TWI371866B - Electronic device contact structures - Google Patents

Electronic device contact structures

Info

Publication number: TWI371866B
Authority: TW; Taiwan
Prior art keywords: electronic device; contact structures; device contact; structures; electronic
Prior art date: 2003-12-12

Other versions

Inventor

Alexei A Erchak

Eleftrios Lidorikis

John W Graff

Original Assignee

Luminus Devices Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-12-12

Filing date

2004-12-03

Publication date

2012-09-01

2003-12-12Priority claimed from US10/735,498external-prioritypatent/US7166871B2/en

2004-03-05Priority claimed from US10/794,244external-prioritypatent/US20040259279A1/en

2004-03-05Priority claimed from US10/794,452external-prioritypatent/US7074631B2/en

2004-06-18Priority claimed from US10/871,877external-prioritypatent/US7105861B2/en

2004-12-03Application filed by Luminus Devices IncfiledCriticalLuminus Devices Inc

2005-09-16Publication of TW200531311ApublicationCriticalpatent/TW200531311A/en

2012-09-01Application grantedgrantedCritical

2012-09-01Publication of TWI371866BpublicationCriticalpatent/TWI371866B/en

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures

TW093137378A2003-12-122004-12-03Electronic device contact structuresTWI371866B (en)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
US10/735,498US7166871B2 (en)	2003-04-15	2003-12-12	Light emitting systems
US10/794,244US20040259279A1 (en)	2003-04-15	2004-03-05	Light emitting device methods
US10/794,452US7074631B2 (en)	2003-04-15	2004-03-05	Light emitting device methods
US55389404P	2004-03-16	2004-03-16
US10/871,877US7105861B2 (en)	2003-04-15	2004-06-18	Electronic device contact structures

Publications (2)

Publication Number	Publication Date
TW200531311A TW200531311A (en)	2005-09-16
TWI371866Btrue TWI371866B (en)	2012-09-01

Family

ID=34714664

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW093137378ATWI371866B (en)	2003-12-12	2004-12-03	Electronic device contact structures

Country Status (2)

Country	Link
TW (1)	TWI371866B (en)
WO (1)	WO2005060586A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI471069B (en)*	2013-05-22	2015-01-21	Takamatsu Plating Co Ltd	Metal board used for led

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102006013408A1 (en)*	2006-03-17	2007-09-20	Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.	Light emitting diode unit for use as signal unit, has electrical conductors led along outer surface of electrically conducting electrodes based on electrical contact, overlapping electrodes in area wise, and forming power supply line
DE102008019049B4 (en)	2008-04-15	2013-12-24	Novaled Ag	Light emitting organic device and device
CN109075057B (en)*	2016-03-09	2023-10-20	应用材料公司	Pad structure and method of manufacture

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3293513A (en)*	1962-08-08	1966-12-20	Texas Instruments Inc	Semiconductor radiant diode
US3922706A (en)*	1965-07-31	1975-11-25	Telefunken Patent	Transistor having emitter with high circumference-surface area ratio
US4864370A (en)*	1987-11-16	1989-09-05	Motorola, Inc.	Electrical contact for an LED
US6307218B1 (en)*	1998-11-20	2001-10-23	Lumileds Lighting, U.S., Llc	Electrode structures for light emitting devices
US7105861B2 (en)*	2003-04-15	2006-09-12	Luminus Devices, Inc.	Electronic device contact structures

2004
- 2004-12-03TWTW093137378Apatent/TWI371866B/ennot_activeIP Right Cessation
- 2004-12-08WOPCT/US2004/040900patent/WO2005060586A2/enactiveApplication Filing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI471069B (en)*	2013-05-22	2015-01-21	Takamatsu Plating Co Ltd	Metal board used for led

Also Published As

Publication number	Publication date
WO2005060586A3 (en)	2006-03-30
WO2005060586A2 (en)	2005-07-07
TW200531311A (en)	2005-09-16

Publication	Publication Date	Title
AU2003292417A8 (en)	2004-07-09	Electronic devices
EP1793599A4 (en)	2009-12-09	Electronic device
TWI350595B (en)	2011-10-11	Electronic device contact structures
AU2003278386A8 (en)	2004-05-25	Machanically operable electrical device
TW566775U (en)	2003-12-11	Portable electronic device
EP1621859A4 (en)	2007-01-10	Force-detecting device
EP1661596A4 (en)	2010-04-21	Oxygen-concentrating device
EP1821183A4 (en)	2011-01-26	Electronic device
EP1739525A4 (en)	2011-08-10	Electronic device
GB2418808B (en)	2009-05-20	Electronic device
EP1630586A4 (en)	2010-03-31	Micrroscope device
EP1626260A4 (en)	2007-09-05	Torque-detecting device
GB2396055B (en)	2006-06-14	Circuit device construction
SG112997A1 (en)	2005-07-28	Portable electronic device
GB0413398D0 (en)	2004-07-21	Electronic device
AU2003237473A8 (en)	2003-12-22	Strained-semiconductor-on-insulator device structures
EP1715445A4 (en)	2016-08-31	Electronic device
EP1589343A4 (en)	2011-06-15	Analyzer-feeding device
TWI371866B (en)	2012-09-01	Electronic device contact structures
GB0325633D0 (en)	2003-12-10	Electronic game device
GB0229660D0 (en)	2003-01-29	Electronic devices
TW572564U (en)	2004-01-11	Clammer-typed electronic device
EP1666993A4 (en)	2008-08-06	Electronic device
GB2398295B (en)	2004-12-29	Electronic de-scalers
SG120275A1 (en)	2006-03-28	Electronic device

Legal Events

Date	Code	Title	Description
2015-06-01	MM4A	Annulment or lapse of patent due to non-payment of fees

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TWI371866B - Electronic device contact structures - Google Patents

Info

Links

Classifications

Applications Claiming Priority (5)

Publications (2)

Family

ID=34714664

Family Applications (1)

Country Status (2)

Cited By (1)

Families Citing this family (3)

Family Cites Families (5)

Cited By (1)

Also Published As

Similar Documents

Legal Events