本發明是有關於一種量測裝置及方法，特別是指一種光學量測裝置及方法。The present invention relates to a measuring device and method, and more particularly to an optical measuring device and method.
參閱圖1，目前使用一雷射二極體11發射雷射光束至一待測物體15上，將使雷射光束造成反射或引起背面散射，則反射或散射的雷射光束與原先的雷射光束產生自混干涉信號(Self-Mixing Interference)由一光偵測器12偵測成為電流信號，再經由一電流轉換電壓單元13將電流信號轉換成電壓信號，再使用一示波器14觀察電壓信號。Referring to FIG. 1, a laser diode is currently used to emit a laser beam onto an object 15 to be measured, which causes the laser beam to reflect or cause backside scattering, and the reflected or scattered laser beam and the original laser beam. The self-mixing interference signal (Self-Mixing Interference) is detected by a photodetector 12 as a current signal, and then converted into a voltage signal via a current conversion voltage unit 13, and an oscilloscope 14 is used to observe the voltage signal.
然而，從該示波器14觀察自混干涉信號轉換成的電壓信號，只能得知該待測物體15振動的頻率及振幅，卻無從得知該待測物體15的表面形貌，更無法計算得知曲率，因此，目前從自混干涉信號得到的訊息非常的簡略且有限，這是目前此領域急需解決的問題。However, when the oscilloscope 14 observes the voltage signal converted from the self-mixing interference signal, only the frequency and amplitude of the vibration of the object 15 to be measured can be known, but the surface topography of the object 15 to be tested is unknown, and the calculation cannot be calculated. Knowing the curvature, therefore, the information obtained from the self-mixing interference signal is very simple and limited, which is an urgent problem to be solved in this field.
因此，本發明之第一目的，即在提供一種從一待測物體的自混干涉信號得知表面形貌，以解決先前技術問題的光學量測裝置。Accordingly, a first object of the present invention is to provide an optical measuring apparatus that solves the prior art problem by providing a surface topography from a self-mixing interference signal of an object to be measured.
於是，本發明光學量測裝置包含：一光學模組，發射一雷射光束至一待測物體的表面產生一相關於該表面的反射光，且該反射光與該雷射光束產生一自混干涉信號，並該光學模組偵測該自混干涉信號以得到一偵測信號；一微分單元，電連接該光學模組以接收該偵測信號，並將該偵測信號進行微分來產生一微分信號，該微分信號用以指示該待測物體的表面是上升或下降；一比較單元，電連接該微分單元以接收該微分信號，並根據該微分信號產生一大於零或小於零的準位信號；及一計算器，電連接該比較單元以接收該準位信號，並將每一準位信號進行累加計算，以得到一相關於該待測物體的表面形貌的資訊。Thus, the optical measuring device of the present invention comprises: an optical module that emits a laser beam to a surface of an object to be measured to generate a reflected light associated with the surface, and the reflected light and the laser beam are self-mixed Interfering with the signal, and the optical module detects the self-mixing interference signal to obtain a detection signal; a differential unit electrically connects the optical module to receive the detection signal, and differentiates the detection signal to generate a a differential signal, the differential signal is used to indicate that the surface of the object to be tested is rising or falling; a comparing unit is electrically connected to the differential unit to receive the differential signal, and generates a level greater than zero or less than zero according to the differential signal. And a calculator electrically connected to the comparison unit to receive the level signal, and cumulatively calculating each level signal to obtain information about a surface topography of the object to be tested.
本發明之第二目的，即在提供一種從該待測物體的自混干涉信號得知表面形貌的光學量測方法。A second object of the present invention is to provide an optical measuring method for obtaining a surface topography from a self-mixing interference signal of an object to be tested.
本發明光學量測方法包含：(A)利用一光學模組發射一雷射光束至一待測物體的表面產生一相關於該表面的反射光，且該反射光與該雷射光束產生一自混干涉信號，並該光學模組偵測該自混干涉信號以得到一偵測信號；(B)利用一微分單元接收該偵測信號，並將該偵測信號進行微分來產生一微分信號，該微分信號用以指示該待測物體的表面是上升或下降；(C)利用一比較單元接收該微分信號，並根據該微分信號產生一大於零或小於零的準位信號；(D)利用一計算器接收該準位信號，並將每一準位信號進行累加計算，以得到一相關於該待測物體的表面形貌的資訊。The optical measuring method of the present invention comprises: (A) using an optical module to emit a laser beam to a surface of an object to be measured to generate a reflected light associated with the surface, and the reflected light and the laser beam generate a self Mixing the interference signal, and the optical module detects the self-mixing interference signal to obtain a detection signal; (B) receiving the detection signal by using a differential unit, and differentiating the detection signal to generate a differential signal, The differential signal is used to indicate that the surface of the object to be tested is rising or falling;(C) receiving the differential signal by using a comparing unit, and generating a level signal greater than zero or less than zero according to the differential signal; (D) receiving the level signal by using a calculator, and performing each level signal Accumulating calculations to obtain information about the surface topography of the object to be tested.
2‧‧‧光學模組2‧‧‧Optical module
21‧‧‧雷射二極體21‧‧‧Laser diode
22‧‧‧光偵測器22‧‧‧Photodetector
23‧‧‧透鏡23‧‧‧ lens
24‧‧‧光學衰減片24‧‧‧Optical Attenuator
31‧‧‧平台31‧‧‧ platform
32‧‧‧馬達32‧‧‧Motor
33‧‧‧驅動電路33‧‧‧Drive circuit
34‧‧‧調整器34‧‧‧ adjuster
4‧‧‧微分單元4‧‧‧differentiation unit
41‧‧‧轉換器41‧‧‧ converter
42‧‧‧放大器42‧‧‧Amplifier
43‧‧‧微分器43‧‧‧Differentiator
5‧‧‧比較單元5‧‧‧Comparative unit
51‧‧‧比較器51‧‧‧ comparator
52‧‧‧乘法器52‧‧‧Multiplier
61‧‧‧計算器61‧‧‧Calculator
62‧‧‧顯示器62‧‧‧ display
7‧‧‧待測物體7‧‧‧ objects to be tested
A01‧‧‧承載步驟A01‧‧‧ Carrying steps
A02‧‧‧移動步驟A02‧‧‧ move steps
A03‧‧‧驅動步驟A03‧‧‧Drive steps
A04‧‧‧調整步驟A04‧‧‧Adjustment steps
A‧‧‧偵測步驟A‧‧‧Detection steps
B‧‧‧微分處理步驟B‧‧‧Differential processing steps
B1‧‧‧轉換步驟B1‧‧‧ conversion steps
B2‧‧‧放大步驟B2‧‧‧Enlargement step
B3‧‧‧微分步驟B3‧‧‧Differential steps
C‧‧‧比較處理步驟C‧‧‧Compare processing steps
C1‧‧‧比較步驟C1‧‧‧Compare steps
C2‧‧‧乘法步驟C2‧‧‧multiplication steps
D‧‧‧累加步驟D‧‧‧Additional steps
E‧‧‧計算步驟E‧‧‧ Calculation steps
F‧‧‧顯示步驟F‧‧‧Display steps
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一方塊圖，說明現有的光學量測裝置；圖2是一方塊圖，說明本發明光學量測裝置的一較佳實施例；圖3是一流程圖，說明該較佳實施例執行本發明光學量測方法的步驟；圖4是一量測圖，說明該較佳實施例的一放大電壓；圖5是一量測圖，說明該較佳實施例的一微分信號；及圖6是一量測圖，說明該較佳實施例的一表面形貌。Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a block diagram illustrating a conventional optical measuring device; FIG. 2 is a block diagram illustrating the optical of the present invention. A preferred embodiment of the measuring device; FIG. 3 is a flow chart illustrating the steps of the preferred embodiment for performing the optical measuring method of the present invention; and FIG. 4 is a measuring view illustrating an enlarged view of the preferred embodiment. FIG. 5 is a measurement diagram illustrating a differential signal of the preferred embodiment; and FIG. 6 is a measurement diagram illustrating a surface topography of the preferred embodiment.
參閱圖2，本發明光學量測裝置之較佳實施例，用以量測一待測物體7的自混干涉信號，進而處理得到該待測物體7的表面形貌、曲率，及振動頻率，且該光學量測裝置包含一光學模組2、一平台31、一馬達32、一驅動電路33、一調整器34、一微分單元4、一比較單元5、一計算器61，及一顯示器62。Referring to FIG. 2, a preferred embodiment of the optical measuring device of the present invention is configured to measure a self-mixing interference signal of an object 7 to be measured, and then process the surface topography, curvature, and vibration frequency of the object 7 to be tested. The optical measuring device comprises an optical module 2, a platform 31, a motor 32, a driving circuit 33, a regulator 34, a differentiating unit 4, a comparing unit 5, a calculator 61, and a display 62. .
該光學模組2包括一雷射二極體21、一光偵測器22、一透鏡23，及一光學衰減片24。The optical module 2 includes a laser diode 21, a photodetector 22, a lens 23, and an optical attenuator 24.
該驅動電路33電連接該雷射二極體21，該調整器34電連接該驅動電路33，且用以控制該雷射二極體21發射雷射光束的功率強度、聚焦點遠近。The driving circuit 33 is electrically connected to the laser diode 21, and the regulator 34 is electrically connected to the driving circuit 33, and is used for controlling the power intensity and the focus point of the laser beam emitted by the laser diode 21.
該微分單元4電連接該光偵測器22，且包括一轉換器41、一放大器42，及一微分器43。The differentiating unit 4 is electrically connected to the photodetector 22 and includes a converter 41, an amplifier 42, and a differentiator 43.
該比較單元5電連接該微分單元4，且包括一比較器51，及一乘法器52。The comparison unit 5 is electrically connected to the differentiation unit 4 and includes a comparator 51 and a multiplier 52.
該計算器61電連接該比較單元5，該顯示器62電連接該計算器61。The calculator 61 is electrically connected to the comparison unit 5, which is electrically connected to the calculator 61.
配合參閱圖3，該光學量測裝置執行一種光學量測方法，用以量測該待測物體7的表面形貌，再進而可得知該待測物體7的曲率，該光學量測方法包含以下步驟：Referring to FIG. 3, the optical measuring device performs an optical measuring method for measuring the surface topography of the object 7 to be tested, and then the curvature of the object 7 to be tested is further known. The optical measuring method includes The following steps:
步驟A01：利用該平台31來承載該待測物體7，即將需量測的該待測物體7放置在該平台31上。Step A01: The platform 31 is used to carry the object 7 to be tested, and the object 7 to be measured to be measured is placed on the platform 31.
步驟A02：利用該馬達32驅動該平台31移動，使該待測物體7在該平台31上被該馬達32驅動而移動，則該光學模組2在該待測物體7可產生整體表面的自混干涉信號。該自混干涉信號由該雷射二極體21發射一雷射光束至該待測物體7的表面，產生一相關於該表面的反射光，且與該雷射光束產生該自混干涉信號。Step A02: The motor 32 is used to drive the platform 31 to move, so that the object 7 to be tested is driven by the motor 32 on the platform 31, and the optical module 2 can generate an overall surface on the object 7 to be tested. Mixed interference signals. The self-mixing interference signal emits a laser beam from the laser diode 21 to the surface of the object 7 to be measured, generates a reflected light associated with the surface, and generates the self-mixing interference signal with the laser beam.
步驟A03：利用該驅動電路33提供一驅動信號，來驅動該雷射二極體21發射該雷射光束。Step A03: The driving circuit 33 is used to provide a driving signal for driving the laser diode 21 to emit the laser beam.
步驟A04：利用該調整器34根據該自混干涉信號來調整該驅動電路33的驅動信號，以調整該雷射二極體21發射適當功率強度的雷射光束，以防止和該自混干涉信號混雜一起的雜訊功率太強，而使入射至該光偵測器22時產生過大的雜訊。由於產生該自混干涉信號的反射光內混雜著雜訊，當該反射光的功率太強時，造成入射至該光偵測器22時產生過大雜訊。Step A04: adjusting the driving signal of the driving circuit 33 according to the self-mixing interference signal by using the adjuster 34 to adjust the laser beam of the laser diode to emit an appropriate power intensity to prevent the self-mixing interference signal. The mixed noise power is too strong, causing excessive noise when incident on the photodetector 22. Since the reflected light that generates the self-mixing interference signal is mixed with noise, when the power of the reflected light is too strong, excessive noise is generated when incident on the photodetector 22.
步驟A：利用該雷射二極體21發射該雷射光束至該待測物體7的表面產生該自混干涉信號，並該光偵測器22偵測該自混干涉信號以得到一偵測信號。步驟A的詳細作法為：該雷射二極體21發射該雷射光束經過該透鏡23聚焦、該光學衰減片24至該待測物體7的表面，產生該反射光，該反射光經該光學衰減片24行走原入射光路，與該雷射二極體21發射的雷射光束產生該自混干涉信號，入射至該光偵測器22偵測以得到該偵測信號，該偵測信號為電流形式，該光學衰減片24用以衰減該反射光的功率，防止和該反射光混雜一起的雜訊功率太強，而使入射至該光偵測器22時產生過大的雜訊。Step A: using the laser diode 21 to emit the laser beam to the surface of the object 7 to be tested to generate the self-mixing interference signal, and the photodetector 22 detects the self-mixing interference signal to obtain a detection. signal. The detailed operation of the step A is: the laser diode 21 emits the laser beam and the optical attenuator 24 is focused by the lens 23 to the surface of the object 7 to be tested, and the reflected light is generated. The attenuating sheet 24 travels the original incident light path, and the laser beam emitted by the laser diode 21 generates the self-mixing interference signal, and is incident on the photodetector 22 to detect the detected signal. The detection signal is In the form of current, the optical attenuator 24 is used to attenuate the power of the reflected light to prevent the noise power mixed with the reflected light from being too strong, so that excessive noise is generated when incident on the photodetector 22.
步驟B：利用該微分單元4接收該偵測信號，並將該偵測信號進行微分來產生一微分信號，該微分信號用以指示該待測物體7的表面是上升或下降，且步驟B更包括以下子步驟：Step B: receiving the detection signal by using the differential unit 4, and differentiating the detection signal to generate a differential signal, the differential signal is used to indicate that the surface of the object to be tested 7 is rising or falling, and step B is further Includes the following substeps:
子步驟B1：利用該轉換器41接收該偵測信號並進行電流至電壓轉換來產生一偵測電壓。Sub-step B1: The detection signal is received by the converter 41 and current-to-voltage conversion is performed to generate a detection voltage.
子步驟B2：利用該放大器42接收該偵測電壓並進行放大而成一放大電壓，以不易受雜訊的影響，因該平台31的移動，使量測到的該放大電壓隨著時間變化，如圖4所示。Sub-step B2: receiving the detected voltage by the amplifier 42 and amplifying it to form an amplified voltage, which is not susceptible to noise, and the measured amplified voltage changes with time due to the movement of the platform 31, such as Figure 4 shows.
子步驟B3：利用該微分器43接收該放大電壓並進行微分來產生該微分信號，用以指示該待測物體7的表面是上升或下降，當該待測物體7的表面為上升時，該放大電壓的正斜率值大於負斜率值，因此該微分信號的峰值為大於零，當該待測物體7的表面為下降時，該放大電壓的正斜率值小於負斜率值，因此該微分信號的峰值為小於零，在本例中，該等微分信號如圖5所示。Sub-step B3: receiving the amplified voltage by using the differentiator 43 and performing differentiation to generate the differential signal for indicating that the surface of the object 7 to be tested is rising or falling. When the surface of the object 7 to be tested is rising, the The positive slope value of the amplified voltage is greater than the negative slope value, so the peak value of the differential signal is greater than zero. When the surface of the object 7 to be measured is decreased, the positive slope value of the amplified voltage is less than the negative slope value, and thus the differential signal The peak value is less than zero. In this example, the differential signals are as shown in FIG.
步驟C：利用該比較單元5接收該微分信號，並根據該微分信號產生一大於零或小於零的準位信號，且步驟C更包括以下子步驟：Step C: The comparison unit 5 receives the differential signal, and generates a level signal greater than zero or less than zero according to the differential signal, and step C further includes the following sub-steps:
子步驟C1：利用該比較器51接收該微分信號，並將該微分信號的峰值與該比較器51內存的一大於零的第一比較值，及一小於零的第二比較值比較，當該微分信號的峰值大於該第一比較值，判斷該待測物體7的表面上升，則該比較器51輸出一大於零的單位值，當該微分信號的峰值小於該第二比較值，判斷該待測物體7的表面下降，該比較器51輸出一小於零的單位值。Sub-step C1: receiving the differential signal by the comparator 51, and comparing the peak value of the differential signal with a first comparison value greater than zero in the comparator 51, and a second comparison value less than zero, when The peak of the differential signal is greater than the first comparison value, and the surface of the object to be tested 7 is determined to rise, and the comparator 51 outputs a unit value greater than zero. When the peak value of the differential signal is smaller than the second comparison value, the waiting for the signal is determined. The surface of the measuring object 7 is lowered, and the comparator 51 outputs a unit value smaller than zero.
子步驟C2：利用該乘法器52接收該單位值並乘上該雷射二極體21發射該雷射光束的二分之一波長，以得到該準位信號，而得到實際上升或下降的高度。Sub-step C2: receiving the unit value by the multiplier 52 and multiplying the laser diode 21 to emit a half wavelength of the laser beam to obtain the level signal, thereby obtaining the actual rising or falling height. .
步驟D：利用該計算器61接收該準位信號，並將每一準位信號進行累加計算，以得到一相關於該待測物體7的表面形貌的資訊，如圖6所示。Step D: The calculator 61 is used to receive the level signal, and each level signal is cumulatively calculated to obtain a related information about the surface topography of the object 7 to be tested, as shown in FIG. 6.
步驟E；利用該計算器61根據該待測物體7的表面形貌進行曲率計算以得到該待測物體7的曲率，曲率公式如下：Rc=(△Z2+(d/2)2)/2△Z，其中，Rc定義為該待測物體7的曲率半徑，為曲率的倒數，△Z定義為該待測物體7的彎曲高度差，d定義為該待測物體7的直徑。Step E; using the calculator 61 to perform curvature calculation according to the surface topography of the object 7 to be measured to obtain the curvature of the object 7 to be tested, and the curvature formula is as follows: Rc=(ΔZ2 +(d/2)2 )/ 2 ΔZ, wherein Rc is defined as the radius of curvature of the object 7 to be measured, which is the reciprocal of the curvature, ΔZ is defined as the difference in the bending height of the object 7 to be tested, and d is defined as the diameter of the object 7 to be tested.
步驟F：利用該顯示器62接收並顯示從該計算器61得到的資訊，例如以圖形顯示該待測物體7的表面形貌及曲率。Step F: The display 62 is used to receive and display information obtained from the calculator 61, for example, graphically displaying the surface topography and curvature of the object 7 to be tested.
另要補充說明的是，若要量測該待測物體7的振動頻率時，在步驟A02中，不驅動該平台31移動，使該平台31固定，則在步驟D得到的是該待測物體7隨時間變化而振動改變的表面形貌，再利用該計算器61根據該待測物體7的表面形貌變化週期，計算該待測物體7的振動頻率。In addition, if the vibration frequency of the object 7 to be measured is to be measured, in step A02, the platform 31 is not driven to move, so that the platform 31 is fixed, then the object to be tested is obtained in step D. 7 The surface topography of the vibration changes with time, and the calculator 61 is used to calculate the vibration frequency of the object 7 to be measured according to the surface topography change period of the object 7 to be tested.
此外，該微分單元4、該比較單元5、該計算器61，及該顯示器62亦可以軟體方式來實現的電腦程式，輸入至一具備電腦處理能力的硬體裝置(如一處理器)，即可執行該微分單元4、該比較單元5、該計算器61，及該顯示器62需執行的動作。In addition, the computer unit of the differentiation unit 4, the comparison unit 5, the calculator 61, and the display 62 can also be implemented in a software manner, and input to a hardware device (such as a processor) having computer processing capability. The differentiation unit 4, the comparison unit 5, the calculator 61, and the actions to be performed by the display 62 are executed.
值得一提的是，該光學量測裝置可與一製造晶片的製程設備結合，則可輕易得知晶片在製作過程中的表面形貌，及在熱熔過程的彎曲程度。It is worth mentioning that the optical measuring device can be combined with a manufacturing crystalThe combination of the process equipment of the film makes it easy to know the surface topography of the wafer during the manufacturing process and the degree of bending during the hot melt process.
綜上所述，上述該較佳實施例利用該微分單元4、該比較單元5及該計算器61施行光學量測方法可從該待測物體7的自混干涉信號得知表面形貌、曲率，及振動頻率等資訊而更加方便，可有效的解決先前技術所遭遇的問題，故確實能達成本發明之目的。In summary, the preferred embodiment uses the differential unit 4, the comparison unit 5, and the calculator 61 to perform optical measurement methods to obtain surface topography and curvature from the self-mixing interference signal of the object 7 to be tested. And the information such as the vibration frequency is more convenient, and the problems encountered in the prior art can be effectively solved, so that the object of the present invention can be achieved.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.
2‧‧‧光學模組2‧‧‧Optical module
21‧‧‧雷射二極體21‧‧‧Laser diode
22‧‧‧光偵測器22‧‧‧Photodetector
23‧‧‧透鏡23‧‧‧ lens
24‧‧‧光學衰減片24‧‧‧Optical Attenuator
31‧‧‧平台31‧‧‧ platform
32‧‧‧馬達32‧‧‧Motor
33‧‧‧驅動電路33‧‧‧Drive circuit
34‧‧‧調整器34‧‧‧ adjuster
4‧‧‧微分單元4‧‧‧differentiation unit
41‧‧‧轉換器41‧‧‧ converter
42‧‧‧放大器42‧‧‧Amplifier
43‧‧‧微分器43‧‧‧Differentiator
5‧‧‧比較單元5‧‧‧Comparative unit
51‧‧‧比較器51‧‧‧ comparator
52‧‧‧乘法器52‧‧‧Multiplier
61‧‧‧計算器61‧‧‧Calculator
62‧‧‧顯示器62‧‧‧ display
7‧‧‧待測物體7‧‧‧ objects to be tested
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103107683ATWI479119B (en) | 2014-03-06 | 2014-03-06 | Optical measuring device and optical measuring method |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103107683ATWI479119B (en) | 2014-03-06 | 2014-03-06 | Optical measuring device and optical measuring method |
| Publication Number | Publication Date |
|---|---|
| TWI479119Btrue TWI479119B (en) | 2015-04-01 |
| TW201534861A TW201534861A (en) | 2015-09-16 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103107683ATWI479119B (en) | 2014-03-06 | 2014-03-06 | Optical measuring device and optical measuring method |
| Country | Link |
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| TW (1) | TWI479119B (en) |
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