TWI841264B

Movatterモバイル変換

Info

Publication number: TWI841264B
Application number: TW112107150A
Authority: TW
Inventors: 吳宇軒; 沈芾雲; 鐘福偉; 劉方超
Original assignee: 大陸商鵬鼎控股（深圳）股份有限公司; 大陸商慶鼎精密電子（淮安）有限公司; 鵬鼎科技股份有限公司
Priority date: 2023-02-16
Filing date: 2023-02-24
Publication date: 2024-05-01
Also published as: CN118510146A; TW202435497A

Abstract

Description

Translated fromChinese

傳輸太赫茲頻率訊號的電路板及其製造方法Circuit board for transmitting terahertz frequency signal and manufacturing method thereof

本申請是有關於一種電路板及其製造方法，且特別是有關於一種傳輸太赫茲頻率訊號的電路板及其製造方法。The present application relates to a circuit board and a manufacturing method thereof, and in particular to a circuit board for transmitting terahertz frequency signals and a manufacturing method thereof.

傳統發射/接收電路與天線之間的訊號傳輸都是透過有線的方式傳輸，傳輸的方法包括使用微帶線、帶狀線、同軸電纜等。然而，即使發射/接收電路小型化製成為晶片，晶片與天線以有線傳輸還是會佔據較多空間，不利於行動裝置（例如手機或平板）小型化的發展。目前還有藉由天線封裝技術（Antenna in Package, AiP）將天線與發射/接收電路整合成集成電路（晶片），成為完整的收發器模組。但天線封裝技術的製程仍具有相當的困難度，導致目前天線封裝的良率仍不理想。Traditionally, the signal transmission between the transmitting/receiving circuit and the antenna is transmitted through wires, including the use of microstrip lines, strip lines, coaxial cables, etc. However, even if the transmitting/receiving circuit is miniaturized into a chip, the chip and the antenna will still take up more space for wired transmission, which is not conducive to the miniaturization of mobile devices (such as mobile phones or tablets). Currently, the antenna and the transmitting/receiving circuit are integrated into an integrated circuit (chip) through the antenna packaging technology (Antenna in Package, AiP) to become a complete transceiver module. However, the manufacturing process of antenna packaging technology is still quite difficult, resulting in the current antenna packaging yield is still not ideal.

本發明至少一實施例提供一種傳輸太赫茲頻率訊號的電路板及其製造方法，其能使發射/接收電路與天線之間以無線傳輸的方式進行訊號傳輸。At least one embodiment of the present invention provides a circuit board for transmitting terahertz frequency signals and a manufacturing method thereof, which can enable signal transmission between a transmitting/receiving circuit and an antenna in a wireless transmission manner.

本發明至少一實施例所提供的傳輸太赫茲頻率訊號的電路板包括介電層、第一金屬圖案層、第二金屬圖案層、至少一收發天線以及至少一電磁波收發模組。第一金屬圖案層具有至少一輻射孔。第一金屬圖案層、第二金屬圖案層與介電層堆疊，且介電層設置在第一金屬圖案層和第二金屬圖案層之間。收發天線設置於介電層對應輻射孔處，且垂直投影與輻射孔重疊。電磁波收發模組設置於介電層內，且電磁波收發模組與收發天線之間具有傳輸距離。在電磁波收發模組產生電磁波訊號時，其中電磁波訊號的頻率在太赫茲頻段的範圍內，收發天線接收電磁波訊號而輻射電磁波，電磁波從輻射孔向外輻射，其中電磁波的頻率與電磁波訊號的頻率相同。在收發天線接收到從輻射孔外傳來的電磁波時，收發天線將電磁波輻射至電磁波收發模組。At least one embodiment of the present invention provides a circuit board for transmitting terahertz frequency signals, comprising a dielectric layer, a first metal pattern layer, a second metal pattern layer, at least one transceiver antenna, and at least one electromagnetic wave transceiver module. The first metal pattern layer has at least one radiation hole. The first metal pattern layer, the second metal pattern layer and the dielectric layer are stacked, and the dielectric layer is disposed between the first metal pattern layer and the second metal pattern layer. The transceiver antenna is disposed at the dielectric layer corresponding to the radiation hole, and the vertical projection overlaps with the radiation hole. The electromagnetic wave transceiver module is disposed in the dielectric layer, and there is a transmission distance between the electromagnetic wave transceiver module and the transceiver antenna. When the electromagnetic wave transceiver module generates an electromagnetic wave signal, wherein the frequency of the electromagnetic wave signal is within the terahertz frequency band, the transceiver antenna receives the electromagnetic wave signal and radiates electromagnetic waves, and the electromagnetic waves radiate outward from the radiation hole, wherein the frequency of the electromagnetic waves is the same as the frequency of the electromagnetic wave signal. When the transceiver antenna receives the electromagnetic wave transmitted from outside the radiation hole, the transceiver antenna radiates the electromagnetic wave to the electromagnetic wave transceiver module.

在本發明至少一實施例中，輻射孔的長度在電磁波的波長的四分之一倍至二分之一倍的範圍。In at least one embodiment of the present invention, the length of the radiation hole is in the range of one quarter to one half of the wavelength of the electromagnetic wave.

在本發明至少一實施例中，傳輸距離在電磁波的波長的四分之一倍至二分之一倍的範圍。In at least one embodiment of the present invention, the transmission distance is in the range of one quarter to one half of the wavelength of the electromagnetic wave.

在本發明至少一實施例中，收發天線為陣列天線，且包括多個天線單元，天線單元間隔排列，且任兩相鄰的天線單元之間的間距在電磁波的波長的八分之一倍至四分之一倍的範圍。In at least one embodiment of the present invention, the transceiver antenna is an array antenna and includes a plurality of antenna units. The antenna units are arranged at intervals, and the distance between any two adjacent antenna units is in the range of one eighth to one quarter of the wavelength of the electromagnetic wave.

在本發明至少一實施例中，電路板包括多個電磁波收發模組，任兩相鄰的電磁波收發模組之間的間距為大於電磁波的波長的二倍。In at least one embodiment of the present invention, the circuit board includes a plurality of electromagnetic wave transceiver modules, and the distance between any two adjacent electromagnetic wave transceiver modules is greater than twice the wavelength of the electromagnetic wave.

在本發明至少一實施例中，電路板包括多個電磁波收發模組與至少一屏蔽結構，屏蔽結構設置在任兩相鄰的電磁波收發模組之間。In at least one embodiment of the present invention, the circuit board includes a plurality of electromagnetic wave transceiver modules and at least one shielding structure, and the shielding structure is disposed between any two adjacent electromagnetic wave transceiver modules.

本發明至少一實施例所提供的製造傳輸太赫茲頻率訊號的電路板的方法包括：提供第一基板，第一基板包括第一基板介電層及第一基板金屬層，其中第一基板介電層和第一基板金屬層堆疊，第一基板金屬層具有至少一輻射孔，至少一收發天線設置於第一基板介電層對應輻射孔處，且其垂直投影與輻射孔重疊；提供第二基板，第二基板包括第二基板介電層及第二基板金屬層，其中第二基板介電層和第二基板金屬層堆疊，至少一電磁波收發模組設置於第二基板介電層內；以及將第一基板和第二基板層疊設置，並使電磁波收發模組對準收發天線。At least one embodiment of the present invention provides a method for manufacturing a circuit board for transmitting terahertz frequency signals, including: providing a first substrate, the first substrate including a first substrate dielectric layer and a first substrate metal layer, wherein the first substrate dielectric layer and the first substrate metal layer are stacked, the first substrate metal layer has at least one radiation hole, at least one transceiver antenna is arranged at the first substrate dielectric layer corresponding to the radiation hole, and its vertical projection overlaps with the radiation hole; providing a second substrate, the second substrate including a second substrate dielectric layer and a second substrate metal layer, wherein the second substrate dielectric layer and the second substrate metal layer are stacked, at least one electromagnetic wave transceiver module is arranged in the second substrate dielectric layer; and stacking the first substrate and the second substrate, and aligning the electromagnetic wave transceiver module with the transceiver antenna.

在本發明至少一實施例中，形成第一基板的步驟包括：提供第一單面板；圖案化第一單面板的金屬層，以形成輻射孔；提供雙面板；圖案化雙面板的其中一金屬層，以形成收發天線；圖案化雙面板的另一金屬層，以形成至少一孔洞，其中收發天線的垂直投影與孔洞重疊；以及將第一單面板與雙面板壓合，使第一單面板與雙面板結合，其中收發天線的垂直投影與輻射孔重疊。In at least one embodiment of the present invention, the step of forming the first substrate includes: providing a first single panel; patterning the metal layer of the first single panel to form a radiation hole; providing a double panel; patterning one of the metal layers of the double panel to form a transceiver antenna; patterning the other metal layer of the double panel to form at least one hole, wherein the vertical projection of the transceiver antenna overlaps with the hole; and pressing the first single panel and the double panel together to combine the first single panel and the double panel, wherein the vertical projection of the transceiver antenna overlaps with the radiation hole.

在本發明至少一實施例中，收發天線為多個收發天線時，提供第一基板的步驟之後更包括：在第一基板的任兩相鄰的收發天線之間形成屏蔽孔；將屏蔽結構填入屏蔽孔。In at least one embodiment of the present invention, when there are a plurality of transceiver antennas, the step of providing a first substrate further includes: forming a shielding hole between any two adjacent transceiver antennas on the first substrate; and filling the shielding structure into the shielding hole.

在本發明至少一實施例中，形成第二基板的步驟包括：提供第一介電層、接合介電層、第二單面板和電磁波收發模組，其中接合介電層位於第一介電層和第二單面板的第二介電層之間，且接合介電層形成至少一穿孔，並電磁波收發模組位於穿孔內；以及將第一介電層、接合介電層和第二單面板壓合，使第一介電層、接合介電層和第二單面板結合。In at least one embodiment of the present invention, the step of forming the second substrate includes: providing a first dielectric layer, a bonding dielectric layer, a second single-sided board and an electromagnetic wave transceiver module, wherein the bonding dielectric layer is located between the first dielectric layer and the second dielectric layer of the second single-sided board, and the bonding dielectric layer forms at least one through-hole, and the electromagnetic wave transceiver module is located in the through-hole; and pressing the first dielectric layer, the bonding dielectric layer and the second single-sided board to combine the first dielectric layer, the bonding dielectric layer and the second single-sided board.

基於上述，在以上實施例所揭示的電路板中，藉由設置在介質層內的電磁波收發模組能發出太赫茲頻段範圍的電磁波訊號以及接收電磁波，而此太赫茲頻段範圍與收發天線所輻射的毫米波的頻率範圍重疊，因而使電磁波收發模組與收發天線之間能進行無線訊號傳輸，以達到縮小電路板佈局空間的優點。Based on the above, in the circuit board disclosed in the above embodiments, the electromagnetic wave transceiver module disposed in the dielectric layer can emit electromagnetic wave signals in the terahertz frequency band and receive electromagnetic waves, and this terahertz frequency band overlaps with the frequency range of the millimeter wave radiated by the transceiver antenna, so that wireless signal transmission can be performed between the electromagnetic wave transceiver module and the transceiver antenna, thereby achieving the advantage of reducing the layout space of the circuit board.

在以下的內文中，為了清楚呈現本案的技術特徵，圖式中的元件（例如層、膜、基板以及區域等）的尺寸（例如長度、寬度、厚度與深度）會以不等比例的方式放大，而且有的元件數量會減少。因此，下文實施例的說明與解釋不受限於圖式中的元件數量以及元件所呈現的尺寸與形狀，而應涵蓋如實際製程及/或公差所導致的尺寸、形狀以及兩者的偏差。例如，圖式所示的平坦表面可以具有粗糙及/或非線性的特徵，而圖式所示的銳角可以是圓的。所以，本案圖式所呈示的元件主要是用於示意，並非旨在精準地描繪出元件的實際形狀，也非用於限制本案的申請專利範圍。In the following text, in order to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions, etc.) in the drawings will be enlarged in unequal proportions, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the dimensions and shapes presented by the elements, but should cover the dimensions, shapes, and deviations therefrom caused by actual processes and/or tolerances. For example, the flat surface shown in the drawings may have rough and/or nonlinear features, and the sharp corners shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the present invention are mainly used for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of the patent application of the present invention.

其次，本案內容中所出現的「約」、「近似」或「實質上」等這類用字不僅涵蓋明確記載的數值與數值範圍，而且也涵蓋發明所屬技術領域中具有通常知識者所能理解的可允許偏差範圍，其中此偏差範圍可由測量時所產生的誤差來決定，而此誤差例如是起因於測量系統或製程條件兩者的限制。此外，「約」可表示在上述數值的一個或多個標準偏差內，例如±30％、±20％、±10％或±5％內。本案文中所出現的「約」、「近似」或「實質上」等這類用字可依光學性質、蝕刻性質、機械性質或其他性質來選擇可以接受的偏差範圍或標準偏差，並非單以一個標準偏差來套用以上光學性質、蝕刻性質、機械性質以及其他性質等所有性質。Secondly, the words "approximately", "approximately" or "substantially" used in the present case not only cover the numerical values and numerical ranges clearly recorded, but also cover the permissible deviation range that can be understood by a person of ordinary skill in the art to which the invention belongs, wherein the deviation range can be determined by the error generated during measurement, and the error is caused by, for example, the limitation of the measurement system or the process conditions. In addition, "approximately" can mean within one or more standard deviations of the above numerical values, such as ±30%, ±20%, ±10% or ±5%. The words "approximately", "approximately" or "substantially" used in this text may select an acceptable range of deviation or standard deviation according to the optical, etching, mechanical or other properties, and do not apply a single standard deviation to all the above optical, etching, mechanical and other properties.

在本案內容中所使用的用語僅是為了描述特定實施例，非用以限制申請專利範圍。除非另有限制，否則單數形式的「一」或「該」用語也可用來表示複數形式。The terms used in this case are only for describing specific embodiments and are not intended to limit the scope of the patent application. Unless otherwise limited, the singular form "a", "an" or "the" can also be used to represent the plural form.

本申請的傳輸太赫茲頻率訊號的電路板可用於任何具有無線通訊功能的電子裝置，其能使發射/接收電路與天線之間以無線傳輸的方式進行訊號傳輸。The circuit board for transmitting terahertz frequency signals of the present application can be used in any electronic device with wireless communication function, which can enable signal transmission between the transmitting/receiving circuit and the antenna in a wireless transmission manner.

圖1A是本申請至少一實施例的傳輸太赫茲頻率訊號的電路板100的剖面示意圖。請參閱圖1A，電路板100包括多層介電層111和112、第一金屬圖案層121、第二金屬圖案層122、第三金屬圖案層123、至少一收發天線130與至少一電磁波收發模組140。以圖1A為例，電路板100包括多個收發天線130與多個電磁波收發模組140。而在其他實施例中，電路板100所包括的收發天線130與電磁波收發模組140兩者個別的數量可以僅為一個。FIG1A is a cross-sectional schematic diagram of acircuit board 100 for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A , thecircuit board 100 includes multipledielectric layers 111 and 112, a firstmetal pattern layer 121, a secondmetal pattern layer 122, a thirdmetal pattern layer 123, at least onetransceiver antenna 130, and at least one electromagneticwave transceiver module 140. Taking FIG1A as an example, thecircuit board 100 includesmultiple transceiver antennas 130 and multiple electromagneticwave transceiver modules 140. In other embodiments, the number of each of thetransceiver antenna 130 and the electromagneticwave transceiver module 140 included in thecircuit board 100 may be only one.

本申請在圖1A以兩層介電層111和112為例，但不以此為限。介電層111與介電層112位於第一金屬圖案層121、第二金屬圖案層122和第三金屬圖案層123之間，且所述介電層111和112、第一金屬圖案層121、第二金屬圖案層122與第三金屬圖案層123皆堆疊結合在一起。需注意的是，電路板100的板材材料並無限制，可使用軟性基材或硬性基材。In FIG. 1A , the present application uses twodielectric layers 111 and 112 as an example, but the present invention is not limited thereto. Thedielectric layers 111 and 112 are located between the firstmetal pattern layer 121, the secondmetal pattern layer 122, and the thirdmetal pattern layer 123, and thedielectric layers 111 and 112, the firstmetal pattern layer 121, the secondmetal pattern layer 122, and the thirdmetal pattern layer 123 are stacked and bonded together. It should be noted that the board material of thecircuit board 100 is not limited, and a soft substrate or a hard substrate can be used.

第一金屬圖案層121具有多個輻射孔124，使介電層111的上方部分暴露，此外第一金屬圖案層121上還具有走線（trace）或/及接地圖案。第二金屬圖案層122上也具有走線或/及接地圖案。第三金屬圖案層123具有多個孔洞125，且所述孔洞125在朝向第一金屬圖案層121垂直投影時分別與輻射孔124重疊。此外，第三金屬圖案層123上也具有走線或/及接地圖案。The firstmetal pattern layer 121 has a plurality ofradiation holes 124, exposing the upper portion of thedielectric layer 111. In addition, the firstmetal pattern layer 121 also has a trace or/and a ground pattern. The secondmetal pattern layer 122 also has a trace or/and a ground pattern. The thirdmetal pattern layer 123 has a plurality ofholes 125, and theholes 125 overlap with theradiation holes 124 when vertically projected toward the firstmetal pattern layer 121. In addition, the thirdmetal pattern layer 123 also has a trace or/and a ground pattern.

在本示例中，所述輻射孔124及所述孔洞125兩者個別的數量皆與所述收發天線130的數量相同，且所述收發天線130的位置分別對應且對準所述輻射孔124及所述孔洞125。每一個輻射孔124的長度l在電磁波的波長的四分之一倍至二分之一倍的範圍，其中前述電磁波為經由對應的收發天線130所輻射，以使對應的收發天線130得到較大的增益。In this example, the number of theradiation holes 124 and theholes 125 is the same as the number of thetransceiver antennas 130, and the positions of thetransceiver antennas 130 correspond to and align with theradiation holes 124 and theholes 125. The length l of eachradiation hole 124 is in the range of one quarter to one half of the wavelength of the electromagnetic wave radiated by thecorresponding transceiver antenna 130, so that thecorresponding transceiver antenna 130 obtains a greater gain.

圖1B是圖1A的收發天線130的放大示意圖。請參閱圖1A和圖1B，所述收發天線130設置於介電層111內，且位於所述輻射孔124及所述孔洞125之間。每一個收發天線130朝向對應的輻射孔124方向垂直投影時與對應的輻射孔124重疊，且朝向對應的孔洞125方向垂直投影時與對應的孔洞125重疊。每一個收發天線130為陣列天線，且包括多個天線單元131。所述天線單元131間隔排列，且任兩相鄰的所述天線單元131之間具有間距d，其中間距d的長度在對應的收發天線130所輻射的電磁波的波長的八分之一倍至四分之一倍的範圍，以提高所述收發天線130的頻寬。FIG1B is an enlarged schematic diagram of thetransceiver antenna 130 of FIG1A . Referring to FIG1A and FIG1B , thetransceiver antenna 130 is disposed in thedielectric layer 111 and is located between theradiation hole 124 and thehole 125 . Eachtransceiver antenna 130 overlaps with thecorresponding radiation hole 124 when vertically projected toward thecorresponding radiation hole 124 , and overlaps with thecorresponding hole 125 when vertically projected toward thecorresponding hole 125 . Eachtransceiver antenna 130 is an array antenna and includes a plurality ofantenna units 131 . Theantenna units 131 are arranged at intervals, and there is a distance d between any twoadjacent antenna units 131, wherein the length of the distance d is in the range of one eighth to one quarter of the wavelength of the electromagnetic wave radiated by thecorresponding transceiver antenna 130, so as to improve the bandwidth of thetransceiver antenna 130.

所述天線單元131為貼片天線（patch antenna）。在本示例中，收發天線130為將所述天線單元131排列成1列4行（1x4）的陣列天線，但不以此為限，收發天線130亦可為將所述天線單元131排列成4列4行（4x4）或8列8行（8x8）的陣列天線。所述收發天線130可受控制以波束成型（beamforming）的方式形成預定天線場型，並所述收發天線130發出的波束可自所述輻射孔124向電路板100外進行波束掃描（beam scanning）。Theantenna unit 131 is a patch antenna. In this example, thetransceiver antenna 130 is an array antenna in which theantenna units 131 are arranged in 1 column and 4 rows (1x4), but the present invention is not limited thereto. Thetransceiver antenna 130 may also be an array antenna in which theantenna units 131 are arranged in 4 columns and 4 rows (4x4) or 8 columns and 8 rows (8x8). Thetransceiver antenna 130 may be controlled to form a predetermined antenna pattern in a beamforming manner, and the beam emitted by thetransceiver antenna 130 may perform beam scanning from theradiation hole 124 to the outside of thecircuit board 100.

所述電磁波收發模組140設置於介電層112內，且分別與所述收發天線130之間具有傳輸距離D。所述電磁波收發模組140分別透過所述孔洞125來對準所述收發天線130，以使各個收發天線130對準一個輻射孔124與一個孔洞125。The electromagneticwave transceiver modules 140 are disposed in thedielectric layer 112 and have a transmission distance D with thetransceiver antennas 130 . The electromagneticwave transceiver modules 140 are aligned with thetransceiver antennas 130 through theholes 125 , so that eachtransceiver antenna 130 is aligned with aradiation hole 124 and ahole 125 .

圖2A是收發天線130與電磁波收發模組140之間進行無線訊號傳輸的示意圖，且圖2B是收發天線130與電磁波收發模組140之間進行無線訊號傳輸的方塊圖。請參閱圖1A、圖2A和圖2B，在本示例中，所述電磁波收發模組140可製作成晶片，例如集成電路（Integrated Circuit, IC）。每一個電磁波收發模組140具有處理器141、發射電路142、接收電路143、電磁波發射器144與電磁波接收器145。FIG2A is a schematic diagram of wireless signal transmission between thetransceiver antenna 130 and the electromagneticwave transceiver module 140, and FIG2B is a block diagram of wireless signal transmission between thetransceiver antenna 130 and the electromagneticwave transceiver module 140. Referring to FIG1A, FIG2A and FIG2B, in this example, the electromagneticwave transceiver module 140 can be made into a chip, such as an integrated circuit (IC). Each electromagneticwave transceiver module 140 has aprocessor 141, atransmitting circuit 142, areceiving circuit 143, anelectromagnetic wave transmitter 144 and anelectromagnetic wave receiver 145.

處理器141用以處理電子訊號以執行運算、識別、特徵值取樣等功能。發射電路142用以處理控制收發天線130輻射的電子訊號。接收電路143用以處理根據收發天線130輻射的電磁波所轉換的電子訊號。電磁波發射器144用以產生電磁波訊號，電磁波發射器144可以是雷射二極體（laser diode）或邁射（microwave amplification by stimulated emission of radiation, maser）二極體（maser diode）。電磁波接收器145用以將接收到的電磁波轉換為電子訊號，電磁波接收器145可以是光電二極體（photodiode）。Theprocessor 141 is used to process electronic signals to perform operations, identification, eigenvalue sampling and other functions. The transmittingcircuit 142 is used to process the electronic signals radiated by thetransceiver antenna 130. The receivingcircuit 143 is used to process the electronic signals converted from the electromagnetic waves radiated by thetransceiver antenna 130. Theelectromagnetic wave transmitter 144 is used to generate electromagnetic wave signals. Theelectromagnetic wave transmitter 144 can be a laser diode or a maser diode. Theelectromagnetic wave receiver 145 is used to convert the received electromagnetic waves into electronic signals. Theelectromagnetic wave receiver 145 can be a photodiode.

電磁波訊號的頻率在太赫茲頻段的範圍內。太赫茲頻段為100GHz（0.1THz）至10000GHz（10THz）的頻率範圍，其中太赫茲頻段內的低頻部分與收發天線130輻射之電磁波的毫米波的頻段重疊。因此本申請藉由電磁波收發模組140產生電磁波訊號，其頻率位於太赫茲頻段內的低頻部分，而與收發天線130輻射的電磁波的頻率相同，因而使所述電磁波收發模組140與所述收發天線130之間能進行無線訊號傳輸。The frequency of the electromagnetic wave signal is within the range of the terahertz frequency band. The terahertz frequency band is a frequency range of 100 GHz (0.1 THz) to 10000 GHz (10 THz), wherein the low frequency portion within the terahertz frequency band overlaps with the frequency band of the millimeter wave of the electromagnetic wave radiated by thetransceiver antenna 130. Therefore, the present application generates an electromagnetic wave signal through the electromagneticwave transceiver module 140, whose frequency is located in the low frequency portion within the terahertz frequency band and is the same as the frequency of the electromagnetic wave radiated by thetransceiver antenna 130, thereby enabling wireless signal transmission between the electromagneticwave transceiver module 140 and thetransceiver antenna 130.

進一步，所述電磁波收發模組140與所述收發天線130之間的傳輸距離D在電磁波的波長的四分之一倍至二分之一倍的範圍，而電磁波為經由對應的收發天線130所輻射。在此範圍的傳輸距離D可減少電磁波訊號和電磁波傳輸的損耗。Furthermore, the transmission distance D between the electromagneticwave transceiver module 140 and thetransceiver antenna 130 is in the range of one quarter to one half of the wavelength of the electromagnetic wave radiated by the correspondingtransceiver antenna 130. The transmission distance D in this range can reduce the loss of electromagnetic wave signals and electromagnetic wave transmission.

在所述收發天線130輻射電磁波的過程為：電子訊號經由發射電路142調變，電磁波發射器144根據調變的電子訊號產生且發射電磁波訊號至所述收發天線130，所述收發天線130根據接收到的電磁波訊號而輻射電磁波，電磁波可從輻射孔124向外輻射。在所述收發天線130接收電磁波的過程為：所述收發天線130接收到從輻射孔124外傳來的電磁波且將電磁波輻射而傳至所述電磁波收發模組140，電磁波接收器145將接收到的電磁波轉換為電子訊號而傳輸給接收電路143，接收電路143解調電子訊號後傳給處理器141。The process of radiating electromagnetic waves at thetransceiver antenna 130 is as follows: the electronic signal is modulated by the transmittingcircuit 142, and theelectromagnetic wave transmitter 144 generates and transmits an electromagnetic wave signal to thetransceiver antenna 130 according to the modulated electronic signal. Thetransceiver antenna 130 radiates electromagnetic waves according to the received electromagnetic wave signal, and the electromagnetic wave can radiate outward from theradiation hole 124. The process of receiving electromagnetic waves at thetransceiver antenna 130 is as follows: thetransceiver antenna 130 receives the electromagnetic wave transmitted from theradiation hole 124 and radiates the electromagnetic wave to the electromagneticwave transceiver module 140, and theelectromagnetic wave receiver 145 converts the received electromagnetic wave into an electronic signal and transmits it to the receivingcircuit 143, and the receivingcircuit 143 demodulates the electronic signal and transmits it to theprocessor 141.

需補充說明的是，任兩相鄰的所述電磁波收發模組140之間的間距L為大於電磁波波長的二倍，以避免相鄰的所述電磁波收發模組140之間彼此的干擾。進一步，電路板100還包括多個屏蔽結構150，所述屏蔽結構150可以是金屬結構，例如銅柱。所述屏蔽結構150可設置在任兩相鄰的所述電磁波收發模組140之間，可讓所述電磁波收發模組140之間的屏蔽效果更好。此外，所述屏蔽結構150也可設置在任兩相鄰的所述收發天線130之間，以屏蔽所述收發天線130之間的干擾。It should be noted that the distance L between any two adjacent electromagneticwave transceiver modules 140 is greater than twice the electromagnetic wave wavelength to avoid interference between the adjacent electromagneticwave transceiver modules 140. Furthermore, thecircuit board 100 also includes a plurality of shieldingstructures 150, and the shieldingstructures 150 can be metal structures, such as copper columns. The shieldingstructures 150 can be arranged between any two adjacent electromagneticwave transceiver modules 140, so that the shielding effect between the electromagneticwave transceiver modules 140 can be better. In addition, the shieldingstructure 150 can also be arranged between any twoadjacent transceiver antennas 130 to shield the interference between thetransceiver antennas 130.

圖3A至圖3C是本申請至少一實施例的製造傳輸太赫茲頻率訊號的電路板的方法中，形成第一基板400的剖面示意圖。請參閱圖3A，首先，提供第一單面板200，其中第一單面板200包括介電層210及金屬層220。介電層210與金屬層220堆疊。接著，圖案化金屬層220以形成多個輻射孔124使介電層210暴露，例如藉由微影與蝕刻來圖案化金屬層220。請參閱圖3B，之後，提供雙面板300，其中雙面板300包括介電層310及二金屬層320和330。所述金屬層320和330分別堆疊在介電層310的上下兩面。接著，圖案化金屬層320以形成所述收發天線130。進一步，圖案化金屬層330以形成所述孔洞125，其中所述收發天線130分別朝向所述孔洞125方向垂直投影時與所述孔洞125重疊。圖案化金屬層320和330的方式例如包括微影與蝕刻。3A to 3C are cross-sectional schematic diagrams of forming afirst substrate 400 in a method of manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG3A , first, a first single-panel board 200 is provided, wherein the first single-panel board 200 includes adielectric layer 210 and ametal layer 220. Thedielectric layer 210 and themetal layer 220 are stacked. Then, themetal layer 220 is patterned to form a plurality of radiation holes 124 to expose thedielectric layer 210, for example, by patterning themetal layer 220 by lithography and etching. Referring to FIG3B , thereafter, a double-panel board 300 is provided, wherein the double-panel board 300 includes adielectric layer 310 and twometal layers 320 and 330. The metal layers 320 and 330 are stacked on the upper and lower surfaces of thedielectric layer 310. Then, themetal layer 320 is patterned to form thetransceiver antenna 130. Further, themetal layer 330 is patterned to form thehole 125, wherein thetransceiver antenna 130 overlaps with thehole 125 when vertically projected toward thehole 125. The method of patterning the metal layers 320 and 330 includes, for example, lithography and etching.

請參閱圖3C，接著，以介電層210與金屬層320彼此面對面的方式，將第一單面板200與雙面板300壓合，使第一單面板200與雙面板300結合，其中這些收發天線130朝向輻射孔124的垂直投影分別與所述輻射孔124重疊。輻射孔124和孔洞125分別位於結合後的第一單面板200和雙面板300的相對兩側。Referring to FIG. 3C , the firstsingle panel 200 and thedouble panel 300 are then pressed together in a manner that thedielectric layer 210 and themetal layer 320 face each other, so that the firstsingle panel 200 and thedouble panel 300 are combined, wherein the vertical projections of thetransceiver antennas 130 toward the radiation holes 124 overlap with the radiation holes 124. The radiation holes 124 and theholes 125 are respectively located on opposite sides of the combined firstsingle panel 200 and thedouble panel 300.

結合後的第一單面板200和雙面板300成為第一基板400，其中第一基板400包括第一基板介電層410及兩個第一基板金屬層420和430，且第一基板金屬層420和430分別堆疊在第一基板介電層410的上下兩面。所述收發天線130設置於第一基板介電層410內。The firstsingle panel 200 and thedouble panel 300 are combined to form afirst substrate 400, wherein thefirst substrate 400 includes a firstsubstrate dielectric layer 410 and two firstsubstrate metal layers 420 and 430, and the firstsubstrate metal layers 420 and 430 are respectively stacked on the upper and lower surfaces of the firstsubstrate dielectric layer 410. Thetransceiver antenna 130 is disposed in the firstsubstrate dielectric layer 410.

配合參閱圖1A，第一基板介電層410即為電路板100的介電層111。第一基板金屬層420可經由圖案化形成走線或/及接地圖案，從而成為第一金屬圖案層121。第一基板金屬層430可經由圖案化形成走線或/及接地圖案，從而成為第三金屬圖案層123。接著，在第一基板400的任兩相鄰的所述收發天線130之間形成多個屏蔽孔，其中例如使用雷射鑽孔以形成所述屏蔽孔。之後，將所述屏蔽結構150填入所述屏蔽孔。Referring to FIG. 1A , the firstsubstrate dielectric layer 410 is thedielectric layer 111 of thecircuit board 100. The firstsubstrate metal layer 420 can be patterned to form a wiring or/and a grounding pattern, thereby forming a firstmetal pattern layer 121. The firstsubstrate metal layer 430 can be patterned to form a wiring or/and a grounding pattern, thereby forming a thirdmetal pattern layer 123. Then, a plurality of shielding holes are formed between any twoadjacent transceiver antennas 130 of thefirst substrate 400, wherein the shielding holes are formed by, for example, laser drilling. Thereafter, the shieldingstructure 150 is filled into the shielding holes.

圖4是本申請至少一實施例的製造傳輸太赫茲頻率訊號的電路板的方法中，形成第二基板600的剖面示意圖。請參閱圖1A和圖4，首先，提供第一介電層510、接合介電層520、第二單面板530和電磁波收發模組140。第二單面板530包括第二介電層531及金屬層532，其中第二介電層531與金屬層532堆疊。接合介電層520位於第一介電層510和第二介電層531之間，且形成至少一穿孔521。在本示例中，接合介電層520形成兩穿孔521，且所述電磁波收發模組140分別位於所述穿孔521內。上述第一介電層510、接合介電層520和第二介電層531的材料例如是液晶聚合物（liquid crystal polymer, LCP）。FIG4 is a cross-sectional schematic diagram of forming asecond substrate 600 in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A and FIG4 , first, a firstdielectric layer 510, abonding dielectric layer 520, a second single-sided board 530, and an electromagneticwave transceiver module 140 are provided. The second single-sided board 530 includes asecond dielectric layer 531 and ametal layer 532, wherein thesecond dielectric layer 531 and themetal layer 532 are stacked. Thebonding dielectric layer 520 is located between thefirst dielectric layer 510 and thesecond dielectric layer 531, and forms at least one through-hole 521. In this example, thebonding dielectric layer 520 forms two through-holes 521, and the electromagneticwave transceiver module 140 is located in the through-holes 521, respectively. The material of thefirst dielectric layer 510 , thebonding dielectric layer 520 and thesecond dielectric layer 531 is, for example, liquid crystal polymer (LCP).

接著，將第一介電層510、接合介電層520和第二單面板530壓合，使第一介電層510、接合介電層520和第二單面板530結合而形成第二基板600，其中第二基板600包括第二基板介電層610及第二基板金屬層620，且第二基板介電層610與第二基板金屬層620堆疊。第二基板介電層610即為電路板100的介電層112。第二基板金屬層620可經由圖案化形成走線或/及接地圖案，從而成為第二金屬圖案層122。所述電磁波收發模組140設置於第二基板介電層610內。Next, thefirst dielectric layer 510, thebonding dielectric layer 520 and the second single-sided board 530 are pressed together to form asecond substrate 600, wherein thesecond substrate 600 includes a secondsubstrate dielectric layer 610 and a secondsubstrate metal layer 620, and the secondsubstrate dielectric layer 610 and the secondsubstrate metal layer 620 are stacked. The secondsubstrate dielectric layer 610 is thedielectric layer 112 of thecircuit board 100. The secondsubstrate metal layer 620 can be patterned to form a routing or/and a grounding pattern, thereby forming a secondmetal pattern layer 122. The electromagneticwave transceiver module 140 is disposed in the secondsubstrate dielectric layer 610.

之後，在第二基板600的任兩相鄰的所述電磁波收發模組140之間形成多個屏蔽孔。接著，將所述屏蔽結構150填入所述屏蔽孔。Afterwards, a plurality of shielding holes are formed between any two adjacent electromagneticwave transceiver modules 140 on thesecond substrate 600. Next, the shieldingstructure 150 is filled into the shielding holes.

圖5是本申請至少一實施例的製造傳輸太赫茲頻率訊號的電路板的方法中，結合第一基板400與第二基板600的剖面示意圖。請參閱圖1A及圖5，以第一基板金屬層430與第二基板介電層610彼此面對面的方式，將第一基板400和第二基板600層疊設置（假壓），並使所述電磁波收發模組140對準所述收發天線130以製造出電路板100。第一基板介電層410即為介電層111，且第二基板介電層610即為介電層112。第一基板金屬層420可形成第一金屬圖案層121、第二基板金屬層620可形成第二金屬圖案層122，且第一基板金屬層430可形成第三金屬圖案層123。FIG5 is a cross-sectional schematic diagram of afirst substrate 400 and asecond substrate 600 combined in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A and FIG5, thefirst substrate 400 and thesecond substrate 600 are stacked (falsely pressed) in a manner that the firstsubstrate metal layer 430 and the secondsubstrate dielectric layer 610 face each other, and the electromagneticwave transceiver module 140 is aligned with thetransceiver antenna 130 to manufacture thecircuit board 100. The firstsubstrate dielectric layer 410 is thedielectric layer 111, and the secondsubstrate dielectric layer 610 is thedielectric layer 112. The firstsubstrate metal layer 420 may form a firstmetal pattern layer 121 , the secondsubstrate metal layer 620 may form a secondmetal pattern layer 122 , and the firstsubstrate metal layer 430 may form a thirdmetal pattern layer 123 .

綜上所述，在以上實施例所揭示的電路板中，藉由設置在介質層內的電磁波收發模組能發出太赫茲頻段範圍的電磁波訊號以及接收電磁波，而此太赫茲頻段範圍與所述收發天線輻射的毫米波的頻率範圍重疊，因而使所述電磁波收發模組與所述收發天線之間能進行無線訊號傳輸，以達到縮小電路板佈局空間的優點。In summary, in the circuit board disclosed in the above embodiments, the electromagnetic wave transceiver module disposed in the dielectric layer can emit electromagnetic wave signals in the terahertz frequency band and receive electromagnetic waves, and this terahertz frequency band overlaps with the frequency range of the millimeter waves radiated by the transceiver antenna, so that wireless signal transmission can be performed between the electromagnetic wave transceiver module and the transceiver antenna, thereby achieving the advantage of reducing the layout space of the circuit board.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，本發明所屬技術領域中具有通常知識者，在不脫離本發明精神和範圍內，當可作些許更動與潤飾，因此本發明保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above by way of embodiments, they are not intended to limit the present invention. A person having ordinary knowledge in the technical field to which the present invention belongs may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the definition of the attached patent application scope.

100:電路板 111:介電層 112:介電層 121:第一金屬圖案層 122:第二金屬圖案層 123:第三金屬圖案層 124:輻射孔 125:孔洞 130:收發天線 131:天線單元 140:電磁波收發模組 141:處理器 142:發射電路 143:接收電路 144:電磁波發射器 145:電磁波接收器 150:屏蔽結構 200:第一單面板 210:介電層 220:金屬層 300:雙面板 310:介電層 320,330:金屬層 400:第一基板 410:第一基板介電層 420,430:第一基板金屬層 510:第一介電層 520:接合介電層 521:穿孔 530:第二單面板 531:第二介電層 532:金屬層 600:第二基板 610:第二基板介電層 620:第二基板金屬層 l:長度 d:間距 D:傳輸距離 L:間距100: Circuit board111: Dielectric layer112: Dielectric layer121: First metal pattern layer122: Second metal pattern layer123: Third metal pattern layer124: Radiation hole125: Hole130: Transceiver antenna131: Antenna unit140: Electromagnetic wave transceiver module141: Processor142: Transmitter circuit143: Receiving circuit144: Electromagnetic wave transmitter145: Electromagnetic wave receiver150: Shielding structure200: First single panel210: Dielectric layer220: Metal layer300: Double panel310: Dielectric layer320,330: Metal layer400: First substrate410: First substrate dielectric layer420,430: First substrate metal layer510: First dielectric layer520: Bonding dielectric layer521: Perforation530: Second single panel531: Second dielectric layer532: Metal layer600: Second substrate610: Second substrate dielectric layer620: Second substrate metal layerl: Lengthd: SpacingD: Transmission distanceL: Spacing

為了更完整了解實施例及其優點，現參照結合所附圖式所做之下列描述，其中： [圖1A]是本申請至少一實施例的傳輸太赫茲頻率訊號的電路板的剖面示意圖； [圖1B]是圖1A的收發天線的放大示意圖； [圖2A]是收發天線與電磁波收發模組之間進行無線訊號傳輸的示意圖； [圖2B]是收發天線與電磁波收發模組之間進行無線訊號傳輸的方塊圖； [圖3A]至[圖3C]是本申請至少一實施例的製造傳輸太赫茲頻率訊號的電路板的方法中，形成第一基板的剖面示意圖； [圖4]是本申請至少一實施例的製造傳輸太赫茲頻率訊號的電路板的方法中，形成第二基板的剖面示意圖；以及 [圖5]是本申請至少一實施例的製造傳輸太赫茲頻率訊號的電路板的方法中，結合第一基板與第二基板的剖面示意圖。In order to more fully understand the embodiments and their advantages, reference is now made to the following description in combination with the attached drawings, wherein: [Figure 1A] is a cross-sectional schematic diagram of a circuit board for transmitting terahertz frequency signals in at least one embodiment of the present application; [Figure 1B] is an enlarged schematic diagram of the transceiver antenna of Figure 1A; [Figure 2A] is a schematic diagram of wireless signal transmission between the transceiver antenna and the electromagnetic wave transceiver module; [Figure 2B] is a block diagram of wireless signal transmission between the transceiver antenna and the electromagnetic wave transceiver module; [Figure 3A] to [Figure 3C] are cross-sectional schematic diagrams of forming a first substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals in at least one embodiment of the present application; [Figure 4] is a schematic cross-sectional view of forming a second substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals in at least one embodiment of the present application; and[Figure 5] is a schematic cross-sectional view of combining a first substrate and a second substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals in at least one embodiment of the present application.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic storage information (please note in the order of storage institution, date, and number)NoneForeign storage information (please note in the order of storage country, institution, date, and number)None

100:電路板100: Circuit board

111:介電層111: Dielectric layer

112:介電層112: Dielectric layer

121:第一金屬圖案層121: First metal pattern layer

122:第二金屬圖案層122: Second metal pattern layer

123:第三金屬圖案層123: The third metal pattern layer

124:輻射孔124: Radiation hole

125:孔洞125: Hole

130:收發天線130: Transceiver antenna

131:天線單元131: Antenna unit

140:電磁波收發模組140:Electromagnetic wave transceiver module

150:屏蔽結構150: Shielding structure

l:長度l: length

D:傳輸距離D: Transmission distance

L:間距L: Spacing