本發明係有關包括使用碳基蝕刻停止層之源極/汲極區的穿隧式電晶體。The present invention relates to tunneling transistors comprising a source/drain region using a carbon-based etch stop layer.
半導體裝置為電子組件，其係使用半導體材料(諸如矽(Si)、鍺(Ge)、及砷化鎵(GaAS))之電子性質。場效電晶體(FET)為一種半導體裝置，其包括三個終端：閘極、源極、和汲極。FET係使用由閘極所施加的電場以控制通道之導電性，電荷載子(例如，電子或電洞)係通過該通道而從源極流至汲極。於其中電荷載子為電子之例子中，FET被稱為n通道裝置；而於其中電荷載子為電洞之例子中，FET被稱為p通道裝置。某些FET具有稱為本體或基底之第四終端，其可被用以偏壓該電晶體。此外，金氧半導體FET(MOSFET)包括介於閘極與通道之間的閘極電介質層。 MOSFET亦可被已知(更一般地)為金屬絕緣體半導體FET(MISFET)或絕緣閘極FET(IGFET)。互補式MOS(CMOS)結構係使用p通道MOSFET(p-MOS)及n通道MOSFET(n-MOS)之組合以實施邏輯閘和其他數位電路。Semiconductor devices are electronic components that use the electronic properties of semiconductor materials such as germanium (Si), germanium (Ge), and gallium arsenide (GaAS). A field effect transistor (FET) is a semiconductor device that includes three terminals: a gate, a source, and a drain. The FET uses an electric field applied by a gate to control the conductivity of the channel through which charge carriers (eg, electrons or holes) flow from the source to the drain. In the example where the charge carriers are electrons, the FET is referred to as an n-channel device; and in the case where the charge carriers are holes, the FET is referred to as a p-channel device. Some FETs have a fourth terminal called a body or substrate that can be used to bias the transistor. In addition, the MOS MOSFET includes a gate dielectric layer between the gate and the channel. MOSFETs can also be known (more generally) as metal-insulator semiconductor FETs (MISFETs) or insulated gate FETs (IGFETs). Complementary MOS (CMOS) structures use a combination of p-channel MOSFETs (p-MOS) and n-channel MOSFETs (n-MOS) to implement logic gates and other digital circuits.
FinFET為建立於半導體材料之細帶(通常稱為鰭)周圍的MOSFET電晶體。FinFET裝置之導電通道係駐存在鄰近閘極電介質之鰭的外部分上。明確地，電流係運行沿著鰭之兩側壁(垂直於基底表面之側)/於鰭之兩側壁內以及沿著鰭之頂部(平行於基底表面之側)。因為此類組態之導電通道基本上駐存沿著鰭之三個不同的外、平坦區，所以此一FinFET設計有時被稱為三閘極電晶體。其他類型的FinFET組態亦為可得的，諸如所謂的雙閘極FinFET，其中導電通道主要地僅駐存沿著鰭之兩側壁(而非沿著鰭之頂部)。奈米線電晶體(有時稱為環繞式閘極(GAA)或奈米帶電晶體)被類似地組態成鰭為基的電晶體，但取代其中閘極位於三個部分上(且因此，有三個有效閘極)之鰭式通道區，一或更多奈米線被用於通道區且閘極材料通常圍繞各奈米線。A FinFET is a MOSFET transistor built around a thin strip of semiconductor material, commonly referred to as a fin. The conductive path of the FinFET device resides on the outer portion of the fin adjacent the gate dielectric. Specifically, the current system runs along both sidewalls of the fin (perpendicular to the side of the substrate surface)/in both sidewalls of the fin and along the top of the fin (parallel to the side of the substrate surface). Because such configured conductive channels reside substantially along three different outer, flat regions of the fin, this FinFET design is sometimes referred to as a three-gate transistor. Other types of FinFET configurations are also available, such as the so-called double gate FinFETs, in which the conductive vias primarily reside only along the two sidewalls of the fin (rather than along the top of the fin). A nanowire transistor (sometimes referred to as a wraparound gate (GAA) or nanocharged crystal) is similarly configured as a fin-based transistor, but instead the gate is located on three portions (and, therefore, There are three effective gates in the fin channel region, one or more nanowires are used for the channel region and the gate material typically surrounds each nanowire.
200‧‧‧基底200‧‧‧Base
202‧‧‧鰭202‧‧‧Fins
203，204‧‧‧部分Section 203, 204‧‧‧
206‧‧‧通道區206‧‧‧Channel area
208‧‧‧奈米線通道區208‧‧•Nami line passage area
210‧‧‧硬遮罩210‧‧‧hard mask
215‧‧‧溝槽215‧‧‧ trench
220‧‧‧淺溝槽隔離(STI)層220‧‧‧Shallow Trench Isolation (STI) Layer
230‧‧‧垂直隔離結構230‧‧‧Vertical isolation structure
242‧‧‧虛擬閘極電介質242‧‧‧Virtual Gate Dielectric
244‧‧‧虛擬閘極電極244‧‧‧Virtual Gate Electrode
250‧‧‧側壁間隔物250‧‧‧ sidewall spacers
261，261’‧‧‧源極區261,261’‧‧‧ source area
262，262’‧‧‧源極區第一層262, 262’ ‧ ‧ the first floor of the source area
264，264’‧‧‧源極區第二層264, 264’ ‧ ‧ second floor of the source area
265，265’‧‧‧汲極區265,265’‧‧‧ bungee area
266‧‧‧碳基蝕刻停止層266‧‧‧Carbon-based etch stop layer
270‧‧‧層間電介質(ILD)層270‧‧‧Interlayer dielectric (ILD) layer
282‧‧‧閘極電介質層282‧‧‧gate dielectric layer
284‧‧‧閘極284‧‧‧ gate
290‧‧‧接觸溝槽290‧‧‧Contact groove
292‧‧‧S/D接點292‧‧‧S/D contacts
400‧‧‧關狀態400‧‧‧Off state
401‧‧‧開狀態401‧‧‧ open state
406‧‧‧通道區406‧‧‧Channel area
461‧‧‧源極區461‧‧‧ source area
462‧‧‧源極區第一層462‧‧‧The first floor of the source area
464‧‧‧源極區第二層464‧‧‧Second floor of the source area
465‧‧‧汲極區465‧‧‧Bungee Area
466‧‧‧碳基蝕刻停止層466‧‧‧Carbon-based etch stop layer
492‧‧‧S/D接點492‧‧‧S/D contacts
500‧‧‧關狀態500‧‧‧Off state
501‧‧‧開狀態501‧‧‧ open state
506‧‧‧通道區506‧‧‧Channel area
561‧‧‧源極區561‧‧‧ source area
562‧‧‧源極區第一層562‧‧‧The first floor of the source area
564‧‧‧源極區第二層564‧‧‧Second floor of the source area
565‧‧‧汲極區565‧‧ ‧ bungee area
566‧‧‧碳基蝕刻停止層566‧‧‧Carbon-based etch stop layer
592‧‧‧S/D接點592‧‧‧S/D contacts
1000‧‧‧計算系統1000‧‧‧Computation System
1002‧‧‧主機板1002‧‧‧ motherboard
1004‧‧‧處理器1004‧‧‧ processor
1006‧‧‧通訊晶片1006‧‧‧Communication chip
圖1闡明一種形成積體電路(IC)之方法，該積體電路(IC)包括包含使用碳基蝕刻停止層的源極/汲極(S/D)區之至少一穿隧式電晶體，依據本發明之一些實施例。1 illustrates a method of forming an integrated circuit (IC) including at least one tunneling transistor including a source/drain (S/D) region using a carbon-based etch stop layer, According to some embodiments of the invention.
圖2A-I闡明當執行圖1之方法時所形成的範例積體電路結構，依據各個實施例。2A-I illustrate an exemplary integrated circuit structure formed when the method of FIG. 1 is performed, in accordance with various embodiments.
圖2D’闡明圖2D之範例結構，包括垂直隔離結構，依據一實施例。Figure 2D' illustrates the example structure of Figure 2D, including a vertical isolation structure, in accordance with an embodiment.
圖2I’闡明圖2I之範例結構，包括圖2D'之垂直隔離結構，依據一實施例。Figure 2I' illustrates the example structure of Figure 2I, including the vertical isolation structure of Figure 2D', in accordance with an embodiment.
圖3闡明沿著圖2I之IC結構的一鰭所取(明確地係沿著A-A平面所取)之範例橫斷面視圖，依據本發明之一些實施例。3 illustrates an example cross-sectional view taken along a fin of the IC structure of FIG. 2I (definitely taken along the A-A plane), in accordance with some embodiments of the present invention.
圖3’闡明圖3之IC結構，包括陰影及圖案化以協助視覺化該材料和該些S/D區之摻雜方案，依據本發明之一些實施例。Figure 3' illustrates the IC structure of Figure 3, including shading and patterning to aid in visualizing the material and the doping scheme of the S/D regions, in accordance with some embodiments of the present invention.
圖4及5個別地闡明範例p型及n型費米過濾器(Fermi filter)場效電晶體(FFFET)能帶圖，針對包括使用不同半導體材料之S/D區的FFFET裝置，依據某些實施例。Figures 4 and 5 individually illustrate exemplary p-type and n-type Fermi filter field effect transistor (FFFET) band diagrams for FFFET devices including S/D regions using different semiconductor materials, depending on certain Example.
圖6闡明一種以積體電路結構及/或電晶體裝置所實施的計算系統，該些結構或裝置係使用文中所揭露之技術來形成，依據本發明之一些實施例。Figure 6 illustrates a computing system implemented in an integrated circuit structure and/or an optoelectronic device that is formed using the techniques disclosed herein, in accordance with some embodiments of the present invention.
本實施例之這些或其他特徵將藉由閱讀以下詳細描述(配合文中所述之圖形)而被更佳地瞭解。於圖形中，於各個圖形中所顯示之各相同或幾乎相同的組件可由類似的數字代表。為了簡潔之目的，並非每一組件可被標示於每一圖形中。再者，如所將理解者，圖形不一定依比例而繪製或用來限制所描述的實施例於所顯示的特定組態。例如，雖然某些圖形一般性地指示直線、直角、及平滑表面，但有鑒於真實世界對製造程序之限制，本技術之實際實施方 式可具有較不完美的直線及直角，且某些特徵可具有表面形貌或者另為非平滑的、給定的真實世界限制。再者，圖形中之某些特徵可包括圖案化的或陰影的填充，其被主要地提供以協助視覺上區別該些不同特徵。簡言之，圖形僅被提供以顯示範例結構。These and other features of this embodiment will be better understood by reading the following detailed description (in conjunction with the figures described herein). In the figures, identical or nearly identical components shown in the various figures may be represented by similar numbers. For the sake of brevity, not every component can be labeled in every figure. Further, as will be understood, the figures are not necessarily drawn to scale or are used to limit the particular embodiments shown. For example, while certain graphics generally indicate straight lines, right angles, and smooth surfaces, in view of the real world limitations on manufacturing procedures, practical implementations of the present technology may have less perfect straight and right angles, and certain features may be A given real world limit with a surface topography or otherwise non-smooth. Moreover, certain features in the graphics may include patterned or shaded fills that are primarily provided to assist in visually distinguishing the different features. In short, graphics are only provided to show the example structure.
不同的電晶體類型係使用不同的源極/汲極(S/D)摻雜方案(doping scheme)，如半導體技術領域中所已知者。例如，金氧半導體場效電晶體(MOSFET)可使用p-n-p或n-p-n之源極-通道-汲極區摻雜方案，其中「p」代表針對既定半導體材料之適當的p型摻雜而「n」代表針對既定半導體材料之適當的n型摻雜。因此，此類MOSFET係使用類似類型的摻雜於一此類裝置之該些S/D區的兩者中。然而，其他電晶體類型係使用其包括相對於該電晶體之汲極區具有不同類型摻雜的源極區之摻雜方案。例如，穿隧場效電晶體(TFET)通常包括類似結構如MOSFET(因為TFET亦包括源極、通道、和汲極區)，除了其TFET可使用p-i-n或n-i-p之源極-通道-汲極區摻雜方案，其中i代表本質或額定未摻雜的半導體材料(例如，其中額定未摻雜包括少於每立方公分1E16、1E17、或1E18原子的雜質摻雜物濃度)。因此，此類TFET係使用不同類型的摻雜於一此類裝置之該些S/D區中。此外，費米過濾器FET(FFFET)，其亦被稱為隧道-源極MOSFET，通常包括類似結構如MOSFET(因 為FFFET亦包括源極、通道、和汲極區)，除了其FFFET包括相反類型摻雜之雙層源極區，以致其FFFET可使用np-i-p(或np-n-p)或pn-i-n(或pn-p-n)之源極-通道-汲極區摻雜方案。針對其包括使用不同摻雜物類型之源極和汲極區(例如，相反於其通常僅包括相同摻雜物類型之MOSFET的S/D區)及/或使用穿隧機制的TFET、FFFET、及其他電晶體類型，可能希望相對於單一半導體材料設計改變該S/D材料組態以增進電晶體性能。此外，當形成S/D接觸溝槽以接觸S/D區時，可能想要有一用以停止接觸溝槽蝕刻之可控制點來防止該接觸溝槽蝕刻移除該些S/D區之材料。Different transistor types use different source/drain (S/D) doping schemes, as is known in the semiconductor technology art. For example, a MOS field effect transistor (MOSFET) can use a source-channel-drain region doping scheme of pnp or npn, where "p" represents the appropriate p-type doping for a given semiconductor material and "n" Represents appropriate n-type doping for a given semiconductor material. Thus, such MOSFETs use a similar type of doping in both of these S/D regions of such a device. However, other transistor types use a doping scheme that includes source regions with different types of doping relative to the drain regions of the transistor. For example, a tunneling effect transistor (TFET) typically includes a similar structure such as a MOSFET (since the TFET also includes the source, channel, and drain regions), except that its TFET can use the source-channel-drain region of the pin or nip. A doping scheme, where i represents an intrinsic or nominally undoped semiconductor material (eg, wherein the nominal undoped includes an impurity dopant concentration of less than 1E16, 1E17, or 1E18 atoms per cubic centimeter). Therefore, such TFETs use different types of doping in the S/D regions of such a device. In addition, Fermi filter FETs (FFFETs), also known as tunnel-source MOSFETs, typically include similar structures such as MOSFETs (because FFFETs also include source, channel, and drain regions), except that their FFFETs include the opposite type. The doped double source region is such that its FFFET can use a source-channel-drain region doping scheme of np-ip (or np-np) or pn-in (or pn-pn). For its use, including source and drain regions using different dopant types (eg, opposite to the S/D regions of MOSFETs that typically only include the same dopant type) and/or TFETs, FFFETs using tunneling mechanisms, As with other transistor types, it may be desirable to change the S/D material configuration relative to a single semiconductor material design to enhance transistor performance. In addition, when an S/D contact trench is formed to contact the S/D region, it may be desirable to have a controllable point to stop the contact trench etch to prevent the contact trench from etching away the material of the S/D regions. .
因此，以及依據本發明之一或更多實施例，提供技術以形成包括使用碳基蝕刻停止層之S/D區的穿隧式電晶體。於某些實施例中，碳基蝕刻停止層可被形成於該些S/D區之一者或兩者上，以協助防止S/D接觸溝槽蝕刻處理不當地從該些S/D區之任一者或兩者移除材料。如根據本說明書可理解：在蝕刻停止層中之碳的存在係容許該層更強韌/能抵抗蝕刻處理，該蝕刻處理係用以形成文中所述之穿隧式電晶體的S/D接觸溝槽。因此，使用文中所述之碳基蝕刻停止層可提供受控制的且可重複的位置，以供停止S/D接觸蝕刻處理，當製造穿隧式電晶體裝置時。於某些實施例中，碳基蝕刻停止層可包括半導體材料(例如，Si)，其不會除此以外包括與碳合金的碳，以致其碳合金的半導體材料(例如，Si：C)包括單晶材料之總原子百分比的百分之1至80的範圍中之碳濃度。於某些實施例中， 碳基蝕刻停止層可被形成以具有1至20nm之範圍中(例如，1至10nm之範圍中)的厚度，或具有某其他適當的厚度，如根據此說明書所將清楚明白者。Thus, and in accordance with one or more embodiments of the present invention, techniques are provided to form a tunneling transistor comprising an S/D region using a carbon-based etch stop layer. In some embodiments, a carbon-based etch stop layer can be formed on one or both of the S/D regions to help prevent S/D contact trench etch processing from being improperly from the S/D regions. Remove material from either or both. As can be understood from the present description, the presence of carbon in the etch stop layer allows the layer to be stronger/resistance to the etching process used to form the S/D contact of the tunneling transistor described herein. Groove. Thus, the use of the carbon-based etch stop layer described herein provides a controlled and repeatable position for stopping the S/D contact etch process when fabricating a tunneling transistor device. In some embodiments, the carbon-based etch stop layer can include a semiconductor material (eg, Si) that does not include carbon with the carbon alloy, such that its carbon alloy semiconductor material (eg, Si:C) includes The carbon concentration in the range of 1 to 80 percent of the total atomic percentage of the single crystal material. In certain embodiments, the carbon-based etch stop layer can be formed to have a thickness in the range of 1 to 20 nm (eg, in the range of 1 to 10 nm), or have some other suitable thickness, as will be in accordance with this specification. Clear and understandable.
如根據本說明書可理解：TFET及FFFET為兩種類型的穿隧式電晶體裝置，其具有比p-n-p及n-p-n MOSFET裝置更陡的電流開啟(例如，相對於閘極電壓)，由於基礎切換機制為相對不同的。例如，此類MOSFET裝置通常係藉由調變在載子上方之熱離子放射來切換，而TFET及FFFET裝置係藉由調變通過載子之量子穿隧來切換。因此，於某些實施例中，經由材料帶隙工程，文中所述之技術係提升此類相對較陡的開電流裝置(例如，TFET及FFFET)之能力以抵抗從源極至汲極(通過通道)及從源極至接地/基底的關狀態漏電流。材料帶隙工程可結合材料為基的帶補償組件以控制關狀態漏電。此一帶補償可延伸於其使用單組成材料組態所可達成之有限的帶補償上，因為以此類單組成材料組態，高於臨限摻雜濃度時，則針對固定尺寸之既定源極至汲極電壓沒有漏電流之額外減少。例如，於矽(Si)材料組態之情況下(例如，其中S/D區兩者均僅包括Si及適當的摻雜物)，藉由以矽鍺(SiGe)或鍺(Ge)取代該些S/D區之一中的Si材料，則導通帶之能量可被減少，藉此增加其電荷載子(例如，電子)必須克服以跨過至通道區的障壁高度(例如，於TFET及FFFET裝置中)。As can be understood from this specification, TFETs and FFFETs are two types of tunneling transistor devices that have steeper current turn-on (eg, relative to gate voltage) than pnp and npn MOSFET devices, since the underlying switching mechanism is Relatively different. For example, such MOSFET devices are typically switched by modulating thermionic radiation above the carrier, while TFET and FFFET devices are switched by quantum tunneling of the carrier by modulation. Thus, in some embodiments, the techniques described herein enhance the ability of such relatively steep on-current devices (eg, TFETs and FFFETs) to resist from the source to the drain (via the material bandgap engineering). Channel) and leakage current from the source to the ground/substrate off state. Material bandgap engineering can be combined with material-based compensation components to control off-state leakage. This band compensation can be extended to the limited band compensation that can be achieved with a single component material configuration, because it is configured with such a single component material, above the threshold doping concentration, for a given source of fixed size There is no additional reduction in leakage current to the drain voltage. For example, in the case of a germanium (Si) material configuration (eg, where the S/D regions both include only Si and appropriate dopants), replace it with germanium (SiGe) or germanium (Ge) The Si material in one of the S/D regions, the energy of the conduction band can be reduced, thereby increasing the height of the barrier that the charge carriers (eg, electrons) must overcome to cross the channel region (eg, in TFETs and In the FFFET device).
如根據此說明書所將清楚明白者，該些技術可被實施於S/D區，包括IV族半導體材料、III-V族半導體材料、及/ 或任何其他適當的半導體材料。「IV族半導體材料」(或「IV族材料」或通常「IV」)於此之使用包括至少一IV族元素(例如，矽、鍺、碳、錫)，諸如Si、Ge、SiGe，等等。「III-V族半導體材料」(或「III-V族材料」或通常「III-V」)於此之使用包括至少一III族元素(例如，鋁、鎵、銦)及至少一V族元素(例如，氮、磷、砷、銻)，諸如砷化鎵(GaAs)、砷化銦鎵(InGaAs)、磷化鎵(GaP)、銻化鎵(GaSb)、及磷化銦(InP)，等等。於某些實施例中，S/D區可使用不同材料以達成所欲的帶隙工程。於某些此類實施例中，帶隙材料工程可被履行於該些裝置之僅源極側。無論如何，於某些實施例中，S/D區可包括彼此間不同的材料，其中源極區將包括其不同於汲極區中所包括之材料的材料。注意：針對電晶體之S/D區的文中所述之材料中的差異係參考S/D區中所包括之大塊半導體材料而非針對其加至大塊半導體材料之雜質摻雜物。例如，包括p-i-n或n-i-p摻雜方案之TFET裝置包括介於源極和汲極區之間的不同雜質摻雜物類型(例如，一者為n型摻雜的而另一者為p型摻雜的)；然而，於此一TFET裝置中之S/D區的大塊半導體材料是相同的。例如，TFET裝置可使用S/D區之兩者中的Si之大塊半導體材料來形成，其中該些S/D區之一被摻雜以適當的n型摻雜物(例如，磷)而另一S/D區被摻雜以適當的p型摻雜物(例如，硼)。As will be apparent from this description, the techniques can be implemented in an S/D region, including a Group IV semiconductor material, a III-V semiconductor material, and/or any other suitable semiconductor material. The "Group IV semiconductor material" (or "Group IV material" or generally "IV") used herein includes at least one Group IV element (eg, lanthanum, cerium, carbon, tin), such as Si, Ge, SiGe, etc. . "III-V semiconductor material" (or "III-V material" or usually "III-V") includes at least one group III element (eg, aluminum, gallium, indium) and at least one group V element. (eg, nitrogen, phosphorus, arsenic, antimony), such as gallium arsenide (GaAs), indium gallium arsenide (InGaAs), gallium phosphide (GaP), gallium antimonide (GaSb), and indium phosphide (InP), and many more. In some embodiments, different materials may be used in the S/D region to achieve the desired bandgap engineering. In some such embodiments, bandgap material engineering can be performed on only the source side of the devices. Regardless, in some embodiments, the S/D regions can include materials that are different from each other, wherein the source regions will include materials that are different from the materials included in the drain regions. Note that the differences in the materials described herein for the S/D regions of the transistor refer to the bulk semiconductor material included in the S/D region rather than the impurity dopants that are added to the bulk semiconductor material. For example, a TFET device including a pin or nip doping scheme includes different impurity dopant types between the source and drain regions (eg, one is n-doped and the other is p-doped). However, the bulk semiconductor material of the S/D region in this TFET device is the same. For example, a TFET device can be formed using a bulk semiconductor material of Si in both of the S/D regions, wherein one of the S/D regions is doped with a suitable n-type dopant (eg, phosphorous) Another S/D region is doped with a suitable p-type dopant (eg, boron).
為了協助闡明文中所述之技術的優點，於一範例FFFET裝置中，源極至汲極材料和摻雜方案可包括n型摻 雜的Si接著p型摻雜的SiGe於源極區中、本質Si於通道區中、及p型摻雜的Si於汲極區中，依據使用p型FFFET裝置之一實施例。於此一範例實施例中，可根據本說明書瞭解：藉由使用p型摻雜的SiGe於此一異質接面源極堆疊，相對於p型摻雜的Si(其中將為同質接面源極堆疊)，該p型摻雜的源極堆疊層之價帶邊緣(Ev)是相對較高的，藉此增加帶補償以協助減少關狀態漏電。於另一範例FFFET裝置中，明確地針對使用n型FFFET裝置之實施例，源極至汲極材料和摻雜方案可包括p型摻雜的GaAs接著n型摻雜的InGaAs於源極區中、本質GaAs於通道區中、及n型摻雜的GaAs於汲極區中，舉例而言。於此一範例實施例中，可根據本說明書瞭解：藉由使用n型摻雜的InGaAs於此一異質接面源極堆疊，相對於n型摻雜的GaAs(其中將為同質接面源極堆疊)，該n型摻雜的源極層之導通帶邊緣(Ec)是相對較低的，藉此增加帶補償以協助減少關狀態漏電。各種材料及摻雜方案組態將根據此說明書而清楚明白。To assist in clarifying the advantages of the techniques described herein, in an exemplary FFFET device, the source-to-drain material and doping scheme can include n-doped Si followed by p-doped SiGe in the source region, essentially Si is in the channel region, and p-doped Si is in the drain region, depending on an embodiment using a p-type FFFET device. In this exemplary embodiment, it can be understood from the description that: by using p-doped SiGe on a heterojunction source stack, relative to p-doped Si (which will be a homojunction source) Stacking), the valence band edge (Ev) of the p-doped source stack layer is relatively high, thereby increasing band compensation to assist in reducing off-state leakage. In another example FFFET device, specifically for embodiments using an n-type FFFET device, the source to drain material and doping scheme may include p-doped GaAs followed by n-doped InGaAs in the source region Intrinsic GaAs is in the channel region, and n-doped GaAs is in the drain region, for example. In this exemplary embodiment, it can be understood from the description that: by using n-doped InGaAs on a heterojunction source stack, relative to n-doped GaAs (which will be a homojunction source) Stacking), the conduction band edge (Ec) of the n-doped source layer is relatively low, thereby increasing band compensation to assist in reducing off-state leakage. Various materials and doping scheme configurations will be apparent from this description.
因此，於某些實施例中，碳基蝕刻停止層(文中亦簡稱為蝕刻停止層)可被用以有益於其包括使用不同/相異半導體材料的S/D區之穿隧式電晶體裝置。於某些此類實施例中，當S/D接觸溝槽處理被同時地履行於該些S/D區之兩者時，則碳基蝕刻停止層可協助防止接觸溝槽蝕刻到達並移除S/D材料，特別由於該S/D材料可被移除以不同的速率，在當相對不同的/相異的材料被使用於該些S/D區中時。然而，於某些實施例中，使用文中所述之技術所形成 的穿隧式電晶體無須包括相異的半導體材料於S/D區之間(亦即，S/D區包括類似或相同的半導體材料)。例如，於TFET裝置之情況下，碳基蝕刻停止層可被用以助於該些S/D區之至少一者，其中S/D區兩者均包括相同的半導體材料但被摻雜以相反的方式(例如，該些S/D區之一為n型摻雜的而其另一為p型摻雜的)，依據某些實施例。再者，於FFFET裝置之情況下，碳基蝕刻停止層可被用以助於該些S/D區之至少一者，其中S/D區兩者均包括相同的半導體材料但摻雜方案包括pn-i-n(或pn-p-n)或np-i-p(或np-n-p)，由於那些裝置中之源極區的雙層結構，依據某些實施例。於此類實施例中，可根據本說明書瞭解：源極區將包括同質接面組態，相對於異質接面架構。於某些實施例中，S/D區可包括相對不同的高度，以致其接觸溝槽處理可到達該些S/D之一者。於某些此類實施例中，碳基蝕刻停止層可藉由以下方式以補償該問題：防止接觸溝槽蝕刻繼續(一旦該蝕刻到達蝕刻停止層時)，容許接觸溝槽蝕刻到達另一、較短的S/D區，舉例而言。因此，如文中所述之碳基蝕刻停止層可有益於多數電晶體裝置，如根據此說明書所將清楚明白者。Thus, in some embodiments, a carbon-based etch stop layer (also referred to herein as an etch stop layer) can be used to benefit a tunneling transistor device that includes S/D regions using different/different semiconductor materials. . In some such embodiments, the carbon-based etch stop layer can assist in preventing contact trench etch from reaching and removing when S/D contact trench processing is simultaneously performed on both of the S/D regions. The S/D material, particularly since the S/D material can be removed at different rates, when relatively different/different materials are used in the S/D regions. However, in some embodiments, the tunneling transistor formed using the techniques described herein need not include dissimilar semiconductor material between the S/D regions (ie, the S/D regions include similar or identical semiconductors). For example, in the case of a TFET device, a carbon-based etch stop layer can be used to facilitate at least one of the S/D regions, wherein the S/D regions both comprise the same semiconductor material but are doped to the opposite The manner (eg, one of the S/D regions is n-doped and the other is p-doped), in accordance with certain embodiments. Furthermore, in the case of an FFFET device, a carbon-based etch stop layer can be used to facilitate at least one of the S/D regions, wherein both S/D regions comprise the same semiconductor material but the doping scheme includes Pn-in (or pn-pn) or np-ip (or np-np), due to the two-layer structure of the source regions in those devices, in accordance with certain embodiments. In such an embodiment, it will be understood from this description that the source region will include a homojunction configuration relative to a heterojunction architecture. In some embodiments, the S/D regions can include relatively different heights such that their contact trench processing can reach one of the S/Ds. In some such embodiments, the carbon-based etch stop layer can be compensated for by preventing the contact trench etch from continuing (once the etch reaches the etch stop layer), allowing the contact trench etch to reach the other, Shorter S/D area, for example. Thus, a carbon-based etch stop layer as described herein may be beneficial to most transistor devices, as will be apparent from this description.
文中所提供的技術及結構之使用可為使用以下工具可檢測的，諸如：電子顯微鏡，包括掃描/穿透式電子顯微鏡(SEM/TEM)、掃描穿透式電子顯微鏡(STEM)、奈米光束電子繞射(NBD或NBED)、及反射電子顯微鏡(REM)；組成映射；x射線結晶或繞射(XRD)；能量色散x射線光譜儀 (EDS)；二次離子質譜法(SIMS)；飛行時間SIMS(ToF-SIMS)；原子探針成像或斷層掃描；局部電極原子探針(LEAP)技術；3D斷層掃描；或高解析度物理或化學分析，僅舉出一些適當的範例分析工具。特別地，於某些實施例中，此類工具可指示一包括穿隧式電晶體之積體電路(IC)，該穿隧式電晶體包括使用碳基蝕刻停止層之至少一S/D區，如文中各處所述者。例如，於某些此類實施例中，碳可存在於S/D區與相應接點之間的介面上，無論其存在為該介面上之獨特層；或者為其已溶解入該S/D區、該接點、或兩特徵中之碳成分。因此，於某些此類實施例中，碳基層無法餘留為最終電晶體裝置之獨特層，由於可能在其形成之後所發生的處理。因此，於某些此類實施例中，文中所提供之技術可根據介於S/D區與其相應接點間之介面上或附近的碳之存在而被檢測。例如，碳可變為介金屬之部分(其中接觸區之電阻降低金屬與來自蝕刻停止層和S/D區之半導體材料反應)，以碳之一部分潛在地餘留在半導體S/D區中。於某些此類情況下，溶解的碳可存在於1至20百分比中，舉例而言。於某些此類實施例中，碳將不會除此以外存在於S/D接觸介面上或其附近，如根據本說明書可理解者。The techniques and structures provided herein can be detected using tools such as electron microscopy, including scanning/transmission electron microscopy (SEM/TEM), scanning transmission electron microscopy (STEM), and nanobeams. Electronic diffraction (NBD or NBED), and reflection electron microscopy (REM); composition mapping; x-ray crystallization or diffraction (XRD); energy dispersive x-ray spectroscopy (EDS); secondary ion mass spectrometry (SIMS); flight time SIMS (ToF-SIMS); atomic probe imaging or tomography; local electrode atom probe (LEAP) technique; 3D tomography; or high-resolution physical or chemical analysis, just to name a few examples of analytical tools. In particular, in some embodiments, such a tool can indicate an integrated circuit (IC) including a tunneling transistor that includes at least one S/D region using a carbon-based etch stop layer As described throughout the text. For example, in some such embodiments, carbon may be present at the interface between the S/D region and the corresponding junction, whether present as a unique layer on the interface; or it may have dissolved into the S/D The carbon component of the zone, the junction, or both features. Thus, in certain such embodiments, the carbon-based layer cannot remain as a unique layer of the final transistor device due to processing that may occur after its formation. Thus, in some such embodiments, the techniques provided herein can be detected based on the presence of carbon between or adjacent the interface between the S/D region and its respective contact. For example, carbon can be changed to a portion of a metal (wherein the resistance of the contact region reduces the metal to react with the semiconductor material from the etch stop layer and the S/D region), potentially remaining in the semiconductor S/D region as a portion of the carbon. In some such cases, dissolved carbon may be present in the range of 1 to 20 percent, for example. In some such embodiments, carbon will not otherwise be present on or near the S/D contact interface, as will be understood in light of this disclosure.
再者，記得：於某些實施例中，S/D區可使用不同的半導體材料。例如，於TFET裝置之情況下，p/n型摻雜的源極區可包括第一半導體材料(例如，Si或GaAs)而n/p型摻雜的汲極區可包括不同於該第一半導體材料的第二半導體 材料(例如，SiGe或InGaAs)。再者，於某些實施例中，源極區可包括雙層結構，其包括第一層和第二層，其中該些層之一為p型摻雜的而另一為n型摻雜的。於某些此類實施例中，第一和第二層可包括不同的半導體材料。於任何此類實施例中，如文中所述之材料工程(包括使用相異的半導體材料於源極和汲極區之間)可使用可獲得的不同帶隙及帶補償以減少其使用量子穿隧及/或帶至帶穿隧(BTBT)的電晶體裝置(例如，TFET或FFFET)之關狀態的漏電流。因此，該些技術可透過橫斷面及材料/化學分析而被檢測。於某些實施例中，文中所述之該些技術及結構可根據從其取得的利益而被檢測，諸如其可使用碳基蝕刻停止層而被獲得之S/D接觸溝槽位置(及因此，S/D接點位置)的可重複性/準確度及/或其可使用相對不同的半導體材料於S/D區中而被獲得之相對減少的關狀態漏電。各種組態及變異將根據此說明書而清楚明白。Again, it is recalled that in certain embodiments, different semiconductor materials may be used for the S/D regions. For example, in the case of a TFET device, the p/n type doped source region may include a first semiconductor material (eg, Si or GaAs) and the n/p type doped drain region may include a different first A second semiconductor material of semiconductor material (eg, SiGe or InGaAs). Furthermore, in some embodiments, the source region can comprise a two-layer structure comprising a first layer and a second layer, wherein one of the layers is p-doped and the other is n-doped . In some such embodiments, the first and second layers can comprise different semiconductor materials. In any such embodiment, material engineering as described herein (including the use of dissimilar semiconductor materials between the source and drain regions) may utilize different band gaps and band compensations available to reduce their use of quantum wear. Leakage currents in the off state of tunneling and/or to a transistor device with tunneling (BTBT), such as a TFET or FFFET. Therefore, these techniques can be detected through cross-section and material/chemical analysis. In some embodiments, the techniques and structures described herein can be detected based on benefits derived therefrom, such as S/D contact trench locations that can be obtained using a carbon-based etch stop layer (and thus The repeatability/accuracy of the S/D contact location and/or its relatively reduced off-state leakage that can be obtained using relatively different semiconductor materials in the S/D region. Various configurations and variations will be apparent from this description.
架構及方法Architecture and method
圖1闡明一種形成積體電路(IC)之方法100，該積體電路(IC)包括包含使用碳基蝕刻停止層的源極/汲極(S/D)區之至少一穿隧式電晶體，依據本發明之一些實施例。於某些實施例中，方法100亦可被用以形成該穿隧式電晶體裝置為包括使用相對不同的半導體材料之S/D區，以致其該源極區包括第一半導體材料而該汲極區包括不同於該第一半導體材料之第二半導體材料，舉例而言。單一電晶體之 S/D區中包括不同的材料係提供利益(如根據本說明書可理解者)，諸如減少以源極至汲極漏電(通過通道)及源極至接地/基底漏電之形式的關狀態漏電；然而，本發明不應被如此限制。圖2A-I闡明當執行圖1之方法100時所形成的範例積體電路結構，依據本發明之一些實施例。圖1之方法100包括主要垂直流程，其係闡明閘極最後電晶體製造程序流程，依據某些實施例。然而，於其他實施例中，閘極最先程序流程可被使用，如將被描述於文中者(且其被闡明以圖1中之替換閘極最先流程100’指示符)。圖2A-I之結構被主要地以形成具有鰭式組態(例如，FinFET或三閘極)之費米過濾器場效電晶體(FFFET)的背景下描繪及描述於文中，以利簡化說明及描述。然而，該些技術可被用以形成任何適當類型及任何適當幾何或組態的電晶體，如根據本說明書可理解者。例如，圖2G闡明一範例積體電路結構，其包括具有奈米線組態之電晶體，如以下將被更詳細地描述者。此外，針對用以形成穿隧FET(TFET)裝置之技術的變化被描述於文中且主要係有關於S/D處理(方法100之方盒114)。1 illustrates a method 100 of forming an integrated circuit (IC) including at least one tunneling transistor including a source/drain (S/D) region using a carbon-based etch stop layer According to some embodiments of the invention. In some embodiments, the method 100 can also be used to form the tunneling transistor device to include using a relatively different semiconductor material S/D region such that the source region includes the first semiconductor material and the germanium The polar region includes a second semiconductor material that is different from the first semiconductor material, for example. The inclusion of different materials in the S/D region of a single transistor provides benefits (as understood in accordance with the present specification), such as reducing source-to-drain leakage (through the channel) and source-to-ground/substrate leakage. The off state leakage; however, the invention should not be so limited. 2A-I illustrate an exemplary integrated circuit structure formed when the method 100 of FIG. 1 is performed, in accordance with some embodiments of the present invention. The method 100 of FIG. 1 includes a primary vertical flow that clarifies the gate final transistor fabrication process flow, in accordance with certain embodiments. However, in other embodiments, the gate first program flow can be used as will be described herein (and it is illustrated with the replacement gate first flow 100' indicator in Figure 1). The structure of Figures 2A-I is depicted and described primarily in the context of forming a Fermi filter field effect transistor (FFFET) having a fin configuration (e.g., FinFET or triple gate) for ease of illustration. And description. However, such techniques can be used to form any suitable type and any suitable geometry or configuration of transistors, as will be understood in light of this disclosure. For example, Figure 2G illustrates an exemplary integrated circuit structure including a transistor having a nanowire configuration, as will be described in more detail below. Moreover, variations to the techniques used to form tunneling FET (TFET) devices are described herein and are primarily related to S/D processing (square box 114 of method 100).
因此，文中所述之技術可有助於各種不同的電晶體類型，諸如多數場效電晶體(FET)(例如，TFET、FFFET)、以及藉由調變通過障壁之量子穿隧而操作的任何其他電晶體，舉例而言。其他適當的電晶體類型可受益自文中所述之技術，其中不同的材料被形成於源極和汲極區中。再者，可受益自文中所述之技術的各種範例電晶體組態包括 (但不限定於)平面、鰭式(例如，FinFET、三閘極、雙閘極)、及奈米線(或奈米帶或環繞式閘極)。又再者，該些技術可被用以有益於p型裝置(例如，p型FFFET和p型TFET)及/或n型裝置(例如，n型FFFET和n型TFET)。另再者，該些技術可被用以形成互補式MOS(CMOS)裝置/電路，其中所包括的p型和n型電晶體之任一者或兩者係使用文中所述之技術來形成，以致其所包括的p型和n型電晶體之任一者或兩者係包括具有相異材料之S/D區。其他的範例電晶體裝置可包括少數至單一電子量子電晶體裝置，且裝置可使用其為三維晶體以及二維晶體或奈米管之半導體材料，舉例而言。於某些實施例中，該些技術可被用以有益於各種尺度之裝置，諸如具有微米(微米)範圍及/或奈米(nm)範圍之關鍵尺寸的IC裝置(例如，形成於22、14、10、7、5、或3nm程序節點上，或超過)。Thus, the techniques described herein can facilitate a variety of different transistor types, such as most field effect transistors (FETs) (eg, TFETs, FFFETs), and any that operate by modulating quantum tunneling through a barrier. Other transistors, for example. Other suitable transistor types may benefit from the techniques described herein in which different materials are formed in the source and drain regions. Furthermore, various example transistor configurations that can benefit from the techniques described herein include, but are not limited to, planar, fin (eg, FinFET, triple gate, double gate), and nanowire (or Nai) Rice band or wraparound gate). Again, these techniques can be used to benefit p-type devices (eg, p-type FFFETs and p-type TFETs) and/or n-type devices (eg, n-type FFFETs and n-type TFETs). Still further, the techniques can be used to form complementary MOS (CMOS) devices/circuits in which either or both of the p-type and n-type transistors included are formed using the techniques described herein. Thus, either or both of the p-type and n-type transistors it comprises include S/D regions having dissimilar materials. Other example transistor devices may include a few to a single electronic quantum crystal device, and the device may use semiconductor materials that are three-dimensional crystals as well as two-dimensional crystals or nanotubes, for example. In some embodiments, the techniques can be used to benefit devices of various sizes, such as IC devices having critical dimensions in the micrometer (micrometer) range and/or nanometer (nm) range (eg, formed at 22, 14, 10, 7, 5, or 3 nm on the program node, or more than).
圖1之方法100包括圖案化102基底200上之硬遮罩210以形成圖2A中所示之範例所得結構，依據一實施例。硬遮罩210可使用任何適當的技術而被形成或沈積於基底200上，如根據此說明書所將清楚明白者。例如，硬遮罩210可被全面性沈積或者生長於基底200上，使用化學氣相沈積(CVD)、原子層沈積(ALD)、物理氣相沈積(PVD)、旋塗式處理及/或任何其他適當的程序以形成硬遮罩210於基底200上。於某些例子中，基底200之頂部表面(於其上將沈積硬遮罩210)可被處置(例如，化學處置、熱處置，等等)在硬遮罩210材料之沈積以前。硬遮罩210可使用任何適當 的技術而被圖案化102，諸如一或更多微影及蝕刻程序，舉例而言。硬遮罩210可包括任何適當的材料，諸如各種氧化物或氮化物材料，舉例而言。特定的氧化物及氮化物材料可包括氧化矽、氧化鈦、氧化鉿、氧化鋁、氮化矽、或氮化鈦，僅舉出一些例子。於某些情況下，硬遮罩210材料可根據基底200之材料而被選擇，舉例而言。The method 100 of FIG. 1 includes patterning the hard mask 210 on the substrate 200 to form the resulting structure shown in FIG. 2A, in accordance with an embodiment. The hard mask 210 can be formed or deposited on the substrate 200 using any suitable technique, as will be apparent from this description. For example, the hard mask 210 can be deposited or grown on the substrate 200 in a comprehensive manner using chemical vapor deposition (CVD), atomic layer deposition (ALD), physical vapor deposition (PVD), spin coating, and/or any Other suitable procedures are used to form the hard mask 210 on the substrate 200. In some examples, the top surface of substrate 200 (on which hard mask 210 will be deposited) can be disposed of (eg, chemically disposed, thermally disposed, etc.) prior to deposition of hard mask 210 material. The hard mask 210 can be patterned 102 using any suitable technique, such as one or more lithography and etching procedures, for example. Hard mask 210 can comprise any suitable material, such as various oxide or nitride materials, for example. Specific oxide and nitride materials may include cerium oxide, titanium oxide, cerium oxide, aluminum oxide, cerium nitride, or titanium nitride, to name a few. In some cases, the hard mask 210 material may be selected based on the material of the substrate 200, for example.
基底200(於某些實施例中)可包括：大塊基底，其包括IV族半導體材料，諸如矽(Si)、鍺(Ge)、或矽鍺(SiGe)；及/或至少一III-V族半導體材料及/或任何其他適當材料，如根據本說明書所將清楚明白者；絕緣體上X(XOI)結構，其中X為該些前述材料之一(例如，IV族及/或III-V族半導體材料)而絕緣體材料為氧化物材料或電介質材料或某其他電絕緣材料；或某其他適當的多層結構，其中頂部層包括該些前述材料之一(例如，IV族及/或III-V族材料)。記得：「IV族半導體材料」(或「IV族材料」或通常「IV」)於此之使用包括至少一IV族元素(例如，矽、鍺、碳、錫)，諸如Si、Ge、SiGe，等等。同時記得：「III-V族半導體材料」(或「III-V族材料」或通常「III-V」)於此之使用包括至少一III族元素(例如，鋁、鎵、銦)及至少一V族元素(例如，氮、磷、砷、銻)，諸如砷化鎵(GaAs)、砷化銦鎵(InGaAs)、磷化鎵(GaP)、銻化鎵(GaSb)、及磷化銦(InP)，等等。注意：III族亦可被已知為硼族或IUPAC族13，IV族亦可被已知為碳族或IUPAC族14，而V族亦可被已知為氮家族或IUPAC族15，舉例而 言。Substrate 200 (in certain embodiments) can include a bulk substrate comprising a Group IV semiconductor material, such as germanium (Si), germanium (Ge), or germanium (SiGe); and/or at least one III-V Group semiconductor materials and/or any other suitable materials, as will be apparent from this specification; X(XOI) structures on insulators, where X is one of the foregoing materials (eg, Group IV and/or III-V) The semiconductor material) and the insulator material is an oxide material or a dielectric material or some other electrically insulating material; or some other suitable multilayer structure in which the top layer comprises one of the foregoing materials (eg, Group IV and/or III-V) material). Remember: "Group IV semiconductor materials" (or "Group IV materials" or usually "IV") are used herein to include at least one Group IV element (eg, lanthanum, cerium, carbon, tin), such as Si, Ge, SiGe, and many more. Also remember that the "III-V semiconductor material" (or "III-V material" or usually "III-V") includes at least one group III element (eg, aluminum, gallium, indium) and at least one Group V elements (eg, nitrogen, phosphorus, arsenic, antimony) such as gallium arsenide (GaAs), indium gallium arsenide (InGaAs), gallium phosphide (GaP), gallium antimonide (GaSb), and indium phosphide ( InP), and so on. Note that Group III can also be known as Boron or IUPAC Group 13, Group IV can also be known as Carbon Group or IUPAC Group 14, and Group V can also be known as Nitrogen Family or IUPAC Group 15, for example Words.
於某些實施例中，基底200基底110可包括由{001}、{011}、或{111}之米勒指數平面所描述的結晶定向，如根據此說明書所將清楚明白者。雖然基底200(於此範例實施例中)被顯示為具有類似於其他層之厚度(在Z軸方向上之尺寸)以利說明；但於某些例子中，基底200可較其他層更厚得多，諸如具有50至950微米之範圍中的厚度，例如，或者如根據此說明書所將清楚明白的任何其他適當厚度。於某些實施例中，基底200可被用於一或更多其他IC裝置，諸如各種二極體(例如，發光二極體(LED)或雷射二極體)、各種電晶體(例如，MOSFET或TFET)、各種電容(例如，MOSCAP)、各種微電機系統(MEMS)、各種奈米電機系統(NEMS)、各種射頻(RF)裝置、各種感應器、或任何其他適當的半導體或IC裝置，根據終端使用或目標應用。因此，於某些實施例中，文中所述之結構可被包括於系統單晶片(SoC)應用中，如根據此說明書所將清楚明白者。In certain embodiments, substrate 200 substrate 110 can include a crystalline orientation as described by the Miller Index plane of {001}, {011}, or {111}, as will be apparent from this description. Although the substrate 200 (in this example embodiment) is shown to have thicknesses similar to those of other layers (dimensions in the Z-axis direction) for purposes of illustration; in some examples, the substrate 200 may be thicker than other layers. Many, such as having a thickness in the range of 50 to 950 microns, for example, or any other suitable thickness as will be apparent from this description. In some embodiments, substrate 200 can be used with one or more other IC devices, such as various diodes (eg, light emitting diodes (LEDs) or laser diodes), various transistors (eg, MOSFET or TFET), various capacitors (eg MOSCAP), various micro-electromechanical systems (MEMS), various nano-motor systems (NEMS), various radio frequency (RF) devices, various inductors, or any other suitable semiconductor or IC device According to the terminal use or target application. Thus, in some embodiments, the structures described herein can be included in a system single-chip (SoC) application, as will be apparent from this description.
圖1之方法100繼續履行104淺溝槽凹陷(STR)蝕刻以從基底200形成鰭202，藉此形成圖2B中所示之所得範例結構，依據一實施例。用以形成溝槽215及鰭202之STR蝕刻104可包括任何適當的技術，諸如各種遮蔽程序和濕式及/或乾式蝕刻程序，舉例而言。於某些情況下，STR蝕刻104可被履行在原處/無空斷；而於其他情況下，STR蝕刻104可被履行在域外，舉例而言。溝槽215可被形成以不同的寬度(於X軸方向上之尺寸)及深度(於Z軸方向上之尺 寸)，如根據本說明書可理解者。例如，多數硬遮罩圖案化102及STR蝕刻104程序可被履行以獲得不同的深度於鰭202之間的溝槽215中。鰭202可被形成以具有不同的寬度Fw(於X軸方向上之尺寸)及高度Fh(於Z軸方向上之尺寸)。例如，於高寬比設陷(ART)整合方案中，鰭可被形成以具有特定的高度與寬度比以致當其稍後被移除或凹陷時，所形成之所得溝槽係容許替換材料中之缺陷被沈積以終結於側表面上(隨著材料垂直地生長)，諸如非晶/電介質側壁，其中該些側壁相對於生長區域之大小是夠高的以便抑制大部分(假如非全部)缺陷，假如此一ART方案被使用的話。The method 100 of FIG. 1 continues to perform 104 shallow trench recess (STR) etching to form the fins 202 from the substrate 200, thereby forming the resulting example structure shown in FIG. 2B, in accordance with an embodiment. The STR etch 104 used to form trenches 215 and fins 202 can include any suitable technique, such as various masking procedures and wet and/or dry etch procedures, for example. In some cases, the STR etch 104 can be performed in situ/no vacancy; in other cases, the STR etch 104 can be performed out of the domain, for example. The grooves 215 can be formed with different widths (dimensions in the X-axis direction) and depths (in the Z-axis direction) as can be understood from the present specification. For example, most of the hard mask patterning 102 and STR etch 104 programs can be implemented to achieve different depths in the trenches 215 between the fins 202. The fins 202 may be formed to have different widths Fw (dimensions in the X-axis direction) and heights Fh (dimensions in the Z-axis direction). For example, in an aspect ratio (ART) integration scheme, fins can be formed to have a specific height to width ratio such that when they are later removed or recessed, the resulting trench is formed into a replacement material. Defects are deposited to terminate on the side surface (as the material grows vertically), such as amorphous/dielectric sidewalls, wherein the sidewalls are sufficiently high relative to the size of the growth region to inhibit most (if not all) defects If such an ART scheme is used.
於某些實施例中，鰭寬度Fw可於5-400nm之範圍中，例如，或者任何其他適當值，如根據此說明書所將清楚明白者。於某些實施例中，鰭高度Fh可於10-800nm之範圍中，例如，或者任何其他適當值，如根據此說明書所將清楚明白者。於使用高寬比設陷(ART)方案之實施例中，鰭可被形成以具有特定的高度與寬度比以致當其稍後被凹陷及/或移除時，所形成之所得鰭溝槽係容許替換材料中之缺陷被沈積以終結於側表面上(隨著材料垂直地生長)，諸如非晶/電介質側壁，其中該些側壁相對於生長區域之大小是夠高的以便抑制大部分(假如非全部)缺陷。於此一範例情況中，鰭之高度與寬度比(Fh：Fw)可大於1，諸如大於1.5、2、2.5、3、3.5、4、4.5、5、6、7、8、9、或10，或任何其他適當的臨限值比，如根據此說明書所將清楚明白者。注意：溝槽215及鰭202被各顯示為具有相同的 寬度及深度/高度於此範例結構中以利說明；然而，本發明不應被如此限制。例如，於某些實施例中，鰭202可被形成以具有不同的高度Fh及/或不同的寬度Fw。再者，注意雖然四個鰭202被顯示於圖2B之範例結構中，但任何數目的鰭均可被形成，諸如一、二、十、數百、數千、及數百萬等個鰭，如根據本說明書可理解者。In certain embodiments, the fin width Fw can be in the range of 5-400 nm, for example, or any other suitable value, as will be apparent from this description. In certain embodiments, the fin height Fh can be in the range of 10-800 nm, for example, or any other suitable value, as will be apparent from this description. In embodiments using an aspect ratio (ART) scheme, the fins can be formed to have a particular height to width ratio such that when they are later recessed and/or removed, the resulting fin trench system is formed Allowing defects in the replacement material to be deposited to terminate on the side surface (as the material grows vertically), such as amorphous/dielectric sidewalls, wherein the sidewalls are sufficiently high relative to the size of the growth region to inhibit most (if Not all) defects. In this example case, the height to width ratio (Fh:Fw) of the fin may be greater than 1, such as greater than 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 6, 7, 8, 9, or 10. , or any other suitable threshold ratio, as will be apparent from this description. Note that trenches 215 and fins 202 are each shown to have the same width and depth/height as described in this example structure; however, the invention should not be so limited. For example, in certain embodiments, the fins 202 can be formed to have different heights Fh and/or different widths Fw. Furthermore, it is noted that although four fins 202 are shown in the example structure of FIG. 2B, any number of fins may be formed, such as one, two, ten, hundreds, thousands, and millions of fins, As can be understood according to the present specification.
圖1之方法100繼續沈積106淺溝槽隔離(STI)層220及平坦化以形成圖2C中所示之所得範例結構，依據一實施例。於某些實施例中，STI層220之沈積106可包括文中所述之任何沈積程序(例如，CVD、ALD、PVD)、或任何其他適當的沈積程序。STI層220之材料可包括任何適當的絕緣材料，諸如一或更多電介質、氧化物(例如，二氧化矽)、或氮化物(例如，氮化矽)材料。於某些實施例中，STI層220之材料可根據基底200之材料而被選擇。例如，於Si基底之情況下，STI材料可為二氧化矽或氮化矽，以提供一範例。The method 100 of FIG. 1 continues to deposit 106 shallow trench isolation (STI) layers 220 and planarization to form the resulting example structure shown in FIG. 2C, in accordance with an embodiment. In some embodiments, the deposition 106 of the STI layer 220 can include any deposition process (eg, CVD, ALD, PVD) as described herein, or any other suitable deposition process. The material of STI layer 220 may comprise any suitable insulating material such as one or more dielectrics, oxide (e.g., hafnium oxide), or nitride (e.g., tantalum nitride) materials. In some embodiments, the material of the STI layer 220 can be selected based on the material of the substrate 200. For example, in the case of a Si substrate, the STI material can be germanium dioxide or tantalum nitride to provide an example.
圖1之方法100繼續凹陷108 STI材料220以致使鰭202之至少一部分204從STI平面滲出，藉此形成圖2D中所示之所得範例結構，依據一實施例。如圖2D中所示，其滲出STI層220之頂部平面上方的鰭202之部分204(指示為204)具有被指示為Fah之有效鰭高度，其可於10-750nm的範圍中，例如，或任何其他適當值，如根據此說明書所將清楚明白者。亦如圖所示，低於STI層220之頂部表面的鰭202之部分203為子鰭部分(指示為203)。注意：於此範例實施 例中，鰭202(包括部分203及204)對於基底200是本機的。換言之，鰭202被形成自基底200於此範例實施例中並包括相同的材料於圖2D之結構中，以致鰭202(包括部分203及204)與基底200為一同質結構。然而，於其他實施例中，鰭202之部分或全部可被移除並替換以替換鰭，舉例而言。於某些此類實施例中，該處理可從圖2C之結構繼續並包括蝕刻鰭202(例如，使用任何適當的濕式及/或乾式蝕刻程序)以形成鰭溝槽於STI層220之間，其中該蝕刻係完全地或部分地移除鰭202(例如，一直到/超過STI層220之底部平面或者不直到/超過STI層220之底部平面，個別地)。於此一實施例中，鰭溝槽可被用於替換材料之沈積，且持續凹陷程序108將導致圖2D之鰭成為替換鰭(其可包括與基底200中所包括者不同的材料)。於某些此類實施例中，替代材料可包括IV族半導體材料及/或III-V族半導體材料、及/或任何其他適當的材料，如根據此說明書所將清楚明白者。例如，包括SiGe之替代鰭可藉由移除本機Si鰭而被形成於此處理期間並以SiGe材料替代它們，僅提供一範例。注意：於其中該些鰭被移除並替代(而因此，並非本機鰭)之一些此類實施例中，ART處理方案可被使用，其中該些鰭溝槽具有高的高寬比(例如，大於1、1.5、2、3、4、5、或更高值之高度：寬度比)。此一ART處理方案可被使用，例如，以抑制位錯，藉此防止位錯到達外延膜表面而顯著地減少溝槽內之表面位錯密度。The method 100 of FIG. 1 continues to recess 108 the STI material 220 such that at least a portion 204 of the fin 202 bleeds out of the STI plane, thereby forming the resulting example structure shown in FIG. 2D, in accordance with an embodiment. As shown in FIG. 2D, the portion 204 (indicated 204) of the fin 202 that oozes out of the top plane of the STI layer 220 has an effective fin height indicated as Fah, which may be in the range of 10-750 nm, for example, or Any other suitable values, as will be apparent from this description. As also shown, portion 203 of fin 202 below the top surface of STI layer 220 is a sub-fin portion (indicated as 203). Note that in this exemplary embodiment, fins 202 (including portions 203 and 204) are native to substrate 200. In other words, the fins 202 are formed from the substrate 200 in this exemplary embodiment and include the same material in the structure of FIG. 2D such that the fins 202 (including portions 203 and 204) are homogenous to the substrate 200. However, in other embodiments, some or all of the fins 202 may be removed and replaced to replace the fins, for example. In some such embodiments, the process can continue from the structure of FIG. 2C and include etching the fins 202 (eg, using any suitable wet and/or dry etch process) to form fin trenches between the STI layers 220. Where the etch removes the fins 202 completely or partially (eg, up to/ beyond the bottom plane of the STI layer 220 or not up to/ beyond the bottom plane of the STI layer 220, individually). In this embodiment, the fin trenches can be used to replace the deposition of material, and the continued recess process 108 will result in the fin of FIG. 2D becoming a replacement fin (which can include a different material than those included in the substrate 200). In certain such embodiments, alternative materials may include Group IV semiconductor materials and/or III-V semiconductor materials, and/or any other suitable materials, as will be apparent from this disclosure. For example, replacement fins including SiGe can be formed during this process by replacing the native Si fins and replacing them with SiGe materials, providing only an example. Note that in some such embodiments where the fins are removed and replaced (and therefore not native fins), an ART processing scheme can be used, wherein the fin trenches have a high aspect ratio (eg, , height greater than 1, 1.5, 2, 3, 4, 5, or higher: width ratio). This ART processing scheme can be used, for example, to suppress dislocations, thereby preventing dislocations from reaching the surface of the epitaxial film and significantly reducing the surface dislocation density within the trenches.
無論有效鰭部分204對於基底200是否為本機的，圖1 之方法100可選擇性地繼續形成110垂直隔離結構230，如圖2D'中所示，依據一實施例。如根據本說明書可理解：圖2D’闡明圖2D之範例結構，包括垂直隔離結構230。因此，針對圖2D之範例結構的先前相關描述同等地可應用於圖2D'之範例結構。於某些實施例中，垂直隔離結構230可被形成以(例如)進一步隔離(或電絕緣)單鰭或鰭之群組。例如，於圖2D'之範例結構中，此類垂直隔離結構存在且可被包括以藉由確保個別S/D區保持分離來防止一電晶體裝置之最終S/D區短路另一(例如，相鄰)電晶體裝置之S/D。因此，此類垂直隔離結構230可使用任何適當的技術而被形成，以及(當存在時)結構230可包括任何適當的電絕緣材料，諸如電介質、氧化物、氮化物、及/或碳化物材料，舉例而言。注意：雖然垂直隔離結構230(於Z軸方向上之尺寸)高於鰭204，但本發明不應被如此限制。同時，因為垂直隔離結構230無須存在於某發明中，由於其為選擇性的，所以方法100將繼續使用無垂直隔離結構230的IC結構來描述，為了便於說明。Regardless of whether the effective fin portion 204 is native to the substrate 200, the method 100 of FIG. 1 can optionally continue to form 110 the vertical isolation structure 230, as shown in FIG. 2D', in accordance with an embodiment. As can be appreciated from this description, Figure 2D' illustrates the example structure of Figure 2D, including a vertical isolation structure 230. Accordingly, the previous related description for the example structure of FIG. 2D is equally applicable to the example structure of FIG. 2D'. In some embodiments, the vertical isolation structure 230 can be formed to, for example, further isolate (or electrically insulate) a group of single fins or fins. For example, in the example structure of FIG. 2D', such vertical isolation structures exist and can be included to prevent shorting of the final S/D region of one transistor device by ensuring that individual S/D regions remain separated (eg, Adjacent to the S/D of the transistor device. Thus, such vertical isolation structures 230 can be formed using any suitable technique, and (when present) structure 230 can comprise any suitable electrically insulating material, such as dielectrics, oxides, nitrides, and/or carbide materials. For example. Note that although the vertical isolation structure 230 (the size in the Z-axis direction) is higher than the fins 204, the present invention should not be so limited. At the same time, because the vertical isolation structure 230 need not be present in an invention, since it is optional, the method 100 will continue to be described using an IC structure without the vertical isolation structure 230, for ease of illustration.
記得：方法100被主要地描述於文中以閘極最後電晶體製造程序流程之背景，其中該處理包括形成虛擬閘極堆疊、履行S/D處理、及接著在S/D區已被處理之後形成最終閘極堆疊。然而，於其他實施例中，該些技術可使用閘極最先程序流程而被履行。於此一範例情況中，程序112-形成虛擬閘極堆疊-將不被履行，而因此，程序112是選擇性的於某些實施例中(諸如那些使用閘極最先程序流程 者)。此被反應於圖1之程序流程的右側上，其中履行116最終閘極堆疊處理116可被履行，在履行114該S/D處理之前，舉例而言。然而，方法100之描述將繼續使用閘極最後程序流程，以容許此一流程(其可包括額外的程序)被充分地描述。Recall that the method 100 is primarily described herein in the context of a gate final transistor fabrication process flow, where the process includes forming a virtual gate stack, performing S/D processing, and then forming after the S/D region has been processed. The final gate is stacked. However, in other embodiments, the techniques may be performed using a gate first program flow. In this example case, the program 112 - forming a virtual gate stack - will not be fulfilled, and thus, the program 112 is optional in some embodiments (such as those using the gate first program flow). This is reflected on the right side of the program flow of Figure 1, where the fulfillment 116 final gate stacking process 116 can be performed, prior to performing 114 the S/D processing, for example. However, the description of method 100 will continue to use the gate final program flow to allow this process (which may include additional programs) to be adequately described.
圖1之方法100繼續以形成112虛擬閘極堆疊，包括虛擬閘極電介質242及虛擬閘極電極244，藉此形成圖2E之範例所得結構，依據一實施例。如上所述，程序112是選擇性的，因為其無須被履行於所有實施例中(諸如那些使用閘極最先程序流程者)。於此範例實施例中，虛擬閘極電介質242(例如，虛擬氧化物材料)及虛擬閘極或虛擬閘極電極244(例如，虛擬多晶矽材料)可被用於替換閘極程序。注意：於虛擬閘極堆疊之任一側上的側壁間隔物250，通常稱為閘極間隔物(或簡稱為間隔物)，亦被形成，且此類間隔物250可協助判定通道長度並可協助替換閘極程序，舉例而言。如根據本說明書可理解：虛擬閘極堆疊(及間隔物250)可協助界定各鰭之通道區及源極/汲極(S/D)區，其中通道區係低於虛擬閘極堆疊(因為其將被設置低於最終閘極堆疊)，而S/D區係位於虛擬閘極堆疊之任一側上。注意：因為IC結構被描述以形成鰭式電晶體之背景，所以最終閘極堆疊亦將相鄰於該鰭之任一側，由於閘極堆疊將沿著鰭式通道區之三個壁而駐存，於某些實施例中。虛擬閘極堆疊之形成可包括沈積虛擬閘極電介質材料242和虛擬閘極電極材料244、圖案化虛擬閘極堆疊、沈積 閘極間隔物材料250、及履行間隔物蝕刻以形成圖2E中所示之結構，舉例而言。間隔物250可包括任何適當的材料，諸如任何適當的電絕緣、電介質、氧化物(例如，氧化矽)、及/或氮化物(例如，氮化矽)材料，如根據此說明書所將清楚明白者。注意：於某些實施例中，文中所述之技術無須包括形成虛擬閘極堆疊，以致其最終閘極堆疊可被形成於第一實例中。無論如何，終端結構將包括終端閘極堆疊，如根據此說明書所將清楚明白者。亦注意：於某些實施例中，硬遮罩(未顯示)可被形成於虛擬閘極堆疊之上(其亦可被形成於間隔物250之上)以保護虛擬閘極堆疊於後續處理期間，舉例而言。The method 100 of FIG. 1 continues to form 112 a virtual gate stack, including a dummy gate dielectric 242 and a dummy gate electrode 244, thereby forming the resulting structure of the example of FIG. 2E, in accordance with an embodiment. As noted above, the program 112 is optional in that it does not have to be implemented in all embodiments (such as those using the gate first program flow). In this example embodiment, a virtual gate dielectric 242 (eg, a dummy oxide material) and a dummy gate or virtual gate electrode 244 (eg, a virtual polysilicon material) can be used to replace the gate process. Note that sidewall spacers 250 on either side of the dummy gate stack, commonly referred to as gate spacers (or simply spacers), are also formed, and such spacers 250 can assist in determining channel length and Assist in replacing the gate procedure, for example. As can be appreciated from this description, the virtual gate stack (and spacer 250) can assist in defining the channel region and source/drain (S/D) regions of each fin, where the channel region is lower than the virtual gate stack (because It will be set lower than the final gate stack) and the S/D zone will be on either side of the virtual gate stack. Note: Since the IC structure is described to form the background of the fin transistor, the final gate stack will also be adjacent to either side of the fin, since the gate stack will reside along the three walls of the fin channel region. In some embodiments. The formation of the dummy gate stack can include depositing dummy gate dielectric material 242 and dummy gate electrode material 244, patterning the dummy gate stack, depositing gate spacer material 250, and performing spacer etching to form the layer shown in FIG. 2E The structure, for example. Spacer 250 can comprise any suitable material, such as any suitable electrical insulation, dielectric, oxide (e.g., antimony oxide), and/or nitride (e.g., tantalum nitride) material, as will be apparent from this description. By. Note that in some embodiments, the techniques described herein need not include forming a dummy gate stack such that its final gate stack can be formed in the first example. In any event, the termination structure will include a terminal gate stack as will be apparent from this description. It is also noted that in some embodiments, a hard mask (not shown) may be formed over the dummy gate stack (which may also be formed over the spacers 250) to protect the dummy gate stack during subsequent processing For example.
圖1之方法100繼續履行114源極/汲極(S/D)處理以形成圖2F之範例所得結構，依據一實施例。如圖2F中所示，該結構包括源極區261，其各包括雙層堆疊結構，包括第一層262及第二層264。注意：雖然源極區第二層264可被形成在源極區第一層262前，於某些實施例中，該些層264、262係由於通過源極區261之電流而被如此指稱(例如，電流可從源極接點流至源極區之第一層262並接著至源極區之第二層264)。於此範例實施例中，第二層264係低於第一層262，而因此，第一層262係高於第二層264；然而，本發明無須如此限制，除非另有聲明。例如，於某些實施例中，源極區261可為單層結構，諸如於形成TFET裝置之情況，以提供一範例。然而，繼續圖2F之範例實施例，於某些實施例中，源極區第二層264可位於源極區第一層262 與通道區和基底200的至少一者之間，如根據本說明書可理解者。例如，第二層264之存在可協助防止從第一層262至通道區及/或基底200之漏電，依據某些此類實施例。亦如圖2F中所示，該結構包括來自各相應源極區261之閘極堆疊的相反側上(而因此於通道區的相反側上)之汲極區265。因此，當討論文中之電晶體的S/D區時，為了便於描述，將假設其單一電晶體將使用單一鰭片結構來形成，以致一源極區261和其相應的汲極區265(例如，於Y軸方向上對準)將被視為該單一電晶體之S/D區。注意：S/D區之結構亦被顯示於圖3，其係闡明沿著圖2I之IC結構的一鰭所取得(及明確地係沿著A-A平面所取得)之範例橫斷面視圖，其將被更詳細地描述於下。因此，圖3之橫斷面視圖可協助闡明S/D區及電晶體結構(一般性地)，舉例而言。The method 100 of FIG. 1 continues to perform 114 source/drain (S/D) processing to form the resulting structure of the example of FIG. 2F, in accordance with an embodiment. As shown in FIG. 2F, the structure includes source regions 261 each including a two-layer stacked structure including a first layer 262 and a second layer 264. Note that although the source region second layer 264 can be formed before the source region first layer 262, in some embodiments, the layers 264, 262 are so referred to by the current through the source region 261 ( For example, current can flow from the source contact to the first layer 262 of the source region and then to the second layer 264 of the source region. In this exemplary embodiment, the second layer 264 is lower than the first layer 262, and thus, the first layer 262 is higher than the second layer 264; however, the invention is not so limited unless otherwise stated. For example, in some embodiments, source region 261 can be a single layer structure, such as in the case of forming a TFET device, to provide an example. However, continuing with the example embodiment of FIG. 2F, in some embodiments, the source region second layer 264 can be located between the source region first layer 262 and at least one of the channel region and the substrate 200, as in accordance with the present specification. Understandable. For example, the presence of the second layer 264 can assist in preventing leakage from the first layer 262 to the channel region and/or substrate 200, in accordance with certain such embodiments. As also shown in FIG. 2F, the structure includes a drain region 265 on the opposite side of the gate stack from each respective source region 261 (and thus on the opposite side of the channel region). Thus, when discussing the S/D regions of the transistors in the text, for ease of description, it will be assumed that a single transistor will be formed using a single fin structure such that a source region 261 and its corresponding drain region 265 (eg, , aligned in the Y-axis direction) will be considered as the S/D region of the single transistor. Note that the structure of the S/D region is also shown in FIG. 3, which illustrates an example cross-sectional view taken along a fin of the IC structure of FIG. 2I (and explicitly taken along the AA plane). It will be described in more detail below. Thus, the cross-sectional view of Figure 3 can assist in clarifying the S/D region and the transistor structure (generally), for example.
S/D區(於某些實施例中)可使用任何適當技術而被形成，諸如遮蔽待處理之S/D區外部的區、從圖2E之結構蝕刻該些鰭之部分(於此範例情況下，有效部分204被蝕刻並移除，僅留下次鰭部分203，如圖所示)、及形成/沈積/生長該些S/D區(例如，使用任何適當的技術，諸如CVD、ALD、PVD)，舉例而言。於某些實施例中，源極區261可與汲極區265被分離地處理，由於其可包括不同的材料及不同的摻雜類型，如根據本說明書可理解者。於某些此類實施例中，一組S/D區(源極區261或汲極區265之任一者)可被遮蔽掉，而處理係發生於另一組S/D區中，且接著該遮蔽與處理可被交換。然而，處理可同時地發生於兩組 S/D區261及265，諸如同時地形成摻雜物於源極層264及汲極265中，由於此類特徵可包括相同的摻雜物類型，依據某些實施例。於某些實施例中，本機鰭204材料(亦即，對於基底200是本機的)可留存在該些S/D區之一者或兩者中，其中此本機材料可被摻雜以形成最後S/D區材料。因此，S/D區之材料可包括本機及/或替換材料，以致其可有或可沒有明顯的介面於次鰭部分203與S/D區(例如，層264及265)之間。於此範例實施例中，由於S/D區之材料為替換材料，所以有明顯的介面於特徵264與203之間以及於特徵265與203之間，如圖2F及3所示。注意：即使在其中對於基底200為本機的材料被使用於S/D區之實施例中，仍可有明顯的介面於該S/D區與次鰭203之間，這是因為被引入該S/D區中之雜質摻雜物，舉例而言。用以處理該些S/D區之多種不同技術將根據本說明書而清楚明白。The S/D region (in some embodiments) may be formed using any suitable technique, such as masking regions outside the S/D region to be processed, and etching portions of the fins from the structure of FIG. 2E (in this example case) Next, active portion 204 is etched and removed, leaving only sub-fin portion 203, as shown), and forming/depositing/growing the S/D regions (eg, using any suitable technique, such as CVD, ALD). , PVD), for example. In some embodiments, source region 261 can be processed separately from drain region 265, as it can include different materials and different doping types, as will be understood in light of this disclosure. In some such embodiments, a set of S/D regions (any of source region 261 or drain region 265) may be masked away, while processing occurs in another set of S/D regions, and This masking and processing can then be exchanged. However, processing can occur simultaneously in two sets of S/D regions 261 and 265, such as simultaneously forming dopants in source layer 264 and drain 265, since such features can include the same dopant type, depending on Certain embodiments. In some embodiments, the native fin 204 material (ie, native to substrate 200) may remain in one or both of the S/D regions, wherein the native material may be doped To form the final S/D zone material. Thus, the material of the S/D region can include the native and/or replacement material such that it may or may not have a significant interface between the secondary fin portion 203 and the S/D region (eg, layers 264 and 265). In this exemplary embodiment, since the material of the S/D region is a replacement material, there is a significant interface between features 264 and 203 and between features 265 and 203, as shown in Figures 2F and 3. Note that even in embodiments in which the material for the substrate 200 is used in the S/D region, there may be a significant interface between the S/D region and the secondary fin 203 because the Impurity dopants in the S/D region, for example. A variety of different techniques for processing the S/D regions will be apparent from this disclosure.
於某些實施例中，S/D區可包括任何適當材料，諸如IV族半導體材料(例如，Si、SiGe、Ge)、III-V族半導體材料(例如，GaAs、InGaAs、InAs)、及/或任何其他適當半導體材料，且亦可包括任何適當的摻雜方案，如根據此說明書所將清楚明白者。當雜質摻雜物被包括於層/區/特徵之半導體材料中時，該些雜質摻雜物可將半導體材料轉換至外質半導體材料(相對於本質半導體材料)，如根據本說明書可理解者。此摻雜有意地將雜質引入半導體材料以(例如)調變半導體材料之電性質。因此，此雜質摻雜可被用以改變所包括的IV族及/或III-V族半導體材料之電性 質，舉例而言。於某些實施例中，摻雜半導體材料可使用任何適當的技術而被獲得，諸如經由擴散、離子植入、以主要半導體材料沈積/生長摻雜物、及/或任何其他適當技術，如根據此說明書所將清楚明白者。於某些實施例中，摻雜物可被引入本機半導體材料(對於基底是本機的)及/或替換半導體材料(例如，其為外延地形成的)，舉例而言。再者，於其中植入被使用之實施例中，雜質摻雜物可被植入有或沒有預先非晶化處置，舉例而言。任何數目的摻雜程序可被履行如所欲以將適當的n型及/或p型摻雜物引入源極、汲極、及/或通道區之半導體材料中，如根據此說明書所將清楚明白者。In certain embodiments, the S/D region can comprise any suitable material, such as a Group IV semiconductor material (eg, Si, SiGe, Ge), a III-V semiconductor material (eg, GaAs, InGaAs, InAs), and / Or any other suitable semiconductor material, and may also include any suitable doping scheme, as will be apparent from this description. When the impurity dopants are included in the layer/region/feature semiconductor material, the impurity dopants can convert the semiconductor material to the exogenous semiconductor material (relative to the intrinsic semiconductor material), as understood in accordance with the present specification. . This doping intentionally introduces impurities into the semiconductor material to, for example, modulate the electrical properties of the semiconductor material. Therefore, this impurity doping can be used to change the electrical properties of the included Group IV and/or III-V semiconductor materials, for example. In certain embodiments, the doped semiconductor material can be obtained using any suitable technique, such as via diffusion, ion implantation, deposition/growth of dopants with a primary semiconductor material, and/or any other suitable technique, such as This description will be clear to the reader. In some embodiments, the dopant can be introduced into the native semiconductor material (which is native to the substrate) and/or replace the semiconductor material (eg, it is epitaxially formed), for example. Furthermore, in embodiments in which implantation is used, the impurity dopant can be implanted with or without prior amorphization treatment, for example. Any number of doping procedures can be performed as desired to introduce appropriate n-type and/or p-type dopants into the semiconductor material of the source, drain, and/or channel regions, as will be clear from this specification. Understand.
然而，於某些實施例中，層/區/特徵(例如，於通道區中)之至少一者中所包括的半導體材料無法被有意地摻雜，以致其半導體材料為本質的或額定未摻雜的。此額定摻雜可發生由於不欲的擴散，舉例而言，而因此，參考半導體材料或包括半導體材料之層/區/特徵的「額定未摻雜」之使用包括具有小於每立方公分(cm)1E15、1E16、1E17、或1E18原子；或小於某其他適當臨限值量的雜質摻雜物濃度，如根據此說明書所將清楚明白者。注意：當摻雜物存在電晶體裝置之任何層/區特徵的半導體材料中時，該些摻雜物可存在以任何適當的濃度，諸如以每立方公分(cm)1E15至5E22之範圍中的濃度、或任何其他適當的濃度，如根據此說明書所將清楚明白者。相對高的摻雜物濃度(例如，大於1E19、1E20、或1E21)可被視為退化摻 雜，其中該半導體材料開始作用更像導體(或實際上確實展現類似於導體之電性質)，如本技術中所已知者。針對IV族半導體材料(例如，Si、SiGe、Ge)之傳統摻雜物包括用於n型摻雜物(施體)之磷(P)及/或砷(As)和用於p型摻雜物(受體)之硼(B)，僅提供某些範例。此外，針對III-V族半導體材料(例如，GaAs、InGaAs、InAs)之傳統摻雜物包括用於n型摻雜物(施體)之Si和用於p型摻雜物之鈹(Be)、鋅(Zn)及/或鎂(Mg)，僅提供某些範例。However, in some embodiments, the semiconductor material included in at least one of the layers/regions/features (eg, in the channel region) cannot be intentionally doped such that its semiconductor material is intrinsic or nominally undoped. Miscellaneous. This nominal doping can occur due to unwanted diffusion, for example, and thus, the use of "rated undoped" with reference to semiconductor materials or layers/zones/features including semiconductor materials includes having less than cubic centimeters per cubic centimeter (cm). 1E15, 1E16, 1E17, or 1E18 atoms; or an impurity dopant concentration less than some other suitable threshold amount, as will be apparent from this specification. Note that when dopants are present in the semiconductor material of any layer/region feature of the crystal device, the dopants may be present in any suitable concentration, such as in the range of 1E15 to 5E22 per cubic centimeter (cm). Concentration, or any other suitable concentration, as will be apparent from this description. A relatively high dopant concentration (eg, greater than 1E19, 1E20, or 1E21) can be considered as a degenerate doping where the semiconductor material begins to act more like a conductor (or indeed exhibits electrical properties similar to a conductor), such as Those known in the art. Conventional dopants for Group IV semiconductor materials (eg, Si, SiGe, Ge) include phosphorus (P) and/or arsenic (As) for n-type dopants (donor) and for p-type doping Boron (B) of the substance (acceptor) provides only some examples. In addition, conventional dopants for Group III-V semiconductor materials (eg, GaAs, InGaAs, InAs) include Si for n-type dopants (donor) and tantalum (Be) for p-type dopants Zinc (Zn) and/or magnesium (Mg), only some examples are provided.
於其中該通道區之任一側上(例如，該閘極堆疊之任一側上)的相應S/D區將被用於FFFET裝置之實施例中，源極區261可包括雙層結構，諸如圖2F及3中所示，其中該雙層源極區包括第一層262及第二層264。因此，於其中所形成的電晶體為FFFET裝置之實施例中，針對特徵262/262-206-265(雙層源極-通道-汲極)之摻雜方案可為np-i-p(或np-n-p)或pn-i-n(或pn-p-n)，其中「n」代表n型摻雜的半導體材料、「p」代表p型摻雜的半導體材料，及「i」代表本質或額定未摻雜的半導體材料，舉例而言。於某些此類實施例中，可瞭解：源極區第一層262可包括n型與p型摻雜物之一，而源極區第二層264包括相對於第一層262的n型與p型摻雜物之另一者。此外，於某些此類實施例中，汲極區265可包括如源極區第二層264之相同摻雜物類型，以致其兩者均包括n型或p型摻雜物，舉例而言。因此，於某些此類實施例中，汲極區265可包括相對於源極區第一層262的n型與p型摻雜物之另一者。同時注意：FFFET裝置 或其可使用文中所述之技術而被形成的任何其他電晶體之通道區206可為本質的或額定未摻雜的(例如，具有每立方公分少於1E16、1E17、或1E18原子之雜質摻雜物濃度)或者通道區206可被摻雜以適當的n型或p型摻雜物，如根據此說明書所將清楚明白者。A corresponding S/D region on either side of the channel region (e.g., on either side of the gate stack) will be used in an embodiment of an FFFET device, which may include a two-layer structure, Such as shown in FIGS. 2F and 3, wherein the dual layer source region includes a first layer 262 and a second layer 264. Thus, in embodiments in which the transistor formed is an FFFET device, the doping scheme for features 262/262-206-265 (dual-layer source-channel-drain) can be np-ip (or np-) Np) or pn-in (or pn-pn), where "n" represents an n-type doped semiconductor material, "p" represents a p-type doped semiconductor material, and "i" represents an essential or nominally undoped Semiconductor materials, for example. In some such embodiments, it can be appreciated that the source region first layer 262 can include one of n-type and p-type dopants, while the source region second layer 264 includes an n-type relative to the first layer 262. The other one with the p-type dopant. Moreover, in some such embodiments, the drain region 265 can include the same dopant type as the second region 264 of the source region such that both comprise an n-type or p-type dopant, for example, for example . Thus, in some such embodiments, the drain region 265 can include the other of the n-type and p-type dopants relative to the first region 262 of the source region. Also note that the FFFET device or any other transistor channel region 206 that can be formed using the techniques described herein can be intrinsic or nominally undoped (eg, having less than 1E16, 1E17 per cubic centimeter, or The impurity concentration of the 1E18 atom or the channel region 206 can be doped with a suitable n-type or p-type dopant, as will be apparent from this description.
於其中該通道區之任一側上(例如，該閘極堆疊之任一側上)的相應S/D區將被用於TFET裝置之實施例中，記得其源極無須具有雙層結構，以致其源極區261為僅一層，舉例而言。於某些此類實施例中，S/D區可包括相反類型的摻雜物於任一p-i-n(例如，針對p-TFET)或n-i-p(例如，針對n-TFET)之源極-通道-汲極方案中。於某些實施例中，其中該通道區之任一側上(例如，該閘極堆疊之任一側上)的相應S/D區將被用於MOSFET裝置，該些S/D區可各包括相同類型的摻雜物於任一p-n-p(例如，針對p-MOS)或n-p-n(例如，針對n-MOS)之源極-通道-汲極摻雜方案中。例如，於某些此類實施例中，n-p-n及/或p-n-p MOSFET裝置可被包括以穿隧式電晶體裝置(例如，FFFET及/或TFET)於相同的電路中(例如，用以形成CMOS裝置)。於某些實施例中，S/D區261與265之一或兩者可包括二或更多材料層之多層結構，例如，諸如源極區261包括雙層結構於圖2F及3之範例實施例中的情況。於某些實施例中，S/D區261與265之一或兩者可包括漸變(例如，遞增及/或遞減)該些區之至少一部分中的一或更多材料之內容/濃度，其中所分級的材料可相關於所包括的半導體材料之 濃度(例如，遍及SiGe材料之Ge的濃度)及/或所包括的摻雜物，舉例而言。因此，依據各個實施例，多數電晶體類型(及因此，S/D組態和摻雜方案)可被使用，如根據本說明書可理解者。再者，文中所述之IC結構的至少二層/區/特徵之組態及/或性質(例如，所包括的半導體材料、摻雜、帶隙性質、相對位置，等等)可被界定以任何適當的相對方式，如根據此說明書所將清楚明白者。A corresponding S/D region on either side of the channel region (e.g., on either side of the gate stack) will be used in an embodiment of the TFET device, remembering that the source does not need to have a two-layer structure, Thus, its source region 261 is only one layer, for example. In some such embodiments, the S/D region can include a dopant of the opposite type at any pin (eg, for a p-TFET) or a nip (eg, for an n-TFET) source-channel-汲In the polar program. In some embodiments, a corresponding S/D region on either side of the channel region (eg, on either side of the gate stack) will be used for the MOSFET device, and the S/D regions may each The same type of dopant is included in the source-channel-drain doping scheme of either pnp (eg, for p-MOS) or npn (eg, for n-MOS). For example, in some such embodiments, an npn and/or pnp MOSFET device can be included in a tunneling transistor device (eg, an FFFET and/or a TFET) in the same circuit (eg, to form a CMOS device) ). In some embodiments, one or both of S/D regions 261 and 265 can include multiple layers of two or more material layers, for example, such as source region 261 including a two-layer structure in the example implementation of FIGS. 2F and 3. The situation in the example. In some embodiments, one or both of S/D regions 261 and 265 can include ramping (eg, incrementing and/or decrementing) the content/density of one or more materials in at least a portion of the regions, wherein The graded material can be related to the concentration of semiconductor material included (eg, the concentration of Ge throughout the SiGe material) and/or dopants included, for example. Thus, in accordance with various embodiments, most transistor types (and thus S/D configurations and doping schemes) can be used, as can be understood in light of this description. Furthermore, the configuration and/or nature of at least two layers/regions/features of the IC structure described herein (eg, semiconductor material included, doping, band gap properties, relative position, etc.) can be defined to Any suitable relative manner will be apparent to those skilled in the art.
記得於某些實施例中，源極區261可包括相對於汲極區265之不同的半導體材料，諸如Si於該些區之一者中而SiGe或Ge於另一者中。例如，於圖2F及3之雙層源極區的情況下(例如，其可針對FFFET裝置而被形成)，該些層262與264之一者或兩者可包括相對於汲極區265中所包括之半導體材料的不同半導體材料，依據某些實施例。再者，於某些實施例中，層262及264可包括相同的或不同的半導體材料(例如，兩者均包括Si或一者包括Si而另一者包括SiGe)。S/D區中之不同半導體材料的使用可容許帶隙工程以獲得所欲的功效，諸如增加帶補償以減少電晶體關狀態下之漏電流，如將參考圖4及5而被更詳細地描述者。例如，於某些實施例中，半導體材料可根據相對帶隙、相對價帶邊緣(Ev)性質、及/或根據相對導通帶邊緣(Ec)性質而被選擇。然而，於某些實施例中，源極區261及汲極區265可包括相同的半導體材料，以及於某些此類實施例中，僅有相同的半導體材料，舉例而言。例如，在相關於TFET裝置之某些此類實施例中，S/D區可包括相同的半導體材 料(例如，Si)，但將為相反類型摻雜的(例如，其中源極區為n型摻雜的而汲極區為p型摻雜的，或其中源極區為p型摻雜的而汲極區為n型摻雜的)。再者，在相關於FFFET裝置之某些此類實施例中，S/D區可包括相同的半導體材料(例如，Si)，以致其雙層源極區包括同質接面組態(而非異質接面組態)，舉例而言。Recall that in some embodiments, source region 261 can include a different semiconductor material relative to drain region 265, such as Si in one of the regions and SiGe or Ge in the other. For example, in the case of the dual source regions of FIGS. 2F and 3 (eg, which may be formed for FFFET devices), one or both of the layers 262 and 264 may be included with respect to the drain region 265. The different semiconductor materials of the semiconductor materials included are in accordance with certain embodiments. Moreover, in some embodiments, layers 262 and 264 can comprise the same or different semiconductor materials (eg, both include Si or one including Si and the other including SiGe). The use of different semiconductor materials in the S/D region can tolerate bandgap engineering to achieve desired effects, such as increasing band compensation to reduce leakage current in the transistor off state, as will be described in more detail with reference to Figures 4 and 5. Describer. For example, in certain embodiments, the semiconductor material can be selected based on relative bandgap, relative valence band edge (Ev) properties, and/or according to relative conduction band edge (Ec) properties. However, in some embodiments, source region 261 and drain region 265 can comprise the same semiconductor material, and in some such embodiments, only the same semiconductor material, for example. For example, in certain such embodiments related to TFET devices, the S/D regions can include the same semiconductor material (eg, Si), but will be doped in opposite types (eg, where the source region is n-type) The doped and drain regions are p-doped, or wherein the source regions are p-doped and the drain regions are n-doped. Furthermore, in certain such embodiments relating to FFFET devices, the S/D regions may comprise the same semiconductor material (eg, Si) such that their dual source regions include homojunction configurations (rather than heterogeneity) Junction configuration), for example.
於使用圖2F及3之雙層源極區261的實施例中，源極區第二層264可被視為過濾器元件，諸如於FFFET裝置中，其中該過濾器元件係相當薄的，具有5-50nm(例如，10-25nm)之範圍中的厚度(例如，Z軸方向上之尺寸及/或Y軸方向上介於262與206之間的尺寸)、或某其他適當的厚度，如根據此說明書所將清楚明白者。通常，S/D區之厚度/高度(例如，Z軸方向上之尺寸)可為任何適當的厚度/高度，其可基於有效通道區高度，舉例而言。額外的材料及摻雜範例組態將參考圖3'、4、及5而被描述於文中。各種電晶體S/D組態及變異將根據此說明書而清楚明白。In an embodiment using the dual layer source region 261 of Figures 2F and 3, the source region second layer 264 can be considered a filter element, such as in an FFFET device, wherein the filter element is relatively thin, having a thickness in the range of 5-50 nm (eg, 10-25 nm) (eg, a dimension in the Z-axis direction and/or a dimension between 262 and 206 in the Y-axis direction), or some other suitable thickness, such as It will be clear from this description. In general, the thickness/height of the S/D region (e.g., the dimension in the Z-axis direction) can be any suitable thickness/height, which can be based on the effective channel region height, for example. Additional material and doping example configurations will be described herein with reference to Figures 3', 4, and 5. Various transistor S/D configurations and variations will be apparent from this description.
於某些實施例中，碳基蝕刻停止層266可被形成於該些S/D區之一者或兩者上，其中碳基蝕刻停止層266可於文中被簡稱為蝕刻停止層，舉例而言。於某些實施例中，碳基蝕刻停止層266可被形成於該些S/D區(例如，261及/或265)之一者或兩者上，以協助防止S/D接觸溝槽蝕刻處理免於從該些S/D區之任一者或兩者不當地移除材料。如根據本說明書可理解：在蝕刻停止層266中之碳的存在係容許該層更強韌/能抵抗蝕刻處理，該蝕刻處理係用以形成 文中所述之穿隧式電晶體的S/D接觸溝槽。因此，使用文中所述之碳基蝕刻停止層266可提供受控制的且可重複的位置，以供停止S/D接觸蝕刻處理，當製造穿隧式電晶體裝置時。注意：蝕刻停止層266被顯示為形成於每鰭片結構之S/D區261與265之兩者，於圖2F之範例實施例中。然而，於某些實施例中，蝕刻停止層266可被使用於僅源極區或汲極區。於某些實施例中，碳基蝕刻停止層266可包括半導體材料(例如，Si)，其不會除此以外包括與碳合金之碳，以致其碳(C)合金的半導體材料可被稱為「Z：C」，其中Z包括半導體材料(例如，IV族或III-V族半導體材料)。於某些實施例中，包括碳合金之半導體材料可包括單晶材料之總原子百分比的百分之1至80的範圍中之碳濃度。於某些實施例中，接觸電阻減少層266可包括多層結構，其包括至少兩材料層，舉例而言。於某些實施例中，接觸電阻減少層266中所包括之一或更多材料的濃度(諸如碳濃度)可或可不以任何適當的方式被漸變(例如，遞增及/或遞減)，舉例而言。於某些實施例中，碳基蝕刻停止層可被形成以具有1至20nm之範圍中(例如，1至10nm之範圍中)的厚度，或具有某其他適當的厚度，如根據此說明書所將清楚明白者。In some embodiments, a carbon-based etch stop layer 266 can be formed on one or both of the S/D regions, wherein the carbon-based etch stop layer 266 can be referred to herein simply as an etch stop layer, for example Words. In some embodiments, a carbon-based etch stop layer 266 can be formed on one or both of the S/D regions (eg, 261 and/or 265) to assist in preventing S/D contact trench etching. Processing is free of material removal from any of the S/D zones or both. As can be understood from the present description, the presence of carbon in the etch stop layer 266 allows the layer to be stronger/resistance to the etching process used to form the S/D of the tunneling transistor described herein. Contact the groove. Thus, the use of the carbon-based etch stop layer 266 described herein can provide a controlled and repeatable position for stopping the S/D contact etch process when fabricating a tunneling transistor device. Note that etch stop layer 266 is shown as being formed in both S/D regions 261 and 265 of each fin structure, in the exemplary embodiment of FIG. 2F. However, in some embodiments, the etch stop layer 266 can be used for only the source region or the drain region. In some embodiments, the carbon-based etch stop layer 266 can include a semiconductor material (eg, Si) that does not include carbon with the carbon alloy, such that the semiconductor material of its carbon (C) alloy can be referred to as "Z: C", where Z includes a semiconductor material (eg, a Group IV or III-V semiconductor material). In certain embodiments, the semiconductor material including the carbon alloy may include a carbon concentration in the range of 1 to 80 percent of the total atomic percentage of the single crystal material. In some embodiments, the contact resistance reducing layer 266 can comprise a multilayer structure comprising at least two layers of material, for example. In some embodiments, the concentration (eg, carbon concentration) of one or more materials included in the contact resistance reducing layer 266 may or may not be graded (eg, incremented and/or decremented) in any suitable manner, for example Words. In certain embodiments, the carbon-based etch stop layer can be formed to have a thickness in the range of 1 to 20 nm (eg, in the range of 1 to 10 nm), or have some other suitable thickness, as will be in accordance with this specification. Clear and understandable.
於某些實施例中，蝕刻停止層266可包括相對於直接下方(或者附近)S/D材料/摻雜物之類似的半導體材料及/或摻雜物，舉例而言。例如，於圖2F所示之範例實施例中，其中源極區261包括雙層組態(其包括第一層262和第二層 264)，形成於第一層262之上的蝕刻停止層266可包括如第一層262之類似或相同的半導體材料，且亦可包括相對於第一層262中所包括者之相同類型的摻雜物(例如，n型或p型)，除了其蝕刻停止層266亦將包括碳合金。更明確地，於一範例實施例中，假如第一層262將包括n型Si(例如，針對p型FFFET裝置)，則上覆接觸電阻減少層266亦可包括n型Si，但具有碳合金，以致其該層266實際上包括n型Si：C或SiGe：C，舉例而言。記得：蝕刻停止層266中之碳濃度的範圍可從1%至80%，且其可具有厚度於1至20nm之範圍中，依據某些實施例。再者，蝕刻停止層266可被摻雜以如下方S/D材料之相同類型的摻雜物(例如，n型或p型)，舉例而言。於某些實施例中，蝕刻停止層266可針對較低包括的碳濃度為相對較厚的，諸如針對10-15nm之範圍中的厚度之約1.5%的碳(C)濃度。此類實施例可特別適於III-V族材料應用，舉例而言。於某些實施例中，蝕刻停止層266可針對較高包括的碳濃度為相對較薄的，諸如針對1-5nm之範圍中的厚度之約40%的碳(C)濃度。因此，於某些此類實施例中，蝕刻停止層266之碳濃度與厚度可為反向相關的，以致其一者之增加可容許另一者之減少，且反之亦然。進一步注意：於其中蝕刻停止層266包括SiGe：C之實施例中，此一材料之Ge濃度可相同於下方材料加或減20百分比點，舉例而言。如根據本說明書可理解：使用文中所述之技術所形成的電晶體裝置之S/D區可包括相反類型的摻雜至少於S/D區之頂部部分中。例如， 於某些實施例中，TFET裝置之S/D區被相反地摻雜，以致其一者為n型摻雜的而另一者為p型摻雜的。因此，於某些此類實施例中，假如蝕刻停止層266被形成於S/D區之兩者上，則n型摻雜的S/D區之上的層266之部分亦可被n型摻雜，而p型摻雜的S/D區之上的層266之部分亦可被p型摻雜以確保摻雜方案之一致性。然而，於某些實施例中，蝕刻停止層266無須包括如下方S/D半導體材料之相同的半導體材料及/或摻雜物，舉例而言。In some embodiments, the etch stop layer 266 can include similar semiconductor materials and/or dopants relative to the underlying (or nearby) S/D material/dopant, for example. For example, in the exemplary embodiment illustrated in FIG. 2F, wherein the source region 261 includes a two-layer configuration (which includes a first layer 262 and a second layer 264), an etch stop layer 266 formed over the first layer 262. A similar or identical semiconductor material as the first layer 262 may be included, and may also include the same type of dopant (eg, n-type or p-type) relative to that included in the first layer 262, except that the etch stop Layer 266 will also include a carbon alloy. More specifically, in an exemplary embodiment, if the first layer 262 would include n-type Si (eg, for a p-type FFFET device), the overlying contact resistance reducing layer 266 may also include n-type Si, but with a carbon alloy. Thus, its layer 266 actually includes n-type Si:C or SiGe:C, for example. It will be recalled that the concentration of carbon in the etch stop layer 266 can range from 1% to 80%, and it can have a thickness in the range of 1 to 20 nm, in accordance with certain embodiments. Furthermore, the etch stop layer 266 can be doped with the same type of dopant (eg, n-type or p-type) of the S/D material as follows, for example. In some embodiments, the etch stop layer 266 can be relatively thick for lower included carbon concentrations, such as a carbon (C) concentration of about 1.5% for a thickness in the range of 10-15 nm. Such embodiments may be particularly suitable for III-V material applications, for example. In some embodiments, the etch stop layer 266 can be relatively thin for higher included carbon concentrations, such as a carbon (C) concentration of about 40% for a thickness in the range of 1-5 nm. Thus, in some such embodiments, the carbon concentration and thickness of the etch stop layer 266 can be inversely related such that an increase in one can allow for the other to decrease, and vice versa. It is further noted that in embodiments in which the etch stop layer 266 comprises SiGe:C, the Ge concentration of this material may be the same as the lower material plus or minus 20 percent points, for example. As can be appreciated from the present description, the S/D regions of the crystal device formed using the techniques described herein can include opposite types of doping in at least the top portion of the S/D region. For example, in some embodiments, the S/D regions of the TFET device are oppositely doped such that one is n-doped and the other is p-doped. Thus, in some such embodiments, if the etch stop layer 266 is formed on both of the S/D regions, portions of the layer 266 over the n-doped S/D region may also be n-type. Doping, while portions of layer 266 over the p-doped S/D region can also be p-doped to ensure uniformity of the doping scheme. However, in some embodiments, the etch stop layer 266 need not include the same semiconductor material and/or dopant of the S/D semiconductor material as follows, for example.
記得：蝕刻停止層266無須存在於源極區261與其相應S/D接點292之間以及亦於汲極區265與其相應S/D接點292之間，於某些實施例中。例如，圖3’闡明變化，其中蝕刻停止層266被形成僅於該些S/D區的一者與其相應接點之間，明確地，介於汲極區265’與其相應S/D接點292之間，如圖所示。亦記得：蝕刻停止層266可被用以有益於穿隧裝置(例如，TFET、FFFET)，其係使用介於個別S/D區之間的類似材料或介於個別S/D區之間的相異/不同材料，如根據本說明書可理解者。再者，記得於FFFET裝置之情況下，蝕刻停止層266可有益於包括雙層源極區之FFFET裝置，無論該源極區係包括異質接面組態或同質接面組態，如根據本說明書亦可理解者。亦注意：當蝕刻停止層266存在於該些S/D區之兩者時，則該層266之不同部分(例如，源極區之上的部分及汲極區之上的部分)可被形成於該程序流程期間之不同時間上，以不同的半導體材料、以不同類型的摻雜物(例如，其中一部分為n型摻雜的 而另一為p型摻雜的)、以不同的摻雜物濃度、以碳合金之不同的濃度、及/或以不同的組態(例如，不同的幾何、電晶體裝置中之不同的相對高度，等等)，依據某些實施例。It is recalled that the etch stop layer 266 need not be present between the source region 261 and its corresponding S/D contact 292 and also between the drain region 265 and its corresponding S/D contact 292, in some embodiments. For example, Figure 3' illustrates a variation in which an etch stop layer 266 is formed only between one of the S/D regions and its corresponding junction, specifically, between the drain region 265' and its corresponding S/D contact. Between 292, as shown. It will also be recalled that the etch stop layer 266 can be used to benefit tunneling devices (e.g., TFETs, FFFETs) that use similar materials between individual S/D regions or between individual S/D regions. Different/different materials, as understood from this specification. Furthermore, it is recalled that in the case of an FFFET device, the etch stop layer 266 can be beneficial for FFFET devices including a dual layer source region, whether the source region includes a heterojunction configuration or a homojunction configuration, such as The instructions are also understandable. It is also noted that when the etch stop layer 266 is present in both of the S/D regions, then different portions of the layer 266 (eg, portions above the source region and portions above the drain region) may be formed. Different dopings at different times during the program flow, with different types of dopants (eg, one of which is n-doped and the other is p-doped), with different doping The concentration of the material, the different concentrations of the carbon alloy, and/or the different configurations (e.g., different geometries, different relative heights in the crystal device, etc.), in accordance with certain embodiments.
注意：於某些實施例中，蝕刻停止層266(當存在時)可為獨特層(例如，如圖2F中所示)或者其可為其中一或更多材料或材料濃度係相對於S/D區之剩餘者而被漸變(例如，遞增及/或遞減)的S/D區之一部分，舉例而言。例如，當履行S/D處理時，S/D形成程序之最後部分可包括以一種穩定或突然的方式將碳合金引入S/D材料來形成接觸電阻減少層266，僅提供一範例。於某些實施例中，蝕刻停止層266無法於最終電晶體裝置中維持係獨特層。例如，於某些實施例中，碳基層266可部分地或完全地溶解入附近接點及/或S/D區材料，於後續處理期間(例如，S/D接點形成處理)，以致其碳原子接著存在於那些特徵之一或二者中。因此，於某些此類實施例中，如文中所述之碳基蝕刻停止層266的使用可根據其存在於或接近源極接點及/或汲極接點介面之碳含量(例如，至少百分之1的碳)而被檢測。因此，於某些此類實施例中，文中所提供之技術可根據該碳之存在而被檢測，因為碳將不會除此以外存在或接近此類S/D接點介面，如根據本說明書可理解者。例如，碳可變為介金屬之部分(其中接觸區之電阻降低金屬與來自蝕刻停止層和S/D區之半導體材料反應)，以碳之一部分潛在地餘留在半導體S/D區中。於某些此類情況下， 已溶解的碳可存在於百分之1至20的範圍中，例如，或者任何其他適當位準，如根據此說明書所將清楚明白者。針對碳基蝕刻停止層之多種不同的組態及變化將根據本說明書而清楚明白。Note that in some embodiments, the etch stop layer 266 (when present) may be a unique layer (eg, as shown in FIG. 2F) or it may be one or more of the materials or material concentrations relative to the S/ Part of the S/D zone that is gradual (eg, incremented and/or decremented) by the remainder of the D zone, for example. For example, when performing S/D processing, the final portion of the S/D forming process may include introducing a carbon alloy into the S/D material in a stable or abrupt manner to form the contact resistance reducing layer 266, providing only an example. In some embodiments, the etch stop layer 266 is unable to maintain a unique layer in the final transistor device. For example, in certain embodiments, the carbon-based layer 266 can be partially or completely dissolved into nearby contacts and/or S/D region materials during subsequent processing (eg, S/D contact formation processing) such that The carbon atom then exists in one or both of those features. Thus, in some such embodiments, the use of the carbon-based etch stop layer 266 as described herein may be based on the carbon content present at or near the source contact and/or the drain contact interface (eg, at least 1% carbon) was detected. Thus, in some such embodiments, the techniques provided herein may be detected based on the presence of the carbon, as carbon will not otherwise exist or be in proximity to such S/D contact interfaces, as in accordance with the present specification. Understandable. For example, carbon can be changed to a portion of a metal (wherein the resistance of the contact region reduces the metal to react with the semiconductor material from the etch stop layer and the S/D region), potentially remaining in the semiconductor S/D region as a portion of the carbon. In some such cases, the dissolved carbon may be present in the range of 1 to 20 percent, for example, or any other suitable level, as will be apparent from this disclosure. A variety of different configurations and variations for the carbon-based etch stop layer will be apparent from this description.
圖1之方法100繼續履行116閘極堆疊處理以形成圖2G之範例所得結構。如圖2G中所示，此範例實施例中之處理包括沈積層間電介質(ILD)層270於圖2F之結構上，接續以選擇性的平坦化及/或拋光以顯露該虛擬閘極堆疊。注意：ILD層270被顯示為透明的，於圖2G之範例結構中，以容許下方特徵被看見；然而，本發明不應被如此限制。於某些實施例中，ILD層270可包括任何適當的電絕緣體、電介質、氧化物(例如，氧化矽)、及/或氮化物(例如，氮化矽)材料，如根據此說明書所將清楚明白者。於此範例實施例中，閘極堆疊處理繼續以移除該虛擬閘極堆疊(包括虛擬閘極244及虛擬閘極電介質242)來容許最終閘極堆疊被形成。記得：於某些實施例中，最終閘極堆疊(其包括閘極電介質層282和閘極(或閘極電極)284)之形成可使用閘極最先流程(亦稱為領先高k閘極)而被履行。於此類實施例中，閘極處理可已被履行在程序108之後或者在選擇性程序110之後(於其中程序110被履行的實施例中)以及在S/D處理114之前。然而，於此範例實施例中，閘極堆疊係使用閘極最後流程(亦稱為替換閘極或替換金屬閘極(RMG)程序)而被形成。於此閘極最後處理中，該程序可包括虛擬閘極氧化物沈積、虛擬閘極電極(例如，多晶矽) 沈積、及(選擇性地)圖案化硬遮罩沈積，如先前所述者。無論使用閘極最先處理或閘極最後處理，該最終閘極堆疊可包括閘極電介質層282和閘極284，如圖2G中所示。The method 100 of FIG. 1 continues to perform the 116 gate stacking process to form the resulting structure of the example of FIG. 2G. As shown in FIG. 2G, the processing in this exemplary embodiment includes depositing an interlayer dielectric (ILD) layer 270 on the structure of FIG. 2F, followed by selective planarization and/or polishing to reveal the dummy gate stack. Note that the ILD layer 270 is shown as being transparent, in the example structure of Figure 2G, to allow the underlying features to be seen; however, the invention should not be so limited. In certain embodiments, ILD layer 270 can comprise any suitable electrical insulator, dielectric, oxide (eg, hafnium oxide), and/or nitride (eg, tantalum nitride) material, as will be clear from this description. Understand. In this example embodiment, the gate stacking process continues to remove the virtual gate stack (including dummy gate 244 and dummy gate dielectric 242) to allow the final gate stack to be formed. Recall that in some embodiments, the final gate stack (which includes the gate dielectric layer 282 and the gate (or gate electrode) 284) can be formed using the gate first process (also known as the leading high-k gate). ) was fulfilled. In such an embodiment, the gate processing may have been performed after the program 108 or after the selective program 110 (in the embodiment where the program 110 is being executed) and before the S/D processing 114. However, in this exemplary embodiment, the gate stack is formed using a gate final flow (also known as a replacement gate or a replacement metal gate (RMG) program). In this gate final processing, the process can include virtual gate oxide deposition, virtual gate electrode (eg, polysilicon) deposition, and (optionally) patterned hard mask deposition, as previously described. The final gate stack can include a gate dielectric layer 282 and a gate 284, whether using gate first processing or gate last processing, as shown in Figure 2G.
注意：當該虛擬閘極被移除時，鰭204之通道區(其未被虛擬閘極所覆蓋)被暴露以容許該些鰭之通道區的任何所欲處理。通道區之此處理可包括各種不同的技術，諸如移除並以替換材料替換該通道區、如所欲摻雜該鰭之該通道區、將該鰭形成入環繞式閘極(GAA)電晶體組態之一或更多奈米線(或奈米帶)、清潔/拋光該通道區、及/或任何其他適當的處理，如根據此說明書所將清楚明白者。例如，鰭式通道區206被闡明(其為最右邊鰭式結構之通道區)，其可已被形成，藉由以所欲的適當n型或p型摻雜物來摻雜本機鰭204，舉例而言。提供另一範例，奈米線通道區208(其為最左邊鰭式結構之通道區)可已被形成在虛擬閘極被移除且該些鰭之通道區被暴露之後，藉由使用任何適當技術以在該位置上轉換該鰭式結構，舉例而言。如圖所示，奈米線通道區208包括2奈米線(或奈米帶)。然而，使用文中所揭露之技術所形成的奈米線(或奈米帶或GAA)電晶體可包括任何數目的奈米線(或奈米帶)，諸如1至10個或更多，根據所欲的組態。Note that when the virtual gate is removed, the channel region of the fin 204 (which is not covered by the dummy gate) is exposed to allow for any desired processing of the channel regions of the fins. This processing of the channel region can include a variety of different techniques, such as removing and replacing the channel region with a replacement material, such as the channel region where the fin is to be doped, forming the fin into a wraparound gate (GAA) transistor. One or more of the nanowires (or nanoribbons) are configured, the channel area is cleaned/polished, and/or any other suitable treatment, as will be apparent from this description. For example, the fin channel region 206 is illustrated (which is the channel region of the rightmost fin structure) that may have been formed by doping the native fin 204 with a suitable n-type or p-type dopant as desired. For example. Providing another example, the nanowire channel region 208, which is the channel region of the leftmost fin structure, may have been formed after the virtual gate is removed and the channel regions of the fins are exposed, by using any suitable Techniques to convert the fin structure at this location, for example. As shown, the nanowire channel region 208 includes 2 nanowires (or nanoribbons). However, nanowire (or nanobelt or GAA) transistors formed using the techniques disclosed herein may include any number of nanowires (or nanoribbons), such as 1 to 10 or more, depending on The desired configuration.
如根據本說明書可理解：通道區係至少低於閘極堆疊，於此範例實施例中。例如，於鰭式電晶體組態之情況下，通道區可低於閘極堆疊且介於閘極堆疊之間，由於該堆疊被形成於三側上，如本技術中所已知者。然而，假如 該電晶體裝置被轉向(invert)並接合至其將為終端基底者，則該通道區可位於該閘極之上。因此，通常，閘極與通道關係可包括近似關係(其可或可不包括中間閘極電介質層及/或其他適當的層)，其中該閘極係接近該通道區以致其可以某方式(例如，以電的方式)施加對於該通道區之控制，依據某些實施例。再者，於奈米線(或奈米帶或GAA)電晶體組態之情況下，該閘極堆疊可實質上(或完全地)圍繞該通道區中之各奈米線/奈米帶。又再者，於平面電晶體組態之情況下，該閘極堆疊可單純位於該通道區之上。於某些實施例中，該通道區可包括IV族半導體材料(例如，Si、GiGe、Ge)、III-V族半導體材料(例如，GaAs、InGaAs、InAs)、及/或任何其他適當的材料，如根據此說明書所將清楚明白者。於某些實施例中，該通道區中所包括的半導體材料可對於基底200是本機的及/或該通道區中所包括的半導體材料可對於基底200不是本機的(例如，以致其為替換材料或形成於基底200之上的材料)。記得：於某些實施例中，該通道區可為摻雜的(例如，以任何適當的n型及/或p型摻雜物)或者為本質的/額定未摻雜的，根據特定的組態。As can be appreciated from the present description, the channel region is at least lower than the gate stack, in this exemplary embodiment. For example, in the case of a fin transistor configuration, the channel region can be lower than the gate stack and between the gate stacks, as the stack is formed on three sides, as is known in the art. However, if the transistor device is inverted and bonded to the person it will be the terminal substrate, the channel region can be located above the gate. Thus, in general, the gate-to-channel relationship can include an approximate relationship (which may or may not include an intermediate gate dielectric layer and/or other suitable layer), wherein the gate is close to the channel region such that it can be in some manner (eg, The control of the channel region is applied electrically, in accordance with certain embodiments. Furthermore, in the case of a nanowire (or nanobelt or GAA) transistor configuration, the gate stack can substantially (or completely) surround each nanowire/nanoband in the channel region. Still further, in the case of a planar transistor configuration, the gate stack can be simply located above the channel region. In some embodiments, the channel region can comprise a Group IV semiconductor material (eg, Si, GiGe, Ge), a III-V semiconductor material (eg, GaAs, InGaAs, InAs), and/or any other suitable material. As will be clear from this description. In some embodiments, the semiconductor material included in the channel region can be native to the substrate 200 and/or the semiconductor material included in the channel region can be non-native to the substrate 200 (eg, such that it is replaced Change material or material formed on substrate 200). Recall that in certain embodiments, the channel region can be doped (eg, in any suitable n-type and/or p-type dopant) or intrinsic/rated undoped, depending on the particular group state.
注意：該些S/D區係相鄰於該通道區之任一側，如可見於圖2G及3中，舉例而言。更明確地，該些S/D區係直接地鄰接該通道區，以致其沒有中間層介於該些S/D區的任一者與該通道區之間，於範例實施例中。然而，本發明不應被如此限制。亦注意：使用文中所述之技術所形成的 電晶體之組態/幾何可主要地根據該電晶體之個別通道區的形狀/組態而被描述，舉例而言。例如，奈米線(或奈米帶或GAA)電晶體可被稱為如此，因為其包括一或更多奈米線(或奈米帶)於該電晶體之該通道區中。然而，電晶體類型(例如，MOSFET、FFFET、TFET或其他適當的類型)可根據源極、汲極、和通道區之摻雜及/或操作方案而被描述，且因此那些個別區可被用以判定既定電晶體之類型或分類，舉例而言。此針對MOSFET相對於TFET電晶體是特別為真的，由於其可結構性地極類似(或相同)，但包括不同的摻雜方案(例如，對於MOSFET之p-n-p或n-p-n相對於對於TFET之p-i-n或n-i-p)。Note that the S/D zones are adjacent to either side of the channel zone, as can be seen in Figures 2G and 3, for example. More specifically, the S/D regions are directly adjacent to the channel region such that there is no intermediate layer between any of the S/D regions and the channel region, in an exemplary embodiment. However, the invention should not be so limited. It is also noted that the configuration/geometry of the transistor formed using the techniques described herein can be primarily described in terms of the shape/configuration of the individual channel regions of the transistor, for example. For example, a nanowire (or nanobelt or GAA) transistor can be referred to as it includes one or more nanowires (or nanoribbons) in the channel region of the transistor. However, transistor types (eg, MOSFETs, FFFETs, TFETs, or other suitable types) can be described in terms of doping and/or operational schemes of source, drain, and channel regions, and thus those individual regions can be used To determine the type or classification of a given transistor, for example. This is especially true for MOSFETs relative to TFET transistors, since they can be structurally very similar (or identical), but include different doping schemes (eg, for pnp or npn of MOSFETs versus pins for TFETs or Nip).
繼續履行116閘極堆疊處理，在該虛擬閘極已被移除且任何所欲的通道區處理已被履行之後，最終閘極堆疊可被形成，依據一實施例。於此範例實施例中，最終閘極堆疊包括閘極電介質層282和閘極284，如圖2G中所示。閘極電介質層282可包括(例如)任何適當的氧化物(諸如二氧化矽)、高k閘極電介質材料、及/或任何其他適當的材料，如根據此說明書所將清楚明白者。高k閘極電介質材料的範例包括(例如)氧化鉿、氧化鉿矽、氧化鑭、氧化鑭鋁、氧化鋯、氧化鋯矽、氧化鉭、氧化鈦、氧化鋇鍶鈦、氧化鋇鈦、氧化鍶鈦、氧化釔、氧化鋁、氧化鉛鈧鉭、及鈮酸鉛鋅，僅提供一些範例。於某些實施例中，退火程序可被執行在閘極電介質層282上以增進其品質，當使用高k材料時。閘極284(或閘極電極)可包括寬廣範圍的材料，諸如 多晶矽、氮化矽、碳化矽、或者各種適當的金屬或金屬合金，諸如鋁(Al)、鎢(W)、鈦(Ti)、鉭(Ta)、銅(Cu)、氮化鈦(TiN)、或氮化鉭(TaN)，舉例而言。於某些實施例中，閘極電介質層282及/或閘極284可包括二或更多材料層之多層結構，舉例而言。於某些實施例中，閘極電介質層282及/或閘極284可包括漸變(例如，遞增及/或遞減)該特徵之至少一部分中的一或更多材料之內容/濃度。額外層可存在於該最終閘極堆疊中，於某些實施例中，諸如一或更多工作函數層或其他適當層，舉例而言。注意：雖然閘極電介質層282僅被顯示於閘極284之下(於圖2G之範例實施例中)，但於其他實施例中，閘極電介質層282亦可存在於閘極284之一或兩側上，以致其閘極電介質層282係介於閘極284與間隔物250之間，舉例而言。Continuing to perform the 116 gate stacking process, after the virtual gate has been removed and any desired channel region processing has been performed, a final gate stack can be formed, in accordance with an embodiment. In this exemplary embodiment, the final gate stack includes a gate dielectric layer 282 and a gate 284, as shown in Figure 2G. Gate dielectric layer 282 can comprise, for example, any suitable oxide (such as hafnium oxide), a high-k gate dielectric material, and/or any other suitable material, as will be apparent from this disclosure. Examples of high-k gate dielectric materials include, for example, hafnium oxide, hafnium oxide, tantalum oxide, hafnium oxide, zirconium oxide, hafnium oxide, hafnium oxide, titanium oxide, niobium oxide, niobium oxide, niobium oxide. Titanium, cerium oxide, aluminum oxide, lead lanthanum oxide, and lead and zinc citrate provide only a few examples. In some embodiments, an annealing process can be performed on the gate dielectric layer 282 to enhance its quality when high k materials are used. The gate 284 (or gate electrode) may comprise a wide range of materials such as polysilicon, tantalum nitride, tantalum carbide, or various suitable metals or metal alloys such as aluminum (Al), tungsten (W), titanium (Ti). , tantalum (Ta), copper (Cu), titanium nitride (TiN), or tantalum nitride (TaN), for example. In some embodiments, gate dielectric layer 282 and/or gate 284 can comprise a multilayer structure of two or more material layers, for example. In some embodiments, gate dielectric layer 282 and/or gate 284 can include ramping (eg, incrementing and/or decrementing) the content/concentration of one or more materials in at least a portion of the feature. Additional layers may be present in the final gate stack, in some embodiments, such as one or more work function layers or other suitable layers, for example. Note that although the gate dielectric layer 282 is only shown under the gate 284 (in the exemplary embodiment of FIG. 2G), in other embodiments, the gate dielectric layer 282 may also be present in one of the gates 284 or On both sides, its gate dielectric layer 282 is interposed between the gate 284 and the spacer 250, for example.
圖1之方法100繼續履行118 S/D接點處理以形成圖2I之範例所得結構，依據一實施例。如圖2H中所示，S/D接點處理首先包括接觸溝槽處理以形成接觸溝槽290。此處理可包括任何適當的技術，諸如一或更多濕式及/或乾式蝕刻程序，以形成接觸溝槽290於S/D區之上的ILD層270中。如根據本說明書可理解：碳基蝕刻停止層266(當存在時)之存在可協助防止S/D接觸溝槽處理不當地從S/D區(例如，區261及/或265)移除材料及/或可協助防止下方S/D材料被除此以外不當地處理(諸如不利地影響材料之品質或性質)。在圖2H之S/D接觸溝槽290已被形成之後，S/D接點292被形成以接觸該些S/D區之各者，如圖2I中所示，於此 範例實施例中。於某些實施例中，S/D接點292可使用任何適當的技術而被形成，諸如沈積金屬或金屬合金(或其他適當的導電材料)於接觸溝槽290中。於某些實施例中，S/D接點292形成可包括矽化(silicidation)、鍺化(germinidatin)、及/或退火程序，舉例而言。於某些實施例中，S/D接點292可包括鋁或鎢，雖然可使用任何適當的導電通孔金屬或合金，諸如銀、鎳-鉑、或鎳-鋁，舉例而言。於某些實施例中，S/D接點292之一或更多者可包括電阻減少金屬及接觸插塞金屬、或僅接觸插塞，舉例而言。範例接觸電阻減少金屬包括(例如)鎳、鋁、鈦、金、金-鍺、鎳-鉑、或鎳鋁、及/或其他此類電阻減少金屬或合金。範例接觸插塞金屬包括(例如)鋁、銅、鎳、鉑、鈦、或鎢、或其合金，雖然可使用任何適當導電的接觸金屬或合金。於某些實施例中，額外層可存在於S/D接點292區中，諸如黏合層(例如，氮化鈦)及/或內襯或障壁層(例如，氮化鉭)，假如想要的話。The method 100 of FIG. 1 continues to perform 118 S/D contact processing to form the resulting structure of the example of FIG. 2I, in accordance with an embodiment. As shown in FIG. 2H, the S/D contact process first includes a contact trench process to form contact trenches 290. This processing may include any suitable technique, such as one or more wet and/or dry etch procedures, to form contact trenches 290 in the ILD layer 270 over the S/D regions. As can be appreciated from the present description, the presence of the carbon-based etch stop layer 266 (when present) can assist in preventing S/D contact trench processing from improperly removing material from the S/D regions (eg, regions 261 and/or 265). And/or may assist in preventing the underlying S/D material from being disposed of improperly (such as adversely affecting the quality or properties of the material). After the S/D contact trenches 290 of Figure 2H have been formed, S/D contacts 292 are formed to contact each of the S/D regions, as shown in Figure 2I, in this exemplary embodiment. In some embodiments, S/D contacts 292 can be formed using any suitable technique, such as depositing a metal or metal alloy (or other suitable conductive material) into contact trenches 290. In some embodiments, S/D contact 292 formation can include silicidation, germindatin, and/or annealing procedures, for example. In some embodiments, S/D contact 292 can comprise aluminum or tungsten, although any suitable conductive via metal or alloy can be used, such as silver, nickel-platinum, or nickel-aluminum, for example. In some embodiments, one or more of the S/D contacts 292 may include a resistance reducing metal and a contact plug metal, or only a contact plug, for example. Exemplary contact resistance reduction metals include, for example, nickel, aluminum, titanium, gold, gold-bismuth, nickel-platinum, or nickel aluminum, and/or other such resistance reducing metals or alloys. Exemplary contact plug metals include, for example, aluminum, copper, nickel, platinum, titanium, or tungsten, or alloys thereof, although any suitably conductive contact metal or alloy can be used. In some embodiments, additional layers may be present in the S/D contact 292 region, such as an adhesive layer (eg, titanium nitride) and/or a liner or barrier layer (eg, tantalum nitride), if desired if.
圖2I’闡明圖2I之範例結構，包括圖2D'之垂直隔離結構230，依據一實施例。記得程序110是選擇性的，以致其垂直隔離結構230無須被包括於該IC結構中。然而，於圖2I'之範例結構中，存在兩個此類結構230。垂直隔離結構230可為針對IC製造期間所使用之蝕刻程序的蝕刻阻劑(例如，藉由含入蝕刻抵抗材料，諸如碳)，且因此，其可進一步隔離單一鰭或鰭之群組。例如，如圖2I’中所示，垂直隔離結構230係將三個最右邊S/D區自IC結構之其他部分 (諸如最左邊S/D區)隔離。此一組態可為理想的，其中(例如)那三個最右邊S/D區均為相同的極性(例如，均為n型或均為p型)，藉此容許那些相同極性的S/D區被自其他極性的S/D區(諸如假如最左邊S/D區為n型與p型之另一極性)隔離。垂直隔離結構230亦可容許相鄰S/D區及/或S/D接點之材料合併在一起，藉此提供障壁，其中想要防止該S/D區及/或S/D接點材料合併或接觸不想要的材料(諸如另一極性的S/D區或接點)。垂直隔離結構230之各種優點將根據本說明書而清楚明白，且此類垂直隔離結構230(當存在時)可被形成並包括於IC結構中如所欲。2I' illustrates the example structure of FIG. 2I, including the vertical isolation structure 230 of FIG. 2D', in accordance with an embodiment. It is to be remembered that the program 110 is selective such that its vertical isolation structure 230 need not be included in the IC structure. However, in the example structure of Figure 2I', there are two such structures 230. The vertical isolation structure 230 can be an etch resist for an etch process used during IC fabrication (eg, by incorporating an etch resistant material, such as carbon), and thus, can further isolate a single fin or group of fins. For example, as shown in Figure 2I', the vertical isolation structure 230 isolates the three rightmost S/D regions from other portions of the IC structure, such as the leftmost S/D region. This configuration may be desirable, where, for example, the three rightmost S/D regions are all of the same polarity (eg, both n-type or p-type), thereby allowing those S/s of the same polarity. The D zone is isolated from other polarity S/D zones (such as if the leftmost S/D zone is n-type and the other polarity of the p-type). The vertical isolation structure 230 can also allow materials of adjacent S/D regions and/or S/D contacts to be merged together, thereby providing a barrier in which it is desired to prevent the S/D region and/or S/D contact material. Combine or touch unwanted materials (such as S/D regions or joints of another polarity). The various advantages of the vertical isolation structure 230 will be apparent from this description, and such vertical isolation structures 230 (when present) can be formed and included in the IC structure as desired.
圖1之方法100繼續完成120積體電路(IC)處理，如所欲，依據某些實施例。用以完成IC之此類額外處理可包括後端或後段製程(BEOL)處理，用以形成一或更多金屬化層及/或用以互連所形成的電晶體裝置，舉例而言。任何其他適當的處理可被履行，如根據此說明書所將清楚明白者。注意：方法100之程序102-120被顯示為係在圖1中之特定順序中，以利說明。然而，程序102-120之一或更多者可以不同的順序被履行或可完全不被履行。例如，方盒110為選擇性程序，假如不想要該蝕刻抵抗垂直結構的話，則其無須被履行。再者，方盒112為選擇性程序，其無須被履行於其使用閘極最先程序流程之實施例中，舉例而言。此外，當程序116被履行時此一閘極最先程序流程會改變，如所示係使用替代或選擇性閘極最先流100’，藉此最終閘極堆疊被履行116在履行114 S/D處理之前。關於 方法100之各種變異及文中所述之技術將根據本說明書而清楚明白。注意：該些技術可被用以形成一或更多電晶體裝置，包括以下之任一者：場效電晶體(FET)、費米過濾器FET(FFFET)、穿隧FET(TFET)、平面組態、鰭式組態(例如，fin-FET、三閘極、雙閘極)、及/或奈米線(或奈米帶或環繞式閘極)組態(具有任何數目的奈米線)。此外，所形成的裝置可包括p型電晶體裝置(例如，p-FFFET或p-TFET)及/或n型電晶體裝置(例如，n-FFFET或n-TFET)。再者，該些裝置可包括互補式MOS(CMOS)裝置或量子裝置(少量到單一個電子)，僅提供額外範例。The method 100 of FIG. 1 continues with 120 integrated circuit (IC) processing, as desired, in accordance with certain embodiments. Such additional processing to complete the IC may include back end or back end of line (BEOL) processing to form one or more metallization layers and/or to interconnect the formed transistor devices, for example. Any other appropriate processing may be performed as will be apparent from the description. Note that the procedures 102-120 of method 100 are shown as being in the particular order of FIG. 1 for illustrative purposes. However, one or more of the programs 102-120 may be performed in a different order or may not be performed at all. For example, the square box 110 is an optional procedure that does not need to be performed if the etch is not desired to resist vertical structures. Again, the box 112 is an optional procedure that does not have to be fulfilled in its embodiment using the gate first program flow, for example. In addition, the first program flow of this gate will change when the program 116 is fulfilled, as shown using an alternate or selective gate first stream 100', whereby the final gate stack is fulfilled 116 in fulfillment 114 S/ Before D is processed. The various variations of the method 100 and the techniques described herein will be apparent from the description. Note: These techniques can be used to form one or more transistor devices, including any of the following: Field Effect Transistors (FETs), Fermi Filter FETs (FFFETs), Tunneling FETs (TFETs), planes Configuration, fin configuration (eg, fin-FET, triple gate, double gate), and/or nanowire (or nanobelt or wraparound gate) configuration (with any number of nanowires) ). Further, the device formed may include a p-type transistor device (eg, a p-FFFET or p-TFET) and/or an n-type transistor device (eg, an n-FFFET or an n-TFET). Furthermore, the devices may include complementary MOS (CMOS) devices or quantum devices (small to single electrons), providing only additional examples.
圖3闡明沿著圖2I之IC結構的一鰭所取(明確地係沿著A-A平面所取)之範例橫斷面視圖，依據本發明之一些實施例。圖3被提供以協助闡明圖2I之結構的不同組件。因此，關於各類似地編號的特徵之先前相關描述係同等地可應用於圖3。然而，注意：圖2I及3中所顯示之特徵的尺寸可不同，以利說明。亦注意：某些變異發生於該些結構之間，諸如間隔物250及S/D接點292(一路延伸至間隔物250)之形狀，舉例而言，如圖3中所示。圖3'亦闡明對於其中碳基蝕刻停止層266僅被形成於該些S/D區之一的技術之變異，及明確地於此範例實施例中，僅於汲極區265，以致其碳基蝕刻停止層266不存在於源極區261’與其相應的S/D接點292之間，如圖所示。圖3’闡明圖3之IC結構，包括陰影及圖案化以協助視覺化該材料和該些S/D區之摻雜方案，依據本發明之一些實施例。關於各類似地編號的特 徵之先前相關描述係同等地可應用於圖3’。然而，注意：於圖3'之範例結構中，雙層源極區261’(包括第一層262’和第二層264’)、和汲極區265’各具有陰影及圖案化以協助視覺地表示相對包括的材料及摻雜方案，依據某些實施例。3 illustrates an example cross-sectional view taken along a fin of the IC structure of FIG. 2I (definitely taken along the A-A plane), in accordance with some embodiments of the present invention. Figure 3 is provided to assist in clarifying the different components of the structure of Figure 2I. Accordingly, previous related descriptions of various similarly numbered features are equally applicable to FIG. Note, however, that the dimensions of the features shown in Figures 2I and 3 can vary for illustrative purposes. It is also noted that certain variations occur between the structures, such as the spacer 250 and the S/D contact 292 (which extends all the way to the spacer 250), for example, as shown in FIG. Figure 3' also illustrates variations in the technique in which the carbon-based etch stop layer 266 is formed only in one of the S/D regions, and specifically in this exemplary embodiment, only in the drain region 265, such that its carbon The etch stop layer 266 is not present between the source region 261' and its corresponding S/D junction 292 as shown. Figure 3' illustrates the IC structure of Figure 3, including shading and patterning to aid in visualizing the material and the doping scheme of the S/D regions, in accordance with some embodiments of the present invention. Previous related descriptions of the various similarly numbered features are equally applicable to Figure 3'. Note, however, that in the example structure of FIG. 3', the dual layer source regions 261' (including the first layer 262' and the second layer 264'), and the drain regions 265' each have a shadow and pattern to aid in vision. Ground refers to the relatively included materials and doping schemes, in accordance with certain embodiments.
例如，於圖3'中，源極區第一層262’包括具有正斜率之對角線圖案化(亦即，從左下至右上方向)以視覺地指示其包括相對於源極區第二層264’和汲極區265’兩者之不同類型的摻雜物，其兩者均包括具有負斜率之對角線圖案化(亦即，從左上至右下方向)，依據某些實施例。於某些此類實施例中，第一層262’包括p型與n型摻雜物之一，而第二層264’和汲極區265’包括相對於該第一層262’的p型與n型摻雜物之另一者，以致其262’與264'/265'之一包括p型摻雜物而另一包括n型摻雜物。再者，第二層264’包括陰影以指示其包括相對於第一層262’和汲極區265’之不同的半導體材料，依據某些實施例。於某些此類實施例中，第一層262’和汲極區265’可因此包括相同的半導體材料；然而，本發明無須被如此限制，以致其可包括不同的半導體材料，於其他實施例中。範例材料組態及摻雜方案將參考圖4及5而被描述於文中。記得：針對TFET裝置，源極區261’可僅包括類似於汲極區265’之組態的一主要部分(而非如圖3'中所示之雙層結構)，其中源極區261’包括相對於汲極區之不同的半導體材料且包括不同的摻雜物類型。亦注意：該些技術可被應 用於其他適當的電晶體類型。例如，MOSFET裝置(例如，包括n-p-n或p-n-p摻雜方案)可受益自包括不同半導體材料於S/D區中，如根據此說明書所將清楚明白者。各種變異及組態將根據此說明書而清楚明白。For example, in FIG. 3', the source region first layer 262' includes a diagonal patterning with a positive slope (ie, from the lower left to the upper right direction) to visually indicate that it includes a second layer relative to the source region. Different types of dopants for both 264' and drain region 265', both of which include diagonal patterning with a negative slope (i.e., from top left to bottom right), in accordance with certain embodiments. In some such embodiments, the first layer 262' includes one of p-type and n-type dopants, and the second layer 264' and the drain region 265' include a p-type relative to the first layer 262' The other of the n-type dopants, such that one of its 262' and 264'/265' includes a p-type dopant and the other includes an n-type dopant. Further, the second layer 264' includes shading to indicate that it includes a different semiconductor material relative to the first layer 262' and the drain region 265', in accordance with certain embodiments. In some such embodiments, the first layer 262' and the drain region 265' may thus comprise the same semiconductor material; however, the invention need not be so limited that it may comprise different semiconductor materials, in other embodiments in. Example material configurations and doping schemes are described herein with reference to Figures 4 and 5. Recall that for a TFET device, the source region 261' may only include a major portion of the configuration similar to the drain region 265' (rather than the two-layer structure as shown in Figure 3'), where the source region 261' It includes different semiconductor materials relative to the drain regions and includes different dopant types. Also note that these techniques can be applied to other suitable transistor types. For example, MOSFET devices (eg, including n-p-n or p-n-p doping schemes) may benefit from including different semiconductor materials in the S/D region, as will be apparent from this description. Various variations and configurations will be apparent from this description.
範例FFFET能帶圖Example FFFET band diagram
圖4及5個別地闡明範例p型及n型FFFET能帶圖，針對包括使用不同半導體材料之S/D區的FFFET裝置，依據某些實施例。注意：來自圖2I及3之結構的特徵被包括於概略結構中之能帶圖底下，以顯示該些帶圖之不同部分並闡明電流可如何流經FFFET裝置。然而，針對各特徵之相關數字的第一數字已被改變以匹配相應圖之數字，由於圖4及5中之特徵係參考特定材料及摻雜組態而被描述，如圖所示。因此，關於那些類似特徵之先前相關描述係同等地可應用於圖4及5之底部上所顯示的概略結構。如亦可理解者：圖4及5包括圖3'之陰影及圖案化，以協助視覺地識別介於該些S/D區之間的材料和摻雜差異。Figures 4 and 5 individually illustrate exemplary p-type and n-type FFFET energy band diagrams for FFFET devices including S/D regions using different semiconductor materials, in accordance with certain embodiments. Note that features from the structures of Figures 2I and 3 are included underneath the energy band diagram in the schematic structure to show different portions of the band diagrams and to illustrate how current can flow through the FFFET device. However, the first number for the associated number of features has been changed to match the number of the corresponding figure, since the features in Figures 4 and 5 are described with reference to particular materials and doping configurations, as shown. Accordingly, previous related descriptions of those similar features are equally applicable to the schematic structures shown on the bottom of Figures 4 and 5. As can also be appreciated, Figures 4 and 5 include the shading and patterning of Figure 3' to assist in visually identifying material and doping differences between the S/D regions.
為了協助描述，圖4之範例p型FFFET概略結構包括：從左至右(連同所包括的材料)，S/D接點492(金屬或金屬合金)、碳基蝕刻停止層466、源極區第一層462(n型Si)、源極區第二層464(p型SiGe)、通道區406(i型Si)、汲極區465(p型Si)、碳基蝕刻停止層466、及S/D接點492(金屬或金屬合金)。如可被理解：第一S/D接點492為明確地源極區261接點，而第二S/D接點492為明確地汲極區265接點， 於此範例實施例中。此外，介於該些S/D區兩者與其相應接點之間的碳基蝕刻停止層466係使用相同的數字(466)來識別以便於參考。然而，記得(於某些實施例中)那些分離的層466可被形成於程序流程期間之不同時刻、具有不同的半導體材料、具有不同類型的摻雜物(例如，其中一部分為n型摻雜的而另一為p型摻雜的)、具有不同的摻雜物濃度、具有碳合金之不同的濃度、及/或具有不同的組態(例如，不同的幾何、電晶體裝置中之不同的相對高度，等等)，依據某些實施例。再者，圖5之範例n型FFFET概略結構包括：從左至右(連同所包括的材料)，S/D接點592(金屬或金屬合金)、碳基蝕刻停止層566、源極區第一層562(p型GaAs)、源極區第二層564(n型InGaAs)、通道區506(i型GaAs)、汲極區565(n型GaAs)、碳基蝕刻停止層566、及S/D接點592(金屬或金屬合金)。To assist in the description, the exemplary p-type FFFET of FIG. 4 includes: from left to right (along with the materials included), S/D contacts 492 (metal or metal alloy), carbon-based etch stop layer 466, source regions. a first layer 462 (n-type Si), a source region second layer 464 (p-type SiGe), a channel region 406 (i-type Si), a drain region 465 (p-type Si), a carbon-based etch stop layer 466, and S/D contact 492 (metal or metal alloy). As can be appreciated, the first S/D contact 492 is an unambiguous source region 261 junction and the second S/D contact 492 is an unambiguous drain region 265 junction, in this example embodiment. In addition, the carbon-based etch stop layer 466 between the two S/D regions and their respective contacts is identified using the same number (466) for ease of reference. However, it is recalled (in some embodiments) that separate layers 466 can be formed at different times during the program flow, have different semiconductor materials, have different types of dopants (eg, some of which are n-type doped And the other is p-doped), have different dopant concentrations, have different concentrations of carbon alloys, and/or have different configurations (eg, different geometries, different in the crystal device) Relative height, etc.), in accordance with certain embodiments. Furthermore, the exemplary n-type FFFET of FIG. 5 includes: from left to right (along with the materials included), S/D contacts 592 (metal or metal alloy), carbon-based etch stop layer 566, source region A layer 562 (p-type GaAs), a source region second layer 564 (n-type InGaAs), a channel region 506 (i-type GaAs), a drain region 565 (n-type GaAs), a carbon-based etch stop layer 566, and S /D contact 592 (metal or metal alloy).
於圖4及5之範例實施例中，源極區461和561包括異質接面結構，由於源極區第一層462/562包括相對於源極區第二層464/564之不同的半導體材料(例如，Si相較於SiGe及GaAs相較於InGaAs，個別地)。再者，源極區461/561包括相對於汲極區465/565之不同的半導體材料，個別地，於範例實施例中。例如，使用圖4之範例p型FFFET裝置，SiGe被包括於源極區461中(明確地，於源極區之第二層464中)，而Si是汲極區中之唯一半導體材料，於範例實施例中。因此，其包括不同的半導體材料。此外，源極區461和561包括雙層結構，其包括p-n或n-p二極體組態，如 根據本說明書可理解者。注意：由於源極區中之二極體，FFFET裝置有時被稱為隧道源極MOSFET。再者，如針對圖3'所解釋，於圖4及5之範例FFFET裝置中，源極區第二層464/564包括如其個別汲極區465/565之相同類型的摻雜(例如，兩者均p型及兩者均n型，個別地)，其為相對於個別源極區第一層462/562之n型與p型的另一者，以致其圖4之範例p型FFFET結構包括np-i-p摻雜方案而圖5之範例n型FFFET結構包括pn-i-n摻雜方案。然而，記得其通道區可被摻雜，以致其p型FFFET裝置可包括np-n-p摻雜方案而n型FFFET裝置可包括pn-p-n摻雜方案，依據某些實施例。In the exemplary embodiments of FIGS. 4 and 5, the source regions 461 and 561 comprise a heterojunction structure, since the source region first layer 462/562 includes a different semiconductor material than the source region second layer 464/564. (For example, Si phase is compared to SiGe and GaAs compared to InGaAs, individually). Moreover, source regions 461/561 include different semiconductor materials relative to drain regions 465/565, individually, in the exemplary embodiments. For example, using the example p-type FFFET device of FIG. 4, SiGe is included in source region 461 (specifically in second layer 464 of the source region), and Si is the only semiconductor material in the drain region, In an example embodiment. Therefore, it includes different semiconductor materials. In addition, source regions 461 and 561 include a two-layer structure that includes a p-n or n-p diode configuration, as will be understood in light of this description. Note: Due to the diodes in the source region, FFFET devices are sometimes referred to as tunnel source MOSFETs. Furthermore, as explained with respect to FIG. 3', in the example FFFET device of FIGS. 4 and 5, the source region second layer 464/564 includes the same type of doping as its individual drain regions 465/565 (eg, two The p-type and both are n-type, individually), which is the other of the n-type and p-type of the first layer 462/562 of the individual source regions, such that the example p-type FFFET structure of FIG. An np-ip doping scheme is included and the example n-type FFFET structure of FIG. 5 includes a pn-in doping scheme. However, it is recalled that its channel region can be doped such that its p-type FFFET device can include an np-n-p doping scheme and the n-type FFFET device can include a pn-p-n doping scheme, in accordance with certain embodiments.
繼續圖4及5之概略FFFET結構的能帶圖，如所示於那些圖形中，其各包括針對裝置之關狀態400/500及開狀態401/501的能帶圖，個別地。此外，能量(E)係增加於朝上方向(針對所有圖形)，如由各圖之左側上的箭號所示。再者，導通帶邊緣(Ec)及價帶邊緣(Ev)均被顯示，如描繪關鍵電子能量位準所常見的。如亦可理解：帶隙為介於Ec與Ev之間的能量差異(以電子伏特)，如本技術中所已知者。相應S/D及通道區被對齊與能帶圖(如圖所示)以闡明從文中所述之技術及結構所取得的優點。注意：並未提供明確的帶圖和值；然而，從文中所述之技術及結構所取得的優點可使用這些範例能帶圖而被瞭解，如將為清楚明白者。Continuing with the energy band diagrams of the schematic FFFET structures of Figures 4 and 5, as shown in those figures, each includes an energy band diagram for the off state 400/500 and the on state 401/501 of the device, individually. In addition, the energy (E) is increased in the upward direction (for all figures) as indicated by the arrows on the left side of each figure. Furthermore, the conduction band edge (Ec) and the valence band edge (Ev) are both displayed, as is common for depicting key electronic energy levels. As can also be understood, the band gap is the energy difference (in electron volts) between Ec and Ev, as is known in the art. The corresponding S/D and channel regions are aligned and energy band diagrams (as shown) to illustrate the advantages derived from the techniques and structures described herein. It is noted that the explicit drawings and values are not provided; however, the advantages obtained from the techniques and structures described herein can be understood using these examples, as will be apparent.
參考圖4之範例p型FFFET裝置，可理解：藉由包括SiGe於異質接面組態中之源極區第二層464中(亦即，相異的結晶半導體材料組態)，由於第一層462包括Si，所以可 獲得相對於同質接面組態之針對該層464的Ev之增加(例如，假如464將包括Si而非SiGe，以致該些層包括相同或類似的半導體材料)。相對於此一假設性同質接面Ev(以虛線表示)之Ev的增加被表示為差量Ev且提供在該462/464層介面上增加針對電荷載子之障壁高度的優點，藉此減少關狀態漏電(特別針對這些FFFET裝置，其包括在所有條件下穿隧通過雙層源極隧道二極體之載子；或其他裝置，其係經由帶至帶穿隧而操作)。於某些此類實施例中，第二層464中所包括之SiGe材料中的Ge濃度可於10-50百分比的範圍中，以提供此類帶隙工程優點、或任何其他適當的Ge濃度，如根據此說明書所將清楚明白者。此外，為了描述之完整，於關狀態400期間，通道區電位可阻擋低能量載子，如可被理解者。再者，p-FFFET裝置仍可有效地操作於開狀態401，如亦可被理解者。Referring to the example p-type FFFET device of FIG. 4, it can be understood that by including SiGe in the source layer second layer 464 in the heterojunction configuration (ie, the dissimilar crystalline semiconductor material configuration), due to the first Layer 462 includes Si, so an increase in Ev for the layer 464 relative to the homojunction configuration can be obtained (e.g., if 464 would include Si instead of SiGe, such layers include the same or similar semiconductor materials). The increase in Ev relative to this hypothetical homojunction Ev (indicated by the dashed line) is expressed as the difference Ev and provides the advantage of increasing the barrier height for the charge carriers on the 462/464 layer interface, thereby reducing the State leakage (particularly for these FFFET devices, including carriers that tunnel through dual-layer source tunnel diodes under all conditions; or other devices that operate via band-to-band tunneling). In certain such embodiments, the Ge concentration in the SiGe material included in the second layer 464 can be in the range of 10-50 percent to provide such band gap engineering advantages, or any other suitable Ge concentration, As will be clear from this description. Moreover, for the sake of completeness of the description, during the off state 400, the channel region potential can block low energy carriers, as can be understood. Moreover, the p-FFFET device can still operate effectively in the on state 401, as can be understood.
圖5之範例n-FFFET裝置包括類似的原理，除了其藉由包括InGaAs於異質接面組態中之源極區第二層564中(相對於層564包括GaAs於同質接面組態中)，可獲得相對於同質接面組態之針對該層564的Ec之減少，其針對n型裝置是有利的。相對於此一假設性同質接面Ec(以虛線表示)之Ec的減少被表示為差量Ec且提供在該562/564層介面上減少針對載子之障壁高度(雖然，以相對於圖4中之反轉方式)的優點，藉此減少關狀態漏電(再次地，特別針對穿隧裝置，諸如FFFET裝置，其包括在所有條件下穿隧之載子)。於某些此類實施例中，第二層564中所包括之InGaAs材料 中的In濃度可於5-70百分比的範圍中，以提供此類帶隙工程優點、或任何其他適當的In濃度，如根據此說明書所將清楚明白者。此外，再次地，於關狀態500期間，通道區電位可阻擋低能量載子，如可被理解者。再者，n-FFFET裝置仍可有效地操作於開狀態501，如亦可被理解者。注意：於圖4及5兩者之情況中，其產生異質接面源極區結構之不同材料具有比源極區中所包括之其他半導體材料更小的帶隙(例如，SiGe具有比Si更小的帶隙而InGaAs具有比GaAs更小的帶隙)。因此，於某些實施例中，使用文中所述之技術所形成的電晶體之源極區中所包括的半導體材料可具有較小的帶隙、較高的價帶邊緣(Ev)、及/或較低的導通帶邊緣(Ec)，相對於源極區中所包括之其他半導體材料(例如，雙層結構中之另一層的材料)與汲極區中所包括之半導體材料的一或二者。各種變異及組態將根據此說明書而清楚明白。The example n-FFFET device of FIG. 5 includes a similar principle except that it includes a source region second layer 564 in a heterojunction configuration including InGaAs (with respect to layer 564 including GaAs in a homojunction configuration) A reduction in Ec for the layer 564 relative to the homojunction configuration can be obtained, which is advantageous for n-type devices. The decrease in Ec relative to this hypothetical homojunction Ec (shown in phantom) is expressed as the difference Ec and provides a reduction in the barrier height for the carrier at the 562/564 layer interface (although, relative to Figure 4) The advantage of the inversion mode, thereby reducing the off-state leakage (again, especially for tunneling devices, such as FFFET devices, which include carriers that tunnel under all conditions). In certain such embodiments, the In concentration in the InGaAs material included in the second layer 564 can range from 5 to 70 percent to provide such bandgap engineering advantages, or any other suitable In concentration, As will be clear from this description. Moreover, again, during the off state 500, the channel zone potential can block low energy carriers, as can be understood. Furthermore, the n-FFFET device can still operate effectively in the on state 501, as can be understood. Note that in the case of both Figures 4 and 5, the different materials that produce the heterojunction source region structure have a smaller bandgap than the other semiconductor materials included in the source region (eg, SiGe has more than Si A small band gap and InGaAs has a smaller band gap than GaAs). Thus, in certain embodiments, the semiconductor material included in the source region of the transistor formed using the techniques described herein may have a smaller band gap, a higher valence band edge (Ev), and / Or a lower conduction band edge (Ec), relative to one or more of the other semiconductor materials included in the source region (eg, another layer of the two-layer structure) and the semiconductor material included in the drain region By. Various variations and configurations will be apparent from this description.
範例系統Sample system
圖6闡明一種以積體電路結構及/或電晶體裝置所實施的計算系統1000，該些結構或裝置係使用文中所揭露之技術來形成，依據本發明之一些實施例。如圖可見，計算系統1000包含主機板1002。主機板1002可包括數個組件，包括(但不限定於)處理器1004及至少一通訊晶片1006，其各可被實體地及電氣地耦合至主機板1002、或否則被整合於其中。如將理解者，主機板1002可為(例如)任何印刷電路 板，無論是主機板或安裝於主機板上之子板或者為系統1000之唯一板，等等。6 illustrates a computing system 1000 implemented in an integrated circuit structure and/or an optoelectronic device that is formed using the techniques disclosed herein, in accordance with some embodiments of the present invention. As can be seen, computing system 1000 includes a motherboard 1002. The motherboard 1002 can include a number of components including, but not limited to, the processor 1004 and at least one communication chip 1006, each of which can be physically and electrically coupled to the motherboard 1002, or otherwise integrated therein. As will be appreciated, the motherboard 1002 can be, for example, any printed circuit board, whether it be a motherboard or a daughter board mounted on a motherboard or the only board of the system 1000, and the like.
根據其應用，計算裝置1000可包括一或更多其他組件，其可被或可不被實體地及電氣地耦合至主機板1002。這些其他組件可包括(但不限定於)揮發性記憶體(例如，DRAM)、非揮發性記憶體(例如，ROM)、圖形處理器、數位信號處理器、密碼處理器、晶片組、天線、顯示器、觸控螢幕顯示器、觸控螢幕控制器、電池、音頻編碼解碼器、視頻編碼解碼器、功率放大器、全球定位系統(GPS)裝置、羅盤、加速計、迴轉儀、揚聲器、相機、及大容量儲存裝置(諸如硬碟機、光碟(CD)、數位光碟(DVD)，等等)。計算系統1000中所包括之任何組件可包括一或更多積體電路結構或裝置，該些結構或裝置係使用依據一範例實施例之揭露技術來形成。於某些實施例中，多重功能可被整合入一或更多晶片(例如，注意：通訊晶片1006可為處理器1004之部分或者被整合入處理器1004)。Depending on its application, computing device 1000 may include one or more other components that may or may not be physically and electrically coupled to motherboard 1002. These other components may include, but are not limited to, volatile memory (eg, DRAM), non-volatile memory (eg, ROM), graphics processors, digital signal processors, cryptographic processors, chipsets, antennas, Display, touch screen display, touch screen controller, battery, audio codec, video codec, power amplifier, global positioning system (GPS) device, compass, accelerometer, gyroscope, speaker, camera, and large Capacity storage devices (such as hard disk drives, compact discs (CDs), digital compact discs (DVDs), etc.). Any of the components included in computing system 1000 can include one or more integrated circuit structures or devices that are formed using the disclosed techniques in accordance with an example embodiment. In some embodiments, multiple functions may be integrated into one or more wafers (eg, note that communication chip 1006 may be part of processor 1004 or integrated into processor 1004).
通訊晶片1006致能無線通訊，以供資料之轉移至及自計算系統1000。術語「無線」及其衍生詞可被用以描述電路、裝置、系統、方法、技術、通訊頻道，等等，其可藉由使用透過非固體媒體之經調變的電磁輻射來傳遞資料。該術語並未暗示其相關裝置不含有任何佈線，雖然於某些實施例中其可能不含有。通訊晶片1006可實施數種無線標準或協定之任一者，包括(但不限定於)Wi-Fi(IEEE 802.11家族)、WiMAX(IEEE 802.16家族)、IEEE 802.20、長期 演進(LTE)、Ev-DO、HSPA+、HSDPA+、HSUPA+、EDGE、GSM、GPRS、CDMA、TDMA、DECT、藍牙、其衍生物，以及其被指定為3G、4G、5G、及以上的任何其他無線協定。計算系統1000可包括複數通訊晶片1006。例如，第一通訊晶片1006可專用於較短距離無線通訊，諸如Wi-Fi及藍牙；而第二通訊晶片1006可專用於較長距離無線通訊，諸如GPS、EDGE、GPRS、CDMA、WiMAX、LTE、Ev-DO及其他。The communication chip 1006 enables wireless communication for the transfer of data to and from the computing system 1000. The term "wireless" and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communication channels, and the like, which may convey data by using modulated electromagnetic radiation transmitted through a non-solid medium. The term does not imply that its associated device does not contain any wiring, although in some embodiments it may not. The communication chip 1006 can implement any of several wireless standards or protocols including, but not limited to, Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, Long Term Evolution (LTE), Ev- DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, and any other wireless protocols designated as 3G, 4G, 5G, and above. Computing system 1000 can include a plurality of communication chips 1006. For example, the first communication chip 1006 can be dedicated to short-range wireless communication, such as Wi-Fi and Bluetooth; and the second communication chip 1006 can be dedicated to longer-range wireless communication, such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE. , Ev-DO and others.
計算系統1000之處理器1004包括封裝於處理器1004內之積體電路晶粒。於某些實施例中，處理器之積體電路晶粒包括板上電路，其被實施以一或更多使用所揭露技術來形成的積體電路結構或裝置，如文中多處所述者。術語「處理器」可指稱任何裝置或裝置之部分，其處理(例如)來自暫存器及/或記憶體之電子資料以將該電子資料轉變為其可被儲存於暫存器及/或記憶體中之其他電子資料。Processor 1004 of computing system 1000 includes integrated circuit dies that are packaged within processor 1004. In some embodiments, the integrated circuit die of the processor includes on-board circuitry that is implemented with one or more integrated circuit structures or devices formed using the disclosed techniques, as described in various places herein. The term "processor" may refer to any device or portion of a device that processes, for example, electronic data from a register and/or memory to convert the electronic data into a memory and/or memory that can be stored in a register. Other electronic materials in the body.
通訊晶片1006亦可包括封裝於通訊晶片1006內之積體電路晶粒。依據某些此等範例實施例，通訊晶片之積體電路晶粒包括使用如文中多處所述之已揭露技術所形成的一或更多積體電路結構或裝置。如根據本說明書所將理解者，注意：多重標準無線能力可被直接地整合入處理器1004(例如，其中任何晶片1006之功能被整合入處理器1004，而非具有分離的通訊晶片)。進一步注意：處理器1004可為具有此類無線能力之晶片組。簡言之，任何數目的處理器1004及/或通訊晶片1006可被使用。類似地，任 一晶片或晶片組可具有整合入其中之多種功能。The communication chip 1006 can also include integrated circuit dies that are packaged in the communication chip 1006. In accordance with certain such exemplary embodiments, the integrated circuit die of the communication chip includes one or more integrated circuit structures or devices formed using the disclosed techniques as described in various places herein. As will be understood in light of this description, it is noted that multiple standard wireless capabilities can be directly integrated into processor 1004 (eg, where the functionality of any of the wafers 1006 is integrated into processor 1004, rather than having separate communication chips). It is further noted that the processor 1004 can be a chipset having such wireless capabilities. In short, any number of processors 1004 and/or communication chips 1006 can be used. Similarly, any wafer or wafer set can have multiple functions integrated into it.
於各種實施方式中，計算系統1000可為膝上型電腦、小筆電、筆記型電腦、智慧型手機、平板電腦、個人數位助理(PDA)、超輕行動PC、行動電話、桌上型電腦、伺服器、印表機、掃描器、顯示器、機上盒、娛樂控制單元、數位相機、可攜式音樂播放器、數位錄影機、或任何其他電子裝置或系統，其係處理資料或運用已揭露技術所形成的一或更多積體電路結構或裝置，如文中多處描述者。注意：對於計算系統之參考係為了包括計算裝置、設備及針對計算或處理資訊而組態的其他結構。In various embodiments, the computing system 1000 can be a laptop, a small notebook, a notebook, a smart phone, a tablet, a personal digital assistant (PDA), an ultra-light mobile PC, a mobile phone, a desktop computer. , server, printer, scanner, display, set-top box, entertainment control unit, digital camera, portable music player, digital video recorder, or any other electronic device or system that processes data or uses One or more integrated circuit structures or devices formed by the techniques are disclosed, as described in various places herein. Note: References to the computing system are intended to include computing devices, equipment, and other structures configured for computing or processing information.
進一步範例實施例Further example embodiments
下列範例係有關於進一步實施例，從該些實施例將清楚明白各種變異及組態。The following examples are directed to further embodiments from which various variations and configurations will be apparent.
範例1為一種積體電路(IC)，包括：基底；及電晶體，其係位於該基底之上與之中的至少一者，該電晶體包括閘極、鄰近該閘極之通道區、鄰接該通道區之源極和汲極(S/D)區，其中該源極區包括第一半導體材料，該第一半導體材料包括n型與p型摻雜物之一；及其中該汲極區包括不同於該第一半導體材料之第二半導體材料，該第二半導體材料包括n型與p型摻雜物之一、電連接至該些S/D區之各者的接點、及位於該接點與該S/D區間之介面上與接近該介面的至少一者之碳。Example 1 is an integrated circuit (IC) comprising: a substrate; and a transistor disposed on at least one of the substrate, the transistor including a gate, a channel region adjacent to the gate, and adjacency a source and drain (S/D) region of the channel region, wherein the source region includes a first semiconductor material, the first semiconductor material including one of an n-type and a p-type dopant; and the drain region thereof A second semiconductor material different from the first semiconductor material, the second semiconductor material including one of an n-type and a p-type dopant, a junction electrically connected to each of the S/D regions, and located at the The carbon of the junction and the interface of the S/D section and at least one of the interfaces.
範例2包括範例1之請求標的，其中該碳係位於該接點 中。Example 2 includes the request target of Example 1, wherein the carbon system is located in the contact.
範例3包括範例1或2之請求標的，其中該第一半導體材料為矽鍺(SiGe)而該第二半導體材料為矽(Si)。Example 3 includes the subject matter of Example 1 or 2, wherein the first semiconductor material is germanium (SiGe) and the second semiconductor material is germanium (Si).
範例4包括範例1或2之請求標的，其中該第一半導體材料為砷化銦鎵(InGaAs)而該第二半導體材料為砷化鎵(GaAs)。Example 4 includes the subject matter of Example 1 or 2, wherein the first semiconductor material is indium gallium arsenide (InGaAs) and the second semiconductor material is gallium arsenide (GaAs).
範例5包括範例1-4的任一者之請求標的，其中該第二半導體材料包括相對於該第一半導體材料之n型與p型摻雜物的另一者。Example 5 includes the subject matter of any of Examples 1-4, wherein the second semiconductor material comprises the other of the n-type and p-type dopants relative to the first semiconductor material.
範例6包括範例1-4的任一者之請求標的，其中該第二半導體材料包括該第一半導體材料中所包括之n型與p型摻雜物的該一者。Example 6 includes the request of any of Examples 1-4, wherein the second semiconductor material comprises the one of n-type and p-type dopants included in the first semiconductor material.
範例7包括範例1-6的任一者之請求標的，其中該源極區包括雙層組態，以致其第三半導體材料被包括於該源極區中之第一層中及該第一半導體材料被包括於該源極區中之第二層中，其中該第二層係介於該第一層與該通道區之間。Example 7 includes the request target of any of Examples 1-6, wherein the source region comprises a two-layer configuration such that a third semiconductor material thereof is included in the first layer of the source region and the first semiconductor A material is included in the second layer of the source region, wherein the second layer is between the first layer and the channel region.
範例8包括範例7之請求標的，其中該第一層包括相對於該第一半導體材料之n型與p型摻雜物的另一者。Example 8 includes the request target of Example 7, wherein the first layer comprises the other of the n-type and p-type dopants relative to the first semiconductor material.
範例9包括範例7或8之請求標的，其中該第三半導體材料係相同於該第二半導體材料。Example 9 includes the request of Example 7 or 8, wherein the third semiconductor material is the same as the second semiconductor material.
範例10包括範例7-9的任一者之請求標的，其中該第二層係介於該第一層與該基底之間。Example 10 includes the request target of any of Examples 7-9, wherein the second layer is between the first layer and the substrate.
範例11包括範例1-10的任一者之請求標的，其中該第 一和第二半導體材料各包括IV族半導體材料。Example 11 includes the subject matter of any of Examples 1-10, wherein the first and second semiconductor materials each comprise a Group IV semiconductor material.
範例12包括範例1-10的任一者之請求標的，其中該第一和第二半導體材料各包括III-V族半導體材料。Example 12 includes the subject matter of any of Examples 1-10, wherein the first and second semiconductor materials each comprise a III-V semiconductor material.
範例13包括範例1-12的任一者之請求標的，其中該通道區包括一組態，其為平面、鰭式、雙閘極、三閘極、鰭式場效電晶體(FinFET)、奈米線、奈米帶、及環繞式閘極(GAA)之至少一者。Example 13 includes the request target of any of Examples 1-12, wherein the channel region includes a configuration that is planar, fin, double gate, triple gate, fin field effect transistor (FinFET), nano At least one of a wire, a nanobelt, and a wraparound gate (GAA).
範例14包括範例1-13的任一者之請求標的，其中該電晶體為費米過濾器場效電晶體(FFFET)。Example 14 includes the request of any of Examples 1-13, wherein the transistor is a Fermi filter field effect transistor (FFFET).
範例15包括範例1-13的任一者之請求標的，其中該電晶體為穿隧場效電晶體(TFET)。Example 15 includes the subject matter of any of Examples 1-13, wherein the transistor is a tunneling field effect transistor (TFET).
範例16為一互補金氧半導體(CMOS)裝置，包括範例1-15的任一者之請求標的。Example 16 is a complementary metal oxide semiconductor (CMOS) device, including the request target of any of Examples 1-15.
範例17為一種計算系統，包括範例1-16的任一者之請求標的。Example 17 is a computing system that includes the request of any of the examples 1-16.
範例18為一種積體電路(IC)，包括：基底；及電晶體，其係位於該基底之上與之中的至少一者，該電晶體包括閘極、鄰近該閘極之通道區、鄰接該通道區之源極區，該源極區包括第一層和介於該第一層與該通道區之間的第二層，該第一層包括第一半導體材料和n型與p型摻雜物之一，該第二層包括第二半導體材料和相對於該第一層的n型與p型摻雜物之另一者、鄰接該通道區之汲極區，該汲極區包括第三半導體材料和相對於該第一層的n型與p型摻雜物之另一者、電連接至該源極與汲極(S/D)區之各者的 接點、及位於該接點與該S/D區間之介面上與接近該介面的至少一者之碳。Example 18 is an integrated circuit (IC) comprising: a substrate; and a transistor disposed on at least one of the substrate, the transistor including a gate, a channel region adjacent to the gate, and a contiguous a source region of the channel region, the source region including a first layer and a second layer interposed between the first layer and the channel region, the first layer comprising a first semiconductor material and n-type and p-type doping One of the impurities, the second layer comprising a second semiconductor material and another one of the n-type and p-type dopants relative to the first layer, adjacent to the drain region of the channel region, the drain region including a third semiconductor material and the other of the n-type and p-type dopants relative to the first layer, a junction electrically connected to each of the source and drain (S/D) regions, and located at the junction The carbon at the interface between the point and the S/D interval and at least one of the interfaces.
範例19包括範例18之請求標的，其中該碳係以至少百分之1至20的濃度位於該接點中。Example 19 includes the subject matter of Example 18, wherein the carbon system is located in the junction at a concentration of at least 1 to 20 percent.
範例20包括範例18或19之請求標的，其中該中間層包括每立方公分(cm)至少1E21原子之最大摻雜物濃度。Example 20 includes the subject matter of Example 18 or 19, wherein the intermediate layer comprises a maximum dopant concentration of at least 1 E21 atoms per cubic centimeter (cm).
範例21包括範例18-20的任一者之請求標的，其中該第一半導體材料係相同於該第二半導體材料。Example 21 includes the request target of any of Examples 18-20, wherein the first semiconductor material is the same as the second semiconductor material.
範例22包括範例18-20的任一者之請求標的，其中該第一半導體材料係不同於該第二半導體材料。Example 22 includes the request target of any of Examples 18-20, wherein the first semiconductor material is different from the second semiconductor material.
範例23包括範例18-21的任一者之請求標的，其中該第一、第二、和第三半導體材料均包括矽(Si)。Example 23 includes the subject matter of any of Examples 18-21, wherein the first, second, and third semiconductor materials each comprise germanium (Si).
範例24包括範例18-20或22的任一者之請求標的，其中該第二半導體材料具有相對於該第一半導體材料之較高的價帶邊緣(Ev)。The example 24 includes the subject matter of any of the examples 18-20 or 22, wherein the second semiconductor material has a higher valence band edge (Ev) relative to the first semiconductor material.
範例25包括範例18-20、22、或24的任一者之請求標的，其中該第二半導體材料具有相對於該第一半導體材料之較低的導通帶邊緣(Ec)。Example 25 includes the request of any of the examples 18-20, 22, or 24, wherein the second semiconductor material has a lower conduction band edge (Ec) relative to the first semiconductor material.
範例26包括範例18-25的任一者之請求標的，其中該第三半導體材料係相同於該第一半導體材料。Example 26 includes the request target of any of Examples 18-25, wherein the third semiconductor material is the same as the first semiconductor material.
範例27包括範例18-25的任一者之請求標的，其中該第三半導體材料係不同於該第一半導體材料。Example 27 includes the request target of any of Examples 18-25, wherein the third semiconductor material is different from the first semiconductor material.
範例28包括範例18-26的任一者之請求標的，其中該第一層包括n型摻雜物，該第二層包括p型摻雜物，及該汲 極區包括p型摻雜物。Example 28 includes the subject matter of any of Examples 18-26, wherein the first layer comprises an n-type dopant, the second layer comprises a p-type dopant, and the dipole region comprises a p-type dopant.
範例29包括範例18-26的任一者之請求標的，其中該第一層包括p型摻雜物，該第二層包括n型摻雜物，及該汲極區包括n型摻雜物。Example 29 includes the request target of any of Examples 18-26, wherein the first layer comprises a p-type dopant, the second layer comprises an n-type dopant, and the drain region comprises an n-type dopant.
範例30包括範例18-29的任一者之請求標的，其中該通道區包括本質的或額定未摻雜的半導體材料。Example 30 includes the subject matter of any of Examples 18-29, wherein the channel region comprises an intrinsic or nominally undoped semiconductor material.
範例31包括範例18-29的任一者之請求標的，其中該通道區包括n型與p型摻雜物之一。Example 31 includes the request of any of Examples 18-29, wherein the channel region comprises one of an n-type and a p-type dopant.
範例32包括範例18-31的任一者之請求標的，其中該通道區包括一組態，其為平面、鰭式、雙閘極、三閘極、鰭式場效電晶體(FinFET)、奈米線、奈米帶、及環繞式閘極(GAA)之至少一者。Example 32 includes the request target of any of Examples 18-31, wherein the channel region includes a configuration that is planar, fin, double gate, triple gate, fin field effect transistor (FinFET), nano At least one of a wire, a nanobelt, and a wraparound gate (GAA).
範例33包括範例18-32的任一者之請求標的，其中該電晶體為費米過濾器場效電晶體(FFFET)。Example 33 includes the request target of any of Examples 18-32, wherein the transistor is a Fermi filter field effect transistor (FFFET).
範例34為一互補金氧半導體(CMOS)裝置，包括範例18-33的任一者之請求標的。Example 34 is a complementary metal oxide semiconductor (CMOS) device comprising the request of any of the examples 18-33.
範例35為一種計算系統，包括範例18-34的任一者之請求標的。Example 35 is a computing system that includes the request of any of the examples 18-34.
範例36為一種形成積體電路(IC)之方法，該方法包括：形成鄰接電晶體之通道區的源極區，其中該源極區包括第一半導體材料，該第一半導體材料包括n型與p型摻雜物之一；形成鄰接該電晶體之該通道區的汲極區，其中該汲極區包括不同於該第一半導體材料之第二半導體材料，該第二半導體材料包括n型與p型摻雜物之一；形成碳基層 於該些源極和汲極(S/D)區之一之上；以及形成接點於該碳基層之上。Example 36 is a method of forming an integrated circuit (IC), the method comprising: forming a source region adjacent to a channel region of a transistor, wherein the source region comprises a first semiconductor material, the first semiconductor material comprising an n-type and One of the p-type dopants; forming a drain region adjacent to the channel region of the transistor, wherein the drain region includes a second semiconductor material different from the first semiconductor material, the second semiconductor material including n-type and One of the p-type dopants; forming a carbon-based layer over one of the source and drain (S/D) regions; and forming a junction over the carbon-based layer.
範例37包括範例36之請求標的，其中該碳基層包括以百分之1至80的範圍中之濃度的碳合金。Example 37 includes the subject matter of Example 36, wherein the carbon-based layer comprises a carbon alloy in a concentration ranging from 1 to 80 percent.
範例38包括範例36或37之請求標的，其中該第一半導體材料為矽鍺(SiGe)而該第二半導體材料為矽(Si)。Example 38 includes the subject matter of Example 36 or 37, wherein the first semiconductor material is germanium (SiGe) and the second semiconductor material is germanium (Si).
範例39包括範例36或37之請求標的，其中該第一半導體材料為砷化銦鎵(InGaAs)而該第二半導體材料為砷化鎵(GaAs)。Example 39 includes the subject matter of Example 36 or 37, wherein the first semiconductor material is indium gallium arsenide (InGaAs) and the second semiconductor material is gallium arsenide (GaAs).
範例40包括範例36-39的任一者之請求標的，其中該第二半導體材料包括相對於該第一半導體材料之n型與p型摻雜物的另一者。The example 40 includes the request target of any of the examples 36-39, wherein the second semiconductor material comprises the other of the n-type and p-type dopants relative to the first semiconductor material.
範例41包括範例36-39的任一者之請求標的，其中該第二半導體材料包括該第一半導體材料中所包括之n型與p型摻雜物的該一者。The example 41 includes the request target of any of the examples 36-39, wherein the second semiconductor material comprises the one of the n-type and p-type dopants included in the first semiconductor material.
範例42包括範例36-41的任一者之請求標的，其中該源極區包括雙層組態，以致其第三半導體材料被包括於該源極區中之第一層中及該第一半導體材料被包括於該源極區中之第二層中，其中該第二層係介於該第一層與該通道區之間。The example 42 includes the request target of any of the examples 36-41, wherein the source region comprises a two-layer configuration such that a third semiconductor material thereof is included in the first layer of the source region and the first semiconductor A material is included in the second layer of the source region, wherein the second layer is between the first layer and the channel region.
範例43包括範例42之請求標的，其中該第一層包括相對於該第一半導體材料之n型與p型摻雜物的另一者。Example 43 includes the request target of Example 42, wherein the first layer comprises the other of the n-type and p-type dopants relative to the first semiconductor material.
範例44包括範例42或43之請求標的，其中該第三半導體材料係相同於該第二半導體材料。Example 44 includes the request target of Example 42 or 43, wherein the third semiconductor material is the same as the second semiconductor material.
範例45包括範例42-44的任一者之請求標的，其中該第二層係介於該第一層與該基底之間。The example 45 includes the request target of any of the examples 42-44, wherein the second layer is between the first layer and the substrate.
範例46包括範例36-45的任一者之請求標的，其中該第一和第二半導體材料各包括IV族半導體材料。The example 46 includes the subject matter of any of the examples 36-45, wherein the first and second semiconductor materials each comprise a Group IV semiconductor material.
範例47包括範例36-45的任一者之請求標的，其中該第一和第二半導體材料各包括III-V族半導體材料。The example 47 includes the subject matter of any of the examples 36-45, wherein the first and second semiconductor materials each comprise a III-V semiconductor material.
範例48包括範例36-47的任一者之請求標的，其中該通道區包括一組態，其為平面、鰭式、雙閘極、三閘極、鰭式場效電晶體(FinFET)、奈米線、奈米帶、及環繞式閘極(GAA)之至少一者。Example 48 includes the request target of any of Examples 36-47, wherein the channel region includes a configuration that is planar, fin, double gate, triple gate, fin field effect transistor (FinFET), nano At least one of a wire, a nanobelt, and a wraparound gate (GAA).
範例49包括範例36-48的任一者之請求標的，其中該電晶體為費米過濾器場效電晶體(FFFET)。Example 49 includes the request of any of Examples 36-48, wherein the transistor is a Fermi filter field effect transistor (FFFET).
範例50包括範例36-48的任一者之請求標的，其中該電晶體為穿隧場效電晶體(TFET)。Example 50 includes the request target of any of Examples 36-48, wherein the transistor is a tunneling field effect transistor (TFET).
範例實施例之前述說明已被提呈以供闡明及描述之目的。不是想要窮舉的或將本發明限制於所揭露的精確形式。許多組態及變異將根據此說明書而為可能的。意欲使本發明之範圍不受此詳細說明所限制，而是由後附的申請專利範圍所限制。主張本申請案之優先權的未來申請案可用不同方式主張所揭露之請求標的，且可一般性地包括如文中所多樣地揭露或另外展示的一或更多限制之任何集合。The foregoing description of the example embodiments has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many configurations and variations will be possible in accordance with this specification. The scope of the present invention is intended to be limited by the scope of the appended claims. Future applications that claim priority to this application may claim the claimed subject matter in various ways, and may generally include any collection of one or more limitations as variously disclosed or otherwise shown herein.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??PCT/US16/54810 | 2016-09-30 | ||
| PCT/US2016/054810WO2018063335A1 (en) | 2016-09-30 | 2016-09-30 | Tunneling transistors including source/drain regions employing carbon-based etch stop layer |
| Publication Number | Publication Date |
|---|---|
| TW201824554Atrue TW201824554A (en) | 2018-07-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106128786ATW201824554A (en) | 2016-09-30 | 2017-08-24 | a tunneling transistor including a source/drain region using a carbon-based etch stop layer |
| Country | Link |
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| TW (1) | TW201824554A (en) |
| WO (1) | WO2018063335A1 (en) |
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