本發明大體上係關於微機電系統(MEMS)感測器，其可被用於多種器件類型，包含可穿戴器件，且可被用於多種應用類型，包含一壓力感測器封裝。特定言之，本發明係關於保護MEMS感測器免受環境影響之MEMS器件封裝及其製造方法。The present invention generally relates to microelectromechanical systems (MEMS) sensors that can be used in a variety of device types, including wearable devices, and can be used in a variety of application types, including a pressure sensor package. In particular, the present invention relates to MEMS device packages that protect MEMS sensors from environmental influences and methods of making the same.
MEMS器件可包含專用封裝，其可取決於例如器件及/或應用類型。例如，諸如壓力感測器等MEMS器件可包含一封裝以容納一或多個壓力埠，使得該壓力感測器之一膜可被曝露於一周圍(外部)環境。然而，封裝之其他元件(諸如一積體電路、電連接器、焊盤等)可需要保護免受外部環境(例如，水及/或其他污染)之影響。MEMS devices may include a dedicated package, which may depend on, for example, the type of device and/or application. For example, a MEMS device such as a pressure sensor may include a package to accommodate one or more pressure ports so that a membrane of the pressure sensor can be exposed to the surrounding (external) environment. However, other components of the package (such as an integrated circuit, electrical connectors, pads, etc.) may need to be protected from the external environment (e.g., water and/or other contaminants).
在習知解決方案中，通常提供一防水MEMS封裝。在一些習知解決方案中，藉由用一黏膠封裝覆蓋MEMS器件以提供防水(及環境保護)。然而，黏膠之存在(例如，在一壓力感測器之一膜上)可影響器件之靈敏度效能及/或可影響(黏膠填充)部件之處置。因此，具有一黏膠之習知防水MEMS封裝將限制器件產品效能之最大化。In known solutions, a waterproof MEMS package is usually provided. In some known solutions, waterproofing (and environmental protection) is provided by covering the MEMS device with an adhesive package. However, the presence of adhesive (e.g., on a membrane of a pressure sensor) may affect the sensitivity performance of the device and/or may affect the handling of (adhesive-filled) parts. Therefore, a known waterproof MEMS package with an adhesive will limit the maximization of the device product performance.
因此，需要具有經改良之環境保護之MEMS器件封裝。Therefore, there is a need for MEMS device packaging with improved environmental protection.
本發明之態樣係關於提供經改良之防水及污染防護之一種MEMS壓力感測器封裝及一種製造此一封裝之方法。Aspects of the present invention relate to a MEMS pressure sensor package providing improved water resistance and contamination protection and a method of manufacturing such a package.
在一些實施例中，本發明提供一種MEMS感測器封裝，其保護MEMS壓力感測器膜免受可損壞感測器且影響其效能之液體及/或污染之影響。In some embodiments, the present invention provides a MEMS sensor package that protects a MEMS pressure sensor membrane from liquids and/or contamination that could damage the sensor and affect its performance.
在一些實施例中，本發明揭示一種微機電系統(MEMS)封裝，其包括：至少一個MEMS器件，其經安置於一基底基板上；及一蓋，其經安置於該基底基板上，該蓋經組態以封閉該至少一個MEMS器件。在一些實施例中，該蓋包括經組態以經耦合至該基底基板之一主體部分、一頂板部分及經組態以與該頂板部分接觸之一膜。在一些實施例中，該主體部分及該頂板部分形成封裝至少一個MEMS器件之一空腔。在一些實施例中，該膜由一過濾織物形成。該膜經組態以實質上阻擋一或多種液體及污染進入該空腔。In some embodiments, the present invention discloses a microelectromechanical system (MEMS) package, comprising: at least one MEMS device disposed on a base substrate; and a cover disposed on the base substrate, the cover configured to enclose the at least one MEMS device. In some embodiments, the cover comprises a body portion configured to be coupled to the base substrate, a top plate portion, and a membrane configured to contact the top plate portion. In some embodiments, the body portion and the top plate portion form a cavity encapsulating at least one MEMS device. In some embodiments, the membrane is formed of a filter fabric. The membrane is configured to substantially block one or more liquids and contaminants from entering the cavity.
在一些實施例中，該頂板部分包括一頂板層，且該膜經組態以經黏附至該頂板層。在其他實施例中，該頂板部分包括第一及第二頂板層，該膜經組態以經嵌入於該第一與第二頂板層之間，且該頂板部分經組態以經耦合至該主體部分。在一些實施例中，該主體部分及該頂板部分經形成為一單片結構。In some embodiments, the top portion includes a top layer, and the membrane is configured to be adhered to the top layer. In other embodiments, the top portion includes first and second top layers, the membrane is configured to be embedded between the first and second top layers, and the top portion is configured to be coupled to the body portion. In some embodiments, the body portion and the top portion are formed as a monolithic structure.
在一些實施例中，該MEMS封裝可進一步包含經安置於過濾織物上之一疏水塗層及一疏油塗層中之至少一者。在一些實施例中，該頂板部分可包含一或多個孔。額外地，該膜可經組態以覆蓋該頂板部分之一或多個孔。In some embodiments, the MEMS package may further include at least one of a hydrophobic coating and an oleophobic coating disposed on the filter fabric. In some embodiments, the top plate portion may include one or more holes. Additionally, the membrane may be configured to cover one or more holes of the top plate portion.
在一些實施例中，過濾織物可包括一膨脹聚四氟乙烯(ePTFE)材料。在一些實施例中，蓋可由包括一金屬之一導電材料形成。額外地，該金屬可包括不銹鋼、鍍黃銅、鍍鋁及鎳中之一或多者。在一些實施例中，該至少一個MEMS器件包括至少一個MEMS壓力感測器。在一些實施例中，該膜經組態以提供該至少一個MEMS器件之防水及污染防護中之至少一者。在一些實施例中，主體部分可包括一環形環，且該頂板部分可包括一盤形。In some embodiments, the filter fabric may include an expanded polytetrafluoroethylene (ePTFE) material. In some embodiments, the cover may be formed of a conductive material including a metal. Additionally, the metal may include one or more of stainless steel, plated brass, plated aluminum, and nickel. In some embodiments, the at least one MEMS device includes at least one MEMS pressure sensor. In some embodiments, the membrane is configured to provide at least one of waterproofing and contamination protection to the at least one MEMS device. In some embodiments, the body portion may include an annular ring, and the top plate portion may include a disk.
在另一態樣中，本發明揭示一種製造一MEMS封裝之方法。在一個實施例中，提供一種製造微機電系統(MEMS)封裝之方法，其包括：形成包括一主體部分及一頂板部分的一蓋，使得該主體部分及該頂板部分形成一空腔，其中至少一個MEMS器件經組態以經封閉於該空腔中；由一過濾織物形成一膜；將該膜安置於該頂板部分上，使得該膜與該頂板部分接觸，該膜經組態以實質上阻擋一或多種液體及污染進入該空腔；及將該蓋安置於該基底基板上，使得該蓋之主體部分經耦合至該基底基板，該基底基板包含經安置於其上之至少一個MEMS器件。In another aspect, the present invention discloses a method for manufacturing a MEMS package. In one embodiment, a method for manufacturing a microelectromechanical system (MEMS) package is provided, comprising: forming a cover including a main body portion and a top plate portion, so that the main body portion and the top plate portion form a cavity, wherein at least one MEMS device is configured to be enclosed in the cavity; forming a membrane from a filter fabric; placing the membrane on the top plate portion so that the membrane contacts the top plate portion, the membrane is configured to substantially block one or more liquids and contaminants from entering the cavity; and placing the cover on the base substrate so that the main body portion of the cover is coupled to the base substrate, the base substrate including at least one MEMS device placed thereon.
在一些實施例中，該蓋之形成進一步包括將該主體部分及該頂板部分形成為一單片結構，且將該膜黏附至該頂板部分。In some embodiments, the forming of the cover further includes forming the body portion and the top plate portion as a monolithic structure, and adhering the film to the top plate portion.
在其他實施例中，該蓋之形成進一步包括提供第一及第二頂板層，該第一及第二頂板層形成頂板部分；及將該頂板部分耦合至該主體部分，其中安置該膜進一步包括將該膜嵌入於該第一頂板層與該第二頂板層之間。額外地，在一些實施例中，該第一及第二頂板層可經黏附在一起，而不將該膜黏附至該第一及第二頂板層。額外地，在其他實施例中，該膜可經黏附至該第一及第二頂板層中之一或多者。In other embodiments, the formation of the cover further includes providing first and second roof layers, the first and second roof layers forming a roof portion; and coupling the roof portion to the body portion, wherein positioning the film further includes embedding the film between the first roof layer and the second roof layer. Additionally, in some embodiments, the first and second roof layers may be adhered together without adhering the film to the first and second roof layers. Additionally, in other embodiments, the film may be adhered to one or more of the first and second roof layers.
在一些實施例中，該方法可進一步包括將一疏水塗層及一疏油塗層中之至少一者安置於該過濾織物上。在一些實施例中，該方法可進一步包括在頂板部分中形成一或多個孔，其中該膜經組態以覆蓋該頂板部分之一或多個孔。在一些實施例中，該過濾織物可包括一ePTFE材料。In some embodiments, the method may further include disposing at least one of a hydrophobic coating and an oleophobic coating on the filter fabric. In some embodiments, the method may further include forming one or more holes in the top plate portion, wherein the membrane is configured to cover the one or more holes in the top plate portion. In some embodiments, the filter fabric may include an ePTFE material.
在一些實施例中，該蓋可由包括一金屬及一聚合物中之一或多者之一材料形成。額外地，該金屬可包括不銹鋼、鍍黃銅、鍍鋁及鎳中的一或多者。In some embodiments, the cover may be formed of a material including one or more of a metal and a polymer. Additionally, the metal may include one or more of stainless steel, plated brass, plated aluminum, and nickel.
在另一態樣中，本發明揭示一種製造複數個殼體封裝之方法。在一個實施例中，提供一種製造複數個殼體封裝之方法，其中各殼體封裝經組態以封裝一微機電系統(MEMS)器件，其包括：提供具有第一頂板組件之一基質之一第一頂板層，該第一頂板組件之各者具有以第一圖案經配置之一或多個第一孔；提供具有第二頂板組件之基質之一第二頂板層，該第二頂板組件之各者具有以一第一圖案經配置之一或多個第二孔；提供包括一過濾織物之一膜層；將該膜層嵌入於該第一頂板層與該第二頂板層之間，使得該第一頂板部分件之基質與該第二頂板組件之基質對準，以形成一第三頂板層；分離該第三頂板層以形成對應於該等複數個殼體封裝之複數個頂板部分；及將該等複數個頂板部分耦合至複數個基座部分以形成該等複數個殼體封裝。In another aspect, the present invention discloses a method for manufacturing a plurality of housing packages. In one embodiment, a method for manufacturing a plurality of housing packages is provided, wherein each housing package is configured to package a micro-electromechanical system (MEMS) device, comprising: providing a first top plate layer of a substrate having a first top plate component, each of the first top plate components having one or more first holes configured in a first pattern; providing a second top plate layer of a substrate having a second top plate component, each of the second top plate components having one or more first holes configured in a first pattern; one or more second holes; providing a membrane layer including a filter fabric; embedding the membrane layer between the first top plate layer and the second top plate layer so that the substrate of the first top plate component is aligned with the substrate of the second top plate component to form a third top plate layer; separating the third top plate layer to form a plurality of top plate portions corresponding to the plurality of housing packages; and coupling the plurality of top plate portions to a plurality of base portions to form the plurality of housing packages.
在一些實施例中，該膜之該嵌入進一步包括將該膜層黏附至該第一頂板層及該第二頂板層中之各者。在其他實施例中，該膜之該嵌入進一步包括：在以一第二圖案經配置之該膜中一或多個第三孔，該第二圖案不同於該第一圖案；根據該第二圖案在該第一頂板層及該第二頂板層之一者上安置一黏合劑；及根據該黏合劑經由該膜之該一或多個第三孔將該第一頂板層黏附至該第二頂板層。In some embodiments, the embedding of the film further includes adhering the film layer to each of the first top board layer and the second top board layer. In other embodiments, the embedding of the film further includes: one or more third holes in the film configured with a second pattern, the second pattern being different from the first pattern; placing an adhesive on one of the first top board layer and the second top board layer according to the second pattern; and adhering the first top board layer to the second top board layer through the one or more third holes of the film according to the adhesive.
在一些實施例中，該過濾織物包括一ePTFE材料。在一些實施例中，該第一頂板層、該第二層及複數個基底部分之各者由包括不銹鋼、鍍黃銅、鍍鋁及鎳中之一或多者之一金屬材料形成。在一些實施例中，該方法進一步包括在將一疏水塗層及一疏油塗層中之至少一者安置於過濾織物之至少一部分上。In some embodiments, the filter fabric includes an ePTFE material. In some embodiments, each of the first top plate layer, the second layer, and the plurality of base portions is formed of a metal material including one or more of stainless steel, plated brass, plated aluminum, and nickel. In some embodiments, the method further includes disposing at least one of a hydrophobic coating and an oleophobic coating on at least a portion of the filter fabric.
100:MEMS感測器封裝100:MEMS sensor packaging
102:MEMS感測器102:MEMS sensor
104:基底基板104: Base substrate
106:蓋106: Cover
108:黏膠108: Adhesive
200:蓋200: Cover
202:主體部分202: Main body
204:頂板部分204: Top plate part
302-1:第一頂板層302-1: First roof layer
302-2:第二頂板層302-2: Second roof layer
304:膜304: Membrane
306:黏合劑306: Adhesive
308-1:孔308-1: Hole
308-2:孔308-2: Hole
310:孔310: Hole
312:突部312: protrusion
314:區域314: Area
402:側壁區域402: Side wall area
404:頂部部分區域404: Part of the top area
406:基底部分區域406: Basement area
408:空腔408: Cavity
500:MEMS封裝500:MEMS packaging
502:基底基板502: Base substrate
504:額外層504: Additional layer
506:積體電路506: Integrated Circuit
508:MEMS器件508:MEMS devices
510:通孔510:Through hole
700:MEMS封裝700:MEMS packaging
702:蓋702: Cover
704:頂板層704: Roof layer
706:頂板層706: Roof layer
708:膜708: Membrane
710:黏合劑710: Adhesive
712:孔712: Hole
714:空腔714: Cavity
716:基底基板716: Base substrate
802:主體部分802: Main body
804:頂板部分804: Top plate part
902-1:第一頂板片材902-1: First roof sheet
902-2:第二頂板片材902-2: Second top plate sheet
904-1:第一孔組904-1: First hole group
904-2:第三孔組904-2: The third hole group
906:黏膠圖案906: Adhesive pattern
908:膜片材908: Membrane sheet
910:孔/第二孔組910: Hole/Second hole group
912:頂板部分912: Top plate part
914-1:第一頂板組件914-1: First roof assembly
914-2:第二頂板組件914-2: Second top plate assembly
916:主體部分916: Main body
918:蓋918: Cover
隨附圖式中展示MEMS器件封裝(本文中被稱為一MEMS封裝)及形成MEMS封裝之一方法之實例。An example of a MEMS device package (referred to herein as a MEMS package) and a method of forming a MEMS package are shown in the accompanying figures.
圖1係一先前技術MEMS感測器封裝之一橫截面圖。Figure 1 is a cross-sectional view of a prior art MEMS sensor package.
圖2係根據本發明之一態樣之一MEMS封裝之一實例蓋之一透視圖。FIG. 2 is a perspective view of an example cover of a MEMS package according to an aspect of the present invention.
圖3係根據本發明之一態樣之圖2中所展示之實例蓋之一分解透視圖。FIG. 3 is an exploded perspective view of the example cover shown in FIG. 2 according to one aspect of the present invention.
圖4A係根據本發明之一態樣之圖2中所展示之蓋之一橫截面圖。FIG. 4A is a cross-sectional view of the cover shown in FIG. 2 according to one aspect of the present invention.
圖4B係根據本發明之一態樣之圖2中所展示之蓋之一橫截面透視圖。FIG. 4B is a cross-sectional perspective view of the cover shown in FIG. 2 according to one aspect of the present invention.
圖5係根據本發明之一態樣之一實例MEMS封裝之一透視圖。FIG5 is a perspective view of an example MEMS package according to an embodiment of the present invention.
圖6係根據本發明之一態樣之圖5中所展示之MEMS封裝之一橫截面透視圖。FIG. 6 is a cross-sectional perspective view of the MEMS package shown in FIG. 5 according to one aspect of the present invention.
圖7A係根據本發明之另一態樣之一實例MEMS封裝之一剖切透視圖。FIG. 7A is a perspective cutaway view of an example MEMS package according to another aspect of the present invention.
圖7B係根據本發明之一態樣之圖7A之一部分7B之一細節圖。FIG. 7B is a detailed diagram of a portion 7B of FIG. 7A according to an aspect of the present invention.
圖8A係根據本發明之一態樣之圖7中所展示之蓋之一透視圖。FIG8A is a perspective view of the cover shown in FIG7 according to one aspect of the present invention.
圖8B係根據本發明之一態樣之圖8A中所展示之蓋之一橫截面透視圖。FIG8B is a cross-sectional perspective view of the cover shown in FIG8A according to one aspect of the present invention.
圖9A、圖9B、圖9C、圖9D、圖9E及圖9F係繪示根據本發明之一態樣之用於製造一或多個MEMS封裝之一或多個蓋之一實例程序之透視圖。Figures 9A, 9B, 9C, 9D, 9E and 9F are perspective views showing an example process for manufacturing one or more covers of one or more MEMS packages according to one aspect of the present invention.
圖10A、圖10B、圖10C、圖10D及圖10E係繪示根據本發明之一態樣之用於製造一或多個MEMS封裝之一或多個蓋之一實例程序之俯視圖。Figures 10A, 10B, 10C, 10D and 10E are top views showing an example process for manufacturing one or more covers of one or more MEMS packages according to one aspect of the present invention.
相關申請案之交叉參考Cross-references to related applications
本申請案主張於2021年9月17日申請之美國臨時申請案第63/245,715號及於2022年4月29日申請之美國專利申請案第17/733,720號之優先權，該等案之全文以引用方式併入。This application claims priority to U.S. Provisional Application No. 63/245,715 filed on September 17, 2021 and U.S. Patent Application No. 17/733,720 filed on April 29, 2022, the entire texts of which are incorporated by reference.
如上文所提及，期望形成MEMS器件(例如，MEMS感測器)，以保護其免受環境影響。例如，可期望防護一MEMS壓力感測器膜免受液體及/或污染之影響，該等液體及/或污染可損壞感測器且影響其效能。因此，為一壓力感測器封裝提供用於防水能力之穩健技術及方法係重要的。As mentioned above, it is desirable to form MEMS devices (e.g., MEMS sensors) to protect them from environmental influences. For example, it may be desirable to protect a MEMS pressure sensor membrane from liquids and/or contamination, which may damage the sensor and affect its performance. Therefore, it is important to provide a pressure sensor package with robust techniques and methods for water resistance.
參考圖1，展示先前技術MEMS感測器封裝100(本文中被稱為習知封裝100)之一橫截面圖。大體上，習知封裝100可包含經安置於基底基板104上之MEMS感測器102。MEMS感測器102可藉由經耦合至基底基板104之蓋106封閉。在一些實例中，蓋106可包含一或多個孔(未經展示)，該等孔可形成通向一外部環境之(若干)埠。習知封裝100可經填充有黏膠108，以在封裝100內提供元件之防水性。黏膠108通常以一方式經安置以覆蓋MEMS感測器102(及任何其他組件(未經圖示)，諸如任何積體電路、接合墊、接合線、連接器等類似物)。大體上，黏膠108可包含一黏膠化合物，且表示可被用於囊封電子組件之一灌封材料之一實例。在一非限制性實例中，黏膠108可包含藉由Shin-Etsu製造之一灌封黏膠，諸如SIFEL®8470。Referring to FIG. 1 , a cross-sectional view of a prior art MEMS sensor package 100 (referred to herein as known package 100) is shown. In general, known package 100 may include a MEMS sensor 102 disposed on a base substrate 104. MEMS sensor 102 may be enclosed by a lid 106 coupled to base substrate 104. In some examples, lid 106 may include one or more holes (not shown) that may form a port(s) leading to an external environment. Known package 100 may be filled with adhesive 108 to provide waterproofing of components within package 100. Adhesive 108 is typically positioned in a manner to cover MEMS sensor 102 (and any other components (not shown), such as any integrated circuits, bond pads, bond wires, connectors, and the like). Generally, adhesive 108 may include an adhesive compound and represents an example of a potting material that may be used to encapsulate electronic components. In a non-limiting example, adhesive 108 may include a potting adhesive manufactured by Shin-Etsu, such as SIFEL® 8470.
在習知封裝100中，黏膠108(通常)完全覆蓋MEMS感測器102之一曝露表面。然而，由於黏膠108覆蓋待經曝露於外部環境之MEMS感測器102之一表面(例如，一壓力感測器之一膜)，黏膠108可影響MEMS感測器102之靈敏度效能(例如，重力(g)-壓力靈敏度之靈敏度)。例如，黏膠108在MEMS感測器102之膜上引入一額外壓力(例如，部分由於膜上黏膠108之厚度及密度及黏膠108之密度)，藉此降低膜對壓力變化作出反應之能力。因此，此額外壓力可降低膜之g靈敏度，且藉由MEMS感測器102導致一延遲反應時間(例如，當倒置MEMS感測器102時)。因此，黏膠108可對MEMS感測器102之效能產生負面影響。額外地，使用者可對處理習知封裝100之黏膠填充組件有顧慮(例如，由於黏膠108之紋理及/或任何其他顧慮)。例如，黏膠108之一表面可從環境及/或在使用期間拾取灰塵及/或污染。此一外觀隨時間之變化可引起對MEMS感測器102及/或封裝100本身之一品質(例如，效能、耐用性等)之顧慮。In the known package 100, the adhesive 108 (typically) completely covers an exposed surface of the MEMS sensor 102. However, because the adhesive 108 covers a surface of the MEMS sensor 102 to be exposed to the external environment (e.g., a membrane of a pressure sensor), the adhesive 108 can affect the sensitivity performance (e.g., the sensitivity of gravity (g)-pressure sensitivity) of the MEMS sensor 102. For example, the adhesive 108 introduces an additional pressure on the membrane of the MEMS sensor 102 (e.g., due in part to the thickness and density of the adhesive 108 on the membrane and the density of the adhesive 108), thereby reducing the ability of the membrane to respond to changes in pressure. Thus, this additional pressure may reduce the g-sensitivity of the membrane and cause a delayed response time by the MEMS sensor 102 (e.g., when the MEMS sensor 102 is inverted). Thus, the adhesive 108 may negatively impact the performance of the MEMS sensor 102. Additionally, users may have concerns about handling the adhesive-filled components of the known package 100 (e.g., due to the texture of the adhesive 108 and/or any other concerns). For example, a surface of the adhesive 108 may pick up dust and/or contamination from the environment and/or during use. This change in appearance over time may cause concerns about the quality (e.g., performance, durability, etc.) of the MEMS sensor 102 and/or the package 100 itself.
本發明之態樣係關於MEMS封裝及其製造方法。在一些實例中，一MEMS封裝可包含經安置於一基底基板上之至少一個MEMS器件及經安置於基底基板上的一蓋。該蓋可經組態以封閉(若干)MEMS器件。在一些實施例中，蓋可包含經組態以經耦合至基底基板之一主體部分、一頂板部分及經組態以與該頂板部分接觸之一膜。在一些實施例中，該主體部分及該頂板部分可形成可封裝(若干)MEMS器件之一空腔。在一些實施例中，膜可由一過濾織物形成。該膜可經組態以實質上阻擋一或多種液體及污染進入該空腔。在一些實施例中，該過濾織物可由一ePTFE材料(本文中被稱為一ePTFE膜)形成。在一些實施例中，(若干)MEMS器件可包含一MEMS壓力感測器。在一些實施例中，MEMS封裝可包含頂板部分中之一或多個孔(例如，以形成通向一外部環境之一或多個埠)。過濾織物可藉由覆蓋(若干)孔以防止流體及/或其他容器進入，同時仍然允許MEMS感測器曝露於外部環境，以提供(若干)MEMS器件之防水及/或污染防護。Aspects of the present invention relate to MEMS packages and methods of making the same. In some embodiments, a MEMS package may include at least one MEMS device disposed on a base substrate and a cover disposed on the base substrate. The cover may be configured to enclose (several) MEMS devices. In some embodiments, the cover may include a main body portion configured to be coupled to the base substrate, a top plate portion, and a membrane configured to contact the top plate portion. In some embodiments, the main body portion and the top plate portion may form a cavity that may encapsulate (several) MEMS devices. In some embodiments, the membrane may be formed by a filter fabric. The membrane may be configured to substantially block one or more liquids and contaminants from entering the cavity. In some embodiments, the filter fabric may be formed of an ePTFE material (referred to herein as an ePTFE membrane). In some embodiments, the MEMS device(s) may include a MEMS pressure sensor. In some embodiments, the MEMS package may include one or more holes in the top plate portion (e.g., to form one or more ports to an external environment). The filter fabric may provide waterproof and/or contamination protection to the MEMS device(s) by covering the hole(s) to prevent ingress of fluids and/or other containers while still allowing the MEMS sensor to be exposed to the external environment.
在本發明之一些實施例中，該頂板部分可包含與該膜接觸之至少一個頂板層。在一些實例中，該蓋可經形成為單一單片組件，使得該頂板部分及該主體部分係一單一結構。在一些實例中，該頂板部分可為該主體部分之一分離組件，且該頂板部分可經耦合至該主體部分(例如，壓入該蓋主體部分)。在一些實例中，該頂板部分可包含一頂部頂板層及一底部頂板層，其中該膜(例如，由一過濾織物形成)嵌入其間。In some embodiments of the present invention, the top plate portion may include at least one top plate layer in contact with the membrane. In some examples, the cover may be formed as a single monolithic component such that the top plate portion and the body portion are a single structure. In some examples, the top plate portion may be a separate component of the body portion, and the top plate portion may be coupled to the body portion (e.g., pressed into the cover body portion). In some examples, the top plate portion may include a top top plate layer and a bottom top plate layer, with the membrane (e.g., formed of a filter fabric) embedded therebetween.
與習知封裝相比，本發明之MEMS封裝不利用在封裝空腔中之一黏膠來覆蓋MEMS器件。相反，本發明之實例MEMS封裝可將膜嵌入(及/或黏附)至蓋之一頂板部分中(例如，藉由將膜嵌入於頂板部分與底部頂板層之間，或在一單片蓋之情況下藉由將膜黏附至頂板層)。使用一ePTFE膜(例如)而非一黏膠提供優於習知封裝之優點，包含經改良之靈敏度效能(例如，g靈敏度效能、膜靈敏度效能)，且可允許保護MEMS器件(例如，壓力感測器)在蓋處理期間免受可能之損壞。In contrast to known packages, the MEMS packages of the present invention do not utilize an adhesive in the package cavity to cover the MEMS device. Instead, example MEMS packages of the present invention may embed (and/or adhere) the membrane into a top plate portion of the lid (e.g., by embedding the membrane between the top plate portion and the bottom top plate layer, or by adhering the membrane to the top plate layer in the case of a monolithic lid). Using an ePTFE membrane (for example) instead of an adhesive provides advantages over known packages, including improved sensitivity performance (e.g., g-sensitivity performance, membrane sensitivity performance), and may allow protection of the MEMS device (e.g., pressure sensor) from potential damage during lid handling.
在一些實例中，本發明之MEMS封裝可被用於一或多個MEMS壓力感測器。在一些實例中，本發明之MEMS封裝可被用於MEMS壓力感測器。大體上，本發明之MEMS封裝可與任何MEMS壓力感測器一起使用。此外，儘管相對於MEMS壓力感測器描述本發明之MEMS封裝之實例，但MEMS封裝不限於MEMS壓力感測器。大體上，本發明之MEMS封裝可經組態以被用於任何MEMS器件，包括包含曝露於(外部)環境之一感測器之一MEMS器件。In some examples, the MEMS package of the present invention can be used with one or more MEMS pressure sensors. In some examples, the MEMS package of the present invention can be used with MEMS pressure sensors. In general, the MEMS package of the present invention can be used with any MEMS pressure sensor. Furthermore, although examples of the MEMS package of the present invention are described with respect to MEMS pressure sensors, the MEMS package is not limited to MEMS pressure sensors. In general, the MEMS package of the present invention can be configured to be used with any MEMS device, including a MEMS device that includes a sensor exposed to an (external) environment.
接下來參考圖2至圖6。根據本發明之一態樣展示MEMS封裝500之實例蓋200。特定言之，圖2係蓋200之一透視圖；圖3係蓋200之一分解透視圖；圖4A係蓋200之一橫截面圖；圖4B自蓋200之一橫截面透視圖；圖5係實例MEMS封裝500之一透視圖；圖6係MEMS封裝500之一橫截面透視圖。Next, refer to Figures 2 to 6. An example cover 200 of a MEMS package 500 is shown according to one aspect of the present invention. Specifically, Figure 2 is a perspective view of the cover 200; Figure 3 is an exploded perspective view of the cover 200; Figure 4A is a cross-sectional view of the cover 200; Figure 4B is a cross-sectional perspective view of the cover 200; Figure 5 is a perspective view of an example MEMS package 500; and Figure 6 is a cross-sectional perspective view of the MEMS package 500.
接著將關於圖2至圖4B描述蓋200。蓋200可包含主體部分202及頂板部分204。主體部分202可包含側壁區域402、頂部部分區域404及基底部分區域406(圖4A)。主體部分202可經組態以經耦合至頂部部分區域404附近之頂板部分204。主體部分202亦可進一步經組態以經由基底部分區域406耦合至基底基板502(圖5)。當主體部分202經耦合至頂板部分204時，組合可經組態以在其中形成空腔408。The cover 200 will then be described with respect to FIGS. 2 to 4B. The cover 200 may include a body portion 202 and a top plate portion 204. The body portion 202 may include a sidewall region 402, a top portion region 404, and a base portion region 406 (FIG. 4A). The body portion 202 may be configured to be coupled to the top plate portion 204 near the top portion region 404. The body portion 202 may also be further configured to be coupled to a base substrate 502 via the base portion region 406 (FIG. 5). When the body portion 202 is coupled to the top plate portion 204, the assembly may be configured to form a cavity 408 therein.
在一些實例中，基底部分202可經組態為一環形環，頂板部分204可經組態為一盤狀，在其中形成一圓柱形空腔408。應暸解，蓋200(及圖7A至圖8B中所展示之蓋702及圖9F中所展示蓋918)之形狀表示一非限制性實例，且蓋200(702、918)可由任何適合之對稱形狀(例如，圓柱形、立方體、長方體等)及/或任何適合之非對稱形狀形成。In some examples, the base portion 202 may be configured as an annular ring and the top plate portion 204 may be configured as a disk, forming a cylindrical cavity 408 therein. It should be understood that the shape of the cover 200 (and the cover 702 shown in Figures 7A to 8B and the cover 918 shown in Figure 9F) represents a non-limiting example, and the cover 200 (702, 918) may be formed of any suitable symmetrical shape (e.g., cylindrical, cubic, cuboid, etc.) and/or any suitable asymmetrical shape.
最佳如圖3及圖4A中所示，頂板部分204可包含第一頂板層302-1、第二頂板層302-2及嵌入其間之膜304。膜304可由一過濾織物形成，且可經組態以實質上阻擋液體(例如水)及污染(例如粒子)中之一或多者進入空腔408且滲透封裝500。在一些實施例中，過濾織物可包含任何適合之ePTFE材料。在一些實例中，一疏水塗層及一疏油塗層中之至少一種可經安置於形成膜304之過濾織物上。As best shown in FIGS. 3 and 4A , the top plate portion 204 may include a first top plate layer 302-1, a second top plate layer 302-2, and a membrane 304 embedded therebetween. The membrane 304 may be formed of a filter fabric and may be configured to substantially block one or more of liquids (e.g., water) and contaminants (e.g., particles) from entering the cavity 408 and penetrating the package 500. In some embodiments, the filter fabric may include any suitable ePTFE material. In some examples, at least one of a hydrophobic coating and an oleophobic coating may be disposed on the filter fabric forming the membrane 304.
在一些實例中，膜304可包含以一預定圖案經配置之一或多個孔310(圖3中所繪示之一個孔圖9C及圖10C中所展示之數個孔910)。在一些實例中，膜304可包含從膜304之一邊緣延伸之一或多個突部312，以在突部312(不包含任何膜材料)之間形成區域314。在一些實例中，膜304可包含一均勻周界(例如，經形成為一圓形)，以便不包含任何突部312(及可包含多於一個孔310)。In some examples, the membrane 304 may include one or more holes 310 (one hole 9C shown in FIG. 3 and several holes 910 shown in FIG. 10C) arranged in a predetermined pattern. In some examples, the membrane 304 may include one or more protrusions 312 extending from an edge of the membrane 304 to form a region 314 between the protrusions 312 (not including any membrane material). In some examples, the membrane 304 may include a uniform perimeter (e.g., formed into a circle) so as not to include any protrusions 312 (and may include more than one hole 310).
在一些實例中，第一頂板層302-1可藉由以一圖案經配置之黏合劑306直接黏附至第二頂板層302-2，使得黏合劑306經組態以與孔310(或孔910)及/或不包含膜304之任何區域314對準。以此方式，最佳如圖4A中所示，第一頂板層302-1可(經由黏合劑306)黏附至第二頂板層302-2，而不將膜304黏附至第一頂板層302-1及第二頂板層302-2(同時仍將膜304嵌入於第一頂板層302-1與第二頂板層302-2之間)。在一些實例中，膜304可(經由任何適合之黏合劑306)黏附至第一頂板層302-1及第二頂板層302-2中之一或多者。黏合劑306可包含給定MEMS封裝500之應用之具有適合之性質之任何黏合材料。在一非限制性實例中，黏合劑306可包含一環氧樹脂。In some examples, the first top sheet layer 302-1 may be directly adhered to the second top sheet layer 302-2 via an adhesive 306 configured in a pattern such that the adhesive 306 is configured to align with the apertures 310 (or apertures 910) and/or any areas 314 that do not include the film 304. In this manner, as best shown in FIG. 4A , the first top sheet layer 302-1 may be adhered to the second top sheet layer 302-2 (via the adhesive 306) without adhering the film 304 to the first top sheet layer 302-1 and the second top sheet layer 302-2 (while still embedding the film 304 between the first top sheet layer 302-1 and the second top sheet layer 302-2). In some examples, the film 304 may be adhered to one or more of the first top board layer 302-1 and the second top board layer 302-2 (via any suitable adhesive 306). The adhesive 306 may include any adhesive material having suitable properties for a given application of the MEMS package 500. In a non-limiting example, the adhesive 306 may include an epoxy.
在一些實例中，第一頂板層302-1及第二頂板層302-2中之各者可包含延伸穿過其之一或多個各自孔308-1及308-2(即，一或多個孔徑)。(若干)孔308-1及(若干)孔308-2(即，一或多個孔徑)可以一相同圖案經配置，使得(若干)孔308-1及(若干)孔308-2經組態以經對準(最佳如圖4A及圖4B中所展示)。在一些實例中，(若干)孔308-1、308-2可形成一或多個聲埠，以將空腔408中之MEMS器件508(圖6)曝露於一外部(環境)環境。In some examples, each of the first and second top board layers 302-1, 302-2 may include one or more respective holes 308-1 and 308-2 (i.e., one or more apertures) extending therethrough. The hole(s) 308-1 and the hole(s) 308-2 (i.e., one or more apertures) may be arranged in a same pattern such that the hole(s) 308-1 and the hole(s) 308-2 are configured to be aligned (best shown in FIGS. 4A and 4B ). In some examples, the hole(s) 308-1, 308-2 may form one or more acoustic ports to expose the MEMS device 508 ( FIG. 6 ) in the cavity 408 to an external (ambient) environment.
如在圖4A及圖4B中所展示，膜304可經組態以與第一頂板層302-1及第二頂板層302-2中之各者接觸。膜304可經組態以覆蓋各自頂板層302-1、302-2中之孔308-1、308-2。在一些實例中，各自頂板層302-1、302-2中之孔308-1、308-2可經組態以允許環境壓力到達MEMS器件508(諸如，一壓力感測器(本文中亦被稱為一換能器))，而膜304可充當一過濾器以保護MEMS器件50免受水(例如，提供防水)、其他液體及污染(例如，根據一期望之入口防護等級(IPXX))。4A and 4B, the membrane 304 can be configured to contact each of the first and second top board layers 302-1, 302-2. The membrane 304 can be configured to cover the holes 308-1, 308-2 in the respective top board layers 302-1, 302-2. In some examples, the holes 308-1, 308-2 in the respective top layers 302-1, 302-2 can be configured to allow ambient pressure to reach the MEMS device 508 (e.g., a pressure sensor (also referred to herein as a transducer)), and the membrane 304 can act as a filter to protect the MEMS device 50 from water (e.g., providing waterproofing), other liquids, and contamination (e.g., according to a desired ingress protection rating (IPXX)).
應理解，頂板層302-1、302-2中之孔308-1、308-2之尺寸、孔之形狀及孔之數量可根據所需之氣流面積而變化。亦應理解，膜304之性質、膜304之一密度及/或膜304之一滲透性可根據一期望之防護位準(例如，其可取決於一換能器應用)而改變。在一些實例中，第一頂板層302-1及第二頂板層303-2可經組態以完全支撐膜304，限制膜304之偏轉。It should be understood that the size, shape, and number of holes 308-1, 308-2 in the top layers 302-1, 302-2 may vary depending on the desired airflow area. It should also be understood that the properties of the membrane 304, a density of the membrane 304, and/or a permeability of the membrane 304 may vary depending on a desired level of protection (e.g., which may depend on a transducer application). In some examples, the first top layer 302-1 and the second top layer 303-2 may be configured to fully support the membrane 304, limiting deflection of the membrane 304.
在一些實例中，蓋200(例如，主體部分202及/或頂板層302-1、302-2)可由包含一金屬之一導電材料形成。在一些實例中，金屬可包含但不限於不銹鋼、鍍黃銅、鍍鋁及鎳中之一或多者。在一些實例中，蓋200(例如，主體部分202及/或頂板層302-1、302-2)可由一聚合物形成。大體上，蓋200之材料可包含一種材料，或可包含具有用於保護MEMS器件508(諸如，一壓力感測器)之適合之性質之材料之任意組合。在一些實例中，蓋200之頂板部分204及主體部分202可由一相同材料形成。在一些實例中，蓋200之頂板部分204及主體部分202可由不同材料形成。In some examples, the cover 200 (e.g., the main body portion 202 and/or the top plate layers 302-1, 302-2) can be formed from a conductive material including a metal. In some examples, the metal can include, but is not limited to, one or more of stainless steel, plated brass, plated aluminum, and nickel. In some examples, the cover 200 (e.g., the main body portion 202 and/or the top plate layers 302-1, 302-2) can be formed from a polymer. Generally, the material of the cover 200 can include one material, or can include any combination of materials having suitable properties for protecting the MEMS device 508 (e.g., a pressure sensor). In some examples, the top plate portion 204 and the main body portion 202 of the cover 200 can be formed from the same material. In some embodiments, the top plate portion 204 and the main body portion 202 of the cover 200 may be formed of different materials.
接下來參考圖5及圖6，展示具有蓋200之MEMS封裝500。在一實例實施例中，MEMS封裝500可包含基底基板502、經安置於基底基板502上之至少一個積體電路506(例如，一專用積體電路(ASIC))、經安置於且經連接至積體電路506之MEMS器件508(例如，MEMS壓力感測器)及經耦合至基底基板502(例如，經由基底部分區域406)之蓋200。MEMS封裝500可進一步包含一或多個連接器、導線接合件、接合盤及類似物。MEMS封裝500亦可進一步包含一或多個額外層504(例如，一或多個互連接層)，其可經組態用於引導基底基板502上之一或多個結構之(若干)電連接，諸如穿過一或多個通孔510。蓋200可經組態以覆蓋MEMS器件508(使得MEMS器件508經封裝於空腔408內)且提供MEMS器件508之防水及污染防護。5 and 6, a MEMS package 500 having a lid 200 is shown. In an example embodiment, the MEMS package 500 may include a base substrate 502, at least one integrated circuit 506 (e.g., an application specific integrated circuit (ASIC)) disposed on the base substrate 502, a MEMS device 508 (e.g., a MEMS pressure sensor) disposed on and connected to the integrated circuit 506, and the lid 200 coupled to the base substrate 502 (e.g., via the base portion area 406). The MEMS package 500 may further include one or more connectors, wire bonds, bonding pads, and the like. The MEMS package 500 may also further include one or more additional layers 504 (e.g., one or more interconnect layers) that may be configured to direct electrical connections of one or more structures on the base substrate 502, such as through one or more through-holes 510. The cover 200 may be configured to cover the MEMS device 508 (such that the MEMS device 508 is packaged within the cavity 408) and provide water and contamination protection for the MEMS device 508.
如上文所討論，MEMS器件508可包含可期望受保護免於流體及/或污染的任何器件及/或感測器類型，包含在期望將MEMS器件508曝露於一外部環境之應用中。在一非限制性實例中，MEMS器件508可包含MEMS壓力感測器。As discussed above, MEMS device 508 may include any device and/or sensor type that may be desired to be protected from fluids and/or contaminants, including in applications where it is desired to expose MEMS device 508 to an external environment. In one non-limiting example, MEMS device 508 may include a MEMS pressure sensor.
MEMS封裝500(及圖7A中所示之MEMS封裝700)可被用作對MEMS器件508(諸如一壓力感測器)有用之任何器件之部分，包含可曝露於流體及/或污染之環境。可包含至少一個MEMS封裝500之器件之非限制性實例包含一可穿戴器件、一行動電話、一電子筆記型電腦、一膝上型電腦、一電腦及類似物中之一或多者。MEMS package 500 (and MEMS package 700 shown in FIG. 7A ) may be used as part of any device useful for a MEMS device 508 (such as a pressure sensor), including an environment that may be exposed to fluids and/or contamination. Non-limiting examples of devices that may include at least one MEMS package 500 include one or more of a wearable device, a mobile phone, an electronic notebook, a laptop, a computer, and the like.
接下來參考圖7A至圖8A。根據本發明之另一態樣，展示具有蓋702之實例MEMS封裝700。特定言之，圖7A係MEMS封裝700之一剖切透視圖；圖7B係繪示蓋702之一部分之細節之部分7B之一細節圖；圖8A係蓋702之一透視圖；及圖8B係蓋702之一橫截面透視圖。Next, refer to Figures 7A to 8A. According to another aspect of the present invention, an example MEMS package 700 having a cover 702 is shown. Specifically, Figure 7A is a cutaway perspective view of the MEMS package 700; Figure 7B is a detail view of a portion of the cover 702 showing details; Figure 8A is a perspective view of the cover 702; and Figure 8B is a cross-sectional perspective view of the cover 702.
與MEMS封裝500類似，MEMS封裝700可包含基底基板716、經安置於基底基板716上之至少一個積體電路506(例如一ASIC)、經安置於且經連接至(若干)積體電路506之MEMS器件508(例如一MEMS壓力感測器)及經耦合至基底基板716之蓋702。MEMS封裝700亦進一步包含一或多個連接器、導線接合件、接合盤及類似物。儘管未圖示，MEMS封裝700亦可進一步包含一或多個額外層(類似於(若干)層504)。蓋702可經組態以覆蓋MEMS器件508(使得MEMS器件508被封閉在空腔714內)，且提供MEMS器件508之防水及污染防護。Similar to MEMS package 500, MEMS package 700 may include base substrate 716, at least one integrated circuit 506 (e.g., an ASIC) disposed on base substrate 716, MEMS device 508 (e.g., a MEMS pressure sensor) disposed on and connected to (several) integrated circuits 506, and lid 702 coupled to base substrate 716. MEMS package 700 also further includes one or more connectors, wire bonds, bonding pads, and the like. Although not shown, MEMS package 700 may also further include one or more additional layers (similar to layer(s) 504). The cover 702 can be configured to cover the MEMS device 508 (such that the MEMS device 508 is enclosed in the cavity 714) and provide water and contamination protection for the MEMS device 508.
蓋702類似於蓋200，因為蓋702可包含主體部分802及頂板部分804(最佳如圖8B中所示)。蓋702與蓋200不同之處在於，蓋702可由單片材料704形成為單一單片組件，使得主體部分802及頂板部分804為一單一結構。Cover 702 is similar to cover 200 in that cover 702 may include a body portion 802 and a top portion 804 (best shown in FIG. 8B ). Cover 702 differs from cover 200 in that cover 702 may be formed from a single piece of material 704 as a single monolithic component such that body portion 802 and top portion 804 are a single structure.
例如，最佳如圖7B中所示，頂板部分804可包含一個頂板層706(與蓋主體部分802整合)，其中膜708附接在頂板層706下方(例如，經由黏合劑710黏附至頂板層706)。大體上，膜708可經由黏合劑710以使得膜708可經組態以實質上阻擋一或多種液體及污染進入空腔714的一方式黏附至頂板層706。膜708類似於膜304，其中膜708由一過濾織物形成，且在一些實施例中，過濾織物可包含任何適合之ePTFE材料。黏合劑710類似於黏合劑306。在一些實例中，一疏水塗層及一疏油塗層中之至少一者可經安置於形成膜708之過濾織物上。雖然圖7B似乎繪示膜708與頂板層706之間之一間隙，但此僅繪示在膜708與頂板層706之間之黏合劑710之區域。實際上，膜708可經安置於頂板層706上，且經由黏合劑710耦合至頂板層706。For example, as best shown in FIG. 7B , the top plate portion 804 can include a top plate layer 706 (integral with the cover body portion 802), wherein the membrane 708 is attached below the top plate layer 706 (e.g., adhered to the top plate layer 706 via an adhesive 710). In general, the membrane 708 can be adhered to the top plate layer 706 via the adhesive 710 in a manner such that the membrane 708 can be configured to substantially block one or more liquids and contaminants from entering the cavity 714. The membrane 708 is similar to the membrane 304, wherein the membrane 708 is formed of a filter fabric, and in some embodiments, the filter fabric can include any suitable ePTFE material. The adhesive 710 is similar to the adhesive 306. In some examples, at least one of a hydrophobic coating and an oleophobic coating may be disposed on the filter fabric forming the membrane 708. Although FIG. 7B appears to show a gap between the membrane 708 and the top plate layer 706, this only shows the area of the adhesive 710 between the membrane 708 and the top plate layer 706. In practice, the membrane 708 may be disposed on the top plate layer 706 and coupled to the top plate layer 706 via the adhesive 710.
在一些實施例中，頂板層706可包含延伸穿過其之一或多個孔712(即，一或多個孔徑)。膜708可經組態以覆蓋(若干)孔712。(若干)孔712類似於孔308-1、308-2。在一些實例中，(若干)孔712可形成一或多個聲埠，以將空腔714中之MEMS器件508曝露於一外部(環境)環境。類似於(若干)孔308-1、308-2，(若干)孔712之形狀及(若干)孔712之數量可根據期望空氣流動面積而變化。亦應理解，類似於膜304，膜708之性質、膜708之一密度及/或膜708之一滲透性可根據一期望之防護水準(例如，其可取決於一換能器應用)而改變。在一些實例中，可以在各孔712周圍提供一密封之一方式在膜708與頂板層706之間施加黏合劑710，以實質上經由(若干)孔712阻擋流體及/或污染進入空腔714。In some embodiments, the top plate layer 706 may include one or more holes 712 (i.e., one or more apertures) extending therethrough. The membrane 708 may be configured to cover the hole(s) 712. The hole(s) 712 are similar to the holes 308-1, 308-2. In some examples, the hole(s) 712 may form one or more acoustic ports to expose the MEMS device 508 in the cavity 714 to an external (environmental) environment. Similar to the holes(s) 308-1, 308-2, the shape of the hole(s) 712 and the number of the hole(s) 712 may vary depending on the desired air flow area. It should also be understood that, similar to membrane 304, the properties of membrane 708, a density of membrane 708, and/or a permeability of membrane 708 may vary depending on a desired level of protection (e.g., which may depend on a transducer application). In some examples, adhesive 710 may be applied between membrane 708 and top sheet layer 706 in a manner that provides a seal around each hole 712 to substantially block fluid and/or contamination from entering cavity 714 through hole(s) 712.
在一些實例中，單片材料704可由包含一金屬之一導電材料形成。在一些實例中，金屬可包含但不限於不銹鋼、鍍黃銅、鍍鋁及鎳中之一或多者。大體上，蓋702之材料704可包含一種材料，或可包含具有用於保護MEMS器件508(諸如，一壓力感測器)之適合之性質之材料之任意組合。In some examples, the monolithic material 704 may be formed of a conductive material including a metal. In some examples, the metal may include, but is not limited to, one or more of stainless steel, plated brass, plated aluminum, and nickel. In general, the material 704 of the cover 702 may include one material, or may include any combination of materials having suitable properties for protecting the MEMS device 508 (e.g., a pressure sensor).
儘管圖7A至圖8B描述由一單片材料704形成之蓋702，在一些實例中，頂板部分804可為主體部分802之一分離組件，且頂板部分804可經耦合至主體部分802(例如，壓入蓋主體部分)。在一些實例中，(分離組件之)蓋702之頂板部分804及主體部分802可由一相同材料形成。在一些實例中，(分離組件之)蓋702之頂板部分804及主體部分802可由不同材料形成。Although FIGS. 7A-8B depict lid 702 formed from a single piece of material 704, in some embodiments, top portion 804 may be a separate component of body portion 802, and top portion 804 may be coupled to body portion 802 (e.g., pressed into the body portion). In some embodiments, top portion 804 and body portion 802 of lid 702 (a separate component) may be formed from the same material. In some embodiments, top portion 804 and body portion 802 of lid 702 (a separate component) may be formed from different materials.
接下來參考圖9A至圖10E，根據本發明之一態樣，展示一實例程序用於製造一或多個殼體封裝(諸如MEMS封裝500)之一或多個蓋918，其中各殼體封裝經組態以封裝一MEMS器件(例如MEMS器件508)。特定言之。圖9A至圖9F係繪示實例程序之透視圖；及圖10A至圖10E係繪示實例程序之俯視圖。Next, referring to FIGS. 9A to 10E , an example process is shown for manufacturing one or more lids 918 of one or more housing packages (such as MEMS package 500), wherein each housing package is configured to encapsulate a MEMS device (such as MEMS device 508). Specifically, FIGS. 9A to 9F are perspective views of the example process; and FIGS. 10A to 10E are top views of the example process.
參考圖9A及圖10A，在一第一步驟中，一第一(例如，底部)頂板片材902-1可經形成為具有以一第一圖案經配置之多個第一孔組904-1。在第一頂板片材902-1中，各第一孔組904-1與第一頂板組件914-1相關聯，使得第一頂板片材902-1包含多個(即，一基質)第一頂板組件(用於多個蓋)。儘管各第一孔組904-1經繪示為包含多個孔，但大體上，第一孔組904-1可包含一或多個孔。第一頂板片材902-1可由一金屬材料形成。在一些實例中，金屬材料可包含但不限於不銹鋼、鍍黃銅、鍍鋁及鎳中之一或多者。9A and 10A, in a first step, a first (e.g., bottom) top sheet 902-1 may be formed with a plurality of first hole sets 904-1 arranged in a first pattern. In the first top sheet 902-1, each first hole set 904-1 is associated with a first top assembly 914-1, such that the first top sheet 902-1 comprises a plurality (i.e., a matrix) of first top assemblies (for a plurality of lids). Although each first hole set 904-1 is depicted as comprising a plurality of holes, in general, the first hole set 904-1 may comprise one or more holes. The first top sheet 902-1 may be formed of a metal material. In some examples, the metal material may include, but is not limited to, one or more of stainless steel, brass-plated, aluminum-plated, and nickel.
參考圖9B及圖10B，在一第二步驟中，黏膠(或更大體上任何適合之黏合劑)可以一預定圖案(例如，通過黏膠印刷)經安置於第一頂板片材902-1上以形成黏膠圖案906。Referring to FIG. 9B and FIG. 10B , in a second step, adhesive (or generally any suitable adhesive) may be placed on the first top plate sheet 902-1 in a predetermined pattern (e.g., by adhesive printing) to form an adhesive pattern 906.
參考圖9C及圖10C，在一第三步驟中，膜片材908可經安置於第一頂板片材902-1上(例如，經由輥層壓)。在一些實例中，膜片材908可在一衝壓步驟(未圖示)期間被預切割，使得膜片材908可包含具有一第二圖案之多個第二孔組910。膜片材908可經安置於第一頂板片材902-1上，使得黏膠圖案906(亦在圖9C及圖10C中展示)與膜片材908之第二孔組910(具有第二圖案)對準，使得黏膠圖案906透過膜片材908之第二孔組910曝露。圖9C及圖10C亦繪示與各第一頂板組件914-1相關聯之第一孔組904-1之位置。膜片材908可由一過濾織物形成，且可經組態以實質上阻擋一或多種液體及污染通過。在一些實施例中，過濾織物可包含任何適合之ePTFE材料。在一些實例中，一疏水塗層及一疏油塗層中之至少一者可經安置於膜片材908之至少一部分上。9C and 10C , in a third step, the membrane sheet 908 may be disposed on the first top sheet 902-1 (e.g., by roller pressing). In some examples, the membrane sheet 908 may be pre-cut during a stamping step (not shown) so that the membrane sheet 908 may include a plurality of second hole groups 910 having a second pattern. The membrane sheet 908 may be disposed on the first top sheet 902-1 so that the adhesive pattern 906 (also shown in FIGS. 9C and 10C ) is aligned with the second hole group 910 (having the second pattern) of the membrane sheet 908 so that the adhesive pattern 906 is exposed through the second hole group 910 of the membrane sheet 908. Figures 9C and 10C also illustrate the location of the first hole group 904-1 associated with each first top plate assembly 914-1. The membrane sheet 908 can be formed of a filter fabric and can be configured to substantially block one or more liquids and contaminants from passing therethrough. In some embodiments, the filter fabric can include any suitable ePTFE material. In some embodiments, at least one of a hydrophobic coating and an oleophobic coating can be disposed on at least a portion of the membrane sheet 908.
參考圖9D及圖10D，在一第四步驟中，第二(例如，頂部)頂板片材902-2被圖案化具有多個第三孔組904-2，且經安置於膜片材908上(例如，經由條帶層壓)。第三孔組904-2具有對應於第一孔組904-1之第一圖案且與第一孔組904-1之第一圖案對準之一第三圖案。在第二頂板片材902-2中，各第三孔組904-2與第二頂板組件914-2相關聯，使得第二頂板片材902-2包含多個(即，一基質)第二頂板組件(用於多個蓋)。Referring to FIG. 9D and FIG. 10D , in a fourth step, a second (e.g., top) top sheet 902-2 is patterned with a plurality of third hole groups 904-2 and is disposed on the membrane sheet 908 (e.g., by strip lamination). The third hole group 904-2 has a third pattern corresponding to the first pattern of the first hole group 904-1 and aligned with the first pattern of the first hole group 904-1. In the second top sheet 902-2, each third hole group 904-2 is associated with a second top assembly 914-2, so that the second top sheet 902-2 includes a plurality of (i.e., a substrate) second top assembly (for a plurality of covers).
藉由將第二頂板片材902-2安置於膜片材908上，黏膠圖案906(透過膜片材908之第二孔組910曝露)接觸第二頂板片材902-2，藉此將第二頂板片材902-2黏附至第一頂板片材902-1上(經由黏膠圖案906)，且將膜片材908嵌入第一頂板片材902-1與第二頂板片材材902-2之間，以形成一組合頂板片材。以此方式，(各自第一頂板片材902-1及第二頂板片材902-2之)第一孔組904-1及第三孔組904-2被膜片材908覆蓋，藉此提供組合頂板片材之防水及污染防護。第二頂板片材902-2可由一金屬材料形成。在一些實例中，金屬材料可包含但不限於不銹鋼、鍍黃銅、鍍鋁及鎳中之一或多者。By placing the second top sheet 902-2 on the membrane sheet 908, the adhesive pattern 906 (exposed through the second hole group 910 of the membrane sheet 908) contacts the second top sheet 902-2, thereby adhering the second top sheet 902-2 to the first top sheet 902-1 (via the adhesive pattern 906), and the membrane sheet 908 is embedded between the first top sheet 902-1 and the second top sheet 902-2 to form a combined top sheet. In this way, the first hole group 904-1 and the third hole group 904-2 (of the first roof sheet 902-1 and the second roof sheet 902-2, respectively) are covered by the membrane sheet 908, thereby providing waterproof and pollution protection for the combined roof sheet. The second roof sheet 902-2 can be formed of a metal material. In some examples, the metal material can include but is not limited to one or more of stainless steel, brass-plated, aluminum-plated, and nickel.
參考圖9E及圖10E，在一第五步驟中，條帶衝壓(strip punching)可被應用至組合頂板片材(形成於第四步驟中)以形成數個盤，其中各盤表示蓋918之頂板部分912(圖9F)。頂板部分912包含嵌入於第一頂板組件914-1與第二頂板組件914-2之間之膜片材908之一部分。頂板部分912亦包含第一頂板組件914-1中之第一孔組904-1(如圖9F中所示)及第二頂板組件914-2中之第三孔組904-2，其中膜片材之一部分覆蓋第一及第三孔組904-1,904-2。以此方式，頂板部分912允許一MEMS器件經曝露於一外部環境，同時實質上阻擋流體及/或污染進入蓋918之一內部。9E and 10E, in a fifth step, strip punching may be applied to the assembled top sheet (formed in the fourth step) to form a plurality of disks, wherein each disk represents a top portion 912 (FIG. 9F) of a cover 918. Top portion 912 includes a portion of membrane sheet 908 embedded between a first top assembly 914-1 and a second top assembly 914-2. Top portion 912 also includes a first hole group 904-1 in the first top assembly 914-1 (as shown in FIG. 9F) and a third hole group 904-2 in the second top assembly 914-2, wherein a portion of the membrane sheet covers the first and third hole groups 904-1, 904-2. In this manner, top plate portion 912 allows a MEMS device to be exposed to an external environment while substantially blocking fluids and/or contaminants from entering an interior portion of cover 918.
參考圖9F，在一第六步驟中，頂板部分912(在第五步驟處形成)可經耦合至主體部分916，以形成用於一MEMS封裝(例如MEMS封裝500)之蓋918。在一些實例中，頂板部分912可經壓配合主體部分916。在一些實例中，可在壓配合程序前及/或期間加熱主體部分916及/或頂板部分912。在一些實例中，可使用一導電黏合劑(諸如，一導電環氧樹脂)代替壓配合程序或作為壓配合程序之一部分。Referring to FIG. 9F , in a sixth step, the top plate portion 912 (formed at the fifth step) can be coupled to the body portion 916 to form a lid 918 for a MEMS package (e.g., MEMS package 500). In some examples, the top plate portion 912 can be press-fitted to the body portion 916. In some examples, the body portion 916 and/or the top plate portion 912 can be heated before and/or during the press-fit process. In some examples, a conductive adhesive (e.g., a conductive epoxy) can be used instead of or as part of the press-fit process.
主體部分916可由一金屬材料形成。在一些實例中，金屬材料可包含但不限於不銹鋼、鍍黃銅、鍍鋁及鎳中之一或多者。在一些實例中，蓋918之頂板部分912及主體部分916可由一相同材料形成。在一些實例中，蓋918之頂板部分912及主體部分916可由不同材料形成。The main body portion 916 may be formed of a metal material. In some examples, the metal material may include, but is not limited to, one or more of stainless steel, brass-plated, aluminum-plated, and nickel. In some examples, the top plate portion 912 and the main body portion 916 of the cover 918 may be formed of the same material. In some examples, the top plate portion 912 and the main body portion 916 of the cover 918 may be formed of different materials.
在一些實施例中。圖9A至圖10E中所展示之程序可表示用於將ePTFE過濾器嵌入金屬蓋918中之一實例程序。In some embodiments, the process shown in FIGS. 9A to 10E may represent an example process for embedding an ePTFE filter in a metal cover 918.
雖然已根據某些實施例討論本發明，但應當限定本發明不限於此。本文以實例之方式解釋實施例，但可採用數種修改、變化及其他實施例，該等修改、變化及其他實施例仍然在本發明之範疇內經採用。Although the present invention has been discussed based on certain embodiments, it should be limited to these. The embodiments are explained in this article by way of example, but several modifications, variations and other embodiments may be adopted, and such modifications, variations and other embodiments are still adopted within the scope of the present invention.
200:蓋200: Cover
202:主體部分202: Main body
204:頂板部分204: Top plate part
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163245715P | 2021-09-17 | 2021-09-17 | |
| US63/245,715 | 2021-09-17 | ||
| US17/733,720 | 2022-04-29 | ||
| US17/733,720US12428292B2 (en) | 2021-09-17 | 2022-04-29 | Waterproof mems pressure sensor package with a metal lid and an embedded ePTFE filter and process of making |
| Publication Number | Publication Date |
|---|---|
| TW202313447A TW202313447A (en) | 2023-04-01 |
| TWI861553Btrue TWI861553B (en) | 2024-11-11 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111133807ATWI861553B (en) | 2021-09-17 | 2022-09-07 | Microelectromechanical system (mems) package, method of making the same, and method of manufacturing a plurality of housing packages |
| Country | Link |
|---|---|
| TW (1) | TWI861553B (en) |
| WO (1) | WO2023043596A1 (en) |
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| TW202313447A (en) | 2023-04-01 |
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