本發明與指紋辨識裝置相關，尤其與指紋辨識裝置內部的元件配置方式相關。The invention relates to a fingerprint identification device, and in particular to a component arrangement within the fingerprint recognition device.
為了提升資料安全性並免去記憶密碼的麻煩，近年來有許多電子產品提供了以指紋做為身分認證依據的功能。典型的指紋辨識裝置通常包含一個指紋辨識晶片以及由多個感應元件構成之一感應器。指紋辨識晶片係用以驅動該等感應元件並接收該等感應元件產生的信號。由於指紋凹處與指紋凸處對感應元件會產生程度不同的影響，指紋辨識晶片能根據該等感應元件產生的信號大小判斷指紋圖樣。In order to improve the security of data and avoid the trouble of memorizing passwords, in recent years, many electronic products have provided the function of using fingerprint as the basis for identity authentication. A typical fingerprint recognition device typically includes a fingerprint recognition wafer and an inductor formed by a plurality of sensing elements. The fingerprint identification chip is used to drive the sensing elements and receive signals generated by the sensing elements. Since the fingerprint recess and the fingerprint protrusion have different degrees of influence on the sensing element, the fingerprint recognition chip can determine the fingerprint pattern according to the signal size generated by the sensing elements.
在先前技術中，上述感應器與指紋辨識晶片的結合方式大致分為兩種。第一種結合方式為在指紋辨識晶片所屬積體電路的表面金屬層上蝕刻出電極圖樣來實現該等感應元件，也就是將指紋辨識晶片與感應器直接整合在同一個積體電路中。第二種結合方式則是將該等感應元件設置在一塊基板(例如可透光基板、塑膠基板或是電路板)上，再以細間距球柵陣列(fine-pitch ball grid array, FBGA)封裝形式將該基板與指紋辨識晶片所屬積體電路封裝在一起。採用這兩種結合方式的指紋辨識裝置，其感應器外觀都是不透明的或者透光性極低，因而對於指紋辨識裝置所屬電子產品的外觀設計造成相當大的限制。In the prior art, the combination of the above sensor and the fingerprint recognition chip is roughly classified into two types. The first combination is to etch the electrode pattern on the surface metal layer of the integrated circuit to which the fingerprint identification chip belongs to realize the sensing elements, that is, to integrate the fingerprint identification chip and the inductor directly into the same integrated circuit. The second combination is that the sensing elements are disposed on a substrate (such as a permeable substrate, a plastic substrate or a circuit board) and then packaged in a fine pitch ball grid array (FBGA) package. The substrate is packaged with the integrated circuit to which the fingerprint identification chip belongs. The fingerprint identification device adopting the two combination methods has an opaque appearance or a very low light transmittance, and thus has a considerable limitation on the design of the electronic product to which the fingerprint identification device belongs.
為解決上述問題，本發明提出一種新的指紋辨識裝置與具有指紋辨識功能的觸控裝置。於實際應用中，根據本發明之指紋辨識裝置與觸控裝置可被整合在行動電話、筆記型電腦、平板電腦等各種需要指紋辨識功能的電子產品中，或是被整合在門禁控制等更大型的身分認證系統內，但不以此為限。In order to solve the above problems, the present invention provides a new fingerprint identification device and a touch device having a fingerprint recognition function. In practical applications, the fingerprint recognition device and the touch device according to the present invention can be integrated into various electronic products requiring fingerprint recognition functions such as mobile phones, notebook computers, and tablet computers, or integrated into a larger control system such as access control. Within the identity certification system, but not limited to this.
根據本發明之一具體實施例為一種指紋辨識裝置，其中包含一可透光基板、複數個感應元件構成之一感應器、一組導線以及一指紋辨識晶片。該複數個感應元件、該組導線與該指紋辨識晶片皆設置於該可透光基板之一上表面。該指紋辨識晶片透過該組導線與該複數個感應元件相連接。該指紋辨識晶片係用以驅動該複數個感應元件、接收該複數個感應元件產生之複數個感應結果，並據此判斷一使用者指紋。According to an embodiment of the invention, a fingerprint identification device includes a light transmissive substrate, a plurality of sensing elements forming an inductor, a set of wires, and a fingerprint recognition chip. The plurality of sensing elements, the set of wires and the fingerprint identification chip are disposed on an upper surface of the light transmissive substrate. The fingerprint identification chip is coupled to the plurality of sensing elements through the set of wires. The fingerprint identification chip is configured to drive the plurality of sensing elements, receive the plurality of sensing results generated by the plurality of sensing elements, and determine a user fingerprint accordingly.
根據本發明之另一具體實施例為一種具有指紋辨識功能之觸控裝置，其中包含一可透光基板、複數個第一感應元件、一組導線、一指紋辨識晶片、複數個第二感應元件，以及一觸控電路。該複數個第一感應元件係設置於該可透光基板之一上表面之一第一區域。該組導線設置於該可透光基板之該上表面。該指紋辨識晶片設置於該可透光基板之該上表面，並透過該組導線與該複數個第一感應元件相連接。該指紋辨識晶片係用以驅動該複數個第一感應元件、接收該複數個第一感應元件產生之複數個第一感應結果，並據此判斷一使用者指紋。該複數個第二感應元件係設置於該可透光基板之該上表面之一第二區域。該第二區域與該第一區域共同構成一觸控範圍。該觸控電路係用以驅動該複數個第二感應元件、接收該複數個第二感應元件產生之複數個第二感應結果，並根據該複數個第一感應結果之至少一部份與該複數個第二感應結果判斷發生於該觸控範圍內之一使用者觸控動作。According to another embodiment of the present invention, a touch device having a fingerprint recognition function includes a light transmissive substrate, a plurality of first sensing elements, a set of wires, a fingerprint identification chip, and a plurality of second sensing elements. And a touch circuit. The plurality of first sensing elements are disposed on a first region of one of the upper surfaces of the light transmissive substrate. The set of wires are disposed on the upper surface of the permeable substrate. The fingerprint recognition chip is disposed on the upper surface of the light transmissive substrate, and is connected to the plurality of first sensing elements through the set of wires. The fingerprint identification chip is configured to drive the plurality of first sensing elements, receive the plurality of first sensing results generated by the plurality of first sensing elements, and determine a user fingerprint accordingly. The plurality of second sensing elements are disposed on a second region of the upper surface of the light transmissive substrate. The second area and the first area together form a touch range. The touch circuit is configured to drive the plurality of second sensing elements, receive the plurality of second sensing results generated by the plurality of second sensing elements, and according to the plurality of first sensing results, the complex number The second sensing result determines that one of the user touch actions occurs within the touch range.
關於本發明的優點與精神可以藉由以下發明詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.
根據本發明之一具體實施例為一種指紋辨識裝置，其元件配置的相對關係示意圖係繪示於圖一(A)。指紋辨識裝置100包含一可透光基板110、複數個感應元件構成之一感應器120、一組導線130與一指紋辨識晶片140。如圖一(A)所示，感應器120中的複數個感應元件、導線130以及指紋辨識晶片140設置在可透光基板110之上表面110A。舉例而言但不以此為限，可透光基板110的材質可為玻璃、塑膠或合成薄膜。A specific embodiment of the present invention is a fingerprint identification device, and a schematic diagram of the relative relationship of component configurations is shown in FIG. 1(A). The fingerprint identification device 100 includes a light transmissive substrate 110, a plurality of sensing elements, a sensor 120, a set of wires 130, and a fingerprint recognition chip 140. As shown in FIG. 1(A), a plurality of sensing elements, wires 130, and fingerprint recognition wafers 140 in the inductor 120 are disposed on the upper surface 110A of the permeable substrate 110. For example, but not limited to, the transparent substrate 110 may be made of glass, plastic or synthetic film.
圖一(B)為指紋辨識裝置100之側視圖。於此實施例中，感應器120包含上下相疊之一覆蓋層120A與一電極層120B。覆蓋層120A係用以承受使用者的接觸，以保護電極層120B，其材質可為但不限於玻璃或硬質鍍膜(hard coating)。電極層120B可直接形成於可透光基板110上。圖二呈現電極層120B的一種詳細實施範例。電極層120B為一層疊結構，由下而上包含一第一金屬層M1、一第一絕緣層IN1、一第二金屬層M2、一第二絕緣層IN2，以及一黏著層AD。第一金屬層M1可被製作為包含多個接收電極圖樣，而第二金屬層M2可被製作為包含多個驅動電極圖樣，或者互相調換。接收電極與驅動電極兩兩成對，構成上述複數個感應元件。舉例而言，感應器120可被設計為包含100*100個以矩陣形式排列的感應元件。感應元件的大小、電極形狀、數量和排列方式，可由電路製作者依感應器120的大小和需要的感應精細度決定。為避免圖面過於混亂，圖一(A)僅呈現6*6個感應元件做為說明範例。實務上，黏著層AD的材料可為具有良好透光率的光學膠(optical clear adhesive, OCA)，用以接合覆蓋層120A與電極層120B。實務上，若黏著層AD的材料具有足夠的絕緣能力，亦可省略第二絕緣層IN2。FIG. 1(B) is a side view of the fingerprint identification device 100. In this embodiment, the inductor 120 includes a cover layer 120A and an electrode layer 120B stacked one on top of the other. The cover layer 120A is for receiving contact with the user to protect the electrode layer 120B, and the material thereof may be, but not limited to, glass or hard coating. The electrode layer 120B can be formed directly on the light transmissive substrate 110. Figure 2 presents a detailed embodiment of an electrode layer 120B. The electrode layer 120B is a laminated structure, and includes a first metal layer M1, a first insulating layer IN1, a second metal layer M2, a second insulating layer IN2, and an adhesive layer AD from bottom to top. The first metal layer M1 may be fabricated to include a plurality of receiving electrode patterns, and the second metal layer M2 may be fabricated to include a plurality of driving electrode patterns, or interchanged with each other. The receiving electrode and the driving electrode are paired in pairs to form the plurality of sensing elements. For example, the sensor 120 can be designed to include 100*100 sensing elements arranged in a matrix. The size of the sensing elements, the shape, number and arrangement of the electrodes can be determined by the circuit manufacturer depending on the size of the sensor 120 and the required inductive fineness. In order to avoid the picture being too confusing, Figure 1 (A) only presents 6*6 sensing elements as an illustrative example. In practice, the material of the adhesive layer AD may be an optical clear adhesive (OCA) having good light transmittance for bonding the cover layer 120A and the electrode layer 120B. In practice, if the material of the adhesive layer AD has sufficient insulating ability, the second insulating layer IN2 may be omitted.
導線130可包含多條形成於上表面110A之金屬走線。指紋辨識晶片140透過導線130與感應器120相連接。指紋辨識晶片140負責驅動感應器120中之感應元件、接收該等感應元件產生的感應結果，並據此判斷一使用者指紋。實務上，指紋辨識晶片140可為具有一覆晶式封裝之一積體電路晶片，並透過導電膠與可透光基板110上的多個導電點相接合，藉此連接到導線130。相較於先前技術中需於封裝廠將感應元件所在基板與指紋辨識晶片整合為一細間距球柵陣列(FBGA)封裝體的做法，根據本發明之實施方式具有可節省封裝成本的優點。於實際應用中，指紋辨識晶片140可包含但不限於類比-數位轉換器、雜訊過濾電路、比較器、記憶體等元件。須說明的是，感應元件的驅動方式與根據感應結果判斷使用者指紋的方法為本發明所屬技術領域中具有通常知識者所知，於此不贅述。The wire 130 can include a plurality of metal traces formed on the upper surface 110A. The fingerprint recognition wafer 140 is connected to the inductor 120 via a wire 130. The fingerprint identification chip 140 is responsible for driving the sensing elements in the sensor 120, receiving the sensing results generated by the sensing elements, and determining a user fingerprint accordingly. In practice, the fingerprint identification wafer 140 can be an integrated circuit wafer having a flip chip package and bonded to a plurality of conductive dots on the permeable substrate 110 through a conductive paste, thereby being connected to the wires 130. Compared with the prior art, it is necessary to integrate the substrate of the sensing element and the fingerprint identification chip into a fine pitch ball grid array (FBGA) package in the packaging factory, and the embodiment according to the invention has the advantage of saving packaging cost. In practical applications, the fingerprint identification chip 140 may include, but is not limited to, an analog-to-digital converter, a noise filtering circuit, a comparator, a memory, and the like. It should be noted that the driving method of the sensing element and the method for determining the fingerprint of the user according to the sensing result are known to those skilled in the art, and will not be described herein.
綜觀圖一(A)、圖一(B)與圖二，在指紋辨識裝置100中，可透光基板110與覆蓋層120A皆可被設計為具有良好的透光性，而感應器120中的第一絕緣層IN1、第二絕緣層IN2以及黏著層AD亦可利用透光性佳的材質實現。另一方面，感應器120中的第一金屬層M1與第二金屬層M2所具有之電極圖樣的鏤空部分亦可被光線穿透。因此，若適當設計感應器120中的電極圖樣，令其包含較多的鏤空部分，或者甚至是以透明導電材料製成電極，順著圖一(B)中標示之方向Z前進或是逆著方向Z前進的光線便有相當可觀的一部份可穿透指紋辨識裝置100。另一方面，即使導線130本身是由多條不透光的金屬細線構成，其走線之間的間隙仍可供光線穿透。因此，從使用者的視角觀看，指紋辨識裝置100上除了指紋辨識晶片140的所在位置之外，其他部分皆可具有相當程度的透光性。Referring to FIG. 1(A), FIG. 1(B) and FIG. 2, in the fingerprint identification device 100, both the permeable substrate 110 and the cover layer 120A can be designed to have good light transmittance, and the sensor 120 The first insulating layer IN1, the second insulating layer IN2, and the adhesive layer AD can also be realized by a material having good light transmittance. On the other hand, the hollow portion of the electrode pattern of the first metal layer M1 and the second metal layer M2 in the inductor 120 can also be penetrated by light. Therefore, if the electrode pattern in the sensor 120 is properly designed to contain more hollow portions, or even electrodes made of a transparent conductive material, proceed along the direction Z indicated in FIG. 1(B) or against A considerable portion of the light traveling in the direction Z can penetrate the fingerprint recognition device 100. On the other hand, even if the wire 130 itself is composed of a plurality of opaque metal thin wires, the gap between the wires is still allowed to penetrate the light. Therefore, from the perspective of the user, the fingerprint recognition device 100 can have a relatively high degree of light transmission except for the location of the fingerprint recognition wafer 140.
相較於先前技術，指紋辨識裝置100的透光特性能提供給各類產品的外觀設計師更大的設計彈性。舉例而言，若將指紋辨識裝置100應用在門禁控制系統，可透光基板110可即為玻璃門片本身。於實際應用中，指紋辨識晶片140可透過設置在可透光基板110上的連接線(未繪示)，例如金手指(golden finger)，連接到其他外部電路，以接收電力供應或是將使用者指紋判斷結果提供給後續電路。Compared to the prior art, the light transmission characteristics of the fingerprint recognition device 100 provide greater design flexibility to the designers of various products. For example, if the fingerprint identification device 100 is applied to an access control system, the permeable substrate 110 may be the glass door itself. In practical applications, the fingerprint recognition chip 140 can be connected to other external circuits through a connection line (not shown) disposed on the opaque substrate 110, such as a golden finger, to receive power supply or to be used. The fingerprint judgment result is provided to the subsequent circuit.
圖三呈現指紋辨識裝置100的一種變化型之側視圖。指紋辨識裝置200與指紋辨識裝置100的主要差異在於，指紋辨識裝置200進一步包含一發光模組150。發光模組150係設置於一發光基板160上，可利用一個或多個發光二極體元件實現，但不以此為限。如圖三所示，發光基板160大致平行於可透光基板110，並與可透光基板110之一下表面110B相對。發光模組150提供的光線可穿透可透光基板110與感應區120，抵達使用者的視線範圍內。舉例而言，發光模組150發出的光線可做為輔助指示，讓使用者較容易注意到感應區120的所在位置。實務上，發光模組150可包含一個控制單元與一發光二極體陣列(由多個光線色彩相同或不同的發光二極體構成)。該控制單元負責配合指紋辨識裝置200的運作模式來控制該等發光二極體的開關、亮度或色彩。FIG. 3 presents a side view of a variation of the fingerprint recognition device 100. The main difference between the fingerprint identification device 200 and the fingerprint recognition device 100 is that the fingerprint recognition device 200 further includes a light emitting module 150. The light-emitting module 150 is disposed on a light-emitting substrate 160, and can be implemented by using one or more light-emitting diode elements, but is not limited thereto. As shown in FIG. 3, the light-emitting substrate 160 is substantially parallel to the light-permeable substrate 110 and opposite to the lower surface 110B of one of the light-permeable substrates 110. The light provided by the light emitting module 150 can penetrate the permeable substrate 110 and the sensing area 120 to reach the line of sight of the user. For example, the light emitted by the light-emitting module 150 can be used as an auxiliary indication, so that the user can easily notice the location of the sensing area 120. In practice, the light-emitting module 150 can include a control unit and an array of light-emitting diodes (consisting of a plurality of light-emitting diodes having the same or different color of light). The control unit is responsible for controlling the switching, brightness or color of the light-emitting diodes in accordance with the operation mode of the fingerprint recognition device 200.
圖四(A)呈現指紋辨識裝置200的一種變化型之示意圖。指紋辨識裝置300進一步包含一控制器170，設置於一主要電路板175上，並且分別透過連接線171、172耦接至指紋辨識晶片140與發光模組150。於實際應用中，主要電路板175可為一印刷電路板，透過軟性電路板或軟性排線與可透光基板110、發光基板160電性連接。換句話說，連接線171、172可各自包含數段在軟性電路板、主要電路板175、可透光基板110與發光基板160上的走線。連接線171、172亦可包含電力線(Power line)，負責將電力自主要電路板175傳遞至指紋辨識晶片140與發光模組150。FIG. 4(A) shows a schematic diagram of a variation of the fingerprint identification device 200. The fingerprint identification device 300 further includes a controller 170 disposed on a main circuit board 175 and coupled to the fingerprint recognition chip 140 and the light emitting module 150 through the connection lines 171 and 172, respectively. In a practical application, the main circuit board 175 can be a printed circuit board, and is electrically connected to the light-permeable substrate 110 and the light-emitting substrate 160 through a flexible circuit board or a flexible cable. In other words, the connecting lines 171, 172 may each include a plurality of traces on the flexible circuit board, the main circuit board 175, the light transmissive substrate 110, and the light emitting substrate 160. The connection lines 171, 172 may also include a power line responsible for transferring power from the main circuit board 175 to the fingerprint recognition chip 140 and the illumination module 150.
控制器170係用以根據指紋辨識晶片140判斷出之使用者指紋控制發光模組150。舉例而言，控制器170中可儲存有一特定指紋圖樣。當目前指紋辨識晶片140偵測到的使用者指紋與該特定指紋圖樣相符，控制器170便控制發光模組150發出某一種顏色(例如綠色)的光線，並且執行身分認證成功時的對應動作(例如將行動電話解鎖)。相對地，當目前指紋辨識晶片140偵測到的使用者指紋不符合該特定指紋圖樣，控制器170便控制發光模組150發出另一種顏色(例如紅色)的光線，並且執行身分認證不成功時的對應動作(例如在行動電話螢幕上顯示解鎖失敗的文字訊息)。實務上，控制器170可被實現為固定式及/或可程式化數位邏輯電路，包含可程式化邏輯閘陣列、特定應用積體電路、微控制器、微處理器、數位信號處理器，與其他必要電路。The controller 170 is configured to control the light emitting module 150 according to the user fingerprint determined by the fingerprint recognition chip 140. For example, a specific fingerprint pattern can be stored in the controller 170. When the fingerprint of the user detected by the fingerprint recognition chip 140 matches the specific fingerprint pattern, the controller 170 controls the illumination module 150 to emit light of a certain color (for example, green), and performs a corresponding action when the identity authentication succeeds ( For example, unlock the mobile phone). In contrast, when the fingerprint of the user detected by the fingerprint recognition chip 140 does not conform to the specific fingerprint pattern, the controller 170 controls the illumination module 150 to emit light of another color (for example, red), and when the identity authentication is unsuccessful. Corresponding actions (such as displaying a text message that failed to unlock on the mobile phone screen). In practice, the controller 170 can be implemented as a fixed and/or programmable digital logic circuit, including a programmable logic gate array, a specific application integrated circuit, a microcontroller, a microprocessor, a digital signal processor, and Other necessary circuits.
或者，如圖四(B)所示，控制器170的功能可被分散實現於指紋辨識晶片140與發光模組150本身的控制單元(未繪示)。易言之，發光模組150可透過連接線173與指紋辨識晶片140相連，並且直接受到指紋辨識晶片140的控制，執行上述發出不同顏色光線的任務。Alternatively, as shown in FIG. 4(B), the functions of the controller 170 can be distributed to the control unit (not shown) of the fingerprint recognition chip 140 and the illumination module 150 itself. In other words, the light-emitting module 150 can be connected to the fingerprint recognition chip 140 through the connection line 173, and directly controlled by the fingerprint recognition chip 140 to perform the above-mentioned task of emitting light of different colors.
圖五(A)呈現指紋辨識裝置300的一種殼體範例。於此範例中，可透光基板110、發光基板160、主要電路板175及其上的元件皆容置於殼體510內部。殼體510之頂壁511具有一開口511A，用以將覆蓋層120A的感應表面露出，接受使用者碰觸。如圖五(A)所示，在垂直可透光基板110且遠離其上表面之參考方向Z’上，指紋辨識晶片140的高度通常會高於感應區120。若以指紋辨識晶片140的高度為基準來設計殼體510的厚度，覆蓋層120A的感應表面在參考方向Z’上會低於殼體510之頂壁511。配合此高度相對關係，殼體510可被設計為令開口511A具有一傾斜部512，自頂壁511下斜向覆蓋層120A的感應表面。相對於為開口511A及覆蓋層120A的交接處採用垂直式側壁，傾斜部512可讓使用者在按壓覆蓋層120A時更為舒適。FIG. 5(A) shows an example of a housing of the fingerprint identification device 300. In this example, the light transmissive substrate 110, the light emitting substrate 160, the main circuit board 175, and the components thereon are housed inside the housing 510. The top wall 511 of the housing 510 has an opening 511A for exposing the sensing surface of the cover layer 120A to be touched by a user. As shown in Fig. 5(A), the height of the fingerprint recognition wafer 140 is generally higher than the sensing area 120 in the reference direction Z' of the vertical permeable substrate 110 and away from the upper surface thereof. If the thickness of the housing 510 is designed with reference to the height of the fingerprint recognition wafer 140, the sensing surface of the cover layer 120A will be lower than the top wall 511 of the housing 510 in the reference direction Z'. In conjunction with this height relative relationship, the housing 510 can be designed such that the opening 511A has an angled portion 512 that slopes downwardly from the top wall 511 toward the sensing surface of the cover layer 120A. The inclined portion 512 allows the user to be more comfortable in pressing the cover layer 120A with respect to the vertical side wall for the intersection of the opening 511A and the cover layer 120A.
請參閱圖五(B)。在殼體510具有導電性的實施例中，指紋辨識裝置300可進一步包含一導電元件520，電性連接於殼體510內側與主要電路板175之間。更明確地說，導電元件520係電性連接至主要電路板175上的一個固定電壓端，例如接地端。於實際應用中，殼體510可能是因為塗佈有金屬噴漆而具有微弱的導電性。即使在導電性微弱的情況下，因殼體510可等效於一個相當大的電容，將殼體510連接至主要電路板175上的固定電壓端可幫助消除指紋辨識晶片140偵測到的背景雜訊、提高偵測結果的正確性。實務上，導電元件520可為但不限於一導電泡棉或一金屬彈片。Please refer to Figure 5 (B). In an embodiment in which the housing 510 is electrically conductive, the fingerprint recognition device 300 can further include a conductive member 520 electrically connected between the inner side of the housing 510 and the main circuit board 175. More specifically, conductive element 520 is electrically coupled to a fixed voltage terminal on main circuit board 175, such as a ground terminal. In practical applications, the housing 510 may have weak electrical conductivity due to the application of metallic paint. Even in the case of poor electrical conductivity, since the housing 510 can be equivalent to a relatively large capacitance, connecting the housing 510 to the fixed voltage terminal on the main circuit board 175 can help eliminate the background detected by the fingerprint recognition chip 140. Noise, improve the accuracy of detection results. In practice, the conductive element 520 can be, but not limited to, a conductive foam or a metal dome.
圖六(A)呈現指紋辨識裝置300的另一種殼體範例。於此範例中，殼體610的頂壁611同樣具有一開口，用以將覆蓋層120A之感應表面露出。本實施例的特點在於，在垂直可透光基板110的參考方向Z’上，覆蓋層120A的厚度被特意增加，使其感應表面與殼體的頂壁611大致等高，亦即讓覆蓋層120A大致密合於頂壁611的開口。這種做法的好處在於能達成全平面機構設計。實務上，利用一玻璃平板或一硬質鍍膜來實現覆蓋層120A皆可方便地控制其厚度。須說明的是，也可藉由加厚電極層120B或是局部加厚電極層120B下方的可透光基板110，來達到令覆蓋層120A之感應表面與頂壁611大致等高的效果。FIG. 6(A) presents another example of a housing of the fingerprint recognition device 300. In this example, the top wall 611 of the housing 610 also has an opening to expose the sensing surface of the cover layer 120A. The feature of this embodiment is that, in the reference direction Z' of the vertical permeable substrate 110, the thickness of the cover layer 120A is intentionally increased, so that the sensing surface is substantially equal to the top wall 611 of the housing, that is, the cover layer is 120A is substantially in close contact with the opening of the top wall 611. The advantage of this approach is that a full planar mechanism design can be achieved. In practice, the cover layer 120A can be conveniently controlled by a glass plate or a hard coating. It should be noted that the effect of the sensing surface of the cover layer 120A and the top wall 611 can be achieved by thickening the electrode layer 120B or the permeable substrate 110 under the partially thickened electrode layer 120B.
如圖六(B)所示，在殼體610具有導電性的實施例中，殼體610內側與主要電路板175之間亦可設置一個導電元件620，以提高指紋辨識晶片140的偵測結果正確性。As shown in FIG. 6(B), in the embodiment in which the housing 610 is electrically conductive, a conductive member 620 may be disposed between the inner side of the housing 610 and the main circuit board 175 to improve the detection result of the fingerprint recognition chip 140. Correctness.
根據本發明之另一具體實施例為一種具有指紋辨識功能之觸控裝置，其元件配置的相對關係示意圖係繪示於圖七(A)。觸控裝置700包含一可透光基板710、位於第一區域711內之複數個第一感應元件、位於第二區域712內之複數個第二感應元件、一組第一導線731、一組第二導線732、一指紋辨識晶片740、一觸控電路760，以及設置於可透光基板710下方的一個顯示器750 (呈現於圖七(C))。Another embodiment of the present invention is a touch device having a fingerprint recognition function, and a schematic diagram of the relative relationship of component configurations is shown in FIG. 7(A). The touch device 700 includes a light transmissive substrate 710, a plurality of first sensing elements located in the first region 711, a plurality of second sensing elements located in the second region 712, a set of first conductive lines 731, and a set of Two wires 732, a fingerprint identification chip 740, a touch circuit 760, and a display 750 disposed under the light transmissive substrate 710 (presented in FIG. 7(C)).
於此實施例中，第一區域711與第二區域712共同構成一個矩形的觸控範圍。如圖七(B)所示，配合第一區域711的形狀及位置，第二區域712的輪廓為具有一凹陷區域的矩形。實務上，該等第二感應元件可為以透明或可透光導電材料製成的多組電極。圖七(B)中的虛線係用以標示該等第二感應元件彼此之間的區隔。實務上，該等第二感應元件的大小、電極形狀、數量和排列方式，可由電路製作者依觸控裝置700的大小和所需的感應精細度(fineness)、感應解析度等要件決定。In this embodiment, the first area 711 and the second area 712 together form a rectangular touch range. As shown in FIG. 7(B), in accordance with the shape and position of the first region 711, the contour of the second region 712 is a rectangle having a recessed region. In practice, the second inductive elements can be a plurality of sets of electrodes made of a transparent or permeable conductive material. The dashed line in Figure 7(B) is used to indicate the separation of the second inductive elements from each other. In practice, the size, shape, number, and arrangement of the second sensing elements can be determined by the circuit maker according to the size of the touch device 700 and the required fineness, sensing resolution, and the like.
如圖七(A)所示，該複數個第一感應元件、該複數個第二感應元件、第一導線731、第二導線732、指紋辨識晶片740與觸控電路760皆設置於可透光基板710之上表面。指紋辨識晶片740透過該組第一導線731與第一區域711內之該等第一感應元件相連接。觸控電路760透過該組第二導線732與第二區域712內之該等第二感應元件相連接。指紋辨識晶片740負責驅動第一區域711內之該等第一感應元件，並接收該等第一感應元件產生之複數個第一感應結果。觸控電路760負責驅動第二區域712內之該等第二感應元件，並接收該複數個第二感應元件產生之複數個第二感應結果。As shown in FIG. 7(A), the plurality of first sensing elements, the plurality of second sensing elements, the first conductive line 731, the second conductive line 732, the fingerprint identification chip 740, and the touch control circuit 760 are all disposed to be transparent. The upper surface of the substrate 710. The fingerprint identification chip 740 is coupled to the first sensing elements in the first region 711 through the set of first wires 731. The touch circuit 760 is connected to the second sensing elements in the second region 712 through the set of second wires 732. The fingerprint recognition chip 740 is responsible for driving the first sensing elements in the first region 711 and receiving a plurality of first sensing results generated by the first sensing elements. The touch circuit 760 is responsible for driving the second sensing elements in the second region 712 and receiving a plurality of second sensing results generated by the plurality of second sensing elements.
圖七(C)為觸控裝置700沿著剖面線799的剖視圖。前述設置於可透光基板710下方的顯示器750之大小可大致相同於第一區域711與第二區域712共同構成的觸控範圍，且位於該觸控範圍的正下方。與圖一中的感應器120相同，圖七(A)與圖七(C)中的第一區域711也具有相當程度的透光性，因此可讓顯示器750發出的光線透出第一區域711。由於第一區域711與第二區域712皆可透光(雖然透光程度可能不完全相同)，使用者可以透過第一區域711與第二區域712完整看到顯示器750呈現的畫面。FIG. 7(C) is a cross-sectional view of the touch device 700 along section line 799. The size of the display 750 disposed under the permeable substrate 710 may be substantially the same as the touch range formed by the first region 711 and the second region 712, and is located directly below the touch range. Like the sensor 120 in FIG. 1, the first region 711 in FIG. 7(A) and FIG. 7(C) also has a relatively high degree of light transmission, so that the light emitted from the display 750 can be transmitted through the first region 711. . Since both the first area 711 and the second area 712 can transmit light (although the degree of light transmission may not be exactly the same), the user can completely see the picture presented by the display 750 through the first area 711 and the second area 712.
當觸控裝置700處於指紋辨識模式時，顯示器750可在第一區域711下方顯示圖樣或線條，指示第一區域711的範圍供使用者參考，以得知應於何處按壓指紋。與圖一中的指紋辨識晶片140相同，指紋辨識晶片740會根據該等第一感應結果判斷一使用者指紋。在這個情況下，觸控電路760可暫不工作。When the touch device 700 is in the fingerprint recognition mode, the display 750 can display a pattern or a line below the first area 711, indicating the range of the first area 711 for the user to refer to to know where to press the fingerprint. Similar to the fingerprint identification chip 140 in FIG. 1, the fingerprint recognition chip 740 determines a user fingerprint based on the first sensing results. In this case, the touch circuit 760 may not work temporarily.
於此實施例中，指紋辨識晶片740與觸控電路760可協同運作，藉此令第一區域711與第二區域712共同構成的觸控範圍等效於一個完整的矩形觸控區域。更明確地說，當觸控裝置700需要偵測更大範圍的使用者觸控動作時，指紋辨識晶片740負責驅動第一區域711內之該等第一感應元件、接收該等第一感應元件產生之複數個第一感應結果，而觸控電路760負責驅動第二區域712內之該等第二感應元件、接收該複數個第二感應元件產生之複數個第二感應結果。並且，指紋辨識晶片740接收到之該等第一感應結果會被提供給觸控電路760。接著，觸控電路760即可根據該複數個第一感應結果與該複數個第二感應結果判斷發生於該矩形觸控範圍內之一使用者觸控動作。實務上，指紋辨識晶片740與觸控電路760各自產生的感應結果亦可被提供至另一後端控制器(未繪示)加以綜合研判、處理。該後端控制器可以是綜合處理觸控裝置700通用應用程式的中央處理器、專司處理顯示器750顯示圖像的繪圖處理器、亦可為一獨立之觸控指紋處理器。由後端控制器綜合研判、處理在某些應用上具有明顯的優點。舉例而言，若該後段控制器為中央處理器，中央處理器可於指紋辨識晶片740與觸控電路760其中之一提供該複數個第一感應結果或該複數個第二感應結果給中央處理器時，即預先啟動相對應的應用程式或預先自記憶體下載相對應之資料，因而在該使用者觸控動作未被判斷出來前，即可處理部分相對應的任務，使得使用者觸控之反應速度加快。在另一個例子裡，若該後端控制器為繪圖處理器，繪圖處理器可控制指紋辨識晶片740於指紋辨識之過程中陸續送出對應感應位置之複數個第一感應結果。在指紋辨識的過程中，繪圖處理器不僅可以控制顯示器750在第一區域711下方靜態顯示圖樣或線條，甚至可以動態地於對應感應位置顯示不同的圖樣，以標示已完成辨識的對應感應位置；自然地，此例亦可由中央處理器做為後端控制器，並同時控制繪圖處理器實現，並且在觸控電路760感應具有連續性的動態手勢時也能有相類似的應用。此外，該後段控制器亦可動態地由多核心處理器中較不忙碌的其中一個或多個處理器實現。In this embodiment, the fingerprint recognition chip 740 and the touch control circuit 760 can cooperate, so that the touch range formed by the first region 711 and the second region 712 is equivalent to a complete rectangular touch region. More specifically, when the touch device 700 needs to detect a wider range of user touch actions, the fingerprint recognition chip 740 is responsible for driving the first sensing elements in the first region 711 and receiving the first sensing elements. The plurality of first sensing results are generated, and the touch circuit 760 is responsible for driving the second sensing elements in the second region 712 and receiving the plurality of second sensing results generated by the plurality of second sensing elements. Moreover, the first sensing results received by the fingerprint recognition chip 740 are provided to the touch circuit 760. Then, the touch circuit 760 can determine, according to the plurality of first sensing results and the plurality of second sensing results, a user touch action occurring in the rectangular touch range. In practice, the sensing results generated by the fingerprint identification chip 740 and the touch control circuit 760 can also be provided to another back-end controller (not shown) for comprehensive evaluation and processing. The back-end controller may be a central processing unit that comprehensively processes the general application of the touch device 700, a graphics processor that processes the display image of the display 750, or a separate touch fingerprint processor. Comprehensive judgment and processing by the back-end controller has obvious advantages in some applications. For example, if the back-end controller is a central processing unit, the central processing unit can provide the plurality of first sensing results or the plurality of second sensing results to the central processing in one of the fingerprint identification chip 740 and the touch control circuit 760. In the device, the corresponding application is pre-activated or the corresponding data is downloaded from the memory in advance, so that the corresponding task can be processed before the user's touch action is not determined, so that the user touches The reaction speed is increased. In another example, if the backend controller is a graphics processor, the graphics processor can control the fingerprint recognition chip 740 to successively send a plurality of first sensing results corresponding to the sensing locations during the fingerprinting process. In the process of fingerprint identification, the drawing processor can not only control the display 750 to statically display patterns or lines under the first area 711, but also dynamically display different patterns in the corresponding sensing positions to indicate the corresponding sensing positions that have been identified; Naturally, this example can also be used by the central processing unit as a back-end controller, while controlling the graphics processor implementation, and can have similar applications when touch circuitry 760 senses dynamic gestures with continuity. In addition, the back-end controller can also be dynamically implemented by one or more of the multi-core processors that are less busy.
一般而言，辨識指紋所需要的感應解析度高於辨識使用者觸控動作的感應解析度。實務上，第一區域711內每單位面積中的感應元件數量可被設計為高於第二區域712內每單位面積中的感應元件數量。因此，當指紋辨識晶片740與觸控電路760協同運作以偵測使用者觸控動作時，觸控電路760可選擇性地僅採用一部份(而非所有)的第一感應結果來代表第一區域711內的感應結果。請參閱圖八(A)與圖八(B)。以第一區域711內每單位面積包含4*4個第一感應元件，且第二區域712內每單位面積包含2*2個第二感應元件的情況為例，觸控電路760可僅採用圖八(C)中標有斜線圖樣的四個第一感應元件之感應結果來代表這個單位面積內的感應結果，藉此減少資料處理量。舉例來說，就圖八(C)中的第一感應元件00、01、10、11而言，觸控電路760可不考慮第一感應元件01、10、11的感應結果，而是將第一感應元件00的感應量乘以四，來代表這四個第一感應元件所在區域內的感應結果。在其他的例子裡，第一感應元件00可被第一感應元件01、10、11其中之一代換，亦可於第一感應元件00、01、10、11當中選擇其二或其三。此外，觸控電路760於不同單位面積區域內亦可因應需求採用不同相對位置或數量的第一感應元件之感應量計算感應結果。In general, the sensitivity resolution required to identify a fingerprint is higher than the sensitivity resolution of identifying a user's touch motion. In practice, the number of sensing elements per unit area in the first region 711 can be designed to be higher than the number of sensing elements per unit area in the second region 712. Therefore, when the fingerprint recognition chip 740 and the touch control circuit 760 cooperate to detect the user's touch action, the touch control circuit 760 can selectively use only a part (but not all) of the first sensing result to represent the first The result of induction in a region 711. Please refer to Figure 8 (A) and Figure 8 (B). For example, in the case where the first region 711 includes 4*4 first sensing elements per unit area, and the second region 712 includes 2*2 second sensing elements per unit area, the touch circuit 760 can only adopt the figure. The inductive result of the four first sensing elements marked with a diagonal pattern in eight (C) represents the sensing result in this unit area, thereby reducing the amount of data processing. For example, with respect to the first sensing elements 00, 01, 10, 11 in FIG. 8(C), the touch circuit 760 may not consider the sensing result of the first sensing elements 01, 10, 11, but will be the first The amount of inductance of the sensing element 00 is multiplied by four to represent the sensing result in the region where the four first sensing elements are located. In other examples, the first sensing element 00 can be replaced by one of the first sensing elements 01, 10, 11 or two or three of the first sensing elements 00, 01, 10, and 11. In addition, the touch circuit 760 can calculate the sensing result by using the sensing quantity of the first sensing element with different relative positions or numbers in different unit area regions according to requirements.
本發明所屬技術領域中具有通常知識者可理解，先前在介紹指紋辨識裝置100時描述的各種操作變化亦可應用至觸控裝置700，其細節不再贅述。Those skilled in the art to which the present invention pertains can understand that various operational changes previously described in the description of the fingerprint recognition apparatus 100 can also be applied to the touch device 700, and details thereof will not be described again.
不同於先前技術中總是將觸控區域與指紋感應區域分開來獨立設置的情況，由於圖七(A)中的第一區域711可具有良好的透光性，觸控裝置700的指紋感應區域(亦即第一區域711)也是觸控區域的一部份。這種做法的好處在於觸控裝置700在顯示器750範圍外的邊框可以被縮小。Different from the prior art, the touch area is always separately separated from the fingerprint sensing area. Since the first area 711 in FIG. 7(A) can have good light transmittance, the fingerprint sensing area of the touch device 700 (ie, the first area 711) is also a part of the touch area. An advantage of this approach is that the bezel of the touch device 700 outside of the display 750 can be shrunk.
藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地，其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
100、200、300：指紋辨識裝置 110：可透光基板 110A：可透光基板上表面 120：感應器 120A：覆蓋層 120B：電極層 130：導線 140：指紋辨識晶片 M1：第一金屬層 M2：第二金屬層 IN1：第一絕緣層 IN2：第二絕緣層 AD：黏著層 Z、Z’：參考方向 150：發光模組 160：發光基板 170：控制器 171、172、173：連接線 175：主要電路板 510、610：殼體 511、611：殼體頂壁 511A：開口 512：傾斜部 520、620：導電元件 700：觸控裝置 710：可透光基板 711：第一區域 712：第二區域 731：第一導線 732：第二導線 740：指紋辨識晶片 750：顯示器 760：觸控電路 799：剖面線100, 200, 300: fingerprint identification device 110: permeable substrate 110A: permeable substrate upper surface 120: sensor 120A: cover layer 120B: electrode layer 130: wire 140: fingerprint identification wafer M1: first metal layer M2 Second metal layer IN1: first insulating layer IN2: second insulating layer AD: adhesive layer Z, Z': reference direction 150: light-emitting module 160: light-emitting substrate 170: controller 171, 172, 173: connection line 175 Main circuit board 510, 610: housing 511, 611: housing top wall 511A: opening 512: inclined portion 520, 620: conductive element 700: touch device 710: permeable substrate 711: first area 712: Second area 731: first wire 732: second wire 740: fingerprint identification chip 750: display 760: touch circuit 799: hatching
圖一(A)為根據本發明之一實施例中的指紋辨識裝置之元件配置的相對關係示意圖；圖一(B)為該指紋辨識裝置之側視圖。 圖二呈現根據本發明之實施例中的電極層之詳細實施範例。 圖三呈現根據本發明之另一實施例中包含發光模組的指紋辨識裝置之側視圖。 圖四(A)與圖四(B)呈現根據本發明之另外兩種實施例中的指紋辨識裝置之示意圖。 圖五(A)呈現根據本發明之指紋辨識裝置的一種殼體範例；圖五(B)呈現在該殼體內部增設導電元件的範例。 圖六(A)呈現根據本發明之指紋辨識裝置的另一種殼體範例；圖六(B)呈現在該殼體內部增設導電元件的範例。 圖七(A)為根據本發明之一實施例中的觸控裝置之元件配置的相對關係示意圖；圖七(B)為其中一第二區域的輪廓示意圖；圖七(C)為該觸控裝置的剖視圖。 圖八(A)~圖八(C)係用以表示不同感應區域中相同單位面積包含不同數量感應元件的情況。 須說明的是，本發明的圖式包含呈現多種彼此關聯之功能性模組的功能方塊圖。該等圖式並非細部電路圖，且其中的連接線僅用以表示信號流。功能性元件及/或程序間的多種互動關係不一定要透過直接的電性連結始能達成。此外，個別元件的功能不一定要如圖式中繪示的方式分配，且分散式的區塊不一定要以分散式的電子元件實現。FIG. 1(A) is a schematic diagram showing the relative relationship of component configurations of a fingerprint recognition apparatus according to an embodiment of the present invention; FIG. 1(B) is a side view of the fingerprint identification apparatus. Figure 2 presents a detailed implementation example of an electrode layer in accordance with an embodiment of the present invention. Figure 3 presents a side view of a fingerprint recognition device including a lighting module in accordance with another embodiment of the present invention. 4(A) and 4(B) are schematic diagrams showing fingerprint identification devices in two other embodiments in accordance with the present invention. Figure 5 (A) shows an example of a housing of the fingerprint recognition device according to the present invention; Figure 5 (B) shows an example of the addition of a conductive member inside the housing. Fig. 6(A) shows an example of another housing of the fingerprint recognition apparatus according to the present invention; Fig. 6(B) shows an example of adding a conductive element inside the housing. FIG. 7(A) is a schematic diagram showing the relative relationship of component configurations of a touch device according to an embodiment of the present invention; FIG. 7(B) is a schematic diagram of a contour of a second region; FIG. 7(C) is a view of the touch A cross-sectional view of the device. Figure 8 (A) ~ Figure 8 (C) are used to indicate that the same unit area in different sensing areas contains different numbers of sensing elements. It should be noted that the drawings of the present invention include functional block diagrams that present a plurality of functional modules associated with each other. These figures are not detailed circuit diagrams, and the connecting lines therein are only used to represent the signal flow. Multiple interactions between functional components and/or procedures do not have to be achieved through direct electrical connections. In addition, the functions of the individual components are not necessarily allotted in the manner illustrated in the drawings, and the decentralized blocks are not necessarily implemented in the form of decentralized electronic components.
| Application Number | Priority Date | Filing Date | Title |
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| TW105116901ATWI616824B (en) | 2016-05-30 | 2016-05-30 | Fingerprint recognition device and touch-control device with fingerprint recognition function |
| Application Number | Priority Date | Filing Date | Title |
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| TW105116901ATWI616824B (en) | 2016-05-30 | 2016-05-30 | Fingerprint recognition device and touch-control device with fingerprint recognition function |
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| TW201741936A TW201741936A (en) | 2017-12-01 |
| TWI616824Btrue TWI616824B (en) | 2018-03-01 |
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| TW105116901ATWI616824B (en) | 2016-05-30 | 2016-05-30 | Fingerprint recognition device and touch-control device with fingerprint recognition function |
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