本發明係關於一種疊層基板之加工方法，尤其是關於一種用來對於脆性材料基板之表面疊層有樹脂層之疊層基板進行加工之方法。The present invention relates to a method of processing a laminated substrate, and more particularly to a method for processing a laminated substrate having a resin layer laminated on a surface of a brittle material substrate.
又，本發明係關於一種利用雷射光之疊層基板之加工裝置。Further, the present invention relates to a processing apparatus for a laminated substrate using laser light.
薄膜太陽電池或液晶顯示裝置等中，有於玻璃基板上設置作為保護膜之樹脂層之情形。並且，此種基板會自一塊大型母基板分斷成複數個單位基板。In a thin film solar cell or a liquid crystal display device, a resin layer as a protective film is provided on a glass substrate. Moreover, such a substrate is divided into a plurality of unit substrates from one large mother substrate.
此種疊層基板之分斷方法示於專利文獻1中。該專利文獻1之方法中，針對於玻璃基板表面形成之保護用樹脂層，沿著分斷預定線照射雷射光。藉由該雷射光照射而去除樹脂層之一部分，露出玻璃基板之一部分。又，於玻璃基板上於加工前形成有初期龜裂，之後對玻璃基板照射雷射光，並噴水進行冷卻，藉此使龜裂進展自而進行分斷。A method of dividing such a laminated substrate is shown in Patent Document 1. In the method of Patent Document 1, the protective resin layer formed on the surface of the glass substrate is irradiated with laser light along a predetermined line of division. A portion of the resin layer is removed by the irradiation of the laser light to expose a portion of the glass substrate. Further, an initial crack was formed on the glass substrate before the processing, and then the glass substrate was irradiated with laser light, and water was sprayed and cooled, whereby the crack progressed and was broken.
[專利文獻1]日本專利特表平10-506087號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 10-506087
於專利文獻1之方法中，形成於玻璃基板表面之樹脂層之一部分因雷射光之照射而蒸發並被去除。此時，有產生如下問題等之情形：被去除之樹脂飛散，作為異物附著於基板上，或者樹脂層之表面氧化而於後步驟中無法進行刻劃加工。進而，亦有加工部周邊產生變色部分而加工寬度變大，或者需要高功率之雷射光等問題。又，於專利文獻1之方法中，需要於雷射光加工前於玻璃基板上形成初期龜裂。In the method of Patent Document 1, a part of the resin layer formed on the surface of the glass substrate is evaporated by the irradiation of the laser light and removed. At this time, there are cases in which the removed resin scatters, adheres to the substrate as a foreign matter, or oxidizes the surface of the resin layer.The scoring process cannot be performed in the subsequent steps. Further, there is a problem in that a color-changing portion is formed around the processed portion, the processing width is increased, or a high-power laser light is required. Further, in the method of Patent Document 1, it is necessary to form an initial crack on the glass substrate before the laser processing.
本發明之課題在於能夠同時且高品質地對構成疊層基板之脆性材料基板及樹脂層進行加工。An object of the present invention is to enable processing of a brittle material substrate and a resin layer constituting a laminated substrate simultaneously and with high quality.
本發明之一態樣之疊層基板之加工方法包含以下步驟。A method of processing a laminated substrate according to an aspect of the present invention comprises the following steps.
第1步驟：準備包含脆性材料基板、及形成於脆性材料基板之表面之樹脂層之疊層基板。First step: A laminated substrate comprising a brittle material substrate and a resin layer formed on the surface of the brittle material substrate is prepared.
第2步驟：將特定波長之雷射光以於脆性材料基板聚光之方式照射於疊層基板，將樹脂層之雷射光照射部分改性而使脆性破壞強度低於周圍之脆性破壞強度，且使脆性材料基板產生龜裂。In the second step, the laser light of a specific wavelength is irradiated onto the laminated substrate so as to condense the brittle material substrate, and the laser light irradiation portion of the resin layer is partially modified to make the brittle fracture strength lower than the surrounding brittle fracture strength, and The brittle material substrate is cracked.
於該方法中，對於脆性材料基板之表面形成有樹脂層之疊層基板，照射特定波長之雷射光。藉由該雷射光之照射，而同時加工經雷射光照射之樹脂層及脆性材料基板。尤其，樹脂層之被雷射光照射之部分係不去除樹脂層地進行改性。藉由該改性，樹脂層之雷射光照射部分之脆性破壞強度與周圍之部分相比變低。因此，能夠高品質且短加工時間地加工疊層基板。In this method, a laminated substrate in which a resin layer is formed on a surface of a brittle material substrate is irradiated with laser light of a specific wavelength. The resin layer irradiated with the laser light and the substrate of the brittle material are simultaneously processed by the irradiation of the laser light. In particular, the portion of the resin layer that is irradiated with the laser light is modified without removing the resin layer. By this modification, the brittle fracture strength of the portion irradiated with the laser light of the resin layer becomes lower than that of the surrounding portion. Therefore, the laminated substrate can be processed with high quality and short processing time.
於此種方法中，藉由沿著例如疊層基板之分斷預定線照射雷射光，能夠不去除分斷預定線之樹脂層地藉由後面之分斷步驟將樹脂層及脆性材料基板分斷。因此，能夠抑制因樹脂層飛散所致之加工品質下降，且能以較低功率之雷射光進行加工。In this method, by irradiating the laser light along a predetermined line of division of the laminated substrate, the resin layer and the brittle material substrate can be separated by the subsequent breaking step without removing the resin layer of the predetermined dividing line. . Therefore, it is possible to suppress a decrease in processing quality due to scattering of the resin layer, and it is possible to perform processing with laser light of a lower power.
本發明之另一態樣之疊層基板之加工方法係於第2步驟中，使雷射光照射部分之體積膨脹或變色而進行改性。In the second step of the method for processing a laminated substrate according to another aspect of the present invention, the volume of the portion irradiated with the laser light is expanded or discolored to be modified.
本發明之又一態樣之疊層基板之加工方法係於第2步驟中，使雷射光照射部分產生龜裂而進行改性。In the second step of the method for processing a laminated substrate according to the present invention, the laser light irradiation portion is cracked and modified.
本發明之又一態樣之疊層基板之加工方法係於第1步驟中，照射波長為515~1080nm之雷射光。A method of processing a laminated substrate according to still another aspect of the present invention is to irradiate laser light having a wavelength of 515 to 1080 nm in the first step.
本發明之又一態樣之疊層基板之加工方法係於第1步驟中，照射脈寬為50psec~15nsec之脈衝雷射光。A method of processing a laminated substrate according to still another aspect of the present invention is to irradiate pulsed laser light having a pulse width of 50 psec to 15 nsec in the first step.
本發明之又一態樣之疊層基板之加工方法係於第2步驟中，照射聚光透鏡之NA為0.17psec~0.7nsec之脈衝雷射光。According to still another aspect of the present invention, in the method of processing a laminated substrate, in the second step, the NA of the condensing lens is irradiated with pulsed laser light of 0.17 psec to 0.7 nsec.
本發明之又一態樣之疊層基板之加工方法係於疊層基板設定分斷預定線。並且，於第2步驟中，沿著樹脂層之分斷預定線照射雷射光，且進而包含沿著分斷預定線將脆性材料基板及樹脂層分斷之第3步驟。A method of processing a laminated substrate according to still another aspect of the present invention is to set a predetermined breaking line on the laminated substrate. Further, in the second step, the laser beam is irradiated along the predetermined line of the resin layer, and further includes a third step of dividing the brittle material substrate and the resin layer along the line to be cut.
本發明之又一態樣之疊層基板之加工方法係於疊層基板設定分斷預定線。並且，於第2步驟中，沿著分斷預定線照射雷射光，且該疊層基板之加工方法進而包含沿著分斷預定線將脆性材料基板及樹脂層分斷之第3步驟。A method of processing a laminated substrate according to still another aspect of the present invention is to set a predetermined breaking line on the laminated substrate. Further, in the second step, the laser beam is irradiated along the line to be cut, and the method of processing the laminated substrate further includes a third step of dividing the brittle material substrate and the resin layer along the line to be cut.
本發明之一態樣之利用雷射光之疊層基板之加工裝置用於將於脆性材料基板之表面疊層有樹脂層之疊層基板進行加工，且具備支持機構及雷射光照射機構。支持機構支持疊層基板。雷射光照射機構將特定波長之雷射光以於脆性材料基板聚光之方式照射於疊層基板，將樹脂層之雷射光照射部分改性而使脆性破壞強度低於周圍之脆性破壞強度，且使脆性材料基板產生龜裂。A processing apparatus for a laminated substrate using laser light according to an aspect of the present invention is used for processing a laminated substrate in which a resin layer is laminated on a surface of a brittle material substrate, and includes a support mechanism and a laser beam irradiation mechanism. The support mechanism supports the laminated substrate. The laser light irradiation mechanism irradiates the laser beam of a specific wavelength to the laminated substrate by concentrating the brittle material substrate, and the laser light irradiation portion of the resin layer is partially modified to make the brittle fracture strength lower than the surrounding brittle fracture strength, and The brittle material substrate is cracked.
於如上所述之本發明中，能夠同時以高品質對構成疊層基板之脆性材料基板及樹脂層進行加工。In the present invention as described above, the brittle material substrate and the resin layer constituting the laminated substrate can be processed simultaneously with high quality.
11‧‧‧玻璃基板11‧‧‧ glass substrate
12‧‧‧聚酯膜(樹脂層)12‧‧‧ polyester film (resin layer)
26‧‧‧脈衝雷射光線振盪單元26‧‧‧Pulse laser oscillation unit
26a‧‧‧振盪器26a‧‧‧Oscillator
26b‧‧‧雷射控制部26b‧‧" Laser Control Department
27‧‧‧傳送光學系統27‧‧‧Transmission optical system
28‧‧‧聚光透鏡28‧‧‧ Concentrating lens
29‧‧‧載物台29‧‧‧stage
30‧‧‧驅動控制部30‧‧‧Drive Control Department
31‧‧‧加工控制部31‧‧‧Processing Control Department
C‧‧‧龜裂C‧‧‧ crack
G‧‧‧疊層基板G‧‧‧Laminated substrate
L‧‧‧雷射光L‧‧‧Laser light
R‧‧‧區域R‧‧‧ area
圖1係作為加工對象之疊層基板之剖面部分圖。Fig. 1 is a cross-sectional view showing a laminated substrate as a processing target.
圖2係用於說明加工方法之第2步驟之疊層基板之剖視圖。Fig. 2 is a cross-sectional view of the laminated substrate for explaining the second step of the processing method.
圖3係本發明之一實施形態之加工裝置之概略構成圖。Fig. 3 is a schematic block diagram showing a processing apparatus according to an embodiment of the present invention.
[加工對象][Processing object]
圖1係表示利用本發明之一實施形態之方法而分斷之疊層基板之剖面。該疊層基板G係例如於強化玻璃等玻璃基板11之表面疊層作為保護層之聚酯膜(以下僅記為「樹脂層」)12而形成。又，此處，疊層基板G係一塊大型之母基板，於該母基板於例如X，Y方向設定有分斷預定線。並且，沿著該分斷預定線將母基板分斷成複數個單位基板。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a laminated substrate which is separated by a method according to an embodiment of the present invention. The laminated substrate G is formed by laminating a polyester film (hereinafter simply referred to as "resin layer") 12 as a protective layer on the surface of the glass substrate 11 such as tempered glass. Here, the laminated substrate G is a large mother substrate, and a predetermined dividing line is set in the X, Y direction, for example, in the mother substrate. Further, the mother substrate is divided into a plurality of unit substrates along the predetermined line.
再者，圖1係模式圖，其示意性顯示將玻璃基板11及樹脂層12之厚度等。又，圖中之一點鏈線d表示設定有分斷預定線之位置。1 is a schematic view schematically showing the thickness of the glass substrate 11 and the resin layer 12 and the like. Further, a dot chain line d in the figure indicates a position at which a predetermined line is divided.
[加工(分斷)方法][Processing (breaking) method]
於分斷疊層基板G之情形時，首先沿著分斷預定線d自形成有樹脂層12之側照射雷射光。以下，說明將樹脂層12改性之情形時之例。In the case of dividing the laminated substrate G, the laser light is first irradiated from the side on which the resin layer 12 is formed along the line to be broken d. Hereinafter, an example in the case where the resin layer 12 is modified will be described.
於該情形時，作為照射之雷射光之條件為如下之程度：如圖2所示，於樹脂層12中，使被照射雷射光L之區域R改性，且使玻璃基板11之內部或表面至內部產生龜裂C。In this case, the condition of the laser light to be irradiated is such that, as shown in FIG. 2, in the resin layer 12, the region R to which the laser light L is irradiated is modified, and the inside or surface of the glass substrate 11 is made. Crack C is generated inside.
此處，所謂「改性」係指樹脂層12之被照射雷射光之區域R產生如下之物理變化，與周圍之部分相比，脆性破壞強度較低。Here, "modification" means that the region R of the resin layer 12 to which the laser light is irradiated has the following physical change, and the brittle fracture strength is lower than that of the surrounding portion.
‧被照射雷射光之部分之體積膨脹‧ Volume expansion of the portion of the irradiated laser light
‧被照射雷射光之部分變色‧ Partial discoloration of irradiated laser light
‧被照射雷射光之部分產生龜裂‧The part of the irradiated laser light is cracked
藉由如上所述之改性，照射有雷射光之部分與其他部分相比變脆。By the modification as described above, the portion irradiated with the laser light becomes brittle as compared with the other portions.
如上所述，對形成有改性區域R及龜裂C之疊層基板G，按壓分斷預定線之兩側。藉此，能夠將玻璃基板11及樹脂層12同時分斷。As described above, the laminated substrate G on which the modified region R and the crack C are formed is pressed against both sides of the predetermined line. Thereby, the glass substrate 11 and the resin layer 12 can be simultaneously divided.
[實施例1][Example 1]
於進行如上所述之加工之情形時，作為照射之雷射光，較佳使用如下規格之雷射光。In the case of performing the processing as described above, it is preferably used as the irradiated laser light.Laser light of the following specifications.
波長：532nmWavelength: 532nm
雷射光功率：1.0WLaser power: 1.0W
掃描速度：500mm/sScanning speed: 500mm/s
聚光徑： 5μmSpot light path: 5μm
脈寬：0.5nsecPulse width: 0.5nsec
再者，雷射光之規格除了以上之實施例1之規格以外，亦可於以下之條件下進行加工。Further, in addition to the specifications of the above first embodiment, the specifications of the laser light can be processed under the following conditions.
波長：515~1080nmWavelength: 515~1080nm
脈寬：50psec~15nsecPulse width: 50psec~15nsec
聚光透鏡之NA：0.17psec~0.7nsecNA of the condenser lens: 0.17psec~0.7nsec
[加工裝置][Processing device]
圖4係表示用於實施如上之加工方法之加工裝置之概略構成。該加工裝置25具有：雷射光線振盪單元26，其包含雷射光線振盪器26a及雷射控制部26b；傳送光學系統27，其包含用於將雷射光導向特定方向之複數個鏡片；及聚光透鏡28，用於使來自傳送光學系統27之雷射光聚光。自雷射光線振盪單元26出射光束強度等照射條件經控制之脈衝雷射光。藉由雷射光線振盪單元26、傳送光學系統27、及聚光透鏡28，構成向疊層基板照射雷射光之雷射光照射機構。Fig. 4 is a view showing the schematic configuration of a processing apparatus for carrying out the above processing method. The processing device 25 has a laser beam oscillating unit 26 including a laser ray oscillator 26a and a laser control unit 26b, and a transmission optical system 27 including a plurality of lenses for directing the laser light in a specific direction; The optical lens 28 is for concentrating the laser light from the transmission optical system 27. The laser light oscillating unit 26 emits pulsed laser light whose irradiation condition is controlled such as the beam intensity. The laser beam illuminating means 26, the transmission optical system 27, and the condensing lens 28 constitute a laser beam irradiation means for irradiating the laminated substrate with laser light.
例如，作為雷射光線振盪器26a，使用具有振盪之雷射光之頻率或脈寬之切換機構之振盪器，藉此可變更疊層基板之樹脂層之吸收率。雷射光之波長只要為樹脂層能吸收之波長則並無特別限定，例如可使用1030~1080nm(基本波)、基本波之2倍波、具有600~980nm之波長之雷射光。For example, as the laser beam oscillator 26a, an oscillator having a switching mechanism of the frequency or pulse width of the oscillating laser light is used, whereby the absorption rate of the resin layer of the laminated substrate can be changed. The wavelength of the laser beam is not particularly limited as long as it is a wavelength at which the resin layer can absorb. For example, 1030 to 1080 nm (basic wave), a fundamental wave double wave, and a laser beam having a wavelength of 600 to 980 nm can be used.
疊層基板G被載置於載物台29。載物台29係由驅動控制部30予以驅動控制，能夠於水平面內移動。即，載置於載物台29之疊層基板G、及自聚光透鏡28照射之雷射光線能夠於水平面內相對移動。又，雷射光與載置有疊層基板G之載物台29能夠相對地於上下方向移動。雷射控制部26b及驅動控制部30係由加工控制部21控制。The laminated substrate G is placed on the stage 29 . The stage 29 is driven and controlled by the drive control unit 30, and is movable in a horizontal plane. That is, the laminated substrate G placed on the stage 29,The laser light irradiated from the condensing lens 28 can be relatively moved in a horizontal plane. Further, the laser beam and the stage 29 on which the laminated substrate G is placed can be moved in the vertical direction. The laser control unit 26b and the drive control unit 30 are controlled by the machining control unit 21.
再者，加工控制部31係由微電腦構成，控制雷射控制部26b及驅動控制部30，執行如上所述之加工。Further, the processing control unit 31 is constituted by a microcomputer, and controls the laser control unit 26b and the drive control unit 30 to execute the processing as described above.
[其他實施形態][Other Embodiments]
本發明並不限定於如上所述之實施形態，可不脫離本發明之範圍地進行各種變化或修正。The present invention is not limited to the embodiments described above, and various changes or modifications may be made without departing from the scope of the invention.
(a)於上述實施形態中，以於玻璃基板之表面形成有樹脂層之疊層基板為例進行說明，但只要為於脆性材料基板之表面形成有樹脂層之疊層基板，便可同樣地應用本發明。具體而言，脆性材料基板之材質可為矽、氧化鋁陶瓷、LTCC、氮化鋁、氮化矽，樹脂層之材質可為矽酮、環氧、阻焊劑。又，樹脂層亦可為疊層有複數個樹脂層之多層膜。再者，使用之雷射之波長亦可根據脆性材料基板及樹脂層之材質適當地選擇，而不限定於上述波長之範圍。(a) In the above embodiment, the laminated substrate in which the resin layer is formed on the surface of the glass substrate is described as an example. However, the laminated substrate in which the resin layer is formed on the surface of the brittle material substrate can be similarly The invention is applied. Specifically, the material of the brittle material substrate may be tantalum, alumina ceramic, LTCC, aluminum nitride or tantalum nitride, and the material of the resin layer may be an anthrone, an epoxy or a solder resist. Further, the resin layer may be a multilayer film in which a plurality of resin layers are laminated. Further, the wavelength of the laser to be used may be appropriately selected depending on the material of the brittle material substrate and the resin layer, and is not limited to the above wavelength range.
(b)又，於上述實施形態中，係自疊層基板之形成有樹脂層之側向樹脂層照射雷射光，但只要為透過脆性材料基板且樹脂層能吸收之雷射光照射條件，則亦可自脆性材料基板側向樹脂層照射雷射光。(b) In the above embodiment, the laser light is irradiated to the resin layer from the side on which the resin layer is formed on the laminated substrate. However, as long as it is a laser light that is transmitted through the brittle material substrate and the resin layer can be absorbed, The laser light may be irradiated from the side of the brittle material substrate toward the resin layer.
(c)於上述實施形態中，係於分斷疊層基板時應用本發明，但亦可於其他加工中同樣地應用本發明。(c) In the above embodiment, the present invention is applied to the case of breaking the laminated substrate, but the present invention can be applied similarly to other processes.
11‧‧‧玻璃基板11‧‧‧ glass substrate
12‧‧‧聚酯膜(樹脂層)12‧‧‧ polyester film (resin layer)
C‧‧‧龜裂C‧‧‧ crack
G‧‧‧疊層基板G‧‧‧Laminated substrate
L‧‧‧雷射光L‧‧‧Laser light
R‧‧‧區域R‧‧‧ area
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015044390 | 2015-03-06 | ||
| JP2015255698AJP2016166120A (en) | 2015-03-06 | 2015-12-28 | Processing method of laminated substrate, and processing device of laminated substrate by laser beam |
| Publication Number | Publication Date |
|---|---|
| TW201706221Atrue TW201706221A (en) | 2017-02-16 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105104788ATW201706221A (en) | 2015-03-06 | 2016-02-18 | Method of processing laminated substrate and apparatus for processing laminated substrate with laser light |
| Country | Link |
|---|---|
| JP (1) | JP2016166120A (en) |
| KR (1) | KR20160108148A (en) |
| CN (1) | CN105935838A (en) |
| TW (1) | TW201706221A (en) |
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