TWI854902B - Heat dissipation equipment - Google Patents

Abstract

A heat dissipation equipment includes a heat dissipation substrate, a microneedle injector, a plurality of piezoelectric elements and a pump. The heat dissipation substrate includes a first surface and a second surface opposite to the first surface. The first surface is configured to contact with an element to be cooled down. The microneedle injector includes a third surface and a plurality of pinholes. The third surface and the second surface define a space therebetween. The pinholes are distributed on the third surface and communicated with the space. The piezoelectric elements are separated from each other and connected between the heat dissipation substrate and the microneedle injector. The pinholes are located between the piezoelectric elements. The pump is connected to the microneedle injector, and is signally connected to the piezoelectric elements.

Description

Translated fromChinese

散熱設備Cooling equipment

本發明是關於一種散熱設備，且特別是一種利用流體態變化特性的散熱設備。The present invention relates to a heat dissipation device, and in particular to a heat dissipation device utilizing the changing characteristics of a fluid.

隨著人們生活水平的不斷提升，伺服器在人們生活中的重要性也變得越來越高。面對伺服器龐大的需求，各大廠商也在致力提高其品牌的市場競爭力。As people's living standards continue to improve, servers are becoming more and more important in people's lives. Facing the huge demand for servers, major manufacturers are also working hard to improve the market competitiveness of their brands.

舉例而言，當伺服器在運作時，若其產生的熱能過量，可能會影響到伺服器的運作效率甚至對伺服器造成損壞。因此，如何在可靠的情況下讓伺服器進行有效的散熱，無疑是業界相當重視的課題。For example, when a server is running, if it generates excessive heat, it may affect the server's operating efficiency or even damage the server. Therefore, how to effectively dissipate heat from the server in a reliable manner is undoubtedly a topic of great importance in the industry.

本發明之目的之一在於提供一種散熱設備，其能持續地對待散熱元件進行高效率的散熱。One of the purposes of the present invention is to provide a heat dissipation device that can continuously and efficiently dissipate heat from a heat dissipation element.

根據本發明的一實施方式，一種散熱設備包含散熱載板、微針注射器、複數個壓電元件以及幫浦。散熱載板包含相對之第一表面以及第二表面，第一表面配置以抵接待散熱元件。微針注射器包含第三表面以及複數個針孔，第三表面與第二表面之間定義一個空間，針孔分布於第三表面並連通上述之空間。壓電元件彼此分離並連接於散熱載板與微針注射器之間，針孔位於壓電元件之間。幫浦連接微針注射器，並訊號連接壓電元件。According to one embodiment of the present invention, a heat dissipation device includes a heat dissipation carrier, a microneedle syringe, a plurality of piezoelectric elements and a pump. The heat dissipation carrier includes a first surface and a second surface opposite to each other, and the first surface is configured to abut against the heat dissipation element. The microneedle syringe includes a third surface and a plurality of pinholes, and a space is defined between the third surface and the second surface. The pinholes are distributed on the third surface and connected to the above-mentioned space. The piezoelectric elements are separated from each other and connected between the heat dissipation carrier and the microneedle syringe, and the pinholes are located between the piezoelectric elements. The pump is connected to the microneedle syringe, and the signal is connected to the piezoelectric element.

在本發明一或多個實施方式中，上述之針孔呈矩陣分布。In one or more embodiments of the present invention, the pinholes are distributed in a matrix.

在本發明一或多個實施方式中，上述之幫浦為蠕動幫浦。In one or more embodiments of the present invention, the pump is a peristaltic pump.

在本發明一或多個實施方式中，上述之第二表面具親水性。In one or more embodiments of the present invention, the second surface is hydrophilic.

在本發明一或多個實施方式中，上述之散熱設備更包含風扇模組。風扇模組配置以朝向空間送風。In one or more embodiments of the present invention, the heat dissipation device further comprises a fan module. The fan module is configured to supply air toward the space.

在本發明一或多個實施方式中，上述之壓電元件定義相對之第一開口以及第二開口。上述之空間連通第一開口以及第二開口，風扇模組配置以通過第一開口朝向上述之空間送風。散熱設備更包含外部熱交換機以及排氣管線。外部熱交換機配置以凝結熱風。排氣管線連接第二開口以及外部熱交換機。In one or more embodiments of the present invention, the piezoelectric element defines a first opening and a second opening opposite to each other. The space is connected to the first opening and the second opening, and the fan module is configured to supply air to the space through the first opening. The heat dissipation device further includes an external heat exchanger and an exhaust pipe. The external heat exchanger is configured to condense hot air. The exhaust pipe is connected to the second opening and the external heat exchanger.

在本發明一或多個實施方式中，上述之散熱設備更包含集液槽。集液槽連接外部熱交換機以及微針注射器。In one or more embodiments of the present invention, the heat dissipation device further comprises a liquid collecting tank, which is connected to an external heat exchanger and a microneedle injector.

在本發明一或多個實施方式中，上述之第三表面與第二表面之間相隔第一距離，第一距離之範圍為2.997公釐與5.191公釐之間。In one or more embodiments of the present invention, the third surface is spaced from the second surface by a first distance, and the first distance is in a range of 2.997 mm to 5.191 mm.

在本發明一或多個實施方式中，每一上述之針孔具有直徑，直徑為2.997公釐。In one or more embodiments of the present invention, each of the pinholes has a diameter of 2.997 mm.

在本發明一或多個實施方式中，上述之針孔中相鄰之兩者相隔第二距離，第二距離之範圍為4.238公釐與5.994公釐之間。In one or more embodiments of the present invention, two adjacent pinholes are separated by a second distance, and the second distance ranges from 4.238 mm to 5.994 mm.

本發明上述實施方式至少具有以下優點：The above-mentioned embodiments of the present invention have at least the following advantages:

（1）當水珠的體積因蒸發而縮小且不再接觸到微針注射器的第三表面時，水珠因表面張力而對微針注射器提供的承托力亦隨之消失，使得微針注射器的重量將主要由壓電元件承托，造成壓電元件得承受更大的壓力。當壓電元件承受的壓力改變時，其電壓亦隨之改變。此時，壓電元件將發送電壓訊號至幫浦，從而使幫浦驅動微針注射器向空間擠水以形成水珠，並讓新形成的水珠繼續吸收從待散熱元件發出的熱能。如此一來，散熱設備能持續地對待散熱元件進行散熱。(1) When the volume of the water droplets shrinks due to evaporation and no longer contacts the third surface of the microneedle syringe, the support force provided by the water droplets to the microneedle syringe due to surface tension also disappears, so that the weight of the microneedle syringe will be mainly supported by the piezoelectric element, causing the piezoelectric element to bear greater pressure. When the pressure on the piezoelectric element changes, its voltage also changes. At this time, the piezoelectric element will send a voltage signal to the pump, so that the pump drives the microneedle syringe to squeeze water into the space to form water droplets, and the newly formed water droplets continue to absorb the heat energy emitted by the heat dissipation element. In this way, the heat dissipation device can continuously dissipate heat from the heat dissipation element.

（2）由於水珠在吸收從待散熱元件發出的熱能後進行態變化而蒸發成為氣體，因此能對待散熱元件進行高效率的散熱。(2) Since the water droplets change state and evaporate into gas after absorbing the heat energy emitted by the heat dissipation component, they can efficiently dissipate heat from the heat dissipation component.

（3）當外部熱交換機把從水珠升溫而成的蒸發氣體凝結後，被凝結而成的液態水份會被集液槽收集，並於幫浦啟動時流向微針注射器而再次於空間形成為水珠。如此一來，水份可於散熱設備內形成流體循環，以利散熱設備能夠持續運作。(3) When the external heat exchanger condenses the evaporated gas formed by the water droplets, the condensed liquid water will be collected by the sump and flow to the microneedle syringe when the pump is started to form water droplets in the space again. In this way, the water can form a fluid circulation in the heat dissipation device, so that the heat dissipation device can continue to operate.

以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之，而在所有圖式中，相同的標號將用於表示相同或相似的元件。且若實施上為可能，不同實施例的特徵係可以交互應用。The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not necessary. In addition, in order to simplify the drawings, some commonly used structures and components will be shown in the drawings in a simple schematic manner, and in all drawings, the same reference numerals will be used to represent the same or similar components. And if it is possible in practice, the features of different embodiments can be applied interchangeably.

除非另有定義，本文所使用的所有詞彙（包括技術和科學術語）具有其通常的意涵，其意涵係能夠被熟悉此領域者所理解。更進一步的說，上述之詞彙在普遍常用之字典中之定義，在本說明書的內容中應被解讀為與本發明相關領域一致的意涵。除非有特別明確定義，這些詞彙將不被解釋為理想化的或過於正式的意涵。Unless otherwise defined, all terms (including technical and scientific terms) used herein have their usual meanings, which are understood by those familiar with this field. Furthermore, the definitions of the above terms in commonly used dictionaries should be interpreted in the content of this specification as meanings consistent with the relevant fields of the present invention. Unless otherwise clearly defined, these terms will not be interpreted as idealized or overly formal meanings.

請參照第1～2圖。第1圖為繪示依照本發明一實施方式之散熱設備100的局部剖面示意圖。第2圖為繪示第1圖沿線段A-A的剖視圖。在本實施方式中，如第1～2圖所示，一種散熱設備100，適用於促進來自伺服器中發熱電子構件（例如是處理器）的熱交換，包含散熱載板110、微針注射器120、複數個壓電元件130以及幫浦140。散熱載板110包含相對之第一表面111以及第二表面112，散熱載板110的第一表面111配置以抵接待散熱元件200，即例如是上述的發熱電子構件。微針注射器120包含第三表面121，微針注射器120的第三表面121與散熱載板110的第二表面112之間定義空間SP，空間SP適於容置複數個水珠WD，且水珠WD可同時接觸第三表面121與第二表面112，並因其表面張力而對微針注射器120提供若干的承托力。壓電元件130彼此分離並連接於散熱載板110與微針注射器120之間，壓電元件130之間亦定義空間SP，即水珠WD亦位於壓電元件130之間。幫浦140連接微針注射器120，並訊號連接壓電元件130。在實務的應用中，幫浦140可為蠕動幫浦，但本發明並不以此為限。Please refer to Figures 1 and 2. Figure 1 is a partial cross-sectional schematic diagram of aheat dissipation device 100 according to an embodiment of the present invention. Figure 2 is a cross-sectional view along line segment A-A of Figure 1. In this embodiment, as shown in Figures 1 and 2, aheat dissipation device 100 is suitable for promoting heat exchange from a heat-generating electronic component (such as a processor) in a server, and includes aheat dissipation carrier 110, amicroneedle injector 120, a plurality ofpiezoelectric elements 130, and apump 140. Theheat dissipation carrier 110 includes afirst surface 111 and asecond surface 112 opposite to each other, and thefirst surface 111 of theheat dissipation carrier 110 is configured to abut against aheat dissipation element 200, such as the above-mentioned heat-generating electronic component. Themicroneedle syringe 120 includes athird surface 121. A space SP is defined between thethird surface 121 of themicroneedle syringe 120 and thesecond surface 112 of theheat sink 110. The space SP is suitable for accommodating a plurality of water droplets WD. The water droplets WD can contact thethird surface 121 and thesecond surface 112 at the same time, and provide a certain supporting force to themicroneedle syringe 120 due to their surface tension. Thepiezoelectric elements 130 are separated from each other and connected between theheat sink 110 and themicroneedle syringe 120. Thepiezoelectric elements 130 also define a space SP, that is, the water droplets WD are also located between thepiezoelectric elements 130. Thepump 140 is connected to themicroneedle syringe 120 and is signal-connected to thepiezoelectric element 130. In practical applications, thepump 140 can be a peristaltic pump, but the present invention is not limited thereto.

在實務的應用中，當要使用散熱設備100對待散熱元件200進行散熱時，使用者以散熱載板110的第一表面111抵接待散熱元件200，而待散熱元件200的熱能經過散熱載板110而傳送至水珠WD，使得水珠WD的溫度上升甚至蒸發為氣體GS，從而達到對待散熱元件200散熱的效果。當水珠WD的體積因蒸發而縮小且不再接觸到微針注射器120的第三表面121時，水珠WD因表面張力而對微針注射器120提供的承托力亦隨之消失，使得微針注射器120的重量將主要由壓電元件130承托，造成壓電元件130得承受更大的壓力。當壓電元件130承受的壓力改變時，其電壓亦隨之改變。此時，壓電元件130將發送電壓訊號至幫浦140，從而使幫浦140驅動微針注射器120向空間SP擠水以形成水珠WD，並讓新形成的水珠WD繼續吸收從待散熱元件200發出的熱能。如此一來，散熱設備100能持續地對待散熱元件200進行散熱。在實務的應用中，壓電元件130可為壓電墊圈，但本發明並不以此為限。In practical applications, when theheat dissipation device 100 is used to dissipate heat from thecomponent 200 to be dissipated, the user uses thefirst surface 111 of theheat dissipation carrier 110 to contact thecomponent 200 to be dissipated, and the heat energy of thecomponent 200 to be dissipated is transferred to the water droplets WD through theheat dissipation carrier 110, so that the temperature of the water droplets WD rises or even evaporates into gas GS, thereby achieving the effect of dissipating heat from thecomponent 200 to be dissipated. When the volume of the water droplets WD shrinks due to evaporation and no longer contacts thethird surface 121 of themicroneedle syringe 120, the supporting force provided by the water droplets WD to themicroneedle syringe 120 due to surface tension also disappears, so that the weight of themicroneedle syringe 120 will be mainly supported by thepiezoelectric element 130, causing thepiezoelectric element 130 to bear greater pressure. When the pressure on thepiezoelectric element 130 changes, its voltage also changes accordingly. At this time, thepiezoelectric element 130 will send a voltage signal to thepump 140, so that thepump 140 drives themicroneedle injector 120 to squeeze water into the space SP to form water droplets WD, and the newly formed water droplets WD continue to absorb the heat energy emitted from theheat dissipation element 200. In this way, theheat dissipation device 100 can continuously dissipate heat from theheat dissipation element 200. In practical applications, thepiezoelectric element 130 can be a piezoelectric gasket, but the present invention is not limited to this.

再者，由於水珠WD在吸收從待散熱元件200發出的熱能後進行態變化而蒸發成為氣體GS，因此能對待散熱元件200進行高效率的散熱。Furthermore, since the water droplets WD undergo a state change and evaporate into the gas GS after absorbing the heat energy emitted from theheat dissipation element 200, theheat dissipation element 200 can be efficiently dissipated.

具體而言，如第1圖所示，微針注射器120的第三表面121與散熱載板110的第二表面112之間相隔第一距離D1。較佳地，第一距離D1之範圍為2.997公釐與5.191公釐之間，以利位於空間SP的水珠WD可同時接觸第三表面121與第二表面112。再者，散熱載板110的第二表面112具親水性，以利從微針注射器120擠出的水份可於第二表面112上呈現水珠狀。在實務的應用中，使用者可於散熱載板110的第二表面112進行適合的表面處理，例如對第二表面112進行化學蝕刻或於第二表面112添加親水塗層，以提升第二表面112的親水性，但本發明並不以此為限。Specifically, as shown in FIG. 1 , thethird surface 121 of themicroneedle syringe 120 is spaced from thesecond surface 112 of theheat sink 110 by a first distance D1. Preferably, the first distance D1 is in the range of 2.997 mm to 5.191 mm, so that the water droplets WD in the space SP can contact thethird surface 121 and thesecond surface 112 at the same time. Furthermore, thesecond surface 112 of theheat sink 110 is hydrophilic, so that the water squeezed out of themicroneedle syringe 120 can appear as water droplets on thesecond surface 112. In practical applications, the user may perform appropriate surface treatment on thesecond surface 112 of theheat sink 110 , such as chemically etching thesecond surface 112 or adding a hydrophilic coating on thesecond surface 112 , to enhance the hydrophilicity of thesecond surface 112 , but the present invention is not limited thereto.

請參照第3圖。第3圖為繪示第1圖沿線段B-B的剖視圖，其中水珠WD被省略。在本實施方式中，如第3圖所示，微針注射器120包含複數個針孔PH，而針孔PH分布於第三表面121並連通空間SP。進一步而言，針孔PH位於壓電元件130之間，且呈矩陣分布，因此，從微針注射器120的針孔PH擠出而形成的水珠WD也可呈矩陣分布。再者，針孔PH中相鄰之兩者相隔第二距離D2。較佳地，第二距離D2之範圍為4.238公釐與5.994公釐之間，以優化空間SP的利用。Please refer to FIG. 3. FIG. 3 is a cross-sectional view along line segment B-B of FIG. 1, in which water droplets WD are omitted. In the present embodiment, as shown in FIG. 3, themicroneedle syringe 120 includes a plurality of pinholes PH, and the pinholes PH are distributed on thethird surface 121 and connected to the space SP. Furthermore, the pinholes PH are located between thepiezoelectric elements 130 and are distributed in a matrix, so the water droplets WD formed by squeezing out the pinholes PH of themicroneedle syringe 120 may also be distributed in a matrix. Furthermore, two adjacent pinholes PH are separated by a second distance D2. Preferably, the range of the second distance D2 is between 4.238 mm and 5.994 mm to optimize the utilization of the space SP.

而且，如第3圖所示，每一針孔PH具有直徑DA。較佳地，直徑DA相同於常規注射針頭編號9的內徑大小，亦即直徑DA可為2.997公釐，以利從微針注射器120的針孔PH擠出的水份通過懸滴法而形成水珠狀。Moreover, as shown in FIG. 3 , each needle hole PH has a diameter DA. Preferably, the diameter DA is equal to the inner diameter of a conventional injection needle No. 9, that is, the diameter DA can be 2.997 mm, so that the water squeezed out from the needle hole PH of themicroneedle syringe 120 can form a water drop shape through the hanging drop method.

進一步而言，在本實施方式中，如第1圖所示，散熱設備100更包含風扇模組150。風扇模組150配置以朝向空間SP送風，亦即對空間SP提供氣流AF，以利把空間SP內的熱氣體GS帶走，從而提高散熱設備100的散熱效率。Furthermore, in this embodiment, as shown in FIG. 1 , theheat dissipation device 100 further includes afan module 150. Thefan module 150 is configured to supply air toward the space SP, that is, to provide an airflow AF to the space SP, so as to take away the hot gas GS in the space SP, thereby improving the heat dissipation efficiency of theheat dissipation device 100.

更具體而言，如第3圖所示，壓電元件130之間定義相對之第一開口OP1以及第二開口OP2。如第1、3圖所示，空間SP連通第一開口OP1以及第二開口OP2，而風扇模組150配置以通過第一開口OP1朝向空間SP送風。More specifically, as shown in Fig. 3, a first opening OP1 and a second opening OP2 are defined between thepiezoelectric element 130. As shown in Figs. 1 and 3, the space SP connects the first opening OP1 and the second opening OP2, and thefan module 150 is configured to supply air toward the space SP through the first opening OP1.

再者，如第1圖所示，散熱設備100更包含外部熱交換機160以及排氣管線170。外部熱交換機160配置以凝結熱風，而排氣管線170連接第二開口OP2以及外部熱交換機160。具體而言，為避免高濕度氣體GS對容置散熱設備100的電子系統或器材造成負面的影響，從水珠WD升溫而成的蒸發氣體GS可從空間SP通過第二開口OP2並透過排氣管線170而傳送至外部熱交換機160，以讓外部熱交換機160將之凝結。Furthermore, as shown in FIG. 1 , theheat dissipation device 100 further includes anexternal heat exchanger 160 and anexhaust pipe 170. Theexternal heat exchanger 160 is configured to condense hot air, and theexhaust pipe 170 connects the second opening OP2 and theexternal heat exchanger 160. Specifically, in order to prevent the high-humidity gas GS from causing a negative impact on the electronic system or equipment accommodating theheat dissipation device 100, the evaporated gas GS formed by the water droplets WD being heated can be transmitted from the space SP through the second opening OP2 and through theexhaust pipe 170 to theexternal heat exchanger 160, so that theexternal heat exchanger 160 can condense it.

進一步而言，如第1圖所示，散熱設備100更包含集液槽180，而集液槽180連接於外部熱交換機160與微針注射器120之間。當外部熱交換機160把從水珠WD升溫而成的蒸發氣體GS凝結後，被凝結而成的液態水份WL會被集液槽180收集，並於幫浦140啟動時流向微針注射器120而再次於空間SP形成為水珠WD。如此一來，水份可於散熱設備100內形成流體循環，以利散熱設備100能夠持續運作。Furthermore, as shown in FIG. 1 , theheat dissipation device 100 further includes aliquid collecting tank 180, and theliquid collecting tank 180 is connected between theexternal heat exchanger 160 and themicroneedle injector 120. When theexternal heat exchanger 160 condenses the evaporated gas GS formed by heating the water droplets WD, the condensed liquid water WL will be collected by theliquid collecting tank 180, and when thepump 140 is started, it will flow to themicroneedle injector 120 and form water droplets WD again in the space SP. In this way, the water can form a fluid circulation in theheat dissipation device 100, so that theheat dissipation device 100 can continue to operate.

請參照第4圖。第4圖為繪示第1圖沿線段C-C的剖視圖。在本實施方式中，如第4圖所示，當風扇模組150（風扇模組150請見第1圖）通過第一開口OP1朝向空間SP送風時，氣流AF會沿送風方向DD流經於水珠WD之間，以利把空間SP內的熱氣體GS（氣體GS請見第1圖）隨氣流AF帶走。另一方面，在沿送風方向DD上排列的兩相鄰的水珠WD之間的範圍Z，則會因氣流AF的流動而產生白努力效應，亦即範圍Z會處於低壓甚至真空狀態，這有利於提升水珠WD進行態變化而蒸發成為氣體GS的速率，從而能加強散熱設備100的散熱效率。Please refer to FIG. 4. FIG. 4 is a cross-sectional view along the line segment C-C of FIG. 1. In the present embodiment, as shown in FIG. 4, when the fan module 150 (see FIG. 1 for the fan module 150) supplies air toward the space SP through the first opening OP1, the airflow AF will flow between the water droplets WD along the air supply direction DD, so as to facilitate the hot gas GS (see FIG. 1 for the gas GS) in the space SP to be taken away with the airflow AF. On the other hand, the range Z between two adjacent water droplets WD arranged along the air supply direction DD will produce a white effort effect due to the flow of the airflow AF, that is, the range Z will be in a low pressure or even vacuum state, which is conducive to increasing the rate at which the water droplets WD undergo a state change and evaporate into the gas GS, thereby enhancing the heat dissipation efficiency of theheat dissipation device 100.

綜上所述，本發明上述實施方式所揭露的技術方案至少具有以下優點：In summary, the technical solution disclosed in the above embodiments of the present invention has at least the following advantages:

（1）當水珠的體積因蒸發而縮小且不再接觸到微針注射器的第三表面時，水珠因表面張力而對微針注射器提供的承托力亦隨之消失，使得微針注射器的重量將主要由壓電元件承托，造成壓電元件得承受更大的壓力。當壓電元件承受的壓力改變時，其電壓亦隨之改變。此時，壓電元件將發送電壓訊號至幫浦，從而使幫浦驅動微針注射器向空間擠水以形成水珠，並讓新形成的水珠繼續吸收從待散熱元件發出的熱能。如此一來，散熱設備能持續地對待散熱元件進行散熱。(1) When the volume of the water droplets shrinks due to evaporation and no longer contacts the third surface of the microneedle syringe, the support force provided by the water droplets to the microneedle syringe due to surface tension also disappears, so that the weight of the microneedle syringe will be mainly supported by the piezoelectric element, causing the piezoelectric element to bear greater pressure. When the pressure on the piezoelectric element changes, its voltage also changes. At this time, the piezoelectric element will send a voltage signal to the pump, so that the pump drives the microneedle syringe to squeeze water into the space to form water droplets, and the newly formed water droplets continue to absorb the heat energy emitted by the heat dissipation element. In this way, the heat dissipation device can continuously dissipate heat from the heat dissipation element.

（2）由於水珠在吸收從待散熱元件發出的熱能後進行態變化而蒸發成為氣體，因此能對待散熱元件進行高效率的散熱。(2) Since the water droplets change state and evaporate into gas after absorbing the heat energy emitted by the heat dissipation component, they can efficiently dissipate heat from the heat dissipation component.

（3）當外部熱交換機把從水珠升溫而成的蒸發氣體凝結後，被凝結而成的液態水份會被集液槽收集，並於幫浦啟動時流向微針注射器而再次於空間形成為水珠。如此一來，水份可於散熱設備內形成流體循環，以利散熱設備能夠持續運作。(3) When the external heat exchanger condenses the evaporated gas formed by the water droplets, the condensed liquid water will be collected by the sump and flow to the microneedle syringe when the pump is started to form water droplets in the space again. In this way, the water can form a fluid circulation in the heat dissipation device, so that the heat dissipation device can continue to operate.

在本發明的一實施例中，本發明之伺服器係可用於人工智慧（artificial intelligence，簡稱AI）運算、邊緣運算（edge computing），亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In one embodiment of the present invention, the server of the present invention can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, cloud server or Internet of Vehicles server.

雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the attached patent application.

100:散熱設備 110:散熱載板 111:第一表面 112:第二表面 120:微針注射器 121:第三表面 130:壓電元件 140:幫浦 150:風扇模組 160:外部熱交換機 170:排氣管線 180:集液槽 200:待散熱元件 A-A,B-B,C-C:線段 AF:氣流 DA:直徑 DD:送風方向 D1:第一距離 D2:第二距離 GS:氣體 OP1:第一開口 OP2:第二開口 PH:針孔 SP:空間 WD:水珠 WL:液態水份 Z:範圍100: heat dissipation device110: heat dissipation carrier111: first surface112: second surface120: microneedle syringe121: third surface130: piezoelectric element140: pump150: fan module160: external heat exchanger170: exhaust pipe180: liquid collection tank200: heat dissipation elementA-A, B-B, C-C: line segmentAF: airflowDA: diameterDD: air supply directionD1: first distanceD2: second distanceGS: gasOP1: first openingOP2: second openingPH: pinholeSP: spaceWD: water dropletsWL: liquid waterZ: range

第1圖為繪示依照本發明一實施方式之散熱設備的局部剖面示意圖。 第2圖為繪示第1圖沿線段A-A的剖視圖。 第3圖為繪示第1圖沿線段B-B的剖視圖，其中水珠被省略。 第4圖為繪示第1圖沿線段C-C的剖視圖。FIG. 1 is a schematic diagram showing a partial cross-section of a heat dissipation device according to an embodiment of the present invention.FIG. 2 is a cross-sectional view along line segment A-A of FIG. 1.FIG. 3 is a cross-sectional view along line segment B-B of FIG. 1, wherein water droplets are omitted.FIG. 4 is a cross-sectional view along line segment C-C of FIG. 1.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic storage information (please note in the order of storage institution, date, and number)NoneForeign storage information (please note in the order of storage country, institution, date, and number)None

100:散熱設備100: Heat dissipation equipment

110:散熱載板110: Heat dissipation carrier

111:第一表面111: First surface

112:第二表面112: Second surface

120:微針注射器120: Microneedle syringe

121:第三表面121: Third surface

140:幫浦140: Pump

150:風扇模組150: Fan module

160:外部熱交換機160: External heat exchanger

170:排氣管線170: Exhaust pipe

180:集液槽180: Liquid collection tank

200:待散熱元件200: Components to be cooled

A-A,B-B,C-C:線段A-A,B-B,C-C: line segment

AF:氣流AF: airflow

D1:第一距離D1: First distance

GS:氣體GS: Gas

OP1:第一開口OP1: First opening

OP2:第二開口OP2: Second opening

SP:空間SP: Space

WD:水珠WD: Water drops

WL:液態水份WL: Liquid water

Claims (10)

Translated fromChinese

一種散熱設備，包含： 一散熱載板，包含相對之一第一表面以及一第二表面，該第一表面配置以抵接一待散熱元件； 一微針注射器，包含一第三表面以及複數個針孔，該第三表面與該第二表面之間定義一空間，該些針孔分布於該第三表面並連通該空間； 複數個壓電元件，彼此分離並連接於該散熱載板與該微針注射器之間，該些針孔位於該些壓電元件之間；以及 一幫浦，連接該微針注射器，並訊號連接該些壓電元件。A heat dissipation device comprises:A heat dissipation carrier, comprising a first surface and a second surface opposite to each other, the first surface being configured to abut against a heat dissipation element;A microneedle syringe, comprising a third surface and a plurality of pinholes, a space being defined between the third surface and the second surface, the pinholes being distributed on the third surface and connecting the space;A plurality of piezoelectric elements, separated from each other and connected between the heat dissipation carrier and the microneedle syringe, the pinholes being located between the piezoelectric elements; andA pump, connected to the microneedle syringe and signal-connected to the piezoelectric elements.如請求項1所述之散熱設備，其中該些針孔呈矩陣分布。A heat dissipation device as described in claim 1, wherein the pinholes are distributed in a matrix.如請求項1所述之散熱設備，其中該幫浦為蠕動幫浦。A heat dissipation device as described in claim 1, wherein the pump is a peristaltic pump.如請求項1所述之散熱設備，其中該第二表面具親水性。A heat dissipation device as described in claim 1, wherein the second surface is hydrophilic.如請求項1所述之散熱設備，更包含： 一風扇模組，配置以朝向該空間送風。The heat dissipation device as described in claim 1 further comprises:A fan module configured to supply air toward the space.如請求項5所述之散熱設備，其中該些壓電元件定義相對之一第一開口以及一第二開口，該空間連通該第一開口以及該第二開口，該風扇模組配置以通過該第一開口朝向該空間送風，該散熱設備更包含： 一外部熱交換機，配置以凝結一熱風；以及 一排氣管線，連接該第二開口以及該外部熱交換機。A heat dissipation device as described in claim 5, wherein the piezoelectric elements define a first opening and a second opening relative to each other, the space is connected to the first opening and the second opening, the fan module is configured to supply air toward the space through the first opening, and the heat dissipation device further includes:an external heat exchanger configured to condense hot air; andan exhaust duct connecting the second opening and the external heat exchanger.如請求項6所述之散熱設備，更包含： 一集液槽，連接該外部熱交換機以及該微針注射器。The heat dissipation device as described in claim 6 further comprises:A liquid collecting tank connected to the external heat exchanger and the microneedle injector.如請求項1所述之散熱設備，其中該第三表面與該第二表面之間相隔一第一距離，該第一距離之範圍為2.997公釐與5.191公釐之間。A heat dissipation device as described in claim 1, wherein the third surface is separated from the second surface by a first distance, and the first distance ranges from 2.997 mm to 5.191 mm.如請求項1所述之散熱設備，其中每一該些針孔具有一直徑，該直徑為2.997公釐。A heat dissipation device as described in claim 1, wherein each of the pinholes has a diameter of 2.997 mm.如請求項1所述之散熱設備，其中該些針孔中相鄰之兩者相隔一第二距離，該第二距離之範圍為4.238公釐與5.994公釐之間。A heat dissipation device as described in claim 1, wherein two adjacent pinholes are separated by a second distance, and the range of the second distance is between 4.238 mm and 5.994 mm.

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