本發明涉及一種散熱結構及其製造方法、應用該散熱結構的裝置。The invention relates to a heat dissipation structure, a manufacturing method thereof and a device using the same.
近年來，LED燈和各類電子設備被廣泛的應用。隨著LED技術的快速發展，LED的發熱量和熱流密度較高，然，根據有關分析，LED的溫度越低越省電，溫度越高燈的壽命越短，且LED燈的溫度每升高1℃，其發光強度會相應的減少1%左右。對於使用高階晶片的電子設備，溫度較高時會影響電子設備的運算效率，且耗能較多。目前LED和晶片的散熱方式分為主動式和被動式兩種：主動式散熱如加裝製冷機構等外界散熱裝置，其具有較快的散熱效率，卻需佔用較大的面積，且形狀較為固定，製造成本高；被動式散熱如利用金屬熱傳遞的方式自然散熱，其存在散熱速度慢、散熱效果差等缺陷。In recent years, LED lights and various types of electronic devices have been widely used. With the rapid development of LED technology, the heat generation and heat flux density of LEDs are relatively high. However, according to the relevant analysis, the lower the temperature of the LED, the more power is saved. The higher the temperature, the shorter the life of the lamp, and the higher the temperature of the LED lamp. At 1 ° C, its luminous intensity will be reduced by about 1%. For electronic devices using high-order chips, the higher temperature will affect the computing efficiency of the electronic device and consume more energy. At present, the heat dissipation methods of LEDs and chips are divided into active and passive types: active heat dissipation, such as external cooling devices such as retrofit refrigeration mechanisms, which have faster heat dissipation efficiency, but require a larger area and a fixed shape. The manufacturing cost is high; the passive heat dissipation is naturally radiated by means of metal heat transfer, and has the defects of slow heat dissipation and poor heat dissipation.
有鑑於此，有必要提供一種散熱效果好且節約成本的散熱結構。In view of this, it is necessary to provide a heat dissipation structure with good heat dissipation effect and cost saving.
另，還有必要提供一種上述散熱結構的製造方法。In addition, it is also necessary to provide a method of manufacturing the above heat dissipation structure.
另，還有必要提供一種應用上述散熱結構的裝置。In addition, it is also necessary to provide a device to which the above heat dissipation structure is applied.
一種散熱結構，其包括底座和蓋設該底座的蓋體，該底座與蓋體之間形成至少一密閉腔體，該底座和蓋體均由導熱材料製成；該底座包括底板和凸設於該底板上的至少一第一環形凸部和圍繞該每一第一環形凸部的第二環形凸部，該每一第一環形凸部的中央區域形成第一容置槽，該每一第一環形凸部與圍繞該第一環形凸部的第二環形凸部之間形成卡持槽；該每一卡持槽中設置有黏接劑；該蓋體包括頂板和凸設於該頂板的至少一第三環形凸部；每一第三環形凸部藉由所述黏接劑嵌合於一卡持槽中，該每一第三環形凸部的中央區域形成第二容置槽，第一容置槽與第二容置槽配合形成所述密閉腔體，其中該密閉腔體內填充有散熱體。A heat dissipating structure includes a base and a cover body covering the base, and at least one closed cavity is formed between the base and the cover body, the base and the cover body are both made of a heat conductive material; the base comprises a bottom plate and a protruding base At least one first annular convex portion on the bottom plate and a second annular convex portion surrounding each of the first annular convex portions, a central portion of each of the first annular convex portions forming a first receiving groove, a holding groove is formed between each of the first annular convex portion and the second annular convex portion surrounding the first annular convex portion; an adhesive is disposed in each of the holding grooves; the cover body includes a top plate and a convex portion At least one third annular convex portion disposed on the top plate; each of the third annular convex portions is fitted into a holding groove by the adhesive, and a central portion of each of the third annular convex portions forms a second portion The accommodating groove, the first accommodating groove and the second accommodating groove cooperate to form the sealed cavity, wherein the sealed cavity is filled with a heat sink.
一種上述散熱結構的製造方法，其包括如下步驟：提供一覆銅板，該覆銅板包括絕緣層、結合於該絕緣層一表面的頂板、及結合於該絕緣層另一表面的底板；A method for manufacturing a heat dissipation structure, comprising the steps of: providing a copper clad laminate comprising an insulating layer, a top plate bonded to a surface of the insulating layer, and a bottom plate bonded to the other surface of the insulating layer;
在底板表面製作形成至少一第一環形凸部和圍繞該每一第一環形凸部的第二環形凸部，該每一第一環形凸部的中央區域形成第一容置槽，該每一第一環形凸部與圍繞該第一環形凸部的第二環形凸部之間形成卡持槽；Forming at least a first annular convex portion and a second annular convex portion surrounding each of the first annular convex portions on a surface of the bottom plate, wherein a central portion of each of the first annular convex portions forms a first receiving groove, Forming a holding groove between each of the first annular convex portions and the second annular convex portion surrounding the first annular convex portion;
在頂板表面製作形成至少一第三環形凸部，該每一第三環形凸部的中央形成第二容置槽；Forming at least one third annular protrusion on the surface of the top plate, the center of each of the third annular protrusions forming a second receiving groove;
將形成有第一環形凸部和第二環形凸部的底板及形成有第三環形凸部的頂板從絕緣層上分離；Separating the bottom plate formed with the first annular convex portion and the second annular convex portion and the top plate formed with the third annular convex portion from the insulating layer;
將散熱體填入每一第一容置槽；Filling the heat sink into each of the first receiving slots;
將黏接劑填入每一卡持槽；Fill the adhesive groove into each card holding slot;
再將每一第三環形凸部藉由黏接劑嵌合於一卡持槽中，該每一第一容置槽與第二容置槽配合形成密閉腔體；Then, each of the third annular protrusions is fitted into a holding groove by an adhesive, and each of the first receiving grooves cooperates with the second receiving groove to form a closed cavity;
該頂板、底板、第一環形凸部、第二環形凸部和第三環形凸部的材質為導熱材料。The top plate, the bottom plate, the first annular convex portion, the second annular convex portion and the third annular convex portion are made of a heat conductive material.
一種應用上述散熱結構的裝置，該裝置具有產熱元件，該產熱元件鄰接所述散熱結構。A device for applying the above heat dissipation structure, the device having a heat generating element adjacent to the heat dissipation structure.
所述散熱結構藉由將蓋體的第三環形凸部卡持固定於底座上的卡持槽，並在卡持槽內填充黏接劑，從而在底座和蓋體之間形成密閉腔體，散熱體填充在密閉腔體內，利用相變材料發生相變時的吸放熱的特性，達到主動快速散熱的目的，可以有效的提高散熱結構的散熱效率。如此，便可以有效的控制LED燈及電子設備的溫度，可有效的延長LED燈及電子設備的使用壽命，減少LED燈的光衰現象。The heat dissipating structure forms a closed cavity between the base and the cover body by clamping and fixing the third annular convex portion of the cover body to the holding groove on the base, and filling the holding groove with the adhesive agent. The heat sink is filled in the sealed cavity, and the heat-dissipating and heat-discharging characteristics of the phase change material are used to achieve active heat dissipation, and the heat dissipation efficiency of the heat dissipation structure can be effectively improved. In this way, the temperature of the LED lamp and the electronic device can be effectively controlled, and the service life of the LED lamp and the electronic device can be effectively extended, and the light decay phenomenon of the LED lamp can be reduced.
圖1為本發明較佳實施方式的散熱結構的立體圖。1 is a perspective view of a heat dissipation structure in accordance with a preferred embodiment of the present invention.
圖2為圖1所示的散熱結構沿II-II方向的剖視圖。2 is a cross-sectional view of the heat dissipation structure shown in FIG. 1 taken along the line II-II.
圖3為圖1所示的散熱結構的分解圖。3 is an exploded view of the heat dissipation structure shown in FIG. 1.
圖4為圖1所示的散熱結構的另一方向的分解圖。4 is an exploded view of the heat dissipating structure shown in FIG. 1 in another direction.
圖5為圖1所示的散熱結構的散熱過程示意圖。FIG. 5 is a schematic diagram of a heat dissipation process of the heat dissipation structure illustrated in FIG. 1. FIG.
圖6為覆銅板的截面示意圖。Figure 6 is a schematic cross-sectional view of a copper clad laminate.
圖7為覆銅板表面結合幹膜層的截面示意圖。Fig. 7 is a schematic cross-sectional view showing a surface of a copper clad laminate in combination with a dry film layer.
圖8為在圖7所示的凹槽中電鍍銅層的截面示意圖。Figure 8 is a schematic cross-sectional view showing a copper plating layer in the groove shown in Figure 7.
圖9為將圖8中的幹膜層和絕緣層去除後得到的底座和蓋體的截面示意圖。Fig. 9 is a schematic cross-sectional view showing the base and the cover obtained by removing the dry film layer and the insulating layer of Fig. 8.
請參閱圖1~2，本發明一較佳實施方式提供一種散熱結構100，其用於對LED燈或電子設備（如電腦、平板電腦、電子閱讀器等）的發熱元件（如微處理器、存儲模組、高速緩衝記憶體晶片等）進行散熱。該散熱結構100包括底座10和蓋設於該底座10的蓋體20。該蓋體20與底座10之間形成至少一密閉腔體40，該每一密閉腔體40內均填充有散熱體30。Referring to FIGS. 1 to 2, a preferred embodiment of the present invention provides a heat dissipation structure 100 for a heating element (such as a microprocessor, an LED lamp or an electronic device (such as a computer, a tablet computer, an e-reader, etc.). The memory module, the cache memory chip, and the like are used for heat dissipation. The heat dissipation structure 100 includes a base 10 and a cover 20 that is disposed on the base 10 . At least one closed cavity 40 is formed between the cover 20 and the base 10, and each of the sealed cavity 40 is filled with a heat sink 30.
該底座10和蓋體20均由導熱材料製成。所述導熱材料可以為金屬，該金屬優選為銅。Both the base 10 and the cover 20 are made of a thermally conductive material. The thermally conductive material may be a metal, preferably copper.
該散熱體30未將密閉腔體40完全填充，該散熱體30的材質為相變材料（PCM-Phase Chang Material）。散熱體30吸收熱量使其溫度升高至相變溫度時，散熱體30發生相變並進一步吸收儲存熱量。相變過程中，散熱體30的溫度保持為相變溫度不變。所述相變材料選自有機相變材料、無機相變材料、複合相變材料中的一種或幾種。無機相變材料主要有結晶水合鹽類、熔融鹽類、金屬合金類等；有機類相變材料主要包括石蠟、羧酸、聚乙烯、多元醇等；混合相變材料主要是有機和無機共熔相變材料的混合物。The heat sink 30 does not completely fill the sealed cavity 40. The heat sink 30 is made of a phase change material (PCM-Phase Chang Material). When the heat sink 30 absorbs heat and raises its temperature to the phase transition temperature, the heat sink 30 undergoes a phase change and further absorbs the stored heat. During the phase change, the temperature of the heat sink 30 is kept constant at the phase transition temperature. The phase change material is selected from one or more of an organic phase change material, an inorganic phase change material, and a composite phase change material. Inorganic phase change materials mainly include crystalline hydrated salts, molten salts, metal alloys, etc.; organic phase change materials mainly include paraffin, carboxylic acid, polyethylene, polyol, etc.; mixed phase change materials are mainly organic and inorganic eutectic materials. A mixture of phase change materials.
本實施例中，散熱結構100的厚度範圍為0.1~0.4mm，密閉腔體40的數量為九個。In this embodiment, the heat dissipation structure 100 has a thickness ranging from 0.1 to 0.4 mm, and the number of the sealed cavities 40 is nine.
請結合參閱圖3，所述底座10包括底板11和凸設於該底板11上的九個第一環形凸部12和圍繞該每一第一環形凸部12的第二環形凸部13。該每一第一環形凸部12的中央形成第一容置槽121。該每一第一環形凸部12與圍繞該第一環形凸部12的第二環形凸部13之間形成卡持槽131。Referring to FIG. 3 , the base 10 includes a bottom plate 11 and nine first annular convex portions 12 protruding from the bottom plate 11 and a second annular convex portion 13 surrounding each of the first annular convex portions 12 . . A center of each of the first annular protrusions 12 defines a first receiving groove 121. A holding groove 131 is formed between each of the first annular convex portions 12 and the second annular convex portion 13 surrounding the first annular convex portion 12.
請結合參閱圖4，所述蓋體20包括頂板21和凸設於該頂板21的九個第三環形凸部22。每一第三環形凸部22的中央形成第二容置槽221。該第三環形凸部22的尺寸小於卡持槽131的尺寸，使該第三環形凸部22可卡持於卡持槽131內，從而使第一容置槽121與第二容置槽221配合形成一密閉腔體40。Referring to FIG. 4 , the cover 20 includes a top plate 21 and nine third annular protrusions 22 protruding from the top plate 21 . A second receiving groove 221 is formed in the center of each of the third annular protrusions 22. The size of the third annular protrusion 22 is smaller than the size of the holding groove 131, so that the third annular protrusion 22 can be retained in the holding groove 131, so that the first receiving groove 121 and the second receiving groove 221 Cooperating to form a closed cavity 40.
本實施例中，該每一第三環形凸部22的高度小於每一卡持槽131的深度，以保證該第三環形凸部22可以卡持容置於卡持槽131內。In this embodiment, the height of each of the third annular protrusions 22 is smaller than the depth of each of the holding slots 131 to ensure that the third annular protrusions 22 can be received in the holding slots 131.
可以理解的，本發明不限於上述的方式形成所述的密閉腔體40，還可藉由其它的方式在底座10和蓋體20之間形成至少一密閉腔體40。It can be understood that the present invention is not limited to the above-described manner to form the closed cavity 40, and at least one closed cavity 40 can be formed between the base 10 and the cover 20 by other means.
本實施例中，所述卡持槽131與卡持壁223的結合處設置有黏接劑50，以將所述蓋體20和底座10黏接固定在一起，形成密封的密閉腔體40。該黏結劑50可以在常溫下固化，該黏結劑50優選為可以在室溫下固化的環氧樹脂。In this embodiment, the bonding portion of the holding groove 131 and the holding wall 223 is provided with an adhesive 50 for bonding and fixing the cover 20 and the base 10 together to form a sealed sealed cavity 40. The adhesive 50 can be cured at a normal temperature, and the adhesive 50 is preferably an epoxy resin which can be cured at room temperature.
在將所述底座10、蓋體20和散熱體30組裝在一起時，首先在底座10的每一卡持槽131內注入適量的黏接劑50，在每一第一容置槽121內放置散熱體30，然後將蓋體20的每一第三環形凸部22對應卡合在一卡持槽131內，該每一第一容置槽121與第二容置槽221配合形成密閉腔體40，所述黏接劑50將底座10和蓋體20黏接固定在一起並將每一密閉腔體40封閉，即組裝得到散熱結構100。When the base 10, the cover 20 and the heat sink 30 are assembled together, an appropriate amount of the adhesive 50 is first injected into each of the holding slots 131 of the base 10, and placed in each of the first receiving slots 121. The heat dissipating body 30 then engages each of the third annular protrusions 22 of the cover body 20 in a latching slot 131. Each of the first receiving slots 121 and the second receiving slot 221 cooperate to form a closed cavity. 40. The adhesive 50 bonds and fixes the base 10 and the cover 20 together and closes each of the sealed cavities 40, that is, the heat dissipation structure 100 is assembled.
請結合參閱圖5，在應用所述散熱結構100時，首先將該散熱結構100安裝於需散熱的裝置內的產熱元件400上，並使底座10或蓋體20鄰接產熱組件400。以產熱元件400鄰接底座10設置為例說明該散熱結構100的散熱過程：在裝置開始工作時，最初散熱體30的初始溫度低於其相變溫度，產熱元件400產生的熱量首先傳遞至散熱結構100的底座10，並經由底座10傳遞至蓋體20和散熱體30，最後藉由蓋體20和底座10與空氣的接觸將熱量散發出去，底座10、蓋體20、散熱體30因吸收熱量而溫度升高，當散熱體30的溫度升高至相變溫度時，組成散熱體30的相變材料發生相變，散熱體30吸收熱量並將吸收的熱量儲存起來，在散熱體30的整個相變過程中，散熱體30的溫度不變，如此，便可以有效的控制裝置的溫度。在裝置停止工作後，底座10、蓋體20、散熱體30內儲存的熱量繼續藉由底座10和蓋體20與空氣的接觸將熱量散發出去，底座10、蓋體20、散熱體30的溫度逐漸降低，散熱體30的溫度降低至其相變溫度時，散熱體30發生相變並將儲存的熱量散發出去，直至散熱體30、底座10、蓋體20的溫度與周圍環境的溫度一致，散熱體30的相變材料恢復至最初的物理狀態。Referring to FIG. 5 , when the heat dissipation structure 100 is applied, the heat dissipation structure 100 is first mounted on the heat generating component 400 in the device to be cooled, and the base 10 or the cover 20 is adjacent to the heat generating component 400 . The heat dissipation process of the heat dissipation structure 100 is illustrated by taking the heat generating component 400 adjacent to the base 10 as an example: when the device starts to work, the initial temperature of the heat sink 30 is lower than the phase transition temperature, and the heat generated by the heat generating component 400 is first transmitted to The base 10 of the heat dissipation structure 100 is transmitted to the cover body 20 and the heat sink 30 via the base 10. Finally, the heat is dissipated by the contact between the cover 20 and the base 10 and the air, and the base 10, the cover 20, and the heat sink 30 are The heat is absorbed and the temperature rises. When the temperature of the heat sink 30 rises to the phase transition temperature, the phase change material constituting the heat sink 30 undergoes a phase change, and the heat sink 30 absorbs heat and stores the absorbed heat. During the entire phase change process, the temperature of the heat sink 30 is constant, so that the temperature of the device can be effectively controlled. After the device stops working, the heat stored in the base 10, the cover 20, and the heat sink 30 continues to dissipate heat by the contact between the base 10 and the cover 20 and the air, and the temperature of the base 10, the cover 20, and the heat sink 30 Gradually, when the temperature of the heat sink 30 is lowered to its phase transition temperature, the heat sink 30 undergoes a phase change and dissipates the stored heat until the temperature of the heat sink 30, the base 10, and the cover 20 is consistent with the temperature of the surrounding environment. The phase change material of the heat sink 30 returns to its original physical state.
請結合參閱圖6~9，一種上述散熱結構100的製造方法，其包括以下步驟：Referring to FIGS. 6-9, a manufacturing method of the above heat dissipation structure 100 includes the following steps:
請參閱圖6，提供一覆銅板200，該覆銅板200包括絕緣層201、結合於絕緣層201一表面的頂板21、及結合於絕緣層201另一表面的底板11。該頂板21及底板11的材質均為金屬銅。Referring to FIG. 6, a copper clad laminate 200 is provided. The copper clad laminate 200 includes an insulating layer 201, a top plate 21 bonded to a surface of the insulating layer 201, and a bottom plate 11 bonded to the other surface of the insulating layer 201. The top plate 21 and the bottom plate 11 are made of metallic copper.
請進一步參閱圖7，在底板11上製作形成圖案化的第一干膜層301，並在頂板21上形成圖案化的第二幹膜層302。該第一干膜層301上具有至少一第一環形凹槽3011和圍繞該每一第一環形凹槽3011的第二環形凹槽3012。該第二幹膜層302上具有至少一第三環形凹槽3021。該第一環形凹槽3011和圍繞該每一第一環形凹槽3011的第二環形凹槽3012之間形成一間隔部3013。該每一間隔部3013與一第三環形凹槽3021相背對，且該間隔部3013的寬度稍大於第三環形凹槽3021的寬度。Referring to FIG. 7, a patterned first dry film layer 301 is formed on the bottom plate 11, and a patterned second dry film layer 302 is formed on the top plate 21. The first dry film layer 301 has at least one first annular groove 3011 and a second annular groove 3012 surrounding each of the first annular grooves 3011. The second dry film layer 302 has at least one third annular groove 3021. A spacer 3013 is formed between the first annular groove 3011 and the second annular groove 3012 surrounding each of the first annular grooves 3011. Each of the spacers 3013 is opposite to a third annular groove 3021, and the width of the spacer 3013 is slightly larger than the width of the third annular groove 3021.
請進一步參閱圖8，向第一環形凹槽3011、第二環形凹槽3012及第三環形凹槽3021內電鍍金屬，該金屬優選為銅。Referring to FIG. 8, the metal is electroplated into the first annular groove 3011, the second annular groove 3012, and the third annular groove 3021. The metal is preferably copper.
請進一步參閱圖9，去除第一干膜層301、第二幹膜層302及絕緣層201，即在頂板21上形成至少一第三環形凸部22，在底板11上形成至少一第一環形凸部12及圍繞該每一第一環形凸部12的第二環形凸部13。該第三環形凸部22上形成有一第二容置槽221。該第一環形凸部12形成有一第一容置槽121。第一環形凸部12與第二環形凸部13之間形成卡持槽131。所述第三環形凸部22的尺寸稍小於卡持槽131的尺寸。Referring to FIG. 9 , the first dry film layer 301 , the second dry film layer 302 and the insulating layer 201 are removed, that is, at least one third annular convex portion 22 is formed on the top plate 21 , and at least one first ring is formed on the bottom plate 11 . a convex portion 12 and a second annular convex portion 13 surrounding each of the first annular convex portions 12. A second receiving groove 221 is formed in the third annular convex portion 22 . The first annular protrusion 12 is formed with a first receiving groove 121. A holding groove 131 is formed between the first annular convex portion 12 and the second annular convex portion 13 . The size of the third annular convex portion 22 is slightly smaller than the size of the holding groove 131.
在每一第一容置槽121內填充散熱體30，在每一卡持槽131內填充黏接劑50，將蓋體20蓋合於底座10上，此時，卡持壁223卡持容置於卡持槽131內，黏接劑50將蓋體20和底座10黏接固定在一起，每一第一容置槽121與第二容置槽221配合形成密閉腔體40。即製得散熱結構100。Each of the first accommodating slots 121 is filled with a heat dissipating body 30, and each of the holding slots 131 is filled with an adhesive 50 to cover the cover 20 to the base 10. At this time, the holding wall 223 is held by the holding body. The adhesive body 50 is adhered to the base 20 and the base 10 is fixed to each other. Each of the first receiving slots 121 and the second receiving slot 221 cooperate to form a sealed cavity 40. That is, the heat dissipation structure 100 is fabricated.
所述散熱結構100藉由將蓋體20的第三環形凸部22卡持固定於底座10上的卡持槽131，並在卡持槽131內填充黏接劑50，從而在底座10和蓋體20之間形成密閉腔體40，散熱體30填充在密閉腔體40內，利用相變材料發生相變時的吸放熱的特性，達到主動快速散熱的目的，可以有效的提高散熱結構100的散熱效率。如此，便可以有效的控制LED燈及電子設備的溫度，可有效的延長LED燈及電子設備的使用壽命，減少LED燈的光衰現象。The heat dissipation structure 100 is fixed to the holding groove 131 of the base 10 by the third annular convex portion 22 of the cover 20, and the adhesive groove 50 is filled in the holding groove 131, so that the base 10 and the cover are A sealing cavity 40 is formed between the bodies 20, and the heat dissipating body 30 is filled in the sealing cavity 40, and the phase-change material absorbs and releases heat during phase change to achieve active and rapid heat dissipation, and the heat dissipation structure 100 can be effectively improved. Cooling efficiency. In this way, the temperature of the LED lamp and the electronic device can be effectively controlled, and the service life of the LED lamp and the electronic device can be effectively extended, and the light decay phenomenon of the LED lamp can be reduced.
100‧‧‧散熱結構100‧‧‧heat dissipation structure
10‧‧‧底座10‧‧‧Base
11‧‧‧底板11‧‧‧floor
12‧‧‧第一環形凸部12‧‧‧First annular convex
121‧‧‧第一容置槽121‧‧‧First accommodating slot
13‧‧‧第二環形凸部13‧‧‧Second annular convex
131‧‧‧卡持槽131‧‧‧ card slot
20‧‧‧蓋體20‧‧‧ cover
21‧‧‧頂板21‧‧‧ top board
22‧‧‧第三環形凸部22‧‧‧3rd annular convex
221‧‧‧第二容置槽221‧‧‧Second accommodating slot
30‧‧‧散熱體30‧‧‧ Heat sink
40‧‧‧密閉腔體40‧‧‧Closed cavity
50‧‧‧黏接劑50‧‧‧Adhesive
200‧‧‧覆銅板200‧‧‧CCL
201‧‧‧絕緣層201‧‧‧Insulation
301‧‧‧第一干膜層301‧‧‧First dry film
3011‧‧‧第一環形凹槽3011‧‧‧First annular groove
3012‧‧‧第二環形凹槽3012‧‧‧second annular groove
3013‧‧‧間隔部3013‧‧‧Interval
302‧‧‧第二幹膜層302‧‧‧Second dry film
3021‧‧‧第三環形凹槽3021‧‧‧3rd annular groove
400‧‧‧產熱組件400‧‧‧heat generating components
無no
100‧‧‧散熱結構100‧‧‧heat dissipation structure
10‧‧‧底座10‧‧‧Base
11‧‧‧底板11‧‧‧floor
12‧‧‧第一環形凸部12‧‧‧First annular convex
13‧‧‧第二環形凸部13‧‧‧Second annular convex
131‧‧‧卡持槽131‧‧‧ card slot
20‧‧‧蓋體20‧‧‧ cover
21‧‧‧頂板21‧‧‧ top board
22‧‧‧第三環形凸部22‧‧‧3rd annular convex
30‧‧‧散熱體30‧‧‧ Heat sink
40‧‧‧密閉腔體40‧‧‧Closed cavity
50‧‧‧黏接劑50‧‧‧Adhesive
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410786714.XACN105764298A (en) | 2014-12-18 | 2014-12-18 | Heat dissipation structure, manufacturing method therefor, and device employing heat dissipation structure |
| Publication Number | Publication Date |
|---|---|
| TW201624647Atrue TW201624647A (en) | 2016-07-01 |
| TWI560823B TWI560823B (en) | 2016-12-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104100619ATWI560823B (en) | 2014-12-18 | 2015-01-09 | Heat radiation structure, method for making the same, and device using the same |
| Country | Link |
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| CN (1) | CN105764298A (en) |
| TW (1) | TWI560823B (en) |
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