TWD112955S1 - Stage arm for semiconductor wafer delivery apparatus - Google Patents

Abstract

Translated fromChinese

【物品用途】;本創作的物品是一種半導體晶圓輸送裝置之平台臂，經由背面的開口部、平台臂、以及右側面的開口部，來輸送半導體晶圓的平台臂；例如在一次一片片自動搬送半導體晶圓的自動搬送裝置(RGV)和半導體處理裝置之間，經由右側面的開口部、以及背面的開口部來輸送半導體晶圓的半導體晶圓輸送裝置之平台臂。;【創作特點】;本創作例如使用狀態參考圖所示，RGV是將使用其搬送臂(RGV臂)所搬送的半導體晶圓，經由右側面的開口部而藉由平台臂輸送且保持；例如，平台臂在前端部輸送半導體晶圓，且保持半導體晶圓；作為檢查半導體晶圓的半導體處理裝置的檢查裝置，是使用其搬送臂(裝置臂)來輸送被保持在平台臂的半導體晶圓，經由背面的開口部將半導體晶圓搬送到檢查裝置內；該平台臂係以上下方向等間隔的複數配置在裝置內，可保持複數個由自動搬送裝置或半導體處理裝置被搬送的半導體晶圓；平台臂是從裝置的左正面側角隅部水平延設在對角線方向，前端部為略圓盤狀；平台臂的前述略圓盤狀前端部的略中心，是位於本創作的左正面側角隅部和右背面側角隅部的對角線上的略中心；平台臂是在上下方向等間隔的設置8個。[Purpose of the Article]; The article of this creation is a platform arm of a semiconductor wafer transport device, which transports semiconductor wafers through an opening on the back, the platform arm, and an opening on the right side; for example, between an automatic transport device (RGV) that automatically transports semiconductor wafers one by one and a semiconductor processing device, the platform arm of a semiconductor wafer transport device transports semiconductor wafers through an opening on the right side and an opening on the back. ;【Features of the creation】; As shown in the reference diagram of the usage status of this creation, for example, the RGV uses its transfer arm (RGV arm) to transport and hold the semiconductor wafer through the opening on the right side by the platform arm; for example, the platform arm transports the semiconductor wafer at the front end and holds the semiconductor wafer; the inspection device, which is a semiconductor processing device for inspecting semiconductor wafers, uses its transfer arm (device arm) to transport the semiconductor wafer held on the platform arm and moves the semiconductor wafer to the inspection device through the opening on the back side. sent to the inspection device; the platform arm is arranged in multiple numbers at equal intervals in the vertical direction in the device, and can hold multiple semiconductor wafers transported by an automatic transport device or a semiconductor processing device; the platform arm is horizontally extended from the left front side corner of the device in the diagonal direction, and the front end is slightly disc-shaped; the approximate center of the aforementioned slightly disc-shaped front end of the platform arm is the approximate center on the diagonal of the left front side corner and the right back side corner of the present invention; 8 platform arms are arranged at equal intervals in the vertical direction.