本發明涉及一種散熱裝置，尤係可用於電子元件散熱之散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of electronic components.
隨著近年來電腦技術之不斷發展，部分視頻圖像卡(VGA卡)等附加卡逐步採用二單獨處理器來提高其運算速度及操作能力。該二處理器通常由一主處理器及一輔助處理器組成。通常採用二相同之散熱模組分別對該二處理器進行散熱。主處理器之功率較輔助處理器之功率大，其工作時產生之熱量較輔助處理器產生之熱量多，因此，與主處理器接觸之散熱模組之溫度較高，而與輔助處理器接觸之散熱模組溫度較低。如此，造成一散熱模組之散熱負荷過大，導致主處理器散發之熱量得不到及時散發，而另一散熱器之散熱效率不高。With the continuous development of computer technology in recent years, some additional cards such as video image cards (VGA cards) gradually adopt two separate processors to improve their computing speed and operation capability. The two processors are usually composed of a main processor and an auxiliary processor. The two processors are usually separately cooled by using the same heat dissipation module. The power of the main processor is larger than that of the auxiliary processor, and the heat generated during operation is more than the heat generated by the auxiliary processor. Therefore, the temperature of the heat dissipation module in contact with the main processor is higher, and the auxiliary processor is in contact with the auxiliary processor. The cooling module has a lower temperature. As a result, the heat dissipation load of a heat dissipation module is too large, so that the heat dissipated by the main processor is not dissipated in time, and the heat dissipation efficiency of the other heat sink is not high.
有鑒於此，實有必要提供一種散熱效率較高之散熱裝置。In view of this, it is necessary to provide a heat dissipating device with high heat dissipation efficiency.
一種散熱裝置，用於對電路板上之一第一發熱元件及一第二發熱元件散熱，其包括一與第一、第二發熱元件貼設之一均溫板，該均溫板包括一密封之殼體、位於殼體內之毛細結構及工作液體，一連接板貼置於均溫板之下表面，複數固定件穿過電路板並與該連接板配合，從而將均溫板固定於電路板上。A heat dissipating device is configured to dissipate heat from a first heat generating component and a second heat generating component on the circuit board, and includes a temperature equalizing plate attached to the first and second heat generating components, wherein the temperature equalizing plate includes a seal a casing, a capillary structure located in the casing and a working liquid, a connecting plate is placed on the lower surface of the temperature equalizing plate, and a plurality of fixing members pass through the circuit board and cooperate with the connecting plate to fix the temperature equalizing plate to the circuit board on.
與習知技術相比，本發明之均溫板通過一連接板固定至電路板上，從而避免了在均溫板上開設螺孔而破壞其內部之毛細結構、或導致均溫板內部之工作液體洩漏、或導致外界空氣進入均溫板內等危害，從而使均溫板之使用更加安全可靠。Compared with the prior art, the temperature equalizing plate of the present invention is fixed to the circuit board through a connecting plate, thereby avoiding the opening of the screw hole on the temperature equalizing plate to break the capillary structure inside or causing the work inside the temperature equalizing plate. The liquid leaks or causes the outside air to enter the uniform temperature plate and so on, so that the use of the temperature equalizing plate is safer and more reliable.
10‧‧‧背板10‧‧‧ Backboard
11‧‧‧散熱板11‧‧‧heating plate
13‧‧‧支撐架13‧‧‧Support frame
20‧‧‧電路板20‧‧‧ boards
21‧‧‧第一發熱電子元件21‧‧‧First heat-generating electronic components
23‧‧‧第二發熱電子元件23‧‧‧Second heating electronic components
25‧‧‧其他電子元件25‧‧‧Other electronic components
30‧‧‧支架30‧‧‧ bracket
31‧‧‧本體31‧‧‧Ontology
33‧‧‧延伸部33‧‧‧Extension
40‧‧‧風扇40‧‧‧Fan
50‧‧‧均溫板50‧‧‧Wall plate
51‧‧‧頂蓋51‧‧‧Top cover
53‧‧‧底蓋53‧‧‧ bottom cover
54‧‧‧臺階部54‧‧‧Steps
60‧‧‧連接板60‧‧‧Connecting plate
61‧‧‧連接片61‧‧‧Connecting piece
63‧‧‧過渡片63‧‧‧ transition piece
70‧‧‧散熱片組70‧‧‧ Heat sink set
71‧‧‧散熱片71‧‧‧ Heat sink
80‧‧‧風扇罩80‧‧‧fan cover
81‧‧‧第一罩設部81‧‧‧First Covering Department
83‧‧‧第二罩設部83‧‧‧Second Covering Department
91、92‧‧‧螺釘91, 92‧‧‧ screws
112、314‧‧‧通孔112, 314‧‧‧through holes
312‧‧‧散熱柱312‧‧‧ Heatsink
316‧‧‧承載部316‧‧‧Loading Department
533、831‧‧‧開口533, 831‧‧ ‧ openings
513‧‧‧缺口513‧‧‧ gap
612‧‧‧螺孔612‧‧‧ screw holes
813、833‧‧‧頂板813, 833‧‧‧ top board
815、835‧‧‧側板815, 835‧‧‧ side panels
3162‧‧‧承載片3162‧‧‧ Carrying film
3164‧‧‧連接片3164‧‧‧Connecting piece
3165‧‧‧安裝孔3165‧‧‧Mounting holes
圖1係本發明散熱裝置之立體分解圖。1 is an exploded perspective view of a heat sink of the present invention.
圖2係圖1之倒置圖。Figure 2 is an inverted view of Figure 1.
圖3係圖1中散熱裝置之部分分解圖。Figure 3 is a partially exploded view of the heat sink of Figure 1.
圖4係圖1中散熱裝置之組裝圖。4 is an assembled view of the heat sink of FIG. 1.
請參閱圖1，其示出了本發明一個較佳實施例中之散熱裝置，該散熱裝置主要用於對電路板20上之一第一發熱電子元件21、一第二發熱電子元件23及分別設置於第一、第二發熱電子元件21、23周圍之其他電子元件25散熱。在本實施例中，該電路板20為視頻圖像卡(VGA)，該第一、第二發熱電子元件21、23為GPU，且第一發熱電子元件21之功率比第二發熱電子元件23之功率高。Please refer to FIG. 1 , which illustrates a heat dissipating device in a preferred embodiment of the present invention. The heat dissipating device is mainly used for one of the first heat-generating electronic component 21 , the second heat-generating electronic component 23 , and the respectively on the circuit board 20 . The other electronic components 25 disposed around the first and second heat-generating electronic components 21, 23 dissipate heat. In this embodiment, the circuit board 20 is a video image card (VGA), the first and second heat-generating electronic components 21, 23 are GPUs, and the power of the first heat-generating electronic component 21 is higher than that of the second heat-generating electronic component 23 The power is high.
該散熱裝置包括位於電路板20下方之一背板10、位於電路板20上方之一支架30、固定於支架30上且分別與第一、第二發熱電子元件21、23貼設之一均溫板50、貼設于均溫板50上表面之一散熱片組70、裝設於支架30上且位於均溫板50一側之一風扇40及將風扇40、散熱片組70及均溫板50罩設其內之一風扇罩80。The heat dissipating device includes a backing plate 10 located below the circuit board 20, a bracket 30 above the circuit board 20, and is fixed on the bracket 30 and is respectively cooled with one of the first and second heat-generating electronic components 21 and 23 The plate 50, the heat sink group 70 attached to the upper surface of the temperature equalizing plate 50, the fan 40 mounted on the bracket 30 and located on the side of the temperature equalizing plate 50, and the fan 40, the heat sink group 70 and the temperature equalizing plate 50 is provided with a fan cover 80 therein.
請同時參閱圖2，該背板10包括一縱長之散熱板11及二支撐架13。該散熱板11為由導熱性能良好之金屬材料如鋁材製成之板體，其熱連接於電路板20之下表面，用於吸收電路板20下表面之熱量。每一支撐架13呈“十”字形，用於支撐電路板20。散熱板11上開設有二通孔112，用於分別收容二支撐架13，每一通孔112為正方形以恰好收容其對應之一支撐架13。可以理解地，支撐架13及通孔112之形狀不限於此。Referring to FIG. 2 at the same time, the back plate 10 includes a longitudinal heat dissipation plate 11 and two support frames 13 . The heat dissipation plate 11 is a plate body made of a metal material having good thermal conductivity, such as aluminum.It is thermally coupled to the lower surface of the circuit board 20 for absorbing heat from the lower surface of the circuit board 20. Each of the support frames 13 has a "ten" shape for supporting the circuit board 20. The heat dissipation plate 11 defines two through holes 112 for receiving the two support frames 13 respectively. Each of the through holes 112 is square to just receive one of the corresponding support frames 13 . It can be understood that the shape of the support frame 13 and the through hole 112 is not limited thereto.
該支架30由導熱性能佳之材料製成，較佳地，其可採用鋁材製成，其包括一大致呈方形之本體31及自本體31一端向外延伸之一弧形之延伸部33。該本體31之中部開設一方形通孔314，用於與均溫板50配合。支架30上遠離電路板20插腳所在側之第一側之頂面凸伸有複數散熱柱312，且該等散熱柱312沿本體31之長度方向間隔排列，以充分利用支架30之表面來輔助散發支架30吸收之熱量。該支架30之相對二第二側兩端向內凸伸有二U形之承載部316，用於承載均溫板50，且該二第二側與第一側相鄰。每一承載部316由二間隔設置之承載片3162及連接二承載片3162之一連接片3164組成。該二承載片3162均為方形之片體，且分別位於本體31之第一側之二相鄰拐角處。二承載部316之開口相對設置。每一承載片3162上開設有一安裝孔3165。均溫板50承載於承載部316且容置於本體31之通孔314，用於與電路板20上之第一、第二發熱電子元件21、23配合。該風扇40裝設於延伸部33之中部，用以冷卻均溫板50及散熱片組70。本體31之底緣用以貼設電路板20上之其他電子元件25。The bracket 30 is made of a material having good thermal conductivity. Preferably, it can be made of aluminum, and includes a substantially square body 31 and an arcuate extension 33 extending outward from one end of the body 31. A square through hole 314 is defined in the middle of the body 31 for mating with the temperature equalizing plate 50. A plurality of heat dissipating columns 312 protrude from a top surface of the first side of the side of the bracket 30 away from the side of the circuit board 20, and the heat dissipating columns 312 are spaced along the length of the body 31 to fully utilize the surface of the bracket 30 to assist in emitting The heat absorbed by the bracket 30. Two opposite U-shaped bearing portions 316 are protruded inwardly from opposite ends of the second and second sides of the bracket 30 for carrying the temperature equalizing plate 50, and the second sides are adjacent to the first side. Each of the carrying portions 316 is composed of two spaced-apart carrier sheets 3162 and one connecting piece 3162 connecting the connecting pieces 3164. The two carrier sheets 3162 are square pieces and are respectively located at two adjacent corners of the first side of the body 31. The openings of the two carrying portions 316 are oppositely disposed. A mounting hole 3165 is defined in each of the carrier sheets 3162. The temperature equalizing plate 50 is carried on the carrying portion 316 and received in the through hole 314 of the body 31 for mating with the first and second heat-generating electronic components 21, 23 on the circuit board 20. The fan 40 is installed in the middle of the extending portion 33 for cooling the temperature equalizing plate 50 and the heat sink group 70. The bottom edge of the body 31 is used to attach other electronic components 25 on the circuit board 20.
該均溫板50包括一大致呈矩形之頂蓋51及與頂蓋51配合之一大致呈碗狀之底蓋53。該頂蓋51及底蓋53共同圍成一密封之腔室，以收容毛細結構(未圖示)及工作液體(未圖示)於其內，優選地，該腔室被抽成真空。該頂蓋51一側中部開設有一U形缺口513，以與支架30配合。該底蓋53中部向下凸伸，並在頂面形成一容置空間(未圖示)，该容置空間在頂蓋51覆蓋於底蓋53上時形成上述密封之腔室，該底蓋53向下凸伸之中部即形成均溫板50與第一、第二發熱電子元件21、23貼設之吸熱部。另外，底蓋53對應頂蓋51開口513處開設有一對應之U形開口533，以與支架30配合。該底蓋53下表面之兩端分別形成二開口相對之U形臺階部54，該二U形臺階部54與二承載部316之結構相適應。The temperature equalizing plate 50 includes a substantially rectangular top cover 51 and a bottom cover 53 which is substantially bowl-shaped in cooperation with the top cover 51. The top cover 51 and the bottom cover 53 together define a sealed chamber for receiving a capillary structure (not shown) and a working fluid (not shown) therein, preferablyThe chamber is evacuated. A U-shaped notch 513 is defined in a central portion of the top cover 51 to engage the bracket 30. The bottom cover 53 protrudes downwardly from the center of the bottom cover 53 and forms an accommodating space (not shown) on the top surface. The accommodating space forms the sealed chamber when the top cover 51 covers the bottom cover 53. The bottom cover The lower portion of the lower portion of the protrusion 53 forms a heat absorbing portion in which the temperature equalizing plate 50 and the first and second heat generating electronic components 21 and 23 are attached. In addition, the bottom cover 53 defines a corresponding U-shaped opening 533 corresponding to the opening 513 of the top cover 51 to cooperate with the bracket 30. The two ends of the lower surface of the bottom cover 53 are respectively formed with two U-shaped step portions 54 opposite to each other, and the two U-shaped step portions 54 are adapted to the structure of the two bearing portions 316.
二U形連接板60焊接于均溫板50之底蓋53之二臺階部54上，其可以採用片狀金屬材料一體沖壓而成。每一連接板60包括二平行且間隔設置之方形連接片61及位於二連接片61之間且垂直連接二連接片61之一過渡片63。二連接片61上分別開設有一螺孔612，用於與螺釘92配合，從而降低了在均溫板50上開設螺孔所帶來危害之機率，例如，破壞均溫板50內部之毛細結構、或導致均溫板50內部之工作液體洩漏、或導致外界空氣進入均溫板50內等，從而使均溫板50之使用更加安全可靠。二連接片61之間之間距等於或稍大於底蓋53最外端之寬度。每一連接板60收容于均溫板50之二臺階部54處。The two U-shaped connecting plates 60 are welded to the two step portions 54 of the bottom cover 53 of the temperature equalizing plate 50, which can be integrally stamped from a sheet metal material. Each connecting plate 60 includes two parallel and spaced square connecting pieces 61 and a transition piece 63 between the two connecting pieces 61 and vertically connecting the two connecting pieces 61. A screw hole 612 is defined in each of the two connecting pieces 61 for engaging with the screw 92, thereby reducing the probability of causing damage to the screw hole on the temperature equalizing plate 50, for example, breaking the capillary structure inside the temperature equalizing plate 50, Or the working fluid inside the temperature equalizing plate 50 is leaked, or the outside air is allowed to enter the temperature equalizing plate 50, etc., so that the use of the temperature equalizing plate 50 is more safe and reliable. The distance between the two connecting pieces 61 is equal to or slightly larger than the width of the outermost end of the bottom cover 53. Each connecting plate 60 is received at two step portions 54 of the temperature equalizing plate 50.
該散熱片組70由複數縱長之散熱片71組成。該等散熱片71之相對兩側相互卡合、其他部分間隔且平行設置。每一散熱片71之頂端一角被傾斜向下地切掉一三角形之部分，從而使散熱片組70之頂端一側形成一向下傾斜之斜面73。該斜面73用於將風扇40產生之氣流導入散熱片組70。散熱片組70裝設于均溫板50之頂蓋51之上表面，用於散熱均溫板50吸收之熱量。The fin group 70 is composed of a plurality of longitudinal fins 71. The opposite sides of the fins 71 are engaged with each other, and the other portions are spaced apart and disposed in parallel. A corner of the top end of each of the fins 71 is cut obliquely downward to cut a portion of the triangle so that the tip end side of the fin group 70 forms a downwardly inclined slope 73. The slope 73 is used to introduce the airflow generated by the fan 40 into the heat sink group 70. The heat sink group 70 is mounted on the upper surface of the top cover 51 of the temperature equalizing plate 50 for dissipating the heat absorbed by the temperature equalizing plate 50.
該風扇罩80包括將散熱片組70及均溫板50罩設其內之一第一罩設部81及將風扇40罩設其內之一第二罩設部83。第一罩設部81包括一大致呈方形之頂板813及自頂板813相對兩側邊緣垂直向下延伸之二側板815。該第一罩設部81之二側板815固定於支架30之本體31之上方。支架30之本體31上之散熱柱312位於側板815之外側。該第二罩設部83為與第一罩設部81連通之圓柱形結構，包括一中部開有圓形開口831之頂板833及自頂板833周緣向下延伸之側板835。該側板835固定於支架30之延伸部33之上方，且其開口831與風扇40對應。The fan cover 80 includes a first cover portion 81 in which the heat sink group 70 and the temperature equalization plate 50 are covered, and a second cover portion 83 in which the fan 40 is covered. The first cover portion 81 includes a substantially square top plate 813 and two side plates 815 extending vertically downward from opposite side edges of the top plate 813. The two side plates 815 of the first cover portion 81 are fixed above the body 31 of the bracket 30. The heat dissipation post 312 on the body 31 of the bracket 30 is located on the outer side of the side plate 815. The second cover portion 83 is a cylindrical structure that communicates with the first cover portion 81, and includes a top plate 833 with a circular opening 831 in the middle and a side plate 835 extending downward from the periphery of the top plate 833. The side plate 835 is fixed above the extension portion 33 of the bracket 30, and the opening 831 thereof corresponds to the fan 40.
請同時參閱圖3及圖4，上述散熱裝置組裝時，先將二連接板60焊接至均溫板50之底蓋53下表面之臺階部54處並使其與支架30之二承載部316對應，同時將散熱片組70焊接在均溫板50之頂蓋51之上表面，併使散熱片組70具有斜面73之一端靠近支架30之延伸部33。然後使均溫板50上之連接板60承載於承載部316且使均溫板50向下凸伸之吸熱部容置於本體31之通孔314。風扇40裝設於支架30延伸部33上表面之中部。將風扇罩80裝設於支架30上。將背板10之散熱板11貼設在電路板20之下表面。複數螺釘91穿過散熱板11之邊緣、電路板20並與風扇罩80配合，從而將散熱板11及風扇罩80固定在電路板20相對兩側。八螺釘92穿過背板10之支撐架13之各角及電路板20，其中四螺釘92與電路板20螺合，另外四螺釘92穿過支架30之承載部316之安裝孔3165並與連接板60之螺孔612螺合，從而將均溫板50固定在電路板20上。Referring to FIG. 3 and FIG. 4 simultaneously, when the heat dissipating device is assembled, the two connecting plates 60 are first welded to the step portion 54 of the lower surface of the bottom cover 53 of the temperature equalizing plate 50 and corresponding to the two bearing portions 316 of the bracket 30. At the same time, the heat sink group 70 is welded to the upper surface of the top cover 51 of the temperature equalizing plate 50, and the heat sink group 70 has one end of the inclined surface 73 close to the extending portion 33 of the bracket 30. Then, the connecting plate 60 on the temperature equalizing plate 50 is carried on the carrying portion 316 and the heat absorbing portion that protrudes downward from the temperature equalizing plate 50 is received in the through hole 314 of the body 31. The fan 40 is mounted on the upper surface of the upper surface of the extension portion 33 of the bracket 30. The fan cover 80 is mounted on the bracket 30. The heat dissipation plate 11 of the back plate 10 is attached to the lower surface of the circuit board 20. The plurality of screws 91 pass through the edge of the heat sink 11 and the circuit board 20 and cooperate with the fan cover 80 to fix the heat sink 11 and the fan cover 80 on opposite sides of the circuit board 20. The eight screws 92 pass through the corners of the support frame 13 of the backboard 10 and the circuit board 20, wherein the four screws 92 are screwed into the circuit board 20, and the other four screws 92 pass through the mounting holes 3165 of the carrier portion 316 of the bracket 30 and are connected thereto. The screw holes 612 of the plate 60 are screwed to fix the temperature equalizing plate 50 to the circuit board 20.
使用時，第一、第二發熱電子元件21、23之熱量被均溫板50吸收後傳導至散熱片組70。由於第一、第二發熱電子元件21、23之功率不同，兩者散發之熱量也不同，均溫板50不同位置吸收熱量後，其內之工作液體將該等熱量傳導至均溫板50之各處，從而使均溫板50均勻地將第一、第二發熱電子元件21、23之熱量傳導至其上之散熱片組70上。風扇40啟動，使外界之冷空氣自風扇罩80之開口831進入第二罩設部83，然後流向第一罩設部81內之散熱片組70，最後自第一罩設部81之一端流出，從而冷卻散熱片組70及均溫板50。In use, the heat of the first and second heat-generating electronic components 21, 23 is absorbed by the temperature equalizing plate 50 and then conducted to the heat sink group 70. Due to the work of the first and second heat-generating electronic components 21, 23The rate is different, and the heat dissipated by the two is different. After the heat sink 50 absorbs heat at different positions, the working liquid therein conducts the heat to the temperature plate 50, so that the temperature equalizing plate 50 uniformly 1. The heat of the second heat-generating electronic components 21, 23 is conducted to the heat sink group 70 thereon. The fan 40 is activated to allow cold air from the outside to enter the second cover portion 83 from the opening 831 of the fan cover 80, and then flow to the heat sink group 70 in the first cover portion 81, and finally flow out from one end of the first cover portion 81. Thereby, the heat sink group 70 and the temperature equalizing plate 50 are cooled.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧背板10‧‧‧ Backboard
11‧‧‧散熱板11‧‧‧heating plate
13‧‧‧支撐架13‧‧‧Support frame
20‧‧‧電路板20‧‧‧ boards
30‧‧‧支架30‧‧‧ bracket
31‧‧‧本體31‧‧‧Ontology
33‧‧‧延伸部33‧‧‧Extension
40‧‧‧風扇40‧‧‧Fan
50‧‧‧均溫板50‧‧‧Wall plate
51‧‧‧頂蓋51‧‧‧Top cover
53‧‧‧底蓋53‧‧‧ bottom cover
54‧‧‧臺階部54‧‧‧Steps
60‧‧‧連接板60‧‧‧Connecting plate
61‧‧‧連接片61‧‧‧Connecting piece
63‧‧‧過渡片63‧‧‧ transition piece
70‧‧‧散熱片組70‧‧‧ Heat sink set
71‧‧‧散熱片71‧‧‧ Heat sink
80‧‧‧風扇罩80‧‧‧fan cover
81‧‧‧第一罩設部81‧‧‧First Covering Department
83‧‧‧第二罩設部83‧‧‧Second Covering Department
91、92‧‧‧螺釘91, 92‧‧‧ screws
312‧‧‧散熱柱312‧‧‧ Heatsink
314‧‧‧通孔314‧‧‧through hole
316‧‧‧承載部316‧‧‧Loading Department
533、831‧‧‧開口533, 831‧‧ ‧ openings
612‧‧‧螺孔612‧‧‧ screw holes
813、833‧‧‧頂板813, 833‧‧‧ top board
815、835‧‧‧側板815, 835‧‧‧ side panels
3162‧‧‧承載片3162‧‧‧ Carrying film
3164‧‧‧連接片3164‧‧‧Connecting piece
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98113778ATWI421022B (en) | 2009-04-24 | 2009-04-24 | Heat dissipation device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98113778ATWI421022B (en) | 2009-04-24 | 2009-04-24 | Heat dissipation device |
| Publication Number | Publication Date |
|---|---|
| TW201039738A TW201039738A (en) | 2010-11-01 |
| TWI421022Btrue TWI421022B (en) | 2013-12-21 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98113778ATWI421022B (en) | 2009-04-24 | 2009-04-24 | Heat dissipation device |
| Country | Link |
|---|---|
| TW (1) | TWI421022B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6082443A (en)* | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
| TW200910069A (en)* | 2007-08-24 | 2009-03-01 | Foxconn Tech Co Ltd | Heat dissipation device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6082443A (en)* | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
| TW200910069A (en)* | 2007-08-24 | 2009-03-01 | Foxconn Tech Co Ltd | Heat dissipation device |
| Publication number | Publication date |
|---|---|
| TW201039738A (en) | 2010-11-01 |
| Publication | Publication Date | Title |
|---|---|---|
| US7755902B2 (en) | Heat dissipation device for computer add-on cards | |
| US7212404B2 (en) | Integrated heat sink device | |
| TWI510895B (en) | Heat dissipation device and electronic device having the same | |
| CN102065667B (en) | Electronic device and heat radiating device thereof | |
| US7810950B2 (en) | LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp | |
| US20090059525A1 (en) | Heat dissipation device for computer add-on cards | |
| CN101873786A (en) | Heat sink | |
| JP2011091384A (en) | Heat dissipation device with heat pipeheat pipe heat radiator | |
| US20080101035A1 (en) | Heat-dissipating assembly structure | |
| JP2005084270A (en) | Thin display device | |
| JP2009231511A (en) | Casing | |
| EP2626899A2 (en) | Heat dissipating module | |
| TWI488574B (en) | Heat-dissipation structure and portable folding electronic apparatus therewith | |
| TW201328552A (en) | Electronic device and heat dissipation device thereof | |
| CN101466240A (en) | Radiating device | |
| JP2008041638A (en) | Heat dissipation device for backlight light source for flat panel display | |
| JP2007258520A (en) | Electronic equipment cooling device | |
| JP3153018U (en) | Heat dissipation device for communication device housing | |
| JPH09233406A (en) | Display heat dissipation device | |
| TWI421022B (en) | Heat dissipation device | |
| TWI397369B (en) | Heat dissipation device | |
| TWI401563B (en) | Heat dissipation device | |
| CN102819300A (en) | Heat sink and electronic device structure | |
| TWI458928B (en) | Heat dissipation module | |
| CN100470777C (en) | heat sink |
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |