本發明涉及電子設備技術領域，尤其涉及一種電子設備及其診斷方法。The present invention relates to the technical field of electronic equipment, and in particular, to an electronic equipment and a diagnostic method thereof.
隨著高科技之發展，智慧手機、平板電腦、智慧手錶等消費電子設備功能越來越豐富，生產、測試過程越來越複雜，需要之測試儀器設備較多，測試成本較高，且可能存於設備功能測試困難、不能完整測試設備功能等缺陷。目前消費電子設備之測試大部分是採用額外之電子儀器設備來測試，類比使用環境來檢測設備功能，可能存於較大之測試誤差，對於測試判定不良之電子設備需要花費大量之人力成本進行分析維修。With the development of high technology, consumer electronic devices such as smartphones, tablets, and smart watches are becoming more and more functional, and the production and testing processes are becoming more and more complex. They require more testing instruments and equipment, and the testing cost is higher, and there may be Due to the difficulty in testing the function of the equipment and the inability to fully test the function of the equipment, etc. At present, most of the testing of consumer electronic equipment uses additional electronic equipment to test. Analogous to the use environment to test the function of the equipment, there may be a large test error. Electronic equipment with poor test results requires a lot of labor costs to analyze. Maintain.
有鑑於此，有必要提供一種電子設備及其診斷方法，可無需借助外部測試儀器即可實現對電子設備之功能模組進行測試。In view of this, it is necessary to provide an electronic device and a diagnostic method thereof, which can test the functional modules of the electronic device without resorting to external testing instruments.
本發明一實施方式提供一種電子設備診斷方法，所述電子設備包括電池及多個功能模組，所述方法包括：獲取所述電池於多個所述功能模組均關閉之情形下所消耗之第一電流值與所述電池之電壓值；開啟多個所述功能模組中之任意功能模組；獲取所述電池於所述功能模組開啟後所消耗之第二電流值與所述功能模組之電壓值；將所述第一電流值、所述第二電流值、所述電池之電壓值及所述功能模組之電壓值分別與對應之基準值進行比較，得到多個比較結果；及根據多個所述比較結果得到開啟之所述功能模組之檢測結果。One embodiment of the present invention provides a method for diagnosing an electronic device. The electronic device includes a battery and a plurality of functional modules. The method includes: obtaining the data from the battery and a plurality of functional modules.The first current value consumed when turned off and the voltage value of the battery; turning on any functional module among the plurality of functional modules; obtaining the first current value consumed by the battery after the functional module is turned on. Two current values and the voltage value of the functional module; compare the first current value, the second current value, the voltage value of the battery and the voltage value of the functional module with the corresponding reference values respectively Compare to obtain a plurality of comparison results; and obtain a detection result of the enabled functional module based on the plurality of comparison results.
本發明一實施方式提供一種電子設備，所述電子設備包括電池、處理晶片、電源管理模組及多個功能模組，所述電子設備還包括電連接於所述電池之採樣模組；其中，當多個所述功能模組均關閉時，所述採樣模組用於採集所述電池當前所消耗之第一電流值，所述電源管理模組用於讀取所述電池之電壓值及所述採樣模組所採集到之第一電流值，併發送給所述處理晶片；當多個所述功能模組中之任意功能模組被開啟時，所述採樣模組用於採集所述電池當前所消耗之第二電流值，所述電源管理模組用於讀取所述功能模組之電壓值及所述採樣模組所採集到之第二電流值，併發送給所述處理晶片；所述處理晶片用於將所述第一電流值、所述第二電流值、所述電池之電壓值及所述功能模組之電壓值分別與對應之基準值進行比較，以得到開啟之所述功能組之檢測結果。One embodiment of the present invention provides an electronic device. The electronic device includes a battery, a processing chip, a power management module and a plurality of functional modules. The electronic device further includes a sampling module electrically connected to the battery; wherein, When multiple functional modules are turned off, the sampling module is used to collect the first current value currently consumed by the battery, and the power management module is used to read the voltage value of the battery and the The first current value collected by the sampling module is sent to the processing chip; when any of the plurality of functional modules is turned on, the sampling module is used to collect the battery The second current value currently consumed, the power management module is used to read the voltage value of the functional module and the second current value collected by the sampling module, and send it to the processing chip; The processing chip is used to compare the first current value, the second current value, the voltage value of the battery and the voltage value of the functional module with corresponding reference values to obtain the turning point. The test results of the functional groups are described below.
與習知技術相比，上述電子設備及其診斷方法，可實現對電子設備之測試不再需要借助外部測試儀器，電子設備可自主判斷於測試過程中出現之不良，實現精準量測電子設備各功能模組，測試成本低廉，且可根據設備異常結果推送對應之異常解決方法。Compared with the conventional technology, the above-mentioned electronic equipment and its diagnostic method can realize the testing of electronic equipment without the need to rely on external testing instruments. The electronic equipment can independently judge the defects that occur during the testing process, achieving accurate measurement of various aspects of the electronic equipment. Functional module, low testing cost, and corresponding abnormal solutions can be pushed according to the abnormal results of the equipment.
10:電池10:Battery
20:處理晶片20: Processing wafers
30:採樣模組30: Sampling module
40a、40b、40c:功能模組40a, 40b, 40c: Function module
50:電源管理模組50:Power management module
60:顯示模組60:Display module
100:電子設備100: Electronic equipment
200:伺服器200:server
S300、S302、S304、S306、S308:步驟S300, S302, S304, S306, S308: steps
圖1是本發明一實施方式之電子設備之功能模組圖。FIG. 1 is a functional module diagram of an electronic device according to an embodiment of the present invention.
圖2是本發明另一實施方式之電子設備之功能模組圖。FIG. 2 is a functional module diagram of an electronic device according to another embodiment of the present invention.
圖3是本發明一實施方式之電子設備診斷方法之流程圖。FIG. 3 is a flow chart of an electronic device diagnosis method according to an embodiment of the present invention.
請參閱圖1，為本發明電子設備100一較佳實施例之示意圖。Please refer to FIG. 1 , which is a schematic diagram of an electronic device 100 according to a preferred embodiment of the present invention.
電子設備100包括電池10、處理晶片20、採樣模組30、多個功能模組40a、40b、40c及電源管理模組50。於圖1中，僅以三個功能模組40a、40b、40c進行舉例說明，但不以此為限，可包括多於三個功能模組或者少於三個功能模組。所述採樣模組30電連接於所述電池10，當電子設備100上電後，電子設備100可藉由網路與伺服器200進行通信，進而可從伺服器200上下載一預設測試軟體及測試基準值檔，所述測試基準值檔中可包含有多項基準值。當電子設備100運行所述預設測試軟體後，可自動執行功能測試流程。The electronic device 100 includes a battery 10, a processing chip 20, a sampling module 30, a plurality of functional modules 40a, 40b, 40c and a power management module 50. In FIG. 1 , only three functional modules 40a, 40b, and 40c are used for illustration, but the invention is not limited thereto. It may include more than three functional modules or less than three functional modules. The sampling module 30 is electrically connected to the battery 10. When the electronic device 100 is powered on, the electronic device 100 can communicate with the server 200 through the network, and then can download a default test software from the server 200. and a test reference value file, which may include multiple reference values. After the electronic device 100 runs the preset test software, the functional test process can be automatically executed.
於一實施方式中，電子設備100還可包括記憶體(圖未示)，所述記憶體可存儲所述預設測試軟體及所述測試基準值檔，所述處理晶片可於電子設備100上電後，控制電子設備100與伺服器200進行通信。所述處理晶片20可載入並執行所述預設測試軟體，以執行功能測試流程。所述記憶體可包括高速隨機存取記憶體，還可包括非易失性記憶體，例如硬碟機、記憶體、插接式硬碟機，智慧存儲卡(Smart Media Card,SMC)，安全數位(Secure Digital,SD)卡，快閃記憶體卡(Flash Card)、至少一個磁碟記憶體件、快閃記憶體器件、或其他易失性固態記憶體件。In one embodiment, the electronic device 100 may further include a memory (not shown), which may store the default test software and the test reference value file, and the processing chip may be on the electronic device 100 After powering on, the control electronic device 100 communicates with the server 200 . The processing chip 20 can load and execute the preset test software to perform a functional test process. The memory may include high-speed random access memory, and may also include non-volatile memory, such as hard drives, memory, plug-in hard drives, smart media cards (SMC), secure Secure Digital (SD) card, flash memory card, at least one disk memory device, flash memory device, or other volatile solid-state memory device.
於一實施方式中，以三個功能模組40a、40b、40c為例，該預設測試軟體可包括四個測試流程。第一測試流程為：多個功能模組40a、40b、40c均被關閉，採樣模組30採集電池10當前所消耗之第一電流值，電源管理模組50讀取電池10之電壓值及採樣模組30所採集到之第一電流值，併發送給處理晶片20；第二測試流程為：功能模組40b、40c被關閉，功能模組40a被開啟，採樣模組30採集電池10當前所消耗之第二電流值，電源管理模組50讀取功能模組40a之電壓值及採樣模組30所採集到之第二電流值，併發送給處理晶片20；第三測試流程為：功能模組40a、40c被關閉，功能模組40b被開啟，採樣模組30採集電池10當前所消耗之第三電流值，電源管理模組50讀取功能模組40b之電壓值及採樣模組30所採集到之第三電流值，併發送給處理晶片20；第四測試流程為：功能模組40a、40b被關閉，功能模組40c被開啟，採樣模組30採集電池10當前所消耗之第四電流值，電源管理模組50讀取功能模組40c之電壓值及採樣模組30所採集到之第四電流值，併發送給處理晶片20。對於第二測試流程，處理晶片20可將所述第一電流值、所述第二電流值、所述電池10之電壓值及所述功能模組40a之電壓值分別與對應之基準值進行比較，得到功能模組40a之檢測結果。對於第三測試流程，處理晶片20同樣可將所述第一電流值、所述第三電流值、所述電池10之電壓值及所述功能模組40b之電壓值分別與對應之基準值進行比較，得到功能模組40b之檢測結果。對於第四測試流程，處理晶片20同樣可將所述第一電流值、所述第四電流值、所述電池10之電壓值及所述功能模組40c之電壓值分別與對應之基準值進行比較，得到功能模組40c之檢測結果。In one implementation, taking three functional modules 40a, 40b, and 40c as an example, the presetTest software can include four testing processes. The first test process is: multiple functional modules 40a, 40b, and 40c are all turned off, the sampling module 30 collects the first current value currently consumed by the battery 10, and the power management module 50 reads the voltage value of the battery 10 and samples it. The first current value collected by the module 30 is sent to the processing chip 20; the second test process is: the function modules 40b and 40c are turned off, the function module 40a is turned on, and the sampling module 30 collects the current value of the battery 10. The second current value consumed, the power management module 50 reads the voltage value of the functional module 40a and the second current value collected by the sampling module 30, and sends them to the processing chip 20; the third test process is: functional module The groups 40a and 40c are closed, the functional module 40b is opened, the sampling module 30 collects the third current value currently consumed by the battery 10, and the power management module 50 reads the voltage value of the functional module 40b and the value of the sampling module 30 The third current value is collected and sent to the processing chip 20; the fourth test process is: the function modules 40a and 40b are turned off, the function module 40c is turned on, and the sampling module 30 collects the fourth current value currently consumed by the battery 10. For the current value, the power management module 50 reads the voltage value of the function module 40c and the fourth current value collected by the sampling module 30, and sends them to the processing chip 20. For the second test process, the processing chip 20 can compare the first current value, the second current value, the voltage value of the battery 10 and the voltage value of the functional module 40a with corresponding reference values respectively. , to obtain the detection result of the function module 40a. For the third test process, the processing chip 20 can also compare the first current value, the third current value, the voltage value of the battery 10 and the voltage value of the functional module 40b with the corresponding reference values. Compare and obtain the detection result of the function module 40b. For the fourth test process, the processing chip 20 can also compare the first current value, the fourth current value, the voltage value of the battery 10 and the voltage value of the functional module 40c with the corresponding reference values. Compare and obtain the detection result of the function module 40c.
於一實施方式中，該四個測試流程之測試內容可根據實際需求進行調整，比如該四個測試流程還可是以下測試內容。第一測試流程為：多個功能模組40a、40b、40c均被關閉，採樣模組30採集電池10當前所消耗之第一電流值，電源管理模組50讀取電池10之電壓值及採樣模組30所採集到之第一電流值，併發送給處理晶片20；第二測試流程為：功能模組40b、40c被關閉，功能模組40a被開啟，採樣模組30採集電池10當前所消耗之第二電流值，電源管理模組50讀取功能模組40a之電壓值及採樣模組30所採集到之第二電流值，併發送給處理晶片20；第三測試流程為：功能模組40c被關閉，功能模組40a、40b被開啟，採樣模組30採集電池10當前所消耗之第三電流值，電源管理模組50讀取功能模組40a之電壓值、功能模組40b之電壓值及採樣模組30所採集到之第三電流值，併發送給處理晶片20；第四測試流程為：功能模組40a、40b、40c均被開啟，採樣模組30採集電池10當前所消耗之第四電流值，電源管理模組50讀取每一功能模組40a、40b、40c之電壓值及採樣模組30所採集到之第四電流值，併發送給處理晶片20。In one embodiment, the test content of the four test processes can be adjusted according to actual needs. For example, the four test processes can also include the following test content. The first test process is: multiple functionsThe energy modules 40a, 40b, and 40c are all turned off. The sampling module 30 collects the first current value currently consumed by the battery 10. The power management module 50 reads the voltage value of the battery 10 and the first current value collected by the sampling module 30. A current value is sent to the processing chip 20; the second test process is: the function modules 40b and 40c are turned off, the function module 40a is turned on, the sampling module 30 collects the second current value currently consumed by the battery 10, and the power supply The management module 50 reads the voltage value of the functional module 40a and the second current value collected by the sampling module 30, and sends them to the processing chip 20; the third test process is: the functional module 40c is turned off, and the functional module 40a and 40b are turned on, the sampling module 30 collects the third current value currently consumed by the battery 10, and the power management module 50 reads the voltage value of the function module 40a, the voltage value of the function module 40b and the voltage value of the sampling module 30. The third current value is collected and sent to the processing chip 20; the fourth test process is: the function modules 40a, 40b, and 40c are all turned on, the sampling module 30 collects the fourth current value currently consumed by the battery 10, and the power supply The management module 50 reads the voltage value of each functional module 40a, 40b, 40c and the fourth current value collected by the sampling module 30, and sends them to the processing chip 20.
於一實施方式中，如圖1所示，多個功能模組40a、40b、40c之開啟與關閉可藉由處理晶片20來控制，若處理晶片20之可使用控制引腳(如GPIO引腳)數量足夠，可利用一控制引腳來控制一功能模組，若處理晶片20之可使用控制引腳之數量低於功能模組之數量，可藉由增設一擴展模組(圖未示)來控制該多個功能模組40a、40b、40c。比如，該擴展模組為三八解碼器，進而實現藉由三個控制引腳控制八個功能模組之工作狀態。In one embodiment, as shown in FIG. 1 , the opening and closing of multiple functional modules 40a, 40b, and 40c can be controlled by the processing chip 20. If the processing chip 20 can use control pins (such as GPIO pins) ) number is sufficient, and one control pin can be used to control a functional module. If the number of usable control pins of the processing chip 20 is lower than the number of functional modules, an expansion module (not shown in the figure) can be added. to control the plurality of functional modules 40a, 40b, and 40c. For example, the expansion module is a three-eight decoder, which can control the working status of eight functional modules through three control pins.
於一實施方式中，處理晶片20可是SOC晶片，採樣模組30可是一採樣電阻，採樣電阻之電阻值可根據實際需求進行選定。該多個功能模組40a、40b、40c可包括攝像頭模組、無線通訊模組、音訊模組、顯示模組等。電源管理模組50可是一電源管理晶片，該電源管理晶片優選集成有模數轉換器(ADC)，電源管理模組50可藉由其集成之ADC實現讀取採樣模組30所採集到之電池10所消耗之電流值。In one embodiment, the processing chip 20 can be a SOC chip, the sampling module 30 can be a sampling resistor, and the resistance value of the sampling resistor can be selected according to actual needs. The multiple functional modules 40a, 40b, and 40c may include camera modules, wireless communication modules, audio modules, display modules, etc. The power management module 50 can be a power management chip, and the power management chip is preferably integrated with an analog-to-digital converter (ADC).The power management module 50 can use its integrated ADC to read the current value consumed by the battery 10 collected by the sampling module 30 .
舉例而言，功能模組40a為攝像頭模組，電源管理模組50為一電源管理晶片。攝像頭模組之檢測流程為：多個功能模組40a、40b、40c均被關閉，此時採樣模組30採集到電池10當前所消耗之第一電流值，電源管理晶片讀取電池10之電壓值及採樣模組30所採集到之第一電流值，併發送給SOC晶片；攝像頭模組開啟且功能模組40b、40c處於關閉狀態，採樣模組30採集電池10當前所消耗之第二電流值，電源管理晶片讀取攝像頭模組之電壓值及採樣模組30所採集到之第二電流值，併發送給SOC晶片；SOC晶片將所述第一電流值、所述第二電流值、電池10之電壓值及攝像頭模組之電壓值分別與對應之基準值進行比較，進而得到攝像頭模組之檢測結果。比如，若攝像頭模組之電壓異常或者攝像頭模組所消耗之電流異常，則判斷攝像頭模組異常。For example, the function module 40a is a camera module, and the power management module 50 is a power management chip. The detection process of the camera module is as follows: multiple functional modules 40a, 40b, and 40c are all turned off. At this time, the sampling module 30 collects the first current value currently consumed by the battery 10, and the power management chip reads the voltage of the battery 10. value and the first current value collected by the sampling module 30, and send it to the SOC chip; the camera module is turned on and the function modules 40b and 40c are in a closed state, and the sampling module 30 collects the second current currently consumed by the battery 10 value, the power management chip reads the voltage value of the camera module and the second current value collected by the sampling module 30, and sends it to the SOC chip; the SOC chip converts the first current value, the second current value, The voltage value of the battery 10 and the voltage value of the camera module are respectively compared with the corresponding reference values, and then the detection result of the camera module is obtained. For example, if the voltage of the camera module is abnormal or the current consumed by the camera module is abnormal, it is determined that the camera module is abnormal.
於一實施方式中，所述測試基準值檔中還可包含有多項基準資訊，當電子設備100運行所述預設測試軟體時，處理晶片20還可讀取每一功能模組40a、40b、40c之基本資訊並與基準資訊進行比較，來判斷每一功能模組40a、40b、40c是否存於不良。比如，該基本資訊包括功能模組之型號、名稱、安裝狀態等資訊。In one embodiment, the test reference value file may also include a plurality of reference information. When the electronic device 100 runs the default test software, the processing chip 20 may also read each functional module 40a, 40b, The basic information of 40c is compared with the benchmark information to determine whether each functional module 40a, 40b, and 40c is defective. For example, the basic information includes the model, name, installation status and other information of the functional module.
如圖2所示，與圖1相比，電子設備100還包括顯示模組60。多個功能模組40a、40b、40c之開啟與關閉還可藉由電源管理模組50來控制，而不藉由處理晶片20來控制。As shown in FIG. 2 , compared with FIG. 1 , the electronic device 100 further includes a display module 60 . The turning on and off of the plurality of functional modules 40a, 40b, and 40c can also be controlled by the power management module 50 instead of the processing chip 20.
於一實施方式中，處理晶片20還用於控制顯示模組60輸出所述檢測結果為異常之功能模組之資訊。比如，當功能模組40a之檢測結果為異常，功能模組40b、40c之檢測結果為正常，顯示模組60輸出功能模組40a之異常原因及推薦之解決方法。推薦之解決方法可預先存儲於所述預設測試軟體或者伺服器200中，可預先藉由大資料方式收集得到電子設備100之每一功能模組40a、40b、40c可能出現之異常情形及對應之解決方法，並建立一一對應之映射關係，以便於電子設備100之測試過程中，基於異常檢測結果來推薦對應之解決方法。In one embodiment, the processing chip 20 is also used to control the display module 60 to output information about the functional module whose detection result is abnormal. For example, when the detection result of function module 40a is abnormal, the function module 40aThe detection results of the function modules 40b and 40c are normal, and the display module 60 outputs the abnormal cause of the function module 40a and the recommended solution. Recommended solutions can be stored in the preset test software or server 200 in advance, and possible abnormal situations and corresponding responses of each functional module 40a, 40b, 40c of the electronic device 100 can be collected in advance through large data methods. solutions, and establish a one-to-one mapping relationship, so that during the testing process of the electronic device 100, corresponding solutions can be recommended based on the abnormality detection results.
於一實施方式中，顯示模組60還可輸出每一功能模組40a、40b、40c之檢測結果(Pass或Fail)，且對於異常之功能模組還輸出其異常原因及推薦之解決方法。In one embodiment, the display module 60 can also output the detection result (Pass or Fail) of each functional module 40a, 40b, 40c, and also output the abnormal reason and recommended solution for the abnormal functional module.
圖3為本發明一實施方式中電子設備診斷方法之流程圖。根據不同之需求，所述流程圖中步驟之順序可改變，某些步驟可省略。FIG. 3 is a flow chart of an electronic device diagnosis method in an embodiment of the present invention. According to different needs, the order of the steps in the flow chart can be changed, and some steps can be omitted.
步驟S300，獲取電池10於多個功能模組40a、40b、40c均關閉之情形下所消耗之第一電流值與電池10之電壓值。Step S300: Obtain the first current value consumed by the battery 10 and the voltage value of the battery 10 when multiple functional modules 40a, 40b, and 40c are turned off.
於一實施方式中，可藉由採樣模組30來採集電池10於多個所述功能模組40a、40b、40c均關閉之情形下所消耗之第一電流值，藉由電源管理模組50來讀取電池10之電壓值及採樣模組30所採集到之第一電流值。In one embodiment, the sampling module 30 can be used to collect the first current value consumed by the battery 10 when a plurality of the functional modules 40a, 40b, and 40c are turned off. The power management module 50 To read the voltage value of the battery 10 and the first current value collected by the sampling module 30 .
步驟S302，開啟多個功能模組40a、40b、40c中之任意功能模組。Step S302: Open any function module among the plurality of function modules 40a, 40b, and 40c.
於一實施方式中，可藉由電源管理模組50或者處理晶片20來控制多個功能模組40a、40b、40c中之任意功能模組開啟，該任意功能模組優選為一個功能模組。比如，當需要對功能模組40a進行測試時，則開啟功能模組40a，當需要對功能模組40b進行測試時，則開啟功能模組40b。以下以開啟功能模組40a為例進行說明。於其他實施例中，該任意功能模組亦可包括兩個或兩個以上之功能模組。In one embodiment, the power management module 50 or the processing chip 20 can be used to control the activation of any functional module among the plurality of functional modules 40a, 40b, and 40c. The arbitrary functional module is preferably one functional module. For example, when the function module 40a needs to be tested, the function module 40a is turned on, and when the function module 40b needs to be tested, the function module 40b is turned on. The following description takes the opening of the function module 40a as an example. In other embodiments, the arbitrary functional module may also include two or more functional modules.
步驟S304，獲取電池10於功能模組40a開啟後所消耗之第二電流值與功能模組40a之電壓值。Step S304: Obtain the second current value consumed by the battery 10 after the functional module 40a is turned on and the voltage value of the functional module 40a.
於一實施方式中，可藉由採樣模組30採集電池10於功能模組40a開啟後所消耗之第二電流值，可藉由電源管理模組50讀取功能模組40a之電壓值及採樣模組30所採集到之第二電流值。In one embodiment, the sampling module 30 can be used to collect the second current value consumed by the battery 10 after the functional module 40a is turned on, and the power management module 50 can be used to read the voltage value and sample the functional module 40a. The second current value collected by the module 30.
步驟S306，將所述第一電流值、所述第二電流值、電池10之電壓值及功能模組40a之電壓值分別與對應之基準值進行比較，得到多個比較結果。Step S306: Compare the first current value, the second current value, the voltage value of the battery 10 and the voltage value of the functional module 40a with corresponding reference values to obtain multiple comparison results.
於一實施方式中，電源管理模組50可將讀取到之所述第一電流值、所述第二電流值、電池10之電壓值及功能模組40a之電壓值發送給處理晶片20，處理晶片20將所述第一電流值、所述第二電流值、電池10之電壓值及功能模組40a之電壓值分別與對應之基準值進行比較，得到多個比較結果。In one embodiment, the power management module 50 can send the read first current value, the second current value, the voltage value of the battery 10 and the voltage value of the functional module 40a to the processing chip 20, The processing chip 20 compares the first current value, the second current value, the voltage value of the battery 10 and the voltage value of the functional module 40a with the corresponding reference values, respectively, to obtain a plurality of comparison results.
步驟S308，根據多個所述比較結果得到開啟之功能模組40a之檢測結果。Step S308: Obtain the detection result of the enabled function module 40a based on the plurality of comparison results.
於一實施方式中，當得到多個比較結果後，處理晶片20可根據多個所述比較結果得到功能模組40a之檢測結果，比如該檢測結果包括測試藉由(Pass)與測試失敗(Fail)。In one embodiment, after obtaining multiple comparison results, the processing chip 20 can obtain the detection result of the functional module 40a based on the multiple comparison results. For example, the detection result includes a test pass (Pass) and a test failure (Fail). ).
可理解對於功能模組40b、40c，其測試步驟與功能40a之測試步驟相同，於此不再詳述。It can be understood that the test steps for the function modules 40b and 40c are the same as the test steps for the function 40a, and will not be described in detail here.
於一實施方式中，當每一功能模組40a、40b、40c測試完成時，可輸出所述檢測結果為異常之功能模組之資訊及建議解決方法，或者輸出每一功能模組40a、40b、40c之檢測結果及所述檢測結果為異常之功能模組之建議解決方法。In one embodiment, when the test of each functional module 40a, 40b, 40c is completed, the information and suggested solutions for the functional module whose detection result is abnormal can be output, or each functional module 40a, 40b can be output , 40c detection results and suggested solutions for functional modules whose detection results are abnormal.
於一實施方式中，當電子設備100上電時，處理晶片20可控制電子設備100從一指定伺服器200上下載預設測試軟體與基準值檔。處理晶片20可載入並執行所述預設測試軟體，以執行功能測試流程。其中所述基準值檔中包含有多項基準值。In one embodiment, when the electronic device 100 is powered on, the processing chip 20 can control the electronic device 100 to download the default test software and the reference value file from a designated server 200 . The processing chip 20 can load and execute the preset test software to perform the functional test process. The benchmark value file includes multiple benchmark values.
上述電子設備100及其診斷方法，可實現對電子設備100之測試不再需要借助外部測試儀器，電子設備100可自主判斷於測試過程中出現之不良，可實現精準量測電子設備100各功能模組，測試成本低廉，且可根據設備異常結果推送對應之異常解決方法。The above-mentioned electronic device 100 and its diagnostic method can realize the test of the electronic device 100 without the need to rely on external test instruments. The electronic device 100 can independently determine the defects that occur during the test process, and can achieve accurate measurement of each functional mode of the electronic device 100. The test cost is low, and corresponding exception solutions can be pushed according to the abnormal results of the equipment.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，本發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。To sum up, this invention meets the requirements for an invention patent and a patent application should be filed in accordance with the law. However, the above are only preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments. Any equivalent modifications or changes made by those familiar with the art in accordance with the spirit of the present invention are deemed to be It should be covered by the following patent application scope.
S300、S302、S304、S306、S308:步驟S300, S302, S304, S306, S308: steps
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| CN202010201191.3 | 2020-03-20 | ||
| CN202010201191.3ACN113495195A (en) | 2020-03-20 | 2020-03-20 | Electronic device and diagnostic method thereof |
| Publication Number | Publication Date |
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| TW202136799A TW202136799A (en) | 2021-10-01 |
| TWI822999Btrue TWI822999B (en) | 2023-11-21 |
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| TW109116999ATWI822999B (en) | 2020-03-20 | 2020-05-21 | Diagnosis method of electronic device and device employing method |
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| CN (1) | CN113495195A (en) |
| TW (1) | TWI822999B (en) |
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