本發明是有關於一種晶片卡組件及其製造方法，特別是有關於一種具有加密功能與無線連結功能的晶片卡組件及其製造方法。The present invention relates to a wafer card assembly and a method of fabricating the same, and more particularly to a wafer card assembly having an encryption function and a wireless connection function and a method of fabricating the same.
晶片卡、智慧卡(Smart Card)經過的發展與運用，已經到了相當成熟普及的境地，特別是近年來詐騙集團猖獗，使得政府、企業加速將傳統磁條卡替換成晶片卡，如今無論是電話卡、健保卡都已是晶片卡，包括便利超商的消費儲值卡也是晶片卡，手機內的SIM(Subscriber Identity Module)卡、報稅與監理所服務的自然人憑證卡、視訊機上盒的收視訂閱戶辨識卡等也都是。猶有甚者，交通運輸搭乘與停車付費之用的悠遊卡(Easy Card)，都是用非接觸的感應式晶片卡。The development and application of the chip card and smart card have reached a fairly mature and popular situation, especially in recent years, the fraud group has made the government and enterprises accelerate the replacement of the traditional magnetic stripe card into a wafer card. Nowadays, it is a calling card. The health insurance card is already a chip card, including the convenience stored value card of the supermarket, the chip card, the SIM (Subscriber Identity Module) card in the mobile phone, the natural person voucher card provided by the tax filing and supervision office, and the viewing subscription of the video box. Household identification cards are also available. What's more, the Easy Card, which is used for transportation and parking, uses a non-contact inductive chip card.
故，今日晶片卡的發展重點，已從基礎的電子電機技術，轉移到更高層次的流程整合、業務統合，如何讓一張晶片卡的價值效益最大化？如何讓一張晶片卡達到最廣泛的通行適用？如何減少每個人身上的晶片卡數目？不過這樣的課題已不是電子工程層面，而是資訊技術層面，甚至是商務層面，包括資料庫的連通、異業結盟的格式轉換、交易查核的互通、活動方案、營運模式、拆帳等等。科技的進步，讓上述目的一一實現。Therefore, the focus of today's wafer card development has shifted from basic electronic motor technology to a higher level of process integration and business integration. How to maximize the value of a wafer card? How to make a wafer card reach the widest range of applications? How to reduce the number of wafer cards on each person? However, such a topic is not at the electronic engineering level, but at the information technology level, even at the business level, including the connectivity of the database, the format conversion of the cross-industry alliance, the interoperability of transaction check, the activity plan, the operation mode, the debit account and so on. The advancement of science and technology has made the above objectives one by one.
晶片卡的另一個同期發展的產品，多媒體記憶卡，亦廣泛的利用於各種常見的電子產品中，諸如數位相機、行動電話與手持式導航系統等。它的特點在於隨著製程技術的演進，其外觀可以小到同指甲的尺寸，而可儲存的資料量以倍增速度成長(現下主流容量已達16GB)。然而，在生產者眾及惡性競爭的情形下，本產品儼然已進入紅海市場。在幾乎無利可圖的情況下，市場上漸有將智慧卡與晶片卡合而為一，增加單卡效能的需求出現。Another concurrent development of the chip card, the multimedia memory card, is also widely used in a variety of common electronic products, such as digital cameras, mobile phones and handheld navigation systems. It is characterized by the evolution of process technology, its appearance can be as small as the size of the nail, and the amount of data that can be stored grows at a multiplying speed (currently the mainstream capacity has reached 16GB). However, in the case of producers and vicious competition, this product has already entered the Red Sea market. In the case of almost no profit, the market has gradually integrated smart cards with chips, and the need to increase the performance of single cards has arisen.
如同中華民國新型專利M288420所揭露(請見第1圖)，一種具有智慧卡晶片卡的多媒體記憶卡，即為一例。前揭專利係利用現有多媒體記憶卡，在適當位置加上智慧卡讀取介面而得(最適宜者為Micro SD卡)。此發明帶給記憶卡使用者不小的方便，然而，對一般智慧型晶片卡的製造商而言，要在現有記憶卡規格上加上智慧型晶片卡組，不是一件容易的事。尤其對於小型記憶卡，其製作工法都要運用到晶圓封裝技術，更遑論要在其晶片卡上加上個人化的資料了。此外，雖說智慧型晶片卡微型化帶給使用者方便，但相對的少了許多卡片面積，使得防偽功能無法在其表面施做，安全性大打折扣。類似的發明也見於中華民國發明專利公開第200608300號(請見第2圖)。As disclosed in the Republic of China new patent M288420 (see Figure 1), a multimedia memory card with a smart card chip card is an example. The previously disclosed patents are obtained by using an existing multimedia memory card and adding a smart card reading interface at an appropriate position (the most suitable one is a Micro SD card). This invention brings convenience to memory card users. However, it is not an easy task for manufacturers of general smart chip cards to add smart chip card sets to existing memory card specifications. Especially for small memory cards, the manufacturing method must be applied to the wafer packaging technology, let alone the personalization of the chip card. In addition, although the smart chip card miniaturization brings convenience to the user, the relative card area is relatively small, so that the anti-counterfeiting function cannot be applied on the surface, and the safety is greatly reduced. A similar invention is also found in the Republic of China Invention Patent Publication No. 200608300 (see Figure 2).
至於兩卡的結合方式，有利用複合式記憶卡讀卡機之助的設計，如中華民國新型專利M253083(請見第3圖)，也有將晶片卡視做獨立模組而接附於記憶模組的創新，如中華民國新型專利M289513(請見第4圖)。除了前段所述小型卡與製作繁複的缺點外，有限的對外銜接介面也無法增加其卡片的價值。As for the combination of the two cards, there is a design that utilizes the help of a composite memory card reader, such as the new patent of the Republic of China M253083 (see Figure 3), and also attaches the wafer card as a separate module to the memory module. Group innovations, such as the Republic of China new patent M289513 (see Figure 4). In addition to the shortcomings of the small cards and the complicated production in the previous paragraph, the limited external interface can not increase the value of the card.
是故，為了解決以上的問題，發明人提出了適切可行解決之道。一種可以提供多張晶片卡與記憶卡的組件，除可有效以標準晶片卡型式存在，加強防偽功能，同時亦可取下其晶片部，作為記憶卡使用。該卡同時具有一種以上的傳輸介面，有效利用其微小空間。製作簡便，也可同步加密於晶片卡上。Therefore, in order to solve the above problems, the inventor proposed a suitable and feasible solution. A component capable of providing a plurality of wafer cards and memory cards, in addition to being effective in a standard wafer card type, enhancing the anti-counterfeiting function, and also removing the wafer portion thereof for use as a memory card. The card has more than one transmission interface at the same time, effectively utilizing its tiny space. Easy to make, it can also be encrypted and encrypted on the chip card.
由先前技術可知，現有晶片卡與智慧卡在結合的過程以便增加其功效時，有著如下的問題：It can be known from the prior art that when the existing wafer card and the smart card are combined to increase their efficacy, the following problems occur:
1.尺寸過小，無法有效進行防偽處理；1. The size is too small to effectively carry out anti-counterfeiting treatment;
2.無適當的傳輸介面；2. There is no suitable transmission interface;
3.製造程序繁複；與3. The manufacturing process is complicated;
4.個人化加密困難。4. Personalized encryption is difficult.
是故，本發明為解決上述問題，提供一種多功能晶片卡組件，包括：一本體；至少一連接部；及至少一晶片部，藉由該連接部與本體可拆取式的連結，包含：至少一具加密功能的晶片，存有個人化資料；一非揮發性記憶體；一第一介面，用以連接外部記憶體讀取裝置；一第二介面，用以連接外部晶片卡讀取裝置；及一控制單元，電連結於該具加密功能的晶片、非揮發性記憶體、第一介面與第二介面，用以執行經由該第一介面自外部記憶體讀取裝置所傳來的指令以讀寫資料於該具加密功能的晶片或該非揮發性記憶體，及執行經由該第二介面自外部晶片卡讀取裝置所傳來的指令以讀寫資料於具加密功能的晶片。Therefore, in order to solve the above problems, the present invention provides a multi-functional wafer card assembly, comprising: a body; at least one connecting portion; and at least one chip portion, wherein the connecting portion and the body are detachably connected, comprising: At least one encryption function chip, having personalized data; a non-volatile memory; a first interface for connecting an external memory reading device; and a second interface for connecting an external wafer card reading device And a control unit electrically coupled to the cryptographically functional chip, the non-volatile memory, the first interface and the second interface for executing instructions transmitted from the external memory reading device via the first interface Reading and writing data to the cryptographically-enabled chip or the non-volatile memory, and executing instructions transmitted from the external chip card reading device via the second interface to read and write data to the cryptographic-enabled wafer.
本發明另為一種多功能晶片卡組件，包括：一本體；至少一連接部；及至少一晶片部，藉由該連接部與本體可拆取式的連結，包含：至少一具加密功能的晶片，存有個人化資料；一非揮發性記憶體；一第一介面，用以連接外部記憶體讀取裝置；一第二介面，用以連接外部晶片卡讀取裝置；一無線收發模組及一控制單元，電連結於該具加密功能的晶片、非揮發性記憶體、第一介面、第二介面與無線收發模組，用以執行經由該第一介面自外部記憶體讀取裝置所傳來的指令以讀寫資料於該具加密功能的晶片或該非揮發性記憶體、執行經由該第二介面自外部晶片卡讀取裝置所傳來的指令以讀寫資料於具加密功能的晶片，及傳送經由該無線收發模組所傳來的指令至該第一介面或第二介面。The invention further provides a multi-functional wafer card assembly, comprising: a body; at least one connecting portion; and at least one chip portion, wherein the connecting portion and the body are detachably connected, comprising: at least one chip with encryption function Personalized data; a non-volatile memory; a first interface for connecting an external memory reading device; a second interface for connecting an external chip card reading device; a wireless transceiver module and a control unit electrically coupled to the cryptographic function chip, the non-volatile memory, the first interface, the second interface, and the wireless transceiver module for performing transmission from the external memory reading device via the first interface The command is to read and write data on the cryptographic function chip or the non-volatile memory, and execute an instruction sent from the external chip card reading device via the second interface to read and write data to the cryptographic function chip. And transmitting a command sent via the wireless transceiver module to the first interface or the second interface.
本發明另為一種多功能晶片卡組件，包括：一本體；至少一連接部；及至少一晶片部，藉由該連接部與本體可拆取式的連結，包含：一非揮發性記憶體；一第一介面，用以連接外部記憶體讀取裝置；一無線收發模組；及一控制單元，電連結於該非揮發性記憶體、第一介面與無線收發模組，用以執行經由該第一介面自外部記憶體讀取裝置所傳來的指令以讀寫資料於該非揮發性記憶體，及傳送經由該無線收發模組所傳來的指令至該第一介面。The present invention is a multi-functional wafer card assembly, comprising: a body; at least one connecting portion; and at least one chip portion, the connecting portion and the body are detachably connected, comprising: a non-volatile memory; a first interface for connecting an external memory reading device; a wireless transceiver module; and a control unit electrically coupled to the non-volatile memory, the first interface and the wireless transceiver module for performing An interface from the external memory reading device reads and writes data to the non-volatile memory, and transmits a command transmitted via the wireless transceiver module to the first interface.
根據本案構想，其中該本體、至少一連接部與至少一晶片部為一體成形，該晶片部可藉由折斷該連接部而取下。According to the present invention, the body, the at least one connecting portion and the at least one wafer portion are integrally formed, and the wafer portion can be removed by breaking the connecting portion.
根據本案構想，其中該本體外部尺寸為標準信用卡尺寸。According to the present invention, the external dimensions of the body are standard credit card sizes.
根據本案構想，其中該晶片部外形如同Micro SD(Secure Digital)卡之外形。According to the present invention, the shape of the wafer portion is shaped like a Micro SD (Secure Digital) card.
根據本案構想，其中該非揮發性記憶體為快閃記憶體(Flash Memory)或可電式抹除程式唯讀記憶體(Electrically-Erasable Programmable Read-Only Memory,EEPROM)。According to the present invention, the non-volatile memory is a Flash Memory or an Electrically-Erasable Programmable Read-Only Memory (EEPROM).
根據本案構想，其中該第一介面具有與Micro SD卡相同的讀取介面規格。According to the present invention, the first interface has the same read interface specifications as the Micro SD card.
根據本案構想，其中該第二介面符合智慧卡讀取介面規格。According to the concept of the present invention, the second interface conforms to the smart card reading interface specification.
根據本案構想，其中該晶片部進一步可形成一內建至少一具加密功能的晶片與附有其讀取介面規格之Micro SD卡。According to the present invention, the chip portion can further form a chip with at least one encryption function and a Micro SD card with its read interface specification.
根據本案構想，其中該晶片部進一步可藉由安置於一轉換裝置內形成一內建至少一具加密功能的晶片與附有其讀取介面規格之Micro SD卡。According to the concept of the present invention, the chip portion can further form a chip with at least one encryption function and a Micro SD card with its read interface specification by being disposed in a conversion device.
本發明另提供一種多功能晶片卡組件的製造方法，包括：以塑料射出部份包覆一晶片組單元且形成至少一連接部與一本體，該本體藉由該連接部與被包覆之晶片組單元可拆取式連結；以量產智慧卡之多作業頭設備，將加密資料及/或個人化資料輸入晶片組單元中；及將對應於個人化資料之產品序號製作於智慧卡組件上；其中該晶片組單元，包含：至少一具加密功能的晶片，存有個人化資料；一非揮發性記憶體；一第一介面，用以連接外部記憶體讀取裝置；一第二介面，用以連接外部晶片卡讀取裝置；及一控制單元，電連結於該具加密功能的晶片、非揮發性記憶體、第一介面與第二介面，用以執行經由該第一介面自外部記憶體讀取裝置所傳來的指令以讀寫資料於該具加密功能的晶片或該非揮發性記憶體，及執行經由該第二介面自外部晶片卡讀取裝置所傳來的指令以讀寫資料於具加密功能的晶片。The invention further provides a method for manufacturing a multi-functional wafer card assembly, comprising: coating a wafer unit with a plastic injection portion and forming at least one connecting portion and a body, the body and the coated wafer by the connecting portion The unit unit is detachable; the multi-head device for mass production of the smart card is used to input the encrypted data and/or the personalized data into the chipset unit; and the product serial number corresponding to the personalized data is created on the smart card component. The chipset unit includes: at least one encryption function chip, storing personalized data; a non-volatile memory; a first interface for connecting an external memory reading device; and a second interface, The device is connected to the external chip card reading device; and a control unit is electrically connected to the cryptographic function chip, the non-volatile memory, the first interface and the second interface for performing internal memory through the first interface An instruction sent by the body reading device reads and writes data to the chip or the non-volatile memory having the encryption function, and performs reading from the external chip card reading device via the second interface The instructions are sent to read and write data on the cryptographic chip.
本發明另提供一種多功能晶片卡組件的製造方法，包括：以塑料射出部份包覆一晶片組單元且形成至少一連接部與一本體，該本體藉由該連接部與被包覆之晶片組單元可拆取式連結；以量產智慧卡之多作業頭設備，將加密資料及/或個人化資料輸入晶片組單元中；及將對應於個人化資料之產品序號製作於智慧卡組件上；其中該晶片組單元，包含：至少一具加密功能的晶片，存有個人化資料；一非揮發性記憶體；一第一介面，用以連接外部記憶體讀取裝置；一第二介面，用以連接外部晶片卡讀取裝置；無線收發模組；及一控制單元，電連結於該具加密功能的晶片、非揮發性記憶體、第一介面、第二介面與無線收發模組，用以執行經由該第一介面自外部記憶體讀取裝置所傳來的指令以讀寫資料於該具加密功能的晶片或該非揮發性記憶體、執行經由該第二介面自外部晶片卡讀取裝置所傳來的指令以讀寫資料於具加密功能的晶片，及傳送經由該無線收發模組所傳來的指令至該第一介面或第二介面。The invention further provides a method for manufacturing a multi-functional wafer card assembly, comprising: coating a wafer unit with a plastic injection portion and forming at least one connecting portion and a body, the body and the coated wafer by the connecting portion The unit unit is detachable; the multi-head device for mass production of the smart card is used to input the encrypted data and/or the personalized data into the chipset unit; and the product serial number corresponding to the personalized data is created on the smart card component. The chipset unit includes: at least one encryption function chip, storing personalized data; a non-volatile memory; a first interface for connecting an external memory reading device; and a second interface, The device is connected to the external chip card reading device; the wireless transceiver module; and a control unit electrically connected to the chip with the encryption function, the non-volatile memory, the first interface, the second interface and the wireless transceiver module, Executing instructions transmitted from the external memory reading device via the first interface to read and write data to the cryptographically functioning chip or the non-volatile memory, and executing via the second The interface transmits an instruction from the external chip card reading device to read and write data to the chip having the encryption function, and transmits the command transmitted through the wireless transceiver module to the first interface or the second interface.
本發明另提供一種多功能晶片卡組件的製造方法，包括：以塑料射出部份包覆一晶片組單元且形成至少一連接部與一本體，該本體藉由該連接部與被包覆之晶片組單元可拆取式連結；以量產智慧卡之多作業頭設備，將加密資料及/或個人化資料輸入晶片組單元中；及將對應於個人化資料之產品序號製作於智慧卡組件上；其中該晶片組單元，包含：至少一具加密功能的晶片，存有個人化資料；一非揮發性記憶體；一第一介面，用以連接外部記憶體讀取裝置；無線收發模組；及一控制單元，電連結於該非揮發性記憶體、第一介面與無線收發模組，用以執行經由該第一介面自外部記憶體讀取裝置所傳來的指令以讀寫資料於該非揮發性記憶體，及傳送經由該無線收發模組所傳來的指令至該第一介面。The invention further provides a method for manufacturing a multi-functional wafer card assembly, comprising: coating a wafer unit with a plastic injection portion and forming at least one connecting portion and a body, the body and the coated wafer by the connecting portion The unit unit is detachable; the multi-head device for mass production of the smart card is used to input the encrypted data and/or the personalized data into the chipset unit; and the product serial number corresponding to the personalized data is created on the smart card component. The chipset unit includes: at least one cryptographic function chip, storing personalized data; a non-volatile memory; a first interface for connecting an external memory reading device; a wireless transceiver module; And a control unit electrically connected to the non-volatile memory, the first interface and the wireless transceiver module, configured to execute an instruction sent from the external memory reading device via the first interface to read and write data in the non-volatile Sex memory, and transmitting instructions transmitted through the wireless transceiver module to the first interface.
根據本案構想，其中該本體外部尺寸為標準信用卡尺寸。According to the present invention, the external dimensions of the body are standard credit card sizes.
根據本案構想，其中該晶片組單元外形同Micro SD卡之外形。According to the present invention, the chip unit unit has a shape similar to that of the Micro SD card.
根據本案構想，其中該非揮發性記憶體為快閃記憶體(Flash Memory)或可電式抹除程式唯讀記憶體(Electrically-Erasable Programmable Read-Only Memory,EEPROM)。According to the present invention, the non-volatile memory is a Flash Memory or an Electrically-Erasable Programmable Read-Only Memory (EEPROM).
根據本案構想，其中該第一介面具有與Micro SD(Secure Digital)卡相同的讀取介面規格。According to the present invention, the first interface has the same read interface specifications as the Micro SD (Secure Digital) card.
根據本案構想，其中該第二介面符合智慧卡讀取介面規格。According to the concept of the present invention, the second interface conforms to the smart card reading interface specification.
根據本案構想，其中該製作方法為雷雕法、噴墨法與彩印法。According to the concept of the present invention, the manufacturing method is a laser engraving method, an inkjet method, and a color printing method.
本發明藉由四個實施例說明。The invention is illustrated by four embodiments.
請見第5圖至第7圖。一多功能晶片卡組件10，作為便利商店儲值消費卡使用。外形上，具有一與信用卡同外觀尺寸的本體102、晶片部106及連接本體102與晶片部106的3個連接部104。該晶片部106的外觀與一Micro SD卡相似，其表面具有一Micro SD卡讀寫介面1062及供儲值消費使用之智慧卡讀寫介面1064。晶片部106可藉由折斷3個連接部104而達到取下獨立使用之目的(即可當作獨立Micro SD卡)。其上有一組雷雕之序號108。晶片部106的結構組成請見第6圖。其內有一控制晶片1066，電連結至該Micro SD卡讀寫介面1062、智慧卡讀寫介面1064、一非揮發性記憶體1067，可為快閃記憶體(Flash Memory)或可電式抹除程式唯讀記憶體(Electrically-Erasable Programmable Read-Only Memory,EEPROM)與該提供智慧卡服務且具加密功能的一晶片1068。該控制晶片1066執行經由Micro SD卡讀寫介面1062自外部讀卡機(未繪示)所傳來的指令以讀寫資料於快閃記憶體1067或晶片1068，並可執行經由智慧卡讀寫介面1064自外部晶片卡讀卡機所傳來的指令以讀寫資料於晶片1068中。See Figures 5 through 7. A multi-function wafer card assembly 10 is used as a convenience store stored value consumer card. The outer shape has a main body 102 having the same outer shape as the credit card, the chip portion 106, and three connecting portions 104 connecting the main body 102 and the wafer portion 106. The chip portion 106 has a similar appearance to a Micro SD card, and has a Micro SD card read/write interface 1062 on its surface and a smart card read/write interface 1064 for stored value consumption. The chip portion 106 can be removed for independent use by being broken by the three connecting portions 104 (that is, as a stand-alone Micro SD card). There is a set of number 108 of the ray sculpture. The structure of the wafer portion 106 is shown in Fig. 6. A control chip 1066 is electrically connected to the micro SD card read/write interface 1062, the smart card read/write interface 1064, and a non-volatile memory 1067, which can be a flash memory or an electrically erasable memory. An electrically-erasable Programmable Read-Only Memory (EEPROM) and a chip 1068 that provides a smart card service and has an encryption function. The control chip 1066 performs an instruction sent from an external card reader (not shown) via the Micro SD card read/write interface 1062 to read and write data to the flash memory 1067 or the chip 1068, and can be read and written via the smart card. The interface 1064 reads and writes data from the external wafer card reader to the wafer 1068.
此處，加密功能指的是晶片1068內可儲存一組控制密碼，當外來訊號要讀寫晶片1068內的資料，必先得核對該控制密碼。若其中所紀錄之密碼未於多功能晶片卡組件10外的讀取機器內登錄或型式不符，則表示該多功能晶片卡組件10未為原授權機構授權，進而失效。Here, the encryption function means that a set of control passwords can be stored in the chip 1068. When the external signal is to read and write the data in the chip 1068, the control password must be checked first. If the password recorded therein is not registered or typed in the reading machine outside the multi-function chip card assembly 10, it means that the multi-function wafer card assembly 10 is not authorized by the original authority, and thus fails.
本例所使用的製造方式請見第7圖。利用塑膠射出法，將ABS(Acrylonitrile-Butadiene-Styrene)樹脂射出以部份包覆印刷電路板組合(PCBA,Printed Circuit Board Assembly)(Micro SD卡讀寫介面1062及智慧卡讀寫介面1064未包覆)，如步驟SO1，該印刷電路板組合具有控制晶片1066、Micro SD卡讀寫介面1062、智慧卡讀寫介面1064、快閃記憶體1067與晶片1068。此時，將射出成型的晶片卡，置於量產智慧卡之多作業頭設備內，將加密資料輸入晶片1068中(步驟S02)。本步驟的優點在於利用一全自動化的連續作業模式，將個別加密資料依序輸入晶片內。最後，於卡片定點雷雕對應於該加密資料的序號108(步驟S03)。至於目前要在記憶卡或晶片卡與記憶卡的混合卡內加入相同資料的工序，因封裝過程複雜，尚無法有效利用一體成型技術與連續作業方式加入加密資料，本發明在量產時則無此困擾。See Figure 7 for the manufacturing method used in this example. ABS (Acrylonitrile-Butadiene-Styrene) resin is injected by a plastic injection method to partially cover a printed circuit board assembly (PCBA). The micro SD card reading and writing interface 1062 and the smart card reading and writing interface 1064 are not included. In step S1, the printed circuit board assembly has a control chip 1066, a Micro SD card read/write interface 1062, a smart card read/write interface 1064, a flash memory 1067 and a wafer 1068. At this time, the injection-molded wafer card is placed in a multi-head machine of a mass production smart card, and the encrypted data is input into the wafer 1068 (step S02). The advantage of this step is that the individual encrypted data is sequentially input into the wafer using a fully automated continuous mode of operation. Finally, the card is positioned to correspond to the serial number 108 of the encrypted material (step S03). As for the current process of adding the same data to the memory card or the hybrid card of the memory card and the memory card, since the packaging process is complicated, it is not possible to effectively use the integrated molding technology and the continuous operation mode to add the encrypted data, and the present invention is not in mass production. This troubles.
請見第8圖。因第二實施例的外觀與製作方式同第一實施例所描述，故不於此贅述。其相異處，此例是供大眾乘坐交通工具之付費晶片卡，同時可以藉由AGPS(Assisted Global Positioning System)之輔助，隨時於手機螢幕上顯示乘客所在位置，並可將乘客所經過之路線紀錄於記憶體中。See Figure 8. Since the appearance and the manufacturing method of the second embodiment are the same as those of the first embodiment, they are not described herein. In contrast, this is a paid wafer card for the public to use the vehicle. At the same time, with the assistance of AGPS (Assisted Global Positioning System), the passenger's location can be displayed on the mobile phone screen at any time, and the passenger can pass the route. Recorded in memory.
是故，一晶片部206內有一控制晶片2066，該控制晶片2066電連結至該Micro SD卡讀寫介面2062、一AGPS無線收發模組2063、智慧卡讀寫介面2064、一快閃記憶體2067與該提供智慧卡服務且具加密功能的一晶片2068。該控制晶片2066執行經由Micro SD卡讀寫介面2062自外部讀卡機(未繪示)所傳來的指令以讀寫資料於快閃記憶體2067或晶片2068、執行經由智慧卡讀寫介面2064自外部晶片卡讀卡機所傳來的指令以讀寫資料於晶片2068中、及傳送經由該AGPS無線收發模組2063所傳來的指令至該Micro SD卡讀寫介面2062或智慧卡讀寫介面2064，以傳遞至手機處理該訊息。Therefore, a chip portion 206 has a control chip 2066 electrically connected to the micro SD card read/write interface 2062, an AGPS wireless transceiver module 2063, a smart card read/write interface 2064, and a flash memory 2067. And a chip 2068 with encryption function provided by the smart card service. The control chip 2066 executes an instruction sent from an external card reader (not shown) via the Micro SD card read/write interface 2062 to read and write data to the flash memory 2067 or the chip 2068, and executes the smart card read/write interface 2064. The command sent from the external chip card reader reads and writes the data in the chip 2068, and transmits the command transmitted through the AGPS wireless transceiver module 2063 to the micro SD card read/write interface 2062 or the smart card. The interface 2064 is passed to the mobile phone to process the message.
請見第9圖與第10圖。本例描述一個藉由轉換器以達成與現有多媒體記憶卡讀卡機接連的多功能晶片卡組件。功能上類似第二實施例，是供大眾乘坐交通工具之付費晶片卡，同時可以藉由AGPS之輔助，隨時於手機螢幕上顯示乘客所在位置，並可將乘客所經過之路線紀錄於記憶體中。其不同點在於本例只需一個讀取介面即可。See Figure 9 and Figure 10. This example describes a multi-function wafer card assembly that is coupled to an existing multimedia memory card reader by a converter. Functionally similar to the second embodiment, it is a paid wafer card for the public to take the vehicle. At the same time, with the aid of AGPS, the position of the passenger can be displayed on the mobile phone screen at any time, and the route the passenger passes can be recorded in the memory. . The difference is that this example only needs one reading interface.
一多功能晶片卡組件30，具有一與信用卡同外觀尺寸的本體302、晶片部306、與晶片部306聯接形成標準Micro SD外型之轉換器307及連接本體302與晶片部306的三個連接部304。該轉換器307表面具有一Micro SD卡讀寫介面3061及供儲值消費使用之智慧卡讀寫介面3064。晶片部306可藉由折斷三個連接部304而達到取下目的，藉轉換器307之助以當作獨立的Micro SD卡。其上有一組噴印之序號308。A multi-function wafer card assembly 30 has a body 302 of the same size as the credit card, a chip portion 306, a converter 307 coupled to the chip portion 306 to form a standard Micro SD form, and three connections between the body 302 and the chip portion 306. Part 304. The surface of the converter 307 has a Micro SD card read/write interface 3061 and a smart card read/write interface 3064 for stored value consumption. The chip portion 306 can be removed by breaking the three connecting portions 304, and is assisted by the converter 307 as a separate Micro SD card. There is a set of printed serial numbers 308 thereon.
晶片部306的結構組成請見第10圖。其內有一控制晶片3066，電連結至一讀寫元件3062(進而與該轉換器307連結)、一AGPS無線收發模組3063、一快閃記憶體3067與該提供智慧卡服務且具加密功能的一晶片3068。該控制晶片3066執行經由讀寫元件3062自轉換器307所傳來的指令以讀寫資料於快閃記憶體3067或晶片3068及傳送經由該AGPS無線收發模組3063所傳來的指令至該讀寫元件3062，藉轉換器307以傳遞至手機處理該訊息。See Figure 10 for the structure of the wafer portion 306. A control chip 3066 is electrically connected to a read/write component 3062 (and thus connected to the converter 307), an AGPS wireless transceiver module 3063, a flash memory 3067 and the smart card service and the encryption function. A wafer 3068. The control chip 3066 executes instructions transmitted from the converter 307 via the read/write component 3062 to read and write data to the flash memory 3067 or the chip 3068 and to transmit instructions transmitted via the AGPS wireless transceiver module 3063 to the read. Write component 3062, by converter 307 to pass to the handset to process the message.
本例的優點在於，可利用不同之轉換器形式，連接不同的多媒體介面，例如MS(Memory Stick)卡。此外，本例之製造方式也為一體成型(但不含轉換器307)，製造過程不再贅述。The advantage of this example is that different converter formats can be used to connect different multimedia interfaces, such as MS (Memory Stick) cards. In addition, the manufacturing method of this example is also integrally formed (but does not contain the converter 307), and the manufacturing process will not be described again.
請見第11圖與第12圖。本例描述一多功能晶片卡組件的晶片部與連結部的特殊連結方式。本例不僅可讓該晶片卡可任意自其本體取下，亦可裝回至定位，不易造成卡片遺失。然，本體與其晶片部需各自製作。See Figure 11 and Figure 12. This example describes the particular manner in which the wafer portion and the joint portion of a multi-function wafer card assembly are coupled. In this example, the wafer card can be arbitrarily removed from its body, and can be reinstalled to the positioning, which is not easy to cause the card to be lost. However, the body and its wafer portion need to be fabricated separately.
一多功能晶片卡組件40(參見第11圖)，作為便利商店儲值消費卡使用。外型上，具有與信用卡同外觀尺寸的一本體402、其內包含的晶片部406及連接本體402與晶片部406的連接部404。該晶片部406的外觀與一Micro SD卡相似，功能同第一實施例，故其組成結構不再贅述。其連接部404乃是利用兩片PVC(Polyvinyl Chloride,聚氯乙烯)薄膜，貼附於本體402之正(面向讀者方向)反(面向紙張方向，未繪示)兩面，並於正面鏤空二部分以便裝設晶片部406。當晶片部406裝入連接部404時，晶片部406上之一智慧卡讀寫介面4062可露出於薄膜之外，便於讀卡機(未繪示)讀寫資料。本體402利用其一突出部4022(參見第12圖)，固定該晶片部406。而欲將晶片部406取出，僅需以手指擠壓連接部404背面PVC薄膜即可，快速方便。A multi-function wafer card assembly 40 (see Figure 11) is used as a convenience store stored value consumer card. The outer shape has a main body 402 having the same external dimensions as the credit card, a wafer portion 406 included therein, and a connecting portion 404 connecting the main body 402 and the wafer portion 406. The appearance of the chip portion 406 is similar to that of a Micro SD card, and the functions are the same as those of the first embodiment, so the detailed structure thereof will not be described again. The connecting portion 404 is made of two pieces of PVC (Polyvinyl Chloride) film attached to the front (facing the direction of the reader) of the main body 402 (the direction facing the paper, not shown), and is hollowed out on the front side. In order to mount the wafer portion 406. When the chip portion 406 is inserted into the connecting portion 404, one of the smart card reading and writing interfaces 4062 on the chip portion 406 can be exposed outside the film to facilitate reading and writing of data by the card reader (not shown). The body 402 is secured to the wafer portion 406 by a projection 4022 (see Fig. 12). To take out the wafer portion 406, it is only necessary to press the PVC film on the back side of the connecting portion 404 with a finger, which is quick and convenient.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
10．．．多功能晶片卡組件10. . . Multi-function wafer card assembly
102．．．本體102. . . Ontology
104．．．連接部104. . . Connection
106．．．晶片部106. . . Chip part
1062．．．Micro SD卡讀寫介面1062. . . Micro SD card reading and writing interface
1064．．．智慧卡讀寫介面1064. . . Smart card reading and writing interface
1066．．．控制晶片1066. . . Control chip
1067．．．快閃記憶體1067. . . Flash memory
1068．．．晶片1068. . . Wafer
108．．．序號108. . . Serial number
206．．．晶片部206. . . Chip part
2062．．．Micro SD卡讀寫介面2062. . . Micro SD card reading and writing interface
2063．．．AGPS無線收發模組2063. . . AGPS wireless transceiver module
2064．．．智慧卡讀寫介面2064. . . Smart card reading and writing interface
2066．．．控制晶片2066. . . Control chip
2067．．．快閃記憶體2067. . . Flash memory
2068．．．晶片2068. . . Wafer
30．．．多功能晶片卡組件30. . . Multi-function wafer card assembly
302．．．本體302. . . Ontology
304．．．連接部304. . . Connection
306．．．晶片部306. . . Chip part
3061．．．Micro SD卡讀寫介面3061. . . Micro SD card reading and writing interface
3062．．．讀寫元件3062. . . Read and write component
3063．．．AGPS無線收發模組3063. . . AGPS wireless transceiver module
3064．．．智慧卡讀寫介面3064. . . Smart card reading and writing interface
3066．．．控制晶片3066. . . Control chip
3067．．．快閃記憶體3067. . . Flash memory
3068．．．晶片3068. . . Wafer
307．．．轉換器307. . . converter
308．．．序號308. . . Serial number
40．．．多功能晶片卡組件40. . . Multi-function wafer card assembly
402．．．本體402. . . Ontology
4022．．．突出部4022. . . Protruding
404．．．連接部404. . . Connection
406．．．晶片部406. . . Chip part
4062．．．智慧卡讀寫介面4062. . . Smart card reading and writing interface
第1圖繪示一種具有智慧型晶片卡的記憶卡的先前技術；Figure 1 illustrates a prior art of a memory card with a smart wafer card;
第2圖繪示另一種具有智慧型晶片卡的記憶卡的先前技術；Figure 2 illustrates a prior art of another memory card with a smart wafer card;
第3圖繪示一種具有智慧型晶片卡與記憶卡雙卡槽讀卡機的先前技術；FIG. 3 illustrates a prior art of a smart card card and a memory card dual card slot reader;
第4圖繪示一種藉由連結器結合智慧型晶片卡與記憶卡的先前技術；Figure 4 illustrates a prior art in which a smart chip card and a memory card are combined by a connector;
第5圖繪示本發明多功能晶片卡組件的第一實施例之外觀圖；5 is a perspective view showing a first embodiment of the multifunctional wafer card assembly of the present invention;
第6圖繪示本發明多功能晶片卡組件的第一實施例之元件方塊圖；Figure 6 is a block diagram showing the components of the first embodiment of the multi-function wafer card assembly of the present invention;
第7圖繪示本發明多功能晶片卡組件的第一實施例之製作流程圖；7 is a flow chart showing the fabrication of the first embodiment of the multifunctional wafer card assembly of the present invention;
第8圖繪示本發明多功能晶片卡組件的第二實施例之元件方塊圖；Figure 8 is a block diagram showing the second embodiment of the multifunctional wafer card assembly of the present invention;
第9圖繪示本發明多功能晶片卡組件的第三實施例之外觀圖；9 is a perspective view showing a third embodiment of the multifunctional wafer card assembly of the present invention;
第10圖繪示本發明多功能晶片卡組件的第三實施例之元件方塊圖；Figure 10 is a block diagram showing the third embodiment of the multifunctional wafer card assembly of the present invention;
第11圖繪示本發明多功能晶片卡組件的第四實施例之外觀圖；及11 is a perspective view showing a fourth embodiment of the multifunctional wafer card assembly of the present invention; and
第12圖繪示本發明多功能晶片卡組件的第四實施例中，本體之外觀圖。Figure 12 is a perspective view of the body of the fourth embodiment of the multi-function wafer card assembly of the present invention.
10．．．多功能晶片卡組件10. . . Multi-function wafer card assembly
102．．．本體102. . . Ontology
104．．．連接部104. . . Connection
106．．．晶片部106. . . Chip part
1062．．．Micro SD卡讀寫介面1062. . . Micro SD card reading and writing interface
1064．．．智慧卡讀寫介面1064. . . Smart card reading and writing interface
108．．．序號108. . . Serial number
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98104864ATWI394080B (en) | 2009-02-16 | 2009-02-16 | Versatile chip card assembly and manufacturing method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98104864ATWI394080B (en) | 2009-02-16 | 2009-02-16 | Versatile chip card assembly and manufacturing method thereof |
| Publication Number | Publication Date |
|---|---|
| TW201032141A TW201032141A (en) | 2010-09-01 |
| TWI394080Btrue TWI394080B (en) | 2013-04-21 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98104864ATWI394080B (en) | 2009-02-16 | 2009-02-16 | Versatile chip card assembly and manufacturing method thereof |
| Country | Link |
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| TW (1) | TWI394080B (en) |
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| TW200709071A (en)* | 2002-10-08 | 2007-03-01 | Hitachi Ulsi Sys Co Ltd | Ic card and manufacturing method thereof applied to semiconductor memory card |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |