本發明涉及一種探針卡裝置，特別是涉及一種適於高頻探測的探針卡裝置。The present invention relates to a probe card device, in particular to a probe card device suitable for high-frequency detection.
隨著科技進步，各類電子產品相繼問世。電子產品所使用的晶片扮演相當重要的角色。因此需要探針卡裝置檢測晶片上電子元件之間的電性連接是否正確，藉由訊號傳輸以及電性訊號分析，確認晶片上電子元件之間的電路是否有瑕疵。With the advancement of technology, various electronic products have been launched one after another. The chips used in electronic products play a very important role. Therefore, probe card devices are needed to detect whether the electrical connection between the electronic components on the chip is correct. Through signal transmission and electrical signal analysis, it is possible to confirm whether the circuit between the electronic components on the chip is defective.
探針卡裝置包括複數個可移動的探針，探針通常為特定金屬或合金且具有良好電性及機械性質。探針以接觸的方式電性連接待測物(上述晶片)。一般而言，垂直式探針卡因探針長度的關係，其電感值較高，因此不利於高頻訊號的探測，所述的高頻訊號為傳遞頻率高於14GHz的訊號。此外，一般的高頻訊號的探測方式，是由測試機提供高頻訊號，經由探針卡裝置包括探針傳送到待測物，再由待測物傳送結果訊號，經由探針卡到測試機進行分析。對於高頻測試來說，測試機到待測物之間的路徑，需要藉由阻抗匹配來達到高頻測試。但探針卡的電路板和探針本身較難進行阻抗匹配，使測試機提供高頻訊號會有反射而造成能量損失而導致訊號失真。The probe card device includes a plurality of movable probes, which are usually made of specific metals or alloys and have good electrical and mechanical properties. The probes are electrically connected to the object to be tested (the above-mentioned chip) by contact. Generally speaking, the vertical probe card has a higher inductance value due to the length of the probe, so it is not conducive to the detection of high-frequency signals, and the high-frequency signals are signals with a transmission frequency higher than 14GHz. In addition, the general high-frequency signal detection method is that the test machine provides a high-frequency signal, which is transmitted to the object to be tested through the probe card device including the probe, and then the object to be tested transmits the result signal, which is analyzed by the probe card to the test machine. For high-frequency testing, the path between the test machine and the object to be tested needs to be impedance matched to achieve high-frequency testing. However, it is difficult to match the impedance of the probe card's circuit board and the probe itself, causing reflections in the high-frequency signal provided by the tester, resulting in energy loss and signal distortion.
在上述的垂直式探針卡中，由於探針長度長，無法符合高頻電子產品測試的需求，因此有必要改良探針的結構以及長度。此外，改良探針的長度可能會增加探針的剛性，例如增加探針與待測物之間的接觸力，可能造成待測物的損傷，嚴重者也可能造成探針本身的破壞，因而失去探測功能。因此，如何設計出適於高頻測試的探針卡裝置，其探針具有良好的電性及機械性能，並於探測過程不損壞待測物，乃是本發明所致力於解決的課題。此外，測試機提供高頻訊號經由探針卡到待測物時，探針卡阻抗不匹配而導致的訊號失真，同時也是前述高頻測試需要解決的課題。In the above-mentioned vertical probe card, due to the long length of the probe, it cannot meet the requirements of high-frequency electronic product testing, so it is necessary to improve the structure and length of the probe. In addition, improving the length of the probe may increase the rigidity of the probe, such as increasing the contact force between the probe and the object to be tested, which may cause damage to the object to be tested. In severe cases, it may also cause damage to the probe itself, thereby losing the detection function. Therefore, how to design a probe card device suitable for high-frequency testing, whose probe has good electrical and mechanical properties and does not damage the object to be tested during the detection process, is the problem that the present invention is committed to solving. In addition, when the test machine provides a high-frequency signal through the probe card to the object to be tested, the signal distortion caused by the impedance mismatch of the probe card is also a problem that needs to be solved in the aforementioned high-frequency test.
為了解決上述的問題，本發明所採用的其中一技術方案是提供一種探針卡裝置，適用於高頻探測，探針卡裝置包括支撐板及探測頭。探測頭位於支撐板下方，探測頭包括上導板、第一下導板、第二下導板、第三下導板、多個高頻探測元件及可撓性薄膜。第一下導板位於上導板下方，上導板具有具有多個上孔道，第一下導板具有多個第一下孔道。第二下導板位於第一下導板的下方，第二下導板具有多個第二下孔道，多個第二下孔道分別對應於多個第一下孔道。第三下導板位於第二下導板下方，第三下導板具有多個第三下孔道，多個第三下孔道分別連通且對應於多個第二下孔道。每一高頻探測元件包括彈性針及探測針，彈性針一端連接支撐板，彈性針穿過上孔道及第一下孔道，彈性針部分容置在上導板和第一下導板之間，探測針穿過第二下孔道及第三下孔道且延伸至第三下孔道外。可撓性薄膜位於第二下導板面向第一下導板的表面上，可撓性薄膜包括金屬線路層以及覆蓋金屬線路層的絕緣層。其中，彈性針自第一下孔道延伸以抵接於可撓性薄膜。探測針的頂端抵持並電性連接於金屬線路層，多個探測針之中的至少兩個分別定義為第一探測針及第二探測針。其中，金屬線路層區分成電性連接於第一探測針的第一內埋部、電性連接於第二探測針的第二內埋部及連接於第一內埋部與第二內埋部之間的外露部，第一內埋部與第二內埋部都位於第一下導板及第二下導板之間，外露部位於第一下導板及第二下導板的外部，一個或多個電子元件電性連接於外露部。其中，第一探測針、第一內埋部、外露部、第二內埋部以及第二探測針形成一回授電路，回授電路用於在探測針接觸一待測物以進行檢測時，第一探測針從待測物所接收的一探測訊號經由回授電路傳回至所述待測物，以形成一回授電路測試（loopback test）。其中，彈性針長度大於探測針長度，彈性針及探測針電性絕緣。彈性針用於提供探測待測物時產生一彈力，以及用於在探測後提供回復彈力。In order to solve the above-mentioned problems, one of the technical solutions adopted by the present invention is to provide a probe card device suitable for high-frequency detection, and the probe card device includes a support plate and a probe head. The probe head is located below the support plate, and the probe head includes an upper guide plate, a first lower guide plate, a second lower guide plate, a third lower guide plate, a plurality of high-frequency detection elements and a flexible film. The first lower guide plate is located below the upper guide plate, the upper guide plate has a plurality of upper channels, and the first lower guide plate has a plurality of first lower channels. The second lower guide plate is located below the first lower guide plate, the second lower guide plate has a plurality of second lower channels, and the plurality of second lower channels correspond to the plurality of first lower channels respectively. The third lower guide plate is located below the second lower guide plate, the third lower guide plate has a plurality of third lower channels, and the plurality of third lower channels are connected and correspond to the plurality of second lower channels respectively. Each high-frequency detection element includes an elastic needle and a probe needle. One end of the elastic needle is connected to the support plate. The elastic needle passes through the upper hole and the first lower hole. The elastic needle is partially accommodated between the upper guide plate and the first lower guide plate. The probe needle passes through the second lower hole and the third lower hole and extends to the outside of the third lower hole. The flexible film is located on the surface of the second lower guide plate facing the first lower guide plate. The flexible film includes a metal circuit layer and an insulating layer covering the metal circuit layer. The elastic needle extends from the first lower hole to abut against the flexible film. The top end of the probe needle abuts and is electrically connected to the metal circuit layer. At least two of the multiple probe needles are defined as the first probe needle and the second probe needle. The metal circuit layer is divided into a first embedded part electrically connected to the first probe needle, a second embedded part electrically connected to the second probe needle, and an exposed part connected between the first embedded part and the second embedded part. The first embedded part and the second embedded part are both located between the first lower guide plate and the second lower guide plate, and the exposed part is located outside the first lower guide plate and the second lower guide plate. One or more electronic components are electrically connected to the exposed part. The first probe needle, the first embedded part, the exposed part, the second embedded part, and the second probe needle form a feedback circuit. The feedback circuit is used for transmitting a detection signal received by the first probe needle from the object to be tested to the object to be tested through the feedback circuit when the probe needle contacts the object to be tested for detection, so as to form a feedback circuit test (loopback test). The length of the elastic needle is greater than that of the detection needle, and the elastic needle and the detection needle are electrically insulated. The elastic needle is used to provide an elastic force when detecting the object to be detected, and is used to provide a restoring elastic force after the detection.
在本發明的其中一技術方案所提供的一種探針卡裝置中，彈性針長度大於探測針長度，彈性針及探測針電性絕緣，彈性針的彈力可避免損壞待測物，探測針適於探測高頻電子產品。藉由金屬線路層的設置，探測訊號由待測物發出，第一探測針接收後再經由第一內埋部、外露部、第二內埋部及第二探測針傳回至待測物，完成回授電路測試。有別於先前之探針卡，以測試機提供高頻訊號經由探針卡到待測物的測試方式，探針卡的電路板電性連接測試機，電路板可能有阻抗不匹配而導致高頻訊號失真。本發明則透過探測針及待測物即完成回授電路測試，相較於測試機提供高頻訊號的測試方式，本發明的回授電路傳輸路徑短，回授電路需要的電路佈局(佈線)空間相對來說也短，阻抗匹配易達成。本發明所提供的探針卡裝置可完成待測物的高頻電性測試。In a probe card device provided by one of the technical solutions of the present invention, the length of the elastic needle is greater than the length of the probe needle, the elastic needle and the probe needle are electrically insulated, the elastic force of the elastic needle can avoid damaging the object to be tested, and the probe needle is suitable for detecting high-frequency electronic products. Through the setting of the metal circuit layer, the detection signal is sent by the object to be tested, and the first probe needle receives it and then transmits it back to the object to be tested through the first embedded part, the exposed part, the second embedded part and the second probe needle to complete the feedback circuit test. Different from the previous probe card test method in which the test machine provides a high-frequency signal through the probe card to the object to be tested, the circuit board of the probe card is electrically connected to the test machine, and the circuit board may have impedance mismatch, resulting in high-frequency signal distortion. The present invention completes the feedback circuit test through the probe and the object to be tested. Compared with the test method in which the tester provides a high-frequency signal, the feedback circuit transmission path of the present invention is short, the circuit layout (wiring) space required for the feedback circuit is relatively short, and impedance matching is easy to achieve. The probe card device provided by the present invention can complete the high-frequency electrical test of the object to be tested.
在本發明的其中一技術方案所提供的一種探針卡裝置中，在待測物上移接觸探測針時，探測針被待測物推移至探測位置，彈性針提供的彈力為探測針與待測物之間的接觸力，使探測針與待測物有良好的接觸。在探測針與待測物分離時，彈性針提供探測針彈性回復力，透過可撓性薄膜推移探測針至初始的位置，如此探針卡裝置可再接續探測其他待測物。由於在彈性針與探測針之間設有絕緣層，如此彈性針與探測針之間絕緣，因此彈性針不會接收到探測針所傳送的探測訊號。換言之，彈性針提供探測針在探測時的接觸力以及探測後的回復彈力，探測訊號不會傳送至彈性針，而是經由訊號輸出端子（第一探測針）、第一內埋部、外露部、第二內埋部及訊號接收端子（第二探測針）傳回至待測物。In a probe card device provided by one of the technical solutions of the present invention, when the object to be tested moves up to contact the probe needle, the probe needle is pushed to the detection position by the object to be tested, and the elastic force provided by the elastic needle is the contact force between the probe needle and the object to be tested, so that the probe needle and the object to be tested have good contact. When the probe needle is separated from the object to be tested, the elastic needle provides an elastic restoring force for the probe needle, and pushes the probe needle to the initial position through the flexible film, so that the probe card device can continue to detect other objects to be tested. Since an insulating layer is provided between the elastic needle and the probe needle, the elastic needle and the probe needle are insulated, so the elastic needle will not receive the detection signal transmitted by the probe needle. In other words, the elastic needle provides the probe needle with contact force during detection and recovery elastic force after detection. The detection signal is not transmitted to the elastic needle, but is transmitted back to the object to be detected through the signal output terminal (first probe needle), the first embedded part, the exposed part, the second embedded part and the signal receiving terminal (second probe needle).
在本發明的其中一技術方案所提供的一種探針卡裝置中，在探測訊號於回授線電路傳遞時，依照晶片測試的需求，於回授電路中加上一個或多個電子元件，所述電子元件可為電阻、電容、衰減器或是其組合。In a probe card device provided by one of the technical solutions of the present invention, when the detection signal is transmitted in the feedback line circuit, one or more electronic components are added to the feedback circuit according to the requirements of chip testing. The electronic components can be resistors, capacitors, attenuators or a combination thereof.
為了解決上述的問題，本發明所採用的另外一技術方案是提供一種探針卡裝置，適用於高頻探測，探針卡裝置支撐板及探測頭。探測頭包括上導板、第一下導板、第二下導板、第三下導板、多個高頻探測元件以及可撓性薄膜。第一下導板位於上導板下方，上導板具有多個上孔道，第一下導板具有多個第一下孔道。第二下導板位於第一下導板的下方，第二下導板具有多個第二下孔道，多個第二下孔道分別對應於多個第一下孔道。第三下導板位於第二下導板下方，第三下導板具有多個第三下孔道，多個第三下孔道分別連通且對應於多個第二下孔道。每一高頻探測元件包括彈性針及探測針，彈性針一端連接支撐板，彈性針穿過上孔道及第一下孔道，彈性針部分容置在上導板和第一下導板之間，探測針穿過第二下孔道及第三下孔道且延伸至第三下孔道外。可撓性薄膜位於第二下導板面向第一下導板的表面上，可撓性薄膜包括金屬線路層以及覆蓋金屬線路層的絕緣層。其中，彈性針自第一下孔道延伸以抵接於可撓性薄膜。探測針的頂端抵持並電性連接於金屬線路層，多個探測針之中的至少兩個分別定義為第一探測針及第二探測針。其中，金屬線路層包括內埋部，內埋部的兩端分別電性連接於第一探測針及第二探測針。其中，第一探測針、內埋部以及第二探測針形成一回授電路，回授電路用於在探測針接觸一待測物以進行檢測時，第一探測針從待測物所接收的一探測訊號經由回授電路傳回至待測物，以形成一回授電路測試。其中，彈性針長度大於探測針長度，彈性針及探測針電性絕緣。彈性針用於提供探測待測物時產生一彈力，以及用於在探測後提供回復彈力。In order to solve the above-mentioned problems, another technical solution adopted by the present invention is to provide a probe card device suitable for high-frequency detection, a probe card device support plate and a probe head. The probe head includes an upper guide plate, a first lower guide plate, a second lower guide plate, a third lower guide plate, a plurality of high-frequency detection elements and a flexible film. The first lower guide plate is located below the upper guide plate, the upper guide plate has a plurality of upper channels, and the first lower guide plate has a plurality of first lower channels. The second lower guide plate is located below the first lower guide plate, the second lower guide plate has a plurality of second lower channels, and the plurality of second lower channels correspond to the plurality of first lower channels respectively. The third lower guide plate is located below the second lower guide plate, the third lower guide plate has a plurality of third lower channels, and the plurality of third lower channels are connected and correspond to the plurality of second lower channels respectively. Each high-frequency detection element includes an elastic needle and a probe needle. One end of the elastic needle is connected to the support plate. The elastic needle passes through the upper hole and the first lower hole. The elastic needle is partially accommodated between the upper guide plate and the first lower guide plate. The probe needle passes through the second lower hole and the third lower hole and extends to the outside of the third lower hole. The flexible film is located on the surface of the second lower guide plate facing the first lower guide plate. The flexible film includes a metal circuit layer and an insulating layer covering the metal circuit layer. The elastic needle extends from the first lower hole to abut against the flexible film. The top end of the probe needle abuts and is electrically connected to the metal circuit layer. At least two of the multiple probe needles are defined as the first probe needle and the second probe needle. The metal circuit layer includes an embedded portion, and two ends of the embedded portion are electrically connected to the first probe needle and the second probe needle respectively. The first probe needle, the embedded portion and the second probe needle form a feedback circuit. When the probe needle contacts an object to be tested for detection, a detection signal received by the first probe needle from the object to be tested is transmitted back to the object to be tested via the feedback circuit to form a feedback circuit test. The length of the elastic needle is greater than that of the probe needle, and the elastic needle and the probe needle are electrically insulated. The elastic needle is used to generate an elastic force when detecting the object to be tested, and to provide a recovery elastic force after detection.
在本發明的其中一技術方案所提供的一種探針卡裝置中，探測針適於探測高頻電子產品。藉由金屬線路層的設置，探測訊號由待測物發出，經由內埋部及第二探測針傳回至待測物，完成回授電路的測試。有別於先前之探針卡，其回授電路係延伸至電路板（例如前述的支撐板），本發明則透過探測針及待測物即完成回授電路的測試，本發明所提供的探針卡裝置可完成待測物的高頻電性測試。In a probe card device provided by one of the technical solutions of the present invention, the probe needle is suitable for probing high-frequency electronic products. Through the setting of the metal circuit layer, the detection signal is sent out by the object to be tested, and is transmitted back to the object to be tested through the embedded part and the second probe needle, completing the test of the feedback circuit. Different from the previous probe card, whose feedback circuit extends to the circuit board (such as the aforementioned support board), the present invention completes the test of the feedback circuit through the probe needle and the object to be tested. The probe card device provided by the present invention can complete the high-frequency electrical test of the object to be tested.
相較於配合回授電路及彈性針、探測針的結構，本發明提出在彈性針、探測針的交界處使用可撓性薄膜使彈性針與探測針之間的電性絕緣，探測針長度小於彈性針長度，使探測針可以達到高頻測試的電性需求，彈性針提供良好機械性能，避免損壞待測物。此外，可撓性薄膜提供一部分回授電路與探測針電性連接，由待測物提供高頻訊號，比測試機提供高頻訊號的測試方式，訊號傳輸路徑短，容易實現高頻測試。此外，探測針包括針尾部及探測部，針尾部的截面積大於探測部的截面積，針尾部的截面積大於第三下導孔，使得針尾部可以固持在第一及第二下導板，探測針不會由第三下導孔掉出，且針尾部可以穩定設置在對應可撓性薄膜及彈性針的相對位置。Compared with the structure of the feedback circuit, the flexible needle and the probe needle, the present invention proposes to use a flexible film at the junction of the flexible needle and the probe needle to electrically insulate the flexible needle and the probe needle. The length of the probe needle is shorter than that of the flexible needle, so that the probe needle can meet the electrical requirements of high-frequency testing. The flexible needle provides good mechanical properties to avoid damage to the object under test. In addition, the flexible film provides a part of the feedback circuit to be electrically connected to the probe needle, and the high-frequency signal is provided by the object under test. Compared with the test method in which the tester provides the high-frequency signal, the signal transmission path is shorter and high-frequency testing is easy to achieve. In addition, the detection needle includes a needle tail and a detection part. The cross-sectional area of the needle tail is larger than the cross-sectional area of the detection part. The cross-sectional area of the needle tail is larger than the third lower guide hole, so that the needle tail can be fixed on the first and second lower guide plates, the detection needle will not fall out of the third lower guide hole, and the needle tail can be stably set at a relative position corresponding to the flexible film and the elastic needle.
在本發明的其中一技術方案所提供的一種探針卡裝置中，在待測物上移接觸探測針時，探測針被待測物推移至探測位置，彈性針提供的彈力為探測針與待測物之間的接觸力，使探測針與待測物有良好的接觸。在探測針與待測物分離時，彈性針提供探測針彈性回復力，透過可撓性薄膜推移探測針至初始的位置，如此探針卡裝置可再接續探測其他待測物。由於在彈性針與探測針之間設有絕緣層，如此彈性針與探測針之間絕緣，因此彈性針不會接收到探測針所傳送的探測訊號。換言之，彈性針提供探測針在探測時的接觸力以及探測後的回復彈力，探測訊號不會傳送至彈性針，而是經由訊號輸出端子（第一探測針）、內埋部及訊號接收端子（第二探測針）傳回至待測物。In a probe card device provided by one of the technical solutions of the present invention, when the object to be tested moves up to contact the probe needle, the probe needle is pushed to the detection position by the object to be tested, and the elastic force provided by the elastic needle is the contact force between the probe needle and the object to be tested, so that the probe needle and the object to be tested have good contact. When the probe needle is separated from the object to be tested, the elastic needle provides an elastic restoring force for the probe needle, and pushes the probe needle to the initial position through the flexible film, so that the probe card device can continue to detect other objects to be tested. Since an insulating layer is provided between the elastic needle and the probe needle, the elastic needle and the probe needle are insulated, so the elastic needle will not receive the detection signal transmitted by the probe needle. In other words, the elastic needle provides the probe with contact force during detection and the recovery force after detection. The detection signal is not transmitted to the elastic needle, but is transmitted back to the object to be detected through the signal output terminal (first probe needle), the embedded part and the signal receiving terminal (second probe needle).
為了解決上述的問題，本發明所採用的另外一技術方案是提供一種探針卡裝置，適用於高頻探測，探針卡裝置包括支撐板及探測頭。探測頭位於支撐板下方，包括上導板、第一下導板、第二下導板、第三下導板、多個高頻探測元件及金屬線路層。第一下導板位於上導板下方，上導板具有多個上孔道，第一下導板具有多個第一下孔道。第二下導板位於第一下導板的下方，第二下導板具有多個第二下孔道，多個第二下孔道分別連通且對應於多個第一下孔道。第三下導板位於第二下導板下方，第三下導板具有多個第三下孔道，多個第三下孔道分別連通且對應於多個第二下孔道。每一高頻探測元件包括彈性針、絕緣結構及探測針。彈性針包括針體及位於針體表面的絕緣膜，彈性針一端連接支撐板，彈性針穿過上孔道及第一下孔道且延伸至第二下孔道，彈性針部分容置在上導板和第一下導板之間。絕緣結構位於彈性針下方及位於探測針的上方。探測針包括針尾部及探測部，針尾部的截面積大於探測部的截面積，針尾部位於第二下孔道內，針尾部的頂端抵持絕緣結構，探測部一端連接於針尾部，另一端延伸至第三下孔道外。多個探測針之中的至少兩個分別定義為第一探測針及第二探測針。金屬線路層包括多個孔壁金屬層及多個導板金屬線路層。孔壁金屬層位於第二下孔道的壁面上，或是第三下孔道的壁面上。電性連接於第一探測針的孔壁金屬層定義第一孔壁金屬層，電性連接於第二探測針的孔壁金屬層定義第二孔壁金屬層，導板金屬線路層分別連接第一孔壁金屬層及第二孔壁金屬層。其中，彈性針、絕緣結構及針尾部可上下移動於第二下孔道內。其中，其中，第一探測針、第一孔壁金屬層、導板金屬線路層、第二孔壁金屬層以及第二探測針形成一回授電路，回授電路用於在探測針接觸一待測物以進行檢測時，第一探測針從待測物所接收的一探測訊號經由回授電路傳回至待測物，以形成一回授電路測試。其中，彈性針長度大於探測針長度，彈性針及探測針電性絕緣。彈性針用於提供探測待測物時產生一彈力，以及用於在探測後提供回復彈力。In order to solve the above-mentioned problems, another technical solution adopted by the present invention is to provide a probe card device suitable for high-frequency detection, and the probe card device includes a support plate and a probe head. The probe head is located below the support plate, and includes an upper guide plate, a first lower guide plate, a second lower guide plate, a third lower guide plate, a plurality of high-frequency detection elements and a metal circuit layer. The first lower guide plate is located below the upper guide plate, the upper guide plate has a plurality of upper channels, and the first lower guide plate has a plurality of first lower channels. The second lower guide plate is located below the first lower guide plate, the second lower guide plate has a plurality of second lower channels, and the plurality of second lower channels are connected and correspond to the plurality of first lower channels. The third lower guide plate is located below the second lower guide plate, the third lower guide plate has a plurality of third lower channels, and the plurality of third lower channels are connected and correspond to the plurality of second lower channels. Each high-frequency detection element includes an elastic needle, an insulating structure and a detection needle. The elastic needle includes a needle body and an insulating film located on the surface of the needle body. One end of the elastic needle is connected to the support plate. The elastic needle passes through the upper channel and the first lower channel and extends to the second lower channel. The elastic needle is partially accommodated between the upper guide plate and the first lower guide plate. The insulating structure is located below the elastic needle and above the detection needle. The detection needle includes a needle tail and a detection part. The cross-sectional area of the needle tail is larger than the cross-sectional area of the detection part. The needle tail is located in the second lower channel. The top end of the needle tail abuts the insulating structure. One end of the detection part is connected to the needle tail, and the other end extends to the outside of the third lower channel. At least two of the multiple detection needles are defined as a first detection needle and a second detection needle. The metal circuit layer includes a plurality of hole wall metal layers and a plurality of guide plate metal circuit layers. The hole wall metal layer is located on the wall surface of the second lower hole channel or the wall surface of the third lower hole channel. The hole wall metal layer electrically connected to the first probe needle defines the first hole wall metal layer, and the hole wall metal layer electrically connected to the second probe needle defines the second hole wall metal layer. The guide plate metal circuit layer is connected to the first hole wall metal layer and the second hole wall metal layer respectively. Among them, the elastic needle, the insulating structure and the needle tail can move up and down in the second lower hole channel. The first probe needle, the first hole wall metal layer, the guide plate metal circuit layer, the second hole wall metal layer and the second probe needle form a feedback circuit. When the probe needle contacts a test object for detection, the first probe needle transmits a detection signal received from the test object back to the test object through the feedback circuit to form a feedback circuit test. The length of the elastic needle is greater than the length of the probe needle, and the elastic needle and the probe needle are electrically insulated. The elastic needle is used to generate an elastic force when detecting the test object, and to provide a restoring elastic force after detection.
在本發明的其中一技術方案所提供的一種探針卡裝置中，探測針適於探測高頻電子產品。藉由設置孔壁金屬層及導板金屬線路層，以及探測針電性接觸孔壁金屬層，探測訊號由待測物發出，經由第一探測針、第一孔壁金屬層、表面金屬線路層、第二孔壁金屬層及第二探測針傳回至待測物，完成回授電路的測試。有別於先前之探測卡，以測試機提供高頻訊號經由探針卡到待測物的測試方式，探針卡的電路板電性連接測試機，電路板可能有阻抗不匹配而導致高頻訊號失真。本發明則透過探測針及待測物即完成回授電路測試，相較於測試機提供高頻訊號的測試方式，本發明的回授電路傳輸路徑短，回授電路需要的電路佈局(佈線)空間相對來說也短，阻抗匹配易達成。本發明所提供的探針卡裝置可完成待測物的高頻電性測試。In a probe card device provided by one of the technical solutions of the present invention, the probe needle is suitable for detecting high-frequency electronic products. By setting a hole wall metal layer and a guide plate metal circuit layer, and the probe needle electrically contacts the hole wall metal layer, the detection signal is sent from the object to be tested, and is transmitted back to the object to be tested through the first probe needle, the first hole wall metal layer, the surface metal circuit layer, the second hole wall metal layer and the second probe needle, completing the test of the feedback circuit. Different from the previous probe card test method in which the test machine provides a high-frequency signal to the object to be tested through the probe card, the circuit board of the probe card is electrically connected to the test machine, and the circuit board may have impedance mismatch, resulting in high-frequency signal distortion. The present invention completes the feedback circuit test through the probe and the object to be tested. Compared with the test method in which the tester provides a high-frequency signal, the feedback circuit transmission path of the present invention is short, the circuit layout (wiring) space required for the feedback circuit is relatively short, and impedance matching is easy to achieve. The probe card device provided by the present invention can complete the high-frequency electrical test of the object to be tested.
本發明使用彈性針、絕緣結構、探測針的技術方案中，本發明提出在彈性針、探測針交界處使用絕緣結構進行彈性針、探測針的電性絕緣，探測針長度小於彈性針長度，使探測針可以達到高頻測試的電性需求，彈性針提供良好機械性能，避免損壞待測物。此外，探針卡在探測針接觸到第三下導板或者第二下導板或者第二和第三下導板之間的孔壁金屬層、表面金屬線路層形成回授電路與探測針電性連接，由待測物提供高頻訊號，比測試機提供高頻訊號的測試方式，訊號傳輸路徑短，容易實現高頻測試。此外，探測針包括針尾部及探測部，針尾部的截面積大於探測部的截面積，針尾部的截面積大於第三下導孔，使得針尾部可以固持在第二下導板，探測針不會由第三下導孔掉出，且針尾部可以穩定設置在對應彈性針的相對位置。In the technical solution of using a flexible needle, an insulating structure, and a probe needle, the present invention proposes to use an insulating structure at the junction of the flexible needle and the probe needle to electrically insulate the flexible needle and the probe needle. The length of the probe needle is shorter than that of the flexible needle, so that the probe needle can meet the electrical requirements of high-frequency testing. The flexible needle provides good mechanical properties to avoid damage to the object to be tested. In addition, the probe needle is stuck in the hole wall metal layer and the surface metal circuit layer where the probe needle contacts the third lower guide plate or the second lower guide plate or between the second and third lower guide plates to form a feedback circuit and electrically connect with the probe needle. The object to be tested provides a high-frequency signal. Compared with the test method in which the tester provides a high-frequency signal, the signal transmission path is shorter and high-frequency testing is easy to achieve. In addition, the detection needle includes a needle tail portion and a detection portion, the cross-sectional area of the needle tail portion is larger than the cross-sectional area of the detection portion, and the cross-sectional area of the needle tail portion is larger than the third lower guide hole, so that the needle tail portion can be fixed on the second lower guide plate, the detection needle will not fall out of the third lower guide hole, and the needle tail portion can be stably set at a relative position corresponding to the elastic needle.
本發明使用彈性針、絕緣結構、探測針的技術方案中（後稱絕緣結構的技術方案），探針卡使用到的回授電路在於探測針接觸到第三下導板或者第二下導板或者第二和第三下導板之間的孔壁金屬層、表面金屬線路層進行。相較於本發明使用可撓性薄膜的探針卡（後稱可撓性薄膜的技術方案），探針卡使用到的回授電路則是探測針接觸設置在第一和第二下導板之間可撓性薄膜的金屬線路層。絕緣結構的技術方案中，探針卡的回授電路較為靠近待測物，進一步來說，回授電路路徑較短，因此可以進行更高頻的電性測試。進一步來說，可撓性薄膜的技術方案中，可撓性薄膜需要開設有溝槽來避免可撓性薄膜同時作動，造成可撓性薄膜上的回授電路的電路佈局（佈線）要繞開溝槽，可能會造成電路佈局（佈線）長度的增加，對於高頻的電性測試較為不利，絕緣結構的技術方案中，回授電路是設置在第三下導板、第二下導板兩者至少其中之一，不需要有增加電路佈局（佈線）長度的問題，相較於可撓性薄膜的技術方案，絕緣結構的技術方案的回授電路，電路佈局（佈線）長度是較短的，因此可以進行更高頻的電性測試。在本發明的其中一技術方案所提供的一種探針卡裝置中，在待測物上移接觸探測針時，探測針被待測物推移至探測位置，彈性針提供的彈力為探測針與待測物之間的接觸力，使探測針與待測物有良好的接觸。在探測針與待測物分離時，彈性針提供探測針彈性回復力，透過絕緣結構推移探測針至初始的位置，如此探針卡裝置可再接續探測其他待測物。由於在彈性針與探測針之間設有絕緣結構，如此彈性針與探測針之間絕緣，因此彈性針不會接收到探測針所傳送的探測訊號。此外，彈性針還具有位在針體表面的絕緣膜，可避免彈性針在受力彎曲時接觸第二下孔道內的孔壁金屬層而產生導電的風險。依據此實施例，彈性針提供探測針在探測時的接觸力以及探測後的回復彈力，探測訊號並不會傳送至彈性針，而是經由訊號輸出端子（第一探測針）、第一孔壁金屬層、導板金屬線路層、第二孔壁金屬層及訊號接收端子（第二探測針）傳回至待測物，完成回授電路測試。In the technical solution of the present invention using a flexible needle, an insulating structure, and a probe needle (hereinafter referred to as the technical solution of the insulating structure), the feedback circuit used by the probe card is that the probe needle contacts the third lower guide plate or the second lower guide plate or the hole wall metal layer and the surface metal circuit layer between the second and third lower guide plates. Compared with the probe card of the present invention using a flexible film (hereinafter referred to as the technical solution of the flexible film), the feedback circuit used by the probe card is that the probe needle contacts the metal circuit layer of the flexible film arranged between the first and second lower guide plates. In the technical solution of the insulating structure, the feedback circuit of the probe card is closer to the object to be tested. Furthermore, the feedback circuit path is shorter, so higher frequency electrical tests can be performed. Furthermore, in the technical solution of the flexible film, the flexible film needs to be provided with grooves to prevent the flexible film from being actuated simultaneously, which causes the circuit layout (wiring) of the feedback circuit on the flexible film to bypass the groove, which may increase the length of the circuit layout (wiring), which is disadvantageous for high-frequency electrical testing. In the technical solution of the insulating structure, the feedback circuit is arranged on at least one of the third lower guide plate and the second lower guide plate, and there is no need to increase the length of the circuit layout (wiring). Compared with the technical solution of the flexible film, the circuit layout (wiring) length of the feedback circuit of the technical solution of the insulating structure is shorter, so higher frequency electrical testing can be performed. In a probe card device provided by one of the technical solutions of the present invention, when the object to be tested moves up to contact the probe needle, the probe needle is pushed to the detection position by the object to be tested, and the elastic force provided by the elastic needle is the contact force between the probe needle and the object to be tested, so that the probe needle and the object to be tested have good contact. When the probe needle is separated from the object to be tested, the elastic needle provides an elastic restoring force for the probe needle, and pushes the probe needle to the initial position through the insulating structure, so that the probe card device can continue to detect other objects to be tested. Since an insulating structure is provided between the elastic needle and the probe needle, the elastic needle and the probe needle are insulated, so the elastic needle will not receive the detection signal transmitted by the probe needle. In addition, the elastic needle also has an insulating film located on the needle body surface, which can prevent the elastic needle from contacting the hole wall metal layer in the second lower hole when bending under force and generating the risk of conduction. According to this embodiment, the elastic needle provides the probe needle with contact force during detection and recovery elastic force after detection. The detection signal is not transmitted to the elastic needle, but is transmitted back to the object to be tested through the signal output terminal (first probe needle), the first hole wall metal layer, the guide plate metal circuit layer, the second hole wall metal layer and the signal receiving terminal (second probe needle) to complete the feedback circuit test.
在上述其中一可行的實施例中，探測頭還包括多個非高頻探測元件，非高頻探測元件穿過第一下孔道、第二下孔道及第三下孔道並與探測針平齊。其中，非高頻探測元件為一體式探針，未區分彈性針及探測針。藉此，本發明之高頻探測元件可與非高頻探測元件一起使用。In one of the feasible embodiments described above, the probe head further includes a plurality of non-high-frequency detection elements, which pass through the first lower hole, the second lower hole, and the third lower hole and are aligned with the detection needle. The non-high-frequency detection element is an integrated probe needle, and the elastic needle and the detection needle are not distinguished. Thus, the high-frequency detection element of the present invention can be used together with the non-high-frequency detection element.
在上述其中一可行的實施例中，第二下孔道內的空間大於第三下孔道內的空間。其中，探測針包括針尾部及探測部，針尾部連接探測部，針尾部的截面積大於探測部的截面積，針尾部位於第二下孔道內，探測部一部位於第三下孔道內，另一部凸露於第三下孔道外。其中，探測針在縱向上的長度小於2000µm。依據此實施例，藉由第二下孔道、第三下孔道、彈性針、可撓性薄膜（或絕緣結構）以及探測針的結構設計，彈性針易於透過可撓性薄膜（或絕緣結構）推移探測針。探測針易於在第二下孔道及第三下孔道內移動，且探測針不易從第三下孔道掉出。由於探測針的長度小於2000µm，有利於高頻測試的需求。In one of the feasible embodiments described above, the space in the second lower channel is larger than the space in the third lower channel. The probe needle includes a needle tail and a detection portion, the needle tail is connected to the detection portion, the cross-sectional area of the needle tail is larger than the cross-sectional area of the detection portion, the needle tail is located in the second lower channel, one portion of the detection portion is located in the third lower channel, and the other portion protrudes outside the third lower channel. The length of the probe needle in the longitudinal direction is less than 2000µm. According to this embodiment, through the structural design of the second lower channel, the third lower channel, the elastic needle, the flexible film (or the insulating structure) and the probe needle, the elastic needle can easily push the probe needle through the flexible film (or the insulating structure). The probe needle is easy to move in the second lower channel and the third lower channel, and the probe needle is not easy to fall out of the third lower channel. Since the length of the probe is less than 2000µm, it is beneficial to the needs of high-frequency testing.
在上述其中一可行的實施例中，可撓性薄膜之絕緣層對應於相鄰的探測針之間開設有溝槽。由於在探測針上、下移動過程中，可撓性薄膜同時作動，藉由開設溝槽，以避免可撓性薄膜施加太多接觸力在探測針上。In one of the above feasible embodiments, the insulating layer of the flexible film is provided with grooves corresponding to adjacent probes. Since the flexible film is moved simultaneously during the upward and downward movement of the probe, the grooves are provided to prevent the flexible film from exerting too much contact force on the probe.
在上述其中一可行的實施例中，所述探測針針尾部設有彈性結構。藉由設置彈性結構使探測針的針尾部與孔壁金屬層有良好的接觸，且探測針的針尾部在第二下孔道內上下移動時，其與第二下孔道的壁面產生的摩擦力不妨礙探測針的移動，也不會從第三下孔道掉出。此外，藉由進一步適當設計彈性結構，使用者可施力自第三下孔道將探測針抽出以及置入新的探測針，提升換針的效率。In one of the feasible embodiments described above, the tail of the probe needle is provided with an elastic structure. By providing the elastic structure, the tail of the probe needle has good contact with the metal layer of the hole wall, and when the tail of the probe needle moves up and down in the second lower hole, the friction between it and the wall of the second lower hole does not hinder the movement of the probe needle, and it will not fall out of the third lower hole. In addition, by further appropriately designing the elastic structure, the user can apply force to pull the probe needle out of the third lower hole and insert a new probe needle, thereby improving the efficiency of needle replacement.
在上述其中一可行的實施例中，第二下導板或第三下導板為多層陶瓷導板 (Multi-layer Ceramic board, MLC），多層陶瓷導板包括導電線路層，電性連接第一孔壁金屬層及第二孔壁金屬層。依據此實施例，待測物所發出的探測訊號可經由第一探測針、第一孔壁金屬層、導電線路層、第二孔壁金屬層及第二探測針傳回至待測物，完成回授電路測試。In one of the above feasible embodiments, the second lower guide plate or the third lower guide plate is a multi-layer ceramic board (MLC), and the multi-layer ceramic board includes a conductive circuit layer, which is electrically connected to the first hole wall metal layer and the second hole wall metal layer. According to this embodiment, the detection signal emitted by the object to be tested can be transmitted back to the object to be tested via the first detection needle, the first hole wall metal layer, the conductive circuit layer, the second hole wall metal layer and the second detection needle, completing the feedback circuit test.
在上述其中一可行的實施例中，絕緣結構可為所述針體表面的絕緣膜之一部分、一絕緣片或一位於探測針的針尾部頂端的一絕緣塗層。確保彈性針及探測針之間為絕緣狀態，不影響測試訊號的傳遞。In one of the above feasible embodiments, the insulating structure may be a portion of the insulating film on the surface of the needle body, an insulating sheet, or an insulating coating at the top of the needle tail of the probe needle, ensuring that the elastic needle and the probe needle are in an insulating state and do not affect the transmission of the test signal.
在上述其中一可行的實施例中，絕緣結構也可以包括所述絕緣膜之一部分、所述絕緣片及所述絕緣塗層中至少兩者的組合，同樣可確保彈性針及探測針之間為絕緣狀態，不影響測試訊號的傳遞。In one of the above feasible embodiments, the insulating structure may also include a combination of at least two of a portion of the insulating film, the insulating sheet, and the insulating coating, which can also ensure that the elastic needle and the detection needle are in an insulating state without affecting the transmission of the test signal.
在上述其中一可行的實施例中，可撓性薄膜具有絕緣彈性針及探測針的功能，也可以進一步提供金屬線路層作為探測針的回授電路。但是在測試某些特定的待測物時，待測物需要高頻探測接點數量是小於等於非高頻探測接點數量。如果此時使用可撓性薄膜結構，則可撓性薄膜結構大部分對應非高頻探測的區域要挖孔讓非高頻探測元件穿過，可撓性薄膜開孔過大或者過多就沒有足夠的支撐力來維持可撓性薄膜上金屬線路層對應探測針的位置，而導致測試待測物發生錯誤。因此進一步提出沒有可撓性薄膜的探針卡，改用絕緣結構取代，例如：彈性針至少在接近探測針的區段塗佈絕緣膜，或者在彈性針接觸探測針的一端設置絕緣片，或者在探測針針尾部面對彈性針的一面設置絕緣塗層等。但這種做法失去了可撓性薄膜提供的金屬線路層。為了克服此一問題，可以將金屬線路層設置在第二下孔道或者第三下孔道中形成多個孔壁金屬層，以讓探測針可以維持與第二下孔道或者第三下孔道的孔壁金屬層的接觸。並進一步的藉由第二下導板或第三下導板的表面金屬線路層或者導電線路層連接孔壁金屬層，作為探測針的回授電路。例如：在第二下導板下表面形成表面金屬線路層與第二下孔道的孔壁金屬層連接。或者在第三下導板上表面形成表面金屬線路層與第三下孔道的孔壁金屬層連接。或者第二下導板或第三下導板使用多層陶瓷導板，進一步在多層陶瓷導板內部設置一導電線路層連接孔壁金屬層。如此，可以上述結構取代可撓性薄膜的探針卡架構，依然可以達到具有回授電路，以用於高頻探測的探針卡裝置。In one of the feasible embodiments described above, the flexible film has the functions of insulating the elastic needle and the probe needle, and can further provide the metal circuit layer as a feedback circuit for the probe needle. However, when testing certain specific objects to be tested, the number of high-frequency detection contacts required by the object to be tested is less than or equal to the number of non-high-frequency detection contacts. If a flexible film structure is used at this time, most of the areas of the flexible film structure corresponding to non-high-frequency detection must be dug to allow non-high-frequency detection elements to pass through. If the openings of the flexible film are too large or too many, there will not be enough support to maintain the position of the metal circuit layer on the flexible film corresponding to the probe needle, resulting in errors in testing the object to be tested. Therefore, it is further proposed that the probe card without the flexible film be replaced with an insulating structure, for example: the elastic needle is coated with an insulating film at least in the section close to the probe needle, or an insulating sheet is provided at the end of the elastic needle that contacts the probe needle, or an insulating coating is provided on the side of the probe needle tail facing the elastic needle, etc. However, this method loses the metal circuit layer provided by the flexible film. In order to overcome this problem, the metal circuit layer can be provided in the second lower channel or the third lower channel to form multiple hole wall metal layers, so that the probe needle can maintain contact with the hole wall metal layer of the second lower channel or the third lower channel. And further, the surface metal circuit layer or the conductive circuit layer of the second lower guide plate or the third lower guide plate is connected to the hole wall metal layer to serve as a feedback circuit for the probe. For example: a surface metal circuit layer is formed on the lower surface of the second lower guide plate to connect with the hole wall metal layer of the second lower channel. Or a surface metal circuit layer is formed on the upper surface of the third lower guide plate to connect with the hole wall metal layer of the third lower channel. Or the second lower guide plate or the third lower guide plate uses a multi-layer ceramic guide plate, and a conductive circuit layer is further provided inside the multi-layer ceramic guide plate to connect with the hole wall metal layer. In this way, the probe card frame of the flexible film can be replaced by the above structure, and a probe card device with a feedback circuit for high-frequency detection can still be achieved.
為使能進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“探針卡裝置”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不背離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。The following is a specific embodiment to illustrate the implementation of the "probe card device" disclosed in the present invention. Technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.
應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.
請參閱圖1至圖4，圖1為本發明之探針卡裝置Z之第一實施例之示意圖。圖2為本發明之可撓性薄膜26之一實施例之示意圖。圖3及圖4分別為圖1所示實施例之使用狀態示意圖。探針卡裝置Z可適用於高頻探測，其包括支撐板1及探測頭2。探測頭2位於支撐板1下方，探測頭2包括上導板241、第一下導板242、第二下導板22、第三下導板23、多個高頻探測元件25及可撓性薄膜26。所述支撐板1依據一些實施例為印刷電路板，支撐板1可確保該探測頭2和待測物T之間的連接。Please refer to Figures 1 to 4. Figure 1 is a schematic diagram of the first embodiment of the probe card device Z of the present invention. Figure 2 is a schematic diagram of an embodiment of the flexible film 26 of the present invention. Figures 3 and 4 are schematic diagrams of the use status of the embodiment shown in Figure 1, respectively. The probe card device Z can be used for high-frequency detection, which includes a support plate 1 and a probe head 2. The probe head 2 is located below the support plate 1, and the probe head 2 includes an upper guide plate 241, a first lower guide plate 242, a second lower guide plate 22, a third lower guide plate 23, a plurality of high-frequency detection elements 25 and a flexible film 26. The support plate 1 is a printed circuit board according to some embodiments, and the support plate 1 can ensure the connection between the probe head 2 and the object T to be detected.
如圖1所示，第一下導板242位於上導板241下方，第一下導板242具有多個第一下孔道211。第二下導板22位於第一下導板242的下方，第二下導板22具有多個第二下孔道221，多個第二下孔道221分別對應於多個第一下孔道211。第三下導板23位於第二下導板22下方，第三下導板23具有多個第三下孔道231，多個第三下孔道231分別連通且對應於多個第二下孔道221。每一高頻探測元件25包括彈性針251及探測針252，彈性針251一端連接支撐板1，彈性針251的另一端穿過上孔道2411及第一下孔道211，彈性針251部分容置在上導板241和第一下導板242之間。探測針252穿過第二下孔道221及第三下孔道231且延伸至第三下孔道231外。依據一些實施例，探測針252在縱向D1上的長度小於2000µm。另依據一些實施例，探測針252的長度小於彈性針251的長度。依據圖1所示的實施例，第二下孔道221內的空間大於第三下孔道231內的空間。探測針252包括針尾部252a及探測部252b，針尾部252a連接探測部252b，在水平截面上，針尾部252a的截面積大於探測部252b的截面積，針尾部252a位於第二下孔道221內，探測部252b一部位於第三下孔道231內，另一部凸露於第三下孔道231外。可撓性薄膜26位於第二下導板22面向第一下導板242的表面上，可撓性薄膜26包括金屬線路層261以及覆蓋金屬線路層261的絕緣層262。彈性針251自第一下孔道211延伸以抵接於可撓性薄膜26。探測針252的頂端抵持並電性連接於金屬線路層261，多個探測針252之中的至少兩個分別定義為第一探測針及第二探測針。其中第一探測針可視為訊號輸出端子TX，第二探測針可視為訊號接收端子RX。As shown in FIG. 1 , the first lower guide plate 242 is located below the upper guide plate 241, and the first lower guide plate 242 has a plurality of first lower channels 211. The second lower guide plate 22 is located below the first lower guide plate 242, and the second lower guide plate 22 has a plurality of second lower channels 221, and the plurality of second lower channels 221 respectively correspond to the plurality of first lower channels 211. The third lower guide plate 23 is located below the second lower guide plate 22, and the third lower guide plate 23 has a plurality of third lower channels 231, and the plurality of third lower channels 231 are respectively connected to and correspond to the plurality of second lower channels 221. Each high-frequency detection element 25 includes an elastic needle 251 and a detection needle 252. One end of the elastic needle 251 is connected to the support plate 1, and the other end of the elastic needle 251 passes through the upper channel 2411 and the first lower channel 211. The elastic needle 251 is partially accommodated between the upper guide plate 241 and the first lower guide plate 242. The detection needle 252 passes through the second lower channel 221 and the third lower channel 231 and extends outside the third lower channel 231. According to some embodiments, the length of the detection needle 252 in the longitudinal direction D1 is less than 2000μm. According to some other embodiments, the length of the detection needle 252 is less than the length of the elastic needle 251. According to the embodiment shown in Figure 1, the space in the second lower channel 221 is larger than the space in the third lower channel 231. The probe needle 252 includes a needle tail 252a and a probe portion 252b. The needle tail 252a is connected to the probe portion 252b. In a horizontal cross section, the cross-sectional area of the needle tail 252a is larger than that of the probe portion 252b. The needle tail 252a is located in the second lower channel 221. A portion of the probe portion 252b is located in the third lower channel 231, and another portion is protruded outside the third lower channel 231. The flexible film 26 is located on the surface of the second lower guide plate 22 facing the first lower guide plate 242. The flexible film 26 includes a metal circuit layer 261 and an insulating layer 262 covering the metal circuit layer 261. The elastic needle 251 extends from the first lower channel 211 to abut against the flexible film 26. The top of the probe needle 252 abuts against and is electrically connected to the metal circuit layer 261. At least two of the plurality of probe needles 252 are defined as a first probe needle and a second probe needle. The first probe needle can be regarded as a signal output terminal TX, and the second probe needle can be regarded as a signal receiving terminal RX.
如圖2所示，金屬線路層261區分成電性連接於訊號輸出端子TX的第一內埋部261a、電性連接於訊號接收端子RX的第二內埋部261c及連接於第一內埋部261a與第二內埋部261c之間的外露部261b，第一內埋部261a與第二內埋部261c 都位於第一下導板242及第二下導板22之間，外露部261b位於第一下導板242及第二下導板22的外部，一個或多個電子元件3電性連接於外露部261b。所述電子元件3可為電阻、電容、衰減器或是其組合。在此實施例中，絕緣層262對應於相鄰之探測針252之間開設有溝槽2621，由於在探測針252往上及往下移動過程中，可撓性薄膜26同時作動，藉由開設溝槽2621以避免可撓性薄膜26施加太多接觸力在探測針252上。As shown in FIG. 2 , the metal circuit layer 261 is divided into a first embedded portion 261a electrically connected to the signal output terminal TX, a second embedded portion 261c electrically connected to the signal receiving terminal RX, and an exposed portion 261b connected between the first embedded portion 261a and the second embedded portion 261c. The first embedded portion 261a and the second embedded portion 261c are both located between the first lower guide plate 242 and the second lower guide plate 22. The exposed portion 261b is located outside the first lower guide plate 242 and the second lower guide plate 22. One or more electronic components 3 are electrically connected to the exposed portion 261b. The electronic component 3 may be a resistor, a capacitor, an attenuator, or a combination thereof. In this embodiment, the insulating layer 262 has grooves 2621 formed between adjacent probe needles 252. Since the flexible film 26 is actuated simultaneously when the probe needles 252 move upward and downward, the grooves 2621 are formed to prevent the flexible film 26 from applying too much contact force on the probe needles 252.
如圖3及圖4所示，當待測物T上移接觸探測針252以進行檢測時，探測針252相對於第二下孔道221及第三下孔道231以從初始位置P1向上移動至探測位置P2，且探測針252透過可撓性薄膜26頂推彈性針251使彈性針251產生彈力，以使得訊號輸出端子TX從待測物T所接收的探測訊號依序經由第一內埋部261a、外露部261b、第二內埋部261c以及訊號接收端子RX傳回至待測物T，藉此以形成回授電路測試。當待測物T下移離開探測針252時，彈性針251回復彈力，以將探測針252從探測位置P2推移至初始位置P1。換言之，訊號輸出端子TX、第一內埋部261a、外露部261b、第二內埋部261c以及訊號接收端子RX形成一回授電路，回授電路用於在探測針252接觸待測物T以進行檢測時，訊號輸出端子TX從待測物T所接收的探測訊號經由回授電路傳回至待測物T，以形成回授電路測試。彈性針251長度大於探測針252長度，用於提供探測待測物T時產生彈力，以及用於在探測後提供回復彈力。As shown in FIG. 3 and FIG. 4 , when the object under test T moves upward to contact the probe needle 252 for detection, the probe needle 252 moves upward from the initial position P1 to the detection position P2 relative to the second lower hole 221 and the third lower hole 231, and the probe needle 252 pushes the elastic needle 251 through the flexible film 26 to make the elastic needle 251 generate elastic force, so that the detection signal received by the signal output terminal TX from the object under test T is transmitted back to the object under test T in sequence through the first embedded portion 261a, the exposed portion 261b, the second embedded portion 261c and the signal receiving terminal RX, thereby forming a feedback circuit test. When the object T to be tested moves downward and away from the probe needle 252, the elastic needle 251 restores the elastic force to move the probe needle 252 from the detection position P2 to the initial position P1. In other words, the signal output terminal TX, the first embedded portion 261a, the exposed portion 261b, the second embedded portion 261c and the signal receiving terminal RX form a feedback circuit. The feedback circuit is used when the probe needle 252 contacts the object T to be tested, and the detection signal received by the signal output terminal TX from the object T is transmitted back to the object T to form a feedback circuit test. The length of the elastic needle 251 is greater than that of the probe needle 252, and is used to provide elastic force when detecting the object T to be tested, and to provide a restoring elastic force after detection.
彈性針251長度大於探測針252長度。彈性針251的縱向剛性大於探測針252的縱向剛性。彈性針251的變形量大於探測針252的變形量。使彈性針251以挫曲變形的方式提供探測待測物T的彈力以及探測後提供回復彈力。彈性針251與探測針252相互絕緣，使回授電路只會經過探測針252而不會經過彈性針251，如此，回授路徑可為最短路徑，有利於高頻測試。The length of the elastic needle 251 is greater than that of the probe needle 252. The longitudinal rigidity of the elastic needle 251 is greater than that of the probe needle 252. The deformation of the elastic needle 251 is greater than that of the probe needle 252. The elastic needle 251 provides elastic force for detecting the object T to be detected by bending and deforming, and provides a restoring elastic force after detection. The elastic needle 251 and the probe needle 252 are insulated from each other, so that the feedback circuit only passes through the probe needle 252 but not the elastic needle 251. In this way, the feedback path can be the shortest path, which is beneficial for high-frequency testing.
請參閱圖5，為本發明之探針卡裝置Z之第二實施例之局部示意圖。於此實施例中，探測頭2還包括多個非高頻探測元件27，非高頻探測元件27穿過第一下孔道211、第二下孔道221及第三下孔道231並與探測針252平齊。非高頻探測元件27為一體式結構的探針，其未區分彈性針251及探測針252。換言之，依據圖5所示的實施例，高頻探測元件25可與非高頻探測元件27搭配使用。在一些實施例中，探測頭2的探測元件皆為高頻探測元件25（例如圖1所示的實施例）。所述的「高頻」，是指傳遞頻率高於14GHz的訊號。Please refer to FIG5 , which is a partial schematic diagram of the second embodiment of the probe card device Z of the present invention. In this embodiment, the probe head 2 further includes a plurality of non-high-frequency detection elements 27, which pass through the first lower channel 211, the second lower channel 221 and the third lower channel 231 and are aligned with the detection needle 252. The non-high-frequency detection element 27 is a probe with an integrated structure, which does not distinguish between the elastic needle 251 and the detection needle 252. In other words, according to the embodiment shown in FIG5 , the high-frequency detection element 25 can be used in combination with the non-high-frequency detection element 27. In some embodiments, the detection elements of the probe head 2 are all high-frequency detection elements 25 (such as the embodiment shown in FIG1 ). The "high frequency" mentioned here refers to the signal transmission frequency higher than 14GHz.
請參閱圖6，為本發明之探針卡裝置Z之第三實施例之局部示意圖。與前述第一實施例不同的地方在於金屬線路層261包括內埋部261d但不包括外露部261b，所述內埋部261d的兩端分別電性連接於第一探測針及第二探測針。其中第一探測針可視為訊號輸出端子TX，第二探測針可視為訊號接收端子RX。當待測物T上移接觸探測針252以進行檢測時（參閱圖3或圖4），訊號輸出端子TX從待測物T所接收的探測訊號依序經由內埋部261d及訊號接收端子RX傳回至待測物T，以此形成回授電路測試。換言之，此回授電路的訊號傳遞並不經由「外露部261b」回傳至待測物T，而是經由訊號輸出端子TX、內埋部261d以及訊號接收端子RX傳回待測物T完成。需特別說明的是，訊號輸出端子TX及訊號接收端子RX的界定並不限於相鄰的二探測針252，端視待測物T之電路圖案層而定。訊號輸出端子TX、內埋部261d以及訊號接收端子RX形成一回授電路，回授電路用於在探測針252接觸待測物T以進行檢測時，訊號輸出端子TX從待測物T所接收的探測訊號經由回授電路傳回至待測物T，以形成回授電路測試。Please refer to FIG6 , which is a partial schematic diagram of the third embodiment of the probe card device Z of the present invention. The difference from the aforementioned first embodiment is that the metal circuit layer 261 includes an embedded portion 261d but does not include an exposed portion 261b, and the two ends of the embedded portion 261d are electrically connected to the first probe needle and the second probe needle respectively. The first probe needle can be regarded as a signal output terminal TX, and the second probe needle can be regarded as a signal receiving terminal RX. When the object to be tested T moves up to contact the probe needle 252 for detection (see FIG3 or FIG4 ), the detection signal received by the signal output terminal TX from the object to be tested T is sequentially transmitted back to the object to be tested T via the embedded portion 261d and the signal receiving terminal RX, thereby forming a feedback circuit test. In other words, the signal transmission of this feedback circuit is not transmitted back to the object under test T via the "exposed portion 261b", but is transmitted back to the object under test T via the signal output terminal TX, the embedded portion 261d, and the signal receiving terminal RX. It should be particularly noted that the definition of the signal output terminal TX and the signal receiving terminal RX is not limited to the two adjacent probe needles 252, but depends on the circuit pattern layer of the object under test T. The signal output terminal TX, the embedded portion 261d, and the signal receiving terminal RX form a feedback circuit. The feedback circuit is used for transmitting the detection signal received by the signal output terminal TX from the object under test T back to the object under test T via the feedback circuit when the probe needle 252 contacts the object under test T for detection, so as to form a feedback circuit test.
請參閱圖7至圖8，分別為本發明之探針卡裝置Z之第四及第五實施例之局部示意圖。依據圖7所示的實施例，第一下導板242、第二下導板22及第三下導板23相堆疊。高頻探測元件25包括彈性針251、絕緣結構28及探測針252。彈性針251包括針體2511及位於針體2511表面的絕緣膜2512。絕緣結構28位於彈性針251下方及位於探測針252的上方，用以斷開彈性針251及探測針252之間的導電。探測針252包括針尾部252a及探測部252b，在水平截面上，針尾部252a的截面積大於探測部252b的截面積，針尾部252a位於第二下孔道221內，針尾部252a的頂端抵持絕緣結構28，探測部252b一端連接於針尾部252a，另一端延伸至第三下孔道231外，彈性針251、絕緣結構28及針尾部252a可上、下移動於第二下孔道221內。金屬線路層261包括多個孔壁金屬層2611及多個導板金屬線路層2612。導板金屬線路層2612位於第二下導板22與第三下導板23之間。彈性針251與第二下孔道221的壁面之間具有間距，第二下孔道221的壁面設有孔壁金屬層2611，孔壁金屬層2611連接導板金屬線路層2612，並在第二下孔道221內接觸（電性連接）探測針252，如上所述，二探測針252分別定義第一探測針及第二探測針。第一探測針可視為訊號輸出端子TX，第二探測針可視為訊號接收端子RX，其中電性連接於訊號輸出端子TX的孔壁金屬層2611定義第一孔壁金屬層2611’，電性連接於訊號接收端子RX的孔壁金屬層2611定義第二孔壁金屬層2611”，導板金屬線路層2612分別連接第一孔壁金屬層2611’及第二孔壁金屬層2611”。依據圖7所示的實施例，於檢測待測物T時，探測針252透過絕緣結構28頂推彈性針251使彈性針251產生彈力，以使得訊號輸出端子TX從待測物T所接收的探測訊號依序經由第一孔壁金屬層2611’、導板金屬線路層2612、第二孔壁金屬層2611”以及訊號接收端子RX傳回至待測物T，藉此以形成回授電路測試。另依據圖8所示的實施例，孔壁金屬層2611則是設置於第三下孔道231的內壁面，且接觸探測部252b，導板金屬線路層2612位於第二下導板22與第三下導板23之間且兩端連接孔壁金屬層2611，依此實施例，在檢測待測物T時，回授電路測試同樣是由訊號輸出端子TX從待測物T所接收的探測訊號依序經由第一孔壁金屬層2611’、導板金屬線路層2612、第二孔壁金屬層2611”以及訊號接收端子RX傳回至待測物T所形成。換言之，訊號輸出端子TX、第一孔壁金屬層2611’、導板金屬線路層2612、第二孔壁金屬層2611”以及訊號接收端子RX形成一回授電路，回授電路用於在探測針252接觸待測物T以進行檢測時，訊號輸出端子TX從待測物T所接收的探測訊號經由回授電路傳回至待測物T，以形成回授電路測試。Please refer to Figures 7 and 8, which are partial schematic diagrams of the fourth and fifth embodiments of the probe card device Z of the present invention. According to the embodiment shown in Figure 7, the first lower guide plate 242, the second lower guide plate 22 and the third lower guide plate 23 are stacked. The high-frequency detection element 25 includes a flexible needle 251, an insulating structure 28 and a detection needle 252. The flexible needle 251 includes a needle body 2511 and an insulating film 2512 located on the surface of the needle body 2511. The insulating structure 28 is located below the flexible needle 251 and above the detection needle 252 to disconnect the conduction between the flexible needle 251 and the detection needle 252. The probe needle 252 includes a needle tail 252a and a detection part 252b. In the horizontal cross section, the cross-sectional area of the needle tail 252a is larger than that of the detection part 252b. The needle tail 252a is located in the second lower channel 221. The top end of the needle tail 252a abuts against the insulating structure 28. One end of the detection part 252b is connected to the needle tail 252a, and the other end extends to the outside of the third lower channel 231. The elastic needle 251, the insulating structure 28 and the needle tail 252a can move up and down in the second lower channel 221. The metal circuit layer 261 includes a plurality of hole wall metal layers 2611 and a plurality of guide plate metal circuit layers 2612. The guide plate metal circuit layer 2612 is located between the second lower guide plate 22 and the third lower guide plate 23. There is a distance between the elastic needle 251 and the wall of the second lower hole 221. The wall of the second lower hole 221 is provided with a hole wall metal layer 2611. The hole wall metal layer 2611 is connected to the guide plate metal circuit layer 2612 and contacts (electrically connects) the probe needle 252 in the second lower hole 221. As mentioned above, the two probe needles 252 respectively define a first probe needle and a second probe needle. The first probe needle can be regarded as a signal output terminal TX, and the second probe needle can be regarded as a signal receiving terminal RX, wherein the hole wall metal layer 2611 electrically connected to the signal output terminal TX defines a first hole wall metal layer 2611', and the hole wall metal layer 2611 electrically connected to the signal receiving terminal RX defines a second hole wall metal layer 2611", and the guide plate metal circuit layer 2612 is respectively connected to the first hole wall metal layer 2611' and the second hole wall metal layer 2611". According to the embodiment shown in FIG. 7 , when detecting the object to be tested T, the probe needle 252 pushes the elastic needle 251 through the insulating structure 28 to generate elastic force on the elastic needle 251, so that the detection signal received by the signal output terminal TX from the object to be tested T is sequentially transmitted through the first hole wall metal layer 2611 ', the guide plate metal line layer 2612, the second hole wall metal layer 2611 "and the signal receiving terminal RX to the object to be tested T, thereby forming a feedback circuit test. According to the embodiment shown in FIG. 8 , the hole wall metal layer 2611 is disposed at the first hole wall metal layer 2611 ', the guide plate metal line layer 2612, the second hole wall metal layer 2611 "and the signal receiving terminal RX. The inner wall surface of the third lower channel 231 contacts the detection portion 252b, the guide plate metal circuit layer 2612 is located between the second lower guide plate 22 and the third lower guide plate 23 and both ends are connected to the hole wall metal layer 2611. According to this embodiment, when detecting the object to be tested T, the feedback circuit test is also formed by the detection signal received by the signal output terminal TX from the object to be tested T in sequence through the first hole wall metal layer 2611', the guide plate metal circuit layer 2612, the second hole wall metal layer 2611" and the signal receiving terminal RX to return to the object to be tested T. In other words, the signal output terminal TX, the first hole wall metal layer 2611', the guide plate metal line layer 2612, the second hole wall metal layer 2611" and the signal receiving terminal RX form a feedback circuit. The feedback circuit is used when the probe needle 252 contacts the object to be tested T for detection. The detection signal received by the signal output terminal TX from the object to be tested T is transmitted back to the object to be tested T through the feedback circuit to form a feedback circuit test.
在一些實施例中，絕緣結構28為針體2511表面的絕緣膜2512的一部分。在一些實施例中，絕緣結構28為針尾部252a頂端的絕緣塗層。依據圖7所示的實施例，絕緣結構28為絕緣片。然而，本發明並不以此為限，依據一些實施例，絕緣結構28包括前述絕緣膜2512的一部分、絕緣片及前述絕緣塗層中至少兩者的組合。In some embodiments, the insulating structure 28 is a portion of the insulating film 2512 on the surface of the needle body 2511. In some embodiments, the insulating structure 28 is an insulating coating at the top of the needle tail 252a. According to the embodiment shown in FIG. 7 , the insulating structure 28 is an insulating sheet. However, the present invention is not limited thereto, and according to some embodiments, the insulating structure 28 includes a portion of the aforementioned insulating film 2512, an insulating sheet, and a combination of at least two of the aforementioned insulating coating.
請參閱圖9，為本發明之探針卡裝置Z之第六實施例之局部示意圖。於此實施例中，針尾部252a設有彈性結構252c，例如但不限於孔洞。設置彈性結構252c的目的，在於使探測針252的針尾部252a與孔壁金屬層有良好的接觸，且探測針252的針尾部252a在第二下孔道221內上下移動時，其與第二下孔道221的壁面產生的摩擦力不妨礙探測針252的移動，也不會從第三下孔道231掉出。此外，藉由設計彈性結構252c，使用者可施力予探測部252b，將探測針252自第三下孔道231抽出以及置入新的探測針252，提升換針的效率。Please refer to FIG. 9, which is a partial schematic diagram of the sixth embodiment of the probe card device Z of the present invention. In this embodiment, the needle tail 252a is provided with an elastic structure 252c, such as but not limited to a hole. The purpose of providing the elastic structure 252c is to make the needle tail 252a of the probe needle 252 have good contact with the metal layer of the hole wall, and when the needle tail 252a of the probe needle 252 moves up and down in the second lower channel 221, the friction generated between the needle tail 252a and the wall surface of the second lower channel 221 does not hinder the movement of the probe needle 252, and it will not fall out of the third lower channel 231. In addition, by designing the elastic structure 252c, the user can apply force to the detection portion 252b to withdraw the detection needle 252 from the third lower channel 231 and insert a new detection needle 252, thereby improving the efficiency of needle replacement.
依據一些實施例，第二下導板22或第三下導板23為多層陶瓷導板 (Multi-layer Ceramic board, MLC），多層陶瓷導板包括導電線路層（圖未示出），電性連接第一孔壁金屬層2611’及第二孔壁金屬層2611”。依據此實施例，待測物T所發出的探測訊號可經由訊號輸出端子TX、第一孔壁金屬層2611’、導電線路層、第二孔壁金屬層2611”及訊號接收端子RX傳回至待測物T，完成回授電路測試。According to some embodiments, the second lower guide plate 22 or the third lower guide plate 23 is a multi-layer ceramic board (MLC), which includes a conductive circuit layer (not shown) electrically connected to the first hole wall metal layer 2611' and the second hole wall metal layer 2611". According to this embodiment, the detection signal emitted by the object to be tested T can be transmitted back to the object to be tested T via the signal output terminal TX, the first hole wall metal layer 2611', the conductive circuit layer, the second hole wall metal layer 2611" and the signal receiving terminal RX to complete the feedback circuit test.
[實施例的有益效果][Beneficial Effects of Embodiments]
本發明的其中一有益效果在於，本發明所提供的探針卡裝置Z，通過「金屬線路層261區分成電性連接於訊號輸出端子TX的第一內埋部261a、電性連接於訊號接收端子RX的第二內埋部261c及連接於第一內埋部261a與第二內埋部261c之間的外露部261b」的技術方案，透過探測針252及待測物T即可完成回授電路測試。One of the beneficial effects of the present invention is that the probe card device Z provided by the present invention can complete the feedback circuit test through the probe needle 252 and the object to be tested T through the technical solution of "the metal circuit layer 261 is divided into a first embedded part 261a electrically connected to the signal output terminal TX, a second embedded part 261c electrically connected to the signal receiving terminal RX, and an exposed part 261b connected between the first embedded part 261a and the second embedded part 261c".
本發明的其中一有益效果在於，本發明所提供的探針卡裝置Z，通過「金屬線路層261包括內埋部，二端分別電性連接訊號輸出端子TX及訊號接收端子RX」的技術方案，透過探測針252及待測物T即可完成回授電路測試。One of the beneficial effects of the present invention is that the probe card device Z provided by the present invention can complete the feedback circuit test through the probe needle 252 and the object to be tested T through the technical solution of "the metal circuit layer 261 includes an embedded part, and the two ends are electrically connected to the signal output terminal TX and the signal receiving terminal RX respectively".
本發明的其中一有益效果在於，本發明所提供的探針卡裝置Z，通過「金屬線路層261包括孔壁金屬層及導板金屬線路層2612，以及探測針252電性接觸孔壁金屬層」的技術方案，透過探測針252及待測物T即可完成回授電路測試。One of the beneficial effects of the present invention is that the probe card device Z provided by the present invention can complete the feedback circuit test through the probe needle 252 and the object to be tested T through the technical solution of "the metal circuit layer 261 includes the hole wall metal layer and the guide plate metal circuit layer 2612, and the probe needle 252 electrically contacts the hole wall metal layer".
本發明的其中一有益效果在於，依據一些實施例，本發明所提供的探針卡裝置Z，適於探測高頻電子產品。在一些實施例中，探針卡裝置Z包括高頻探測元件25及非高頻探測元件27，兩者可搭配使用。One of the beneficial effects of the present invention is that, according to some embodiments, the probe card device Z provided by the present invention is suitable for detecting high-frequency electronic products. In some embodiments, the probe card device Z includes a high-frequency detection element 25 and a non-high-frequency detection element 27, and the two can be used in combination.
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.
Z:探針卡裝置 1:支撐板 2:探測頭 211:第一下孔道 22:第二下導板 221:第二下孔道 23:第三下導板 231:第三下孔道 241:上導板 2411:上孔道 242:第一下導板 25:高頻探測元件 251:彈性針 2511:針體 2512:絕緣膜 252:探測針 252a:針尾部 252b:探測部 252c:彈性結構 26:可撓性薄膜 261:金屬線路層 261a:第一內埋部 261b:外露部 261c:第二內埋部 261d:內埋部 2611:孔壁金屬層 2611’:第一孔壁金屬層 2611” :第二孔壁金屬層 2612:導板金屬線路層 262:絕緣層 2621:溝槽 27:非高頻探測元件 28:絕緣結構 3:電子元件 D1:縱向 P1:初始位置 P2:探測位置 T:待測物 RX:訊號接收端子 TX:訊號輸出端子Z: Probe card device1: Support plate2: Probe head211: First lower channel22: Second lower guide plate221: Second lower channel23: Third lower guide plate231: Third lower channel241: Upper guide plate2411: Upper channel242: First lower guide plate25: High-frequency detection element251: Elastic needle2511: Needle body2512: Insulating film252: Probe needle252a: Needle tail252b: Probe part252c: Elastic structure26: Flexible film261: Metal circuit layer261a: First embedded part261b: Exposed part261c: Second embedded part261d: embedded part2611: hole wall metal layer2611’: first hole wall metal layer2611”: second hole wall metal layer2612: guide plate metal line layer262: insulation layer2621: groove27: non-high frequency detection element28: insulation structure3: electronic componentD1: longitudinalP1: initial positionP2: detection positionT: object to be testedRX: signal receiving terminalTX: signal output terminal
圖1為本發明之探針卡裝置之第一實施例之示意圖。FIG. 1 is a schematic diagram of a first embodiment of the probe card device of the present invention.
圖2為本發明之可撓性薄膜之一實施例之示意圖。FIG. 2 is a schematic diagram of an embodiment of the flexible film of the present invention.
圖3為圖1所示實施例之使用狀態示意圖。FIG. 3 is a schematic diagram of the use status of the embodiment shown in FIG. 1 .
圖4為圖1所示實施例之使用狀態示意圖。FIG. 4 is a schematic diagram of the use status of the embodiment shown in FIG. 1 .
圖5為本發明之探針卡裝置之第二實施例之局部示意圖。FIG. 5 is a partial schematic diagram of a second embodiment of the probe card device of the present invention.
圖6為本發明之探針卡裝置之第三實施例之局部示意圖。FIG. 6 is a partial schematic diagram of a third embodiment of the probe card device of the present invention.
圖7為本發明之探針卡裝置之第四實施例之局部示意圖。FIG. 7 is a partial schematic diagram of a fourth embodiment of the probe card device of the present invention.
圖8為本發明之探針卡裝置之第五實施例之局部示意圖。FIG. 8 is a partial schematic diagram of a fifth embodiment of the probe card device of the present invention.
圖9為本發明之探針卡裝置之第六實施例之局部示意圖。FIG. 9 is a partial schematic diagram of a sixth embodiment of the probe card device of the present invention.
Z:探針卡裝置Z: Probe card device
1:支撐板1: Support plate
2:探測頭2: Detector head
211:第一下孔道211: The first lower channel
22:第二下導板22: Second lower guide plate
221:第二下孔道221: The second lower channel
23:第三下導板23: The third lower guide plate
231:第三下孔道231: The third lower channel
241:上導板241: Upper guide plate
2411:上孔道2411: Upper channel
242:第一下導板242: First lower guide plate
25:高頻探測元件25: High frequency detection element
251:彈性針251: Elastic needle
252:探測針252: Probe
252a:針尾部252a: Needle tail
252b:探測部252b: Detection Department
26:可撓性薄膜26: Flexible film
261:金屬線路層261: Metal circuit layer
262:絕緣層262: Insulation layer
3:電子元件3: Electronic components
D1:縱向D1: Longitudinal
RX:第一探測針RX: First probe needle
TX:第二探測針TX: Second probe needle
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111146656ATWI865981B (en) | 2022-12-06 | 2022-12-06 | Probe card device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111146656ATWI865981B (en) | 2022-12-06 | 2022-12-06 | Probe card device |
| Publication Number | Publication Date |
|---|---|
| TW202424500A TW202424500A (en) | 2024-06-16 |
| TWI865981Btrue TWI865981B (en) | 2024-12-11 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111146656ATWI865981B (en) | 2022-12-06 | 2022-12-06 | Probe card device |
| Country | Link |
|---|---|
| TW (1) | TWI865981B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653340A (en)* | 2002-05-08 | 2005-08-10 | 佛姆费克托公司 | High peformance probe system for testing semiconductor wafers |
| TW201840987A (en)* | 2017-02-15 | 2018-11-16 | 義大利商探針科技公司 | Improved probe card for high-frequency applications |
| TW202006368A (en)* | 2018-07-04 | 2020-02-01 | 義大利商探針科技公司 | Probe card for high frequency applications |
| TW202229881A (en)* | 2020-11-25 | 2022-08-01 | 義大利商探針科技公司 | Flexible membrane adapted to carry high-frequency (rf) power signals and corresponding probe card for the high-frequency (rf) power test of electronic devices |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653340A (en)* | 2002-05-08 | 2005-08-10 | 佛姆费克托公司 | High peformance probe system for testing semiconductor wafers |
| TW201840987A (en)* | 2017-02-15 | 2018-11-16 | 義大利商探針科技公司 | Improved probe card for high-frequency applications |
| TW202006368A (en)* | 2018-07-04 | 2020-02-01 | 義大利商探針科技公司 | Probe card for high frequency applications |
| TW202229881A (en)* | 2020-11-25 | 2022-08-01 | 義大利商探針科技公司 | Flexible membrane adapted to carry high-frequency (rf) power signals and corresponding probe card for the high-frequency (rf) power test of electronic devices |
| Publication number | Publication date |
|---|---|
| TW202424500A (en) | 2024-06-16 |
| Publication | Publication Date | Title |
|---|---|---|
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