本發明是有關於一種觸控模組結構及其製造方法，且特別是有關於一種顯示器的觸控模組結構及其製造方法。The invention relates to a touch module structure and a manufacturing method thereof, and more particularly to a touch module structure of a display and a manufacturing method thereof.
近年來，手持行動電子裝置的螢幕大都改為觸控螢幕以便於使用者能更方便的輸入資料。觸控螢幕之觸控模組與驅動模組之間通常會藉軟性電路板連接。In recent years, most of the screens of handheld mobile electronic devices have been changed to touch screens so that users can input data more conveniently. The touch module of the touch screen and the driving module are usually connected by a flexible circuit board.
當軟性電路板的一端使用導電膠黏合於觸控面板之導電連接區時，由於印刷溢墨、印刷公差與黏合偏移公差等考量，一般絕緣膠的印刷設計必需讓開觸控面板之導電連接區。因此，當軟性電路板黏合於觸控面板之導電連接區，常發生軟性電路板與絕緣膠之間隙露出導電連接區內的金屬線，易造成金屬線氧化、水氣滲入或刮傷等問題。When one end of the flexible circuit board is bonded to the conductive connection area of the touch panel with conductive adhesive, due to considerations such as printing ink overflow, printing tolerance and adhesion offset tolerance, the printing design of general insulating glue must allow the conductive connection of the touch panel to be opened. Area. Therefore, when the flexible circuit board is adhered to the conductive connection area of the touch panel, it often occurs that the gap between the flexible circuit board and the insulating glue exposes the metal wires in the conductive connection zone, which easily causes problems such as metal wire oxidation, water vapor infiltration or scratching.
如何克服印刷溢墨、印刷公差或黏合偏移公差的因素，而又能使軟性電路板與絕緣膠之間隙不露出導電連接區內的金屬線，而使觸控模組具有更可靠的信賴性，仍需投注更多的努力。How to overcome the factors of printing ink overflow, printing tolerance or adhesion offset tolerance, and can prevent the gap between the flexible circuit board and the insulating glue from exposing the metal wires in the conductive connection area, so that the touch module has more reliable reliability , Still need to bet more effort.
因此，本發明之一態樣是在提供一種觸控模組結構，其包含一基板、複數個偵測電極圖案、一銅電極圖案層、一軟性電路板、一異方性導電膠層以及一絕緣膠層。該些個偵測電極圖案位於基板上，且銅電極圖案層接觸該些個偵測電極圖案。軟性電路板具有一連接電極區。異方性導電膠層位於銅電極圖案層與連接電極區之間。絕緣膠層覆蓋銅電極圖案層，且部分區域位於銅電極圖案層與連接電極區之間。Therefore, one aspect of the present invention is to provide a touch module structure including a substrate, a plurality of detection electrode patterns, a copper electrode pattern layer, a flexible circuit board, an anisotropic conductive adhesive layer, and a Insulating rubber layer. The detection electrode patterns are located on the substrate, and the copper electrode pattern layer contacts the detection electrode patterns. The flexible circuit board has a connection electrode region. The anisotropic conductive adhesive layer is located between the copper electrode pattern layer and the connection electrode region. The insulating adhesive layer covers the copper electrode pattern layer, and a part of the region is located between the copper electrode pattern layer and the connection electrode region.
依據本發明之一實施例，絕緣膠層接觸異方性導電膠層。According to an embodiment of the present invention, the insulating adhesive layer contacts the anisotropic conductive adhesive layer.
依據本發明之一實施例，絕緣膠層位於銅電極圖案層與連接電極區之間區域的寬度C符合C=A-B關係式，其中A為連接電極區之寬度，B為異方性導電膠層之寬度，且A、B、C均為正值。According to an embodiment of the present invention, the width C of the region between the insulating adhesive layer between the copper electrode pattern layer and the connection electrode region conforms to the relationship C = AB, where A is the width of the connection electrode region and B is the anisotropic conductive adhesive layer. Width, and A, B, and C are all positive values.
依據本發明之一實施例，觸控模組結構更包含一光學膠層，其覆蓋於該些個偵測電極圖案未被銅電極圖案層或絕緣膠層接觸或覆蓋的部分。According to an embodiment of the present invention, the touch module structure further includes an optical adhesive layer covering the portions of the detection electrode patterns that are not contacted or covered by the copper electrode pattern layer or the insulating adhesive layer.
依據本發明之一實施例，觸控模組結構更包含一黑膠層，其填充於光學膠層與軟性電路板之間隙內。According to an embodiment of the present invention, the touch module structure further includes a black adhesive layer, which is filled in a gap between the optical adhesive layer and the flexible circuit board.
依據本發明之一實施例，絕緣膠層位於銅電極圖案層與連接電極區之間區域的寬度C符合以下關係式：
本發明之一態樣是在提供一種觸控模組結構的製造方法，其包含以下步驟。提供一觸控模組，其包含一基板、複數個偵測電極圖案以及一銅電極圖案層，其中該些個偵測電極圖案位於基板上，且銅電極圖案層接觸該些個偵測電極圖案。貼合一軟性電路板之連接電極區至觸控模組之銅電極圖案層。形成一異方性導電膠層，其位於銅電極圖案層與連接電極區之間。形成一絕緣膠層，其覆蓋銅電極圖案層，且部分區域位於銅電極圖案層與連接電極區之間。One aspect of the present invention is to provide a method for manufacturing a touch module structure, which includes the following steps. A touch module is provided, which includes a substrate, a plurality of detection electrode patterns, and a copper electrode pattern layer, wherein the detection electrode patterns are located on the substrate, and the copper electrode pattern layer contacts the detection electrode patterns. . Laminate the connection electrode area of a flexible circuit board to the copper electrode pattern layer of the touch module. An anisotropic conductive adhesive layer is formed, which is located between the copper electrode pattern layer and the connection electrode region. An insulating glue layer is formed, which covers the copper electrode pattern layer, and a part of the region is located between the copper electrode pattern layer and the connection electrode region.
依據本發明之一實施例，絕緣膠層接觸異方性導電膠層。According to an embodiment of the present invention, the insulating adhesive layer contacts the anisotropic conductive adhesive layer.
依據本發明之一實施例，絕緣膠層位於銅電極圖案層與連接電極區之間區域的寬度C符合C=A-B關係式，其中A為連接電極區之寬度，B為異方性導電膠層之寬度，且A、B、C均為正值。According to an embodiment of the present invention, the width C of the region between the insulating adhesive layer between the copper electrode pattern layer and the connection electrode region conforms to the relationship C = AB, where A is the width of the connection electrode region and B is the anisotropic conductive adhesive layer. Width, and A, B, and C are all positive values.
依據本發明之一實施例，絕緣膠層位於銅電極圖案層與連接電極區之間區域的寬度C符合以下關係式：
綜合以上，本發明所提出之觸控模組結構及其製造方法，其印刷之絕緣膠層需與軟性電路板之連接電極區重疊，藉以補強人工點膠的變異性因素。即使人工點膠異常或未執行，銅電極圖案層仍能被完善的覆蓋保護，進而使電子裝置 之觸控模組具有更高的防水氣或氧化等功能之信賴性。To sum up, in the touch module structure and the manufacturing method of the present invention, the printed insulating adhesive layer needs to overlap the connection electrode area of the flexible circuit board, so as to reinforce the variability factor of artificial dispensing. Even if the manual dispensing is abnormal or not performed, the copper electrode pattern layer can still be completely covered and protected, thereby making the touch module of the electronic device more reliable in functions such as waterproofness and oxidation.
100‧‧‧觸控模組結構100‧‧‧touch module structure
100’‧‧‧觸控模組結構100’‧‧‧ touch module structure
102‧‧‧基板102‧‧‧ substrate
104‧‧‧偵測電極圖案104‧‧‧Detection electrode pattern
106‧‧‧銅電極圖案層106‧‧‧ Copper electrode pattern layer
108‧‧‧絕緣膠層108‧‧‧Insulating adhesive layer
108’‧‧‧絕緣膠層108’‧‧‧ insulating rubber layer
108a‧‧‧重疊區108a‧‧‧ overlapping area
110‧‧‧軟性電路板110‧‧‧flexible circuit board
110a‧‧‧連接電極區110a‧‧‧ connected electrode area
112‧‧‧異方性導電膠層112‧‧‧Anisotropic conductive adhesive layer
114‧‧‧光學膠層114‧‧‧Optical adhesive layer
116‧‧‧黑膠層116‧‧‧vinyl layer
120‧‧‧間隙120‧‧‧ Clearance
A‧‧‧寬度A‧‧‧Width
B‧‧‧寬度B‧‧‧Width
C‧‧‧寬度C‧‧‧Width
X1‧‧‧異方性導電膠層之圖案公差X1‧‧‧ Pattern tolerance of anisotropic conductive adhesive layer
X2‧‧‧連接電極區之圖案公差X2‧‧‧ pattern tolerance of connecting electrode area
X3‧‧‧異方性導電膠層之貼合公差X3‧‧‧ Adhesion tolerance of anisotropic conductive adhesive layer
X4‧‧‧軟性電路板之貼合公差X4‧‧‧ Fitting tolerance of flexible circuit board
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之詳細說明如下：第1圖係繪示根據本發明之一實施例所述之觸控模組結構的局部俯視圖；第2圖係繪示根據本發明之另一實施例所述之觸控模組結構的局部俯視圖；以及第3圖係繪示沿第2圖之剖面線3-3之剖面圖。In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the detailed description of the drawings is as follows: FIG. 1 illustrates a touch mode according to an embodiment of the present invention. Partial top view of the group structure; FIG. 2 is a partial top view showing the structure of the touch module according to another embodiment of the present invention; and FIG. 3 is a view along the section line 3-3 of FIG. 2 Sectional view.
第4圖係繪示根據本發明之一實施例所述之觸控模組結構的分解示意圖；以及第5圖係繪示根據本發明之另一實施例所述之觸控模組結構的分解示意圖。FIG. 4 is an exploded view of a touch module structure according to an embodiment of the present invention; and FIG. 5 is an exploded view of a touch module structure according to another embodiment of the present invention; schematic diagram.
本發明之一態樣是提供電子裝置一種觸控模組結構及其製造方法，藉以使電子裝置之觸控模組具有更高的防水氣或氧化等功能的信賴性。One aspect of the present invention is to provide a touch module structure of an electronic device and a manufacturing method thereof, so that the touch module of the electronic device has higher reliability of functions such as waterproofness and oxidation.
請同時參照圖第1圖，其繪示根據本發明之一實施例所述之觸控模組結構的局部俯視圖。觸控模組結構100包含觸控模組與連接於其邊上的軟性電路板110。觸控模組包含一基板102、複數個偵測電極圖案104以及一銅電極圖案層106。該些偵測電極圖案104係高光透的導電層，例如氧化銦 錫導電層，其形成於基板102上需要具有觸控功能的區域。基板102亦為高透光材質的基板，例如玻璃基板等材質的基板。銅電極圖案層106係通常位於基板102的邊緣區域，方便軟性電路板110黏合，但並不以此為限。Please refer to FIG. 1 at the same time, which illustrates a partial top view of a touch module structure according to an embodiment of the present invention. The touch module structure 100 includes a touch module and a flexible circuit board 110 connected to the touch module. The touch module includes a substrate 102, a plurality of detection electrode patterns 104, and a copper electrode pattern layer 106. The detection electrode patterns 104 are highly light-transmissive conductive layers, such as an indium tin oxide conductive layer, and are formed on a region of the substrate 102 that needs to have a touch function. The substrate 102 is also a substrate of a material with high light transmission, such as a substrate of a material such as a glass substrate. The copper electrode pattern layer 106 is generally located on the edge region of the substrate 102, which is convenient for the adhesion of the flexible circuit board 110, but is not limited thereto.
絕緣膠層108的印刷區域係覆蓋銅電極圖案層106與部份偵測電極圖案104(非觸控需求區域)，並讓出軟性電路板110欲黏合的區域。當軟性電路板110以導電膠(例如異方性導電膠層)貼合於絕緣膠層108所預先未印刷之區域，常因印刷公差或黏合偏移公差等的因素，而使軟性電路板110與絕緣膠層108之間留下間隙120。此間隙120的大小因實際製程而有所差異。The printed area of the insulating adhesive layer 108 covers the copper electrode pattern layer 106 and part of the detection electrode pattern 104 (non-touch-required area), and allows the flexible circuit board 110 to be bonded. When the flexible circuit board 110 is attached with a conductive adhesive (such as an anisotropic conductive adhesive layer) to an area not previously printed on the insulating adhesive layer 108, the flexible circuit board 110 is often caused by factors such as printing tolerances or adhesion offset tolerances. A gap 120 is left from the insulating adhesive layer 108. The size of the gap 120 varies according to the actual process.
為解決上述間隙120所產生的可能負面影響(例如金屬線氧化、水氣滲入或刮傷等)，最直接的解決方式就是在軟性電路板110貼合於觸控模組後，以人工點膠的方式，將黑膠(材料同下述之黑膠層116)填入間隙120內。In order to solve the possible negative effects (such as metal wire oxidation, water vapor infiltration or scratching) generated by the gap 120, the most direct solution is to manually dispense the flexible circuit board 110 after it is attached to the touch module. In the same manner, black glue (the material is the same as the black glue layer 116 described below) is filled into the gap 120.
請同時參照第2、3圖，第2圖繪示根據本發明之另一實施例所述之觸控模組結構的局部俯視圖；第3圖繪示沿第2圖之剖面線3-3之剖面圖。上述以人工點膠方式的解決方法固然直接，但若因間隙120過小或不易填入或其他入工作業所易發生的缺點，本發明提出另一種解決方式供選擇。Please refer to Figs. 2 and 3 at the same time. Fig. 2 shows a partial top view of a touch module structure according to another embodiment of the present invention. Fig. 3 shows a section along line 3-3 of Fig. 2 Sectional view. Although the above-mentioned solution by manual dispensing method is straightforward, if the gap 120 is too small or is not easy to be filled in or other shortcomings which are prone to occur in the work industry, the present invention proposes another solution to choose from.
觸控模組結構100’包含觸控模組與連接於其邊上的軟性電路板110。觸控模組包含一基板102、複數個偵測電極圖案104以及一銅電極圖案層106。該些偵測電極圖案104係高光透的導電層，例如氧化銦錫導電層，其形成於基板102 上需要具有觸控功能的區域。基板102亦為高透光材質的基板，例如玻璃基板等材質的基板。銅電極圖案層106係通常位於基板102的邊緣區域，方便軟性電路板110黏合，但並不以此為限。銅電極圖案層106係接觸該些個偵測電極圖案104，使彼此能電性上導通。異方性導電膠層112形成於銅電極圖案層106與軟性電路板之連接電極區110a之間，使軟性電路板110能透過異方性導電膠層112、銅電極圖案層106而電性連接至該些偵測電極圖案104。The touch module structure 100 'includes a touch module and a flexible circuit board 110 connected to the touch module. The touch module includes a substrate 102, a plurality of detection electrode patterns 104, and a copper electrode pattern layer 106. The detection electrode patterns 104 are highly light-transmissive conductive layers, such as an indium tin oxide conductive layer, and are formed on a region of the substrate 102 that needs to have a touch function. The substrate 102 is also a substrate of a material with high light transmission, such as a substrate of a material such as a glass substrate. The copper electrode pattern layer 106 is generally located on the edge region of the substrate 102, which is convenient for the adhesion of the flexible circuit board 110, but is not limited thereto. The copper electrode pattern layer 106 is in contact with the detection electrode patterns 104 so as to be electrically conductive with each other. The anisotropic conductive adhesive layer 112 is formed between the copper electrode pattern layer 106 and the connection electrode region 110a of the flexible circuit board, so that the flexible circuit board 110 can be electrically connected through the anisotropic conductive adhesive layer 112 and the copper electrode pattern layer 106. To the detection electrode patterns 104.
本實施例與第1圖之實施例主要差異在於，(印刷)形成之絕緣膠層108’會刻意的與軟性電路板110欲黏合的區域的邊緣重疊，因此軟性電路板110黏合後絕緣膠層108’不僅覆蓋銅電極圖案層106與部份偵測電極圖案104(非觸控需求區域)，且其部份區域伸入銅電極圖案層106與軟性電路板110之間(即重疊區108a)，使銅電極圖案層106沒有外露的機會。The main difference between this embodiment and the embodiment of FIG. 1 is that the (insulation) insulating rubber layer 108 'formed by (printing) will deliberately overlap the edges of the region where the flexible circuit board 110 is to be bonded. Therefore, the insulating circuit layer after the flexible circuit board 110 is bonded 108 'not only covers the copper electrode pattern layer 106 and part of the detection electrode pattern 104 (non-touch-required area), but a part of the area extends between the copper electrode pattern layer 106 and the flexible circuit board 110 (that is, the overlap area 108a) So that the copper electrode pattern layer 106 is not exposed.
在較多數的製程狀況，絕緣膠層108’之重疊區108a會伸入銅電極圖案層106與軟性電路板110之間，且與異方性導電膠層112接觸。即使製程控制的較不佳，而使絕緣膠層108’之重疊區108a未與異方性導電膠層112接觸，但絕緣膠層108’伸入銅電極圖案層106與軟性電路板110之間的重疊區108a會黏合彼此，有效封閉水、氣的入侵管道，同樣能使銅電極圖案層106能被完全覆蓋。In most manufacturing processes, the overlap region 108a of the insulating adhesive layer 108 'will protrude between the copper electrode pattern layer 106 and the flexible circuit board 110 and contact the anisotropic conductive adhesive layer 112. Even if the process control is poor, and the overlapping area 108a of the insulating adhesive layer 108 'is not in contact with the anisotropic conductive adhesive layer 112, the insulating adhesive layer 108' extends between the copper electrode pattern layer 106 and the flexible circuit board 110 The overlapping areas 108a will adhere to each other, effectively closing the water and gas intrusion pipelines, and also enabling the copper electrode pattern layer 106 to be completely covered.
觸控模組更包含一光學膠層114(Optical Clear Adhesive)，其覆蓋於該些個偵測電極圖案104未被銅電極圖 案層106或絕緣膠層106接觸或覆蓋的部分。光學膠層114為高光透的材質的膠層。The touch module further includes an optical clear layer 114 (Optical Clear Adhesive), which covers portions of the detection electrode patterns 104 that are not touched or covered by the copper electrode pattern layer 106 or the insulating adhesive layer 106. The optical adhesive layer 114 is an adhesive layer made of a material with high light transmission.
或許，光學膠層114與軟性電路板110之間又因印刷公差或黏合偏移公差等的因素產生間隙，仍可以上述人工點膠的方式再填入一黑膠層116到間隙內。然而，此人工點膠步驟並非必需，因前述的絕緣膠層108’之重疊區108a已伸入銅電極圖案層106與軟性電路板110之間黏合彼此，有效封閉水、氣的入侵管道。Perhaps, a gap is created between the optical adhesive layer 114 and the flexible circuit board 110 due to factors such as printing tolerances or adhesion offset tolerances, and a black adhesive layer 116 can still be filled into the gap by the manual dispensing method described above. However, this manual dispensing step is not necessary, because the overlapping area 108a of the aforementioned insulating adhesive layer 108 'has been projected into the copper electrode pattern layer 106 and the flexible circuit board 110 to adhere to each other, effectively sealing off water and gas intrusion pipes.
請同時參照第4、5圖，第4圖係繪示根據本發明之一實施例所述之觸控模組結構的分解示意圖；第5圖係繪示根據本發明之另一實施例所述之觸控模組結構的分解示意圖。前述的絕緣膠層108’之重疊區108a伸入銅電極圖案層106與軟性電路板110之間，雖能有效封閉水、氣的入侵管道，但也會減少異方性導電膠層112黏合的區域。因此，絕緣膠層108’之重疊區108a的寬度需儘量縮小，但仍需達成其預期的目的。Please refer to FIG. 4 and FIG. 5 at the same time. FIG. 4 is an exploded view showing the structure of a touch module according to an embodiment of the present invention. FIG. 5 is a view showing an embodiment of the touch module according to the present invention. An exploded view of the touch module structure. The aforementioned overlap region 108a of the insulating adhesive layer 108 'extends between the copper electrode pattern layer 106 and the flexible circuit board 110. Although it can effectively seal the invasion of water and gas, it can also reduce the adhesion of the anisotropic conductive adhesive layer 112. region. Therefore, the width of the overlapping region 108a of the insulating adhesive layer 108 'needs to be minimized, but it still needs to achieve its intended purpose.
若以第4圖為例，絕緣膠層108’之重疊區108a的寬度C=A-B，其中A為軟性電路板之連接電極區110a之寬度，B為異方性導電膠層112之寬度(A、B、C理當為正值)。若軟性電路板之連接電極區110a之寬度A為定值，當寬度C越大，寬度B就越小，異方性導電膠層112之寬度B若過窄可能造成電阻值過高，影響電性導通功能。因此絕緣膠層108’之重疊區108a的寬度C需儘量縮小。Taking the figure 4 as an example, the width C of the overlapping region 108a of the insulating adhesive layer 108 'is C = AB, where A is the width of the connecting electrode region 110a of the flexible circuit board, and B is the width of the anisotropic conductive adhesive layer 112 (A , B, C should be positive values). If the width A of the connection electrode area 110a of the flexible circuit board is constant, the larger the width C, the smaller the width B. If the width B of the anisotropic conductive adhesive layer 112 is too narrow, the resistance value may be too high, which affects the electrical Sexual conduction function. Therefore, the width C of the overlapping region 108a of the insulating adhesive layer 108 'needs to be minimized.
若絕緣膠層108’之重疊區108a的寬度C要達成其 預期的目的(即伸入銅電極圖案層106與軟性電路板110之間與異方性導電膠層112連間，而全面覆蓋銅電極圖案層106，進而達到有效封閉水、氣的入侵管道的目的)，考量到各站製程公差對絕緣膠覆蓋範圍的影響，其需符合以下關係式：
在本案之實施例中，上述絕緣膠層係以濕式絕緣膠製程製作而成的保護層。In the embodiment of the present invention, the insulating rubber layer is a protective layer made by a wet insulating rubber process.
綜合以上，本發明所提出之觸控模組結構及其製造方法，其印刷之絕緣膠層需與軟性電路板之連接電極區重疊，藉以補強人工點膠的變異性因素。即使人工點膠異常或未執行，銅電極圖案層仍能被完善的覆蓋保護，進而使電子裝置之觸控模組具有更高的防水氣或氧化等功能之信賴性。To sum up, in the touch module structure and the manufacturing method of the present invention, the printed insulating adhesive layer needs to overlap the connection electrode area of the flexible circuit board, so as to reinforce the variability factor of artificial dispensing. Even if the manual dispensing is abnormal or not performed, the copper electrode pattern layer can still be completely covered and protected, so that the touch module of the electronic device has higher reliability in functions such as waterproofness and oxidation.
雖然本發明已以數個實施例揭露如上，然其並非用以限定本發明，在本發明所屬技術領域中任何具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed as above with several embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field to which the present invention pertains can make various modifications without departing from the spirit and scope of the present invention. Changes and retouching, so the protection scope of the present invention shall be determined by the scope of the appended patent application.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??201710576203.9 | 2017-07-14 | ||
| CN201710576203.9ACN107168588A (en) | 2017-07-14 | 2017-07-14 | Touch module structure and its manufacture method |
| Publication Number | Publication Date |
|---|---|
| TW201908942Atrue TW201908942A (en) | 2019-03-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106128639ATW201908942A (en) | 2017-07-14 | 2017-08-23 | Touch module structure and manufacturing method thereof |
| Country | Link |
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| CN (1) | CN107168588A (en) |
| TW (1) | TW201908942A (en) |
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| TWI703479B (en)* | 2019-04-11 | 2020-09-01 | 大陸商業成科技（成都）有限公司 | Touch module device and manufacturing method thereof |
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| TWI703479B (en)* | 2019-04-11 | 2020-09-01 | 大陸商業成科技（成都）有限公司 | Touch module device and manufacturing method thereof |
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| CN107168588A (en) | 2017-09-15 |
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