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TW428298B - Manufacturing method and structure for 3D system on chip - Google Patents

Manufacturing method and structure for 3D system on chip

Info

Publication number
TW428298B
TW428298BTW88116072ATW88116072ATW428298BTW 428298 BTW428298 BTW 428298BTW 88116072 ATW88116072 ATW 88116072ATW 88116072 ATW88116072 ATW 88116072ATW 428298 BTW428298 BTW 428298B
Authority
TW
Taiwan
Prior art keywords
chips
chip
stacked vertically
manufacturing
electrically connected
Prior art date
Application number
TW88116072A
Other languages
Chinese (zh)
Inventor
Jian-Gau Shr
Shin-Bang Liu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW88116072ApriorityCriticalpatent/TW428298B/en
Application grantedgrantedCritical
Publication of TW428298BpublicationCriticalpatent/TW428298B/en

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Abstract

A 3D system on a chip (SOC) structure which comprises: a plurality of chips and a plurality of plugs arranged in each chip. Those chips are stacked vertically and comprise a peripheral circuit region respectively that the peripheral circuit region is configured with several contact pads respectively. The plugs are located in the chips and being electrically connected with the corresponding contact pad of the two chips which are neighbored and stacked vertically; and, electrically connected with the corresponding contact pad of the two chips which are not adjacent and stacked vertically.
TW88116072A1999-09-171999-09-17Manufacturing method and structure for 3D system on chipTW428298B (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
TW88116072ATW428298B (en)1999-09-171999-09-17Manufacturing method and structure for 3D system on chip

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
TW88116072ATW428298B (en)1999-09-171999-09-17Manufacturing method and structure for 3D system on chip

Publications (1)

Publication NumberPublication Date
TW428298Btrue TW428298B (en)2001-04-01

Family

ID=21642337

Family Applications (1)

Application NumberTitlePriority DateFiling Date
TW88116072ATW428298B (en)1999-09-171999-09-17Manufacturing method and structure for 3D system on chip

Country Status (1)

CountryLink
TW (1)TW428298B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7906849B2 (en)1998-12-212011-03-15Megica CorporationChip structure and process for forming the same
US7915734B2 (en)2001-12-132011-03-29Megica CorporationChip structure and process for forming the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7906849B2 (en)1998-12-212011-03-15Megica CorporationChip structure and process for forming the same
US7906422B2 (en)1998-12-212011-03-15Megica CorporationChip structure and process for forming the same
US7915157B2 (en)1998-12-212011-03-29Megica CorporationChip structure and process for forming the same
US7915734B2 (en)2001-12-132011-03-29Megica CorporationChip structure and process for forming the same
US7919867B2 (en)2001-12-132011-04-05Megica CorporationChip structure and process for forming the same
US7932603B2 (en)2001-12-132011-04-26Megica CorporationChip structure and process for forming the same
US8008776B2 (en)2001-12-132011-08-30Megica CorporationChip structure and process for forming the same
US8546947B2 (en)2001-12-132013-10-01Megica CorporationChip structure and process for forming the same

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