
將實施例1中之熱密封層材料變更為聚乙烯(SUMIKATHENE L705，住友化學公司製造)與具有防靜電性能之乙烯-乙酸乙烯酯共聚物(MELTHENE(註冊商標)M(MX53C)，東曹公司製造)以20/80(質量比)混合之材料，除此以外，藉由與實施例1同樣之方法，製作實施例2之覆蓋帶。The heat sealing layer material in Example 1 was changed to a material mixed with polyethylene (SUMIKATHENE L705, manufactured by Sumitomo Chemical Co., Ltd.) and ethylene-vinyl acetate copolymer with antistatic properties (MELTHENE (registered trademark) M (MX53C), manufactured by Tosoh Corporation) at a ratio of 20/80 (mass ratio). In addition, the cover tape of Example 2 was prepared by the same method as Example 1.
將實施例1中之熱密封層材料變更為將聚乙烯(SUMIKATHENE L705，住友化學公司製造)與具有防靜電性能之乙烯-乙酸乙烯酯共聚物(MELTHENE(註冊商標)M(MX53C)，東曹公司製造)以60/40(質量比)混合而成之材料，除此以外，藉由與實施例1同樣之方法，製作實施例3之覆蓋帶。The heat sealing layer material in Example 1 was changed to a material obtained by mixing polyethylene (SUMIKATHENE L705, manufactured by Sumitomo Chemical Co., Ltd.) and ethylene-vinyl acetate copolymer (MELTHENE (registered trademark) M (MX53C), manufactured by Tosoh Corporation) with an antistatic property at a ratio of 60/40 (mass ratio). In addition, the cover tape of Example 3 was prepared by the same method as Example 1.
將實施例1中之熱密封層材料變更為63.2質量%之乙烯-乙酸乙烯酯共聚物(EVAFLEX EV550，三井-陶氏聚合化學公司製造)、26.4質量%之低密度聚乙烯(SUMIKATHENE L705，住友化學公司製造)、8質量%之改質劑(ARKON P-125，荒川化學公司製造)、及2.4質量%之防靜電母料(RIKEMASTER ELB-347，理研維他命公司製造(含有25%防靜電劑))之混合材料，且將實施例1中之中間層材料變更為聚乙烯樹脂(NOVATEC LC600A，日本聚乙烯公司製造)，除此以外，藉由與實施例1同樣之方法，製作實施例4之覆蓋帶。The heat sealing layer material in Example 1 was changed to a mixed material of 63.2 mass% of ethylene-vinyl acetate copolymer (EVAFLEX EV550, manufactured by Mitsui-Dow Polychemicals Co., Ltd.), 26.4 mass% of low-density polyethylene (SUMIKATHENE L705, manufactured by Sumitomo Chemical Co., Ltd.), 8 mass% of modifier (ARKON P-125, manufactured by Arakawa Chemical Co., Ltd.), and 2.4 mass% of antistatic masterbatch (RIKEMASTER ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)), and the middle layer material in Example 1 was changed to polyethylene resin (NOVATEC LC600A, manufactured by Japan Polyethylene Co., Ltd.). In addition, the cover tape of Example 4 was prepared by the same method as Example 1.
將實施例1中之熱密封層材料變更為44.8質量%之乙烯-乙酸乙烯酯共聚物(EVAFLEX EV550，三井-陶氏聚合化學公司製造)、44.8質量%之低密度聚乙烯(SUMIKATHENE L705，住友化學公司製造)、8質量%之改質劑(ARKON P-125，荒川化學公司製造)、及2.4質量%之防靜電母料(RIKEMASTER ELB-347，理研維他命公司製造(含有25%防靜電劑))之混合材料，且將實施例1中之中間層材料變更為聚乙烯樹脂(NOVATEC LC600A，日本聚乙烯公司製造)，除此以外，藉由與實施例1同樣之方法，製作實施例5之覆蓋帶。The heat sealing layer material in Example 1 was changed to a mixed material of 44.8 mass% of ethylene-vinyl acetate copolymer (EVAFLEX EV550, manufactured by Mitsui-Dow Polychemicals Co., Ltd.), 44.8 mass% of low-density polyethylene (SUMIKATHENE L705, manufactured by Sumitomo Chemical Co., Ltd.), 8 mass% of modifier (ARKON P-125, manufactured by Arakawa Chemical Co., Ltd.), and 2.4 mass% of antistatic masterbatch (RIKEMASTER ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)), and the middle layer material in Example 1 was changed to polyethylene resin (NOVATEC LC600A, manufactured by Japan Polyethylene Co., Ltd.). In addition, the cover tape of Example 5 was prepared by the same method as Example 1.
將實施例1中之熱密封層材料變更為78.8質量%之乙烯-乙酸乙烯酯共聚物(EVAFLEX EV2350，三井-陶氏聚合化學公司製造)、8.8質量%之低密度聚乙烯(SUMIKATHENE L705，住友化學公司製造)、10質量%之改質劑(ARKON P-125，荒川化學公司製造)、及2.4質量%之防靜電母料(RIKEMASTER ELB-347，理研維他命公司製造(含有25%防靜電劑))之混合材料，除此以外，藉由與實施例1同樣之方法，製作實施例6之覆蓋帶。The heat sealing layer material in Example 1 was changed to a mixed material of 78.8 mass% of ethylene-vinyl acetate copolymer (EVAFLEX EV2350, manufactured by Mitsui-Dow Polymer Chemicals Co., Ltd.), 8.8 mass% of low-density polyethylene (SUMIKATHENE L705, manufactured by Sumitomo Chemical Co., Ltd.), 10 mass% of modifier (ARKON P-125, manufactured by Arakawa Chemical Co., Ltd.), and 2.4 mass% of antistatic masterbatch (RIKEMASTER ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)). In addition, the cover tape of Example 6 was prepared by the same method as Example 1.
將實施例1中之熱密封層材料變更為具有防靜電性能之乙烯-乙酸乙烯酯共聚物(MELTHENE(註冊商標)M(MX53C)，東曹公司製造)，除此以外，藉由與實施例1同樣之方法，製作比較例1之覆蓋帶。The heat sealing layer material in Example 1 was changed to ethylene-vinyl acetate copolymer (MELTHENE (registered trademark) M (MX53C), manufactured by Tosoh Corporation) with antistatic properties. In addition, the cover tape of Comparative Example 1 was prepared by the same method as Example 1.
於實施例4中之覆蓋帶未設置防靜電層，除此以外，藉由與實施例4同樣之方法，製作比較例2之覆蓋帶。The cover tape in Example 4 is not provided with an antistatic layer. In addition, the cover tape of Comparative Example 2 is manufactured by the same method as Example 4.
使用下述編帶機器，一面將500個下述電子零件連續地配置於下述紙載帶之空腔內，一面於下述條件下將紙載帶及覆蓋帶熱密封並捲取，藉此獲得滾筒狀包裝體之樣品。Using the following taping machine, 500 of the following electronic components were continuously placed in the cavities of the following paper carrier tape, and the paper carrier tape and cover tape were heat-sealed and rolled up under the following conditions to obtain a sample of a cylindrical package.
編帶機器：NST-35(日東工業公司製造)Taping machine: NST-35 (manufactured by Nitto Industry Co., Ltd.)
紙載帶：Hokuetsu Corporation公司製造，0.31mmt、8mm寬(原生紙)Paper carrier: Made by Hokuetsu Corporation, 0.31mmt, 8mm width (virgin paper)
紙載帶進給孔間距：2mmPaper carrier feed hole spacing: 2mm
覆蓋帶寬度：5.25mm寬Covering tape width: 5.25mm wide
編帶溫度：180℃Tape temperature: 180℃
編帶速度：3500產距Taping speed: 3500 production distance
編帶鉗尺寸：0.6mm×2線Taping clamp size: 0.6mm×2 wires
編帶鉗長度(1產距時之密封長度)8±1mmTape clamp length (sealing length at 1 production distance) 8±1mm
電子零件：0402尺寸之電容器Electronic parts: 0402 size capacitors
對於藉由上述製作方法獲得之滾筒狀包裝體，於設定為60℃、95%RH之恆溫恆濕試驗室中將滾筒橫放並存放24小時。其後，於設定為25℃、40%RH之恆溫恆濕試驗室中，將滾筒橫放並存放24小時，其後進行測定或評價。For the cylindrical packaging body obtained by the above-mentioned production method, the cylinder is placed horizontally in a constant temperature and humidity test room set at 60°C and 95%RH for 24 hours. Thereafter, the cylinder is placed horizontally in a constant temperature and humidity test room set at 25°C and 40%RH for 24 hours, and then measured or evaluated.
表面電阻率係使用表面電阻率計(三菱化學分析科技公司之Hiresta UP MCP-HT450)，並於下述試驗條件下進行測定。The surface resistivity was measured using a surface resistivity meter (Hiresta UP MCP-HT450 from Mitsubishi Chemical Analytical Technology Co., Ltd.) under the following test conditions.
探針：UA探針Probe: UA probe
施加電壓：未達1010Ω/□10VApplied voltage: less than 1010 Ω/□10V
1010~1012Ω/□500V1010 ~1012 Ω/□500V
1013Ω/□以上1000V1013 Ω/□ or more 1000V
測定點：樣品中央部Measuring point: center of sample
測定值：以測定點不重疊之方式測定5點，採用平均值Measurement value: Measure 5 points without overlapping measurement points, and use the average value.
1次之測定時間：採用10秒後之顯示1 measurement time: Display after 10 seconds
測定前樣品存放：於25℃、40%RH環境下存放24小時以上Sample storage before measurement: Store at 25°C, 40%RH for more than 24 hours
測定環境：25±2℃、40±5%RH環境Measurement environment: 25±2℃, 40±5%RH environment
表面黏力係使用黏著力試驗機(TAC-2，RHESCA公司製造)，並以下述測定條件及測定順序進行測定。The surface adhesion is measured using an adhesion tester (TAC-2, manufactured by RHESCA) under the following test conditions and test procedures.
加壓(壓縮)速度：30mm/minCompression speed: 30mm/min
加壓荷重：200gfPressurizing load: 200gf
加壓時間：10sPressurization time: 10s
測定(脫離)速度：30mm/minMeasuring (detachment) speed: 30mm/min
測定接觸部(探針)：圓柱直徑5mm、SUS304Measuring contact part (probe): cylindrical diameter 5mm, SUS304
溫度條件：探針溫度60℃、試樣台溫度60℃(樣品溫度60℃)Temperature conditions: Probe temperature 60℃, test bench temperature 60℃ (sample temperature 60℃)
測定前樣品存放：於25℃、40%RH環境下存放24小時以上Sample storage before measurement: Store at 25°C, 40%RH for more than 24 hours
測定環境：25±2℃、40±5%RH環境Measurement environment: 25±2℃, 40±5%RH environment
將覆蓋帶切斷為50mm×20mm，獲得樣品。使樣品之熱密封層側之面朝上，並於載玻片(76×26mm，0.8~1.0mmt)上平坦地使用3MTM耐熱聚醯亞胺帶7414，聚醯亞胺帶以不自載玻片伸出之方式貼附於樣品4角或4邊。藉由裝置自帶之金屬扣將樣品設置於測定裝置之載台上，使探針於上述測定條件下自上部與樣品接觸，並於上述測定條件下使探針自試樣脫離，此時，獲取探針所受之荷重值。Cut the covering tape into 50mm×20mm to obtain the sample. Make the heat-sealed layer of the sample face upward, and use 3MTM heat-resistant polyimide tape 7414 flat on the slide glass (76×26mm, 0.8~1.0mmt). The polyimide tape is attached to the 4 corners or 4 sides of the sample in a way that it does not extend from the slide glass. The sample is placed on the stage of the measuring device using the metal buckle provided by the device, so that the probe contacts the sample from the top under the above-mentioned measuring conditions, and the probe is separated from the sample under the above-mentioned measuring conditions. At this time, the load value of the probe is obtained.
關於熱密封強度，對於藉由上述製作方法獲得之包裝體使用密封強度測定機(Vanguard Systems之peel back tester VG-20)，並於下述測定條件下測定剝離強度(單位：gf)。Regarding heat seal strength, the packaging body obtained by the above-mentioned production method was tested using a seal strength tester (Vanguard Systems' peel back tester VG-20) and the peel strength (unit: gf) was measured under the following test conditions.
剝離速度：300mm/minPeeling speed: 300mm/min
剝離溫度：25±3℃、40±10%RHStripping temperature: 25±3℃, 40±10%RH
剝離角度：165~175°Peeling angle: 165~175°
測定值：測定150mm時之平均值Measured value: average value when measuring 150mm
測定將覆蓋帶自藉由上述製作方法獲得之包裝體剝離時之電子零件之行為異常數。具體而言，使用覆蓋帶剝離裝置(W08f Intelligent Feeder，FUJI公司製造)以100mm/秒之速度將覆蓋帶自滾筒狀包裝體剝離。剝離係於25±3℃、30±5%RH之環境下進行並於10秒鐘內完成。藉由高速相機觀察剝離時之電子零件之行為。將剝離時一半以上之晶片自載帶之空腔跳出之情形(包括電子零件貼附於覆蓋帶之情形、電子零件旋轉90度立起之情形、及電子零件自紙載帶之空腔跳出之情形)視為異常行為，一面以慢動作播放高速相機所拍攝到之影像，一面藉由目視進行觀察並統計產生異常行為之數量。The abnormal behavior of electronic components when the cover tape is peeled off from the package obtained by the above-mentioned production method is measured. Specifically, the cover tape is peeled off from the drum-shaped package at a speed of 100 mm/sec using a cover tape peeling device (W08f Intelligent Feeder, manufactured by FUJI Corporation). The peeling is performed in an environment of 25±3°C and 30±5%RH and completed within 10 seconds. The behavior of the electronic components during the peeling is observed by a high-speed camera. The situation where more than half of the chips jumped out of the cavity of the carrier tape during peeling (including the situation where the electronic components were attached to the cover tape, the situation where the electronic components were rotated 90 degrees and stood up, and the situation where the electronic components jumped out of the cavity of the paper carrier tape) was considered abnormal behavior. The images taken by the high-speed camera were played in slow motion, and the number of abnormal behaviors was observed visually and counted.
對於實施例1~6及比較例1~2之覆蓋帶，進行上述濕熱負載前(於設定為25℃、40%RH之恆溫恆濕試驗室中將滾筒橫放並存放24小時後)及上述濕熱負載後之表面電阻率、表面黏力、及熱密封強度之測定以及異常行為數之評價。再者，表面電阻率係自覆蓋帶之防靜電層側進行測得，又，表面黏力係自覆蓋帶之熱密封層側進行測得。又，根據濕熱負載前後之表面黏力之值，測定表面黏力於熱負載前後之變化率(((濕熱負載後之表面黏力/濕熱負載前之表面黏力)×100)(%))。將測定及評價之結果示於表1。For the cover tapes of Examples 1 to 6 and Comparative Examples 1 to 2, the surface resistivity, surface adhesion, and heat sealing strength were measured before the above-mentioned wet and hot load (after the drum was placed horizontally in a constant temperature and humidity test room set at 25°C and 40%RH for 24 hours) and after the above-mentioned wet and hot load, and the number of abnormal behaviors was evaluated. In addition, the surface resistivity was measured from the antistatic layer side of the cover tape, and the surface adhesion was measured from the heat sealing layer side of the cover tape. In addition, based on the surface adhesion values before and after wet heat loading, the change rate of surface adhesion before and after heat loading was measured (((surface adhesion after wet heat loading/surface adhesion before wet heat loading)×100)(%)). The results of the measurement and evaluation are shown in Table 1.
但是，比較例2之覆蓋帶表面電阻率過高，藉由上述方法無法測定出，故而使用數位超高電阻/微電流計8340、Resistivity Chamber 12704A(施加電壓：500V)進行測定。However, the surface resistivity of the cover tape in Comparative Example 2 is too high to be measured using the above method, so the digital ultra-high resistance/micro-galvanometer 8340 and the resistance chamber 12704A (applied voltage: 500V) were used for measurement.
實施例1~6之覆蓋帶之濕熱負載後之異常行為數較比較例1~2之覆蓋帶少。另一方面，比較例1之覆蓋帶由於濕熱負載後自熱密封層側測得之表面黏力超過5gf，故濕熱負載後之異常行為數較實施例1~6之覆蓋帶多。又，比較例2之覆蓋帶雖於濕熱負載後自熱密封層側測得之表面黏力為5gf以下，但於濕熱負載後自防靜電層側測得之表面電阻率超過1×1010Ω/□，故濕熱負載後之異常行為數較實施例1~6之覆蓋帶多。The number of abnormal behaviors of the cover tapes of Examples 1 to 6 after wet heat loading is less than that of the cover tapes of Comparative Examples 1 to 2. On the other hand, the number of abnormal behaviors of the cover tape of Comparative Example 1 after wet heat loading is more than that of the cover tapes of Examples 1 to 6 because the surface adhesion measured from the heat sealing layer side after wet heat loading exceeds 5 gf. In addition, although the surface adhesion of the cover tape of Comparative Example 2 measured from the heat sealing layer side after wet heat loading is less than 5 gf, the surface resistivity measured from the antistatic layer side after wet heat loading exceeds 1×1010 Ω/□, so the number of abnormal behaviors after wet heat loading is more than that of the cover tapes of Examples 1 to 6.
1:覆蓋帶1: Covering tape
2:基材層2: Base material layer
3:熱密封層3: Heat sealing layer
4:防靜電層4: Anti-static layer
Claims (3)
Translated fromChineseApplications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-047023 | 2020-03-17 | ||
| JP2020047023AJP6950773B1 (en) | 2020-03-17 | 2020-03-17 | Cover tape and packaging for electronic component packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202142460A TW202142460A (en) | 2021-11-16 |
| TWI877326Btrue TWI877326B (en) | 2025-03-21 |
Family
ID=77771597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110109523ATWI877326B (en) | 2020-03-17 | 2021-03-17 | Cover tape for packing electronic component and package |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6950773B1 (en) |
| CN (1) | CN115298109B (en) |
| MY (1) | MY207786A (en) |
| TW (1) | TWI877326B (en) |
| WO (1) | WO2021187519A1 (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1432514A (en)* | 2002-01-09 | 2003-07-30 | 住友电木株式会社 | Electonic element packing belt |
| JP2008280365A (en)* | 2007-05-08 | 2008-11-20 | Nitto Denko Corp | Laminated tape for packaging materials |
| CN103043302A (en)* | 2011-10-14 | 2013-04-17 | 电气化学工业株式会社 | Cover tape |
| TWI473751B (en)* | 2007-04-11 | 2015-02-21 | Sumitomo Bakelite Co | Electronic parts packaging |
| JP2018127256A (en)* | 2017-02-09 | 2018-08-16 | 住友ベークライト株式会社 | Cover tape and electronic component packaging |
| JP2019043032A (en)* | 2017-09-01 | 2019-03-22 | 東ソー株式会社 | Easy peelable film |
| JP2019156405A (en)* | 2018-03-07 | 2019-09-19 | 住友ベークライト株式会社 | Cover tape and electronic component package |
| CN110683208A (en)* | 2018-07-06 | 2020-01-14 | 3M创新有限公司 | Multilayer cover tape construction |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4460870B2 (en)* | 2003-10-09 | 2010-05-12 | 北越紀州製紙株式会社 | Carrier tape paper for chip electronic devices |
| CN101070420B (en)* | 2006-05-09 | 2010-05-12 | 远东新世纪股份有限公司 | Conductive polymer composition and anti-static coating and anti-static film made thereby |
| JP5456602B2 (en)* | 2010-06-29 | 2014-04-02 | 旭化成ケミカルズ株式会社 | Cover tape, cover tape manufacturing method, and electronic component package |
| CN101648622A (en)* | 2009-09-08 | 2010-02-17 | 联盟电子科技（昆山）有限公司 | Method for dissipating charges on end face of cover tape |
| CN101789294B (en)* | 2009-12-16 | 2012-03-07 | 深圳顺络电子股份有限公司 | Electronic component and manufacturing method thereof |
| JP2012214252A (en)* | 2010-09-30 | 2012-11-08 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
| JP5602067B2 (en)* | 2011-03-09 | 2014-10-08 | 三井・デュポンポリケミカル株式会社 | Sealant material, cover tape, and packaging for transporting electronic components |
| JP6085410B2 (en)* | 2011-03-09 | 2017-02-22 | 三井・デュポンポリケミカル株式会社 | Sealant material, cover tape, and packaging for transporting electronic components |
| JP6065569B2 (en)* | 2012-12-14 | 2017-01-25 | 住友ベークライト株式会社 | Cover tape for electronic component packaging and electronic component package |
| CN105377713A (en)* | 2013-07-09 | 2016-03-02 | 住友电木株式会社 | Cover tape for packaging electronic components |
| KR101756623B1 (en)* | 2014-11-12 | 2017-07-10 | 스미또모 베이크라이트 가부시키가이샤 | Cover tape for electronic part package, packaging material for electronic part package, and electronic part package |
- 2020
- 2020-03-17JPJP2020047023Apatent/JP6950773B1/ennot_activeCeased
- 2021
- 2021-03-17CNCN202180021226.8Apatent/CN115298109B/enactiveActive
- 2021-03-17TWTW110109523Apatent/TWI877326B/enactive
- 2021-03-17WOPCT/JP2021/010788patent/WO2021187519A1/ennot_activeCeased
- 2021-03-17JPJP2022508406Apatent/JP7201125B2/enactiveActive
- 2021-03-17MYMYPI2022005041Apatent/MY207786A/enunknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1432514A (en)* | 2002-01-09 | 2003-07-30 | 住友电木株式会社 | Electonic element packing belt |
| TWI473751B (en)* | 2007-04-11 | 2015-02-21 | Sumitomo Bakelite Co | Electronic parts packaging |
| JP2008280365A (en)* | 2007-05-08 | 2008-11-20 | Nitto Denko Corp | Laminated tape for packaging materials |
| CN103043302A (en)* | 2011-10-14 | 2013-04-17 | 电气化学工业株式会社 | Cover tape |
| JP2018127256A (en)* | 2017-02-09 | 2018-08-16 | 住友ベークライト株式会社 | Cover tape and electronic component packaging |
| JP2019043032A (en)* | 2017-09-01 | 2019-03-22 | 東ソー株式会社 | Easy peelable film |
| JP2019156405A (en)* | 2018-03-07 | 2019-09-19 | 住友ベークライト株式会社 | Cover tape and electronic component package |
| CN110683208A (en)* | 2018-07-06 | 2020-01-14 | 3M创新有限公司 | Multilayer cover tape construction |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021176758A (en) | 2021-11-11 |
| JP7201125B2 (en) | 2023-01-10 |
| CN115298109B (en) | 2024-02-06 |
| TW202142460A (en) | 2021-11-16 |
| JPWO2021187519A1 (en) | 2021-09-23 |
| CN115298109A (en) | 2022-11-04 |
| JP6950773B1 (en) | 2021-10-13 |
| MY207786A (en) | 2025-03-19 |
| WO2021187519A1 (en) | 2021-09-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103459146B (en) | cover film | |
| US10099454B2 (en) | Cover tape for packaging electronic part | |
| TWI778161B (en) | cover film | |
| JP2016182989A (en) | Electronic component packaging cover tape, electronic component packaging material and electronic component packaging body | |
| JP7197052B2 (en) | Electronic component packaging cover tape and package | |
| TWI877326B (en) | Cover tape for packing electronic component and package | |
| TWI805842B (en) | Covering tape for packing elecronic component and package | |
| CN113646242B (en) | Cover tape for packaging electronic components and package | |
| JP4334858B2 (en) | Cover tape for taping packaging of electronic parts | |
| JP2021178470A (en) | Cover tape and packaging for electronic component packaging | |
| JP2023038475A (en) | Electronic component packaging cover tape and package | |
| KR100397022B1 (en) | Cover tape for packaging electronic components | |
| JP2022180578A (en) | Electronic component packaging cover tape and electronic component package | |
| JP2022183740A (en) | Electronic component packaging cover tape and package | |
| KR100571538B1 (en) | Cover tape for packaging electronic components and manufacturing method thereof | |
| JP2021138412A (en) | Cover tape for electronic component packaging and electronic component packaging |