TWI691875B

Movatterモバイル変換

Info

Publication number: TWI691875B
Application number: TW107131591A
Authority: TW
Inventors: 趙勁翔
Original assignee: 友達光電股份有限公司
Priority date: 2018-09-07
Filing date: 2018-09-07
Publication date: 2020-04-21
Also published as: TW202011164A; CN109656423B; CN109656423A

Abstract

A detection-display device includes a display panel, a position identifying pattern layer, an adhesive layer, and a cover. The position identifying pattern layer is disposed above the display panel and includes a plurality of code patterns. Each of the code patterns includes a first body and at least one first microstructure connecting to the first body. The first body is between the display panel and the first microstructure, and the first microstructure has a size less than that of the first body. The adhesive layer is disposed above the identifying pattern layer. The cover is disposed above the adhesive layer.

Description

Translated fromChinese

感測顯示裝置及應用其的顯示模組Sensing display device and display module using the same

本揭露內容是關於一種感測顯示裝置及應用其的顯示模組。This disclosure relates to a sensing display device and a display module using the same.

隨著電子產品設計的發展日漸茁壯，許多具有高機能性的電子產品也漸漸被開發出來。以提供使用者顯示畫面的產品來說，其產品趨向讓使用者可直接在顯示畫面進行觸控操作，以利操作過程可更直觀，也因此相關產品的發展性也備受看好。As the development of electronic product design has grown stronger, many electronic products with high functionality have been gradually developed. In terms of products that provide users with display screens, their product trends allow users to directly perform touch operations on the display screen, so that the operation process can be more intuitive, and the development of related products is also highly optimistic.

具體來說，這類操作方式除了可透過使用者直接以手指達成以外，也有產品是開發成另外搭配觸控筆使用，像是繪圖板或是電子筆記本。對於另外搭配觸控筆的產品而言，感測觸控的方式分為非常多種，其大致可分為接觸式或非接觸式。然而，無論是接觸式或非接觸式，由於觸控精度將會連帶影響使用者的操作體驗，故此類產品的觸控精度已成為相關領域的發展方向之一。Specifically, in addition to direct operation by the user's finger, this type of operation method is also developed to be used with a stylus, such as a graphics tablet or an electronic notebook. For products that are additionally equipped with a stylus, there are many ways to sense touch, which can be roughly classified as contact or non-contact. However, whether it is a contact type or a non-contact type, since the touch accuracy will affect the user's operating experience, the touch accuracy of such products has become one of the development directions in related fields.

本揭露內容之一實施方式提供一種感測顯示裝置，包含顯示面板、位置辨識圖層、貼合膠以及蓋板。位置辨識圖層設置在顯示面板上並包含碼點，其中碼點包含第一本體與連接在第一本體上的第一微結構，第一本體位在顯示面板與第一微結構之間，且第一微結構的尺寸小於第一本體的尺寸。貼合膠設置在位置辨識圖層上。蓋板設置在貼合膠上。One embodiment of the present disclosure provides a sensing display device, including a display panel, a position recognition layer, a bonding glue, and a cover plate. The position recognition layer is set on the display panel and includes a code point, wherein the code point includes a first body and a first microstructure connected to the first body, the first body is located between the display panel and the first microstructure, and the first The size of a microstructure is smaller than the size of the first body. The bonding glue is set on the position recognition layer. The cover plate is set on the bonding glue.

於部分實施方式中，碼點的材料為金屬。In some embodiments, the material of the code point is metal.

於部分實施方式中，感測顯示裝置更包括透光基板。透光基板設置在位置辨識圖層和顯示面板之間，且透光基板包含第二本體以及第二微結構。第二本體設置在顯示面板上。第二微結構連接第二本體並由碼點覆蓋，其中第二微結構的尺寸小於第二本體的尺寸。In some embodiments, the sensing display device further includes a light-transmitting substrate. The transparent substrate is disposed between the position recognition layer and the display panel, and the transparent substrate includes a second body and a second microstructure. The second body is provided on the display panel. The second microstructure is connected to the second body and covered by code points, wherein the size of the second microstructure is smaller than the size of the second body.

於部分實施方式中，透光基板更包括第三微結構。第三微結構連接第二本體並由貼合膠覆蓋，其中第三微結構的尺寸小於第二本體的尺寸。In some embodiments, the transparent substrate further includes a third microstructure. The third microstructure is connected to the second body and covered by the bonding glue, wherein the size of the third microstructure is smaller than the size of the second body.

於部分實施方式中，感測顯示裝置更包括透光基板。透光基板設置在位置辨識圖層和顯示面板之間，且透光基板，且透光基板包含第二本體以及第二微結構。第二本體設置在顯示面板上。第二微結構連接第二本體並位由碼點覆蓋，且第二微結構的尺寸小於第二本體的尺寸，其中第二本體與貼合膠形成第一交界面，碼點與第二微結構形成第二交界面，且第一交界面的粗糙度小於第二交界面的粗糙度。In some embodiments, the sensing display device further includes a light-transmitting substrate. The transparent substrate is disposed between the position recognition layer and the display panel, and the transparent substrate includes a second body and a second microstructure. The second body is provided on the display panel. The second microstructure is connected to the second body and is covered by code points, and the size of the second microstructure is smaller than the size of the second body, wherein the second body and the bonding glue form a first interface, the code point and the second microstructure A second interface is formed, and the roughness of the first interface is smaller than the roughness of the second interface.

於部分實施方式中，碼點的第一微結構與透光基板的第二微結構共形。In some embodiments, the first microstructure of the code point is conformal with the second microstructure of the transparent substrate.

於部分實施方式中，感測顯示裝置更包含鈍化層。位置辨識圖層在鈍化層和顯示面板之間，且貼合膠位在鈍化層與蓋板之間。In some embodiments, the sensing display device further includes a passivation layer. The position recognition layer is between the passivation layer and the display panel, and the bonding glue is between the passivation layer and the cover plate.

於部分實施方式中，第一微結構具有第一部與第二部，第一部位在第一本體與第二部之間，且第二部在第一本體上的垂直投影位於第一部在第一本體上的垂直投影內。In some embodiments, the first microstructure has a first part and a second part, the first part is between the first body and the second part, and the vertical projection of the second part on the first body is located in the first part In the vertical projection on the first body.

於部分實施方式中，第一微結構為自第一本體朝遠離顯示面板之方向凸出的顆粒狀結構。In some embodiments, the first microstructure is a granular structure protruding from the first body away from the display panel.

於部分實施方式中，碼點於顯示面板的投影形狀呈桿狀。In some embodiments, the projection shape of the code point on the display panel is rod-shaped.

於部分實施方式中，碼點具有長度與寬度，長度大於寬度，且寬度介於10微米與20微米之間。In some embodiments, the code point has a length and a width, the length is greater than the width, and the width is between 10 microns and 20 microns.

於部分實施方式中，第一微結構的高度介於100奈米至300奈米之間。In some embodiments, the height of the first microstructure is between 100 nm and 300 nm.

於部分實施方式中，貼合膠的折射率介於1.4至1.6之間。In some embodiments, the refractive index of the bonding glue is between 1.4 and 1.6.

本揭露內容之一實施方式提供一種顯示模組，包含感測顯示裝置以及操作物件，其中操作物件包含不可見光發射器與不可見光接收器。An embodiment of the disclosure provides a display module including a sensing display device and an operation object, wherein the operation object includes an invisible light emitter and an invisible light receiver.

透過上述配置，位置辨識圖層的碼點表面可呈現起伏形貌。透過碼點的起伏形貌，除了可增加碼點對於光線的反射量之外，也可提升碼點將光線反射回溯至接近其原發射位置的機會。在透過碼點增加不可見光的反射量並提升不可見光反射至不可見光接收器的機會之情況下，可利於解析出操作物件與感測顯示裝置的相對位置關係，從而增加對觸控位置的判斷精度。Through the above configuration, the surface of the code point of the position recognition layer can exhibit an undulating shape. Through the undulating shape of the code point, in addition to increasing the amount of reflection of the code point to the light, it can also enhance the chance of the code point reflecting the light back to its original emission position. In the case of increasing the amount of reflection of invisible light through the code point and increasing the chance of reflection of invisible light to the invisible light receiver, it can facilitate the analysis of the operating objectThe relative position relationship between the device and the sensing display device, thereby increasing the accuracy of determining the touch position.

100A、100B、100C、100D、100E、100F‧‧‧感測顯示裝置100A, 100B, 100C, 100D, 100E, 100F sensing display device

110‧‧‧顯示面板110‧‧‧Display panel

112‧‧‧畫素區域112‧‧‧Pixel area

120‧‧‧透光基板120‧‧‧Transparent substrate

122‧‧‧第二本體122‧‧‧Second body

124‧‧‧第二微結構124‧‧‧Second microstructure

126‧‧‧第三微結構126‧‧‧The third microstructure

130‧‧‧位置辨識圖層130‧‧‧ Location recognition layer

132‧‧‧碼點132‧‧‧ code points

134‧‧‧第一本體134‧‧‧ first body

136‧‧‧第一微結構136‧‧‧The first microstructure

137‧‧‧第一部137‧‧‧Part 1

138‧‧‧第二部138‧‧‧Part 2

139‧‧‧第三部139‧‧‧Part III

140‧‧‧貼合膠140‧‧‧ Laminating adhesive

150‧‧‧蓋板150‧‧‧cover

160‧‧‧鈍化層160‧‧‧passivation layer

200‧‧‧操作物件200‧‧‧Operation object

202‧‧‧不可見光發射器202‧‧‧Invisible light transmitter

204‧‧‧不可見光接收器204‧‧‧Invisible light receiver

206‧‧‧不可見光206‧‧‧Invisible light

DH‧‧‧橫向方向DH‧‧‧Horizontal

DV‧‧‧縱向方向DV‧‧‧Vertical

H1、H2、H3、H4、H5、H6‧‧‧高度H1, H2, H3, H4, H5, H6 ‧‧‧ height

I1‧‧‧第一交界面I1‧‧‧The first interface

I2‧‧‧第二交界面I2‧‧‧Second interface

L‧‧‧長度L‧‧‧Length

W‧‧‧寬度W‧‧‧Width

第1A圖為依據本揭露內容的第一實施方式繪示感測顯示裝置的側視示意圖。FIG. 1A is a schematic side view showing a sensing display device according to the first embodiment of the present disclosure.

第1B圖繪示第1A圖的碼點的放大示意圖。FIG. 1B is an enlarged schematic diagram of the code point in FIG. 1A.

第1C圖為繪示第1A圖的碼點相對其下方的顯示裝置的分佈位置的示意圖。FIG. 1C is a schematic diagram illustrating the distribution positions of the code points in FIG. 1A relative to the display device below it.

第1D圖繪示第1A圖的感測顯示裝置的應用方式的示意圖。FIG. 1D is a schematic diagram illustrating an application manner of the sensing display device of FIG. 1A.

第2圖為依據本揭露內容的第二實施方式繪示感測顯示裝置的側視示意圖。FIG. 2 is a schematic side view of a sensing display device according to a second embodiment of the present disclosure.

第3圖為依據本揭露內容的第三實施方式繪示感測顯示裝置的側視示意圖。FIG. 3 is a schematic side view of a sensing display device according to a third embodiment of the present disclosure.

第4圖為依據本揭露內容的第四實施方式繪示感測顯示裝置的側視示意圖。FIG. 4 is a schematic side view of a sensing display device according to a fourth embodiment of the present disclosure.

第5A圖為依據本揭露內容的第五實施方式繪示感測顯示裝置的側視示意圖。FIG. 5A is a schematic side view of a sensing display device according to a fifth embodiment of the present disclosure.

第5B圖繪示第5A圖的碼點的放大示意圖。FIG. 5B is an enlarged schematic view of the code point in FIG. 5A.

第6A圖為依據本揭露內容的第六實施方式繪示感測顯示裝置的側視示意圖。FIG. 6A is a schematic side view of a sensing display device according to a sixth embodiment of the present disclosure.

第6B圖繪示第6A圖的碼點的放大示意圖。FIG. 6B is an enlarged schematic diagram of the code point in FIG. 6A.

以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節為非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。In the following, a plurality of embodiments of the present invention will be disclosed in the form of diagrams. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings.

在本文中，使用第一、第二與第三等等之詞彙，是用於描述各種元件、組件、區域、層是可以被理解的。但是這些元件、組件、區域、層不應該被這些術語所限制。這些詞彙只限於用來辨別單一元件、組件、區域、層。因此，在下文中的一第一元件、組件、區域、層也可被稱為第二元件、組件、區域、層，而不脫離本發明的本意。In this article, the terms first, second, third, etc. are used to describe various elements, components, regions, and layers that can be understood. But these elements, components, regions, layers should not be limited by these terms. These vocabularies are limited to identifying single components, components, regions, and layers. Therefore, a first element, component, region, layer in the following may also be referred to as a second element, component, region, layer without departing from the original intention of the present invention.

本揭露內容的感測顯示裝置為一種具可操作性的感測顯示裝置，即感測顯示裝置除了具有顯示影像的功能之外，還可感測使用者的觸控位置，從而提供使用者進行觸控操作。The sensing display device of the present disclosure is an operable sensing display device, that is, in addition to the function of displaying images, the sensing display device can also sense the touch position of the user, thereby providing the user with Touch operation.

請參照第1A圖，第1A圖為依據本揭露內容的第一實施方式繪示感測顯示裝置100A的側視示意圖。感測顯示裝置100A包含顯示面板110、透光基板120、位置辨識圖層130、貼合膠140以及蓋板150，其中透光基板120、位置辨識圖層130、貼合膠140以及蓋板150疊置在顯示面板110上。Please refer to FIG. 1A. FIG. 1A is a schematic side view illustrating asensing display device 100A according to the first embodiment of the present disclosure. Thesensing display device 100A includes adisplay panel 110, atransparent substrate 120, aposition recognition layer 130, abonding glue 140 and acover plate 150, wherein thetransparent substrate 120, theposition recognition layer 130, thebonding glue 140 and thecover plate 150 are stacked On thedisplay panel 110.

顯示面板110可用以提供影像，其中顯示面板110所提供的影像可在穿過透光基板120、貼合膠140以及蓋板150後供使用者視得，即顯示面板110的上表面可做為其顯示面。Thedisplay panel 110 can be used to provide images, wherein thedisplay panel 110The provided image can be viewed by the user after passing through thetransparent substrate 120, the adhesive 140 and thecover plate 150, that is, the upper surface of thedisplay panel 110 can be used as its display surface.

透光基板120設置在顯示面板110上，其中透光基板120可貼附在顯示面板110的上表面，然而本揭露內容不以此配置方式為限，於其他實施方式中，也可額外配置支撐結構(未繪示)於顯示面板110和透光基板120之間，以使顯示面板110和透光基板120之間會存在氣隙。此外，透光基板120可以是玻璃基板、擴散玻璃板、光學膜片或是其他具透光性的基材。Thetransparent substrate 120 is disposed on thedisplay panel 110, wherein thetransparent substrate 120 can be attached to the upper surface of thedisplay panel 110, however, the disclosure is not limited to this configuration, and in other embodiments, additional support may be provided. The structure (not shown) is between thedisplay panel 110 and thetransparent substrate 120 so that there is an air gap between thedisplay panel 110 and thetransparent substrate 120. In addition, thetransparent substrate 120 may be a glass substrate, a diffused glass plate, an optical film, or other transparent substrates.

位置辨識圖層130設置在透光基板120上，並接觸透光基板120。位置辨識圖層130包含多個碼點132，其中碼點132的材料可以是金屬或是其他具光反射性的材料，以使碼點132可具光反射性。Theposition recognition layer 130 is disposed on thetransparent substrate 120 and contacts thetransparent substrate 120. Theposition recognition layer 130 includes a plurality ofcode points 132, wherein the material of thecode points 132 may be metal or other light reflective materials, so that thecode points 132 can be light reflective.

請同時看到第1A圖與第1B圖，其中第1B圖繪示第1A圖的碼點132的放大示意圖。每一個碼點132會包含第一本體134與連接在第一本體134上的第一微結構136，其中第一本體134位在透光基板120與第一微結構136之間，且第一微結構136的尺寸小於第一本體134的尺寸。具體來說，本實施方式中，第一本體134的高度H1可介於300奈米至500奈米之間，而第一微結構136的高度H2可介於100奈米至300奈米之間。第一微結構136的橫切面大致呈現三角形，透過此配置，碼點132的上表面會呈現起伏形貌。Please see Figure 1A and Figure 1B at the same time. Figure 1B shows an enlarged schematic view of thecode point 132 of Figure 1A. Eachcode point 132 includes afirst body 134 and afirst microstructure 136 connected to thefirst body 134, wherein thefirst body 134 is located between thetransparent substrate 120 and thefirst microstructure 136, and the first microstructure The size of thestructure 136 is smaller than the size of thefirst body 134. Specifically, in this embodiment, the height H1 of thefirst body 134 may be between 300 nm and 500 nm, and the height H2 of thefirst microstructure 136 may be between 100 nm and 300 nm . The cross-section of thefirst microstructure 136 is generally triangular, and through this configuration, the upper surface of thecode point 132 will exhibit an undulating shape.

碼點132可透過微影製程形成在透光基板120上。例如，可先在透光基板120上形成一個層體，並藉由對此層體進行曝光與蝕刻來形成碼點，此時，所形成的碼點的上表面尚未呈現起伏形貌。於部分實施方式中，可接著對所形成的碼點的表面進行轟擊，例如使用氣體粒子進行轟擊，以形成如第1B圖的微結構。於其他實施方式中，可接著對所形成的碼點進行曝光與與蝕刻，以形成如第1B圖的微結構，其中所形成的微結構的分佈位置、形貌及尺寸可依據所使用的光罩圖案或是蝕刻時間來調整。舉例來說，所形成的微結構也可以是條狀、不規則凹陷狀或其他可使碼點132上表面呈現起伏形貌的形狀。Thecode point 132 may be formed on the light-transmittingsubstrate 120 through a lithography process. For example, a layered body can be formed on the light-transmittingsubstrate 120 first, and code points can be formed by exposing and etching the layered body. At this time, the formed code points are listed in the table above.The surface has not shown ups and downs. In some embodiments, the surface of the formed code point may be bombarded, for example, using gas particles to form a microstructure as shown in FIG. 1B. In other embodiments, the formed code points can then be exposed and etched to form the microstructure as shown in FIG. 1B, wherein the distribution position, morphology and size of the formed microstructure can depend on the light used Adjust the mask pattern or etching time. For example, the formed microstructures may also be strips, irregular depressions, or other shapes that can make the upper surface of thecode point 132 exhibit a undulating shape.

請再看到第1C圖，第1C圖為繪示第1A圖的碼點132相對其下方的顯示面板110的分佈位置的示意圖。第1C圖所繪的視角為以俯視視角看向感測顯示裝置100A(即自第1A圖的感測顯示裝置100A的上方看向感測顯示裝置100A)。如第1C圖所示，顯示面板110具有多個畫素區域112，這些畫素區域112大致呈現類似矩形的形狀，並沿著第1C圖的橫向方向DH與縱向方向DV排成陣列。Please refer to FIG. 1C again. FIG. 1C is a schematic diagram illustrating the distribution positions of thecode points 132 of FIG. 1A relative to thedisplay panel 110 therebelow. The angle of view depicted in FIG. 1C is to look at thesensing display device 100A from a top view (that is, from above thesensing display device 100A of FIG. 1A to thesensing display device 100A). As shown in FIG. 1C, thedisplay panel 110 has a plurality ofpixel regions 112, which generally have a rectangular-like shape, and are arranged in an array along the horizontal direction DH and the vertical direction DV of FIG. 1C.

碼點132於顯示面板110的投影形狀係呈桿狀。具體而言，當以俯視視角看向碼點132(即自第1A圖的感測顯示裝置100A的上方看向碼點132)的時候，碼點132會呈桿狀，且這些桿狀的碼點132的延伸方向異於第1C圖的橫向方向DH與縱向方向DV，即碼點132的延伸方向會異於顯示面板110的畫素區域112的排列方向。此外，碼點132具有長度L與寬度W，且長度L大於寬度W，其中長度L可介於130微米與150微米之間，而寬度W可介於10微米與20微米之間。透過將碼點132配置為傾斜畫素區域112的排列方向並將碼點132設計為如上述的尺寸，可降低人眼對碼點132的可視得性，從而避免碼點132干擾使用者的觀看體驗。The projected shape of thecode point 132 on thedisplay panel 110 is rod-shaped. Specifically, when looking at thecode point 132 from a top view (that is, when looking at thecode point 132 from above thesensing display device 100A in FIG. 1A), thecode point 132 will be in the shape of a bar, and these bar-shaped codes The extending direction of thedot 132 is different from the horizontal direction DH and the vertical direction DV of FIG. 1C, that is, the extending direction of thecode point 132 is different from the arrangement direction of thepixel regions 112 of thedisplay panel 110. In addition, thecode point 132 has a length L and a width W, and the length L is greater than the width W, wherein the length L may be between 130 μm and 150 μm, and the width W may be between 10 μm and 20 μm. By arranging thecode points 132 in the arrangement direction of theoblique pixel regions 112 and designing thecode points 132 as described aboveThe size can reduce the visibility of thecode point 132 by the human eye, thereby preventing thecode point 132 from interfering with the user's viewing experience.

請再回到第1A圖。貼合膠140設置在透光基板120上，並接觸透光基板120及位置辨識圖層130，其中貼合膠140具有可透光性，其例如可以是水膠或光學膠。此外，貼合膠140的折射率可與透光基板120匹配，例如當透光基板120為玻璃基板的時候，貼合膠140的折射率可介於1.4至1.6之間，以助於穿過透光基板120的光線入射至貼合膠140內。蓋板150設置在位置辨識圖層130與貼合膠140上，並具有可透光性，其例如可以是軟性基板或是其他透光性基板，且蓋板150可藉由貼合膠140的黏著性而固定。蓋板150可用做為保護層，以保護位在其下的層體或元件受到磨損。於第1A圖所繪的結構中，位置辨識圖層130的碼點132與蓋板150之間會存在一段間距，並透過貼合膠140將彼此分隔開來。然而，於其他實施方式中，在貼合膠140填充於透光基板120與蓋板150之間的情況下，位置辨識圖層130的碼點132也可以接觸蓋板150。Please go back to Figure 1A. Thebonding glue 140 is disposed on the light-transmittingsubstrate 120 and contacts the light-transmittingsubstrate 120 and theposition recognition layer 130. Thebonding glue 140 is light-transmissive, which may be, for example, water glue or optical glue. In addition, the refractive index of the adhesive 140 can be matched with thetransparent substrate 120. For example, when thetransparent substrate 120 is a glass substrate, the refractive index of the adhesive 140 can be between 1.4 and 1.6 to help pass through The light from thetransparent substrate 120 is incident into thebonding glue 140. Thecover plate 150 is disposed on theposition recognition layer 130 and thebonding glue 140, and has light transmittance, which may be, for example, a flexible substrate or other light-transmissive substrates, and thecover plate 150 may be adhered by thebonding glue 140 Sex and fixed. Thecover plate 150 can be used as a protective layer to protect the layer body or component underneath from wear. In the structure depicted in FIG. 1A, there is a gap between thecode point 132 of theposition recognition layer 130 and thecover plate 150, and are separated from each other by thebonding glue 140. However, in other embodiments, when thebonding glue 140 is filled between thetransparent substrate 120 and thecover 150, thecode point 132 of theposition recognition layer 130 may also contact thecover 150.

透過上述配置，當有光線自感測顯示裝置100A的上方往感測顯示裝置100A行進並接觸碼點132的時候，由於碼點132的上表面為呈現起伏形貌，故可增加碼點132對於光線的反射量。此外，透過碼點132的起伏形貌，可提升碼點132將光線反射回溯至接近其原發射位置的機會。Through the above configuration, when light travels from above thesensing display device 100A toward thesensing display device 100A and contacts thecode point 132, since the upper surface of thecode point 132 presents an undulating shape, thecode point 132 can be increased for The amount of light reflected. In addition, through the undulating topography of thecode point 132, the chance of thecode point 132 reflecting light back to its original emission position can be improved.

舉例來說，請看到第1D圖，第1D圖繪示第1A圖的感測顯示裝置100A的應用方式的示意圖。如第1D圖所示，第1A圖的感測顯示裝置100A可搭配操作物件200而應用成為顯示模組(即顯示模組包含感測顯示裝置100A與操作物件200)。感測顯示裝置100A可透過顯示面板110提供影像及提供操作介面(例如虛擬選單)。操作物件200可供使用者操作感測顯示裝置100A所提供的操作介面(例如虛擬選單)。For example, please see FIG. 1D, which illustrates a schematic diagram of an application manner of thesensing display device 100A of FIG. 1A. As shown in FIG. 1D, thesensing display device 100A of FIG. 1A can be used as anoperation object 200 to become anThe display module (that is, the display module includes thesensing display device 100A and the operation object 200). Thesensing display device 100A can provide images through thedisplay panel 110 and provide an operation interface (such as a virtual menu). Theoperation object 200 can be used for a user to operate an operation interface (such as a virtual menu) provided by thesensing display device 100A.

操作物件200可包含不可見光發射器202與不可見光接收器204，其中不可見光例如可以是紅外光波段或紫外線波段。當使用者藉由操作物件200進行操作的時候，操作物件200的不可見光發射器202可朝著感測顯示裝置100A發射不可見光206。Theoperation object 200 may include aninvisible light emitter 202 and aninvisible light receiver 204, where the invisible light may be, for example, an infrared band or an ultraviolet band. When the user operates by operating theobject 200, theinvisible light emitter 202 of theoperating object 200 may emitinvisible light 206 toward thesensing display device 100A.

當不可見光206照射感測顯示裝置100A的時候，照射在碼點132的不可見光206可由碼點132反射，其中具有起伏形貌的碼點132可利於將不可見光206反射回溯至接近操作物件200，例如，碼點132可將不可見光206反射至不可見光接收器204。此外，具有起伏形貌的碼點132也可增加不可見光206的反射量，以利不可見光接收器204接收更多自碼點132反射的不可見光206。具體而言，不可見光206可經第一微結構136反射至不可見光接收器204；或者，不可見光206也可以是經由第一微結構136反射至第一本體134並再經由第一本體134反射至不可見光接收器204，反之亦然。When theinvisible light 206 illuminates thesensing display device 100A, theinvisible light 206 irradiated on thecode point 132 can be reflected by thecode point 132, wherein thecode point 132 having an undulating shape can facilitate the reflection of theinvisible light 206 back to close to theoperation object 200 For example, thecode point 132 may reflect theinvisible light 206 to theinvisible light receiver 204. In addition, thecode dots 132 having an undulating shape can also increase the amount of reflection of theinvisible light 206, so that theinvisible light receiver 204 can receive moreinvisible light 206 reflected from thecode dot 132. Specifically, theinvisible light 206 may be reflected to theinvisible light receiver 204 via thefirst microstructure 136; or, theinvisible light 206 may be reflected to thefirst body 134 via thefirst microstructure 136 and then reflected via thefirst body 134 Invisiblelight receiver 204, and vice versa.

操作物件200可經由接收反射的不可見光206形成黑白或灰階影像，其中此黑白或灰階影像的對比度與光線的接收量相關，且可透過所形成的影像判讀出碼點132的位置以及其配向(即桿狀碼點132的傾斜方向)，藉以判斷出操作物件200的觸控位置。也就是說，透過碼點132增加不可見光206的反射量並提升不可見光206反射至不可見光接收器204的機會，可利於解析出操作物件200與感測顯示裝置100A的相對位置關係，從而增加顯示模組對觸控位置的判斷精度。Theoperation object 200 can form a black-and-white or gray-scale image by receiving reflectedinvisible light 206, wherein the contrast of the black-and-white or gray-scale image is related to the amount of light received, and the position of thecode point 132 and its Alignment (ie, the tilt direction of the rod-shaped code point 132), so as to determine the touch position of theoperation object 200. In other words, increase theinvisible light 206 through thecode point 132The amount of reflection increases the chance of theinvisible light 206 reflecting to theinvisible light receiver 204, which facilitates the analysis of the relative positional relationship between the operatingobject 200 and thesensing display device 100A, thereby increasing the accuracy of the display module in determining the touch position.

此外，於部分實施方式中，操作物件200可更包含濾光層(未繪示)，從而防止因接收到不預期波長的光線而導致的誤判狀況。In addition, in some embodiments, theoperation object 200 may further include a filter layer (not shown), so as to prevent misjudgment caused by receiving light of an unexpected wavelength.

請再看到第2圖，第2圖為依據本揭露內容的第二實施方式繪示感測顯示裝置100B的側視示意圖。本實施方式與第一實施方式的至少一個差異點在於，本實施方式的透光基板120具有微結構。具體來說，本實施方式的透光基板120可以是玻璃基板，例如像是擴散玻璃板，且如第2圖所示，透光基板120包含第二本體122、第二微結構124及第三微結構126，其中第二本體122設置在顯示面板110上。Please refer to FIG. 2 again. FIG. 2 is a schematic side view illustrating thesensing display device 100B according to the second embodiment of the present disclosure. At least one difference between this embodiment and the first embodiment is that the light-transmittingsubstrate 120 of this embodiment has a microstructure. Specifically, thetransparent substrate 120 of this embodiment may be a glass substrate, such as a diffused glass plate, and as shown in FIG. 2, thetransparent substrate 120 includes asecond body 122, asecond microstructure 124, and a third Themicrostructure 126 in which thesecond body 122 is disposed on thedisplay panel 110.

第二微結構124連接第二本體122並由碼點132覆蓋，且第二本體122位在顯示面板110和第二微結構124之間，其中第二微結構124的尺寸小於第二本體122的尺寸。第三微結構126連接第二本體122並由貼合膠140覆蓋，且第二本體122位在顯示面板110和第三微結構126之間，其中第三微結構126的尺寸小於第二本體122的尺寸。透過第二微結構124與第三微結構126，透光基板120的上表面會呈現起伏形貌。Thesecond microstructure 124 is connected to thesecond body 122 and covered by thecode point 132, and thesecond body 122 is located between thedisplay panel 110 and thesecond microstructure 124, wherein the size of thesecond microstructure 124 is smaller than that of thesecond body 122 size. Thethird microstructure 126 is connected to thesecond body 122 and covered by thebonding glue 140, and thesecond body 122 is located between thedisplay panel 110 and thethird microstructure 126, wherein the size of thethird microstructure 126 is smaller than thesecond body 122 size of. Through thesecond microstructure 124 and thethird microstructure 126, the upper surface of the light-transmittingsubstrate 120 will exhibit an undulating shape.

本實施方式中，透光基板120的第二微結構124及第三微結構126可透過表面處理形成，像是當透光基板120為玻璃基板的時候，可透過噴砂或是離子束轟擊來形成微結構，其中第二微結構124與第三微結構126可以是藉由同一道表面處理製程來形成，從而簡化製程，以方便製作具微結構的玻璃基板。此外，第二微結構124的尺寸與第三微結構126的尺寸可與第一實施方式的第一微結構136的尺寸略同，即第二微結構124的高度與第三微結構126的高度可介於100奈米至300奈米之間。In this embodiment, thesecond microstructure 124 and thethird microstructure 126 of thetransparent substrate 120 can be formed by surface treatment, such as when thetransparent substrate 120 is a glass substrate, it can be formed by sandblasting or ion beam bombardment Microstructure, wherein thesecond microstructure 124 and thethird microstructure 126 may be through the same channelThe surface treatment process is formed to simplify the process and facilitate the production of glass substrates with microstructures. In addition, the size of thesecond microstructure 124 and the size of thethird microstructure 126 may be slightly the same as the size of thefirst microstructure 136 of the first embodiment, that is, the height of thesecond microstructure 124 and the height of thethird microstructure 126 It can be between 100 nm and 300 nm.

碼點132的第一微結構136的起伏形貌可藉由透光基板120的第二微結構124的起伏形貌來形成。具體來說，當在具有第二微結構124的透光基板120上形成碼點132的時候，碼點132會與其下的透光基板120的第二微結構124共形，從而於其表面處形成第一微結構136。因此，碼點132的第一微結構136的形貌係會與透光基板120的第二微結構124的形貌大致相同，且碼點132的第一微結構136所致使的粗糙度可以與透光基板120的第二微結構124所致使的粗糙度大致相等，其中此粗糙度(Ra)約介於100奈米與300奈米之間。透過此配置，可省略對碼點132的表面處理，從而使位置辨識圖層130的製程更彈性。The relief topography of thefirst microstructure 136 of thecode point 132 can be formed by the relief topography of thesecond microstructure 124 of the light-transmittingsubstrate 120. Specifically, when thecode dots 132 are formed on thetransparent substrate 120 having thesecond microstructure 124, thecode dots 132 will conform to thesecond microstructure 124 of thetransparent substrate 120 underneath, so as to be on the surface Thefirst microstructure 136 is formed. Therefore, the shape of thefirst microstructure 136 of thecode point 132 is approximately the same as the shape of thesecond microstructure 124 of thetransparent substrate 120, and the roughness caused by thefirst microstructure 136 of thecode point 132 can be The roughness caused by thesecond microstructure 124 of thetransparent substrate 120 is approximately equal, wherein the roughness (Ra) is approximately between 100 nm and 300 nm. Through this configuration, the surface treatment of thecode point 132 can be omitted, thereby making the process of theposition recognition layer 130 more flexible.

覆蓋在第三微結構126上的貼合膠140可填入至第三微結構126的側壁間隙內，且在貼合膠140的折射率與透光基板120的折射率相匹配(即例如透光基板120為玻璃基板，且貼合膠140與玻璃基板的折射率皆介於1.4至1.5之間)的情況下，可避免顯示面板110所顯示的影像品質受第三微結構126影響。Thebonding glue 140 covering thethird microstructure 126 can be filled into the gap of the sidewall of thethird microstructure 126, and the refractive index of thebonding glue 140 matches the refractive index of the transparent substrate 120 (i.e., transparent When theoptical substrate 120 is a glass substrate, and the refractive indexes of the adhesive 140 and the glass substrate are both between 1.4 and 1.5), the image quality displayed by thedisplay panel 110 can be prevented from being affected by thethird microstructure 126.

請再看到第3圖，第3圖為依據本揭露內容的第三實施方式繪示感測顯示裝置100C的側視示意圖。本實施方式與第一實施方式的至少一個差異點在於，本實施方式的透光基板120包含微結構。具體來說，本實施方式的透光基板120可以是玻璃基板，例如像是擴散玻璃板，且如第3圖所示，透光基板120包括第二本體122以及第二微結構124，其中第二本體122設置在顯示面板110上。Please refer to FIG. 3 again. FIG. 3 is a schematic side view illustrating thesensing display device 100C according to the third embodiment of the present disclosure. This embodimentAt least one difference from the first embodiment is that the light-transmittingsubstrate 120 of this embodiment includes a microstructure. Specifically, thetransparent substrate 120 of this embodiment may be a glass substrate, such as a diffused glass plate, and as shown in FIG. 3, thetransparent substrate 120 includes asecond body 122 and asecond microstructure 124, wherein The twobodies 122 are disposed on thedisplay panel 110.

第二微結構124連接第二本體122並位由碼點132覆蓋，且第二本體122位在顯示面板110和第二微結構124之間，其中第二微結構124的尺寸小於第二本體122的尺寸。Thesecond microstructure 124 is connected to thesecond body 122 and is covered by thecode point 132, and thesecond body 122 is located between thedisplay panel 110 and thesecond microstructure 124, wherein the size of thesecond microstructure 124 is smaller than thesecond body 122 size of.

同前所述，第二微結構124可透過表面處理形成，像是噴砂或是離子束轟擊。於部分實施方式中，在進行表面處理的期間，可遮蔽透光基板120的部分區域，以使第二微結構124產生在透光基板120未被遮蔽的區域。As described above, thesecond microstructure 124 can be formed by surface treatment, such as sandblasting or ion beam bombardment. In some embodiments, during the surface treatment, a portion of thetransparent substrate 120 may be shielded, so that thesecond microstructure 124 is generated in the unshielded area of thetransparent substrate 120.

具體來說，透光基板120在不同區域的粗糙度會有所不同，例如，透光基板120的第二本體122會與貼合膠140形成第一交界面I1，而透光基板120的第二微結構124會與碼點132形成第二交界面I2，其中第一交界面I1的粗糙度小於第二交界面I2的粗糙度，且第一交界面I1的粗糙度(Ra)約介於100奈米與300奈米之間。換言之，對於透光基板120的上表面而言，貼合膠140所覆蓋的區域會比碼點132所覆蓋的區域相對平坦。對這些由貼合膠140覆蓋且相對平坦的區域而言，其可利於顯示面板110提供穩定品質的影像。Specifically, the roughness of thetransparent substrate 120 in different regions will be different. For example, thesecond body 122 of thetransparent substrate 120 and thebonding glue 140 form a first interface I1, and the first The twomicrostructures 124 and thecode point 132 form a second interface I2, wherein the roughness of the first interface I1 is less than the roughness of the second interface I2, and the roughness (Ra) of the first interface I1 is approximately between Between 100 nm and 300 nm. In other words, for the upper surface of thetransparent substrate 120, the area covered by thebonding glue 140 is relatively flat than the area covered by thecode dots 132. For these relatively flat areas covered by the laminating adhesive 140, it can facilitate thedisplay panel 110 to provide stable quality images.

此外，第二微結構124的尺寸可與第一實施方式的第一微結構136的尺寸略同，即第二微結構124的高度可介於100奈米至300奈米之間。同樣地，碼點132的第一微結構136可藉由透光基板120的第二微結構124形成，此關於形成碼點132的第一微結構136的方式可與第二實施方式所述之方式雷同，故在此不再贅述。In addition, the size of thesecond microstructure 124 may be slightly the same as the size of thefirst microstructure 136 of the first embodiment, that is, the height of thesecond microstructure 124 may be between 100 nm and 300 nm. Similarly, thefirst microstructure 136 of thecode point 132It may be formed by thesecond microstructure 124 of the light-transmittingsubstrate 120. The method of forming thefirst microstructure 136 of thecode point 132 may be the same as the method described in the second embodiment, so it will not be repeated here.

請再看到第4圖，第4圖為依據本揭露內容的第四實施方式繪示感測顯示裝置100D的側視示意圖。本實施方式與第一實施方式的至少一個差異點在於，本實施方式的感測顯示裝置100D更包含鈍化層160，且鈍化層160位在顯示面板110與貼合膠140之間，其中鈍化層160的材料可包含無機材料，例如氧化矽、氮化矽、氮氧化矽、其它合適的材料、或上述之組合。Please refer to FIG. 4 again. FIG. 4 is a schematic side view illustrating thesensing display device 100D according to the fourth embodiment of the present disclosure. At least one difference between this embodiment and the first embodiment is that thesensing display device 100D of this embodiment further includes apassivation layer 160, and thepassivation layer 160 is located between thedisplay panel 110 and thebonding glue 140, wherein the passivation layer The material of 160 may include inorganic materials, such as silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or combinations thereof.

具體來說，如第4圖所示，鈍化層160可覆蓋在透光基板120及位置辨識圖層130上，以使位置辨識圖層130位在鈍化層160和顯示面板110之間。鈍化層160可做為位置辨識圖層130的保護層，從而防止碼點132因遭擠壓而變形或是防止碼點132受到磨損。此外，位置辨識圖層130可透過鈍化層160而與貼合膠140分隔開來，其中貼合膠140係配置在鈍化層160上且位在鈍化層160與蓋板150之間。Specifically, as shown in FIG. 4, thepassivation layer 160 may cover thetransparent substrate 120 and theposition recognition layer 130 so that theposition recognition layer 130 is located between thepassivation layer 160 and thedisplay panel 110. Thepassivation layer 160 can be used as a protective layer for theposition recognition layer 130, thereby preventing thecode point 132 from being deformed due to being pressed or preventing thecode point 132 from being worn. In addition, theposition recognition layer 130 can be separated from thebonding adhesive 140 by thepassivation layer 160, wherein thebonding adhesive 140 is disposed on thepassivation layer 160 and is located between thepassivation layer 160 and thecover plate 150.

此外，雖本實施方式的透光基板120係繪示為如第一實施方式的透光基板120，然而，本揭露內容不以此為限，例如，本實施方式的透光基板120也可置換為第二實施方式的透光基板120或是第三實施方式的透光基板120。In addition, although thetransparent substrate 120 of this embodiment is shown as thetransparent substrate 120 of the first embodiment, the disclosure content is not limited thereto. For example, thetransparent substrate 120 of this embodiment can also be replaced It is thetransparent substrate 120 of the second embodiment or thetransparent substrate 120 of the third embodiment.

請再看到第5A圖與第5B圖，第5A圖為依據本揭露內容的第五實施方式繪示感測顯示裝置100E的側視示意圖，而第5B圖繪示第5A圖的碼點132的放大示意圖。本實施方式與第一實施方式的至少一個差異點在於，本實施方式的碼點132的第一微結構136的橫切面大致呈現塔形。Please refer to FIGS. 5A and 5B again. FIG. 5A is a schematic side view of thesensing display device 100E according to the fifth embodiment of the present disclosure, and FIG. 5B shows thecode point 132 of FIG. 5A. The enlarged schematic. This implementationAt least one difference between the method and the first embodiment is that the cross section of thefirst microstructure 136 of thecode point 132 of the present embodiment is substantially tower-shaped.

具體來說，如第5B圖所示，碼點132的第一微結構136具有第一部137、第二部138與第三部139，其中第一部137位在第一本體134與第二部138之間，而第二部138位在第一部137與第三部139之間。Specifically, as shown in FIG. 5B, thefirst microstructure 136 of thecode point 132 has afirst portion 137, asecond portion 138, and athird portion 139, wherein thefirst portion 137 is located on thefirst body 134 and the second Between thefirst part 137 and thethird part 139.

對於塔形的的第一微結構136而言，第二部138在第一本體134上的垂直投影P2會位於第一部137在第一本體134上的垂直投影P1內，且會與第一部137在第一本體134上的垂直投影P1的邊界相隔一段距離。同樣地，第三部139在第一本體134上的垂直投影P3會位於第二部138在第一本體134上的垂直投影P2內，且會與第二部138在第一本體134上的垂直投影P2的邊界相隔一段距離。此外，塔形的第一微結構136的每一層可具有大致相同的高度，舉例來說，塔形的第一微結構136的第一部137的高度H3、第二部138的高度H4與第三部139的高度H5分別可介於90奈米至110奈米之間。For the tower-shapedfirst microstructure 136, the vertical projection P2 of thesecond portion 138 on thefirst body 134 will be located in the vertical projection P1 of thefirst portion 137 on thefirst body 134, and will be in contact with the first The boundary of the vertical projection P1 of theportion 137 on thefirst body 134 is separated by a distance. Similarly, the vertical projection P3 of thethird portion 139 on thefirst body 134 will be located in the vertical projection P2 of thesecond portion 138 on thefirst body 134 and will be perpendicular to thesecond portion 138 on thefirst body 134 The boundaries of projection P2 are separated by a distance. In addition, each layer of the tower-shapedfirst microstructure 136 may have approximately the same height. For example, the height H3 of thefirst portion 137 and the height H4 of thesecond portion 138 The height H5 of the threeparts 139 may be between 90 nm and 110 nm, respectively.

藉由塔形的第一微結構136，可使由碼點132反射的光線具有良好的指向性，以使操作物件(例如第1D圖的操作物件200)所接收的光線量增加，從而提升操作物件所接到的影像對比度，並進一步提升對觸控位置的判斷精度。With the tower-shapedfirst microstructure 136, the light reflected by thecode point 132 can have good directivity, so that the amount of light received by the operation object (such as theoperation object 200 in FIG. 1D) increases, thereby improving the operation The contrast of the image received by the object further improves the accuracy of determining the touch position.

請再看到第6A圖與第6B圖，第6A圖為依據本揭露內容的第六實施方式繪示感測顯示裝置100F的側視示意圖，而第6B圖繪示第6A圖的碼點132的放大示意圖。本實施方式與第一實施方式的至少一個差異點在於，本實施方式的碼點132的第一微結構136為呈現顆粒狀。Please refer to FIG. 6A and FIG. 6B again. FIG. 6A is a schematic side view of thesensing display device 100F according to the sixth embodiment of the present disclosure, and FIG. 6B shows thecode point 132 of FIG. 6A. The enlarged schematic. At least one difference between this embodiment and the first embodiment is that the code of this embodimentThefirst microstructure 136 of thepoint 132 is granular.

具體來說，如第6B圖所示，碼點132的第一微結構136為顆粒狀的結構，且此顆粒狀的結構係自第一本體134朝遠離顯示面板110之方向凸出，即呈現顆粒狀的第一微結構136是朝著感測顯示裝置100F的上方凸出。本實施方式中，雖第6A圖與第6B圖的碼點132的第一微結構136是繪示為半圓形，然而，於其他實施方式中，碼點132的第一微結構136也可以是其他形狀，像是半橢圓形或是其他表面為曲面的形狀。此外，碼點132的第一微結構136的高度H6可介於230奈米至270奈米之間。Specifically, as shown in FIG. 6B, thefirst microstructure 136 of thecode point 132 is a granular structure, and the granular structure protrudes from thefirst body 134 away from thedisplay panel 110, that is, it appears The granularfirst microstructure 136 protrudes upward from thesensing display device 100F. In this embodiment, although thefirst microstructure 136 of thecode point 132 in FIGS. 6A and 6B is shown as a semicircle, in other embodiments, thefirst microstructure 136 of thecode point 132 may be It is other shapes, such as a semi-ellipse or other shapes with curved surfaces. In addition, the height H6 of thefirst microstructure 136 of thecode point 132 may be between 230 nm and 270 nm.

藉由顆粒狀的第一微結構136，可增加碼點132的反射範圍，以使位置辨識圖層130能對應反射更多不同入射角度的光線，從而擴大操作物件(例如第1D圖的操作物件200)的使用角度。在此，所述「操作物件的使用角度」表示筆狀的操作物件即使在更傾斜於感測顯示裝置100F的情況下，位置辨識圖層130仍可將操作物件發出的光線反射回操作物件。換言之，藉由顆粒狀的第一微結構136，可提供使用者有更彈性的操作方式。With the granularfirst microstructure 136, the reflection range of thecode point 132 can be increased, so that theposition recognition layer 130 can reflect more light rays with different incident angles, thereby expanding the operation object (for example, theoperation object 200 in FIG. 1D) ) Angle of use. Here, the “use angle of the operation object” indicates that theposition recognition layer 130 can reflect the light emitted by the operation object back to the operation object even when the operation object in a pen shape is more inclined to thesensing display device 100F. In other words, the granularfirst microstructure 136 can provide the user with a more flexible operation method.

雖第五實施方式與第六實施方式的透光基板120是繪示為具有微結構，然而，本揭露內容不以此為限，於其他實施方式中，也可將第五實施方式與第六實施方式的透光基板120置換為上述其他實施方式所繪的透光基板120，且所置換的透光基板120具有對應形狀的微結構，例如第五實施方式的塔形或是第六實施方式的顆粒狀。此外，各實施方式的微結構數量僅為例示，其非用以限制本揭露內容，例如第5A圖的每一個碼點132的塔形微結構的數量可由三個變更為兩個，或是第6A圖的每一個碼點132的顆粒狀微結構的數量可由一個變更為三個。Although the light-transmittingsubstrates 120 of the fifth and sixth embodiments are illustrated as having microstructures, the disclosure is not limited to this. In other embodiments, the fifth and sixth embodiments can also be used The light-transmittingsubstrate 120 of the embodiment is replaced with the light-transmittingsubstrate 120 described in other embodiments above, and the replaced light-transmittingsubstrate 120 has a microstructure with a corresponding shape, such as the tower shape of the fifth embodiment or the sixth embodiment. Granular. In addition, the microstructure of each embodimentThe number is for illustration only, and it is not intended to limit the content of this disclosure. For example, the number of tower-shaped microstructures for eachcode point 132 in FIG. 5A can be changed from three to two, or for eachcode point 132 in FIG. 6A The number of granular microstructures can be changed from one to three.

綜上所述，本揭露內容的感測顯示裝置包含顯示面板以及位置辨識圖層。位置辨識圖層設置在顯示面板上並包含多個碼點，其中碼點具有微結構，以致使碼點表面可呈現起伏形貌。透過碼點的起伏形貌，除了可增加碼點對於光線的反射量之外，也可提升碼點將光線反射回溯至接近其原發射位置的機會。當使用操作物件對感測顯示裝置發射不可見光時，碼點可將不可見光反射至操作物件的不可見光接收器，以使操作物件可形成黑白或灰階影像。在透過碼點增加不可見光的反射量並提升不可見光反射至不可見光接收器的機會之情況下，可利於解析出操作物件與感測顯示裝置的相對位置關係，從而增加對觸控位置的判斷精度。In summary, the sensing display device of the present disclosure includes a display panel and a position recognition layer. The position recognition layer is set on the display panel and contains a plurality of code points, wherein the code points have microstructures, so that the surface of the code points can exhibit an undulating shape. Through the undulating shape of the code point, in addition to increasing the amount of reflection of the code point to the light, it can also enhance the chance of the code point reflecting the light back to its original emission position. When the operating object is used to emit invisible light to the sensing display device, the code point can reflect the invisible light to the invisible light receiver of the operating object, so that the operating object can form a black and white or grayscale image. In the case of increasing the amount of reflection of invisible light through the code point and increasing the chance of invisible light reflecting to the invisible light receiver, it can facilitate the analysis of the relative positional relationship between the operating object and the sensing display device, thereby increasing the judgment of the touch position Precision.

雖然本發明已以多種實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in various embodiments as above, it is not intended to limit the present invention. Anyone who is familiar with this skill can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of protection shall be deemed as defined by the scope of the attached patent application.

100A‧‧‧感測顯示裝置100A‧‧‧sensing display device