TW202242661A

Movatterモバイル変換

Info

Publication number: TW202242661A
Application number: TW110113876A
Authority: TW
Inventors: 郭育瑋; 吳彥廷; 陳聖文; 廖國堯
Original assignee: 群聯電子股份有限公司
Priority date: 2021-04-19
Filing date: 2021-04-19
Publication date: 2022-11-01
Also published as: TWI762274B

Abstract

A system and a method for adjusting circuit parameter and a host system are disclosed. The system includes a processing circuit, a re-driving circuit and a memory storage device. The processing circuit is configured to transmit a command to the memory storage device through the re-driving circuit to instruct the memory storage device to provide signal quality information. The processing circuit is further configured to receive the signal quality information from the memory storage device and adjust a circuit parameter of the re-driving circuit according to the signal quality information.

Description

Translated fromChinese

電路參數調整系統、方法及主機系統Circuit parameter adjustment system, method and host system

本發明是有關於一種電路參數調整技術，且特別是有關於一種電路參數調整系統、方法及主機系統。The present invention relates to a circuit parameter adjustment technology, and in particular to a circuit parameter adjustment system, method and host system.

訊號中繼器(re-driver)一般可用以延長訊號的傳輸距離。但是，在不同的使用環境及/或不同的配置條件下，訊號中繼器所預設使用的電路參數可能導致訊號中繼器對訊號的調變效率不佳。A signal repeater (re-driver) can generally be used to extend the transmission distance of a signal. However, under different usage environments and/or different configuration conditions, the preset circuit parameters of the signal repeater may lead to poor signal modulation efficiency of the signal repeater.

本發明提供一種電路參數調整系統、方法及主機系統，可提高對於中繼電路使用的電路參數的調整效率。The invention provides a circuit parameter adjustment system, method and host system, which can improve the adjustment efficiency of circuit parameters used in relay circuits.

本發明的範例實施例提供一種電路參數調整系統，其包括處理電路、中繼電路及記憶體儲存裝置。所述中繼電路耦接至所述處理電路。所述記憶體儲存裝置耦接至所述中繼電路。所述處理電路用以經由所述中繼電路傳送指令至所述記憶體儲存裝置。所述指令用以指示所述記憶體儲存裝置提供訊號品質資訊。所述處理電路更用以從所述記憶體儲存裝置接收所述訊號品質資訊。所述處理電路更用以根據所述訊號品質資訊調整所述中繼電路的電路參數。An exemplary embodiment of the present invention provides a circuit parameter adjustment system, which includes a processing circuit, a relay circuit and a memory storage device. The relay circuit is coupled to the processing circuit. The memory storage device is coupled to the relay circuit. The processing circuit is used for sending instructions to the memory storage device via the relay circuit. The command is used to instruct the memory storage device to provide signal quality information. The processing circuit is further configured to receive the signal quality information from the memory storage device. The processing circuit is further used for adjusting circuit parameters of the relay circuit according to the signal quality information.

在本發明的一範例實施例中，所述中繼電路用以調變在所述處理電路與所述記憶體儲存裝置之間傳遞的訊號，以延長所述訊號的傳輸距離。In an exemplary embodiment of the present invention, the relay circuit is used to modulate the signal transmitted between the processing circuit and the memory storage device, so as to extend the transmission distance of the signal.

在本發明的一範例實施例中，所述中繼電路包括發送端電路，且經調整的所述電路參數為所述發送端電路的至少一設定參數。In an exemplary embodiment of the present invention, the relay circuit includes a sending-end circuit, and the adjusted circuit parameter is at least one setting parameter of the sending-end circuit.

本發明的範例實施例另提供一種電路參數調整方法，其包括：經由中繼電路傳送指令至記憶體儲存裝置，其中所述指令用以指示所述記憶體儲存裝置提供訊號品質資訊；從所述記憶體儲存裝置接收所述訊號品質資訊；以及根據所述訊號品質資訊調整所述中繼電路的電路參數。An exemplary embodiment of the present invention further provides a method for adjusting circuit parameters, which includes: transmitting an instruction to a memory storage device via a relay circuit, wherein the instruction is used to instruct the memory storage device to provide signal quality information; The memory storage device receives the signal quality information; and adjusts the circuit parameters of the relay circuit according to the signal quality information.

在本發明的一範例實施例中，所述的電路參數調整方法更包括：經由所述中繼電路調變在處理電路與所述記憶體儲存裝置之間傳遞的訊號，以延長所述訊號的傳輸距離。In an exemplary embodiment of the present invention, the circuit parameter adjustment method further includes: modulating the signal transmitted between the processing circuit and the memory storage device via the relay circuit to prolong the signal transmission distance.

在本發明的一範例實施例中，所述訊號品質資訊反映所述記憶體儲存裝置經由所述中繼電路接收到的測試訊號的訊號品質。In an exemplary embodiment of the present invention, the signal quality information reflects the signal quality of a test signal received by the memory storage device through the relay circuit.

在本發明的一範例實施例中，所述訊號品質資訊反映所述記憶體儲存裝置經由所述中繼電路接收到的所述測試訊號的訊號恢復狀態、訊號眼寬狀態、訊號眼高狀態及訊號邊緣狀態的至少其中之一。In an exemplary embodiment of the present invention, the signal quality information reflects the signal recovery state, signal eye width state, and signal eye height state of the test signal received by the memory storage device through the relay circuit and at least one of the signal edge states.

在本發明的一範例實施例中，經調整的所述電路參數用以提高所述中繼電路的運作效能。In an exemplary embodiment of the present invention, the adjusted circuit parameters are used to improve the operation performance of the relay circuit.

在本發明的一範例實施例中，所述處理電路與所述中繼電路設置於同一主機板上。In an exemplary embodiment of the present invention, the processing circuit and the relay circuit are disposed on the same motherboard.

在本發明的一範例實施例中，所述中繼電路包括發送端電路，且根據所述訊號品質資訊調整所述中繼電路的所述電路參數的步驟包括：根據所述訊號品質資訊調整所述發送端電路的至少一設定參數。In an exemplary embodiment of the present invention, the relay circuit includes a transmitting circuit, and the step of adjusting the circuit parameters of the relay circuit according to the signal quality information includes: according to the signal quality information Adjust at least one setting parameter of the sending end circuit.

在本發明的一範例實施例中，所述記憶體儲存裝置包括接收端電路。所述記憶體儲存裝置的所述接收端電路耦接至所述中繼電路的所述發送端電路。所述記憶體儲存裝置的所述接收端電路的至少一設定參數是由所述記憶體儲存裝置設定。In an exemplary embodiment of the invention, the memory storage device includes a receiver circuit. The receiving end circuit of the memory storage device is coupled to the sending end circuit of the relay circuit. At least one setting parameter of the receiver circuit of the memory storage device is set by the memory storage device.

在本發明的一範例實施例中，所述記憶體儲存裝置可插拔式地安裝於所述主機板上。In an exemplary embodiment of the present invention, the memory storage device is pluggably installed on the motherboard.

在本發明的一範例實施例中，所述記憶體儲存裝置包括外接式儲存裝置。In an exemplary embodiment of the present invention, the memory storage device includes an external storage device.

本發明的範例實施例另提供一種主機系統，其經由中繼電路耦接至記憶體儲存裝置。所述主機系統包括處理電路。所述處理電路用以運行控制程式以：對所述中繼電路進行初始化設定；經由初始化後的所述中繼電路與所述記憶體儲存裝置執行交握程序；經由所述中繼電路傳送開發者指令至所述記憶體儲存裝置，以指示所述記憶體儲存裝置提供訊號品質資訊；以及根據所述訊號品質資訊調整所述中繼電路的電路參數。An exemplary embodiment of the present invention further provides a host system coupled to a memory storage device via a relay circuit. The host system includes processing circuitry. The processing circuit is used to run the control program to: initialize the relay circuit; execute the handshake procedure through the initialized relay circuit and the memory storage device; sending developer instructions to the memory storage device to instruct the memory storage device to provide signal quality information; and adjusting circuit parameters of the repeater circuit according to the signal quality information.

在本發明的一範例實施例中，所述記憶體儲存裝置包括接收端電路，其耦接至所述中繼電路。在所述交握程序中，所述記憶體儲存裝置自動調整所述接收端電路的至少一設定參數。In an exemplary embodiment of the present invention, the memory storage device includes a receiver circuit coupled to the relay circuit. In the handshaking procedure, the memory storage device automatically adjusts at least one setting parameter of the receiving end circuit.

基於上述，處理電路可經由中繼電路傳送特定指令至記憶體儲存裝置，以指示所述記憶體儲存裝置提供訊號品質資訊。接著，處理電路可從所述記憶體儲存裝置接收所述訊號品質資訊並根據所述訊號品質資訊調整所述中繼電路的電路參數。藉此，可提高對於中繼電路使用的電路參數的調整效率。Based on the above, the processing circuit can send a specific instruction to the memory storage device through the relay circuit, so as to instruct the memory storage device to provide signal quality information. Then, the processing circuit can receive the signal quality information from the memory storage device and adjust circuit parameters of the relay circuit according to the signal quality information. Thereby, the adjustment efficiency of the circuit parameters used for the relay circuit can be improved.

圖1是根據本發明的一範例實施例所繪示的電路參數調整系統的示意圖。請參照圖1，系統(亦稱為電路參數調整系統)10包括處理電路11、中繼電路(re-driving circuit)12及記憶體儲存裝置13。處理電路11可經由中繼電路12存取記憶體儲存裝置13。例如，處理電路11可包括中央處理單元(Central Processing Unit, CPU)、或是其他可程式化之一般用途或特殊用途的微處理器、數位訊號處理器(Digital Signal Processor, DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuits, ASIC)、可程式化邏輯裝置(Programmable Logic Device, PLD)或其他類似裝置或這些裝置的組合。FIG. 1 is a schematic diagram of a circuit parameter adjustment system according to an exemplary embodiment of the present invention. Referring to FIG. 1 , a system (also called a circuit parameter adjustment system) 10 includes aprocessing circuit 11 , are-driving circuit 12 and amemory storage device 13 . Theprocessing circuit 11 can access thememory storage device 13 via therelay circuit 12 . For example, theprocessing circuit 11 may include a central processing unit (Central Processing Unit, CPU), or other programmable general-purpose or special-purpose microprocessors, digital signal processors (Digital Signal Processor, DSP), programmable Controller, application specific integrated circuit (Application Specific Integrated Circuits, ASIC), programmable logic device (Programmable Logic Device, PLD) or other similar devices or a combination of these devices.

中繼電路12耦接至處理電路11與記憶體儲存裝置13。例如，中繼電路12可設置於處理電路11與記憶體儲存裝置13之間的訊號傳遞路徑上。中繼電路12可用以調變在處理電路11與記憶體儲存裝置13之間傳遞的訊號，以延長所述訊號的傳輸距離。例如，中繼電路12可包括訊號中繼器(Re-driver)。Therelay circuit 12 is coupled to theprocessing circuit 11 and thememory storage device 13 . For example, therelay circuit 12 can be disposed on the signal transmission path between theprocessing circuit 11 and thememory storage device 13 . Therelay circuit 12 can be used to modulate the signal transmitted between theprocessing circuit 11 and thememory storage device 13 to extend the transmission distance of the signal. For example, therelay circuit 12 may include a signal repeater (Re-driver).

記憶體儲存裝置13用以非揮發性地儲存資料。例如，記憶體儲存裝置13可包括隨身碟、記憶卡、固態硬碟(Solid State Drive, SSD)或無線記憶體儲存裝置等外接式儲存裝置。或者，記憶體儲存裝置13也可包括嵌入式多媒體卡(embedded Multi Media Card, eMMC)或嵌入式多晶片封裝(embedded Multi Chip Package, eMCP)儲存裝置等嵌入式儲存裝置。Thememory storage device 13 is used for non-volatile storage of data. For example, thememory storage device 13 may include an external storage device such as a flash drive, a memory card, a solid state drive (SSD) or a wireless memory storage device. Alternatively, thememory storage device 13 may also include an embedded storage device such as an embedded Multi Media Card (eMMC) or an embedded Multi Chip Package (eMCP) storage device.

在一範例實施例中，處理電路11與中繼電路12設置於主機板14上並經由主機板14彼此通訊。在一範例實施例中，處理電路11、中繼電路12及記憶體儲存裝置13皆設置於主機板14上並經由主機板14彼此通訊。In an exemplary embodiment, theprocessing circuit 11 and therelay circuit 12 are disposed on themotherboard 14 and communicate with each other through themotherboard 14 . In an exemplary embodiment, theprocessing circuit 11 , therelay circuit 12 and thememory storage device 13 are all disposed on themotherboard 14 and communicate with each other through themotherboard 14 .

在一範例實施例中，記憶體儲存裝置13可藉由嵌入式的安裝方式內嵌於主機板14上。在一範例實施例中，記憶體儲存裝置13亦可以藉由高速周邊零件連接介面(Peripheral Component Interconnect Express, PCI Express)插槽、序列先進附件(Serial Advanced Technology Attachment, SATA)插槽、通用序列匯流排(Universal Serial Bus, USB)插槽或類似的匯流排插槽而可插拔式地安裝於主機板14上(即電性連接至主機板14)。In an exemplary embodiment, thememory storage device 13 can be embedded on themotherboard 14 through an embedded installation method. In an exemplary embodiment, thememory storage device 13 can also be connected via a high-speed peripheral component interconnect interface (Peripheral Component Interconnect Express, PCI Express) slot, a serial advanced attachment (Serial Advanced Technology Attachment, SATA) slot, a universal serial bus USB (Universal Serial Bus, USB) socket or similar bus socket and is pluggably installed on the motherboard 14 (that is, electrically connected to the motherboard 14).

在一範例實施例中，處理電路11可經由中繼電路12傳送至少一指令至記憶體儲存裝置13。例如，所述指令可包括預先定義的開發者指令或類似指令。所述指令可用以指示記憶體儲存裝置13提供訊號品質資訊。In an exemplary embodiment, theprocessing circuit 11 can transmit at least one command to thememory storage device 13 via therelay circuit 12 . For example, the instructions may include predefined developer instructions or the like. The command can be used to instruct thememory storage device 13 to provide signal quality information.

在一範例實施例中，所述訊號品質資訊可由記憶體儲存裝置13產生。所述訊號品質資訊可反映記憶體儲存裝置13經由中繼電路12接收到的測試訊號的訊號品質。所述測試訊號可由處理電路11產生並經由中繼電路12調變後傳送至傳送記憶體儲存裝置13。記憶體儲存裝置13可根據所接收到的測試訊號產生所述訊號品質資訊。In an exemplary embodiment, the signal quality information can be generated by thememory storage device 13 . The signal quality information can reflect the signal quality of the test signal received by thememory storage device 13 through therelay circuit 12 . The test signal can be generated by theprocessing circuit 11 and modulated by therelay circuit 12 before being sent to the transmittingmemory storage device 13 . Thememory storage device 13 can generate the signal quality information according to the received test signal.

在一範例實施例中，響應於所述指令，記憶體儲存裝置13可將所述訊號品質資訊提供給處理電路11。然後，處理電路11可根據所述訊號品質資訊調整中繼電路12的電路參數。經調整的電路參數可用以提高中繼電路12的運作效能。例如，經調整的電路參數可改善經由中繼電路12在處理電路11與記憶體儲存裝置13之間傳輸的訊號的訊號品質，從而提高中繼電路12的運作效能。In an exemplary embodiment, in response to the instruction, thememory storage device 13 may provide the signal quality information to theprocessing circuit 11 . Then, theprocessing circuit 11 can adjust the circuit parameters of therelay circuit 12 according to the signal quality information. The adjusted circuit parameters can be used to improve the operation performance of therelay circuit 12 . For example, the adjusted circuit parameters can improve the signal quality of the signal transmitted between theprocessing circuit 11 and thememory storage device 13 via therelay circuit 12 , thereby improving the operation performance of therelay circuit 12 .

圖2至圖5是根據本發明的一範例實施例所繪示的調整中繼電路的電路參數的示意圖。請參照圖2，在一範例實施例中，處理電路11包括控制程式21，中繼電路12包括調變電路22且記憶體儲存裝置13包括訊號接收電路23。2 to 5 are schematic diagrams of adjusting circuit parameters of a relay circuit according to an exemplary embodiment of the present invention. Referring to FIG. 2 , in an exemplary embodiment, theprocessing circuit 11 includes acontrol program 21 , therelay circuit 12 includes amodulation circuit 22 and thememory storage device 13 includes asignal receiving circuit 23 .

處理電路11可運行控制程式21以產生測試訊號TS(i)。i可以為任意正整數。測試訊號TS(i)可經由中繼電路12傳送至記憶體儲存裝置13。其中，測試訊號TS(i)可先被傳送至中繼電路12。當接收到測試訊號TS(i)時，調變電路22可根據一或多個電路參數來自動對測試訊號TS(i)進行調變。例如，所述調變可包括改變測試訊號TS(i)的電壓、波形或頻率等各式電氣特徵。經調變電路22調變的測試訊號TS(i)可被傳送至記憶體儲存裝置13。Theprocessing circuit 11 can run thecontrol program 21 to generate the test signal TS(i). i can be any positive integer. The test signal TS(i) can be sent to thememory storage device 13 through therelay circuit 12 . Wherein, the test signal TS(i) can be sent to therelay circuit 12 first. When receiving the test signal TS(i), themodulation circuit 22 can automatically modulate the test signal TS(i) according to one or more circuit parameters. For example, the modulation may include changing various electrical characteristics of the test signal TS(i), such as voltage, waveform or frequency. The test signal TS(i) modulated by themodulation circuit 22 can be sent to thememory storage device 13 .

訊號接收電路23可經由中繼電路12接收測試訊號TS(i)。當接收到測試訊號TS(i)時，訊號接收電路23可對測試訊號TS(i)進行訊號恢復等前處理並對測試訊號TS(i)進行分析。訊號接收電路23可根據測試訊號TS(i)的分析結果產生與測試訊號TS(i)有關的訊號品質資訊(例如圖4的訊號品質資訊SQ(i))。與測試訊號TS(i)有關的訊號品質資訊可反映所接收到的測試訊號TS(i)的訊號品質。訊號接收電路23可將所述訊號品質資訊暫存於記憶體儲存裝置13中。Thesignal receiving circuit 23 can receive the test signal TS(i) through therelay circuit 12 . When receiving the test signal TS(i), thesignal receiving circuit 23 can perform preprocessing such as signal recovery on the test signal TS(i) and analyze the test signal TS(i). Thesignal receiving circuit 23 can generate signal quality information (such as the signal quality information SQ(i) in FIG. 4 ) related to the test signal TS(i) according to the analysis result of the test signal TS(i). The signal quality information related to the test signal TS(i) may reflect the signal quality of the received test signal TS(i). Thesignal receiving circuit 23 can temporarily store the signal quality information in thememory storage device 13 .

請參照圖3，接續於圖2的範例實施例，在傳送測試訊號TS(i)之後，處理電路11可運行控制程式21以產生開發者指令VC(i)。開發者指令VC(i)對應於測試訊號TS(i)。處理電路11可經由中繼電路12將開發者指令VC(i)傳送至記憶體儲存裝置13。開發者指令VC(i)可用以指示記憶體儲存裝置13提供與測試訊號TS(i)有關的訊號品質資訊。Please refer to FIG. 3 , following the exemplary embodiment of FIG. 2 , after transmitting the test signal TS(i), theprocessing circuit 11 may run thecontrol program 21 to generate the developer command VC(i). The developer command VC(i) corresponds to the test signal TS(i). Theprocessing circuit 11 can transmit the developer command VC(i) to thememory storage device 13 via therelay circuit 12 . The developer command VC(i) can be used to instruct thememory storage device 13 to provide signal quality information related to the test signal TS(i).

請參照圖4，接續於圖3的範例實施例，在接收到開發者指令VC(i)之後，響應於開發者指令VC(i)，記憶體儲存裝置13可讀取先前儲存的與測試訊號TS(i)有關的訊號品質資訊SQ(i)。此外，響應於開發者指令VC(i)，記憶體儲存裝置13可經由中繼電路12將訊號品質資訊SQ(i)傳送至處理電路11。Please refer to FIG. 4 , following the exemplary embodiment of FIG. 3 , after receiving the developer command VC(i), in response to the developer command VC(i), thememory storage device 13 can read the previously stored and test signal The signal quality information SQ(i) related to TS(i). In addition, in response to the developer command VC(i), thememory storage device 13 can transmit the signal quality information SQ(i) to theprocessing circuit 11 through therelay circuit 12 .

請參照圖5，接續於圖4的範例實施例，在接收到訊號品質資訊SQ(i)之後，處理電路11可根據訊號品質資訊SQ(i)獲得經由調變電路22傳送至記憶體儲存裝置13的測試訊號TS(i)的訊號品質。根據訊號品質資訊SQ(i)，處理電路11可運行控制程式21發送參數調整指令ADJ(i)至中繼電路12。中繼電路12可根據參數調整指令ADJ(i)來調整調變電路22的一或多個電路參數。Please refer to FIG. 5 , following the exemplary embodiment in FIG. 4 , after receiving the signal quality information SQ(i), theprocessing circuit 11 can obtain the signal quality information SQ(i) according to the signal quality information SQ(i) and send it to the memory through themodulation circuit 22 for storage. The signal quality of the test signal TS(i) of thedevice 13 . According to the signal quality information SQ(i), theprocessing circuit 11 can run thecontrol program 21 to send the parameter adjustment command ADJ(i) to therelay circuit 12 . Therelay circuit 12 can adjust one or more circuit parameters of themodulation circuit 22 according to the parameter adjustment command ADJ(i).

在一範例實施例中，處理電路11可根據訊號品質資訊SQ(i)評估當前調變電路22所使用的電路參數是否適當(例如是否達到相對較佳的訊號傳輸品質)。若不適當(例如未達到相對較佳的訊號傳輸品質)，處理電路11可運行控制程式21發送參數調整指令ADJ(i)至中繼電路12，以持續對調變電路22的一或多個電路參數進行調整。反之，若適當(例如已達到相對較佳的訊號傳輸品質)，則處理電路11可不發送參數調整指令ADJ(i)。In an exemplary embodiment, theprocessing circuit 11 can evaluate whether the current circuit parameters used by themodulation circuit 22 are appropriate (for example, whether a relatively good signal transmission quality is achieved) according to the signal quality information SQ(i). If not appropriate (for example, the relatively good signal transmission quality has not been achieved), theprocessing circuit 11 can run thecontrol program 21 and send the parameter adjustment command ADJ(i) to therelay circuit 12 to continuously adjust one or more of themodulation circuits 22. A circuit parameter is adjusted. On the contrary, if appropriate (for example, relatively good signal transmission quality has been achieved), theprocessing circuit 11 may not send the parameter adjustment command ADJ(i).

須注意的是，圖2至圖5的範例實施例中所提及的操作可被重複執行多次，以持續根據調變電路22對測試訊號TS(i)的調變結果(或訊號品質資訊SQ(i))來調整調變電路22所使用的電路參數。例如，當i=1時，測試訊號TS(1)可先被調變電路22調變並傳送至記憶體儲存裝置13。然後，處理電路11可使用開發者指令VC(1)向記憶體儲存裝置13請求訊號品質資訊SQ(1)。訊號品質資訊SQ(1)可反映記憶體儲存裝置13所接收到的測試訊號TS(1)的訊號品質。根據記憶體儲存裝置13所提供的訊號品質資訊SQ(1)，處理電路11可藉由參數調整指令ADJ(i)來調整調變電路22的特定電路參數。接著，當i=2、3或其他數值時，圖2至圖5的範例實施例中所提及的操作可被重複，直到完成對調變電路22的參數調整操作。It should be noted that the operations mentioned in the exemplary embodiments of FIG. 2 to FIG. 5 can be repeated multiple times, so as to continuously adjust the modulation result (or signal quality) of the test signal TS(i) according to themodulation circuit 22. information SQ(i)) to adjust the circuit parameters used by the modulatingcircuit 22 . For example, when i=1, the test signal TS(1) can be modulated by the modulatingcircuit 22 first and sent to thememory storage device 13 . Then, theprocessing circuit 11 can use the developer command VC(1) to request the signal quality information SQ(1) from thememory storage device 13 . The signal quality information SQ(1) can reflect the signal quality of the test signal TS(1) received by thememory storage device 13 . According to the signal quality information SQ(1) provided by thememory storage device 13, theprocessing circuit 11 can adjust specific circuit parameters of themodulation circuit 22 through the parameter adjustment command ADJ(i). Then, when i=2, 3 or other values, the operations mentioned in the exemplary embodiments of FIG. 2 to FIG. 5 can be repeated until the parameter adjustment operation of themodulation circuit 22 is completed.

在一範例實施例中，中繼電路12包括接收端電路(亦稱為第一接收端電路)與發送端電路(亦稱為第一發送端電路)，且記憶體儲存裝置13也包括接收端電路(亦稱為第二接收端電路)與發送端電路(亦稱為第二發送端電路)。中繼電路12中的接收端電路(即第一接收端電路)與記憶體儲存裝置13中的接收端電路(即第二接收端電路)皆屬於RX電路並用以從外部接收訊號。中繼電路12中的發送端電路(即第一發送端電路)與記憶體儲存裝置13中的發送端電路(即第二發送端電路)皆屬於TX電路並用以發送訊號。In an exemplary embodiment, therelay circuit 12 includes a receiving end circuit (also called a first receiving end circuit) and a sending end circuit (also called a first sending end circuit), and thememory storage device 13 also includes a receiving end circuit An end circuit (also called a second receiving end circuit) and a sending end circuit (also called a second sending end circuit). Both the receiving end circuit in the relay circuit 12 (ie, the first receiving end circuit) and the receiving end circuit in the memory storage device 13 (ie, the second receiving end circuit) belong to the RX circuit and are used to receive signals from the outside. Both the transmitter circuit in the relay circuit 12 (ie, the first transmitter circuit) and the transmitter circuit in the memory storage device 13 (ie, the second transmitter circuit) belong to the TX circuit and are used for sending signals.

在一範例實施例中，中繼電路12中的發送端電路(即第一發送端電路)耦接至記憶體儲存裝置13中的接收端電路(即第二接收端電路)。在一範例實施例中，中繼電路12中的發送端電路(即第一發送端電路)可發送測試訊號TS(i)至記憶體儲存裝置13中的接收端電路(即第二接收端電路)。在一範例實施例中，調變電路22可設置於第一發送端電路中。在一範例實施例中，訊號接收電路23可設置於第二接收端電路中。In an exemplary embodiment, the transmitting-end circuit (ie, the first transmitting-end circuit) in therelay circuit 12 is coupled to the receiving-end circuit (ie, the second receiving-end circuit) in thememory storage device 13 . In an exemplary embodiment, the transmitting circuit in the relay circuit 12 (ie, the first transmitting circuit) can send the test signal TS(i) to the receiving circuit in the memory storage device 13 (ie, the second receiving circuit). circuit). In an exemplary embodiment, the modulatingcircuit 22 may be disposed in the first transmitting end circuit. In an exemplary embodiment, thesignal receiving circuit 23 may be disposed in the second receiving end circuit.

在一範例實施例中，在傳遞測試訊號TS(i)的過程中，中繼電路12可經由第一接收端電路從處理電路11接收測試訊號TS(i)並經由第一發送端電路中的調變電路22來調變測試訊號TS(i)。經調變的測試訊號TS(i)可經由第一發送端電路傳送至記憶體儲存裝置13。記憶體儲存裝置13可經由第二接收端電路中的訊號接收電路23接收測試訊號TS(i)並產生對應於測試訊號TS(i)的訊號品質資訊SQ(i)。訊號品質資訊SQ(i)可經由第二發送端電路傳送至中繼電路12並經由中繼電路12傳送至處理電路11。然後，處理電路11可根據訊號品質資訊SQ(i)發送參數調整指令ADJ(i)至中繼電路12，以藉由參數調整指令ADJ(i)來調整第一發送端電路的至少一設定參數。例如，中繼電路12中經調整的設定參數可包括第一發送端電路(或調變電路22)中的訊號放大器的設定參數等可改變由第一發送端電路輸出的訊號的電壓、波形或頻率等各式電氣特徵之參數。此外，記憶體儲存裝置13中的發送端電路(即第二發送端電路)及/或接收端電路(即第二接收端電路)的至少一設定參數是由記憶體儲存裝置13本身進行設定及/或調整。例如，記憶體儲存裝置13中經調整的設定參數可包括第二接收端電路(或訊號接收電路23)中的等化器電路的設定參數。In an exemplary embodiment, in the process of transmitting the test signal TS(i), therelay circuit 12 may receive the test signal TS(i) from theprocessing circuit 11 through the first receiving circuit and transmit the test signal TS(i) through the first transmitting circuit. Themodulation circuit 22 modulates the test signal TS(i). The modulated test signal TS(i) can be transmitted to thememory storage device 13 through the first transmitting circuit. Thememory storage device 13 can receive the test signal TS(i) through thesignal receiving circuit 23 in the second receiving end circuit and generate signal quality information SQ(i) corresponding to the test signal TS(i). The signal quality information SQ(i) can be sent to therelay circuit 12 via the second sending circuit and sent to theprocessing circuit 11 via therelay circuit 12 . Then, theprocessing circuit 11 can send the parameter adjustment command ADJ(i) to therelay circuit 12 according to the signal quality information SQ(i), so as to adjust at least one setting of the first transmitting end circuit through the parameter adjustment command ADJ(i) parameter. For example, the adjusted setting parameters in therelay circuit 12 may include setting parameters of the signal amplifier in the first sending end circuit (or modulating circuit 22), etc., which can change the voltage of the signal output by the first sending end circuit, Parameters of various electrical characteristics such as waveform or frequency. In addition, at least one setting parameter of the sending end circuit (i.e. the second sending end circuit) and/or the receiving end circuit (i.e. the second receiving end circuit) in thememory storage device 13 is set by thememory storage device 13 itself and / or adjust. For example, the adjusted setting parameters in thememory storage device 13 may include the setting parameters of the equalizer circuit in the second receiving end circuit (or the signal receiving circuit 23 ).

在一範例實施例中，在將中繼電路12與記憶體儲存裝置13電性連接至主機板14之後，處理電路11可運行控制程式21以對中繼電路12執行一初始化設定。例如，在此初始化設定中，控制程式21可指示中繼電路12執行一初始化配置，以將中繼電路12的至少部分參數設定為初始值。在完成初始化設定後，處理電路11可運行控制程式21以經由初始化後的中繼電路12與記憶體儲存裝置13執行交握程序(亦稱為交握操作)。在此交握程序中，處理電路11可經由中繼電路12與記憶體儲存裝置13交換資訊，例如交換與電壓及/或頻率有關的電氣資訊。此外，在此交握程序中，記憶體儲存裝置13可根據來自中繼電路12的資訊自動調整記憶體儲存裝置13中的接收端電路(即第二接收端電路)(例如訊號接收電路23)的至少一設定參數。在完成交握程序後，處理電路11可運行控制程式21以執行圖2至圖5的範例實施例中提及的至少部分操作。此外，在一範例實施例中，圖2的範例實施例中提及的至少部分操作(例如傳送測試訊號TS(i)並分析測試訊號TS(i)的訊號品質)亦可在所述交握程序中執行。In an exemplary embodiment, after therelay circuit 12 and thememory storage device 13 are electrically connected to themotherboard 14 , theprocessing circuit 11 can run thecontrol program 21 to perform an initialization setting on therelay circuit 12 . For example, in the initialization setting, thecontrol program 21 may instruct therelay circuit 12 to perform an initialization configuration, so as to set at least some parameters of therelay circuit 12 as initial values. After the initialization setting is completed, theprocessing circuit 11 can run thecontrol program 21 to perform a handshake procedure (also called a handshake operation) through the initializedrelay circuit 12 and thememory storage device 13 . In this handshaking procedure, theprocessing circuit 11 can exchange information with thememory storage device 13 via therelay circuit 12 , for example, exchange electrical information related to voltage and/or frequency. In addition, in this handshake procedure, thememory storage device 13 can automatically adjust the receiving end circuit (ie, the second receiving end circuit) in thememory storage device 13 according to the information from the relay circuit 12 (for example, the signal receiving circuit 23 ) at least one setting parameter. After completing the handshake procedure, theprocessing circuit 11 can run thecontrol program 21 to perform at least some of the operations mentioned in the exemplary embodiments of FIGS. 2 to 5 . In addition, in an exemplary embodiment, at least part of the operations mentioned in the exemplary embodiment of FIG. 2 (such as transmitting the test signal TS(i) and analyzing the signal quality of the test signal TS(i)) can also be performed in the handshake executed in the program.

在一範例實施例中，訊號接收電路23可根據所接收到的測試訊號TS(i)來評估測試訊號TS(i)的訊號恢復狀態、訊號眼寬狀態、訊號眼高狀態及/或訊號邊緣狀態。例如，訊號接收電路23可包括眼寬偵測器及/或眼高偵測器等各式用以評估訊號品質的檢測電路。然後，訊號接收電路23可根據評估結果儲存與測試訊號TS(i)有關的訊號品質資訊SQ(i)。藉此，所儲存的訊號品質資訊SQ(i)可反映所接收到的測試訊號TS(i)的訊號恢復狀態、訊號眼寬狀態、訊號眼高狀態及訊號邊緣狀態的至少其中之一。In an exemplary embodiment, thesignal receiving circuit 23 can evaluate the signal recovery state, the signal eye width state, the signal eye height state and/or the signal edge of the test signal TS(i) according to the received test signal TS(i). state. For example, thesignal receiving circuit 23 may include various detection circuits for evaluating signal quality, such as an eye width detector and/or an eye height detector. Then, thesignal receiving circuit 23 can store the signal quality information SQ(i) related to the test signal TS(i) according to the evaluation result. Thus, the stored signal quality information SQ(i) can reflect at least one of the signal recovery state, signal eye width state, signal eye height state and signal edge state of the received test signal TS(i).

圖6是根據本發明的一範例實施例所繪示的訊號的眼圖的示意圖。請參照圖6，接續於圖2的範例實施例，在一範例實施例中，訊號接收電路23可描繪出所接收到的測試訊號TS(i)的眼圖61。眼圖61中的至少部分資訊可反映所接收到的測試訊號TS(i)的訊號品質。FIG. 6 is a schematic diagram of an eye diagram of a signal depicted according to an exemplary embodiment of the present invention. Please refer to FIG. 6 , following the exemplary embodiment of FIG. 2 , in an exemplary embodiment, thesignal receiving circuit 23 may draw an eye diagram 61 of the received test signal TS(i). At least part of the information in the eye diagram 61 can reflect the signal quality of the received test signal TS(i).

在一範例實施例中，訊號接收電路23可根據眼圖61中的參數D(1)~D(5)或者其他有用的資訊來產生訊號品質資訊SQ(i)。例如，參數D(1)可反映所接收到的測試訊號TS(i)的訊號眼寬狀態。例如，參數D(2)可反映所接收到的測試訊號TS(i)的訊號眼高狀態。例如，參數D(3)~D(5)可反映所接收到的測試訊號TS(i)的訊號邊緣狀態。此外，在一範例實施例中，訊號接收電路23也可根據對所接收到的測試訊號TS(i)進行訊號恢復或訊號重建的次數來評估所接收到的測試訊號TS(i)的訊號恢復狀態。In an exemplary embodiment, thesignal receiving circuit 23 can generate the signal quality information SQ(i) according to the parameters D(1)˜D(5) in the eye diagram 61 or other useful information. For example, the parameter D(1) may reflect the signal eye width state of the received test signal TS(i). For example, the parameter D(2) may reflect the signal eye-high state of the received test signal TS(i). For example, the parameters D(3)˜D(5) can reflect the signal edge state of the received test signal TS(i). In addition, in an exemplary embodiment, thesignal receiving circuit 23 may also evaluate the signal recovery of the received test signal TS(i) according to the number of signal recovery or signal reconstruction performed on the received test signal TS(i) state.

圖7是根據本發明的一範例實施例所繪示的記憶體儲存裝置的示意圖。請參照圖7，記憶體儲存裝置13包括連接介面單元701、記憶體控制電路單元702與可複寫式非揮發性記憶體模組703。FIG. 7 is a schematic diagram of a memory storage device according to an exemplary embodiment of the present invention. Referring to FIG. 7 , thememory storage device 13 includes aconnection interface unit 701 , a memorycontrol circuit unit 702 and a rewritablenon-volatile memory module 703 .

連接介面單元701用以將記憶體儲存裝置13耦接至圖1的處理電路11、中繼電路12及/或主機板14。記憶體儲存裝置13可透過連接介面單元701與處理電路11、中繼電路12及/或主機板14通訊。例如，連接介面單元701可相容SATA標準、並列先進附件(Parallel Advanced Technology Attachment, PATA)標準、電氣和電子工程師協會(Institute of Electrical and Electronic Engineers, IEEE)1394標準、PCI Express標準、USB標準、安全數位(Secure Digital, SD)介面標準、超高速一代(Ultra High Speed-I, UHS-I)介面標準、超高速二代(Ultra High Speed-II, UHS-II)介面標準、記憶棒(Memory Stick, MS)介面標準、MCP介面標準、MMC介面標準、eMMC介面標準、通用快閃記憶體(Universal Flash Storage, UFS)介面標準、eMCP介面標準、小型快閃(Compact Flash, CF)介面標準、整合式驅動電子介面(Integrated Device Electronics, IDE)標準或其他適合的標準。此外，連接介面單元701可與記憶體控制電路單元702封裝在一個晶片中或者佈設於包含記憶體控制電路單元702的晶片外。Theconnection interface unit 701 is used for coupling thememory storage device 13 to theprocessing circuit 11 , therelay circuit 12 and/or themotherboard 14 of FIG. 1 . Thememory storage device 13 can communicate with theprocessing circuit 11 , therelay circuit 12 and/or themotherboard 14 through theconnection interface unit 701 . For example, theconnection interface unit 701 is compatible with the SATA standard, the Parallel Advanced Technology Attachment (PATA) standard, the Institute of Electrical and Electronic Engineers (Institute of Electrical and Electronic Engineers, IEEE) 1394 standard, the PCI Express standard, the USB standard, Secure Digital (SD) interface standard, Ultra High Speed-I (UHS-I) interface standard, Ultra High Speed-II (UHS-II) interface standard, Memory Stick (Memory Stick) Stick, MS) interface standard, MCP interface standard, MMC interface standard, eMMC interface standard, Universal Flash Storage (UFS) interface standard, eMCP interface standard, Compact Flash (CF) interface standard, Integrated Device Electronics (IDE) standard or other suitable standards. In addition, theconnection interface unit 701 and the memorycontrol circuit unit 702 can be packaged in one chip or arranged outside the chip including the memorycontrol circuit unit 702 .

記憶體控制電路單元702用以執行以硬體型式或韌體型式實作的多個邏輯閘或控制指令並且根據主機系統的指令在可複寫式非揮發性記憶體模組703中進行資料的寫入、讀取與抹除等運作。The memorycontrol circuit unit 702 is used to execute a plurality of logic gates or control instructions implemented in hardware or firmware and write data in the rewritablenon-volatile memory module 703 according to the instructions of the host system Input, read and erase operations.

可複寫式非揮發性記憶體模組703是耦接至記憶體控制電路單元702並且用以儲存處理電路11所寫入之資料。例如，可複寫式非揮發性記憶體模組703可以是單階記憶胞(Single Level Cell, SLC)NAND型快閃記憶體模組(即，一個記憶胞中可儲存1個位元的快閃記憶體模組)、二階記憶胞(Multi Level Cell, MLC)NAND型快閃記憶體模組(即，一個記憶胞中可儲存2個位元的快閃記憶體模組)、三階記憶胞(Triple Level Cell，TLC)NAND型快閃記憶體模組(即，一個記憶胞中可儲存3個位元的快閃記憶體模組)、四階記憶胞(Quad Level Cell，QLC)NAND型快閃記憶體模組(即，一個記憶胞中可儲存4個位元的快閃記憶體模組)、其他快閃記憶體模組或其他具有相同特性的記憶體模組。The rewritablenon-volatile memory module 703 is coupled to the memorycontrol circuit unit 702 and used for storing data written by theprocessing circuit 11 . For example, the rewritablenon-volatile memory module 703 can be a single-level memory cell (Single Level Cell, SLC) NAND flash memory module (that is, a flash memory cell that can store 1 bit memory module), second-order memory cell (Multi Level Cell, MLC) NAND flash memory module (that is, a flash memory module that can store 2 bits in one memory cell), third-order memory cell (Triple Level Cell, TLC) NAND flash memory module (that is, a flash memory module that can store 3 bits in a memory cell), Quad Level Cell (QLC) NAND type A flash memory module (that is, a flash memory module that can store 4 bits in a memory cell), other flash memory modules, or other memory modules with the same characteristics.

在一範例實施例中，記憶體控制電路單元702亦稱為快閃記憶體控制器。在一範例實施例中，可複寫式非揮發性記憶體模組703亦稱為快閃記憶體模組。在一範例實施例中，圖1的主機板14上的至少部分電子電路(包含處理電路11)亦可統稱為主機系統。In an exemplary embodiment, the memorycontrol circuit unit 702 is also called a flash memory controller. In an exemplary embodiment, the rewritablenon-volatile memory module 703 is also called a flash memory module. In an exemplary embodiment, at least part of the electronic circuits (including the processing circuit 11 ) on themotherboard 14 of FIG. 1 may also be collectively referred to as a host system.

圖8是根據本發明的一範例實施例所繪示的電路參數調整方法的流程圖。請參照圖8，在步驟S801中，經由中繼電路傳送至少一指令至記憶體儲存裝置，其中所述指令用以指示所述記憶體儲存裝置提供訊號品質資訊。在步驟S802中，從所述記憶體儲存裝置接收所述訊號品質資訊。在步驟S803中，根據所述訊號品質資訊調整所述中繼電路的一或多個電路參數。FIG. 8 is a flowchart of a method for adjusting circuit parameters according to an exemplary embodiment of the present invention. Please refer to FIG. 8 , in step S801 , at least one command is sent to the memory storage device via the relay circuit, wherein the command is used to instruct the memory storage device to provide signal quality information. In step S802, the signal quality information is received from the memory storage device. In step S803, one or more circuit parameters of the relay circuit are adjusted according to the signal quality information.

然而，圖8中各步驟已詳細說明如上，在此便不再贅述。值得注意的是，圖8中各步驟可以實作為多個程式碼或是電路，本發明不加以限制。此外，圖8的方法可以搭配以上範例實施例使用，也可以單獨使用，本發明不加以限制。However, each step in FIG. 8 has been described in detail above, and will not be repeated here. It should be noted that each step in FIG. 8 can be implemented as a plurality of program codes or circuits, which is not limited by the present invention. In addition, the method in FIG. 8 can be used in combination with the above exemplary embodiments, or can be used alone, which is not limited by the present invention.

綜上所述，在處理電路(例如CPU)經由中繼電路耦接至記憶體儲存裝置的使用情景中，處理電路可使用特定指令(例如開發者指令)來從記憶體儲存裝置讀取訊號品質資訊。然後，處理電路可根據此訊號品質資訊評估當前中繼電路所使用的電路參數是否需更新並可動態調整所述電路參數。在一範例實施例中，不需額外外接檢測儀器來對中繼電路輸出的訊號進行檢測。藉由處理電路與記憶體儲存裝置之間的配合，中繼電路使用的電路參數可適當地被調整，從而提高對於中繼電路使用的電路參數的調整效率。To sum up, in a usage scenario where a processing circuit (such as a CPU) is coupled to a memory storage device via a relay circuit, the processing circuit can use specific instructions (such as developer instructions) to read signals from the memory storage device quality information. Then, the processing circuit can evaluate whether the circuit parameters currently used by the relay circuit need to be updated according to the signal quality information, and dynamically adjust the circuit parameters. In an exemplary embodiment, no additional external detection equipment is needed to detect the signal output by the relay circuit. Through the cooperation between the processing circuit and the memory storage device, the circuit parameters used by the relay circuit can be properly adjusted, thereby improving the adjustment efficiency of the circuit parameters used by the relay circuit.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

10:電路參數調整系統 11:處理電路 12:中繼電路 13:記憶體儲存裝置 14:主機板 21:控制程式 22:調變電路 23:訊號接收電路 61:眼圖 701:連接介面單元 702:記憶體控制電路單元 703:可複寫式非揮發性記憶體模組 S801:步驟(經由中繼電路傳送指令至記憶體儲存裝置，其中所述指令用以指示記憶體儲存裝置提供訊號品質資訊) S802:步驟(從所述記憶體儲存裝置接收所述訊號品質資訊) S803:步驟(根據所述訊號品質資訊調整所述中繼電路的電路參數)10: Circuit parameter adjustment system 11: Processing circuit 12: Relay circuit 13: Memory storage device 14: Motherboard 21: Control program 22: Modulation circuit 23: Signal receiving circuit 61:Eye Diagram 701: Connection interface unit 702: memory control circuit unit 703: Rewritable non-volatile memory module S801: Step (transmitting an instruction to the memory storage device via the relay circuit, wherein the instruction is used to instruct the memory storage device to provide signal quality information) S802: Step (receiving the signal quality information from the memory storage device) S803: step (adjusting the circuit parameters of the relay circuit according to the signal quality information)

圖1是根據本發明的一範例實施例所繪示的電路參數調整系統的示意圖。圖2至圖5是根據本發明的一範例實施例所繪示的調整中繼電路的電路參數的示意圖。圖6是根據本發明的一範例實施例所繪示的訊號的眼圖的示意圖。圖7是根據本發明的一範例實施例所繪示的記憶體儲存裝置的示意圖。圖8是根據本發明的一範例實施例所繪示的電路參數調整方法的流程圖。FIG. 1 is a schematic diagram of a circuit parameter adjustment system according to an exemplary embodiment of the present invention. 2 to 5 are schematic diagrams of adjusting circuit parameters of a relay circuit according to an exemplary embodiment of the present invention. FIG. 6 is a schematic diagram of an eye diagram of a signal depicted according to an exemplary embodiment of the present invention. FIG. 7 is a schematic diagram of a memory storage device according to an exemplary embodiment of the present invention. FIG. 8 is a flowchart of a method for adjusting circuit parameters according to an exemplary embodiment of the present invention.

10:電路參數調整系統10: Circuit parameter adjustment system

11:處理電路11: Processing circuit

12:中繼電路12: Relay circuit

13:記憶體儲存裝置13: Memory storage device

14:主機板14: Motherboard