本揭露的實施例涉及微型探針（例如，用於晶片級測試或插座測試積體電路，或用於與印刷電路板或其它電子元件進行電連接），更具體地說是針狀微型探針（即，具有垂直或縱向高度大於其寬度的微型探針，例如在某些實施例中，高度比寬度大5倍，而在其它實施例中是10倍，還有一些是20倍），或者按鈕狀探針，其中當處於無偏置狀態時，彈簧元件具有平面配置。在某些實施例中，這些微型探針至少部分地通過電化學製造方法製造，更具體地說是通過多層、多材料的電化學製造方法，而在某些實施例中，多個探針以陣列形式使用，包括一個或多個帶有通孔的板，這些通孔與探針的特徵和/或其它陣列保持結構相配合。Embodiments of the present disclosure relate to microprobes (e.g., for use in wafer-level testing or socket testing of integrated circuits, or for making electrical connections to printed circuit boards or other electronic components), more particularly needle-shaped microprobes (i.e., microprobes having a vertical or longitudinal height greater than their width, e.g., in some embodiments, the height is 5 times greater than the width, in other embodiments, 10 times, and in some embodiments, 20 times), or button-shaped probes in which the spring element has a planar configuration when in an unbiased state. In some embodiments, these microprobes are at least partially fabricated by electrochemical fabrication methods, more particularly, by multi-layer, multi-material electrochemical fabrication methods, and in some embodiments, multiple probes are used in an array format, including one or more plates with through holes that mate with features of the probes and/or other array retention structures.
許多電接觸探針和針配置已經在商業上使用或提出，其中一些可以符合現有技術，而另一些則不符合現有技術。Many electrical contact probes and needle configurations have been used or proposed commercially, some of which may comply with the prior art and others of which may not comply with the prior art.
來自多個黏附層的三維結構的電化學製造技術已經或正在由加利福尼亞州範奈斯的Microfabrica Inc.（前身為MEMGen Corporation）在EFAB和MICA FREEFORM®這兩個製程下進行商業化的研究。Electrochemical fabrication of three-dimensional structures from multiple adhesion layers has been or is being commercialized by Microfabrica Inc. (formerly MEMGen Corporation) in Van Nuys, California, under the EFAB and MICA FREEFORM® processes.
電化學製造提供了以合理的成本和合理的時間形成微型物體、零件、結構、裝置等原型和商業數量的能力。事實上，電化學製造是形成許多以前無法生產的結構的推動者。電化學製造在許多工業領域中開創了新設計和產品的領域。即使電化學製造提供了這種新的能力，人們瞭解到電化學製造技術可以與各個領域內已知的設計和結構結合，形成新的結構，但在某些電化學製造的應用中提供的設計、結構、能力和/或特徵，在目前技術水準，提供了設計、結構、能力和/或特徵，這些特徵在目前狀態下並不為人所知或不明顯。Electrochemical manufacturing provides the ability to form prototypes and commercial quantities of micro-sized objects, parts, structures, devices, etc. at reasonable cost and in reasonable time. In fact, electrochemical manufacturing is the enabler for the formation of many structures that were previously impossible to produce. Electrochemical manufacturing has opened up new areas of design and products in many industrial fields. Even with the new capabilities provided by electrochemical manufacturing, it is understood that electrochemical manufacturing techniques can be combined with known designs and structures in various fields to form new structures, but in some applications of electrochemical manufacturing, designs, structures, capabilities and/or features are provided that are not known or obvious in the current state of the art.
在各個領域存在一種需要，即需要具有改進特性、縮短製造時間、降低製造成本、簡化製造過程、在裝置設計中更具靈活性、改進材料的選擇、改進材料性能、更具成本效益和風險較小地生產這些裝置的微型裝置，以及幾何配置和所選製造過程之間更大的獨立性。There is a need in various fields for micro-devices with improved properties, reduced manufacturing time, reduced manufacturing costs, simplified manufacturing processes, more flexibility in device design, improved choice of materials, improved material properties, more cost-effective and less risky production of these devices, and greater independence between geometric configuration and the selected manufacturing process.
本公開的某些實施例的目的是提供改進的探針，其中包括由多個順應模組形成的順應元件，這些順應模組包括平面但非線性（即，不是直的）彈簧配置（即，彈簧配置不是沒有彎曲或角度的直條，而是在至少一層平面內具有一些二維配置，形成彎曲或曲線），在無偏置狀態時。其中，彈簧的平面垂直於探針的縱軸，並沿著探針的縱軸提供順應性，順應模組以串聯方式疊放。具有非線性彈簧配置的探針可能在偏置時提供線性的彈簧回復力或非線性的回復力。Certain embodiments of the present disclosure are directed to providing an improved probe including a compliant element formed of a plurality of compliant modules including a planar but nonlinear (i.e., not straight) spring configuration (i.e., the spring configuration is not a straight bar without bends or angles, but has some two-dimensional configuration in at least one plane, forming bends or curves), in an unbiased state. Wherein the plane of the spring is perpendicular to the longitudinal axis of the probe and provides compliance along the longitudinal axis of the probe, and the compliant modules are stacked in series. A probe with a nonlinear spring configuration may provide a linear spring restoring force or a nonlinear restoring force when biased.
本揭露的某些實施例的目的是提供改進的探針，其中包括由一個或多個順應模組形成的順應元件，這些順應模組包括平面但非線性（即非直的）的彈簧配置，在無偏置時。其中，這些彈簧的平面法向並非垂直於探針的縱軸，而彈簧偏離未受撓曲的彈簧平面而提供探針縱軸上的大多數順應性。在某些情況下，探針彈簧可能在形成探針的層面或層面中橫向延伸（即，彈簧的平面垂直於形成探針的層面的堆疊方向），而探針軸（由端點延伸到端點）可能不垂直於彈簧或彈簧的平面（例如，由於探針的對立端之間的有意側向偏移）。在某些變化中，探針軸可能與彈簧的平面或平面基本垂直，“基本”是指角度不超過20°、不超過10°、不超過5°、不超過2°或不超過1°的角度誤差，除非特別指示。Certain embodiments of the present disclosure are directed to providing improved probes including compliant elements formed from one or more compliant modules including a planar but nonlinear (i.e., non-straight) spring configuration when unbiased, wherein the plane normal of the springs is not perpendicular to the longitudinal axis of the probe, and the springs are offset from the unflexed spring plane to provide most of the compliance in the longitudinal axis of the probe. In some cases, the probe springs may extend transversely in a plane or layers forming the probe (i.e., the plane of the springs is perpendicular to the stacking direction of the layers forming the probe), and the probe axis (extending from end point to end point) may not be perpendicular to the plane of the springs or springs (e.g., due to an intentional lateral offset between opposing ends of the probe). In some variations, the probe axis may be substantially perpendicular to the plane or plane of the spring, with “substantially” meaning an angular error of no more than 20°, no more than 10°, no more than 5°, no more than 2°, or no more than 1°, unless otherwise indicated.
本揭露的某些實施例的目的是使用單個順應模組作為帶有單一接觸尖的探針。Certain embodiments of the present disclosure are directed to using a single compliant module as a probe with a single contact tip.
本揭露的某些實施例的目的是使用單個順應模組作為帶有兩個相對面的接觸尖端的探針。Certain embodiments of the present disclosure are directed to using a single compliant module as a probe with two opposing contact tips.
本公開的某些實施例的目的是提供兩個或更多具有相反方向的順應模組，以提供具有兩個相對定向的接觸表面或尖端的探針。It is an object of certain embodiments of the present disclosure to provide two or more compliant modules with opposite orientations to provide a probe having two oppositely oriented contact surfaces or tips.
本揭露的某些實施例的目的是提供具有基本特徵的探針和/或順應模組，以與陣列結構或其他順應模組的尖端進行配合。Certain embodiments of the present disclosure are directed to providing a probe and/or compliant module having basic features for mating with the tip of an array structure or other compliant module.
本揭露的某些實施例的目的是提供具有尖端特徵的探針和/或順應模組，以與其他順應模組的尖端或基本結構進行配合。Certain embodiments of the present disclosure are directed to providing probes and/or compliant modules having tip features that can mate with the tip or base structure of other compliant modules.
本揭露的某些實施例的目的是提供用於接受插入探針或順應模組的通孔配置的陣列結構，通過限制至少來自一個方向的插入範圍，至少在某種程度上基於陣列結構的至少一個特徵，來保持探針或順應模組。Certain embodiments of the present disclosure are directed to providing an array structure for receiving a through-hole configuration for insertion of a probe or compliant module, retaining the probe or compliant module by limiting the range of insertion from at least one direction, at least in part based on at least one characteristic of the array structure.
本揭露的某些實施例的目的是提供具有用於與陣列結構中的通孔進行嚙合的特徵的探針或順應模組，以使探針或順應模組通過限制至少來自一個方向的插入範圍，至少在某種程度上基於探針或順應模組的一個或多個特徵而被保持。Certain embodiments of the present disclosure are directed to providing a probe or compliant module having features for engaging with a through hole in an array structure such that the probe or compliant module is retained at least in part based on one or more features of the probe or compliant module by limiting the range of insertion from at least one direction.
本揭露的某些實施例的目的是提供由包含多個彈簧元件的順應模組形成的探針，其中這些彈簧元件支撐著支撐探針尖的探針臂，該尖端至少包括兩個指向相反方向的探針尖，被配置用於接觸不同的電子元件，例如待測試裝置（DUT）和與之相連的測試電路的介面元件，例如空間變壓器、中間接頭或與之相連的印刷電路板。Certain embodiments of the present disclosure are directed to providing a probe formed by a compliant module including a plurality of spring elements, wherein the spring elements support a probe arm supporting a probe tip, the tip including at least two probe tips pointing in opposite directions, configured to contact different electronic components, such as a device under test (DUT) and interface elements of a test circuit connected thereto, such as a space transformer, an intermediate connector, or a printed circuit board connected thereto.
本揭露的各種實施例的其它目的和優點對於本領域技術人員在閱讀本文的教示後將是顯而易見的。明確在此或從本文教示中確定的本揭露的各種實施例，可以獨自或組合地解決上述一個或多個目的，或者可以解決本文教導中確定的其他某個目的，而不一定是上述特定目的之一。因此，並不一定希望由本揭露的任何單一方面或本揭露的任何實施例來解決上述所有目的，甚至不一定是解決上述多數目的或上述某個目的的多數方面，即使對於某些方面或實施例可能是這樣的情況，也不一定是解決上述多數目的或上述某個目的的多數方面，即使對於某些方面或實施例可能是這樣的情況。Other purposes and advantages of the various embodiments of the present disclosure will be apparent to those skilled in the art after reading the teachings of this article. The various embodiments of the present disclosure, which are clearly identified here or from the teachings of this article, can solve one or more of the above-mentioned purposes alone or in combination, or can solve other certain purposes identified in the teachings of this article, and not necessarily one of the above-mentioned specific purposes. Therefore, it is not necessarily desired that all of the above-mentioned purposes be solved by any single aspect of the present disclosure or any embodiment of the present disclosure, or even necessarily solve most of the above-mentioned purposes or most aspects of one of the above-mentioned purposes, even if this may be the case for some aspects or embodiments, or solve most of the above-mentioned purposes or most aspects of one of the above-mentioned purposes, even if this may be the case for some aspects or embodiments.
根據本揭露的一個方面，用於在兩個電子電路元件之間進行接觸的探針包括至少一個順應結構，包括：至少一個支撐件，具有在縱向上分離的第一端和第二端；至少一個第一順應元件，其在垂直於其平面配置的方向上提供順應性，其中第一順應元件的第一部分在功能上與至少一個支撐件相連，第一順應元件的第二部分在功能上與可以相對於至少一個支撐件彈性移動的第一尖端臂相連，當第一順應元件未偏置時，第一尖端臂直接或間接固定第一探針尖端，該尖端在縱向上延伸至至少一個支撐件的第一端之外；至少一個第二順應元件，其在垂直於其平面配置的方向上提供順應性，其中第二順應元件的第一部分在功能上與至少一個支撐件相連，第二順應元件的第二部分在功能上與可以相對於至少一個支撐件彈性移動的第二尖端臂相連，當第二順應元件未偏置時，第二尖端臂直接或間接固定第二探針尖端，該尖端在縱向上延伸至至少一個支撐件的第二端之外，以及一個環狀基座，通過其外部的最外側範圍固定上下順應元件，其中第一和第二順應元件的第一部分在縱向上被至少一個支撐件和所述環狀基座分開，當至少第一和第二探針尖之一被偏向另一探針尖時，第一和第二順應元件的第二部分在縱向上移動更靠近一起。According to one aspect of the present disclosure, a probe for making contact between two electronic circuit components includes at least one compliant structure, including: at least one support member having a first end and a second end separated in the longitudinal direction; at least one first compliant element, which provides compliance in a direction perpendicular to its plane configuration, wherein a first portion of the first compliant element is functionally connected to the at least one support member, and a second portion of the first compliant element is functionally connected to a first tip arm that can be elastically moved relative to the at least one support member, when the first compliant element is not biased, the first tip arm directly or indirectly fixes a first probe tip, which extends in the longitudinal direction beyond the first end of the at least one support member; at least one second compliant element, which is configured perpendicular to its plane configuration. The invention relates to a method for providing compliance upwardly, wherein a first portion of a second compliant element is functionally connected to at least one support member, a second portion of the second compliant element is functionally connected to a second tip arm that can be resiliently moved relative to the at least one support member, when the second compliant element is not biased, the second tip arm directly or indirectly fixes a second probe tip, which extends longitudinally beyond the second end of the at least one support member, and an annular base, which fixes the upper and lower compliant elements through the outermost extent of its exterior, wherein the first portions of the first and second compliant elements are separated longitudinally by at least one support member and the annular base, and when at least one of the first and second probe tips is biased toward the other probe tip, the second portions of the first and second compliant elements move closer together in the longitudinal direction.
本揭露存在並且包括眾多變化，例如：(1) 環形基座可能具有具備內部開口的圓形外部，內部開口有相對的弧形側面和較窄的相對平坦側面，以及連接平坦側面並為至少一個支撐件提供附著區域的上下表面，這些支撐件進而支撐第一和第二順應元件的端部，而弧形側面提供在任何變形之前，第一和第二順應元件的最外部部分可以駐留的間隙；(2) 第一和第二順應元件可能分別包括第一及第二螺旋彈簧元件，該等的的一端由至少一個支撐件支撐，而最外部部分可以駐留在環形基座的內部開口的弧形側面提供的間隙中；(3) 第一順應元件的第一螺旋彈簧元件可能從位於環形基座上方的第一支撐件開始向內移動，而第二順應元件的第二螺旋彈簧元件可能從位於環形基座下方的第二支撐件開始向內移動，第一和第二支撐件相對，第一和第二順應元件形成縱向分隔共面的繞線螺旋懸臂對；(4) 第一順應元件的第一螺旋彈簧元件的旋轉方向可能與第二順應元件的第二螺旋彈簧元件的旋轉方向相反；(5) 每個順應元件的螺旋懸臂可能在向內移動的過程中分為多個縱向間隔的懸臂，使多個第一懸臂元件連接到第一尖端臂的每一側，而多個第二懸臂元件則分別連接到第二尖端臂的任一側，進而支撐第一和第二探針尖；(6) 第一和第二螺旋彈簧元件中的至少一個可能具有以下結構之一：(i) 向內旋轉的圓形螺旋、(ii) 向內旋轉的矩形螺旋、(iii) 向內旋轉的六邊形螺旋、(iv) 向內旋轉的八邊形螺旋、(v) 從第一探針尖向第二探針尖觀察時，逆時針向內旋轉的螺旋，和(vi) 從第一探針尖向第二探針尖觀察時，順時針向內旋轉的螺旋；(7) 第一和第二螺旋彈簧元件中的至少一個可能具有以下旋轉範圍之一：(i) 至少180°、(ii) 至少360°、(iii) 至少540°，和(iv) 至少720°；(8) 第一順應元件的第一和第二螺旋彈簧元件中的至少一個可能具有第一旋轉方向，而第二順應元件的第一和第二螺旋彈簧元件中的至少一個是平面的，具有第二旋轉方向，其中第一和第二旋轉方向選自包括下列族群之一：(i) 相同方向，和(ii) 不同方向；(9) 第一順應元件的第一部分可能比第二順應元件的第一部分更靠近至少一支撐件的第一端，而第二順應元件的第一部分可能比第一順應元件的第一部分更靠近至少一支撐件的第二端；(10) 第一順應元件可能從至少一支撐件的一部分開始，形成一個開始數量的第一懸臂，其中開始數量選自包括下列族群之一：(i) 至少一個第一平面懸臂，和(ii) 縱向分隔的至少兩個第一平面懸臂，開始懸臂的數量可能以第一尖端臂為結束點，其中該數量包括開始數量加上N，其中N至少為一；(11) N可能選自包括下列族群之一：至少為2、3、4、5、6、7和8；(12) 第二順應元件可能從至少一支撐件的一部分開始，形成一個開始數量的第二懸臂，其中該開始數量選自包括下列族群之一：(i) 至少一個第二平面懸臂，和(ii) 縱向分隔的至少兩個第二平面懸臂，起始懸臂的數量可能以第二尖端臂為結束點，其中該數量包括起始數量加上P，其中P至少為一；(13) P可能選自包括下列族群之一：至少為2、3、4、5、6、7和8；(14) 環形基座可能是剛性的環形基座；(15) 環形基座和至少一支撐件可能直接接觸或相互構成一整體。Numerous variations exist and are included in the present disclosure, for example: (1) the annular base may have a circular outer portion with an inner opening, the inner opening having opposing curved sides and narrower opposing flat sides, and upper and lower surfaces connecting the flat sides and providing an attachment area for at least one support member, which in turn supports the ends of the first and second compliant elements, and the curved sides provide a gap in which the outermost portions of the first and second compliant elements can reside before any deformation; (2) the first and second compliant elements may include first and second coil spring elements, respectively, one end of each of which is supported by at least one support member, and the outermost portions can reside in the gap provided by the curved side of the inner opening of the annular base; (3) The first coil spring element of the first compliant element may start to move inward from the first support member located above the annular base, while the second coil spring element of the second compliant element may start to move inward from the second support member located below the annular base, the first and second support members are opposite to each other, and the first and second compliant elements form a pair of longitudinally separated and coplanar winding helical suspensions; (4) The rotation direction of the first coil spring element of the first compliant element may be opposite to the rotation direction of the second coil spring element of the second compliant element; (5) The helical suspension of each compliant element may be divided into a plurality of longitudinally spaced suspensions during the inward movement, so that a plurality of first suspension elements are connected to each side of the first tip arm, and a plurality of second suspension elements are respectively connected to either side of the second tip arm, thereby supporting the first and second probe tips; (6) At least one of the first and second coil spring elements may have one of the following structures: (i) a circular spiral that rotates inwardly, (ii) a rectangular spiral that rotates inwardly, (iii) a hexagonal spiral that rotates inwardly, (iv) an octagonal spiral that rotates inwardly, (v) a spiral that rotates inwardly counterclockwise when viewed from the first probe tip to the second probe tip, and (vi) a spiral that rotates inwardly clockwise when viewed from the first probe tip to the second probe tip; (7) At least one of the first and second coil spring elements may have one of the following rotation ranges: (i) at least 180°, (ii) at least 360°, (iii) at least 540°, and (iv) at least 720°; (8) At least one of the first and second coil spring elements of the first compliant element may have a first rotational direction, and at least one of the first and second coil spring elements of the second compliant element is planar and has a second rotational direction, wherein the first and second rotational directions are selected from one of the following groups: (i) the same direction, and (ii) different directions; (9) the first portion of the first compliant element may be closer to the first end of the at least one support member than the first portion of the second compliant element, and the first portion of the second compliant element may be closer to the second end of the at least one support member than the first portion of the first compliant element; (10) the first compliant element may start from a portion of the at least one support member to form a first cantilever with a starting number, wherein the starting number is selected from one of the following groups: (i) at least one first planar cantilever, and (ii) At least two first plane cantilevers separated longitudinally, the number of starting cantilevers may end at the first tip arm, wherein the number includes the starting number plus N, wherein N is at least one; (11) N may be selected from one of the following groups: at least 2, 3, 4, 5, 6, 7 and 8; (12) the second compliant element may start from a portion of at least one support member to form a starting number of second cantilevers, wherein the starting number is selected from one of the following groups: (i) at least one second plane cantilever, and (ii) at least two second plane cantilevers separated longitudinally, the number of starting cantilevers may end at the second tip arm, wherein the number includes the starting number plus P, wherein P is at least one; (13) P may be selected from one of the following groups: at least 2, 3, 4, 5, 6, 7 and 8; (14) The annular base may be a rigid annular base; (15) the annular base and at least one supporting member may be in direct contact or form an integral part with each other.
對於本揭露所述的其他特徵，熟悉此項技藝之人士在閱讀本教導後將能夠理解。本文的其他方面可能涉及上述方面的組合。這些本文的其他方面可能提供上述方面的各種組合，以及提供其他未在上文中明確設定的配置、結構、功能關係和流程，而這些是由本文中的其他具體教示或整體說明書的教學所教授的。For other features described in the present disclosure, people familiar with this technology will be able to understand after reading this teaching. Other aspects of this article may involve combinations of the above aspects. These other aspects of this article may provide various combinations of the above aspects, as well as other configurations, structures, functional relationships and processes that are not explicitly set in the above, which are taught by other specific teachings in this article or the teachings of the overall specification.
圖1A至圖1I示意了一個示例多層、多材料電化學製造過程中的各種狀態的側視圖。圖1A至圖1G展示了多層製造過程中單層形成的各個階段，其中第二種金屬被沉積在第一種金屬上，以及在第一種金屬的開口中，使第一和第二金屬形成該層的一部分。在圖1A中，顯示了具有表面88的基板82的側視圖，上面放置了可圖案化的光阻84，如圖1B所示。在圖1C中，顯示了從光阻表面86到基板82的表面88的厚度延伸的開口或孔92(a) - 92(c)的圖案，該圖案是由於對光阻進行固化、曝光和開發而產生的。在圖1D中，金屬94（例如鎳）顯示為被電鍍到開口92(a) - 92(c)中。在圖1E中，光阻已被去除（即化學或其它方式去除），以露出未被第一金屬94覆蓋的基板82區域。在圖1F中，第二金屬96（例如銀）顯示為被均勻電鍍到基板82（導電的）的整個暴露部分以及第一金屬94（同樣是導電的）上。圖1G描繪了由於對第一和第二金屬進行平坦化而形成的結構的完成第一層，該結構使第一金屬裸露，並為第一層設定了厚度。在圖1H中，展示了重複進行圖1B至圖1G中所示的過程步驟多次以形成多層結構的結果，其中每一層由兩種材料組成。對於大多數應用，其中一種材料被去除，如圖1I所示，以產生所需的3D結構98（例如，元件或設備）或多個這樣的結構。Figures 1A-1I illustrate side views of various states in an example multi-layer, multi-material electrochemical manufacturing process. Figures 1A-1G show various stages of formation of a single layer in a multi-layer manufacturing process, wherein a second metal is deposited on a first metal, and in an opening in the first metal so that the first and second metals form part of the layer. In Figure 1A, a side view of a substrate 82 having a surface 88 is shown, on which a patternable photoresist 84 is placed, as shown in Figure 1B. In Figure 1C, a pattern of openings or holes 92(a)-92(c) extending from the photoresist surface 86 to the thickness of the surface 88 of the substrate 82 is shown, which pattern is produced by curing, exposing and developing the photoresist. In FIG. 1D , a metal 94 (e.g., nickel) is shown plated into openings 92 (a) - 92 (c). In FIG. 1E , the photoresist has been removed (i.e., chemically or otherwise) to expose areas of the substrate 82 not covered by the first metal 94. In FIG. 1F , a second metal 96 (e.g., silver) is shown plated uniformly over the entire exposed portion of the substrate 82 (conductive) and the first metal 94 (also conductive). FIG. 1G depicts the completed first layer of the structure formed as a result of planarizing the first and second metals, exposing the first metal and setting the thickness for the first layer. In FIG. 1H , the result of repeating the process steps shown in FIGS. 1B to 1G multiple times to form a multi-layer structure is shown, wherein each layer is composed of two materials. For most applications, one material is removed, as shown in FIG. 1I , to produce a desired 3D structure 98 (eg, a component or device) or multiple such structures.
本揭露的各個方面的各個實施例涉及由材料形成三維結構，其中一些或全部可以是電沉積或化學沉積的（如圖1A-1I的示例中所示） 。 這些結構中的一些可以由一種或多種沉積材料形成的單一構建層形成，而其它結構由多個構建層形成，每個構建層包括至少兩種材料(例如，兩層或更多層，較佳的是五層或更多層) ，並且最佳的是十層或更多層）。 在一些實施例中，層厚度可以小至一微米或大至五十微米。 在其它實施例中，可以使用較薄的層，而在其它實施例中，可以使用更厚的層。 在一些實施例中，微米級結構具有以0.1-10微米級精度定位的橫向特徵以及微米至數十微米量級的最小特徵尺寸。 在其它實施例中，可以形成具有精確較少的特徵放置和/或更大的最小特徵的結構。 在又一些實施例中，可能需要更高的精度和更小的最小特徵尺寸。 在本申請中，中尺度(meso-scale)和毫米尺度具有相同的含義，並且指的是可具有可延伸至0.5-50毫米範圍或更大的一個或多個尺寸的裝置，並且特徵以微米到 100 微米範圍內的精度定位，最小特徵尺寸為數十微米到數百微米。Various embodiments of various aspects of the present disclosure involve forming three-dimensional structures from materials, some or all of which may be electrodeposited or chemically deposited (as shown in the examples of Figures 1A-1I). Some of these structures may be formed from a single building layer formed from one or more deposited materials, while other structures are formed from multiple building layers, each building layer including at least two materials (e.g., two or more layers, preferably five or more layers, and most preferably ten or more layers). In some embodiments, the layer thickness may be as small as one micron or as large as fifty microns. In other embodiments, thinner layers may be used, while in other embodiments, thicker layers may be used. In some embodiments, the micron-scale structures have lateral features positioned with 0.1-10 micron-level precision and minimum feature sizes on the order of microns to tens of microns. In other embodiments, structures may be formed with less precise feature placement and/or larger minimum features. In still other embodiments, higher precision and smaller minimum feature sizes may be desired. In this application, meso-scale and millimeter scale have the same meaning and refer to devices that may have one or more dimensions that may extend to the range of 0.5-50 mm or larger, and features are positioned with an accuracy in the range of microns to 100 microns, with minimum feature sizes of tens to hundreds of microns.
本文所揭示的各種實施例、替代方案和技術可以使用單一圖案製程在所有層上形成多層結構，或者在不同層上使用不同的圖案製程。例如，本文的各種實施例可能使用可適應式接觸遮罩和遮罩操作（即使用與基板接觸但不黏附於基板的遮罩的操作）、接近遮罩和遮罩操作（即使用至少部分地通過其接近基板而至少部分選擇性地遮蔽基板的遮罩的操作，即使未進行接觸）、非可適應式遮罩和遮罩操作（即基於其接觸表面不明顯適應的遮罩和操作）和/或黏附遮罩和遮罩操作（使用與基板黏附而不僅僅是接觸的遮罩和操作，用於發生選擇性沉積或蝕刻的基板）。可適應式接觸遮罩、接近遮罩和非可適應式接觸遮罩具有一個共同特性，即它們是預先形成並帶到或接近將要處理的表面（即將要處理的表面的暴露部分）。這些遮罩通常可以在不損壞遮罩或接觸或接近的表面的情況下被移除。黏附遮罩通常形成在要處理的表面上（即將要被遮蔽的表面的部分）並與該表面結合，以至於它們不能在不完全破壞或損壞的情況下與該表面分離，也不能再次使用。黏附遮罩可以以多種方式形成，包括：(1) 應用光阻、選擇性曝光光阻，然後發展光阻，(2) 預先圖案化遮罩材料的選擇性轉移，和/或 (3) 通過材料的計算機控制沉積直接形成遮罩。在某些實施例中，黏附的遮罩材料可以用作該層的犧牲層，或者僅用作在完成該層的形成之前由另一種材料（例如，電介質或導電材料）替換的遮罩材料，其中替換材料將被視為該層的犧牲材料。遮罩材料在沉積材料到其中的間隙或開口之前或之後，可能會進行平坦化，也可能不進行。Various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning process on all layers, or may use different patterning processes on different layers. For example, various embodiments herein may use adaptable contact masks and masking operations (i.e., operations using a mask that is in contact with but not adhered to a substrate), proximity masks and masking operations (i.e., operations using a mask that selectively masks a substrate at least partially by its proximity to the substrate, even if no contact is made), non-adaptable masks and masking operations (i.e., masks and operations that do not explicitly adapt based on the surface they contact), and/or adhesion masks and masking operations (using masks and operations that adhere to, but not just in contact with, a substrate for selective deposition or etching to occur). Conformable contact masks, proximity masks, and non-conformable contact masks share a common characteristic in that they are preformed and brought to or in proximity to the surface to be processed (i.e., the exposed portion of the surface to be processed). These masks can generally be removed without damaging the mask or the surface to which they are contacted or in proximity. Adhesive masks are generally formed on the surface to be processed (i.e., the portion of the surface to be masked) and become bonded to that surface such that they cannot be separated from that surface or reused without complete destruction or damage. Adhesive masks can be formed in a variety of ways, including: (1) application of a photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of a pre-patterned mask material, and/or (3) direct formation of the mask by computer controlled deposition of the material. In some embodiments, the adhered mask material may be used as a sacrificial layer for the layer, or may simply be used as a mask material that is replaced by another material (e.g., a dielectric or conductive material) prior to completing the formation of the layer, where the replaced material will be considered a sacrificial material for the layer. The mask material may or may not be planarized before or after depositing the material into the gaps or openings therein.
圖案製程操作可用於選擇性沉積材料和/或可用於選擇性蝕刻材料。被選擇性蝕刻的區域可以通過選擇性填充或通過毯式沉積等方式用不同的所需材料填充。在某些實施例中，逐層堆疊可能涉及同時形成多層的部分。在某些實施例中，與某些層級相關的沉積可能導致與其它層級相關的區域的沉積（即，與定義不同層的幾何配置的頂部和底部邊界層之間的區域）。選擇性蝕刻和/或交錯材料沉積也可與多層結構相關聯。Patterning process operations may be used to selectively deposit materials and/or may be used to selectively etch materials. The selectively etched areas may be filled with different desired materials by selective filling or by blanket deposition, etc. In some embodiments, layer-by-layer stacking may involve forming portions of multiple layers simultaneously. In some embodiments, deposition associated with certain levels may result in deposition of areas associated with other levels (i.e., areas between top and bottom boundary layers that define a geometric configuration of different layers). Selective etching and/or staggered material deposition may also be associated with multi-layer structures.
可用於形成結構的臨時基板可能是犧牲型（即在分離沉積材料的過程中被破壞或損壞，以至於不能再次使用）或非犧牲型（即未被破壞或過度損壞，即未損壞到不能再次使用的程度，例如，在基板和結構的初始層之間放置了犧牲層或釋放層）。非犧牲型基板可被視為可重複使用的，且可能需要很少或沒有重新加工（例如，重新規劃一個或多個選定的表面或應用釋放層等），儘管它們可能因為各種原因而被重複使用或不被重複使用。Temporary substrates that may be used to form structures may be sacrificial (i.e., destroyed or damaged during the process of separating the deposited material to the point where they cannot be reused) or non-sacrificial (i.e., not destroyed or excessively damaged, i.e., not damaged to the point where they cannot be reused, e.g., a sacrificial or release layer is placed between the substrate and the initial layer of the structure). Non-sacrificial substrates may be considered reusable and may require little or no reprocessing (e.g., re-planning of one or more selected surfaces or application of a release layer, etc.), although they may or may not be reused for a variety of reasons.
對於理解本揭露實施例（無論是對於裝置本身、製造裝置的某些方法，還是使用裝置的某些方法）可能使用的各種術語和概念的定義，將被技術領域的專業人員所理解。Definitions of various terms and concepts that may be used to understand the embodiments of the present disclosure (whether for the device itself, certain methods of making the device, or certain methods of using the device) will be understood by professionals in the technical field.
本揭露的一些實施例涉及彈簧模組，其中每個彈簧模組包括至少一個位於中心的尖端，該尖端附接至至少一個平面順應性彈簧元件（同時處於非偏置狀態），該平面順應性彈簧元件又經由連接橋或支撐件，或其中基座提供支撐件功能的至少一部分，其中主彈簧柔量的軸線垂直於形成彈簧元件的一個或多個彈簧臂的平面。 一些實施例涉及包括順應性元件的彈簧模組，該順應性元件具有向內纏繞螺旋(無論是平滑彎曲配置還是多邊形配置或成角度配置)形式的扁平彈簧，其終止於縱向延伸的接觸尖端或尖端延伸部、支撐件、或臂。 一些實施例涉及形成為單一彈簧模組或由單一彈簧模組形成的探針。 一些實施例涉及形成為背對背彈簧模組或由背靠背彈簧模組形成的探針，所述彈簧模組可共用連接支撐件的公共基座元件、用作支撐件的基座元件、或簡單地具有連接到彈簧元件的一個或多個接合的支撐件。一些實施例涉及由多個彈簧模組與諸如探針尖端（其可以與彈簧模組尖端分離）、尖端延伸部分和護套等其它部件組合形成的探針。 一些實施例涉及用於形成彈簧模組的方法； 包括單個彈簧模組的成形探針、包括背對背彈簧模組的成形探針、或包括在形成並同時組裝部件或結構的過程期間建立的多個黏附或接觸彈簧模組的成形探針，而還有其它涉及形成探針部件並隨後將它們組裝成工作探針結構。 還有其它實施例涉及包括一種或多種上述探針類型以及陣列結構(例如，基底、導板等)的探針陣列。 還有其它實施例涉及製造此類探針陣列的方法。Some embodiments of the present disclosure relate to spring modules wherein each spring module comprises at least one centrally located tip attached to at least one planar compliant spring element (while in a non-biased state) which in turn is connected via a connecting bridge or support, or wherein a base provides at least a portion of the support function, wherein the axis of the main spring compliance is perpendicular to the plane forming one or more spring arms of the spring element. Some embodiments relate to spring modules comprising a compliant element having a flat spring in the form of an inwardly wound spiral (whether in a smoothly curved configuration or a polygonal configuration or an angled configuration) terminating in a longitudinally extending contact tip or tip extension, support, or arm. Some embodiments relate to probes formed as or from a single spring module. Some embodiments relate to probes formed as or from back-to-back spring modules that may share a common base member that is connected to a support, a base member that serves as a support, or simply has one or more joined supports connected to the spring element. Some embodiments relate to probes formed from multiple spring modules in combination with other components such as a probe tip (which may be separate from the spring module tip), a tip extension, and a sheath. Some embodiments are directed to methods for forming spring modules; forming probes including a single spring module, forming probes including back-to-back spring modules, or forming probes including multiple adhered or contacting spring modules established during the process of forming and simultaneously assembling the components or structures, while still others are directed to forming probe components and subsequently assembling them into a working probe structure. Still other embodiments are directed to probe arrays including one or more of the above probe types and array structures (e.g., bases, guides, etc.). Still other embodiments are directed to methods of making such probe arrays.
本揭露的平面彈簧或平面順應元件可以以多種方式形成，並具有多種不同的配置。通常，這些順應元件包括平面彈簧，其部分從一個支撐件延伸到懸臂或橋式的尖端或尖端臂（例如，從不同的橫向支撐件位置開始的兩個或更多彈簧，並連接到一個共同的尖端臂，通常被稱為懸臂或懸臂）。在正常操作期間，這些可變部分通常跨越一個間隙或開放區域，彈簧可以在其中偏轉。這些可變部分通常在橫向平面內具有二維非線性配置，以及垂直於平面的厚度（例如，沿著縱向方向），其中，二維配置可能以樑結構的形式存在，具有彎曲或斜角的配置，其長度遠大於其寬度，例如，在某些變化中至少為5、10、20或甚至50倍以上，其中厚度通常小於樑的長度，例如，在某些變化中至少為5、10、20或甚至50倍以上，或者是彈簧元件的橫向尺寸，例如，在某些變化中為2、5、10或甚至20倍以上。在某些實施例中，當探針或模組由多個黏合的層形成時（例如，X-Y平面），此類配置的平面可能與層平面平行。彈簧的厚度（例如，Z方向）可能是單層的厚度，也可能是多層的厚度。在某些實施例中，順應元件包括多個間隔的平面彈簧元件。The planar springs or planar compliant elements of the present disclosure can be formed in a variety of ways and have a variety of different configurations. Typically, these compliant elements include a planar spring having portions extending from a support member to a cantilever or bridge-like tip or tip arm (e.g., two or more springs starting from different lateral support member locations and connected to a common tip arm are often referred to as a cantilever or cantilever). During normal operation, these variable portions typically span a gap or open area in which the spring can deflect. These variable portions typically have a two-dimensional nonlinear configuration in a transverse plane, and a thickness perpendicular to the plane (e.g., along the longitudinal direction), wherein the two-dimensional configuration may be in the form of a beam structure, a curved or angled configuration, whose length is much greater than its width, for example, at least 5, 10, 20 or even 50 times greater in some variations, wherein the thickness is typically less than the length of the beam, for example, at least 5, 10, 20 or even 50 times greater in some variations, or the transverse dimension of the spring element, for example, 2, 5, 10 or even 20 times greater in some variations. In some embodiments, when the probe or module is formed from multiple bonded layers (e.g., X-Y plane), the plane of such a configuration may be parallel to the plane of the layers. The thickness of the spring (e.g., Z direction) may be the thickness of a single layer or the thickness of multiple layers. In some embodiments, the compliant element includes a plurality of spaced-apart planar spring elements.
在某些實施例中，順應元件可能包括平面彈簧元件，這些元件不僅在懸臂或尖端結構處相互連接，而且還在介於這些末端元件之間的位置相互連接。在某些此類實施例中，平面彈簧元件可能從一端（例如，一個支撐件或尖端臂）開始，作為一個或多個加厚彈簧，具有相對較高的彈簧常數，然後通過去除初始彈簧結構頂部和底部之間的一些中間彈簧材料，以降低彈簧常數，使一開始作為少量但較厚的平面順應元件（例如，1、2或3個元件）過渡到更多較薄的平面元件，一些初始的平面元件分為2、3、4、5個或更多較薄的平面元件，在到達另一端（例如，懸臂的尖端）之前，因此，例如，彈簧常數、力量需求、超行程、應力、應變、電流承載能力、整體尺寸和其它操作參數可以被調整以滿足特定應用的需求。In some embodiments, the compliant elements may include planar spring elements that are interconnected not only at the cantilever or tip structure, but also at locations between these end elements. In some such embodiments, the planar spring elements may begin at one end (e.g., a support member or tip arm) as one or more thickened springs having a relatively high spring constant and then transition to a larger number of thinner planar elements by removing some intermediate spring material between the top and bottom of the initial spring structure to reduce the spring constant, with some of the initial planar elements being divided into 2, 3, 4, 5 or more thinner planar elements before reaching the other end (e.g., the tip of the cantilever) so that, for example, spring constants, force requirements, overtravel, stress, strain, current carrying capacity, overall size and other operating parameters can be adjusted to meet the needs of a particular application.
許多圖中包含參考編號，其中相似的結構或特徵在不同實施例中使用相同的編號表示。特別是，在各種實施例的圖中（即，圖2至圖8），當使用參考編號時，參考編號以3或4位數的格式呈現，可能後面跟有字母、破折號和/或額外的數字，其中第一位數（從左邊開始）代表FIG號碼，而最右邊的兩位或三位數字以及任何尾隨的字母、破折號或數字表示特定的一般結構或特徵。當兩個或更多的圖包含具有相同最左位數（以及後面的字母、破折號和其它數字）的參考時，這意味著這些特徵是相似的。以下的表格列出了這最右邊的兩位數字，以及附加的字母、破折號和數字，以及被表示的一般結構或特徵的簡要描述。在此及以下，像“頂部”、“底部”、“上部”、“下部”、“向下”、“向上”等相對詞語是指相對於圖中的插圖，以簡潔為緣由。同樣，像“左”、“右”、“上方”、“下方”等詞語仍然是相對於圖示的參考。結構/特徵的參考編號表
圖2A和圖2B展示了示例彈簧模組。圖2A顯示了一個示例彈簧模組200A的等距展開圖，包括兩個未偏轉的彈簧元件221-1和221-2，與彈簧元件相隔的基座201，以及連接支撐（例如，支撐件或橋樑）211，跨越彈簧元件221-1、221-2和基座201之間的縱向模組間隙MG。在圖2A的示例中，兩個彈簧元件221-1、221-2的每個都採用從徑向偏移的橋樑211到中心或軸向定位的尖端元件231的平面徑向螺旋形式，通過尖端結構231的下伸部連接。彈簧元件221-1、221-2之間縱向分隔一個間隙SG。在此示例中，橋樑211連接每個彈簧元件的一端，而尖端結構231通過尖端結構231的延伸部分連接彈簧元件221-1、221-2的另一端。尖端結構231具有所需的寬度TW和超過上部彈簧元件221-2的所需尖端高度TH，每個彈簧元件221-1、221-2具有所需的材料、樑厚度或彈簧高度SH、樑寬度或彈簧寬度SW、彈簧線圈間距CS以及螺旋樑長度，使得彈簧元件能夠在不超過結構和其所形成的材料的彈性偏轉極限的情況下，提供在其偏轉範圍內的所需固定或可變彈簧力。特別是，尖端結構231的長度可以使模組尖端結構朝基座壓縮達到所需的程度，而不會基座、橋樑和彈簧元件相互干擾。在一些實施例中，例如，每個模組尖端的最大行程距離可能只有5微米（um）或更少，也可能多達500微米（例如25微米、50微米、100微米或200微米）或更多。例如，在某些實施例中，每個模組的最大行程距離可能為25微米至200微米，而在其他示例實施例中，每個模組的最大行程距離可能為50微米至150微米。在一些實施例中，尖端結構的最大行程距離可能由硬擋止設置，例如藉由基座上的檔止結構使彈簧元件或尖端結構的偏轉部分與基座接觸，或者可能由與尖端結構接觸的表面（例如相鄰模組的表面）與橋樑的上部分接觸。在其他實施例中，最大行程距離可能由軟性擋止或順應性減小結構引起。實現最大偏轉（或行程）所需的力可能從0.1克力(gram force)到20克力或更大。在一些實施例中，0.5克力的力目標可能是合適的。在其他情況下，可能需要1克力、2克力、4克力、8克力或更多。在一些實施例中，模組高度MH（縱向尺寸）可能為50微米或更小，而在其他情況下，可能為500微米或更大。在一些實施例中，模組的整體徑向直徑或寬度MW可能為100微米或更小，或者為400微米或更大（例如150微米、200微米或250微米）。模組的彈簧元件，或樑元件，可能具有從1微米或更小到100微米或更大（例如10微米、20微米、30微米或40微米）的彈簧高度（或樑高度）SH，以及從1微米或更小到100微米或更大（例如10微米、20微米、30微米或40微米）的彈簧寬度（或樑寬度）SW。尖端結構可能具有均勻或變化的幾何形狀（例如，圓柱形、矩形、圓錐形、多齒形(multi-prong)或其他配置，或這些配置的組合）。與彈簧（樑）連接的尖端結構通常具有較大的橫截面寬度TW，超過它們連接的彈簧（樑）的寬度SW。2A and 2B illustrate example spring modules. FIG2A shows an isometric expansion of an example spring module 200A, including two undeflected spring elements 221-1 and 221-2, a base 201 spaced from the spring elements, and a connecting support (e.g., a support member or bridge) 211 spanning a longitudinal module gap MG between the spring elements 221-1, 221-2 and the base 201. In the example of FIG2A, each of the two spring elements 221-1, 221-2 is in the form of a planar radial spiral from a radially offset bridge 211 to a central or axially positioned tip element 231, connected by a down extension of the tip structure 231. The spring elements 221 - 1 and 221 - 2 are separated longitudinally by a gap SG. In this example, the bridge 211 connects one end of each spring element, and the tip structure 231 connects the other ends of the spring elements 221 - 1 and 221 - 2 through an extension of the tip structure 231. The tip structure 231 has a desired width TW and a desired tip height TH over the upper spring element 221-2, and each spring element 221-1, 221-2 has a desired material, beam thickness or spring height SH, beam width or spring width SW, spring coil spacing CS, and spiral beam length, so that the spring element can provide a desired fixed or variable spring force within its deflection range without exceeding the elastic deflection limit of the structure and the material it is formed of. In particular, the length of the tip structure 231 can enable the module tip structure to be compressed toward the base to a desired extent without the base, bridge and spring elements interfering with each other. In some embodiments, for example, the maximum travel distance of the tip of each module may be only 5 microns (um) or less, or may be as much as 500 microns (e.g., 25 microns, 50 microns, 100 microns, or 200 microns) or more. For example, in some embodiments, the maximum travel distance of each module may be 25 microns to 200 microns, while in other exemplary embodiments, the maximum travel distance of each module may be 50 microns to 150 microns. In some embodiments, the maximum travel distance of the tip structure may be set by a hard stop, such as by a stop structure on the base so that the deflected portion of the spring element or the tip structure contacts the base, or may be caused by a surface in contact with the tip structure (e.g., a surface of an adjacent module) and the upper portion of the bridge. In other embodiments, the maximum travel distance may be caused by a soft stop or a compliant reduction structure. The force required to achieve maximum deflection (or travel) may range from 0.1 gram force to 20 gram force or more. In some embodiments, a force target of 0.5 gram force may be appropriate. In other cases, 1 gram force, 2 grams force, 4 grams force, 8 grams force or more may be required. In some embodiments, the module height MH (longitudinal dimension) may be 50 microns or less, and in other cases, it may be 500 microns or more. In some embodiments, the overall radial diameter or width MW of the module may be 100 microns or less, or 400 microns or more (e.g., 150 microns, 200 microns, or 250 microns). The spring elements, or beam elements, of the module may have a spring height (or beam height) SH ranging from 1 micron or less to 100 microns or more (e.g., 10 microns, 20 microns, 30 microns, or 40 microns), and a spring width (or beam width) SW ranging from 1 micron or less to 100 microns or more (e.g., 10 microns, 20 microns, 30 microns, or 40 microns). The tip structures may have uniform or varying geometric shapes (e.g., cylindrical, rectangular, conical, multi-prong, or other configurations, or combinations of these configurations). The tip structures connected to the springs (beams) typically have a larger cross-sectional width TW than the width SW of the springs (beams) to which they are connected.
圖2B顯示了第二個示例彈簧模組200B的等距展開圖，它與圖2A的模組相似，唯一的區別在於兩個彈簧元件更厚，因此提供比圖2A的元件更大的彈簧常數。從另一個角度來看，圖2B的示例將需要更多的力來實現給定的偏轉，並且因此將在比圖2A的示例更小的偏轉下達到材料和結構幾何的屈服強度（例如，達到彈性偏轉限制）。FIG2B shows an isometric exploded view of a second example spring module 200B, which is similar to the module of FIG2A, with the only difference being that the two spring elements are thicker, thereby providing a larger spring constant than the elements of FIG2A. Viewed from another perspective, the example of FIG2B will require more force to achieve a given deflection, and will therefore reach the yield strength of the material and structural geometry (e.g., reach the elastic deflection limit) at a smaller deflection than the example of FIG2A.
在其它實施例中，彈簧模組可能採用與圖2A或圖2B所示不同的形式。例如：(1) 一個模組可能具有單個彈簧元件或多於兩個彈簧元件；(2) 每個彈簧元件可能在寬度、厚度、長度或旋轉程度中有變化；(3) 彈簧元件可能在其長度上發生變化；(4) 彈簧元件可能具有不同於歐拉螺旋(Euler spirals)的配置，例如矩形螺旋、帶有圓角的矩形螺旋、S形結構或C形結構；(5) 單個彈簧元件可能連接到不止一個橋接連接點，例如連接到模組周圍180度、120度或90度處的橋接連接點；(6) 橋接連接點可以位於不同的橋上；(7) 基座元件的徑向範圍可能小於彈簧/橋接連接點，以使更高的模組的基底在模組尖端在堆疊時足夠壓縮時延伸到更低相鄰模組的上部範圍以下；(8) 模組基底可以替換為允許從兩個方向對模組彈簧進行壓縮的額外彈簧；(9) 探針尖端可能與模組的整體橫向配置不是側向居中的（即，在逐層形成時，與壓縮主軸或主構建軸不重合甚至共線性）。In other embodiments, the spring module may take a different form than that shown in FIG. 2A or FIG. 2B. For example: (1) a module may have a single spring element or more than two spring elements; (2) each spring element may vary in width, thickness, length, or degree of rotation; (3) the spring elements may vary in their length; (4) the spring elements may have configurations different from Euler spirals, such as rectangular spirals, rectangular spirals with rounded corners, S-shaped structures, or C-shaped structures; (5) a single spring element may be connected to more than one bridge connection point, such as bridge connection points at 180 degrees, 120 degrees, or 90 degrees around the module; (6) the bridge connection points may be located on different bridges; (7) The radial extent of the base element may be smaller than the spring/bridge connection point so that the base of the taller module extends below the upper extent of the lower adjacent module when the module tip is sufficiently compressed when stacked; (8) the module base may be replaced with additional springs that allow compression of the module springs from two directions; (9) the probe tip may not be laterally centered with respect to the overall lateral configuration of the module (i.e., not coincident or even colinear with the compression axis or the major build axis during layer-by-layer formation).
圖2C顯示了探針200C的部分剖視圖，包括：（a）類似於圖2A和圖2B的多個彈簧模組200A和200B，（b）第一個或上部多模組尖端432-U，（c）第一個或上部尖端支撐或延伸臂432-UA，它可能與其直接交互的模組的尖端連接或黏結，（c）第一個或上部尖端過度壓縮檔止435-U，（d）第二個或下部尖端432-L，（e）第二個尖端或下部支撐或延伸臂432-LA，它可能與其直接交互的模組的尖端連接或黏結，或者不連接或不黏結，和（f）護套451（以切割視圖顯示，將彈簧模組保持在相互之間基本線性的配置，並限制尖端的縱向延伸），其中護套具有用於通過尖端支撐臂432-UA和432-LA的開口442-U和442-L。尖端432-L具有矩形配置，可能對於接觸焊料顆粒或其它突出的接觸表面是有用的。在圖2C的探針設計中，如果發生足夠的壓縮，每個模組在以下兩個事件之一發生時都會達到壓縮限制：(1) 當彈簧模組的下彈簧元件的中心部分與模組基座的上表面接觸時，或者 (2) 當緊鄰的上模組基座的下表面與下模組橋樑的上表面接觸時。探針200C作為整體可能在上尖端支撐臂432-UA和下尖端支撐臂432-LA都達到壓縮極限時達到壓縮極限，這可能在任何彈簧模組達到壓縮極限之前或僅在部分模組達到其自己的壓縮極限之後發生。探針的直徑可能具有所需的陣列間距的適當大小。例如，有效的探針直徑可能小至100微米或更小，或大至600微米或更大。在某些實施例中，例如，用於具有400微米間距陣列的探針可能具有250至350微米範圍內的有效直徑，或者用於300微米陣列的探針可能具有150至250微米範圍內的有效直徑。探針的高度可能設置為提供有效的縱向行程，以便在與半導體晶圓或其它電子元件接觸時可以滿足個別模組、探針或整個陣列的超行程要求。例如，超行程可能在25微米或更小至400微米或更多的範圍內，而探針高度可能在150微米或更小至2000微米或更多的範圍內。FIG. 2C shows a partial cross-sectional view of a probe 200C including: (a) multiple spring modules 200A and 200B similar to FIG. 2A and FIG. 2B , (b) a first or upper multiple module tip 432-U, (c) a first or upper tip support or extension arm 432-UA which may be connected or bonded to the tip of the module with which it directly interacts, (c) a first or upper tip over-compression stop 435-U, (d) a second or lower tip 432-U 32-L, (e) a second tip or lower support or extension arm 432-LA, which may or may not be connected or bonded to the tip of the module with which it directly interacts, and (f) a sheath 451 (shown in cutaway view, holding the spring modules in a substantially linear configuration relative to each other and limiting the longitudinal extension of the tip), wherein the sheath has openings 442-U and 442-L for passing the tip support arms 432-UA and 432-LA. The tip 432-L has a rectangular configuration and may be useful for contacting solder particles or other protruding contact surfaces. In the probe design of FIG2C, if sufficient compression occurs, each module will reach its compression limit when one of two events occurs: (1) when the center portion of the lower spring element of the spring module contacts the upper surface of the module base, or (2) when the lower surface of the adjacent upper module base contacts the upper surface of the lower module bridge. The probe 200C as a whole may reach its compression limit when both the upper tip support arm 432-UA and the lower tip support arm 432-LA reach their compression limits, which may occur before any spring module reaches its compression limit or only after some modules reach their own compression limits. The diameter of the probe may be of an appropriate size for the desired array pitch. For example, the effective probe diameter may be as small as 100 microns or less, or as large as 600 microns or more. In certain embodiments, for example, a probe for an array having a 400 micron pitch may have an effective diameter in the range of 250 to 350 microns, or a probe for a 300 micron array may have an effective diameter in the range of 150 to 250 microns. The height of the probe may be set to provide an effective longitudinal travel so that overtravel requirements for individual modules, probes, or the entire array can be met when contacting a semiconductor wafer or other electronic component. For example, overtravel may be in the range of 25 microns or less to 400 microns or more, and the probe height may be in the range of 150 microns or less to 2000 microns or more.
對於圖2C中所示探針的實施例，存在許多可能的變化，包括但不限於：(1) 模組尖端可能連接到相鄰模組基座，或者模組尖端可能僅與相鄰模組基座接觸；(2) 在形成給定的探針時可能使用超過四個或少於四個彈簧模組；(3) 在給定的探針中，一些或所有彈簧模組可能具有相似的彈簧常數和/或配置，或不同的彈簧常數和/或配置；(4) 尖端支撐臂上可能有位於與接觸尖端相距的位置的壓縮檔止；(5) 探針的每端可能具有一個接觸尖端，或者一個端具有接觸尖端，而另一個端具有可黏結的尖端或附著結構；(6) 探針可能具有阻止模組從護套的一個或兩個端滑出的一個或多個固定端蓋，或者可能沒有固定端蓋；(7) 探針可能具有允許發生彈簧模組載入的護套端，從而允許模組內的彈簧產生偏置而無需對探針端尖施加壓縮壓力，或者可能允許在護套內的工作範圍位置之外形成彈簧模組；(8) 彈簧模組或尖端支撐臂可能具有滑動接觸或其它接觸，使電流可以從彈簧元件中分流，而流經護套；(9) 彈簧模組可能以一些介電元件形成；(10) 彈簧模組和/或護套可能包括介電元件或被介電元件分隔，使彈簧模組/尖端支撐臂與護套發生電隔離，例如，以提供雙電隔離的導電電流路徑，或確保陣列中一個探針的中央導電路徑不會意外短接到另一個相鄰探針上的導電路徑；(11) 可以形成由兩個或更多部分組成的護套，以允許將彈簧模組和其它元件組裝到護套中以形成探針；(12) 多個彈簧模組可以以彼此連接的方式形成，以提供一體式的順應結構（具有或不具有尖端支撐臂和尖端），可以完全形成在護套內、在護套內的一部分，將在形成後完成載入，或者與護套分離，以便稍後組裝到護套中；(13) 分裂的護套可以形成，具有易於在形成後進行組裝的卡合特性；和(14)可以在彈簧模組或護套的選定位置打孔或開口，以改善犧牲材料蝕刻到內部部分，這在使用多材料、多層電化學製造製程形成探針或模組時可能有用，該製程涉及必須去除犧牲材料。There are many possible variations on the embodiment of the probe shown in FIG. 2C , including, but not limited to: (1) a module tip may be connected to an adjacent module base, or a module tip may simply contact an adjacent module base; (2) more than four or fewer than four spring modules may be used in forming a given probe; (3) some or all of the spring modules in a given probe may have similar spring constants and/or configurations, or different spring constants and/or configurations; (4) the tip support arm may have a compression stop located at a distance from the contact tip; (5) the probe may have a contact tip at each end, or one end may have a contact tip and the other end may have a bondable tip or attachment structure; (6) The probe may have one or more fixed end caps to prevent the module from sliding out of one or both ends of the sheath, or may have no fixed end caps; (7) The probe may have a sheath end that allows spring module loading to occur, thereby allowing the spring within the module to generate bias without applying compressive pressure to the probe tip, or may allow the spring module to be formed outside the working range position within the sheath; (8) The spring module or tip support arm may have sliding contacts or other contacts that allow current to be diverted from the spring element and flow through the sheath; (9) The spring module may be formed with some dielectric components; (10) The spring module and/or the housing may include or be separated by a dielectric element to electrically isolate the spring module/tip support arm from the housing, for example, to provide dual electrically isolated conductive current paths or to ensure that a central conductive path of one probe in an array does not accidentally short to a conductive path on another adjacent probe; (11) the housing may be formed in two or more parts to allow the spring module and other components to be assembled into the housing to form the probe; (12) multiple spring modules may be formed in a manner connected to each other to provide a unitary compliant structure (with or without a tip support arm and tip) that may be formed completely within the housing, part of the housing to be loaded after formation, or separate from the housing for later assembly into the housing; (13) The split sheath can be formed having snap-fit features for ease of assembly after formation; and (14) holes or openings can be punched at selected locations in the spring module or sheath to improve etching of sacrificial material into the interior portion, which may be useful when forming a probe or module using a multi-material, multi-layer electrochemical manufacturing process that involves the necessary removal of sacrificial material.
圖3A到圖3D4提供了根據本揭露的另一實施例的探針3400或其部分的各種視圖，其中探針3400包括一個環形基座或框架3401，通過其外部橫向極限保持上順應元件或螺旋彈簧陣列3421-UC和下順應元件螺旋彈簧陣列3421-LC，以在上彈簧陣列3421-UC和下彈簧陣列3421-LC之間提供基本的支撐件功能。這些陣列包括相應的螺旋彈簧元件3421-1U、3421-2U和3421-1L、3421-2L。基座或框架3401具有圓形外觀，內部具有具有對立的弧形側面3401-A和較窄的對立平坦側面3401-F的開口（如圖3C1和3C2所示）。上表面和下表面連接平坦側面3401-F，並為上和下支撐或支撐件3411-1、3411-2、3412-1和3412-2提供附著區域，這些支撐或支撐件反過來支撐上螺旋彈簧陣列3421-UC和下螺旋彈簧陣列3421-LC的螺旋彈簧元件的端部，而弧形側面3401-A提供外部懸臂部分可以停留的間隙（在變形之前）。此外，基座3401的厚度充當支撐件間隔，在探針尖端3431-U和3431-L向彼此壓縮期間，螺旋彈簧元件的部分可以發生偏轉。特別是，基座3401可能是剛性基座。3A to 3D4 provide various views of a probe 3400 or portion thereof according to another embodiment of the present disclosure, wherein the probe 3400 includes an annular base or frame 3401 that holds an upper compliant element or coil spring array 3421-UC and a lower compliant element coil spring array 3421-LC by its outer lateral limits to provide a basic support member function between the upper spring array 3421-UC and the lower spring array 3421-LC. These arrays include corresponding coil spring elements 3421-1U, 3421-2U and 3421-1L, 3421-2L. The base or frame 3401 has a circular appearance with an opening inside having opposing curved sides 3401-A and narrower opposing flat sides 3401-F (as shown in Figures 3C1 and 3C2). The upper and lower surfaces connect the flat sides 3401-F and provide attachment areas for upper and lower supports or supports 3411-1, 3411-2, 3412-1 and 3412-2, which in turn support the ends of the coil spring elements of the upper coil spring array 3421-UC and the lower coil spring array 3421-LC, while the curved sides 3401-A provide a gap where the outer cantilever portion can rest (before deformation). In addition, the thickness of the base 3401 acts as a support member spacing, and during the compression of the probe tips 3431-U and 3431-L toward each other, portions of the helical spring element can deflect. In particular, the base 3401 may be a rigid base.
上彈簧陣列3421-UC和下彈簧陣列3421-LC的每一個從對立的支撐件對開始它們的向內路徑，作為上彈簧陣列3421-UC的基座3401上的兩個縱向分離的共面螺旋懸臂或彈簧元件3421-1U和3421-2U，以及下彈簧陣列3421-LC的基座3401下的共面螺旋懸臂或彈簧元件3421-1L和3421-2L。每個元件的每個懸臂在其向內的過程中分為兩個縱向間隔的懸臂，使得四個上懸臂元件UC1 – UC4連接到上尖端支撐臂3431-UA的每一側，而四個下懸臂元件LC1 – LC4連接到下尖端支撐臂3431-LA的每一側，這些支撐臂進一步支撐相應的接觸或黏結尖端3431-U和3431-L。Each of the upper spring array 3421-UC and the lower spring array 3421-LC begins their inward path from opposing pairs of supports as two longitudinally separated coplanar helical cantilevers or spring elements 3421-1U and 3421-2U above the base 3401 of the upper spring array 3421-UC, and coplanar helical cantilevers or spring elements 3421-1L and 3421-2L below the base 3401 of the lower spring array 3421-LC. Each cantilever of each element splits into two longitudinally spaced cantilever arms as it progresses inwardly, such that four upper cantilever elements UC1 - UC4 are connected to each side of the upper tip support arm 3431-UA, and four lower cantilever elements LC1 - LC4 are connected to each side of the lower tip support arm 3431-LA, which support arms further support corresponding contact or bonding tips 3431-U and 3431-L.
具體來說，上彈簧陣列3421-UC從支撐件3411-1的一部分開始，作為一開始數量的第一懸臂，其中開始數量選自包括以下族群之一：(a)至少一個第一平面懸臂，和(b)縱向分隔的至少兩個第一平面懸臂，其中開始數量的懸臂在第一尖端支撐臂3431-UA結束，作為縱向分隔的懸臂的多個，其中該多個包括開始數量加上N，其中N至少為一。Specifically, the upper spring array 3421-UC begins at a portion of the support member 3411-1 as a starting number of first suspensions, wherein the starting number is selected from one of the following groups: (a) at least one first plane suspension, and (b) at least two first plane suspensions separated longitudinally, wherein the starting number of suspensions ends at a first tip support arm 3431-UA as a plurality of longitudinally separated suspensions, wherein the plurality includes the starting number plus N, wherein N is at least one.
根據一實施例，N可以選自包括以下族群之一：至少為2、3、4、5、6、7和8。According to one embodiment, N can be selected from one of the following groups: at least 2, 3, 4, 5, 6, 7 and 8.
類似地，下彈簧陣列3421-LC從支撐件3412-1的一部分開始，作為一開始數量的第二懸臂，其中開始數量選自包括以下族群之一：(1)至少一個第二平面懸臂，和(2)縱向分隔的至少兩個第二平面懸臂，其中開始數量的懸臂在第二尖端支撐臂3431-LA結束，作為縱向分隔的懸臂的多個，其中該多個包括開始數量加上P，其中P至少為一。根據一實施例，P可以選自包括下列族群之一 : 至少為2、3、4、5、6、7和8。Similarly, the lower spring array 3421-LC begins at a portion of the support member 3412-1 as a starting number of second cantilevers, wherein the starting number is selected from one of the following groups: (1) at least one second planar cantilever, and (2) at least two second planar cantilevers spaced longitudinally, wherein the starting number of cantilevers ends at the second tip support arm 3431-LA as a plurality of longitudinally spaced cantilevers, wherein the plurality includes the starting number plus P, wherein P is at least one. According to one embodiment, P can be selected from one of the following groups: at least 2, 3, 4, 5, 6, 7, and 8.
此外，上彈簧陣列3421-UC的螺旋彈簧元件3421-1U和3421-2U的旋轉方向連接到上接觸尖端3431-U，並且相對於下彈簧陣列3421-LC的螺旋彈簧元件3421-1L和3421-2L連接到下接觸尖端3431-L具有相反的旋轉方向。In addition, the rotation direction of the coil spring elements 3421-1U and 3421-2U of the upper spring array 3421-UC is connected to the upper contact tip 3431-U, and has an opposite rotation direction relative to the coil spring elements 3421-1L and 3421-2L of the lower spring array 3421-LC is connected to the lower contact tip 3431-L.
此外，支撐件3411-1、3411-2、3412-1和3412-2僅在上螺旋陣列3421-UC的多個螺旋彈簧或樑之間，以及下螺旋陣列3421-LC的多個螺旋彈簧或樑之間提供中間支撐功能，但不提供兩個彈簧組之間的支撐功能，因為該功能由基座3401直接提供。In addition, the support members 3411-1, 3411-2, 3412-1 and 3412-2 only provide an intermediate support function between the multiple coil springs or beams of the upper coil array 3421-UC and the multiple coil springs or beams of the lower coil array 3421-LC, but do not provide a support function between the two spring groups because this function is directly provided by the base 3401.
圖3A、3B1和圖3B2分別提供了探針3400的側面、上等軸測和下等軸測視圖，其中可以看到探針的不同特徵。圖3B1提供了探針3400的上部彈簧陣列3421-UC的最上部一對螺旋彈簧元件3421-1U和3421-2U的視圖，而圖3B2提供了探針3400的下部彈簧陣列3421-LC的最下部一對螺旋彈簧元件3421-1L和3421-2L的視圖。圖3A、3B1和3B2中的每一個都提供了上下尖端3431-U和3431-L以及中央基座3401的視圖。圖3A、3B1和3B2還提供了上支撐3411-1和3411-2以及下支撐3412-1和3412-2的視圖，以及上彈簧元件3421-1U和3421-2U和下彈簧元件3421-1L和3421-2L的縱向分隔的外部部分的視圖，其中上和下彈簧元件3421-1U、3421-2U和3421-1L、3421-2L是懸臂元件。還可以看到成對共面懸臂元件的交錯路徑從各自的支撐件向內傳播，在各自的中心尖端相遇。3A, 3B1, and 3B2 provide side, upper isometric, and lower isometric views of the probe 3400, respectively, in which different features of the probe can be seen. FIG. 3B1 provides a view of the uppermost pair of helical spring elements 3421-1U and 3421-2U of the upper spring array 3421-UC of the probe 3400, while FIG. 3B2 provides a view of the lowermost pair of helical spring elements 3421-1L and 3421-2L of the lower spring array 3421-LC of the probe 3400. Each of FIG. 3A, 3B1, and 3B2 provides a view of the upper and lower tips 3431-U and 3431-L and the central base 3401. 3A, 3B1 and 3B2 also provide views of upper supports 3411-1 and 3411-2 and lower supports 3412-1 and 3412-2, and views of longitudinally separated outer portions of upper spring elements 3421-1U and 3421-2U and lower spring elements 3421-1L and 3421-2L, where the upper and lower spring elements 3421-1U, 3421-2U and 3421-1L, 3421-2L are cantilever elements. It can also be seen that the staggered paths of pairs of coplanar cantilever elements propagate inwardly from their respective supports and meet at their respective central tips.
圖3C1和3C2分別提供了探針3400的上部和下部爆炸式等距視圖，因此不僅可以看到下懸臂元件或彈簧元件3421-1L和3421-2L的底部以及上懸臂元件或彈簧元件3421-1U和3421-2U的頂部，還可以看到下懸臂元件或彈簧元件3421-1L和3421-2L的頂部和上懸臂元件或彈簧元件3421-1U和3421-2U的底部以及環形基座3401的內部，其中包括平面和弧形側面壁3401-F和3401-A。在圖3C1和3C2中，探針3400的上彈簧陣列或上順應元件3421-UC與中央框架或基座元件3401分離，中央框架或基座元件3401又與探針3400的下彈簧陣列或下順應元件3421-LC分離。在圖3C1中，可以看到上尖端3431-U以及上彈簧陣列3421-UC和3421-LC的頂部和中央框架元件3401的頂部。在圖3C2中，可以看到下尖端3431-L以及上彈簧陣列3421-UC和3421-LC的底部和中央框架元件3401的底部。如虛線所示連接的爆炸元件，中央框架元件3401支撐上彈簧陣列3421-UC和下彈簧陣列3421-LC的外部橫向極限，更具體地說，支撐件3411-1、3411-2、3412-1和3412-2支援那些懸臂元件或彈簧元件3421-1U、3421-2U、3421-1L和3421-2L。Figures 3C1 and 3C2 provide upper and lower exploded isometric views of the probe 3400, respectively, so that not only the bottom of the lower cantilever element or spring element 3421-1L and 3421-2L and the top of the upper cantilever element or spring element 3421-1U and 3421-2U can be seen, but also the top of the lower cantilever element or spring element 3421-1L and 3421-2L and the bottom of the upper cantilever element or spring element 3421-1U and 3421-2U and the interior of the annular base 3401 can be seen, including the planar and curved side walls 3401-F and 3401-A. In Figures 3C1 and 3C2, the upper spring array or upper compliant element 3421-UC of the probe 3400 is separated from the central frame or base element 3401, which is in turn separated from the lower spring array or lower compliant element 3421-LC of the probe 3400. In Figure 3C1, the upper tip 3431-U can be seen, as well as the top of the upper spring arrays 3421-UC and 3421-LC and the top of the central frame element 3401. In Figure 3C2, the lower tip 3431-L can be seen, as well as the bottom of the upper spring arrays 3421-UC and 3421-LC and the bottom of the central frame element 3401. As shown by the dashed lines connecting the explosive elements, the central frame element 3401 supports the outer lateral limits of the upper spring array 3421-UC and the lower spring array 3421-LC, more specifically, the supports 3411-1, 3411-2, 3412-1 and 3412-2 support those cantilever elements or spring elements 3421-1U, 3421-2U, 3421-1L and 3421-2L.
圖3D1至3D4提供了探針3400的四個不同的切割視圖，逐漸切去探針3400的一側，以揭示探針3400的內部結構，從而更容易看到和理解懸臂的變化。隨著螺旋元件朝著橫向居中的尖端元件向內旋轉，懸臂元件經歷從基座3401上方的兩個縱向分隔的懸臂元件或彈簧元件3421-2U和3421-1U以及基座3401下方的兩個縱向分隔的懸臂元件或彈簧元件3421-1L和3421-2L到基座3401上方的四個縱向分隔的懸臂元件UC1 – UC4以及基座3401下方的四個縱向分隔的元件LC1 – LC4的過渡，其中樑到達它們分別縱向可移動的尖端臂元件3431-UA和3431-LA（在圖3D3中最容易看到），它們進一步連接或成為尖端3431-U和3431-L。根據一實施例，基座3401和至少其中的一個支撐件3411-1、3411-2、3412-1和3412-2是直接接觸或與彼此構成一整體。3D1 to 3D4 provide four different cutaway views of the probe 3400, gradually cutting away a side of the probe 3400 to reveal the internal structure of the probe 3400, making it easier to see and understand the changes in the cantilever. As the spiral element rotates inwardly toward the laterally centered tip element, the cantilever elements undergo a transition from two longitudinally separated cantilever elements or spring elements 3421-2U and 3421-1U above the base 3401 and two longitudinally separated cantilever elements or spring elements 3421-1L and 3421-2L below the base 3401 to four longitudinally separated cantilever elements UC1 - UC4 above the base 3401 and four longitudinally separated elements LC1 - LC4 below the base 3401, where the beams reach their longitudinally movable tip arm elements 3431-UA and 3431-LA, respectively (best seen in FIG. 3D3), which further connect or become tips 3431-U and 3431-L. According to one embodiment, the base 3401 and at least one of the supports 3411-1, 3411-2, 3412-1 and 3412-2 are in direct contact or integrally formed with each other.
圖3E1提供了探針3400的側視圖，類似於圖3A，但標有17個樣本層級L1到L17，其中每個層級沿著探針3400的縱向軸（即Z軸如所示）具有所標識的厚度，可以例如通過多層製造過程（例如，通過使用單一或多種結構材料（以及犧牲材料）的多層、多材料電化學製造過程，使用與探針3400的縱向軸對應的建造軸或層疊軸）來製造探針3400。在這些形成實施例中，雖然可以一次製作一個探針，但通常更喜歡通過逐層建造的方式同時製造數百甚至數千個探針。FIG3E1 provides a side view of probe 3400, similar to FIG3A, but with 17 sample levels L1 to L17 labeled, each of which has a thickness identified along the longitudinal axis of probe 3400 (i.e., the Z axis as shown), and probe 3400 can be manufactured, for example, by a multi-layer manufacturing process (e.g., by a multi-layer, multi-material electrochemical manufacturing process using a single or multiple structural materials (and sacrificial materials), using a building axis or stacking axis corresponding to the longitudinal axis of probe 3400). In these formation embodiments, although one probe can be manufactured at a time, it is generally preferred to manufacture hundreds or even thousands of probes simultaneously in a layer-by-layer construction manner.
圖3E2-A至3E9-B示例了圖層L1 – L17的頂視圖（-A圖）和等距視圖（-B圖）的八種獨特橫切面配置。Figures 3E2-A to 3E9-B illustrate eight unique cross-section configurations of top (-A) and isometric (-B) views of layers L1 – L17.
圖3E2-A和3E2-B示例了L1和L17層的視圖，其中可以看到尖端，即L1的下尖端3431-L和L17的上尖端3431-U。Figures 3E2-A and 3E2-B illustrate views of the L1 and L17 layers, where the tips can be seen, namely the lower tip 3431-L of L1 and the upper tip 3431-U of L17.
圖3E3-A和3E3-B示例了L2、L4、L6和L8的視圖，提供了平面螺旋彈簧元件3421-1L、3421-2L的部分以及形成懸臂部分LC1到LC4（未標記）的其最內部區域，下尖端支撐臂3431-LA的部分和下支撐件3412-1和3412-2的部分，其中可以看到雙層、交織的螺旋配置。Figures 3E3-A and 3E3-B illustrate views of L2, L4, L6 and L8, providing portions of the planar helical spring elements 3421-1L, 3421-2L and their innermost regions forming cantilever portions LC1 to LC4 (unlabeled), portions of the lower tip support arm 3431-LA and portions of the lower supports 3412-1 and 3412-2, in which a double-layered, interwoven helical configuration can be seen.
圖3E4-A和3E4-B示例了L3和L7的視圖，其中可以看到不完整的螺旋彈簧元件3421-1L、3421-2L以及支撐件3412-1和3412-2（類似於圖3E3-A和3E3-B的特徵，但缺少LC1 – LC4部分）。這些圖中反映的螺旋部分，與34E3-A和34E3-B的覆蓋和底部部分結合，形成彈簧元件外部最側面的加厚懸臂部分，其中下部順應元件3421-LC僅包括兩個加厚懸臂元件或彈簧元件3421-1L和3421-2L，而不是加入尖端支撐臂3431-LA的四個較薄懸臂元件或彈簧元件LC1 – LC4的元件。Figures 3E4-A and 3E4-B illustrate views of L3 and L7 where incomplete helical spring elements 3421-1L, 3421-2L and supports 3412-1 and 3412-2 are visible (similar to the features of Figures 3E3-A and 3E3-B, but with portions LC1 – LC4 missing). The helical portions reflected in these figures, combined with the cover and bottom portions of 34E3-A and 34E3-B, form the outermost thickened cantilevered portion of the spring element, where the lower compliant element 3421-LC includes only two thickened cantilevered elements or spring elements 3421-1L and 3421-2L, rather than the four thinner cantilevered elements or spring elements LC1 – LC4 that join the tip support arm 3431-LA.
圖3E5-A和3E5-B示例了L5的視圖，其中包括下尖端支撐臂3431-LA的部分和支撐件3431-1和3431-2的部分，其提供懸臂彈簧元件3421-1L和3421-2L之間的連接。Figures 3E5-A and 3E5-B illustrate views of L5, including portions of the lower tip support arm 3431-LA and portions of supports 3431-1 and 3431-2 that provide a connection between cantilever spring elements 3421-1L and 3421-2L.
圖3E6-A和3E6-B示例了L9的視圖，其中包括環形基座3401，通過兩個基座3401的部分，它們作為支撐件架起到分隔並連接上順應元件或彈簧陣列3421-UC和下順應元件或彈簧陣列3421-LC的作用，其中基座3401的一些橫向部分對準及連接彈簧元件於它們的的支撐件區域3411-1、3411-2、3412-1和3412-2。探針3400的向內螺旋的實際開始取決於L8的特徵如何與L9的特徵進行介面，以及類似地L9的特徵如何與L10的特徵進行介面。在當前實施例中，該介面不垂直於纏繞螺旋的局部長度（即，提供最小寬度介面）而是以一種角度形成，使得與基座接觸的螺旋樑的外部部分在其長度上得到不同程度的支撐，而不同於內部部分得到的支撐。在一些變體中，可以以提供介面垂直於樑的局部長度的方式提供介面，以便基座（或其它支撐區域）提供樑區域的橫向垂直或基本垂直的過渡。在當前實施例中，垂直的過渡在其它樑到支撐區域的介面中提供，例如L4和L5、L5和L6、L12和L13、L13和L14以及其它樑分裂區域，如L2到L3、L3到L4、L6到L7、L7到L8、L10到L11、L11到L12、L14到L15和L15到L16，在這些區域中，樑的過渡沿著橫向線延伸，該線與樑的直接長度或局部長度基本垂直。這種垂直或非垂直的介面及其一致或變化的使用可以用於調整探針的性能或操作性質。在當前實施例中，由於與基座的非垂直介面接觸和與懸臂的其它樑之間的介面接觸，懸臂的外部部分被提供為單一的加厚樑，而懸臂結構的內部部分從開始時作為兩個中等厚度的樑，其結束在探針臂處為四個較薄的樑。在一些變體中，初始懸臂結構（從其橫向離開基座的位置來看）可開始作為單一的加厚樑或整個寬度上的多樑。樑長度沿著樑長度的其它過渡也可以設置為提供清晰或垂直的過渡，也可以設置為提供可變或非垂直的過渡。3E6-A and 3E6-B illustrate views of L9 including an annular base 3401 that acts as a support frame to separate and connect upper compliant elements or spring arrays 3421-UC and lower compliant elements or spring arrays 3421-LC through two portions of base 3401, wherein some lateral portions of base 3401 align and connect the spring elements to their support regions 3411-1, 3411-2, 3412-1 and 3412-2. The actual start of the inward spiraling of probe 3400 depends on how the features of L8 interface with the features of L9, and similarly how the features of L9 interface with the features of L10. In the current embodiment, the interface is not perpendicular to the local length of the wrapped spiral (i.e., providing a minimum width interface) but is formed at an angle so that the outer portion of the spiral beam that contacts the base is supported to a different extent over its length than the inner portion. In some variations, the interface can be provided in a manner that provides the interface perpendicular to the local length of the beam so that the base (or other support area) provides a lateral vertical or substantially vertical transition of the beam area. In the current embodiment, perpendicular transitions are provided in other beam to support region interfaces, such as L4 and L5, L5 and L6, L12 and L13, L13 and L14, and other beam split regions, such as L2 to L3, L3 to L4, L6 to L7, L7 to L8, L10 to L11, L11 to L12, L14 to L15, and L15 to L16, where the beam transitions extend along transverse lines that are substantially perpendicular to the direct or local length of the beam. Such perpendicular or non-perpendicular interfaces and their consistent or varied use can be used to adjust the performance or operational properties of the probe. In the current embodiment, due to the non-perpendicular interface contacts with the base and the interface contacts with the other beams of the cantilever, the outer portion of the cantilever is provided as a single thickened beam, while the inner portion of the cantilever structure starts as two medium thickness beams, which end as four thinner beams at the probe arm. In some variations, the initial cantilever structure (as viewed laterally from its position away from the base) may start as a single thickened beam or multiple beams across the width. Other transitions in beam length along the length of the beam may also be configured to provide a clear or perpendicular transition, or may be configured to provide a variable or non-perpendicular transition.
圖3E7-A和3E7-B顯示了L10、L12、L14和L16的視圖，它們展示了(1)上層平面螺旋彈簧元件3421-1U和3421-2U的部分，以及形成懸臂部分UC1到UC4（未標記）的內部擴展，(2)上層中央尖端臂3431-UA的部分，以及上層支撐件3411-1和3411-2的部分，其中可以看到雙重的、交織的螺旋配置。這些是上層的順應元件，對應於圖34E3-A和34E3-B中顯示的下層順應元件特徵。這些圖的比較顯示了上層和下層順應元件的螺旋彈簧元件的旋轉方向相反。這種旋轉方向的相反在一些實施例中被認為是有益的，但在其它實施例中是不必要的甚至是有害的。在彈簧元件受壓時，尖端可能傾向於以與螺旋彈簧元件向內旋轉相反的方向旋轉，這可能會導致摩擦或刮擦效果，這可能有助於突破氧化鍍或對接觸表面造成損傷。上下探針尖端之間的擦拭方向的反轉可能是有益的，也可能在其它情況下是不必要的甚至有害的。在初始的探針設計過程中，可能需要考慮到下層和上層探針尖端之間的擦拭方向的反轉。同樣，分離的上層彈簧元件的相對方向的反轉是可能的，分離的下層彈簧元件的方向也可以反轉。Figures 3E7-A and 3E7-B show views of L10, L12, L14, and L16 showing (1) portions of the upper level planar helical spring elements 3421-1U and 3421-2U, and the internal extensions that form cantilevered arm portions UC1 through UC4 (not labeled), and (2) portions of the upper level central tip arms 3431-UA, and portions of the upper level supports 3411-1 and 3411-2, where a double, intertwined helical configuration can be seen. These are the upper level compliant elements, corresponding to the lower level compliant element features shown in Figures 34E3-A and 34E3-B. Comparison of these figures shows that the helical spring elements of the upper and lower level compliant elements have opposite directions of rotation. This reversal of rotational direction is considered beneficial in some embodiments, but unnecessary or even detrimental in other embodiments. When the spring element is compressed, the tip may tend to rotate in a direction opposite to the inward rotation of the helical spring element, which may cause a friction or scraping effect that may help to break through the oxide plating or cause damage to the contact surface. The reversal of the wiping direction between the upper and lower probe tips may be beneficial or unnecessary or even detrimental in other situations. The reversal of the wiping direction between the lower and upper probe tips may need to be considered during the initial probe design process. Similarly, the reversal of the relative directions of the separated upper spring element is possible, and the direction of the separated lower spring element may also be reversed.
圖3E8-A和3E8-B顯示了層L11和L15的視圖，其中可以看到不完整的螺旋彈簧元件3421-1U和3421-2U以及支撐件3411-1和3411-2的連接區域，這些區域將圖3E7-A和3E7-B中的螺旋彈簧元件的部分連接在一起，形成了彈簧元件最外側部分的增厚螺旋段，其中上層的順應元件3421-UC僅包括兩個增厚的彈簧元件3421-1U和3421-2U，而與連接在內側區域的尖端臂3431-UA上的四個較薄的元件相反。圖3E8-A和3E8-B提供了下層順應元件的對應部分，這些下層順應元件在圖3E4-A和3E4-B中顯示。Figures 3E8-A and 3E8-B show views of layers L11 and L15, in which incomplete helical spring elements 3421-1U and 3421-2U and connection areas of supports 3411-1 and 3411-2 can be seen, which connect portions of the helical spring elements in Figures 3E7-A and 3E7-B together to form thickened helical segments of the outermost portions of the spring elements, wherein the upper layer's compliant element 3421-UC includes only two thickened spring elements 3421-1U and 3421-2U, as opposed to four thinner elements connected to the tip arm 3431-UA in the inner region. Figures 3E8-A and 3E8-B provide corresponding portions of the underlying compliant elements that are shown in Figures 3E4-A and 3E4-B.
圖3E9-A和3E9-B顯示了包括上層尖端臂3431-UA的部分和支撐件3411-1和3411-2的層L13的視圖，這些部分提供了懸臂元件或彈簧元件3421-1U和3421-2U之間的連接。圖3E9-A和3E9-B提供了上層順應元件的部分影像，這些部分是圖3E5-A和3E5-B中發現的下層順應元件的對應部分。Figures 3E9-A and 3E9-B show views of layer L13 including portions of upper layer tip arms 3431-UA and supports 3411-1 and 3411-2 that provide connections between cantilever elements or spring elements 3421-1U and 3421-2U. Figures 3E9-A and 3E9-B provide images of portions of upper layer compliant elements that are corresponding portions of lower layer compliant elements found in Figures 3E5-A and 3E5-B.
圖3A-3E9-B實施例的許多其它變化是可能的，並且在審閱本文的教導時對於本領域技術人員來說是顯而易見的，並且包括，例如：(1)材料的變化；（2）配置的變化，包括每個彈簧元件包含的旋轉或部分旋轉的次數，每個縱向級別使用的交織彈簧的數量，使用的縱向間隔的彈簧的數量（例如，偶數、奇數等），沿螺旋的長度發生的縱向樑過渡的數量和位置，連續螺旋所採取的旋轉方向（例如，順時針-逆時針-順時針-逆時針-順時針，順時針-逆時針-逆時針-逆時針-順時針等），尖端的形狀，懸臂樑的寬度和厚度；（3）使用使上下彈簧模組之一或兩者與環狀框架保持間隔的支撐件，（4）使用距離探針中央部分較近的支撐件，而不是探針外周的支撐件；（5）使用不同類型的框架或基礎結構和/或這些框架和基礎結構中的開口；（6）使用的彈簧結構不是由不同支撐件支撐的共面交錯螺旋對，而是給定縱向水平上的單個螺旋或給定縱向水平上的兩個以上交錯螺旋；以及（7）取自本文所述的其它實施例和方面的特徵及其變化的變化。Many other variations of the embodiments of FIGS. 3A-3E9-B are possible and will be apparent to one skilled in the art upon reviewing the teachings herein, and include, for example: (1) variations in materials; (2) variations in configuration, including the number of rotations or partial rotations contained in each spring element, the number of interlaced springs used in each longitudinal level, the number of longitudinally spaced springs used (e.g., even, odd, etc.), the number and location of longitudinal beam transitions occurring along the length of the spiral, the direction of rotation taken by successive spirals (e.g., clockwise-counterclockwise-clockwise-counterclockwise-clockwise, clockwise-counterclockwise-counterclockwise-clockwise, etc.); clockwise-clockwise, etc.), the shape of the tip, the width and thickness of the cantilever beam; (3) using supports that space one or both of the upper and lower spring modules from the annular frame, (4) using supports closer to the center of the probe rather than at the periphery of the probe; (5) using different types of frames or base structures and/or openings in these frames and base structures; (6) using spring structures that are not pairs of coplanar staggered spirals supported by different supports, but rather a single spiral at a given longitudinal level or more than two staggered spirals at a given longitudinal level; and (7) variations of features and variations thereof taken from other embodiments and aspects described herein.
上面已經給了許多實施例，但是在不背離本揭露的精神的情況下，許多另外的實施例也是可能的。 這些附加實施例中的一些可以基於本文的教導與現有技術的各種教導的組合。 一些製造實施例可以使用多層電化學沉積製程，而其它製造實施例則可以不使用。 有些實施例可以使用選擇性沉積和毯式沉積製程的組合，而其它實施例可以兩者都不使用，而還有一些實施例可以使用不同製程的組合。 例如，一些實施例可以不使用任何毯式沉積製程和/或它們在連續層的形成中可以不使用平坦化製程。 一些實施例可以在不是電沉積製程的某些層上使用選擇性沉積製程或毯式沉積製程。 例如，一些實施例可以使用鎳(Ni)、鎳-磷(Ni-P)、鎳-鈷(NiCo)、金(Au)、銅(Cu)、錫(Sn)、銀(Ag)、鋅( Zn)、焊料、銠(Rh)、錸(Re)、鈹銅(BeCu)、鎢(W)、錸鎢(ReW)、鋁銅(AlCu)、鈀(Pd)、鈀鈷(PdCo)、鉑（Pt）、鉬（Mo）、錳（Mn）、鋼、P7合金、黃銅、鉻（Cr）、鉻、鉻銅（CrCu）、其它鈀合金、銅銀合金，作為結構材料或犧牲材料而其它實施例可以使用不同的材料。例如，上述材料中的一些材料可因其彈簧特性而優先使用，而其它材料可因其增強的導電性、其耐磨性、其阻隔特性、其熱特性而被使用（例如，在高溫或高溫下的屈服強度或高導熱率），而有些則可以根據其黏合特性、與其它材料的可分離性、甚至在所需應用或用途中感興趣的其他特性來選擇。其它實施例可以使用不同的材料或材料的不同組合，包括介電材質(例如，陶瓷、塑膠、光阻、聚醯亞胺、玻璃、陶瓷或其他聚合物)、其它金屬、半導體等作為結構材料、犧牲材料或圖案化材料。 在一些實施例中，例如可以使用銅、錫、鋅、焊料、光阻劑或其它材料作為犧牲材料。 一些實施例可以在不同層上或在單層的不同部分上使用不同的結構材料。 有些實施例可以去除犧牲材料，而其它實施例則不能。 有些實施例可以形成探針結構，而其它實施例可以使用本揭露的彈簧模組用於非探測目的(例如，以期望的彈簧力或順應性嚙合來偏置其它操作裝置)。Many embodiments have been given above, but many additional embodiments are possible without departing from the spirit of the present disclosure. Some of these additional embodiments may be based on a combination of the teachings of this article with various teachings of the prior art. Some manufacturing embodiments may use multi-layer electrochemical deposition processes, while other manufacturing embodiments may not. Some embodiments may use a combination of selective deposition and blanket deposition processes, while other embodiments may use neither, and some embodiments may use a combination of different processes. For example, some embodiments may not use any blanket deposition processes and/or they may not use a planarization process in the formation of continuous layers. Some embodiments may use a selective deposition process or a blanket deposition process on certain layers that are not electrochemical deposition processes. For example, some embodiments may use nickel (Ni), nickel-phosphorus (Ni-P), nickel-cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), ruthenium (Re), benzene copper (BeCu), tungsten (W), ruthenium tungsten (ReW), aluminum copper (AlCu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chromium, chromium copper (CrCu), other palladium alloys, copper-silver alloys as structural materials or sacrificial materials while other embodiments may use different materials. For example, some of the above materials may be used preferentially for their spring properties, while others may be used for their enhanced conductivity, their wear resistance, their barrier properties, their thermal properties (e.g., yield strength at high temperatures or high thermal conductivity), while some may be selected based on their adhesive properties, separability from other materials, or even other properties of interest in the desired application or use. Other embodiments may use different materials or different combinations of materials, including dielectric materials (e.g., ceramics, plastics, photoresists, polyimides, glass, ceramics or other polymers), other metals, semiconductors, etc. as structural materials, sacrificial materials or patterned materials. In some embodiments, for example, copper, tin, zinc, solder, photoresists or other materials may be used as sacrificial materials. Some embodiments may use different structural materials on different layers or on different parts of a single layer. Some embodiments may remove sacrificial materials, while others may not. Some embodiments may form probe structures, while others may use the disclosed spring modules for non-probing purposes (e.g., to bias other operating devices with a desired spring force or compliant engagement).
熟悉此項技藝之人士可以理解，附加的操作可用於實現上述實施例或用於上述實施例的變體。例如，這些附加操作可以提供：（1）表面清潔，（2）表面活化，（3）熱處理（例如，改善層間附著力，改善所選材料的性能或探針的特徵，例如屈服強度，彈簧常數等），（4）提供保形塗層，（5）提供表面平滑，粗糙化或其它表面處理，（6）提供表面紋理， （7）提供摻雜的初級材料與次級材料，以提供改進的材料性能，和/或提供（8） 過程監控、測試和/或測量，以確保根據規範或其它要求（可能由客戶、使用者、品質標準測試或過程操作員自己定義的過程標準）進行製造，作為確保提供給客戶或最終使用者的製造零件或產品功能齊全並滿足所有要求的一部分。Those skilled in the art will appreciate that additional operations may be used to implement the above-described embodiments or variations of the above-described embodiments. For example, these additional operations may provide: (1) surface cleaning, (2) surface activation, (3) heat treatment (e.g., to improve interlayer adhesion, improve properties of a selected material or characteristics of a probe such as yield strength, spring constant, etc.), (4) provide a conformal coating, (5) provide surface smoothing, roughening or other surface treatment, (6) provide surface texturing, (7) provide blending of primary and secondary materials to provide improved material properties, and/or provide (8) process monitoring, testing and/or measurement to ensure that manufacturing is performed in accordance with specifications or other requirements (which may be defined by the customer, user, quality standard testing, or process standards defined by the process operator itself) as part of ensuring that the manufactured part or product provided to the customer or end user is fully functional and meets all requirements.
同時，也應該理解，本文某些方面的探針元件可能使用與此處所述過程非常不同的過程形成，並且並非打算僅通過本文所教導的過程或由本文所教導的過程明顯提出的過程形成本文所述結構方面。At the same time, it should also be understood that probe elements of certain aspects of the present invention may be formed using processes that are very different from the processes described herein, and it is not intended that the structural aspects described herein be formed solely by processes taught herein or processes that are obviously suggested by processes taught herein.
儘管本說明書的各個部分都已提供標題，但不打算使用標題來限制發現於說明書一部分的教導不應適用於說明書的其它部分。例如，在與某一實施例相關聯的替代方案應該適用於所有實施例，只要不同實施例的特徵使得此類應用功能，並且不否認或刪除所採用實施例的所有好處。Although the various sections of this specification have been provided with headings, it is not intended that the headings be used to limit the teachings found in one part of the specification to other parts of the specification. For example, an alternative scheme associated with a certain embodiment should be applicable to all embodiments, as long as the features of the different embodiments enable such application functions and do not negate or eliminate all the advantages of the adopted embodiment.
本文所載的本揭露的任何方面均代表獨立的揭露描述，申請人認為這些描述是申請人認為可以作為獨立項提出的完整和完整的揭露描述，而無需從此處規定的其它實施例或方面中引入額外的限制或要素，以進行解釋或澄清，除非在此類獨立項中明確規定。另可以理解的是，本文所述方面的任何變化都代表單個和單獨的特徵，這些特徵可以形成單獨的獨立項，可以單獨添加到獨立權利要求中，或作為附屬項添加，以進一步定義這些各自附屬項所要求的揭露（如果它們被寫成）。Any aspect of the present disclosure set forth herein represents an independent disclosure description, which the applicant considers to be a complete and complete disclosure description that the applicant considers to be capable of being set forth as an independent claim, without introducing additional limitations or elements from other embodiments or aspects set forth herein for explanation or clarification, unless expressly set forth in such independent claim. It is also understood that any variation of the aspects described herein represents individual and separate features that may form separate independent claims that may be added separately to independent claims, or added as dependent claims to further define the disclosure claimed by these respective dependent claims (if they are written).
鑒於本文的教導，對於技術人員來說，將會看到許多進一步的實施例、設計的替代方案和本文所述實施例的用途。因此，本文並不打算限制於上述特定的實例、替代方案和用途，而僅僅是由此後提出的聲明所限制。In view of the teachings of this article, many further embodiments, design alternatives and uses of the embodiments described herein will be apparent to those skilled in the art. Therefore, this article is not intended to be limited to the specific embodiments, alternatives and uses described above, but is only limited by the statements set forth thereafter.
82:基板 84:光阻劑 86:光阻表面 88:表面 92(a)至92(c):開口或孔洞 94:第一種金屬 96:第二種金屬 200A、200B:彈簧模組 200C:探針 201:基座 211:撐件或橋樑 221-1、221-2:彈簧元件 231:尖端元件 300:彈簧模組 321-1、321-2:彈簧元件 400:探針 432-U:模組尖端 432-UA:延伸臂 435-U:尖端過度壓縮止動件 432-L:下部尖端 432-LA:延伸臂 442-U、442-L:開口 451:護套 3400:探針 3401:環狀基座 3411-1, 3411-2, 3412-1, 3412-2:支撐件 3421-UC:第一順應元件 3421-LC:第二順應元件 3431-UA:第一尖端臂 3431-LA:第二尖端臂 3421-1U, 3421-2U:第一螺旋彈簧元件（第一順應元件） 3421-1L, 3421-2L:第二螺旋彈簧元件（第二順應元件） 3421-UC1-UC4, LC1-LC4:多個螺旋懸臂 3431-U, 3431-L:第一和第二探針尖端82: substrate84: photoresist86: photoresist surface88: surface92(a) to 92(c): opening or hole94: first metal96: second metal200A, 200B: spring module200C: probe201: base211: support or bridge221-1, 221-2: spring element231: tip element300: spring module321-1, 321-2: spring element400: probe432-U: module tip432-UA: extension arm435-U: tip overcompression stop432-L: lower tip432-LA: extension arm442-U, 442-L: opening451: sheath3400: probe3401: annular base3411-1, 3411-2, 3412-1, 3412-2: support3421-UC: first compliance element3421-LC: second compliance element3431-UA: first tip arm3431-LA: second tip arm3421-1U, 3421-2U: first coil spring element (first compliance element)3421-1L, 3421-2L: second coil spring element (second compliance element)3421-UC1-UC4, LC1-LC4: multiple coil cantilevers3431-U, 3431-L: First and second probe tips
圖1A至圖1F以示意方式描繪了使用黏附遮罩電鍍形成結構的第一層的形成過程，其中第二材料的毯式沉積(blanket deposition)覆蓋了第一材料的沉積位置之間的開口以及第一材料本身。1A to 1F schematically depict the formation of a first layer of a structure using adhesion mask plating, wherein a blanket deposition of a second material covers the openings between deposition locations of the first material as well as the first material itself.
圖1G描繪了通過將沉積的材料平坦化到所需水平而完成的第一層的形成。FIG. 1G depicts the formation of the first layer completed by planarizing the deposited material to the desired level.
圖1H和圖1I分別描繪了結構形成多層後和結構從可犧牲材料中釋放後的過程狀態。FIG1H and FIG1I respectively depict the process states after the structure is formed into multiple layers and after the structure is released from the sacrificial material.
圖2A描繪了一個例子的彈簧模組或順應模組的等距視圖，包括兩個連接的彈簧元件、一個基座和一個連接支撐或支撐件，可用於探針或作為探針。FIG. 2A depicts an isometric view of an example spring module or compliant module including two connected spring elements, a base, and a connected support or support member that can be used with or as a probe.
圖2B描繪了第二個例子的彈簧模組或順應模組的等距視圖，可用於探針或作為探針，與圖2A的模組相似，唯一的區別是兩個彈簧元件更厚，因此提供比圖2A的元件更大的彈簧常數。FIG. 2B depicts an isometric view of a second example spring module or compliant module that may be used with or as a probe, similar to the module of FIG. 2A , the only difference being that the two spring elements are thicker, thereby providing a greater spring constant than the elements of FIG. 2A .
圖2C描繪了包括多個彈簧模組的探針的部分切割視圖。FIG. 2C depicts a partial cutaway view of a probe including multiple spring modules.
圖3A至圖3D4提供了根據本揭露的實施例的探針的各種視圖。3A-3D4 provide various views of a probe according to an embodiment of the present disclosure.
圖3E1提供了圖3A至圖3D4中的探針的側視圖，顯示可用於製造探針的17個樣本層級，其中不是所有層都具有唯一的配置。FIG. 3E1 provides a side view of the probe of FIGS. 3A-3D4 , showing 17 sample layers that may be used to fabricate the probe, not all of which have unique configurations.
圖3E2-A至3E9-B說明瞭層L1至L17的獨特配置的橫截面配置，分別顯示在頂視圖（-A圖）和等距視圖（-B圖）中。Figures 3E2-A to 3E9-B illustrate cross-sectional configurations of a unique configuration of layers L1 to L17, shown in a top view (-A) and an isometric view (-B), respectively.
3400:探針3400:Probe
3401:環狀基座3401: Ring base
3411-1:支撐柱3411-1: Support column
3412-1:支撐柱3412-1: Support column
3412-2:支撐柱3412-2: Support column
3421-1U:旋彈簧元件3421-1U: Coil spring element
3421-2U:旋彈簧元件3421-2U: Coil spring element
3421-1L:旋彈簧元件3421-1L: Coil spring element
3421-2L:旋彈簧元件3421-2L: Coil spring element
3421-UC:第一彈性元件3421-UC: First elastic element
3431-UA:第一尖端臂3431-UA: First tip arm
3421-LC:第二彈性元件3421-LC: Second elastic element
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| US17/967,548US20240103042A1 (en) | 2019-12-31 | 2022-10-17 | Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes |
| US17/967,548 | 2022-10-17 | ||
| US17/968,638 | 2022-10-18 | ||
| US17/968,552 | 2022-10-18 | ||
| US17/968,552US12196781B2 (en) | 2019-12-31 | 2022-10-18 | Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes |
| US17/968,601US12196782B2 (en) | 2019-12-31 | 2022-10-18 | Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes |
| US17/968,638US20240094258A1 (en) | 2019-12-31 | 2022-10-18 | Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes |
| US17/968,601 | 2022-10-18 |
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| TW112126718ATW202417855A (en) | 2022-10-17 | 2023-07-18 | Probes with planar unbiased spring elements for electronic component contact |
| TW112138928ATW202417857A (en) | 2022-10-17 | 2023-10-12 | Probes with planar unbiased spring elements for electronic component contact |
| TW112138929ATW202417858A (en) | 2022-10-17 | 2023-10-12 | Probes with planar unbiased spring elements for electronic component contact |
| TW112138927ATW202433063A (en) | 2022-10-17 | 2023-10-12 | Probes with planar unbiased spring elements for electronic component contact |
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| TW112126719ATW202433062A (en) | 2022-10-17 | 2023-07-18 | Probes with planar unbiased spring elements for electronic component contact |
| TW112126718ATW202417855A (en) | 2022-10-17 | 2023-07-18 | Probes with planar unbiased spring elements for electronic component contact |
| Application Number | Title | Priority Date | Filing Date |
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| TW112138929ATW202417858A (en) | 2022-10-17 | 2023-10-12 | Probes with planar unbiased spring elements for electronic component contact |
| TW112138927ATW202433063A (en) | 2022-10-17 | 2023-10-12 | Probes with planar unbiased spring elements for electronic component contact |
| TW112139405ATW202433064A (en) | 2022-10-17 | 2023-10-16 | Probes with planar unbiased spring elements for electronic component contact |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060006888A1 (en)* | 2003-02-04 | 2006-01-12 | Microfabrica Inc. | Electrochemically fabricated microprobes |
| US20080157793A1 (en)* | 2003-02-04 | 2008-07-03 | Microfabrica Inc. | Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes |
| KR20070017935A (en)* | 2003-12-12 | 2007-02-13 | 스미토모덴키고교가부시키가이샤 | Fine terminal, its manufacturing method, and contact sheet |
| TWI235837B (en)* | 2004-03-10 | 2005-07-11 | Mjc Probe Inc | Probe device and probe card using the same |
| KR101921291B1 (en)* | 2018-05-11 | 2019-02-13 | (주) 마이크로프랜드 | Semiconductor Device Test Socket |
| KR102678287B1 (en)* | 2021-11-08 | 2024-06-26 | 주식회사 에이엠에스티 | Test socket |
| CN119013568A (en)* | 2022-04-07 | 2024-11-22 | 微制造股份有限公司 | Probe with planar non-biased spring element for electronic component contact, method for manufacturing such a probe and method for using such a probe |
| Publication number | Publication date |
|---|---|
| TW202433064A (en) | 2024-08-16 |
| WO2024086546A9 (en) | 2025-02-20 |
| WO2024086507A1 (en) | 2024-04-25 |
| WO2024086546A1 (en) | 2024-04-25 |
| WO2024086505A1 (en) | 2024-04-25 |
| WO2024085933A1 (en) | 2024-04-25 |
| WO2024086506A1 (en) | 2024-04-25 |
| TW202417858A (en) | 2024-05-01 |
| TW202417855A (en) | 2024-05-01 |
| TW202433062A (en) | 2024-08-16 |
| TW202433063A (en) | 2024-08-16 |
| WO2024085934A1 (en) | 2024-04-25 |
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