本發明是有關於一種電子元件，且特別是有關於一種顯示裝置。The present invention relates to an electronic component, and more particularly to a display device.
由於顯示面板具有體積小、輻射低等優點，顯示面板已經普遍地被應用在各式各樣的電子產品中。隨著顯示科技的發展，消費者對顯示面板性能(例如：高解析度、高色彩飽和度等)的要求日漸提升外，消費者更希望顯示面板具有窄邊框，以增加電子產品的顯示區及提升外觀美感。Due to the advantages of small size, low radiation, and the like, display panels have been commonly used in a wide variety of electronic products. With the development of display technology, consumers are increasingly demanding display panel performance (eg, high resolution, high color saturation, etc.), consumers prefer that the display panel has a narrow bezel to increase the display area of the electronic product. Improve the aesthetic appearance.
然而，現有的顯示面板為了能夠與外部元件連接而預留了大面積的周邊區域，而使得顯示面板與外框組裝時，因為周邊區域過大而無法實現窄邊框的顯示裝置。而且現有的顯示面板的二個基板的材料皆為不可彎折或彎折易碎的玻璃或石英，因此，現有的顯示面板的二個基板更無法應用於需要彎折的顯示裝置上。However, in the conventional display panel, a large-area peripheral area is reserved in order to be able to be connected to an external component, and when the display panel is assembled with the outer frame, the display device of the narrow bezel cannot be realized because the peripheral area is too large. Moreover, the materials of the two substrates of the existing display panel are not bendable or bendable glass or quartz. Therefore, the two substrates of the existing display panel are less applicable to display devices that need to be bent.
本發明提供一種顯示裝置，其可實現超窄邊框及部份彎折的應用。The present invention provides a display device that can realize an application of an ultra-narrow bezel and a partial bend.
本發明提供一種顯示裝置，包括第一硬質基板、可撓基板、多個子畫素單元、多條走線、多個接墊、對向基板、顯示介質層以及背框。第一硬質基板具有顯示區以及內表面。第一硬質基板的內表面面向可撓基板。可撓基板配置於第一硬質基板的內表面上，以覆蓋第一硬質基板之至少部份的顯示區。可撓基板具有由第一硬質基板的顯示區延伸至第一硬質基板外的電路區。多個子畫素單元配置於第一硬質基板的顯示區上。各子畫素單元至少具有掃描線、資料線、電晶體以及畫素電極，其中電晶體的閘極電性連接於掃描線、電晶體的源極電性連接於資料線，而電晶體的汲極電性連接於畫素電極。多條走線以及多個接墊配置於可撓基板的電路區上。各走線電性連接於各子畫素單元與各接墊之間。對向基板相對於第一硬質基板。對向基板在第一硬質基板上的正投影與第一硬質基板的顯示區疊合。顯示介質層配置於第一硬質基板與對向基板之間，以構成一顯示面板。背框用以容納顯示面板的第一硬質基板且具有背向第一硬質基板的外表面。可撓基板的電路區延伸至背框外且向下並往背框的方向彎折，以使位於電路區之可撓基板的外表面面向背框的外表面。The present invention provides a display device including a first rigid substrate, a flexible substrate, a plurality of sub-pixel units, a plurality of traces, a plurality of pads, a counter substrate, a display medium layer, and a back frame. The first rigid substrate has a display area and an inner surface. The inner surface of the first rigid substrate faces the flexible substrate. The flexible substrate is disposed on an inner surface of the first rigid substrate to cover at least a portion of the display area of the first rigid substrate. The flexible substrate has a circuit region extending from the display region of the first rigid substrate to outside the first rigid substrate. The plurality of sub-pixel units are disposed on the display area of the first rigid substrate. Each sub-pixel unit has at least a scan line, a data line, a transistor, and a pixel electrode. The gate of the transistor is electrically connected to the scan line, and the source of the transistor is electrically connected to the data line, and the transistor of the transistor is electrically connected. It is electrically connected to the pixel electrode. A plurality of traces and a plurality of pads are disposed on the circuit area of the flexible substrate. Each of the traces is electrically connected between each sub-pixel unit and each of the pads. The opposite substrate is opposite to the first rigid substrate. The orthographic projection of the opposite substrate on the first rigid substrate overlaps with the display region of the first rigid substrate. The display medium layer is disposed between the first hard substrate and the opposite substrate to form a display panel. The back frame is for accommodating the first rigid substrate of the display panel and has an outer surface facing away from the first rigid substrate. The circuit area of the flexible substrate extends beyond the back frame and is bent downwardly and in the direction of the back frame such that the outer surface of the flexible substrate located in the circuit area faces the outer surface of the back frame.
在本發明一實施例中，上述的背框包括底部以及與底部連接的側壁。底部具有面向第一硬質基板的內表面以及相對於底部之內表面的外表面。側壁設置於底部的內表面上，且容納第一硬質基板。In an embodiment of the invention, the back frame includes a bottom portion and a side wall connected to the bottom portion. The bottom has an inner surface facing the first rigid substrate and opposite to the bottomThe outer surface of the inner surface of the part. The sidewall is disposed on the inner surface of the bottom and houses the first rigid substrate.
在本發明一實施例中，上述位於電路區之可撓基板的外表面面向側壁的外表面以及底部之部份的外表面，以使得位於電路區的走線會經過側壁且延伸至底部。此時，位於電路區上的接墊會與部份之底部重疊。In an embodiment of the invention, the outer surface of the flexible substrate located in the circuit area faces the outer surface of the sidewall and the outer surface of the portion of the bottom portion such that the traces located in the circuit region pass through the sidewall and extend to the bottom. At this point, the pads on the circuit area will overlap the bottom of the portion.
在本發明一實施例中，上述的位於電路區之可撓基板的外表面面向側壁的外表面，以使得位於電路區之走線與接墊位於側壁的外表面上方。In an embodiment of the invention, the outer surface of the flexible substrate located in the circuit area faces the outer surface of the sidewall such that the traces and pads located in the circuit region are located above the outer surface of the sidewall.
在本發明一實施例中，上述的顯示裝置更包括第二硬質基板。可撓基板的電路區位於第二硬質基板上。第一硬質基板與第二硬質基板之間存在一間隙，以使第一硬質基板與第二硬質基板相互分隔開來，且間隙暴露出位於電路區之可撓基板的外表面。In an embodiment of the invention, the display device further includes a second rigid substrate. The circuit area of the flexible substrate is on the second rigid substrate. A gap exists between the first rigid substrate and the second rigid substrate to separate the first rigid substrate from the second rigid substrate, and the gap exposes an outer surface of the flexible substrate located in the circuit region.
在本發明一實施例中，上述的第二硬質基板在可撓基板上的正投影至少與接墊在可撓基板上的正投影重疊。In an embodiment of the invention, the orthographic projection of the second rigid substrate on the flexible substrate overlaps at least with the orthographic projection of the pad on the flexible substrate.
在本發明一實施例中，上述的背框伸入第一硬質基板與第二硬質基板之間的一間隙。In an embodiment of the invention, the back frame extends into a gap between the first rigid substrate and the second rigid substrate.
在本發明一實施例中，上述的可撓基板全面性覆蓋第一硬質基板的顯示區，而子畫素單元配置於可撓基板上。In an embodiment of the invention, the flexible substrate covers the display area of the first rigid substrate in a comprehensive manner, and the sub-pixel unit is disposed on the flexible substrate.
在本發明一實施例中，上述的顯示裝置更包括阻擋層。阻擋層設置且覆蓋於可撓基板的內表面上，而子畫素單元、走線以及接墊配置於阻擋層上。In an embodiment of the invention, the display device further includes a barrier layer. The barrier layer is disposed on and covers the inner surface of the flexible substrate, and the sub-pixel unit, the traces, and the pads are disposed on the barrier layer.
在本發明一實施例中，上述的可撓基板暴露出部分的顯示區，且多個子畫素單元之一部份配置於被可撓基板暴露出的部分的顯示區上。In an embodiment of the invention, the flexible substrate exposes a portion of the display area, and one of the plurality of sub-pixel units is disposed on a display area of the portion exposed by the flexible substrate.
在本發明一實施例中，上述的多個子畫素單元之另一部份設置於可撓基板的一部份上。In an embodiment of the invention, another portion of the plurality of sub-pixel units is disposed on a portion of the flexible substrate.
在本發明一實施例中，上述的顯示裝置更包括阻擋層。阻擋層設置於且覆蓋被可撓基板暴露出的部分顯示區以及可撓基板的內表面，而子畫素單元、走線以及接墊配置於阻擋層上。In an embodiment of the invention, the display device further includes a barrier layer. The barrier layer is disposed on and covers a portion of the display area exposed by the flexible substrate and the inner surface of the flexible substrate, and the sub-pixel unit, the traces, and the pads are disposed on the barrier layer.
在本發明一實施例中，上述的顯示裝置更包括與接墊接合的驅動晶片以及透過接墊與驅動晶片電性連接的可撓印刷電路板。In an embodiment of the invention, the display device further includes a driving die bonded to the pad and a flexible printed circuit board electrically connected to the driving chip through the pad.
在本發明一實施例中，上述的顯示裝置更包括與接墊接合的可撓印刷電路板。In an embodiment of the invention, the display device further includes a flexible printed circuit board bonded to the pad.
在本發明一實施例中，上述的顯示裝置更包括位於顯示面板與背框之間的背光模組。In an embodiment of the invention, the display device further includes a backlight module located between the display panel and the back frame.
基於上述，在本發明一實施例的顯示裝置中，第一硬質基板上配置有可撓基板，且走線及接墊是搭載於延伸至第一硬質基板及背框外之可撓基板的電路區上。藉此，走線及接墊可隨著可撓基板之電路區的彎折而配置於背框的外表面上。意即，顯示裝置之配置走線及接墊的外引腳接合區可彎折至背框的外表面上，從而顯示裝置能夠實現超窄邊框，且可實現部份彎折的應用。In the display device according to the embodiment of the invention, the flexible substrate is disposed on the first rigid substrate, and the wiring and the pad are mounted on the flexible substrate extending to the first rigid substrate and the back frame. On the district. Thereby, the wiring and the pad can be disposed on the outer surface of the back frame along with the bending of the circuit area of the flexible substrate. That is to say, the configuration lead of the display device and the outer pin joint region of the pad can be bent onto the outer surface of the back frame, so that the display device can realize an ultra-narrow bezel and can realize partial bending application.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more apparent, the following is a specialThe embodiments are described in detail below in conjunction with the drawings.
100‧‧‧顯示面板100‧‧‧ display panel
110‧‧‧硬質基板110‧‧‧hard substrate
110a、120a、222a‧‧‧內表面110a, 120a, 222a‧‧‧ inner surface
110b、120b、222b、224a‧‧‧外表面110b, 120b, 222b, 224a‧‧‧ outer surface
110c‧‧‧顯示區110c‧‧‧ display area
110d‧‧‧周邊區110d‧‧‧ surrounding area
112‧‧‧第一硬質基板112‧‧‧First hard substrate
114‧‧‧第二硬質基板114‧‧‧Second hard substrate
120、120E‧‧‧可撓基板120, 120E‧‧‧ flexible substrate
120c、120cC、120cD‧‧‧電路區120c, 120cC, 120cD‧‧‧ circuit area
120d‧‧‧區域120d‧‧‧Area
130、130E‧‧‧阻擋層130, 130E‧‧‧ barrier
140‧‧‧子畫素單元140‧‧‧Subpixel unit
142、144‧‧‧絕緣層142, 144‧‧‧ insulation
152、154、156‧‧‧接墊152, 154, 156‧‧‧ pads
162、164‧‧‧走線162, 164‧‧‧ Trace
170‧‧‧對向基板170‧‧‧ opposite substrate
180‧‧‧顯示介質層180‧‧‧Display media layer
190‧‧‧框膠190‧‧‧Box glue
200、242‧‧‧驅動晶片200, 242‧‧‧ drive wafer
210、240‧‧‧可撓印刷電路板210, 240‧‧‧Flexible printed circuit boards
220‧‧‧背框220‧‧‧ Back frame
220a‧‧‧外表面220a‧‧‧ outer surface
222‧‧‧底部222‧‧‧ bottom
224‧‧‧側壁224‧‧‧ side wall
230‧‧‧背光模組230‧‧‧Backlight module
232‧‧‧導光板232‧‧‧Light guide plate
234‧‧‧光源234‧‧‧Light source
1000、1000A~1000F‧‧‧顯示裝置1000, 1000A~1000F‧‧‧ display device
A-A’‧‧‧剖線A-A’‧‧‧ cut line
D‧‧‧汲極D‧‧‧汲
DL‧‧‧資料線DL‧‧‧ data line
G‧‧‧閘極G‧‧‧ gate
g‧‧‧間隙G‧‧‧ gap
K‧‧‧扇出走線群K‧‧‧ fanout group
PE‧‧‧畫素電極PE‧‧‧ pixel electrode
S‧‧‧源極S‧‧‧ source
SL‧‧‧掃描線SL‧‧‧ scan line
T‧‧‧電晶體T‧‧‧O crystal
圖1A至圖1D為本發明一實施例之顯示裝置的製造流程剖面示意圖。1A to 1D are schematic cross-sectional views showing a manufacturing process of a display device according to an embodiment of the present invention.
圖2為圖1A之可撓基板、阻擋層、多個子畫素單元、多條走線與多個接墊的上視示意圖。2 is a top plan view of the flexible substrate, the barrier layer, the plurality of sub-pixel units, the plurality of traces, and the plurality of pads of FIG. 1A.
圖3A至圖3D為本發明另一實施例之顯示裝置的製造流程剖面示意圖。3A to 3D are schematic cross-sectional views showing a manufacturing process of a display device according to another embodiment of the present invention.
圖4為本發明又一實施例之顯示裝置的剖面示意圖。4 is a cross-sectional view showing a display device according to still another embodiment of the present invention.
圖5為本發明再一實施例之顯示裝置的剖面示意圖。FIG. 5 is a cross-sectional view showing a display device according to still another embodiment of the present invention.
圖6A為本發明一實施例之顯示裝置的剖面示意圖。6A is a cross-sectional view of a display device in accordance with an embodiment of the present invention.
圖6B為圖6A之電路區未彎折向背框前時第一硬質基板、可撓基板、阻擋層、多個子畫素單元、多條走線與多個接墊的上視示意圖。6B is a top view of the first hard substrate, the flexible substrate, the barrier layer, the plurality of sub-pixel units, the plurality of traces, and the plurality of pads when the circuit area of FIG. 6A is not bent toward the front frame.
圖7為本發明另一實施例之顯示裝置的剖面示意圖。FIG. 7 is a cross-sectional view of a display device according to another embodiment of the present invention.
圖1A至圖1D為本發明一實施例之顯示裝置的製造流程剖面示意圖。請參照圖1A，首先，提供具有相對之內表面110a與外表面110b，即具有二個相反的表面的硬質基板110。硬質基板(rigid substrate)110具有顯示區110c及位於顯示區110c外的周邊區110d。在本實施例中，硬質基板110可選擇性地為透光基板。透光基板的材質可為玻璃、石英、有機聚合物、或是其它可適用的材料。然而，本發明不限於此，在其他實施例中，硬質基板110亦可為不透光/反光基板。不透光/反光基板的材質例如為導電材料、晶圓、陶瓷、或其它可適用的材料。1A to 1D are schematic cross-sectional views showing a manufacturing process of a display device according to an embodiment of the present invention. Referring to FIG. 1A, first, a rigid substrate 110 having an opposite inner surface 110a and an outer surface 110b, that is, having two opposite surfaces, is provided. Hard baseA rigid substrate 110 has a display area 110c and a peripheral area 110d located outside the display area 110c. In this embodiment, the rigid substrate 110 can be selectively a light transmissive substrate. The material of the transparent substrate may be glass, quartz, organic polymer, or other applicable materials. However, the present invention is not limited thereto. In other embodiments, the rigid substrate 110 may also be an opaque/reflective substrate. The material of the opaque/reflective substrate is, for example, a conductive material, a wafer, a ceramic, or other applicable materials.
接著，在硬質基板110的內表面110a上形成可撓基板120。可撓基板(或稱為軟性基板，flexible substrate)120具有相對之內表面120a與外表面120b，即具有二個相反的表面。可撓基板120的內表面120a背向硬質基板110。可撓基板120的外表面120b面向硬質基板110的內表面110a。在本實施例中，可撓基板120的外表面120b可與硬質基板110的內表面110a直接接觸，但本發明不以此為限，例如：至少一粘著層夾設於可撓基板120與硬質基板110之間而呈現三明治堆疊結構。可撓基板120的材質可選自有機聚合物，例如：聚醯亞胺(polyimide，PI)、聚萘二甲酸乙醇酯(polyethylene naphthalate，PEN)、聚對苯二甲酸乙二酯(poly(ethylene terephthalate，PET)、聚碳酸酯(polycarbonates，PC)、聚醚碸(poly(ether sulfone)，PES)、聚芳基酸酯(polyarylate)、或其它合適的材料。Next, a flexible substrate 120 is formed on the inner surface 110a of the hard substrate 110. The flexible substrate 120 has a relatively inner surface 120a and an outer surface 120b, that is, has two opposite surfaces. The inner surface 120a of the flexible substrate 120 faces away from the rigid substrate 110. The outer surface 120b of the flexible substrate 120 faces the inner surface 110a of the rigid substrate 110. In this embodiment, the outer surface 120b of the flexible substrate 120 can be in direct contact with the inner surface 110a of the rigid substrate 110, but the invention is not limited thereto. For example, at least one adhesive layer is sandwiched between the flexible substrate 120 and A sandwich stack structure is formed between the hard substrates 110. The material of the flexible substrate 120 may be selected from organic polymers, such as polyimide (PI), polyethylene naphthalate (PEN), and polyethylene terephthalate (poly(ethylene). Terephthalate, PET), polycarbonate (PC), poly(ether sulfone, PES), polyarylate, or other suitable materials.
可撓基板120配置於硬質基板110的內表面110a上，以覆蓋硬質基板110之至少部份的顯示區110c。可撓基板120至少具有由硬質基板110之顯示區110c正上方延伸至硬質基板110之周邊區110d正上方的電路區120c。在本實施例中，可撓基板120可全面性地覆蓋硬質基板110的顯示區110c與周邊區110d。然而，本發明不限於此，在其他實施例中，可撓基板亦可覆蓋硬質基板110的周邊區110d、部份的顯示區110c，而暴露出其餘部份的顯示區110c。以下將於後續段落中配合圖示說明之。The flexible substrate 120 is disposed on the inner surface 110a of the rigid substrate 110 to cover at least a portion of the display region 110c of the rigid substrate 110. The flexible substrate 120 has at least a portion directly extending from the display region 110c of the rigid substrate 110 to the rigid substrate 110.The circuit area 120c directly above the peripheral area 110d. In the embodiment, the flexible substrate 120 can cover the display area 110c and the peripheral area 110d of the rigid substrate 110 in a comprehensive manner. However, the present invention is not limited thereto. In other embodiments, the flexible substrate may also cover the peripheral region 110d of the rigid substrate 110 and a portion of the display region 110c to expose the remaining portion of the display region 110c. The following paragraphs will be accompanied by illustrations in the following paragraphs.
接著，在本實施例中，可選擇性地在可撓基板120的內表面120a上形成阻擋層130。阻擋層130設置且覆蓋可撓基板120的內表面120a。阻擋層130可與可撓基板120的內表面120a直接接觸。在本實施例中，阻擋層130可覆蓋可撓基板120的電路區120c及可撓基板120之除了電路區120c外的其餘區域120d。阻擋層130能夠阻擋外界水氣及/或來自硬質基板110的雜質傷害於後續製程中形成在阻擋層130上的構件(例如：子畫素單元、走線、接墊等)，進而使顯示裝置的信賴性(reliability)更佳。阻擋層130可為單層或雙層結構，且其材料可為無機材料(例如：氧化矽、氮化矽、氮氧化矽、或其它合適材料、或上述至少二種材料的堆疊層)、有機材料(可選自上述的有機材料)或上述之組合。Next, in the present embodiment, the barrier layer 130 may be selectively formed on the inner surface 120a of the flexible substrate 120. The barrier layer 130 is disposed and covers the inner surface 120a of the flexible substrate 120. The barrier layer 130 can be in direct contact with the inner surface 120a of the flexible substrate 120. In this embodiment, the barrier layer 130 may cover the circuit region 120c of the flexible substrate 120 and the remaining region 120d of the flexible substrate 120 except the circuit region 120c. The barrier layer 130 can block external moisture and/or impurities from the hard substrate 110 from harming components formed on the barrier layer 130 in subsequent processes (eg, sub-pixel units, traces, pads, etc.), thereby enabling the display device The reliability is better. The barrier layer 130 may be a single layer or a double layer structure, and the material thereof may be an inorganic material (for example: yttria, tantalum nitride, ytterbium oxynitride, or other suitable materials, or a stacked layer of at least two of the above materials), organic The material (which may be selected from the organic materials described above) or a combination of the above.
圖2為圖1A之可撓基板、阻擋層、多個子畫素單元、多條走線與多個接墊的上視示意圖。特別是，圖1A是對應於圖2的剖線A-A’。請參照圖1A及圖2，接著，在阻擋層130上形成多個子畫素單元140、多個接墊152、154、156與多條走線162、164。換言之，多個子畫素單元140、多個接墊152、154、156與多條走線162、164係配置於阻擋層130與可撓基板120上。子畫素單元140位於可撓基板120的區域120d上。走線162、164與接墊152、154、156位於可撓基板120的電路區120c上。各子畫素單元140至少包括具有閘極G、源極S與汲極D的電晶體T、與閘極G連接的掃描線SL、與源極S連接的資料線DL以及與汲極D電性連接的畫素電極PE。各條走線162、164電性連接於各子畫素單元140與各接墊152、154之間。舉例而言，在本實施例中，各走線162電性連接於各子畫素單元140的掃描線SL與接墊152之間，各走線164電性連接於各子畫素單元140的資料線DL與接墊154之間，而各接墊156與接墊152或接墊154相對設置。多條走線162、164構成扇出(fan out)走線群K。扇出走線群K與接墊152、154、156配置的區域可稱為外引腳接合區(outer lead bonding，OLB)。2 is a top plan view of the flexible substrate, the barrier layer, the plurality of sub-pixel units, the plurality of traces, and the plurality of pads of FIG. 1A. In particular, Fig. 1A is a cross-sectional line A-A' corresponding to Fig. 2. Referring to FIG. 1A and FIG. 2 , a plurality of sub-pixel units 140 , a plurality of pads 152 , 154 , 156 and a plurality of traces 162 , 164 are formed on the barrier layer 130 . In other words, the plurality of sub-pixel units 140, the plurality of pads 152, 154, and 156 and the plurality of traces 162 and 164 are disposed on the barrier layer 130 and the flexible substrate 120. Subpixel unit140 is located on a region 120d of the flexible substrate 120. Traces 162, 164 and pads 152, 154, 156 are located on circuit region 120c of flexible substrate 120. Each sub-pixel unit 140 includes at least a transistor T having a gate G, a source S and a drain D, a scan line SL connected to the gate G, a data line DL connected to the source S, and a drain D Sexually connected pixel electrode PE. Each of the traces 162 and 164 is electrically connected between each of the sub-pixel units 140 and each of the pads 152 and 154. For example, in the present embodiment, each of the traces 162 is electrically connected between the scan line SL of each sub-pixel unit 140 and the pad 152, and each trace 164 is electrically connected to each sub-pixel unit 140. The data line DL is connected to the pad 154, and each pad 156 is disposed opposite to the pad 152 or the pad 154. A plurality of traces 162, 164 constitute a fan out trace group K. The area in which the fan-out wiring group K and the pads 152, 154, and 156 are disposed may be referred to as an outer lead bonding (OLB).
在本實施例中，可同時形成多條掃描線SL、多個閘極G、多條走線162、多個接墊152以及與接墊152相對設置的部份接墊156。然後，於掃描線SL、閘極G以及走線162上覆蓋上一層絕緣層142，絕緣層142暴露出接墊152、156。接著，在絕緣層142上形成與閘極G重疊之電晶體T的通道(未繪示)。之後，在各通道的相對二側形成源極S與汲極D，而源極S與汲極D接觸通道，並且同時形成多條資料線DL、多條走線164、多個接墊154以及與接墊154相對設置的部份接墊156。接著，在通道(未繪示)、源極S、汲極D、資料線DL以及走線164上形成絕緣層144。絕緣層144覆蓋通道、源極S、汲極D、與資料線DL。絕緣層144暴露出接墊154、156與暴露出汲極D一部份的接觸窗。然後，於絕緣層144上形成多個畫素電極PE，各畫素電極PE經由接觸窗與對應的汲極D電性連接。其中，本實施例的閘極G、源極S、汲極D與通道(未繪示)構成電晶體T，且此電晶體T係為底閘型電晶體為範例，但不限於此。於其它實施例中，電晶體T可為頂閘型電晶體，即最先形成通道(未繪示)於阻擋層130上。絕緣層142形成且覆蓋於通道(未繪示)與阻擋層130上，而多條掃描線SL、多個閘極G、多條走線162、多個接墊152以及與接墊152相對設置的部份接墊156形成於絕緣層142上，且各個閘極G與各個通道(未繪示)重疊。其餘的膜層形成順序可參考上述，而不再贅言。需說明的是，上述子畫素單元140的形成方式、子畫素單元140的各構件(即電晶體T、掃描線SL、資料線DL與畫素電極PE)、走線162、164以及接墊152、154、156之間的膜層關係與圖2所示之各子畫素單元140的電晶體T、、掃描線SL、資料線DL以及畫素電極PE的數量是用以舉例說明本發明而非用以限制本發明。子畫素單元140的形成方式、子畫素單元140之各構件、走線162、164以及接墊152、154、156之間的膜層關係與各子畫素單元140的電晶體T、掃描線SL、資料線DL以及畫素電極PE的數量均可視實際需求做其他適當設計。In this embodiment, a plurality of scan lines SL, a plurality of gates G, a plurality of traces 162, a plurality of pads 152, and a plurality of pads 156 disposed opposite the pads 152 may be simultaneously formed. Then, the scan line SL, the gate G and the trace 162 are covered with an insulating layer 142, and the insulating layer 142 exposes the pads 152, 156. Next, a channel (not shown) of the transistor T overlapping the gate G is formed on the insulating layer 142. Thereafter, the source S and the drain D are formed on opposite sides of each channel, and the source S and the drain D are in contact with the channel, and simultaneously form a plurality of data lines DL, a plurality of traces 164, a plurality of pads 154, and A portion of the pad 156 disposed opposite the pad 154. Next, an insulating layer 144 is formed on the vias (not shown), the source S, the drain D, the data lines DL, and the traces 164. The insulating layer 144 covers the channel, the source S, the drain D, and the data line DL. Insulation layer 144The contact pads 154, 156 are exposed to a contact window exposing a portion of the drain D. Then, a plurality of pixel electrodes PE are formed on the insulating layer 144, and each of the pixel electrodes PE is electrically connected to the corresponding drain D through a contact window. The gate G, the source S, the drain D and the channel (not shown) of the present embodiment constitute a transistor T, and the transistor T is a bottom gate transistor, but is not limited thereto. In other embodiments, the transistor T can be a top gate type transistor, that is, a channel (not shown) is formed on the barrier layer 130 first. The insulating layer 142 is formed on the channel (not shown) and the barrier layer 130, and the plurality of scan lines SL, the plurality of gates G, the plurality of traces 162, the plurality of pads 152, and the pads 152 are disposed opposite to each other. The partial pads 156 are formed on the insulating layer 142, and the respective gates G overlap with the respective channels (not shown). For the remaining film formation order, reference may be made to the above, and it is no longer a rumor. It should be noted that the formation manner of the sub-pixel unit 140, the components of the sub-pixel unit 140 (ie, the transistor T, the scan line SL, the data line DL and the pixel electrode PE), the traces 162, 164, and the connection The relationship between the film layers between the pads 152, 154, and 156 and the number of the transistors T, the scanning lines SL, the data lines DL, and the pixel electrodes PE of each of the sub-pixel units 140 shown in FIG. 2 are used to illustrate the present example. The invention is not intended to limit the invention. The formation of the sub-pixel unit 140, the components of the sub-pixel unit 140, the traces 162, 164, and the film relationship between the pads 152, 154, 156 and the transistor T of each sub-pixel unit 140, scanning The number of lines SL, data lines DL, and pixel electrodes PE can be appropriately designed according to actual needs.
請參照圖1A，接著，在硬質基板110的對向處形成對向基板170並形成顯示介質層180。對向基板170可為可撓基板或剛性基板(或稱為硬質基板)。顯示介質層180位於硬質基板110與對向基板170之間。舉例而言，在本實施例中，若採用液晶為顯示介質層180，則可先在硬質基板110上方形成框膠190；然後，再將顯示介質層180滴入硬質基板110與框膠190圍出的空間中；之後，於近真空環境下將對向基板170移至硬質基板110上方並與框膠190接觸，以組裝(assemble)對向基板170與硬質基板110。於其它實施例，框膠190可先形成在對向基板170上，然後，再依續上述的製造方法，在此不再贅言。簡言之，當顯示介質層180採用非自發光材料時，例如：液晶為範例，可採用滴入(one drop fill，ODF)法或真空注入(injection)法形成顯示介質層180。然而，本發明不限於此，在其他實施例中，非自發光材料包含電泳材料、電潤濕材料、電致變色材料或其它合適的材料，且上述材料可採用適當方式形成顯示介質層180。此外，需說明的是，本發明並不限制顯示介質層180一定要採用非自發光材料，在其他實施例中，亦可採用自發光材料(例如：有機電致發光材料、無機電致發光材料或其他適當材料)做為顯示介質層180，且利用對應的方法(例如：蒸鍍、噴墨、轉印或其它合適的方法)形成之。Referring to FIG. 1A, a counter substrate 170 is formed on the opposite side of the hard substrate 110 to form a display medium layer 180. The opposite substrate 170 may be a flexible substrate or a rigid substrate (or referred to as a rigid substrate). The display medium layer 180 is located on the hard substrate 110 and the pairBetween the substrates 170. For example, in the embodiment, if the liquid crystal is used as the display medium layer 180, the sealant 190 may be formed on the hard substrate 110; then, the display medium layer 180 is dropped into the rigid substrate 110 and the sealant 190. After that, the opposite substrate 170 is moved over the hard substrate 110 and brought into contact with the sealant 190 in a near vacuum environment to assemble the opposite substrate 170 and the hard substrate 110. In other embodiments, the sealant 190 may be formed on the opposite substrate 170 first, and then continue to be described above. In short, when the display medium layer 180 is a non-self-luminous material, for example, a liquid crystal is exemplified, the display medium layer 180 may be formed by a one drop fill (ODF) method or a vacuum injection method. However, the invention is not limited thereto, and in other embodiments, the non-self-emissive material comprises an electrophoretic material, an electrowetting material, an electrochromic material, or other suitable material, and the above materials may be used to form the display medium layer 180 in a suitable manner. In addition, it should be noted that the present invention does not limit the display medium layer 180 to use non-self-luminous materials. In other embodiments, self-luminous materials (eg, organic electroluminescent materials, inorganic electroluminescent materials) may also be used. Or other suitable material) is used as the display dielectric layer 180 and is formed using a corresponding method (eg, evaporation, inkjet, transfer, or other suitable method).
請參照圖1A及圖2，接著，接合(bounding)驅動晶片200與接墊152、154、156，且接合接墊156與可撓印刷電路板(flexible printed circuit，FPC)210。可撓印刷電路板210透過接墊156與驅動晶片200電性連接。在本實施例中，可在子畫素單元140的製程之外，獨立製作驅動晶片200，然後，再將驅動晶片200與接墊152、154、156接合。然而，本發明不限於此，在其他實施例中，亦可將驅動晶片的製作整合在子畫素單元140的製程中，然後，再接合可撓印刷電路板與和此驅動晶片電性連接的接墊。舉例而言，驅動晶片200可包括閘極驅動電路(Gate Driver On Array，GOA)，或者是驅動晶片200設置在可撓印刷電路板210之表面上且與可撓印刷電路板210內的導線連接，再接合接墊152、154、156與可撓印刷電路板(flexible printed circuit，FPC)210。Referring to FIG. 1A and FIG. 2, the driving wafer 200 and the pads 152, 154, and 156 are bonded, and the bonding pads 156 and the flexible printed circuit (FPC) 210 are bonded. The flexible printed circuit board 210 is electrically connected to the driving die 200 through the pads 156. In the present embodiment, the driving wafer 200 can be independently fabricated outside the process of the sub-pixel unit 140, and then the driving wafer 200 is bonded to the pads 152, 154, 156. However, the invention is not limited thereto, and in other embodiments,The fabrication of the driver wafer can also be integrated into the process of the sub-pixel unit 140, and then the flexible printed circuit board and the pads electrically connected to the driver chip can be bonded. For example, the driving chip 200 may include a Gate Driver On Array (GOA), or the driving wafer 200 is disposed on the surface of the flexible printed circuit board 210 and connected to the wires in the flexible printed circuit board 210. Reconnecting pads 152, 154, 156 and a flexible printed circuit (FPC) 210.
請參照圖1A及圖1B，接著，去除硬質基板110之至少部份的周邊區110d，以形成第一硬質基板112。是否完全地去除硬質基板110的周邊區110d或保留一部份的周邊區110d，端視實際的需求而定。但是，被保留一部份的的周邊區110d不能影響可撓基板120彎折至下述實施例所述的實施方式為準。第一硬質基板112至少包括硬質基板110的顯示區110c，且亦具有前述之硬質基板110的內表面110a與外表面110b。第一硬質基板112相對於對向基板170。顯示介質層180配置於第一硬質基板112與對向基板170之間。對向基板170在第一硬質基板112上的正投影與第一硬質基板112的顯示區110c疊合(matched)。換言之，第一硬質基板112的顯示區110c可由對向基板170在第一硬質基板112上的正投影定義出。Referring to FIG. 1A and FIG. 1B, the peripheral region 110d of at least a portion of the hard substrate 110 is removed to form the first rigid substrate 112. Whether to completely remove the peripheral region 110d of the rigid substrate 110 or to retain a portion of the peripheral region 110d depends on actual needs. However, the portion of the peripheral region 110d that is retained cannot affect the bending of the flexible substrate 120 to the embodiment described in the following embodiments. The first rigid substrate 112 includes at least the display region 110c of the rigid substrate 110, and also has the inner surface 110a and the outer surface 110b of the aforementioned rigid substrate 110. The first rigid substrate 112 is opposite to the opposite substrate 170. The display medium layer 180 is disposed between the first hard substrate 112 and the opposite substrate 170. The orthographic projection of the counter substrate 170 on the first hard substrate 112 is matched with the display region 110c of the first hard substrate 112. In other words, the display region 110c of the first hard substrate 112 can be defined by the orthographic projection of the opposite substrate 170 on the first hard substrate 112.
第一硬質基板112暴露出可撓基板120之位於電路區120c的部份外表面120b。可撓基板120之另一部份的外表面120b可與第一硬質基板112接觸。在本實施例中，可利用雷射挖除製程(laser lift-off process)從硬質基板110外表面110b去除硬質基板110之至少部份的周邊區110d，以形成第一硬質基板112。然而，本發明並不限制去除硬質基板110之至少部份的周邊區110d的方法為何，在其他實施例中，亦可採用其他適當方法。舉例而言，在其他實施例中，可先用刀具從硬質基板110外表面110b切割硬質基板110；然後，再剝除硬質基板110之至少部份的周邊區110d，以形成第一硬質基板112。The first rigid substrate 112 exposes a portion of the outer surface 120b of the flexible substrate 120 that is located in the circuit region 120c. The outer surface 120b of the other portion of the flexible substrate 120 can be in contact with the first rigid substrate 112. In this embodiment, the hard substrate can be removed from the outer surface 110b of the rigid substrate 110 by a laser lift-off process.At least a portion of the peripheral region 110d of the 110 to form the first rigid substrate 112. However, the present invention does not limit the method of removing the peripheral region 110d of at least a portion of the rigid substrate 110. In other embodiments, other suitable methods may be employed. For example, in other embodiments, the hard substrate 110 may be first cut from the outer surface 110b of the rigid substrate 110 by a cutter; then, the peripheral region 110d of at least a portion of the hard substrate 110 is stripped to form the first rigid substrate 112. .
請參照圖1C，接著，將第一硬質基板112容納於背框220中。此時，背框220可抵頂可撓基板120被第一硬質基板112暴露出的部份外表面120b。然而，本發明不限於此，在其他實施例中，背框220亦可不抵頂可撓基板120被第一硬質基板112暴露出的部份外表面120b。在本實施例中，由於顯示介質層180是選用非自發光性材料，因此，在第一硬質基板112容置於背框220之前，可先將背光模組230設置於背框220中，然後，再將第一硬質基板112容置於背框220中。背光模組230位於顯示面板100的第一硬質基板112與背框220之間。顯示面板100包括對向基板170、顯示介質層180、子畫素單元140、接墊152、154、156、走線162、164、可撓基板120以及第一硬質基板112。Referring to FIG. 1C, the first rigid substrate 112 is then accommodated in the back frame 220. At this time, the back frame 220 can abut the partial outer surface 120b of the flexible substrate 120 exposed by the first rigid substrate 112. However, the present invention is not limited thereto. In other embodiments, the back frame 220 may not abut the partial outer surface 120b of the flexible substrate 120 exposed by the first rigid substrate 112. In this embodiment, since the display medium layer 180 is made of a non-self-luminous material, the backlight module 230 may be disposed in the back frame 220 before the first hard substrate 112 is received in the back frame 220, and then The first rigid substrate 112 is further received in the back frame 220. The backlight module 230 is located between the first rigid substrate 112 and the back frame 220 of the display panel 100. The display panel 100 includes a counter substrate 170, a display medium layer 180, sub-pixel units 140, pads 152, 154, 156, traces 162, 164, a flexible substrate 120, and a first rigid substrate 112.
在本實施例中，背光模組230可包括導光板232以及配置於導光板232旁的光源234，而光源234發出的光線透過導光板232的傳遞後可分散至顯示面板100各處，進而穿過顯示介質層180以提供顯示畫面。本實施例之背光模組230可為側入式背光模組，然而，本發明不限於此，在其他實施例中，背光模組亦可為直下式背光模組或其他適當形式的背光模組。舉例而言，直下式背光模組中背光模組230包含光學膜片(例如：擴散膜或增亮膜)與光源，而光源的光線透過光學膜片分散至顯示面板100各處，進而穿過顯示介質層180以提供顯示畫面。需說明的是，本發明並不限制顯示裝置一定要包括背光模組，在其他實施例中，當顯示介質層選用自發光顯示介質(例如：有機電致發光層或其他可適用材料)時，顯示裝置亦可不包括背光模組230。In this embodiment, the backlight module 230 can include a light guide plate 232 and a light source 234 disposed beside the light guide plate 232. The light emitted by the light source 234 can be dispersed throughout the display panel 100 after being transmitted through the light guide plate 232, and then worn. The medium layer 180 is displayed to provide a display screen. The backlight module 230 of the embodiment may be a side-lit backlight module. However, the present invention is not limited thereto. In other embodiments, the backlight module may also beDirect-lit backlight module or other suitable form of backlight module. For example, in the direct type backlight module, the backlight module 230 includes an optical film (for example, a diffusion film or a brightness enhancement film) and a light source, and the light of the light source is dispersed through the optical film to the display panel 100, and then passes through. The media layer 180 is displayed to provide a display screen. It should be noted that, the present invention does not limit the display device to include the backlight module. In other embodiments, when the display medium layer is selected from a self-luminous display medium (for example, an organic electroluminescent layer or other applicable materials), The display device may also not include the backlight module 230.
請參照圖1C，可撓基板120的電路區120c由第一硬質基板112的顯示區110c延伸至第一硬質基板112與背框220外。從另一角度而言，可撓基板120的電路區120c是從與顯示介質層180重疊區域之邊緣向外越過環繞顯示介質層180的框膠190，進而延伸至第一硬質基板112與背框220外。換言之，如圖1A所示，可撓基板120的電路區120c投影於一平面之面積實質上小於或等於硬質基板110的周邊區110d投影於一平面之面積，即可撓基板120的電路區120c會完全重疊或部份重疊於硬質基板110的周邊區110d。請參照圖1D，接著，將可撓基板120之電路區120c延伸至背框220外的部分向下並往背框220的方向彎折，以使位於電路區120c之可撓基板120的外表面120b面向背框220之外表面220a，其中背框220的外表面220a是背向第一硬質基板112。於此，便完成了本實施例之顯示裝置1000。Referring to FIG. 1C , the circuit region 120 c of the flexible substrate 120 extends from the display region 110 c of the first rigid substrate 112 to the outside of the first rigid substrate 112 and the back frame 220 . From another point of view, the circuit region 120c of the flexible substrate 120 extends outward from the edge of the region overlapping the display dielectric layer 180 over the periphery of the display dielectric layer 180, thereby extending to the first rigid substrate 112 and the back frame. 220 outside. In other words, as shown in FIG. 1A, the area of the circuit area 120c of the flexible substrate 120 projected on a plane is substantially smaller than or equal to the area projected by the peripheral area 110d of the rigid substrate 110 on a plane, that is, the circuit area 120c of the substrate 120 can be flexed. The peripheral region 110d of the hard substrate 110 may be completely overlapped or partially overlapped. Referring to FIG. 1D, the portion of the flexible substrate 120 extending from the circuit region 120c to the outside of the back frame 220 is bent downward and bent in the direction of the back frame 220 so that the outer surface of the flexible substrate 120 located in the circuit region 120c is The 120b faces the outer surface 220a of the back frame 220, wherein the outer surface 220a of the back frame 220 faces away from the first rigid substrate 112. Here, the display device 1000 of the present embodiment is completed.
背框220例如可包括底部222以及側壁224。底部222遮蔽子畫素單元140(標示於圖2)。底部222具有面向第一硬質基板112的內表面222a以及相對於內表面222a的外表面222b。側壁224設置於底部222的內表面220a上且具有背向第一硬質基板112的外表面224a。底部222與側壁224圍出一空間，以容納第一硬質基板112。在本實施例中，位於電路區120c之可撓基板120的外表面120b面向側壁224的外表面224a以及底部222之部份的外表面222b，則位於電路區120c之走線162、164(標示於圖2)會經過背框220的側壁224而延伸至背框220的底部222上。此時，位於電路區120c上的接墊152、154、156會與背框220之部份的底部222重疊。Back frame 220 can include, for example, a bottom 222 and side walls 224. The bottom 222 masks the sub-pixel unit 140 (shown in Figure 2). The bottom 222 has a first hard base facingThe inner surface 222a of the plate 112 and the outer surface 222b relative to the inner surface 222a. The sidewall 224 is disposed on the inner surface 220a of the bottom portion 222 and has an outer surface 224a that faces away from the first rigid substrate 112. The bottom 222 and the side wall 224 enclose a space to accommodate the first rigid substrate 112. In the present embodiment, the outer surface 120b of the flexible substrate 120 located in the circuit region 120c faces the outer surface 224a of the sidewall 224 and the outer surface 222b of the portion of the bottom portion 222, and the traces 162, 164 of the circuit region 120c are marked. 2) will extend through the side wall 224 of the back frame 220 to the bottom 222 of the back frame 220. At this time, the pads 152, 154, 156 located on the circuit region 120c overlap the bottom portion 222 of the portion of the back frame 220.
簡言之，本實施例之可撓基板120的電路區120c可具有足夠的長度，以繞過背框220的側壁224，進而使配置於電路區120c上的接墊152、154、156、驅動晶片200、可撓印刷電路板210隱藏在背框220的底部222下。然而，本發明不限於此，在其他實施例中，接墊152、154、156、驅動晶片200、可撓印刷電路板210亦可以其他適當方式配置，以下將於後續段落中配合圖示說明之。In short, the circuit area 120c of the flexible substrate 120 of the present embodiment may have a sufficient length to bypass the sidewall 224 of the back frame 220, thereby enabling the pads 152, 154, 156 and the driving on the circuit region 120c. The wafer 200 and the flexible printed circuit board 210 are hidden under the bottom 222 of the back frame 220. However, the present invention is not limited thereto. In other embodiments, the pads 152, 154, 156, the driving chip 200, and the flexible printed circuit board 210 may be configured in other suitable manners, which will be described later in the following paragraphs. .
值得一提的是，由於走線162、164以及接墊152、154、156是搭載於可撓基板120的電路區120c上，且可撓基板120的電路區120c是由顯示區110c延伸至第一硬質基板112與背框220外，因此，走線162、164以及接墊152、154、156可隨著可撓基板120之電路區120c的彎折而配置於背框220的外表面220a上。意即，顯示裝置1000的外引腳接合區(即由走線162、164構成之扇出走線群K與接墊152、154、156所在處)可彎折至背框220的外表面220a上，從而顯示裝置1000能夠實現超窄邊框。It is worth mentioning that the traces 162, 164 and the pads 152, 154, 156 are mounted on the circuit region 120c of the flexible substrate 120, and the circuit region 120c of the flexible substrate 120 extends from the display region 110c to the first The outer surface of the back frame 220 is disposed on the outer surface 220a of the back frame 220 along with the bending of the circuit area 120c of the flexible substrate 120. . That is, the outer pin junction area of the display device 1000 (ie, consisting of the traces 162, 164)The fanout group K and the pads 152, 154, 156 can be bent onto the outer surface 220a of the back frame 220, so that the display device 1000 can achieve an ultra-narrow bezel.
圖3A至圖3D為本發明另一實施例之顯示裝置的製造流程剖面示意圖。圖3A至圖3D的顯示裝置的製造流程與圖1A至圖1D的顯示裝置的製造流程類似，且圖3D的顯示裝置1000B與圖1D的顯示裝置1000類似，因此相同或相對應的元件以相同或相對應的標號表示。圖3A至圖3D的顯示裝置製造流程與圖1A至圖1D的顯示裝置製造流程的主要差異在於：二者之移除硬質基板110的區域略有不同。圖3D的顯示裝置1000B與圖1D的顯示裝置1000的主要差異在於：顯示裝置1000B較顯示裝置1000多了第二硬質基板114。以下主要就此相異處做說明，二者相同之處請依圖3A至圖3D中的標號參照前述說明，於此便不再重述。3A to 3D are schematic cross-sectional views showing a manufacturing process of a display device according to another embodiment of the present invention. The manufacturing process of the display device of FIGS. 3A to 3D is similar to the manufacturing process of the display device of FIGS. 1A to 1D, and the display device 1000B of FIG. 3D is similar to the display device 1000 of FIG. 1D, and thus the same or corresponding elements are the same Or the corresponding label is indicated. The main difference between the manufacturing process of the display device of FIGS. 3A to 3D and the manufacturing process of the display device of FIGS. 1A to 1D is that the areas where the hard substrate 110 is removed are slightly different. The main difference between the display device 1000B of FIG. 3D and the display device 1000 of FIG. 1D is that the display device 1000B has more of the second rigid substrate 114 than the display device 1000. The following mainly explains the difference, and the same points are referred to the above description according to the reference numerals in FIGS. 3A to 3D, and will not be repeated here.
請參照圖3A，首先，提供具有相對之內表面110a與外表面110b的硬質基板110。接著，在硬質基板110的內表面110a上形成可撓基板120。接著，可選擇性地在可撓基板120的內表面120a上形成阻擋層130。圖3A之可撓基板、阻擋層、多個子畫素單元、多條走線與多個接墊的上視示意圖同圖2，請參照圖2及圖3A，接著，在阻擋層130上形成多個子畫素單元140、多個接墊152、154、156與多條走線162、164。多個子畫素單元140、多個接墊152、154、156與多條走線162、164可配置於阻擋層130及可撓基板120上。接著，接合驅動晶片200與接墊152、154、156，且接合接墊156與可撓印刷電路板210。Referring to FIG. 3A, first, a rigid substrate 110 having an opposite inner surface 110a and an outer surface 110b is provided. Next, a flexible substrate 120 is formed on the inner surface 110a of the hard substrate 110. Next, a barrier layer 130 may be selectively formed on the inner surface 120a of the flexible substrate 120. FIG. 3A is a top view of the flexible substrate, the barrier layer, the plurality of sub-pixel units, the plurality of traces and the plurality of pads, and FIG. 2, please refer to FIG. 2 and FIG. 3A, and then formed on the barrier layer 130. The sub-pixel unit 140, the plurality of pads 152, 154, 156 and the plurality of traces 162, 164. The plurality of sub-pixel units 140, the plurality of pads 152, 154, and 156 and the plurality of traces 162 and 164 may be disposed on the barrier layer 130 and the flexible substrate 120. Next, the driving wafer 200 and the pads 152, 154, 156 are bonded, and the bonding pads 156 and the flexible printed circuit board 210 are bonded.
請參照圖3A及圖3B，接著，去除硬質基板110之至少部份的周邊區110d，以形成第一硬質基板112與第二硬質基板114。請參照圖3B，可撓基板120的部份電路區120c位於第二硬質基板114上。第一硬質基板112與第二硬質基板114之間存在一間隙g，以使得第一硬質基板112與第二硬質基板114相互分隔開來。間隙g暴露出位於電路區120c之可撓基板120的外表面120b。第二硬質基板114在可撓基板120上的正投影至少與接墊152、154、156在可撓基板120上的正投影重疊。於其它實施例中，可撓基板120電路區120c上之部份走線162、164與接墊152、154、156位於第二硬質基板114上，即第二硬質基板114在可撓基板120上的正投影與接墊152、154、156及部份走線162、164在可撓基板120上的正投影重疊。第二硬質基板114與第一硬質基板112是由同一塊硬質基板110形成。第二硬質基板114與第一硬質基板112是位於可撓基板120的同一側，即第二硬質基板114與第一硬質基板112是位於可撓基板120的外表面120b。第二硬質基板114亦具有前述之硬質基板110(或第一硬質基板112)的內表面110a與外表面110b。Referring to FIGS. 3A and 3B, at least a portion of the peripheral region 110d of the rigid substrate 110 is removed to form a first rigid substrate 112 and a second rigid substrate 114. Referring to FIG. 3B, a portion of the circuit region 120c of the flexible substrate 120 is located on the second rigid substrate 114. A gap g exists between the first rigid substrate 112 and the second rigid substrate 114 such that the first rigid substrate 112 and the second rigid substrate 114 are separated from each other. The gap g exposes the outer surface 120b of the flexible substrate 120 located in the circuit region 120c. The orthographic projection of the second rigid substrate 114 on the flexible substrate 120 overlaps at least the orthographic projection of the pads 152, 154, 156 on the flexible substrate 120. In other embodiments, a portion of the traces 162 , 164 and pads 152 , 154 , 156 on the circuit region 120 c of the flexible substrate 120 are located on the second rigid substrate 114 , that is, the second rigid substrate 114 is on the flexible substrate 120 . The orthographic projection overlaps the orthographic projections of pads 152, 154, 156 and portions of traces 162, 164 on flexible substrate 120. The second rigid substrate 114 and the first hard substrate 112 are formed of the same rigid substrate 110. The second rigid substrate 114 and the first rigid substrate 112 are located on the same side of the flexible substrate 120 , that is, the second rigid substrate 114 and the first rigid substrate 112 are located on the outer surface 120 b of the flexible substrate 120 . The second rigid substrate 114 also has the inner surface 110a and the outer surface 110b of the aforementioned rigid substrate 110 (or the first rigid substrate 112).
請參照圖3C，接著，將第一硬質基板112容納於背框220中。此時，背框220伸入第一硬質基板112與第二硬質基板114之間的間隙g。可撓基板120之部分的電路區120c以及第二硬質基板114是位於背框220外。請參照圖3D，接著，將可撓基板120之電路區120c延伸至背框220外的部分以及第二硬質基板114向下並往背框220的方向彎折，則位於電路區120c之可撓基板120的外表面120b以及第二硬質基板114的外表面110b面向背框220的外表面220a。於此，便完成了本實施例之顯示裝置1000B。Referring to FIG. 3C, the first rigid substrate 112 is then accommodated in the back frame 220. At this time, the back frame 220 protrudes into the gap g between the first rigid substrate 112 and the second rigid substrate 114. The circuit area 120c and the second hard substrate 114 of the portion of the flexible substrate 120 are located outside the back frame 220. Referring to FIG. 3D, the circuit region 120c of the flexible substrate 120 is extended to a portion outside the back frame 220 and the second rigid substrate 114 is oriented.Bending downward and in the direction of the back frame 220, the outer surface 120b of the flexible substrate 120 and the outer surface 110b of the second rigid substrate 114 in the circuit region 120c face the outer surface 220a of the back frame 220. Here, the display device 1000B of the present embodiment is completed.
圖3D之顯示裝置1000B與圖1D之顯示裝置1000不同的是，顯示裝置1000D更包括第二硬質基板114。在本實施例中，被間隙g暴露出之可撓性基板120電路區120c的外表面120b面向背框220側壁224的外表面224a，則位於電路區120c之走線162、164會經過背框220側壁224且延伸至背框220底部222。此時，電路區120c上的接墊152、154、156會與部份底部222重疊，而第二硬質基板114的外表面110b面向底部222的外表面222a。顯示裝置1000B亦具有與顯示裝置1000類似的功效及優點，於此便不再重述。The display device 1000B of FIG. 3D is different from the display device 1000 of FIG. 1D in that the display device 1000D further includes a second rigid substrate 114. In this embodiment, the outer surface 120b of the flexible substrate 120 circuit region 120c exposed by the gap g faces the outer surface 224a of the sidewall 224 of the back frame 220, and the traces 162, 164 located in the circuit region 120c pass through the back frame. The sidewall 224 extends to the bottom 222 of the back frame 220. At this time, the pads 152, 154, 156 on the circuit region 120c overlap the partial bottom portion 222, and the outer surface 110b of the second rigid substrate 114 faces the outer surface 222a of the bottom portion 222. The display device 1000B also has similar functions and advantages as the display device 1000, and will not be repeated here.
圖4為本發明又一實施例之顯示裝置的剖面示意圖。圖4的顯示裝置1000C與圖1D的顯示裝置1000類似，因此相同或相對應的元件以相同或相對應的標號表示。此外，顯示裝置1000C的可撓基板120、阻擋層130、多個子畫素單元140、多條走線162、164與多個接墊152、154、156在可撓基板120的電路區120cC未彎折向背框220之前，其上視示意圖與圖2相同，而圖2中的可撓基板120的電路區120c是對應於圖4之可撓基板120的電路區120cC。顯示裝置1000C與顯示裝置1000的主要差異在於：顯示裝置1000C之可撓基板120的電路區120cC較短，而搭載於電路區120cC上的接墊152、154、156是位於背框220的側壁224上。以下主要就此差異處做說明，二者相同之處請依圖4中的標號參照前述說明，於此便不再重述。4 is a cross-sectional view showing a display device according to still another embodiment of the present invention. The display device 1000C of FIG. 4 is similar to the display device 1000 of FIG. 1D, and thus the same or corresponding elements are denoted by the same or corresponding reference numerals. In addition, the flexible substrate 120 of the display device 1000C, the barrier layer 130, the plurality of sub-pixel units 140, the plurality of traces 162, 164 and the plurality of pads 152, 154, 156 are not bent in the circuit region 120cC of the flexible substrate 120. Before being folded to the back frame 220, the upper view is the same as that of FIG. 2, and the circuit area 120c of the flexible substrate 120 in FIG. 2 is the circuit area 120cC corresponding to the flexible substrate 120 of FIG. The main difference between the display device 1000C and the display device 1000 is that the circuit region 120cC of the flexible substrate 120 of the display device 1000C is short, and the pads 152, 154, 156 mounted on the circuit region 120cC are located on the sidewall 224 of the back frame 220.on. The following mainly explains the difference. If the two are the same, please refer to the above description according to the reference numerals in FIG. 4, and the description will not be repeated here.
請參照圖4及圖2，顯示裝置1000C包括第一硬質基板112、可撓基板120、多個子畫素單元140、多條走線162、164、多個接墊152、154、156、對向基板170、顯示介質層180以及背框220，其中多個子畫素單元140、多條走線162、164、多個接墊152、154、156與顯示裝置1000C其他構件間的關係可從圖2、圖4及前述說明中得知，於此便不再重述。與圖1D的顯示裝置1000不同的是，在圖4的實施例中，位於電路區120cC之可撓基板120的外表面120b面向側壁224的外表面224a，則位於電路區120cC的走線162、164與接墊152、154、156就會位於側壁224的外表面224a上方。更進一步地說，與接墊152、154、156接合的驅動晶片200亦位於側壁224的外表面224a上方，而可撓印刷電路板210可選擇性地由背框220的側壁224彎折至背框220的底部222下方。顯示裝置1000C亦具有與顯示裝置1000類似的功效及優點，於此便不再重述。Referring to FIG. 4 and FIG. 2 , the display device 1000C includes a first rigid substrate 112 , a flexible substrate 120 , a plurality of sub-pixel units 140 , a plurality of traces 162 , 164 , a plurality of pads 152 , 154 , 156 , and a plurality of pads The substrate 170, the display medium layer 180 and the back frame 220, wherein the relationship between the plurality of sub-pixel units 140, the plurality of traces 162, 164, the plurality of pads 152, 154, 156 and other components of the display device 1000C can be seen from FIG. It is understood from Fig. 4 and the foregoing description that it will not be repeated here. Different from the display device 1000 of FIG. 1D, in the embodiment of FIG. 4, the outer surface 120b of the flexible substrate 120 located in the circuit region 120cC faces the outer surface 224a of the sidewall 224, and the trace 162 located in the circuit region 120cC, The 164 and pads 152, 154, 156 are located above the outer surface 224a of the sidewall 224. More specifically, the drive wafer 200 bonded to the pads 152, 154, 156 is also located above the outer surface 224a of the sidewall 224, and the flexible printed circuit board 210 is selectively bendable from the sidewall 224 of the back frame 220 to the back. Below the bottom 222 of the frame 220. The display device 1000C also has similar functions and advantages as the display device 1000, and will not be repeated here.
圖5為本發明再一實施例之顯示裝置的剖面示意圖。圖5的顯示裝置1000D與圖3D的顯示裝置1000B類似，因此相同或相對應的元件以相同或相對應的標號表示。此外，顯示裝置1000D的可撓基板120、阻擋層130、多個子畫素單元140、多條走線162、164與多個接墊152、154、156在可撓基板120的電路區120cD未彎折向背框220之前，其上視示意圖與圖2相同，而圖2中的可撓基板120的電路區120c是對應於圖5之顯示裝置1000D的可撓基板120的電路區120cD。以下主要二者差異處做說明，二者相同之處請依圖5中的標號參照前述說明，於此便不再重述。FIG. 5 is a cross-sectional view showing a display device according to still another embodiment of the present invention. The display device 1000D of FIG. 5 is similar to the display device 1000B of FIG. 3D, and thus the same or corresponding elements are denoted by the same or corresponding reference numerals. In addition, the flexible substrate 120, the barrier layer 130, the plurality of sub-pixel units 140, the plurality of traces 162, 164, and the plurality of pads 152, 154, 156 of the display device 1000D are not bent in the circuit region 120cD of the flexible substrate 120. Before folding to the back frame 220, the top view is the same as that of FIG. 2, and in FIG. 2The circuit region 120c of the flexible substrate 120 is a circuit region 120cD corresponding to the flexible substrate 120 of the display device 1000D of FIG. The following two main differences are explained. If the two are the same, please refer to the above description according to the reference numerals in FIG. 5, and the description will not be repeated here.
圖5的顯示裝置1000D與圖3D的顯示裝置1000B的差異在於：顯示裝置1000D的可撓基板120的電路區120cD較短，而搭載於電路區120cD上第二硬質基板114是位於背框220的側壁224上。詳言之，被第一硬質基板112以及第二硬質基板114暴露出之可撓性基板120電路區120c的外表面120b是面向背框220側壁224的外表面224a，則位於電路區120c之走線162、164與接墊152、154、156就會位於側壁224的外表面224a上方。此時，電路區120c上的接墊152、154、156會與部份側壁224重疊，而第二硬質基板114的外表面110b面向側壁224的外表面224a。顯示裝置1000D亦具有與顯示裝置1000類似的功效及優點，於此便不再重述。The difference between the display device 1000D of FIG. 5 and the display device 1000B of FIG. 3D is that the circuit region 120cD of the flexible substrate 120 of the display device 1000D is shorter, and the second rigid substrate 114 is mounted on the circuit region 120cD. On the side wall 224. In detail, the outer surface 120b of the circuit region 120c of the flexible substrate 120 exposed by the first rigid substrate 112 and the second rigid substrate 114 is the outer surface 224a facing the sidewall 224 of the back frame 220, and is located in the circuit region 120c. Lines 162, 164 and pads 152, 154, 156 are located above outer surface 224a of side wall 224. At this time, the pads 152, 154, 156 on the circuit region 120c overlap with the partial sidewalls 224, and the outer surface 110b of the second rigid substrate 114 faces the outer surface 224a of the sidewalls 224. The display device 1000D also has similar functions and advantages as the display device 1000, and will not be repeated here.
圖6A為本發明一實施例之顯示裝置的剖面示意圖。圖6B為圖6A之電路區未彎折向背框之前第一硬質基板、可撓基板、阻擋層、多個子畫素單元、多條走線與多個接墊的上視示意圖。請參照圖6A及圖6B，顯示裝置1000E與顯示裝置1000類似，因此相同或相對應的元件以相同或相對應的標號表示。顯示裝置1000E與顯示裝置1000的主要差異在於：顯示裝置1000E之可撓基板120E的分佈範圍與顯示裝置1000之可撓基板120的分佈範圍不同。以下主要就此相異處做說明，二者相同之處請依圖6A及圖6B中的標號參照前述說明，於此便不再重述。6A is a cross-sectional view of a display device in accordance with an embodiment of the present invention. 6B is a top view of the first rigid substrate, the flexible substrate, the barrier layer, the plurality of sub-pixel units, the plurality of traces, and the plurality of pads before the circuit region of FIG. 6A is bent to the back frame. Referring to FIGS. 6A and 6B, the display device 1000E is similar to the display device 1000, and thus the same or corresponding elements are denoted by the same or corresponding reference numerals. The main difference between the display device 1000E and the display device 1000 is that the distribution range of the flexible substrate 120E of the display device 1000E is different from the distribution range of the flexible substrate 120 of the display device 1000. The following mainly explains this difference. Please refer to Figure 6A for the similarities.The reference numerals in Fig. 6B are referred to the foregoing description and will not be repeated here.
請參照圖6A及圖6B，顯示裝置1000E的顯示裝置1000不同的是，顯示裝置1000E的可撓基板120E未全面性覆蓋第一硬質基板112，即可撓基板120E未遮蔽部分之第一硬質基板112的顯示區110c。詳言之，可撓基板120E暴露出部分之第一硬質基板112的顯示區110c，即暴露出位於顯示區110c上之第一硬質基板112的內表面110a。多個子畫素單元140的一部份配置於被可撓基板120E暴露出的部分顯示區110c上。阻擋層130E可選擇設置且覆蓋被可撓基板120E暴露出的部分顯示區110c(第一硬質基板112的內表面110a)以及可撓基板120E的內表面120a。子畫素單元140、走線162、164以及接墊152、154、156配置於阻擋層130E上。因此，多個子畫素單元140之一部份設置於硬質基板120之阻擋層130E上，即多個子畫素單元140之一部份的正下方不存在可撓基板120E。多個子畫素單元140之另一部份設置於可撓基板120E的一部份上，即多個子畫素單元140之另一部份設置於位於可撓基板120E上方之阻擋層130E上，即多個子畫素單元140之另一部份的正下方存在可撓基板120E與第一硬質基板112之重疊處。換言之，基於機械應力的考量，暴露出的部分顯示區110c的可撓基板120E以較伸入對向基板170與第一硬質基板112之間而與畫素電極PE重疊為佳。然而，本發明不限於此，在其他實施例中，當可撓基板暴露出的部分顯示區110c時，可撓基板亦可伸入至框膠190在第一硬質基板112上的正投影與最靠近框膠190之一列畫素電極PE在第一硬質基板112上的正投影之間，而不與畫素電極PE重疊。顯示裝置1000E亦具有與顯示裝置1000類似的功效及優點，於此便不再重述。Referring to FIG. 6A and FIG. 6B , the display device 1000 of the display device 1000E is different in that the flexible substrate 120E of the display device 1000E does not cover the first rigid substrate 112 in a comprehensive manner, that is, the first rigid substrate of the unmasked portion of the substrate 120E can be flexed. Display area 110c of 112. In detail, the flexible substrate 120E exposes a portion of the display region 110c of the first rigid substrate 112, that is, exposes the inner surface 110a of the first rigid substrate 112 on the display region 110c. A portion of the plurality of sub-pixel units 140 is disposed on a portion of the display area 110c exposed by the flexible substrate 120E. The barrier layer 130E is selectively disposed and covers a portion of the display region 110c (the inner surface 110a of the first hard substrate 112) exposed by the flexible substrate 120E and the inner surface 120a of the flexible substrate 120E. The sub-pixel unit 140, the traces 162, 164, and the pads 152, 154, 156 are disposed on the barrier layer 130E. Therefore, one of the plurality of sub-pixel units 140 is disposed on the barrier layer 130E of the rigid substrate 120, that is, the flexible substrate 120E is not directly under one of the plurality of sub-pixel units 140. Another portion of the plurality of sub-pixel units 140 is disposed on a portion of the flexible substrate 120E, that is, another portion of the plurality of sub-pixel units 140 is disposed on the barrier layer 130E above the flexible substrate 120E, that is, The overlap between the flexible substrate 120E and the first rigid substrate 112 exists directly under the other portion of the plurality of sub-pixel units 140. In other words, based on the mechanical stress considerations, it is preferable that the flexible substrate 120E of the exposed portion of the display region 110c protrudes between the opposite substrate 170 and the first rigid substrate 112 to overlap the pixel electrode PE. However, the present invention is not limited thereto. In other embodiments, when the portion of the display region 110c exposed by the flexible substrate is exposed, the flexible substrate may also protrude into the orthographic projection of the sealant 190 on the first rigid substrate 112. Close to the frame glue 190A column of pixel electrodes PE is between the orthographic projections on the first hard substrate 112 without overlapping the pixel electrodes PE. The display device 1000E also has similar functions and advantages as the display device 1000, and will not be repeated here.
圖7為本發明另一實施例之顯示裝置的剖面示意圖。圖7的顯示裝置1000F與圖1D的顯示裝置1000類似，因此相同或相對應的元件以相同或相對應的標號表示。以下主要就二者相異處做說明，二者相同之處請依圖7中的標號參照前述說明，於此便不再重述。請參照圖7，顯示裝置1000F與顯示裝置1000不同的是，顯示裝置1000F可不包括與顯示裝置1000之接墊152、154、156直接接合之驅動晶片200且可省略接墊156的設置。詳言之，顯示裝置1000F可包括可撓印刷電路板240。可撓印刷電路板240與設置在可撓基板120之電路區120c的接墊154接合。可撓印刷電路板240可選擇性地具有驅動晶片242。透過接墊154，可撓印刷電路板240的驅動晶片242可驅動顯示面板100。FIG. 7 is a cross-sectional view of a display device according to another embodiment of the present invention. The display device 1000F of FIG. 7 is similar to the display device 1000 of FIG. 1D, and thus the same or corresponding elements are denoted by the same or corresponding reference numerals. The following mainly explains the difference between the two. For the similarities, please refer to the above description according to the reference numerals in FIG. 7, and the description will not be repeated here. Referring to FIG. 7 , the display device 1000F differs from the display device 1000 in that the display device 1000F may not include the driving wafer 200 directly bonded to the pads 152 , 154 , 156 of the display device 1000 and the arrangement of the pads 156 may be omitted. In particular, display device 1000F can include flexible printed circuit board 240. The flexible printed circuit board 240 is bonded to pads 154 disposed in the circuit region 120c of the flexible substrate 120. The flexible printed circuit board 240 can optionally have a drive wafer 242. The drive wafer 242 of the flexible printed circuit board 240 can drive the display panel 100 through the pads 154.
簡言之，顯示裝置1000F是用具有驅動晶片242的可撓印刷電路板240取代圖1D之驅動晶片200以及可撓印刷電路板210的功能，而可省略圖1D之接墊156的設置。然而，本發明不限於此，在其他實施例中，可撓印刷電路板240亦可選擇性地不具有驅動晶片242，而將具有驅動晶片242功能之電路設置在外部驅動電路板上。顯示裝置1000F亦具有與顯示裝置1000類似的功效及優點，於此便不再重述。In short, the display device 1000F replaces the driving chip 200 of FIG. 1D and the flexible printed circuit board 210 with a flexible printed circuit board 240 having a driving wafer 242, and the arrangement of the pads 156 of FIG. 1D can be omitted. However, the present invention is not limited thereto. In other embodiments, the flexible printed circuit board 240 may also optionally have no drive wafer 242, and a circuit having the function of driving the wafer 242 may be disposed on the external drive circuit board. The display device 1000F also has similar functions and advantages as the display device 1000, and will not be repeated here.
此外，需說明的是，上述對應圖6A、圖6B之可撓基板120E非全面性覆蓋第一硬質基板112的概念亦可應用圖3D、圖4、圖5、圖7的實施例中，本領域具有通常知識者根據上述說明可據以實施，於此便不再逐一繪示，而該等顯示裝置亦在本發明保護的範疇內。類似地，上述對應圖7之可撓印刷電路板240與接墊154直接接合而不設置圖1D之與接墊152、154、156接合之驅動晶片200的概念，亦可應用圖3D、圖4、圖5、圖6A以及上述該等顯示裝置中，這些顯示裝置亦在本發明保護的範疇內。類似地，若上述圖1B~1D、圖3A~3D、圖4、圖5、圖6A與圖7之顯示介質層180係使用自發光材料，則可不需要背光模組230的存在。In addition, it should be noted that the above flexible substrate corresponding to FIG. 6A and FIG. 6BThe concept of 120E non-universal coverage of the first rigid substrate 112 can also be applied to the embodiments of FIG. 3D, FIG. 4, FIG. 5, and FIG. 7. Those having ordinary knowledge in the art can implement according to the above description, and thus no longer One by one, and such display devices are also within the scope of the present invention. Similarly, the flexible printed circuit board 240 corresponding to FIG. 7 is directly bonded to the pad 154 without the concept of the driving die 200 bonded to the pads 152, 154, 156 of FIG. 1D, and FIG. 3D and FIG. 4 can also be applied. In Figures 5, 6A and the above display devices, these display devices are also within the scope of the present invention. Similarly, if the display medium layer 180 of the above-described FIGS. 1B to 1D, FIGS. 3A to 3D, FIG. 4, FIG. 5, FIG. 6A and FIG. 7 uses a self-luminous material, the presence of the backlight module 230 may not be required.
綜上所述，在本發明一實施例的顯示裝置中，第一硬質基板上配置有可撓基板，且走線及接墊是搭載於延伸至第一硬質基板以及背框外之可撓基板的電路區上。藉此，走線及接墊可隨著可撓基板之電路區的彎折而配置於背框的外表面上。意即，顯示裝置之配置走線及接墊的外引腳接合區可彎折至背框的外表面上，從而顯示裝置能夠實現超窄邊框。As described above, in the display device according to the embodiment of the present invention, the flexible substrate is disposed on the first rigid substrate, and the wiring and the pad are mounted on the flexible substrate extending to the first rigid substrate and the back frame. On the circuit area. Thereby, the wiring and the pad can be disposed on the outer surface of the back frame along with the bending of the circuit area of the flexible substrate. That is, the configuration lead of the display device and the outer lead land of the pad can be bent to the outer surface of the back frame, so that the display device can realize an ultra-narrow bezel.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧顯示面板100‧‧‧ display panel
110a、120a、222a‧‧‧內表面110a, 120a, 222a‧‧‧ inner surface
110b、120b、222b、224a‧‧‧外表面110b, 120b, 222b, 224a‧‧‧ outer surface
110c‧‧‧顯示區110c‧‧‧ display area
110d‧‧‧周邊區110d‧‧‧ surrounding area
112‧‧‧第一硬質基板112‧‧‧First hard substrate
120‧‧‧可撓基板120‧‧‧Flexible substrate
120c‧‧‧電路區120c‧‧‧ circuit area
120d‧‧‧區域120d‧‧‧Area
130‧‧‧阻擋層130‧‧‧Block
142、144‧‧‧絕緣層142, 144‧‧‧ insulation
154、156‧‧‧接墊154, 156‧‧‧ pads
164‧‧‧走線164‧‧‧Wiring
170‧‧‧對向基板170‧‧‧ opposite substrate
180‧‧‧顯示介質層180‧‧‧Display media layer
190‧‧‧框膠190‧‧‧Box glue
200‧‧‧驅動晶片200‧‧‧ drive chip
210‧‧‧可撓印刷電路板210‧‧‧Flexible printed circuit boards
220‧‧‧背框220‧‧‧ Back frame
220a‧‧‧外表面220a‧‧‧ outer surface
222‧‧‧底部222‧‧‧ bottom
224‧‧‧側壁224‧‧‧ side wall
230‧‧‧背光模組230‧‧‧Backlight module
232‧‧‧導光板232‧‧‧Light guide plate
234‧‧‧光源234‧‧‧Light source
1000‧‧‧顯示裝置1000‧‧‧ display device
PE‧‧‧畫素電極PE‧‧‧ pixel electrode
SL‧‧‧掃描線SL‧‧‧ scan line
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103131536ATWI587768B (en) | 2014-09-12 | 2014-09-12 | Display apparatus |
| CN201410594332.7ACN104330906A (en) | 2014-09-12 | 2014-10-29 | Display device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103131536ATWI587768B (en) | 2014-09-12 | 2014-09-12 | Display apparatus |
| Publication Number | Publication Date |
|---|---|
| TW201611693A TW201611693A (en) | 2016-03-16 |
| TWI587768Btrue TWI587768B (en) | 2017-06-11 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103131536ATWI587768B (en) | 2014-09-12 | 2014-09-12 | Display apparatus |
| Country | Link |
|---|---|
| CN (1) | CN104330906A (en) |
| TW (1) | TWI587768B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI680331B (en)* | 2018-12-21 | 2019-12-21 | 友達光電股份有限公司 | Electronic device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102388104B1 (en) | 2015-08-13 | 2022-04-20 | 삼성디스플레이 주식회사 | Display device and method of manufacturing cover member |
| TWI598661B (en)* | 2016-12-26 | 2017-09-11 | 友達光電股份有限公司 | display device |
| CN107219696A (en)* | 2017-06-20 | 2017-09-29 | 武汉华星光电技术有限公司 | A kind of array base palte, liquid crystal panel and liquid crystal display |
| CN107357068A (en)* | 2017-07-21 | 2017-11-17 | 武汉华星光电技术有限公司 | A kind of narrow frame display panel and manufacture method |
| CN110501848A (en)* | 2018-05-18 | 2019-11-26 | 胜利仕科技股份有限公司 | Liquid crystal display device |
| CN108874215A (en)* | 2018-06-04 | 2018-11-23 | 业成科技（成都）有限公司 | Touch control sensor and the touch panel with touch control sensor |
| CN109523949A (en)* | 2018-11-15 | 2019-03-26 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| TWI695215B (en) | 2019-03-15 | 2020-06-01 | 友達光電股份有限公司 | Component substrate and splicing electronic device |
| US11211445B2 (en)* | 2019-07-16 | 2021-12-28 | Au Optronics Corporation | Foldable display panel |
| CN110286043A (en)* | 2019-07-30 | 2019-09-27 | 霸州市云谷电子科技有限公司 | A bending test device and bending test method |
| TWI729493B (en)* | 2019-09-12 | 2021-06-01 | 友達光電股份有限公司 | Pixel array substrate |
| CN111524461A (en)* | 2020-04-27 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Display module and preparation method thereof |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200604686A (en)* | 2004-04-19 | 2006-02-01 | Sharp Kk | Coupling structure of electronic components |
| TWI261715B (en)* | 1999-11-17 | 2006-09-11 | Sharp Kk | Flexible wiring board and electrical device using the same |
| TW201429720A (en)* | 2013-01-25 | 2014-08-01 | Ind Tech Res Inst | Flexible electronic device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008046284A (en)* | 2006-08-14 | 2008-02-28 | Toshiba Matsushita Display Technology Co Ltd | Liquid crystal display device |
| CN101636689A (en)* | 2007-03-20 | 2010-01-27 | 富士通株式会社 | Laminated display element and method for manufacturing same |
| CN102809841B (en)* | 2012-08-21 | 2015-05-20 | 深圳市华星光电技术有限公司 | Liquid display device |
| KR102020982B1 (en)* | 2013-02-28 | 2019-09-16 | 엘지디스플레이 주식회사 | Flexible display divice and method of manufacturing the same |
| CN104009044B (en)* | 2014-05-22 | 2018-11-23 | 京东方科技集团股份有限公司 | A kind of array substrate and preparation method thereof, display base plate, display device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI261715B (en)* | 1999-11-17 | 2006-09-11 | Sharp Kk | Flexible wiring board and electrical device using the same |
| TW200604686A (en)* | 2004-04-19 | 2006-02-01 | Sharp Kk | Coupling structure of electronic components |
| TW201429720A (en)* | 2013-01-25 | 2014-08-01 | Ind Tech Res Inst | Flexible electronic device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI680331B (en)* | 2018-12-21 | 2019-12-21 | 友達光電股份有限公司 | Electronic device |
| Publication number | Publication date |
|---|---|
| TW201611693A (en) | 2016-03-16 |
| CN104330906A (en) | 2015-02-04 |
| Publication | Publication Date | Title |
|---|---|---|
| TWI587768B (en) | Display apparatus | |
| US12092935B2 (en) | Display panel and method of manufacturing the same | |
| US10516009B2 (en) | Display module and display apparatus thereof | |
| USRE47701E1 (en) | Display panel and method of manufacturing the same | |
| WO2012147672A1 (en) | Display module and display device | |
| JP6768394B2 (en) | Electronics | |
| CN207037305U (en) | Electronic equipment | |
| KR101952132B1 (en) | Display panel and method of fabricating the same | |
| CN113851520A (en) | Display panel, method of making the same, and terminal device | |
| KR20140038823A (en) | Display panel and method of fabricating the same | |
| TWI446064B (en) | Display panel | |
| JP6033880B2 (en) | Display device | |
| CN104393022A (en) | Display device and method for manufacturing the same | |
| TWI540361B (en) | Method for cutting mother board of display panel | |
| JP6509993B2 (en) | Liquid crystal display and LED assembly | |
| KR102674786B1 (en) | Multi screen display apparatus and method of manufacturing the same | |
| CN108241227A (en) | Array substrate for liquid crystal display and liquid crystal display including same | |
| CN111798765A (en) | Preparation method of display panel and display device | |
| TWI439778B (en) | Pixel array substrate and display panel | |
| TW202036128A (en) | Device substrate and spliced electronic apparatus | |
| KR102093717B1 (en) | Display panel and method of fabricating the same | |
| TWI711857B (en) | Display device | |
| KR102026422B1 (en) | Display panel | |
| CN105989780A (en) | Display module | |
| KR20240017277A (en) | Method for manufacturing display apparatus and apparatus for manufacturing display apparatus |
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |