TWD140000S1 - Chip leadframe - Google Patents

Abstract

Translated fromChinese

【物品用途】;本創作為一導線架，尤指一種晶片之導線架，適用於封裝晶片。;【創作特點】;本創作之晶片之導線架具有一承載部與一框體。框體包覆部分的承載部。就前視圖與立體圖而言，框體具有一貫通孔以暴露出部分的承載部。貫通孔的頂部開口的邊緣大致呈現長方形，貫通孔的底部開口的邊緣大致呈現橢圓形。承載部具有一凹陷，凹陷不位於貫通孔的底部開口的中央部位。凹陷的頂部開口的邊緣大致呈現橢圓形，凹陷的底部的邊緣大致呈現橢圓形。就A-A端面剖視圖與B-B端面剖視圖而言，貫通孔的內表面是一傾斜面，凹陷的內表面是一傾斜面。就俯視圖與仰視圖而言，承載部延伸至框體外以形成兩個彎折的端子。就後視圖而言，被框體所暴露之承載部的區域，其位置並非置中且大致呈現橢圓形。;以整體觀之，本創作具有獨特的風格，予人圓滑而不突兀的視覺感受。本創作之晶片之導線架是一種創新的創作，符合新式樣專利要件，敬請准予專利保障。[Use of the Article]; This creation is a lead frame, especially a chip lead frame suitable for packaging chips.; [Features of the Creation]; The chip lead frame of this creation has a supporting portion and a frame. The frame covers part of the supporting portion. In the front view and the three-dimensional view, the frame has a through hole to expose part of the supporting portion. The edge of the top opening of the through hole is roughly rectangular, and the edge of the bottom opening of the through hole is roughly elliptical. The supporting portion has a depression, and the depression is not located in the center of the bottom opening of the through hole. The edge of the top opening of the depression is roughly elliptical, and the edge of the bottom of the depression is roughly elliptical. In the A-A end face section view and the B-B end face section view, the inner surface of the through hole is an inclined surface, and the inner surface of the recess is an inclined surface. In the top view and the bottom view, the support portion extends outside the frame to form two bent terminals. In the rear view, the area of the support portion exposed by the frame is not centered and is roughly elliptical. ; Overall, this creation has a unique style, giving people a smooth and non-obtrusive visual experience. The chip lead frame of this creation is an innovative creation that meets the requirements of a new style patent. Please grant patent protection.