TWD138225S1 - Elastic film for semiconductor wafer polishing equipment - Google Patents

Abstract

Translated fromChinese

【物品用途】;本創作的物品係半導體晶圓研磨裝置用彈性膜，為扁薄圓形體，通常使用於半導體的製造晶圓研磨製程，裝設於研磨裝置的基板保持環內側，並利用供給空氣等氣體，使膜面朝正面鼓起，將配設於正面的晶圓單面按壓於研磨墊。;【創作特點】;從各視圖觀之，本創作係扁薄之圓形體，其前面具有六個細小圓形孔，後面則有中間雙圈之不同間距摺疊狀凸環形同心圓，且該六個細小圓形孔於後面擴大，形成外徑深入後面摺疊狀凸環底部之圓形凹部，而外周邊則形成外翻凸緣形態；該整體造型的創新設計，為本物品之創作重點。[Purpose of the item]: The item in this creation is an elastic film for semiconductor wafer polishing equipment. It is a flat and thin round body, usually used in the semiconductor manufacturing wafer polishing process. It is installed on the inner side of the substrate holding ring of the polishing device, and uses the supply of air or other gases to make the film bulge toward the front side, pressing the single side of the wafer placed on the front side against the polishing pad. ;【Features of the creation】;From all views, this creation is a thin and flat round body with six small round holes on the front and double-circle folded convex concentric circles with different intervals in the middle at the back. The six small round holes expand at the back to form a circular concave part with an outer diameter that penetrates into the bottom of the folded convex ring at the back, while the outer periphery forms an outward-turned convex shape. The innovative design of the overall shape is the focus of the creation of this product.