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TW371285B - Foiled UD-prepreg and PWB laminate prepared therefrom - Google Patents

Foiled UD-prepreg and PWB laminate prepared therefrom

Info

Publication number
TW371285B
TW371285BTW083110086ATW83110086ATW371285BTW 371285 BTW371285 BTW 371285BTW 083110086 ATW083110086 ATW 083110086ATW 83110086 ATW83110086 ATW 83110086ATW 371285 BTW371285 BTW 371285B
Authority
TW
Taiwan
Prior art keywords
foiled
prepreg
pwb
layers
prepared therefrom
Prior art date
Application number
TW083110086A
Other languages
Chinese (zh)
Inventor
Erik Middelman
Original Assignee
Amp Akzo Linlam Vof
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Akzo Linlam VoffiledCriticalAmp Akzo Linlam Vof
Application grantedgrantedCritical
Publication of TW371285BpublicationCriticalpatent/TW371285B/en

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Abstract

The invention relates to a basic material for making a PWB laminate, which is a foiled UD prepreg comprising a layer of a conductive metal foil bonded to a layer made up of parallel, unidirectionally oriented reinforcing fibres impregnated with not yet fully consolidated matrix resin. The foiled UD-prepreg can be used to manufacture UD-crossply PWB laminates by stacking and pressing them together with, in between, other UD-layers, which may be either non-foiled UD prepreg layers, of non-flowing UD composite layers.
TW083110086A1994-09-191994-11-02Foiled UD-prepreg and PWB laminate prepared therefromTW371285B (en)

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
EP942026881994-09-19

Publications (1)

Publication NumberPublication Date
TW371285Btrue TW371285B (en)1999-10-01

Family

ID=8217206

Family Applications (1)

Application NumberTitlePriority DateFiling Date
TW083110086ATW371285B (en)1994-09-191994-11-02Foiled UD-prepreg and PWB laminate prepared therefrom

Country Status (9)

CountryLink
EP (1)EP0782500A1 (en)
JP (1)JPH10508720A (en)
KR (1)KR970705465A (en)
CN (1)CN1158101A (en)
AU (1)AU694564B2 (en)
CA (1)CA2200314A1 (en)
MX (1)MX9702059A (en)
TW (1)TW371285B (en)
WO (1)WO1996009158A1 (en)

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WO2000072643A1 (en)*1999-05-262000-11-30Ppg Industries Ohio, Inc.Fabrication of unidirectional laminate prepregs using tape casting methods and equipment
US7356916B2 (en)2001-07-182008-04-15Matsushita Electric Industrial Co., Ltd.Circuit-formed substrate and method of manufacturing circuit-formed substrate
ITRM20040571A1 (en)*2004-11-222005-02-22Gen Services Srl ROTOR, RELATIVE MANUFACTURING PROCEDURE, AND INDUCTION MACHINE USING THE ROTOR.
JP4903723B2 (en)2006-01-302012-03-28京セラ株式会社 Wiring board and electronic device
US7951447B2 (en)2007-01-312011-05-31Kyocera CorporationMethod and apparatus for manufacturing prepreg sheet and prepreg sheet
EP2372756A1 (en)2007-03-132011-10-05Semiconductor Energy Laboratory Co, Ltd.Semiconductor device and manufacturing method thereof
EP1970951A3 (en)*2007-03-132009-05-06Semiconductor Energy Laboratory Co., Ltd.Semiconductor device and manufacturing method thereof
CN101680707B (en)2007-03-262013-02-20Lg电子株式会社Reinforcing component for refrigerator
EP1976000A3 (en)2007-03-262009-05-13Semiconductor Energy Laboratory Co., Ltd.Method for manufacturing semiconductor device
EP1976001A3 (en)2007-03-262012-08-22Semiconductor Energy Laboratory Co., Ltd.Method for manufacturing semiconductor device
US8012561B2 (en)2007-03-302011-09-06Kyocera CorporationFiber-reinforced resin and method for manufacturing the same
EP2001047A1 (en)2007-06-072008-12-10Semiconductor Energy Laboratory Co, Ltd.Semiconductor device
JP2009045915A (en)*2007-07-262009-03-05Kyocera Corp Composite board, wiring board, mounting structure, and method for manufacturing composite board
WO2009051239A1 (en)*2007-10-182009-04-23Kyocera CorporationWiring board, mounting structure and method for manufacturing wiring board
JP5293075B2 (en)*2007-10-242013-09-18日立化成株式会社 Metal foil-clad laminate and printed wiring board
JP2009205669A (en)2008-01-312009-09-10Semiconductor Energy Lab Co LtdSemiconductor device
CN102067281B (en)2008-04-252013-06-12株式会社半导体能源研究所Semiconductor device and method for manufacturing the same
WO2009139282A1 (en)2008-05-122009-11-19Semiconductor Energy Laboratory Co., Ltd.Semiconductor device and method for manufacturing semiconductor device
WO2009142310A1 (en)2008-05-232009-11-26Semiconductor Energy Laboratory Co., Ltd.Semiconductor device and method for manufacturing the same
CN102037556B (en)2008-05-232016-02-10株式会社半导体能源研究所Semiconductor device
US8053253B2 (en)2008-06-062011-11-08Semiconductor Energy Laboratory Co., Ltd.Method for manufacturing semiconductor device
JP5248412B2 (en)2008-06-062013-07-31株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP5473413B2 (en)2008-06-202014-04-16株式会社半導体エネルギー研究所 Wiring substrate manufacturing method, antenna manufacturing method, and semiconductor device manufacturing method
JP2010041045A (en)2008-07-092010-02-18Semiconductor Energy Lab Co LtdSemiconductor device and method for producing the same
KR101588576B1 (en)2008-07-102016-01-26가부시키가이샤 한도오따이 에네루기 켄큐쇼Light emitting device and electronic device
TWI475282B (en)2008-07-102015-03-01Semiconductor Energy LabLiquid crystal display device and method for manufacturing the same
JP5216716B2 (en)2008-08-202013-06-19株式会社半導体エネルギー研究所 Light emitting device and manufacturing method thereof
WO2010032611A1 (en)2008-09-192010-03-25Semiconductor Energy Laboratory Co., Ltd.Semiconductor device and method for manufacturing the same
JP5583951B2 (en)2008-11-112014-09-03株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
CN102460722B (en)2009-06-052015-04-01株式会社半导体能源研究所 Photoelectric conversion device and manufacturing method thereof
TWI517268B (en)2009-08-072016-01-11半導體能源研究所股份有限公司Method for manufacturing terminal structure and method for manufacturing electronic device
JP5719560B2 (en)2009-10-212015-05-20株式会社半導体エネルギー研究所 Manufacturing method of terminal structure
KR20110114325A (en)2010-04-132011-10-19삼성모바일디스플레이주식회사 Display device
JP5594872B2 (en)*2010-05-062014-09-24日精株式会社 Colored fiber reinforced composite
JP5851875B2 (en)*2012-02-142016-02-03信越化学工業株式会社 Method for manufacturing package for optical semiconductor device and method for manufacturing optical semiconductor device
NL2016357B1 (en)2016-03-032017-09-20Allotropica Tech IncPre-preg and composite products
JPWO2019111416A1 (en)*2017-12-082020-12-10昭和電工マテリアルズ株式会社 Prepregs, laminates, and their manufacturing methods, as well as printed wiring boards and semiconductor packages.
CN109049891B (en)*2018-06-132020-09-29咸阳天华电子科技有限公司Preparation method of high-elasticity copper-clad unidirectional fiber sheet
CN109496076B (en)*2018-12-192020-12-15咸阳天华电子科技有限公司Manufacturing process of unidirectional fiber circuit board
CN111688287B (en)*2020-06-142022-06-10湖南亿润新材料科技有限公司Epoxy resin prepreg and production process thereof

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JPS51111879A (en)*1975-03-271976-10-02Mitsubishi Gas Chemical CoManufacture of metal foillclad preepreg
FR2516441A1 (en)*1981-11-181983-05-20Spie Batignolles PROCESS FOR PRODUCING FIBER-LOADED THERMOPLASTIC RESIN PROFILES, INSTALLATION FOR IMPLEMENTATION, PROFILES OBTAINED AND USE THEREOF
KR900009265A (en)*1988-12-071990-07-04원본미기재 Manufacturing method of reinforced thermoplastic composite-metal foil laminate
JPH04329132A (en)*1991-04-301992-11-17Tonen CorpHybrid prepreg
TW244340B (en)*1992-07-211995-04-01Akzo Nv

Also Published As

Publication numberPublication date
KR970705465A (en)1997-10-09
CA2200314A1 (en)1996-03-28
AU694564B2 (en)1998-07-23
EP0782500A1 (en)1997-07-09
WO1996009158A1 (en)1996-03-28
CN1158101A (en)1997-08-27
AU3568495A (en)1996-04-09
MX9702059A (en)1997-06-28
JPH10508720A (en)1998-08-25

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