經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（丨） 技術範圍 本發明係關於電子封装姐合方面，特別是關於將至少一 主動或被動電子姐件（諸如一積體電路，電晶體，電阻器 或電容器）連接于導電（電路）構件例如一印刷電路板，一 電路模姐等用之各封装姐合。更特別者，本發明乃關於可 用于資訊處理糸統（電腦）環境中之該種封裝姐合。 本發明之背景 電子封裝組合設計之當前趨向，特別是供電腦方面使用 之各姐合，乃係提供一種高密度，高度接線能力及高度可 靠之组合，此種组合對形成電腦重要部份之各電路裝置提 供連接及互連。高密度及高度接線能力對于此種姐合在一 最小空間中提供一指定功能之所需性能乃屬必要。由于终 點產品之可能失效（設若此等裝置之重要誤接發生），高度 之可靠性殊屬重要。此外，為確保該系統之各不同姐件（ 即連接器，積體電路（晶片λ，各板，模姐等）之有效修理 ，升級及/或更換起見，所高度希望者為此等姐合在最後 產品之範圍内乃係可分離及重新連接，κ及能容忍灰塵及 纖維碎屑。在此等產品之製造過程中，此種能力亦屬需眉 ，例如使測試容易。 執行相似類型功能之其他方法現已可供使用，唯在功用 *性能及/或價格上有甚多限制、在一此種實例中，基片 為纖維玻璃加強之環氧樹脂所製之一典型印刷電路板、因 為用Μ將該封装组合插入一配合插座之各插腳係直接通過 該基片加上（通常使用扣固方法），須作多種折衷之處理 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） I. 裝 訂 -線 (請先閱讀背面之注意事項再填寫本頁i'': 經濟部中央標準局員工消費合作社印裝 A7 B7 五、發明説明（Z ) 。舉冽而言，因為各插腳突出伸過該基片之頂表面，大多 數電子及機械姐件必須位于沿該封装姐合周邊之各列插腳 所形成之邊界内。該基片之接線能力由于各插腳所需電鍍 貫通孔之較大直徑而有所妥協，此胆礙大量之可能接線通 道。再者，要求有一整列插腳之設計（不減少密集Μ形成 插腳之一周邊行列）乃屬非常困難，因為突出之各插腳將 妨礙除頂部表面上之最小組件Μ舛之所有配置，一封裝之 應用可能由于許多理由而欲有整列之插腳，包括需要更多 -ί. 之外部連接在内，希望將封裝姐合所用之空間減至最小， 及希望Μ信號或電源連接直接退出向下至印刷電路结構Μ 增進性能，與將此等連接成扇形出于基片之周邊然後退出 往下至印刷電路结構者相反。 執行相似功能之第二種方法實例涉及由已知材料例如礬 土或玻璃陶磁姐成之基片之使用，此種基片通常僅有一或 兩接線層，且在各組件相同之一側，與所揭露之本發明比 較，此種載體之限制事項為較高之成本，有限度之接線能 力（如前列實例中所述之相同理由）不能支持各插腳之整 區行列及此種玻璃或陶磁基之載體難Κ支援使用孔穴中插 腳（P i η - i η - h ο 1 e )插腳之事實。 執行上述功能之第三方法實例涉及由例如礬土或玻璃一 陶磁材料組成但通常具有多數接線層之一基Η之使用。此 種结構亦稱為多層陶磁模组。此種结構克服有限度接線之 限制，因其具有多個配線層Μ及用于連接裝置之單獨附加 插腳。此等插腳係附加（通常用銅銲）于（與延伸通過相 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） ：---------批衣------1Τ-------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（4 ) 反）基片之底部。但仍有上述之限制事項；主要包括此種 材料難以支持孔穴中插腳姐件之使用及遠為較高之費用（ 尤其是大於40毫米之尺寸）。 關於提供用Μ連接及互連各種不同電子組件於電路構件 之一種封裝姐合之各種技術，請參閱美國專利案第 5,036,431 號、5,155,955 號及 5,010,445 號。如從閱讀 此等專利荼可瞭解者，其中所敘述之技術包括許多上文中 所述之缺點，例如受限制之接線能力，不能支持一整個區 域行列之插腳，不能支持孔穴中插腳姐件之使用Μ及其他 例如較複雜之設計，製造費用不貲等事項。 在1 9 9 3年9月2 8日日頒佈發明名稱為”高密度連接器” (發明人：[_6.81153(^〇等）之美國專利案第5,248,262號 中，所述者為具有各導電接點之一種電連接器，包括將軟 性電路系统及一配合之彈簧裝置合併，適於用作本發明實 例中另件之各種接點。茲將已讓與本發明之同一受讓人之 第5 , 2 4 S , 2 6 2號專利案併列于此，Κ供參考。 相信能有效及可靠地連接主動及被動姐件於一電路構件 之封裝組合，其中此等連接乃可重複（即能迅易發生連接 及再連接）Μ及提供可自下文中說明看出之其他有利特點 者，構成本技藝中之重大進展。 本發明之揭露 因此，本發明之主要目的在提昇電子封裝姐合之技藝。 本發明之另一目的為提供一種能Κ有效及可靠方式連接 主動及被動電子姐件于一電路構件且如屬需要此種連接能 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） ^^衣 訂 線 . (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標隼局員工消費合作社印製 A7 B7 五、發明説明（4 ) 迅易分開及重接之電子封裝組合。 本發明之又一目的為提供一種製造相當廉價及設計較簡 單之此種組合。 根據本發明之一項特色，所提供者為一種用Μ電耦合至 具有許多第一導體之一導電構件之電子封裝组合。此種组 合包含一第一基片 > 該基片包括具有第一密度之電圖察在 其上之第一表面及具有較第一密度為少之第二密度電圖案 在其上之第二表面，在第一及第二表面上之電圖荼係Μ導 電方式互相連接，至少一電子姐件係電耦合至第一表面上 之電圖荼，及一第二基片包括具有許多第二導體在其中且 適合置于該導電構件上之一介質構件，第二基片之各第二 導體中選出之導體係耦合至具有與第二密度相似密度之第 一基片之第二表面上電圖案，當第二基片置于其上時，各 第二導體乃適合電耦合至第一導電構件之個別導體。 圖式之簡單說明 圖1為根據本發明之一特色之一種封裝組合之透視圖。 圖2為圖1之姐合截面及用較大比例尺之部份正視側面 圖。 圖3例示根據本發明另一具體實例之一種组合截面並用 較圖1中所示者為大之比例尺之部份正視側面圖。 實施本發明之最佳模式 為對本發明速同其他及進一步之目的，優點及其能力有 較佳之瞭解起見，請參閱與上述圖式有關之下列說明及所 附之申請專利範圍。 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） 裝 訂 ，線 (請先閱讀背面之注意事項再填寫本頁) A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（3·) 在圖1中所示者為根據本發明之具體實例，用Μ電耦合 至一導電構件40之一種電子封裝姐合1 0，封裝组合1 0包含 一第一基片2 0，包括至少一個（及較佳者為多個）第二導體 3 1之第二基片3 0 Κ及至少一個（及較佳者為數個）電子組件 11° 就第二基Η之術語而言，乃意在界定具有一個或多個導 電元件（例如第二導體）之一片絕緣材料，該基片可視具體 實例而定Κ不同之形體要素予Κ完成。實例可包括保持一 個或數個插腳之一介質層（該介質層與插腳之組合在本技 術中亦稱為插腳列頂蓋P i η η e d a r r a y h e a d e r )，與此種介 質/插腳實例相似之一組合，唯該介質層亦可包括另增之 電路元件，諸如線路，櫬墊，導電通路，電鍍之貫通孔等 K提供另增之接線能力及/或功能性，及第三，用于一區 域行列插入物式樣之連接器之外罩。可瞭解者為使用于此 等實例之第二導體可大為不同，視第二基片（3 0)之各自如 何完成而定。 圖2中所見者為切開封装總成1 0之更詳細舉例說明。第 一基H20包括具有第一密度之電圖案23在其上之第一表面 2 2及具有較第一密度為少之第二密度之電圖案2 5在其上之 第二相反表面2 4。 ”密度” 一詞乃意指線性密度（即一姐件或特徵圖察例如 一列襯墊之在直線方向每吋輸入/输出（Ί / 0)接點之數量 )。在一典型實例中，本技藝中稱為線姐平坦襯墊之一組 件通常位于第一表面2 2上者可有導電引線在其四邊之每一 ~ 8 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210乂 297公釐）Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (丨) Technical Scope The present invention is related to electronic packaging, especially the integration of at least one active or passive electronic component (such as an integrated circuit, Transistors, resistors, or capacitors) are connected to conductive (circuit) components such as a printed circuit board, a circuit mold, and the like. More specifically, the present invention relates to such a package that can be used in an information processing system (computer) environment. BACKGROUND OF THE INVENTION The current trend in the design of electronic packaging combinations, especially for computer applications, is to provide a combination of high density, high wiring capability, and high reliability. This combination is important for forming important parts of computers. Circuitry provides connectivity and interconnection. High density and high wiring capability are necessary for such a unit to provide the required performance in a minimal space. Due to the possible failure of the end products (provided that important misconnections of these devices occur), a high degree of reliability is particularly important. In addition, in order to ensure the effective repair, upgrade and / or replacement of the various components of the system (i.e. connectors, integrated circuits (chip λ, boards, molds, etc.), it is highly desirable for these sisters Closing within the scope of the final product is detachable and reconnectable, kappa and can tolerate dust and fiber debris. In the manufacturing process of these products, this ability is also needed, for example to make testing easier. Perform similar types Other methods of function are available now, but there are many restrictions on function * performance and / or price. In one such example, the substrate is a typical printed circuit board made of fiberglass reinforced epoxy resin. Since the pins of the package assembly inserted into a mating socket with M are directly added through the substrate (usually using a fastening method), a variety of compromises must be made. This paper size applies the Chinese National Standard (CNS) A4 specification ( 210X 297mm) I. Binding-Thread (Please read the notes on the back before filling in this page i '': Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 5. Invention Description (Z). Because the pins protrude beyond the top surface of the substrate, most electronic and mechanical components must be located within the boundary formed by the rows of pins along the periphery of the package. The wiring capability of the substrate is due to the plating of the pins. The larger diameter of the through hole compromises, which prevents a large number of possible wiring channels. Furthermore, the design of a whole row of pins (without reducing the number of dense rows forming one of the pins) is very difficult because of the prominent The pins will hinder all configurations except the smallest component MZ on the top surface. The application of a package may require a whole series of pins for many reasons, including external connections that require more-. I hope that the package is suitable for use The space is minimized, and it is desired that the M signal or power connection exits directly down to the printed circuit structure M to improve performance, as opposed to connecting these fan-shaped out of the periphery of the substrate and then exiting down to the printed circuit structure. An example of a second method of similar functionality involves the use of substrates made of known materials such as alumina or glass ceramics. Such substrates are usually only One or two wiring layers, and on the same side of each component, compared with the disclosed invention, the limitations of this carrier are higher costs and limited wiring capabilities (for the same reasons as described in the previous examples) ) Cannot support the entire area of each pin and the fact that this glass or ceramic magnetic carrier is difficult to support the use of pins in the hole (P i η-i η-h ο 1 e). A third method example of performing the above function Involved in the use of, for example, alumina or glass-ceramic magnetic materials, but usually has one of the most wiring layers. This structure is also known as a multilayer ceramic magnetic module. This structure overcomes the limitations of limited wiring because it has multiple Wiring layer M and separate additional pins for connecting devices. These pins are attached (usually by brazing) to (and extend through the paper size apply the Chinese National Standard (CNS) A4 specification (210X 297 mm)):- ------- Approve clothes ----- 1T ------- line (please read the precautions on the back before filling this page) Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 5 2. Description of the invention (4) Anti) substrate The bottom. However, there are still the above-mentioned restrictions; mainly including that this kind of material is difficult to support the use of pin inserts in the cavity and the cost is much higher (especially the size greater than 40 mm). Please refer to US Patent Nos. 5,036,431, 5,155,955, and 5,010,445 for various technologies that provide a package that connects and interconnects various electronic components with circuit components. As can be understood from reading these patents, the technology described therein includes many of the disadvantages described above, such as limited wiring capabilities, cannot support pins in an entire area, and cannot support the use of pin pieces in holes. Μ and other matters such as more complex designs, not expensive manufacturing and so on. In U.S. Patent No. 5,248,262, entitled "High-Density Connector" (inventor: [_6.81153 (^ 〇, etc.)], issued on September 28, 1993, the invention name is An electrical connector of a conductive contact includes a combination of a flexible circuit system and a mating spring device, and is suitable for use as various contacts in the example of the present invention. The same assignee as the present invention has been given No. 5, 2 4 S, 2 6 2 are listed here for reference. K is believed to be able to effectively and reliably connect the active and passive components to a circuit assembly package, where these connections are repeatable (ie Connection and reconnection can occur quickly) and providing other advantageous features that can be seen from the description below constitutes a significant advance in the art. Disclosure of the Invention Therefore, the main purpose of the present invention is to improve electronic packaging Another object of the present invention is to provide an efficient and reliable way to connect active and passive electronic components to a circuit component and if such connection is required, the paper size applies the Chinese National Standard (CNS) A4 specification ( 210X 297 mm) ^^ Thread. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of the invention (4) Quickly separated and reconnected Electronic packaging combination. Another object of the present invention is to provide such a combination which is relatively cheap to manufacture and simple in design. According to a feature of the present invention, the present invention provides an electrical coupling with M to one of a plurality of first conductors. Electronic package combination of conductive members. This combination includes a first substrate > The substrate includes a first surface having an electric map having a first density thereon and a second density having a second density less than the first density. The second surface on which the pattern is on, the electrograms on the first and second surfaces are electrically connected to each other in a conductive manner, at least one electronic component is electrically coupled to the electrogram on the first surface, and a second The substrate includes a dielectric member having a plurality of second conductors therein and adapted to be placed on the conductive member. A conductor system selected from each of the second conductors of the second substrate is coupled to a first substrate having a density similar to the second density. Katano The electric pattern on the two surfaces, when the second substrate is placed thereon, each of the second conductors is suitable as an individual conductor electrically coupled to the first conductive member. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a feature according to a feature of the present invention. A perspective view of the package assembly. Fig. 2 is a side view of the sister cross section of Fig. 1 and a part with a larger scale. Fig. 3 illustrates a combination cross section according to another embodiment of the present invention. A large scale portion is a front view of the side. The best mode for carrying out the present invention is to better understand the present invention, for other and further purposes, advantages and capabilities, please refer to the following descriptions related to the above drawings and The scope of the attached patent application. This paper size applies to Chinese National Standard (CNS) A4 size (210X 297mm) binding, thread (please read the precautions on the back before filling this page) A7 B7 Employees of Central Bureau of Standards, Ministry of Economic Affairs Printed by the cooperative V. Description of the invention (3 ·) The one shown in FIG. 1 is an electronic package which is electrically coupled to a conductive member 40 with M, according to a specific example of the present invention. The assembly 10 includes a first substrate 20 including at least one (and preferably a plurality of) second substrates 3 0 of the second conductor 31 and at least one (and preferably several) electrons. Module 11 ° In terms of the second base, it is intended to define a piece of insulating material with one or more conductive elements (such as a second conductor). The base may be different depending on the specific examples. carry out. Examples may include holding a dielectric layer of one or several pins (the combination of the dielectric layer and the pins is also referred to in the art as the pin column top cover P i η η edarrayheader), a combination similar to this medium / pin instance However, the dielectric layer can also include additional circuit components, such as lines, pads, conductive paths, plated through holes, etc. K provides additional wiring capabilities and / or functionality, and third, for a region Cover for connector of insert style. It can be understood that the second conductors used in these examples may be greatly different depending on how the respective second substrates (30) are completed. Seen in Figure 2 is a more detailed example of a cut-out package assembly 10. The first base H20 includes a first surface 22 having an electric pattern 23 having a first density thereon and a second opposite surface 24 having an electric pattern 25 having a second density less than the first density thereon. The term "density" means linear density (ie the number of input / output (Ί / 0) contacts per inch in a straight line of a row of pads or feature maps such as a row of pads). In a typical example, one of the components referred to in the art as a flattened flat gasket is usually located on the first surface 2 and may have conductive leads on each of its four sides ~ 8-This paper size applies to Chinese national standards (CNS ) A4 size (210 乂 297mm)
Iri±衣-- (請先閱讀背面之注意事項再填寫本頁) 訂 '線 經濟部中央標準局員工消費合作社印製 A7 ^__ __B7 五、發明説明（t) 邊上約0 . 〇 2 0至〇 ‘ 0 2 5吋之中心處。但在第二表面2 4上之~ 列插腳。可用Μ附加于第二基片3 0中之第二導體3 1，然後 插入于導電構件40之第一導體41中者，通常可在0.100吋 之中心點上（例如在所請X及γ之方向中）。 可包括一或更多線路及/或襯墊系列之在第一表面2 2上 之電圖案2 3 ’旨在提供一或多個電子組件11間之互連。此 種連接亦可使用内部電路元件例如内部線路（2 6 )，導電通 路（2 8 )，電鍍，貫通孔（2 9 )等達成。 電子組件11可有不同之種類及结構要素，雖然主要位于 第一基片20之第一表面22，亦可位于第一表面22，第二表 面2 4及甚至沿第一基片2 0周邊之住何姐合上，電子組件 11之實例包括電阻器，電容器，電晶體，裸露之半導體， 在包封中之半導體（例如線姐平坦襯墊及雙重内線封裝） Μ及封裝在多晶片載體上之各半導體，此等組件11根據其 如何附加于基片可有三種一般结構要素（Α)孔穴中插脚 (Β )表面安裝及（C )直接-晶片-附加（包括引線接合及 倒裝附加）。各姐件11可用本技術中已知之方法諸如銲接 ’導電黏附，引線接合及銅銲附加于表面2 2上電圖案之一 。封裝姐合1 0亦可提供納入機械組件例如連接器，散熱座 及致動/夾緊裝置之支持。雖然封装姐合1 〇之主要目的為 提供自一或多個電子姐件1 1至一導電構件例如印刷電路板 ’電路模姐等等信號與電源連接，須瞭解者為此種姐合亦 能提供組合1 0上之各组件間之信號與電源連接。 在第一基片2 0之第二表面2 4上之電圖案2 5亦可包括一或 本紙張尺度適用中國國家標準（CNS ) Α4規格（210 X 297_公釐） I 裝"" II —訂—_ I I -線 (請先閱讀背面之注意事項再填寫本頁} 經濟部中央標準局員工消費合作社印製 A7 _________ B7 五、發明説明（7) 更多線路及/或襯塾2 7糸列者乃主要由旨在提供自第—基 Μ 2 0至位于第二基片3 0中之第二導體3 1之直接電接點之襯 塾糸列2 7姐成。電圖察2 5亦可提供至自第一基片2 0之第二 表面2 4上之一或數電子組件及來自等組件或在其間之互連 ’設若此等組件係位于該表面上（未顯示于圖2中，但可能 與表囬2 2上各組件相似）。 第—基片20之兩表面22與24上各電圖案間之互連，（Κ 及任何另增内部層之互連）宜使用内部線路2 6，襯墊2 7， 導電通路28及/或電鍍貫通孔29達成之。 在—較佳之具體實例中，第一基片2 0為介質材料2 1例如 纖維玻璃加強之環氧樹脂製成之一印刷電路板。上述之環 氧樹脂可為T e f 1 〇 η (台特威爾州威明頓市杜邦化學公司之 商標]’ K a p t ο η (台特威爾州威明頓市美國杜邦公司之商 標）或ϋ p i 1 e X (台特威爾州威明頓市1(：1美國公司之商標）。 如前所述之第一基片2〇上及其内之電圖察（供給至第一基 Η 2 0及其內之大部份互連者]乃由導電材料例如銅（或相 似之金屬材枓包括諸如銅之合金，鋁等以及其他材料例如 導電油墨等）姐成。重要者，銅為電圖荼之宣採用材料’ 因為較之其他通用之材料，铜之電與熱阻率較低。在其他 實施例諸如Μ陶瓷為基礎之基Η中，此等水平與垂直之連 接亦可存在，但大多數乃Μ不同之装置及材料實連接。 重要者，玻璃纖維加強之環氧樹脂對于許多用3^具有較 多種其他介質材料為佳之若干優點，因其較之此等其他材 枓為廉價，同時經由使用精细之線式電路（^卩5夾$之印刷 -10 - 本紙張尺度適用中國國家標隼（CMS ) Α4規格（210Χ297公釐） I---------1------ΐτ------,線 - - (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消費合作社印策 κι Β7 五、發明説明（次） 電路線路及空間，連同小直徑導電通路與電鍍貫通孔）可 有極高之接線能力。此外，玻璃纖維加強之環氧樹脂卡片 或板容易容納各種電子姐件Μ及機械组件之多種不同结構 要素，包括：U)孔穴中插腳（b)表面安裝及U)直接一晶 Η —附加（：Μ包括引線接合及倒裝片附加之已知方法實施 )。此為優于陶瓷基載體之一重大利益。此外 > 第一基片 2 0可提供電力及信號分佈之卓越性能，因其具有可供其使 用之典型印刷電路结構之所有優點與能力。 在本發明之一實例中，第一基片20可具有各為2 . 0吋之 寬度與長度尺寸（” WF S ”，圖1 )。此基片亦可具有僅約 0 . 0 6 2时之厚度尺寸（” T F S ”，圖1 )。 電子封裝姐合1 0另包括一第二基片3 0，在本實例之較佳 實施中，該基片亦係由纖維玻璃加強之環氧樹脂製成，具 有與第一基片2 0大體上相同之熱膨脹係數，並包括至少一 (宜有多個）第二導體31。重要者，第二基Η30之熱膨脹 係數宜儘可能接近第一基Η 2 0之熱膨脹係數，因而確保整 個電子封裝组合1 0之機_完整性c第二基片3 0另包括插入 于其中之至少一個及較佳者為一列之第二導體3 1。 在此較佳實例中，第二導體3 1為單獨之插腳，可用本技 藝中熟知之方法Μ摩擦方式置于第二基片3 0之各開口中。 在一實例中，可使用總共為丨6 〇個之此種插腳。由導電材 料例如黃铜或磷青銅製成及包含一頭部3 2，一本體3 3及一 尾部3 4之第二導體3 1可用一螺釘機製成之。頭部3 2宜為圓 形，包括一平坦之頂面及具有較放置此導體于其中之開口 -1 1 - 本紙張尺度適用中國國家標隼（CNS ) Α4規格（210 X 297公釐） 1 裝 訂 線 (請先閱讀背面之注意事項再填寫本頁) A7 B7五、發明説明（I) 經濟部中央標準局員工消費合作杜印製 稍大之直徑。本體3 3通常包括芒刺，槽溝或在另一表面上 之脊（未圖示）Μ在該本體一巨插入第二基片3 0之開口中時 提供第二導體之較佳保持力。尾部3 4通常為光滑及具有均 勻一致之直徑Μ利插入于電鍍貫通孔或插腳柵列插座（圖 2 )中。 在本發明之一實例中，第二基片3 0可具有各為約1 . 7吋 之寬度與長度尺寸Γ VS S ”，圖1)。此基片亦可具有僅約 0 . 0 6 2吋之厚度尺寸（” TS S ”，圖1)，因此，第二基片在全 部尺寸上可能多少較基片2 0為小，及宜有同樣之厚度。 應注意者，雖然在圖2之實例中，第二基片3 0上及/或 其内部並無電圖案（如同第一基片2 0所具有者），但使用所 述之内及/或外圖案仍在本發明之範圍内。 在一較佳之具體實例中，在第二基片30内第二導體31之 頭部3 2，係在第二基片3 0之上表面（3 8 )升起，如圖2中所 示。此係在可能使用銲接法之装配期中，用Μ防止污染物 之誘陷及有助于汚染物之移除。在其他具體實例中，頭部 3 2可被安装成與表面3 δ齊平或稍低于該表面，Μ增進本發 明之諸如簡化個別裝配過程等之特色。頭部3 2之直徑可隨 用途之不同而改變或甚至在一項用途内改變Μ配合特殊之 需要。藉增加頭部3 2與第一基片2 0間之接點面積可使較大 直徑之頭部3 2更容易或更堅定附著于第一基片。但較小直 徑之頭部3 2可增進在第一基片2 0之第二表面2 4之電圖案上 各電路之接線能力。 如若使甩第二導體3 1之稀疏行列（例如僅有2 8 9個插腳 -12 - ----------坤衣------1Τ------,線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Α4規格（2丨Ο X 297公釐） 經濟部中央標準局員工消費合作社印製 A 7 B7 五、發明説明（Γ ) 計數列（如在1 7 X 1 7之圖案中）之外列）*第二基片3 0之中 心部份可移除Μ使另增之姐件1 1得以置于第一基片之第二 表面2 4上。此許可真正之立體電子封裝。 在一較佳具體實例中，第二基片3 0協助保持在第二導體 3 1整列上之尾部3 4之一致間隔及頭部3 2頂表面之一致高度 。前者有助于確保第二導體3 1至導電構件40之第一導體 4 1之成功連接，而後者則有肋于第二導體3 1附加于第一基 片20之第二表面24上之電圖案。 _ 在第二基片30中之第二導體31可用夾緊裝置（未圖示）附 加于電圖案2 5上之襯墊2 7，但Μ更永久性之方法例如銲接 ，導電黏附或銅銲附加為宜。在一較佳之具體實例中，則 使用銲接法。重要者可見將第二基片3 0納入作為各單獨第 二導體3 1之載體大為增強電子封裝姐合1 0之製造能力，因 其許可所有之第二導體3 1被附加于第一基片2 0作為單一表 面安装姐件。較佳者，導體3 1係同時附加作為表面安裝组 件11，例如，使用雙邊，雙通紅外線銲接回流之已知方法 。為進一步協助此種裝配法起見，宜許可第二基片之至少 一部份並無第二導體3 1，因而有利于使用装配設備（例如 一檢取及安置工具）之處理。 殊屬重要之事為記住代替第二導體3 1通過第一基片附加 時，如在許多先前结構中所述者，電子封装姐合1 0許可各 電子姐件1 1之安置而與此等第二導體之位置無關。 電子封裝組合1 0與導電構件4 0之互連係預定主要由第二 基片3 0之第二導體3 1電耦合至導電構件4 0内之第一導體 -13 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） (請先閱讀背面之注意事項再填寫本頁) -裝_ *1Τ 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（I丨） 4 1達成之，此等相互連接可用永久性之各種不同方式（銲 錫，導電性糊膏等），但K現場可分開為宜。現場可分開 一詞乃用以表示能Μ高度之可靠性將已離開製造位置及可 能在他處使用中之電子装餚之兩個單獨另件拆開，然後重 新連接。 第二導體3 1及第一導體4 1之付諸實用殊視互連是否為永 久性或現場可分開形式而定、如若此等導體為永久性互連 ，第二導體3 1可包含插腳（可能覆Μ銲錫），銲錫球狀體 ，銲錫突出等，而第一導體4 1可包含印刷電路墊，銲錫箕 ，銲錫突出等。如若此種互連為現場可分開式，第二導體 3 1可包含插腳（較佳者在其用以達成接點之至少一部分上 鍍Μ抗牲完全導電之金屬材料例如鏡，金，銀，鈀等）， 在一内置式連接器中之導電接點構件等，而第一導體4 1則 可包含設計成配合此等插腳或接點用之插座。 在一現場可分開结構之較佳實例中，在第二基片3 0中之 第二導體3 1糸列乃在約0 . 1 0 0时之各中心上，（例如在將 提及之X及Υ方向中）並係預定與在插腳柵列插座（較佳者 為零插力型）中第一導體4 1系列對準及置于其内。此種插 座（例如圖2中所示者）係電連接（較佳者經由如銲接之方 法）至導電構件4 0 (例如為板，卡Η或橫组之印刷電路结 構），因而完成電子姐件1 1對導電構件4 0之相互連接。 可能者為如若第二基片3 0係非常之薄（即0 , 0 0 5厚之 K a ρ t ο η層），一俟第二導體3 1已附加于第一基Η 2 0，此層 即可移除：.不過，通常並不建議使用此種结構于電子封裝 -14 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） I----------私衣------ΪΤ-------線 (請先閱该背面之注意事項再填寫本頁) Α7 Β7 經濟部中央標準局員工消費合作社印製 五、發明説明（) 組合1 0由于銲接點之.可能疲勞及導體3 1之可能彆曲而須重 複插入于導電構件40及自其移除之各用途中，為進一步增 強電子封装姐合1 0之連接性，可用設置及電耦合至電圖案 2 3及2 5上之連接器或電纜（未圖示）完成另外之互連。 可如何使用電子封裝姐合1 0之一實例為許可在其表面安 装包封中之一特定組件與作為其插腳柵列型相同插梢 (P i η 〇 u t:)相匹配之，此賦予電子封裝姐成1 0許可表面安裝 姐件與在印刷電路结構上之插腳柵列插座向相容”之能 力。由于許多理由，包括一組件之插腳柵列型並非立即可 用，插腳柵列型過于昂貴，或希望代Μ —高級替換物（較 佳性能，低功率耗損，低價等）使一現用電路升級而仍保 持插腳相容性等情況，上述之结構乃吾人所欲者。 電子封装姐合1 0可有對電子系統例如個人電腦之製造商 之另一益處。電子糸統製造商之通常作業為除設計以提供 相同或相似功能之一升级插座外，將一低功能，較低成本 之表面安装積體電路（例如一微處理機）銲接于一糸統板 。以提供相同或類似之功能。如若電子封裝姐合1 0之成本 較低，製造商可將原來之表面安装積體電路封裝于此種電 子封裝姐合上Μ獲致利益，因為此一作法可在系统板上得 回有價值之不動產Μ及有助于製造商實現依定購製造 (built to order)策路。 雖然未特別顯示，電壓調節裝置可包括於第一基片2 0 Μ 進一步增強電子封装组合1 0之能力。此種應用對電腦工業 之一範例為用Μ支援個人電腦中3 . 3伏（或其他之非5汰 -15 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） I---------裝-- (請先閱讀背面之注意事項再填寫本頁) 訂 線 經濟部中央標隼局員工消費合作社印装 A7 B7 五、發明説明（G) )之半導體。在許多個人電腦中之電力Μ應有5伏特之輸 出。因此，包括電壓調卽Ρ 3于電子封装姐合1 0上許可使 用較新之3 . J Ρ特半導體于現有糸统中。此外，該調節裝 置可使電子封裝組合1 0得Μ同時支持各種具有不同電壓需 求（例如3 · 3及5伏特），而僅需單一電壓（例如5伏特 )输出之半導體。此可經由包括及使用一或更多之電壓水 平面（未圖示）于第一基片2 0中達成之而無電力分布性能之 降格/、電壓調節裝置可用本技藝中熟知之數種不同方法包 --·乂 括作為線性或開關調節器電路付諸實施、在一較佳實例中 ，開關調節器宜予採用，因其具有較高效力及因而散逸較 少功率（及熱）。 圖2中所示電子封裝组合1 0之互連型式對于擬用作一升 级單位Μ插入在現有導電構件4 0上所存在之插腳柵列插座 之各用途工作良好。就新近發展之用途而言，為克復典型 之插腳柵列插座之若干限制（如提供導體于遠小于0 . 1 0 0 吋乘0 . 0 5 0时柵列上之各導體之能力）可能欲使用連接一封 裝姐合之不同方法。此種方法敘述于有關圖3之說明中。 在圖3中*第二基片6 0 (包括第二基體6 1 )為插入物 (i n t e r p a s e r )式樣，此種基片之一實例敘述于美國第 5 , 2 4 8 , 2 6 2號中，特併列于此Μ供參考。此外，除保持上 述之一插腳列頂蓋之優點Κ外，圖3之賁例具有若干其他 優點。此等優點包括支持全部區域行列連接于遠較0 . 1 0 0 时為密之柵網上之能力，可能更佳之導電性能，較簡單之 裝配與再工作（因為各連接器裝置可夾置于第一基Η20, -16 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） I^衣 訂 矣 * (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 _____ 五、發明説明（丨4 代替永久性附加）而仍許可與導電構件4 0之介面為現場可 分開者。 在圖3中，所示之封装組合5 0包括一第一基片2 0，其中 包括至少一個第二導體6 1 (以多個為宜）之一第二基片6 0及 至少一（較佳者為數個）電子姐件1 1。 第一基片20宜與圖2中之基片20相似，及因而包括具有 第一密度之電圖案23在其上之第一表面22，以及具有較第 —密度為少之第二密度之電圖案25在其上之第二相反表面 25 〇 電子封裝總成50另包括一第二介質基片60及其中之一列 第二導體61。在此實例中，第二基片60及第二導體61係用 作一區域行列插入式連接器。此種連接器可有許多不同方 式付諸實施。在一實例中，可使用一介質彈性體，該介質 彈性體包括在其中之多個導電路徑，例如小直徑之導線， 小導電軌跡，或多或少之導電（或導電性電鍍）材料柱狀糸 列，Μ提供所需之互連。在另一實例中，形成一極精细（ 典型者為0 . 0 0 1至0 . 0 0 2吋直徑）鍍金線，典型者為例如碘 化銅，銅一銀或I目材料製成及將其壓縮成為一”電紐狀’’ 接點，插入于該介質基片中均勻一致間隔開口糸列之一中 0 在圖3之實例中，此為本發明之一較佳實例，第二基片 6 0用于數種功能，包括作為第二導體6 1之保護外套，及用 Μ保持及使第二導體6 1定向之结構，Μ確保組合5 0之適當 對準，接合及成功之連接。如上所述，對基本6 0及導骨豊 -17 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） I 裝 訂 線 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（（Γ) (31之進一步敘述，見美國第5,2 4 8，2 (5 2號專利荼。 第二基片6 0 (參閱圖3 )之一或數部分乃係宜Μ電絕緣物 · ，例如塑膠材料，模製之且大體上宜為長方形組態’在本 發明之一實例中，第二基片6 0可具有約2 · 3吋之寬度（未 ’ 圖示）及僅約〇 . 1 9 0吋之合併厚度。用於第二基片6 0之較 佳材料為塑膠*此種材料之適當實例為Vectra(Hoechst C e 1 a n e s e公司之商標）’ R y t 〇 η (菲力浦石油公司之商標） ，S分及聚酯。 第二基片60宜包括供每個配合導體61用之至少一细長電 絕緣定位構件6 4，每一定位構件6 4宜有下列之一橫斷面’ 即此橫斷面在其重直邊之一有多少外凸之形狀（如圖示）’ 在其相反之一邊則有大體上之凹入形狀，且係由聚合物材 料製成（此種材料之適切範例為上述之Vectra，Ryton， P h e η ο 1 i c及聚酯）。基Μ 6 〇宜以例如模製或擠壓加工之方 法製成*並由夾緊終端另件（未圖示）保持于其位置中。此 種夾緊结構可簡單包括一 C _形夾或類似者以接合在構件 20及40上之各自表面。進一步之說明似無必要。鄰接之定 位構件6 4形成一糸列預加應力位置6 5 ’ 一導體6 1可佔領每 一預加應力位置。電絕緣定位構件6 4乃設計為最初在兩個 外定位表面6 6及一內定位表面6 7接點各第二導體6 1 ’使第 二導體6 1稍為偏斜，及因而保持此等導體于一定心’稍為 彎曲之自由浮動位置°每個第二導體6 1係由摩擦力保持于 三個接點點表面（6 6及6 7 )與彎曲之第二導體6 1之間。此權 .稍為彎曲之形式預置第二導體61之彎曲方向’故在促動電 -18 - __-- 本紙張尺度適用中國國家標準（CNS ) Α4规格（210Χ297公釐） (請先閱讀背面之注意事項再填寫本頁) -裝· 訂 Α7 Β7 經濟部中央標準局員工消費合作社印製 五、發明説明（ώ) 子封裝姐合5 0之期間，所有第二導體6 1在相同之方向偏斜 。此外，每一定位構件6 4之外表面6 6及與其緊鄰之鄰接定 位構件6 4之有點凸出形吠部分界定隙孔6 8，通過該孔之每 個第二等體61之各自相對端部62及63向外突出于該基片之 介質。 在一較佳實例中，第二導體6 1可為例如鈹銅之導電材料 且可由例如衝壓或蝕刻之方法單獨形成或作為一較大群之 另件（例如形成作為一軟性電路部分之一列導體）。皴-銅為第二導體6 1之較宜採用材料，因其執行第二導體6 1之 電功能（例如供給導電路徑）同時亦提供其機械功能，因而 免除隔離彈簧裝置之需要。較佳者，第二導體61(或至少 相對之端部6 2及6 3 )係鍍K抗蝕及純粹之導電材料例如鎳 ，金’銀，鈀等。 在一較佳實例中，在第二基片6 0中之第二導體6 1糸列係 在X及Y尺寸中之各0 . 0 5 0时中心上，雖然甚至更小之中心 至中心距離乃屬可能。第二導體6 1之尺寸可改變Μ符合特 定之機械及導電參數。在一實例中，第二導體6 1係由皴-銅製成並具有0.200吋之長度，0.030吋之寬度及0.002 吋之厚度。 重要者，機械上用作扣梁之圖3中之第二導體6 1，許可 在垂直順應之寬廣範圍上作窄範圍接點力之斟酌、舉例而 言，在一實例中，大于0 . 0 2 0吋之垂直順應範圍係Μ力量 之百分之十Μ下改變達成。作為比較，典型之區域行列連 接器具有在1 0 0 - 3 0 0 %力量變化上小于0 . 0 1 0吋之可用垂直 -19 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） I---------裝-- (請先閱讀背面之注意事項再填寫本頁) 訂 線 Α7 Β7 經濟部中央標準局員工消费合作社印裝 五、發明説明（（Ί) 順應範圍。此外，對第二導體6 1使用扣梁式彈簧裝置可便 第二導體6 1之長度得K減少°此可增進電（自一信號與電 力載荷觀點而言）及熱之特性。 須注意者，幾乎立即在最初接點導電構件4 0上之第一導 體4 1及第一基片2 0之第二表面上之電圖察2 5後，第二導_ 6 1之相對端部6 2及6 3係處于最大之力量中。及在其餘之致 動期間，大體上保持相同之力量。此外，因為第二導體 6 1不总..過度驅動Μ獲致每一接點之最大力量（此可能為具 有較大力量變化之各導體之情形）第二導體6 1能將在導雩 構件4 0上不必要之夾緊力減至最小。 如上所述，電子封装組合5 0與導電構件4 0之互連係由在 第一基片20的第二表面24之電圖案25上之接點墊27電耦合 至第二導體6 1之端部6 2，及第二導體6 1之端部6 3電耦合至 設在導電構件4 0上之第一導體4 1 (例如銅襯墊）達成之。 雖然僅需一現場可分離介面使一組合成為可現場分離’在 本實例之較佳實作中，第二導體6 1兩端之介面乃可現場分 離，因而如屬需要，得Μ使第二基片6 0 (及第二導體6 1) 作現場替換。 上述各介面之對準係利用一對自基片（例如2 0 )延伸之突 出銷（未丽示）提供，此兩銷乃與其他基片（例如6 0 )及導體 40内之對應開口（未圖示）對準及位于其内。應瞭解者使用 對準之其他装置乃屬可能，包括提供自導體構件4 0伸出及 插入基體6 0與2 0内對應開口之各銷。雖然電子封裝組合 5 0及導電構件40之致動裝置未予特別顯示，所瞭解者，此 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1 裳 訂 線 ί請先閑讀背面之注意事項再填寫本頁j 經濟部中央樣準局員工消費合作社印聚 Α7 Β7 等裝置可由本技藝中熟知之數種方法例如夾緊，如上所述 者完成之。 第二基片6 0 /第二導體6 1姐合之功能可由在第二導體 6 1之相對端部6 2及6 3上包含穿透式接點之幾何形體例如樹 枝狀元件（未圖示）藉接點之重複部分增加各連接之可靠性 而予Μ增強，此一功用復可減少接點電阻，熱散逸及操作 時各接點之溫度。此外，樹枝狀元件可突破可能存在于各 導體上之灰塵，薄膜及纖維碎屑，如對導電構件4 0所示者 。此種樹枝狀元件可用美國第5 , 237 , 743號專利寒所教導 之方式設在突出之端部6 2及6 3上。此等元件亦可用加拿大 專利案第1 , 1 2 1 , 0 11號所述之方式在導體2 7，4 1及插腳 3 1之所選部份（例如頭部3 2)上形成。上述之兩專利察亦併 列于此Μ供參考。 為進一步加強電子封裝姐合50之連接性，另加2 5速可 用設置及電耦合至電圖案23及25上之各連接器及胃胃胃成 Ο 雖然未予Κ特別顯示，為再增強電子封裝姐合5 0 έ 量 ，可將電壓調節裝置Μ圖2中實例所述之相似方式包含于 第一基片2 0上進一步之說明似無必要。 因此，本文已顯示及敘述一種能有效及可靠地連接不同 種類及结構要素之主動與被動電子姐件（以及支持之機械 元件）于一電子電路構件之電子封裝組合，其中此種連接 可重複實狍（即連接與再連接可迅易發生）者。本發明係 Μ較低之費用製造，亦屬較簡單之設計，並提供自上列說 -21 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） I---------^-- (請先閱讀背面之注意事項再填寫本頁) 、«! 線 五、發明説明（ 9 A7 B7 ’ 修 明與 說變 及改 示項 顯各。 M作圍 予中範 例其之 實在定 佳可界 較言中 。之而圍 色明士範 特發人利 利本之專 有為術請 他認技申 其前本附 干目諳所 若對熟離 之已于背 見然對不 可雖然而 明 顯正 I--------批衣------II------.^ (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）Iri ± clothing-(Please read the precautions on the back before filling this page) Order 'Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economy A7 ^ __ __B7 V. Description of the invention (t) About 0. 〇2 0 To the center of 0 '0 2 5 inches. But on the second surface 24, the ~ rows of pins. It can be attached to the second conductor 31 in the second substrate 30 and then inserted into the first conductor 41 of the conductive member 40, which can usually be at a center point of 0.100 inches (for example, in the X and γ requested) Direction). The electrical pattern 2 3 ′ on the first surface 22, which may include one or more lines and / or pad series, is intended to provide interconnection between one or more electronic components 11. Such connection can also be achieved using internal circuit components such as internal circuits (2 6), conductive paths (2 8), plating, through holes (2 9), and the like. The electronic component 11 can have different kinds and structural elements, although it is mainly located on the first surface 22 of the first substrate 20, it can also be located on the first surface 22, the second surface 24, and even along the periphery of the first substrate 20 Sister Ho closed, examples of electronic components 11 include resistors, capacitors, transistors, bare semiconductors, semiconductors in the package (such as line flat pads and dual internal package) Μ and packaged on a multi-chip carrier For each semiconductor, these components 11 can have three general structural elements according to how they are attached to the substrate: (A) pins in the cavity (B) surface mount and (C) direct-wafer-attach (including wire bonding and flip-chip attachment) . Each piece 11 can be attached to one of the electrical patterns on the surface 22 by a method known in the art such as welding 'conductive adhesion, wire bonding and brazing. Encapsulation 10 can also provide support for incorporating mechanical components such as connectors, heat sinks and actuation / clamping devices. Although the main purpose of the package is to provide signals from one or more electronic components 11 to a conductive member such as a printed circuit board, a circuit model, etc., and the power supply, it is necessary to understand that it can also Provides signal and power connections between components on combination 10 The electrical pattern 2 5 on the second surface 24 of the first substrate 20 may also include one or the same paper size as applicable to the Chinese National Standard (CNS) A4 specification (210 X 297_mm). I " " II —Order—_ II -Line (Please read the notes on the back before filling out this page} Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 _________ B7 V. Description of the invention (7) More lines and / or linings 2 The 7 queue is mainly composed of a line 2 7 designed to provide direct electrical contacts from the first substrate M 20 to the second conductor 31 located in the second substrate 30. 2 5 can also be provided to one or several electronic components on the second surface 2 4 of the first substrate 20 and interconnections from or between such components, provided that these components are located on that surface (not shown on In Figure 2, but may be similar to the components on Table 2))-the interconnection between the electrical patterns on the two surfaces 22 and 24 of the substrate 20 (K and any additional internal layer interconnection) This is achieved using internal wiring 26, pads 27, conductive vias 28 and / or plated through holes 29. In a preferred embodiment, the first substrate 20 is The dielectric material 21 is a printed circuit board made of fiberglass-reinforced epoxy resin. The above epoxy resin may be T ef 1 〇η (trademark of DuPont Chemical Company, Wilmington, Tex.) 'K apt ο η (trademark of American DuPont, Wilmington, Tex.) or ϋ pi 1 e X (trademark of Wilmington, Texas 1 (: 1, U.S. company). First base as previously described The electrical maps (supplied to the first base Η 20 and most of the interconnects) on and in the wafer 20 are made of a conductive material such as copper (or similar metal materials, including alloys such as copper, Aluminum and other materials such as conductive ink, etc.). Importantly, copper is the material used for the electric diagram. Because copper has lower electrical and thermal resistivity than other commonly used materials. In other embodiments such as M ceramic In the basic foundation, these horizontal and vertical connections can also exist, but most of them are physically connected with different devices and materials. Importantly, glass fiber reinforced epoxy resin has a variety of other applications for many applications. Dielectric materials have several advantages as they are better than Other materials are cheap, and at the same time through the use of fine wire circuits (^ 卩 5 clips of $ -10-This paper size applies to China National Standard (CMS) A4 specifications (210 × 297 mm) I ----- ---- 1 ------ ΐτ ------, line--(Please read the notes on the back before filling out this page) Printing policy of the Consumers ’Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs κι Β7 V. Description of the invention (times) Circuit wiring and space, together with small diameter conductive paths and plated through holes) can have extremely high wiring capacity. In addition, glass fiber reinforced epoxy cards or boards can easily accommodate various electronic components and mechanical components A variety of different structural elements include: U) pins in the cavity (b) surface mounting and U) a direct crystal Η-add (: M includes the implementation of known methods of wire bonding and flip chip attachment). This is a major benefit over ceramic-based carriers. In addition > The first substrate 20 can provide superior performance in power and signal distribution, as it has all the advantages and capabilities of a typical printed circuit structure available for its use. In one example of the present invention, the first substrate 20 may have a width and a length of 2.0 inches ("WF S", Fig. 1). This substrate can also have a thickness dimension of only about 0.062 ("T F S", Fig. 1). The electronics package 10 also includes a second substrate 30. In a preferred implementation of this example, the substrate is also made of fiberglass-reinforced epoxy resin. The coefficient of thermal expansion is the same and includes at least one (preferably multiple) second conductors 31. Importantly, the thermal expansion coefficient of the second substrate Η30 should be as close as possible to the thermal expansion coefficient of the first substrate Η20, so as to ensure the completeness of the electronic package assembly 10_integrity. C The second substrate 30 also includes the one inserted therein. At least one and preferably one row of second conductors 31. In this preferred embodiment, the second conductor 31 is a separate pin and can be placed in each opening of the second substrate 30 by a rubbing method known in the art. In one example, a total of 60 such pins may be used. The second conductor 31, which is made of a conductive material such as brass or phosphor bronze and includes a head 32, a body 3 3, and a tail 34, can be made by a screw machine. The head 3 2 should be round, including a flat top surface and an opening more than the conductor -1 1-This paper size applies to China National Standard (CNS) Α4 size (210 X 297 mm) 1 Gutter (please read the precautions on the back before filling out this page) A7 B7 V. Description of Invention (I) Consumption cooperation of employees of the Central Standards Bureau of the Ministry of Economic Affairs has printed a slightly larger diameter. The body 33 usually includes burrs, grooves, or ridges (not shown) on the other surface, which provide a better holding force for the second conductor when a large body of the body is inserted into the opening of the second substrate 30. The tails 34 are usually smooth and have a uniform diameter, and are inserted into the plated through holes or the pin grid sockets (Figure 2). In one example of the present invention, the second substrate 30 may have a width and a length Γ VS S of about 1.7 inches each, FIG. 1). This substrate may also have only about 0.06 2 Inch thickness ("TSS", Fig. 1), therefore, the second substrate may be somewhat smaller than the substrate 20 in all dimensions and should have the same thickness. It should be noted that although in Fig. 2 In the example, there is no electrical pattern on and / or inside the second substrate 30 (as the first substrate 20 has), but it is still within the scope of the present invention to use the inner and / or outer patterns described. In a preferred embodiment, the head 32 of the second conductor 31 in the second substrate 30 is raised on the surface (38) of the second substrate 30, as shown in FIG. This is to prevent the trapping of pollutants and to facilitate the removal of pollutants during the assembly period when welding may be used. In other specific examples, the head 32 can be installed flush with the surface 3 δ or Slightly lower than this surface, M enhances the features of the present invention such as simplifying the individual assembly process, etc. The diameter of the head 32 can be changed depending on the application or even in one application. Internal change M to meet special needs. By increasing the contact area between the head 32 and the first substrate 20, the larger diameter head 32 can be more easily or more firmly attached to the first substrate. The small-diameter head 32 can improve the wiring ability of each circuit on the electrical pattern of the second surface 24 of the first substrate 20. If the sparse ranks of the second conductor 31 (for example, only 2 8 9 Pins -12----------- Kunyi ----- 1T ------, line (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 Specification (2 丨 〇 X 297 mm) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A 7 B7 V. Description of the Invention (Γ) Counting column (as in the pattern of 1 7 X 1 7) Outside columns) * The central part of the second substrate 30 can be removed so that the additional sister 11 can be placed on the second surface 24 of the first substrate. This permits true three-dimensional electronic packaging. In a preferred embodiment, the second substrate 30 assists in maintaining a consistent spacing of the tails 34 and the top height of the top surface of the head 32 on the entire row of the second conductors 31. The former helps ensure the first The successful connection of the two conductors 31 to the first conductor 41 of the conductive member 40, which has an electrical pattern ribbed on the second surface 24 of the first substrate 20 attached to the second conductor 31. _ In the second The second conductor 31 in the substrate 30 can be attached to the pad 27 on the electrical pattern 25 by a clamping device (not shown), but a more permanent method such as welding, conductive adhesion or brazing is suitable. In a preferred specific example, the welding method is used. It is important to see that the inclusion of the second substrate 30 as a carrier for each individual second conductor 31 greatly enhances the manufacturing capability of the electronic package and package 10, because of its permission All the second conductors 31 are attached to the first substrate 20 as a single surface-mounting piece. Preferably, the conductor 31 is added as a surface mount component 11 at the same time, for example, a known method of reflow using double-sided, double-pass infrared soldering is used. To further assist such an assembly method, it is desirable to permit at least a portion of the second substrate to be free of the second conductor 31, thereby facilitating processing using assembly equipment (e.g., a pick and place tool). It is important to remember that when replacing the second conductor 3 1 with the first substrate, as described in many previous structures, the electronic package 10 permits the placement of the electronic components 11 1 The position of the second conductor is irrelevant. The interconnection between the electronic package combination 10 and the conductive member 40 is intended to be electrically coupled mainly to the second conductor 3 1 of the second substrate 30 to the first conductor -13 of the conductive member 13-This paper size applies to Chinese national standards (CNS) Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling out this page)-Equipment_ * 1Τ Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (I 丨) 4 1 to achieve this, these various interconnections can be used in a variety of permanent ways (soldering, conductive paste, etc.), but K site can be separated. The term on-site separable is used to indicate that a high degree of reliability can be used to disassemble two separate pieces of electronic food that have left the manufacturing location and may be in use elsewhere, and then reconnected. The practical use of the second conductor 31 and the first conductor 41 depends on whether the interconnection is permanent or on-site separable. If these conductors are permanent interconnection, the second conductor 31 may include pins ( May be covered with M solder), solder spheroids, solder bumps, etc., while the first conductor 41 may include a printed circuit pad, solder tin, solder bumps, etc. If this type of interconnection is field-separate, the second conductor 31 may include pins (preferably a metal material such as a mirror, gold, or silver is plated on at least a portion of the contact used to achieve the contact. Palladium, etc.), a conductive contact member, etc. in a built-in connector, and the first conductor 41 may include a socket designed to fit with such pins or contacts. In a preferred example of a field separable structure, the second conductor 31 1 in the second substrate 30 is at each center at about 0.10, (for example, in the X to be mentioned And (2) directions and are intended to be aligned with and placed in the first conductor 41 series in the pin grid socket (preferably zero insertion force type). Such a socket (such as shown in FIG. 2) is electrically connected (preferably by a method such as soldering) to a conductive member 40 (such as a printed circuit structure of a board, a card or a horizontal group), thereby completing the electronic sister The pieces 11 are connected to the conductive members 40 to each other. If it is possible, if the second substrate 30 is very thin (ie, a 0, 0 05 thick K a ρ t ο η layer), a second conductor 3 1 has been attached to the first substrate Η 2 0. The layer can be removed: However, it is generally not recommended to use this structure for electronic packaging -14-This paper size applies to China National Standard (CNS) A4 specification (210 × 297 mm) I -------- --Private clothing ------ ΪΤ ------- line (please read the notes on the back before filling this page) Α7 Β7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ) The combination 10 may be repeatedly inserted into the conductive member 40 and removed from various uses due to the possible fatigue of the solder joints and the possibility of the conductor 3 1, in order to further enhance the connectivity of the electronic package sister 10, Additional interconnections may be accomplished with connectors or cables (not shown) that are configured and electrically coupled to the electrical patterns 23 and 25. An example of how electronic packaging can be used is to allow a specific component in its surface mount package to match the same pin (P i η 〇ut :) as its pin grid type, which gives the electronics The package is capable of 10 surface mounting components compatible with the pin grid socket on the printed circuit structure. "For many reasons, the pin grid type including a component is not immediately available, and the pin grid type is too much. Expensive, or want to replace M-advanced replacement (better performance, low power consumption, low price, etc.) to upgrade an existing circuit and still maintain pin compatibility, etc. The above structure is what I want. Incorporating 10 may have another benefit for manufacturers of electronic systems such as personal computers. The usual operation of electronic system manufacturers is to reduce the cost and function of the sockets in addition to upgrading the sockets to provide one of the same or similar functions. The surface-mounted integrated circuit (such as a microprocessor) is soldered to a system board to provide the same or similar functions. If the cost of the electronic package is low, the manufacturer can replace the original Surface-mount integrated circuit packaging in this type of electronic packaging can benefit from closing M, because this method can get valuable real estate on the system board and help manufacturers implement built-to-order policies. Although not specifically shown, a voltage regulating device may be included in the first substrate 20M to further enhance the ability of the electronic packaging combination 10. One example of such an application to the computer industry is the use of M to support 3.3V in a personal computer. (Or other non-TJ-15)-This paper size applies to China National Standard (CNS) Α4 specification (210 × 297 mm) I --------- install-(Please read the precautions on the back before (Fill in this page) A7 B7 printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economics of the PRC 5. Semiconductors of Invention (G)). The power M in many personal computers should have an output of 5 volts. Therefore, including voltage regulation卽 Ρ 3 allows the use of the newer 3 on the electronic packaging sister 10.1. JP special semiconductor in the existing system. In addition, the adjustment device can make the electronic packaging combination 10 to Μ simultaneously support a variety of different voltage requirements ( For example 3. 3 and 5 volts ), And only requires a single voltage (such as 5 volts) output semiconductor. This can be achieved by including and using one or more voltage levels (not shown) in the first substrate 20 without power distribution performance The downgrading / voltage regulator can be implemented in a number of different ways well known in the art-including the implementation as a linear or switching regulator circuit. In a preferred example, a switching regulator should be used because it has Higher efficiency and thus less power (and heat) dissipation. The interconnection type of the electronic package combination 10 shown in Figure 2 is for a pin grid that is intended to be used as an upgrade unit M inserted on an existing conductive member 40 The sockets work well for all uses. As far as newly developed uses are concerned, certain restrictions on the typical pin grid sockets (such as the provision of conductors far less than 0.10 inches by 0. 500) The ability of each conductor) may want to use different methods of connecting a package. This method is described in the description of FIG. 3. In FIG. 3 * the second substrate 60 (including the second substrate 6 1) is an interpaser pattern. An example of such a substrate is described in US No. 5, 2 48, 2 62, Specially listed here for reference. Furthermore, in addition to maintaining the advantages K of one of the pin row top covers described above, the example of Fig. 3 has several other advantages. These advantages include the ability to support the connection of all areas in a grid that is much denser than 0.10, may have better conductivity, simpler assembly and rework (because each connector device can be clamped in First base 20, -16-This paper size applies to Chinese National Standard (CNS) Α4 size (210X 297 mm) I ^ 矣 定 矣 * (Please read the notes on the back before filling this page) Central Bureau of Standards, Ministry of Economic Affairs Printed by employee consumer cooperative A7 _____ 5. Description of the invention (丨 4 instead of permanent addition) and still permit the interface with conductive member 40 to be on-site separable. In Figure 3, the package combination 50 shown includes a first A substrate 20, which includes at least one second conductor 6 1 (preferably a plurality), a second substrate 60 and at least one (preferably several) electronic parts 11. The first substrate 20 is preferably similar to the substrate 20 in FIG. 2 and thus includes a first surface 22 having an electrical pattern 23 having a first density thereon, and an electrical pattern 25 having a second density less than the first density. On the second opposite surface 25 〇 electronic package assembly 50 another including a The second dielectric substrate 60 and one of the second conductors 61. In this example, the second substrate 60 and the second conductor 61 are used as an area matrix plug-in connector. There are many different ways of this type of connector Putting it into practice. In one example, a dielectric elastomer may be used that includes multiple conductive paths therein, such as small diameter wires, small conductive tracks, or more or less conductive (or conductive plating) ) Columns of material in columns, M provides the required interconnections. In another example, a very fine (typically 0.01 to 0.22 inch diameter) gold-plated wire is formed, typically for example Made of copper iodide, copper-silver or I-mesh material and compressed into a "electric button" contact, inserted into one of the evenly spaced opening queues in the dielectric substrate. 0 Example in FIG. 3 This is a preferred example of the present invention. The second substrate 60 is used for several functions, including a protective jacket for the second conductor 61, and a structure for holding and orienting the second conductor 61 with M. M ensures proper alignment, bonding and successful connection of the combination 50. As described above For basic 60 and guide bone 豊 -17-This paper size applies Chinese National Standard (CNS) Α4 size (210 × 297 mm) I gutter (please read the precautions on the back before filling this page) Central Bureau of Standards, Ministry of Economic Affairs Printed by employee consumer cooperatives A7 B7 V. Further description of the invention ((Γ) (31, see US Patent No. 5, 2 4 8, 2 (Patent No. 52). Second substrate 60 (see Figure 3) One or more parts are suitable for electrical insulation, such as plastic materials, which are molded and generally have a rectangular configuration. 'In one example of the present invention, the second substrate 60 may have about 2. 3 inches. Width (not shown) and a combined thickness of only about 0.190 inches. The preferred material for the second substrate 60 is plastic * A suitable example of such a material is Vectra (trademark of Hoechst Ce 1 anese) 'R yt 〇η (trademark of Phillips Petroleum Corporation), S points And polyester. The second substrate 60 should preferably include at least one elongated electrically insulating positioning member 64 for each mating conductor 61, and each positioning member 64 should have one of the following cross-sections, i.e., the cross-section is straight at its How many convex shapes are there on one side (as shown) 'On the opposite side are generally concave shapes and are made of a polymer material (a suitable example of such a material is Vectra, Ryton above , P he η ο 1 ic and polyester). The substrate M 60 should preferably be made by, for example, a molding or extrusion process * and held in place by a clamping terminal piece (not shown). Such a clamping structure may simply include a C-shaped clamp or the like to engage the respective surfaces of the members 20 and 40. No further explanation seems necessary. Adjacent positioning members 6 4 form a series of prestressed positions 6 5 ′. A conductor 61 can occupy each prestressed position. The electrically insulating positioning member 64 is designed so that the second conductor 6 1 is slightly deflected at each of the two outer positioning surfaces 6 6 and one inner positioning surface 6 7, and thus maintains these conductors. At a certain center, it is a slightly free floating position. Each second conductor 61 is held by friction between the three contact surfaces (6 6 and 67) and the curved second conductor 61. This right. The bending direction of the second conductor 61 is preset in a slightly curved form. Therefore, the electric current is -18-__-- This paper size applies to the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) (please read the back first) Please pay attention to this page before filling in this page)-Binding and ordering Α7 Β7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Skewed. In addition, the outer surface 66 of each positioning member 6 4 and a slightly protruding bark portion adjacent to the adjacent positioning member 64 4 define a gap hole 68 through which the opposite end of each second equal body 61 passes. Portions 62 and 63 project outward from the medium of the substrate. In a preferred example, the second conductor 61 may be a conductive material such as beryllium copper and may be formed separately, such as by stamping or etching, or as a larger group of components (eg, forming a row of conductors as part of a flexible circuit) .皴 -Copper is the preferred material for the second conductor 61, because it performs the electrical function of the second conductor 61 (such as supplying a conductive path) and also provides its mechanical function, thus eliminating the need for an isolation spring device. Preferably, the second conductor 61 (or at least the opposite end portions 62 and 63) is plated with K resist and a pure conductive material such as nickel, gold 'silver, palladium, and the like. In a preferred example, the second conductor 61 1 in the second substrate 60 is centered at 0,500 hours in each of the X and Y dimensions, although an even smaller center-to-center distance It is possible. The size of the second conductor 61 can be changed to conform to specific mechanical and electrical parameters. In one example, the second conductor 61 is made of rhenium-copper and has a length of 0.200 inches, a width of 0.030 inches, and a thickness of 0.002 inches. Importantly, the second conductor 61 in Fig. 3, which is used mechanically as a buckling beam, allows a narrow range of contact forces to be considered over a wide range of vertical compliance. For example, in one example, it is greater than 0. 0 The 20-inch vertical compliance range is achieved by a change of 10% of the M power. As a comparison, a typical regional rank connector has a usable vertical of less than 0. 10 inches in a 100%-3 0% change in force. -19-This paper size applies the Chinese National Standard (CNS) Α4 size (210X 297). (Mm) I --------- install-- (please read the precautions on the back before filling this page) Thread A7 Β7 Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention ((Ί ) Compliant range. In addition, the use of a buckle beam spring device for the second conductor 61 can reduce the length of the second conductor 61 by K. This can improve the characteristics of electricity (from the perspective of a signal and electric load) and heat. It should be noted that the electrical conductivity of the first conductor 41 on the first contact conductive member 40 and the second surface of the first substrate 20 on the second contact surface almost immediately after the second conductor _ 6 1 is opposite. The ends 6 2 and 6 3 are in the greatest force. And during the rest of the actuation, they remain substantially the same. In addition, because the second conductor 6 1 is not always. Maximum force (this may be the case for conductors with large force changes) The second conductor 61 can The unnecessary clamping force on the guide member 40 is minimized. As described above, the interconnection of the electronic package combination 50 and the conductive member 40 is performed on the electrical pattern 25 on the second surface 24 of the first substrate 20 The contact pad 27 is electrically coupled to the end portion 6 2 of the second conductor 61, and the end portion 6 3 of the second conductor 61 is electrically coupled to the first conductor 4 1 (such as copper lining) provided on the conductive member 40. Pad) is achieved. Although only a field separable interface is required to make a combination field separable 'In the preferred implementation of this example, the interfaces at both ends of the second conductor 61 can be separated on site, so if needed, The second substrate 60 (and the second conductor 61) can be replaced in situ. The alignment of the above interfaces is provided by a pair of protruding pins (not shown) extending from the substrate (for example, 20). These two pins are aligned with and located within other substrates (such as 60) and corresponding openings (not shown) in the conductor 40. It should be understood that other means of alignment are possible, including the provision of self-conducting components 40 is extended and inserted into the corresponding openings in the base 60 and 20. Although the electronic package combination 50 and the conductive member 40 The actuating device is not specifically shown. As far as I know, this paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm). 1 Please make sure to read the precautions on the back before filling out this page. J Ministry of Economy The central sample bureau staff consumer cooperatives Yinju A7 B7 and other devices can be clamped by several methods known in the art, such as those described above. The function of the second substrate 6 0 / the second conductor 61 1 can be Geometries that include penetrating contacts on the opposite ends 6 2 and 63 of the second conductor 6 1, such as dendritic elements (not shown), increase the reliability of each connection by enhancing the reliability of each connection and enhance it. This function can reduce the contact resistance, heat dissipation and the temperature of each contact during operation. In addition, dendritic elements can break through dust, film, and fiber debris that may be present on various conductors, as shown in 40 for conductive members. Such dendritic elements can be provided on the protruding ends 62 and 63 in the manner taught by U.S. Patent No. 5,237,743. These components can also be formed on selected portions of the conductors 27, 4 1 and pins 31 (such as the head 3 2) in the manner described in Canadian Patent No. 1, 121, 011. The two patents mentioned above are also listed here for reference. In order to further enhance the connectivity of the electronic package, 50%, plus 2 5 speed available settings and electrical coupling to the connectors on the electrical patterns 23 and 25 and stomach stomach stomach 0 Although not specifically shown, it is to enhance the electronics The package size is 50 °, and the voltage regulation device M can be similarly described in the example in FIG. 2 to the first substrate 20, and further explanation may not be necessary. Therefore, this article has shown and described an electronic package combination that can effectively and reliably connect different types and structural elements of active and passive electronic components (and supported mechanical components) to an electronic circuit component, where this connection can be repeated.狍 (that is, connection and reconnection can happen quickly). The invention is manufactured at a lower cost, and it is also a simpler design, and it is provided from the above. -21-This paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) I ------ --- ^-(Please read the precautions on the back before filling this page), «! Line V. Description of the invention (9 A7 B7 'Revise and explain changes and display items. The truth is that Dingjia Kejie is more eloquent. And the exclusiveness of the encircled Mingshi Fante Liliben is to ask him to apply his skills to the former attached to the eyes of the people who have already met the departed. However, it ca n’t be obvious. I -------- Approve clothes -------- II ------. ^ (Please read the notes on the back before filling this page) Central Standards of the Ministry of Economic Affairs The paper size printed by the Bureau ’s Consumer Cooperative is applicable to the Chinese National Standard (CNS) A4 (210X297 mm)