201243343 六、發明說明： 【發明所屬之技術領域】 本發明係關於高速測試之探針卡，特別是指一種具古 速模組之探針卡及其製作方法。 >'问 【先前技術】 隨著科技化電子產品漸趨高速運作的需求下，電 品内部之積體電路元件在晶圓測試時，測試探針卡除了· 顧及電子元件測試銲墊之間的間距，使探針卡的探針在二 觸測試薛墊時能精確對準，尚須顧慮電子元件的高速運作 需求’針對個別電子元件的測試特性而於探針卡電路 其操作條件的高速測試電路，提供積體電路 日日因達成元整的測試工程’藉以確保產品的使用品質。 然而探針卡製造商普遍可快速量產製作之測試公板係 構具有固定位置之測試接點’需再透過跳線結 構作為測4機台與探針間之訊號傳輸路徑，僅適於一般 二訊號傳輸測試用；除非所有傳輸結構完全針 的二二員:Μ條件而設計’包括顧及高頻測試中特定 的傳輸路徑等條件，否則以測試公 '，、、〆供4混合有—般中、低頻段及高頻 程技術元件所用。縱使㈣定線路佈設之專 於積體電路為相同頻率操作甚 之電路佈局有所更改圓製程產品’只要製程電子元件 輸路徑有所變更逮電子元件中各訊號之相對傳 更戍_一瓜中、低頻段的訊號傳輸路徑有相 201243343 對變更，探針卡製造商仍須重新設計製作與其電路佈局相 對應的專板測試之探針卡；為此探針卡製造業者皆須耗費 相當的工時及製作成本，尤其當製程積體電路越複雜且待 測試電路越繁多時，相對的專板製作則需花費更多的工時 及成本。 縱使有如台灣專利公告第1266882提出之一種以適於 傳輸高頻訊號之撓性導線構成之探測系統，然，該探測系 統於電路板上配置額外之位置設置撓性導線以接收高頻訊 號，需將測試機台之測試頭所提供高頻峨及—般頻段之 測試訊號分開於不同之訊號接收位置，無異影響—般頻段 測试sfl唬之電路佈設，需犧牲高頻傳輸路徑所佔去的電路 二間且將撓性導線自電路板邊緣延伸至具有高密度排列 之探針結射’對於有特定賴需求之微小探針結構而 將撓㈣線直錢人高錢騎之間無異直接造成對 探針彈性職方向之阻力；致使制晶粒麵有探針同時 點觸至不同元件之賴銲墊時，所受到之雜接觸力以及 對探針之反作用力亦完全不同，經—段時間使用過後勢必 影響不同探針之彈性回覆力，造成探針針尖之測試平面不 平齊而使局部測試㈣受力過大或電性接觸不良，致使降 ，積體電路晶圓電性測試之可靠度。再者，—旦每一待挪 阳粒有更多數不同條件之高頻元件時，測試機台需以更多 、】式頭輸出*同條件之高頻訊號，則上述探測系統需於電 反邊緣以更夕數之撓性導線接收所不同位置之測試頭所 供之高頻訊號；不但更多之撓性導線完全插人高密度探 201243343 針之間’對所有探針的彈性 只要操作過程财碰觸任何—撓性=成更大的阻力，且 完全錯位甚至損毁，需對導線’將致使所有探針 測試。 重新維修而無法進行電性 =此探針卡製造業者在面臨 時，如何能以最短的交期 ：下針卡 構，，體二 :::r針卡製造者所面臨的-‘ 之探針卡及其製作要供-種具高速模組 針卡的’本發明所提供—種具高速模組之探 針卡用讀輸測試機台所提供不同辭之第 =有以對待測積體電路元件進行電性測試，所= -電路基板，係具有位於内 針區，並具有相對之-上表面及一下表面，上= =:有t數第-測試接點，該下表面_= 1機1針接點’該第—測試接點用以傳遞上述測 機口=第—職訊號並與該第—探針接點電性導通； 速模組’係沿該電路基板之上表面自該測試區延 没，經穿設該電路基板沿該下表面繼續延伸，該高速 —軟性電路_製成，該軟性電路板佈設有一接地 201243343 層夕數訊號線、多數第二探針接點及多數接地接點，該 接地層與該等訊號線相鄰並列且電性連接上述測試機台之 4妾i也雷私 ^ ，各該訊號線用以傳遞上述測試機台之第二測試 點鄰、該第二探針接點設於各該訊號線之一端，該接地接 各"亥第二探針接點且電性連接該接地層；以及， 性遠垃探針組，設有多數第—及第二探針，該第一探針電 接該電路基板之第-探針接點，該第二探針具有一金 線/及與之相互電性絕緣之—地線或—金屬套管，該地 針，、，金屬針相鄰並列，該金屬套管以同軸環繞該金屬 亥金屬針電性連接該軟性電路板之第二探針接點，該 線或該金屬套管電性連接該軟性電路板之接地接點。 ，明之另-目的乃在於提供—種具高速模組之探針 可以不同之模組結構同時接收測試機台所提供不同頻 年之測試訊號’衫需犧牲較低頻段測試職之電路空間。 為達成前揭目的’本發明所提供—種具高速模組之探 …’用以傳輸測試機台所提供不同頻率之第—及第 =號’以對待測積體電路元件進行電性職，所述探針 卡包括有： —電路基板，係具有位於内mm =，並具有㈣之—絲硫—下表面，虹表面= μ區佈設有多數第—測試接點’該下表面於該探針: ，有多數第-探針接點，該第_測試接·關轉遞 試機台之第-測試訊號並與該第一探針接點電性導通；〆貝 一高速模组’ m電路紐之上表面自朗試區延 201243343 伸佈设’經穿設該電路基板沿該下表面繼續延伸 ，該高速 模,且以雜電路板所製成，該軟性電路板佈設有多數訊 號線用以傳遞上勒m機台之第二職訊號，絲性電路 板之數第二測·!式接點以及至少—通孔各該第 。測》式接點fi±連接該訊號線，且各該第二測試接點於該 電路基板之上表面覆蓋該電路基板之第—測試接點並與之 電性絕緣，該電路基板之至少—該第—職接點穿過該通 孔；以及， 一探針組，設有多數第―及第二探針分別電性連接該 電路基板之第-探針接點及練性電路板之訊號線。 為達成刚揭目的’本發明所提供一種具高速模組之探 針卡之製作方法係包括有以下步驟： a. 提供一電路基板，該電路基板係具有位於内、外圈 之-測試區及-探針區，並具有相對之—上表面及一下表 面’該上表祕朗额佈設有多數第—職接點，該下 表面於該探針區佈設有多數第—探針接點，使該等第一測 試接點分別透料數第—減線無第-探針接點電性導 通； b. 提供一軟性電路板，於該軟性電路板上佈設多數第 二訊號線及一接地層，該等第二訊號線與該接地層相鄰並 列，各該第二訊號線之一端設有一第二測試接點； c. 將該軟性電路板之一端疊置於該電路基板上表面 之測試區，各該第二測試接點對應覆蓋於該電路基板之第 一測試接點上並與之電性絕緣，且該電路基板與該軟性電 201243343 路板所層疊之數個該等第—測試接財，至少—該第 試接點透過該軟性電路板外露； …d.將該軟性電路板固定於該電路基板之上表面且沿 /電路土板之上表面自該測試區延伸穿設該電路基板至並 下表面之該探針區；以及， ^ e.提供夕數第一及第二探針’固定於該電路基板之探 針區’使該第—探針紐連接該電路基板之第—探針接 點，該第二探針具有—金屬針以及與之相互電性絕緣之一 管’該地線與該金屬針相鄰並列，該金屬 s二錢4金屬針，使該金屬針電性連接該軟性電 路板之第―訊號線，使舰線賴金料 性電路板之接地層。 【實施方式】 以下，兹配合圖示列舉若干較佳實 發明之結構與功效作詳細說明，其中所用圖示之簡2 明如下· ^ 一 =棘發明所提供第―較佳魏例之觀示意圖； 第逑第一較佳實施例之局部底視示意圖； 第二圖係上述第一較佳實施例之結構示意圖； 第四圖係上述第—較佳實施例之局部頂視示意圖，表 性電路板設於電職板上表面之結構示意圖； 第五圖係上述第四圖之5錢線剖視示意圖； 第六圖係本發_提供第二難實_之局部頂視示意 8 201243343 圖，表示紐電贿設於電概板上表面之結構示意圖； 第七圖係上述第六圖之7_7連線剖視示意圖； 第八圖係本發騎提供第三概實施例之結構示意圖； 第九圖係本發明所提供細較佳實施例之結構示意圖； 第十圖係本發騎提供第五較佳實施例之結構示意圖； 第十@係本發騎提供第六較佳實關之結構示意圖 -月參閱如第-至第五圖所示本發明所提供第—較佳 施例之-探針卡卜適用於測朗時具有於—般中、低頻 段運作之電子元件及以更高舰運作之高速電料件之積 體電路日日圓’因此測試機台可將較低測試頻率之第—測試 訊號及較高輯試職透過騎卡輸至 積體電路晶圓之待測晶粒以進行電性測試；該探’ 括有:電路基板10、至少—高速模組3G以及—探針組5〇l 其中· 請配合第H圖參照，電路基板1G可區分為位於 内、外圈之一测試㉟102及一探針區1〇4，並之 一上表面100及—下矣 邳對之 下表面108，該上表面106於該測 102佈設有多數第一制呀拉田μ 硎忒接點12，該下表面ι〇8於該 區104佈設有多數笙权^衣針 数第一探針接點14，該第一測試接 用以傳遞上述測試機a筮 ·· 、馎口之弟一測試訊號，並透過多 跳線結構或内部走線夕窜 ^ 卜σΡ 深之苐一 s孔號線16與該第一探針拉 14電性導通。 了钱點 高速模組30用以傳遞上述測試機台之第二剛試訊 201243343 號，係沿該電路基板ίο之上表面1〇6自該測試區1〇2延伸 佈。又’並穿設該電路基板1〇後沿該下表面1〇8延伸至該探 針組50邊緣，至於最適之數量及位置則依實際積體電路元 件之高頻測試需求而配置；該高速模組3〇可如本實施例所 提供之以單一軟性電路板3〇〇所製成，延伸於電路基板1〇 之上、下表面106、108，使第二測試訊號於軟性電路板3〇〇 内μ電路基板10之上、下表面1〇6、1〇8傳遞於測試區⑴2 及才木針區104之間。 配合第二至第五圖參照，該軟性電路板3〇〇之一端疊 置於5亥電路基板10上表面1〇6之測試區1〇2，並設有多數 第二測試接點302以及至少一通孔綱，各該第二測試接 點302覆蓋該電路基板1〇之第一測試接點12並與之電性 絕緣’未被第二測試接點3〇2 I蓋之其餘第一測試接點12 外露於該軟性電路板之通孔304 ;因此該軟性電路板 3〇〇藉由透過通孔304使第一測試接點12夕卜露，使軟性電 路板3〇0之第二測試接‘點302皆對準第-測試接點12上， 子、丨4機D而δ，測試頭所提供高頻訊號之位置維持相 同於原本第—測試接點12之相對位置。該軟性電路板300 ^佈設有1地们2以及多數訊號線34，該等訊號線34 ^生，接5亥第二測試接.點3〇2並與接地層％相鄰並列且相 :S緣層36 ’可依照第二測試訊號之實際高頻傳輸規格 ^訊號線34與接蘭32相隔特定厚度之絕料36 ;接地 曰32電性連接至少—該第二測試接點观，且軟性電路板 之其中—該通孔綱可用以設置—金屬塊％，與位於 201243343 通孔304下之第一測試接點12電性連接，因此軟性電路板 300除了可藉由至少一該第二測試接點3〇2使接地層32接 收測試機台所提供之接地電位，亦可藉由通孔3〇4中之金 屬塊38接收並透過第一測試接點12與電路基板1〇内部傳 遞接地電位之第一訊號線16等電位。請配合第二及第三圖 參照’該軟性電路板3〇〇之另一端延伸至電路基板1〇下表 面108之探針區1〇4,對應各訊號線34設有一第二探針接 點306及鄰近之一接地接點3〇8，第二探針接點3〇6位於 訊號線34之末端’接地接點3〇8與該接地層％電性導通； 當然，接地接點308可透過該絕緣層36與接地層32縱向 電性連接’或者移除第二探針接點3Q6鄰近之局部絕緣層 36使外露之接地層32形成接地接點3〇8，皆可具有本發明 所欲達成之功效，因而不在此限。 請配合第二及第三圖參照，探針組5〇之一固定座上 500設有多數第-及第二探針52、54，第一探針52電性連 接該電路基板10之第—探針無14，第二探針54為具高 頻傳輸特性之高頻探針結構，可如本實施例所使用之為一 金屬針542以及與之相互並列且電性絕緣之-地線544所 製成；當然亦可為-般具有同軸傳輸結構者，以一金屬針 以及於其外_赌繞之—金屬套f所製成，皆可具有本 發明所欲達成之功效，因而不在此限。該金屬針M2電性 連接該軟性電路板細之第二探針接點遍該地線⑽ 電性連接該軟性電路板，之接地接點遍。當然，為使 高頻訊號傳輸至第二探針54時伴隨之接地電位可維持於 201243343 间頻導通迴路上，料組更可_定座上，設有一金屬 片56與該等第二探針54之地線⑽i性連接，並將鄰近 用以導通測試機台之接地電位至待測晶粒所需之其中一該 第探針52電性連接該金屬片56，或者將該金屬片％延 伸至鄰近之連接待測試電子元件之接地電位之第一探針 52上直接與之電性導通，皆可具有本發明所欲達成之功 效’因而不在此限。 综合上述可知，本發明所提供探針卡丨可以電路基板 10之第―測試接點12接❹m機台所提供之第-測試訊 號，經該電路基板K)之第—訊躲16傳輸後，以探針組 5〇之第一探針52點觸待測晶粒中一般中、低頻段運作之 電子元件；同時可以高速模組30之軟性電路板3⑻所設置 之第二測試接點302接收測試機台所提供之第二測試訊 號，並透過軟性電路板3〇〇所設置之其中一通孔3〇4與電 路基板10之第-測試接點12對位，使測試機台之測試頭 所提供高頻訊號之位置維持相同於原本第一測試接點12 之相對位置，並仍可以通孔3〇4下第一測試接·點12接收第 一測試訊號，不需犧牲高頻傳輸路徑所佔去的電路空間。 且軟性電路板300傳遞第二測試訊號時，透過至少一該第 二測試接點3〇2或其中一通孔3〇4所設置之金屬塊犯接收 測試機台所提供之接地電位，可使接地電位伴隨第二測試 訊號於軟性電路板300之接地層32傳輸，維持第二測試訊 號於高速模組30内之高頻傳輸特性阻抗，因此再以探針組 50之第二探針54點觸待測晶粒中高頻段運作之高速電子 12 201243343 ==_晶_之所有不同操作頻段 電路板之内部1=之電性測試。更甚者，藉由軟性 ^ 電佈設結構’可使概電路板300表 ，、目w㈣衫間得明設 軟性電路板300所傳攝笛一、日w & 疋仟以狐 因此使測試元件電性之電_感特性； 連接軟性電路板300内部之訊號線34 执θ ’可依待H財電子元件之高賴號傳遞規 七不同而賴改錄性魏板㈣訊縣34之電容或 電感特性。 — '寻提的疋，上述鬲速模組3〇之軟性電路板3⑻ 所設置之接地層32主要為了接收測試機台所提供之接地 電位使伴隨第二職訊號於軟性電路板·中傳輸，不一 定需要藉由該第二測試接點302或通孔3〇4所設置之金屬 塊38與測試機台電性連接，·請參閱如第六及第七圖所示， 為本發明第二較佳實闕所提供另-高速馳4〇之-軟 性電路板4GG結構，具有與上述實施例相同之__接地層^ 及多數訊號線44，差異僅在於： 該軟性電路板_之接地層42於軟性電路板彻之側 邊與鄰近之第-職接點12 t性連接，可如本實施例所提 供者，將軟性電路板400 |面用以覆蓋接地層42之一表層 402於側邊將局部去除，而使接地層42於邊緣外露，與軟 性電路板4GG側邊鄰近之第—測試接點12電性連接，則接 地層42可以透過軟性電路板4〇〇側邊鄰近之第一測試接點 Ϊ2接收測試機台所提供之接地電位；且接地層42未佈設 201243343 至軟性電路板400所穿設一通孔404之邊緣，故第一測試 接點12在透過通孔404與測試機台之點觸頭接觸時，可與 接地層42電性絕緣，不至於影響第一測試接點12所接收 測試機台之第一測試訊號；因此本實施例所提供高速模組 40不但可供軟性電路板4〇〇傳遞高頻之第一測試訊號，更 藉由多數通孔之設置增加電路基板1〇對待測晶粒較低頻 段運作之電子元件測試之電路傳輸空間。 再者，本發明所提供高速模組可如上述實施例僅以單 一軟性電路板所製成，依據積體電路晶圓之電路佈局再於 軟性電路板内規劃對應高頻訊號傳輸位置之訊號線；或可 如第八及第九圖所示分別為本發明第三及第四較佳實施例 所提供之一高速模組35、37，以複數個軟性電路板分段延 伸於電路基板10之上、下表面1〇6、1〇8，與上述實施例 所提供者同樣使軟性電路板覆蓋電路基板1〇之第一測試 接點12，並接收測試機台所提供之第二測試訊號，使沿電 路基板10之上、下表面106、108自測試區1〇2至探針區 104以至探針組50之第二探針54，其差異僅在於： 第八圖所示咼速模組35之上、下軟性電路板35丨、 之間以一轉接器355電性連接’轉接器355可為多重矩陣 開關元件，用以將該上軟性電路板351之訊號線352切換 至與該下軟性電路板353之訊號線354 —對一電性導通。 第九圖所示高速模組37之上、下軟性電路板37卜373之 間以-高頻傳輸線375電性連接’用以將該上軟性電路板 371之訊號線372跳接至與該下軟性電路板373之訊號線 201243343 374 —對一電性導通。 ^速輪組35之各軟性電路板％卜 則可事先備製好岐路徑之訊號線352、354(或372、 洲，再依實際積魏路㈣之電路佈局將上、下軟性電 路板 351、353 (或 371、37^、 ^ 的模組製作I. 對應轉接導通’加速探針卡 、虽然’本例上述各實_所提供冑賴組主要在於 傳遞測4機台之第二測試訊號，使沿該電路基板⑺之上表 面1〇6自該測試區102延伸佈設，並穿設該電路基板10 後沿該下表面108延伸至該探針组5〇邊緣；因此除了可將 ，二測試訊觸立配胁高速模組以確保高頻訊號的傳輸 ⑽質’且因高速模組藉由軟性電路板沿著電路基板丨〇下表 面刚於探針區104延伸，不至於影響探針區104中高密 度的電路配置結構。至於若為了加速探針卡賴組製作工 時1量’除了可如上述第三及第四較佳實施例所提供之高 速2組’更可請參閱如第十圖所示本發明第五較佳實施例 斤提供之一向速模組6〇，具有一軟性電路板6㈨及多數傳 輪線62，與上述較佳實施例所提供者差異在於： 單11玄軟性電路板600係沿電路基板1〇之下表面1〇8 於探針區104延伸至探針組50邊緣，以供接設探針組5〇 之第二探針54 ;軟性電路板600具有與上述實施例相同之 一接地層002及多數訊號線604,接地層6〇2及訊號線6〇4 分別電性連接第二探針54之地線544及金屬針542。 傳輸線62延伸於電路基板1〇之上、下表面1〇6、1〇8， 201243343 各該傳輸線6 2具有一金屬線6 2 2及與之電性絕緣之一地線 624 ’金屬線622之兩端分別與該電路基板10之第一測試 接點12及該軟性電路板600之訊號線604電性連接，地線 624之兩端分別與該電路基板1〇用以接收測試機台接地電 位之第一測試接點12及該軟性電路板600之接地層602 電性連接。 因此本實施例所提供局速模組60在電路基板1〇電路 最密集之探針區104以外佈設跳線結構之該等傳輸線62， 不但對應積體電路晶圓不同製程產品之晶圓測試有更彈性 的跳線配置，亦有鄰近探針組50所設置的軟性電路板 600’而不至於在探針卡模組過程干擾高密度分佈的探針結 構’避免如習用探測系統容易造成探針損毀之缺點。 根據上述實施例所揭露之技術特徵，本發明更可提供 如第十一圖本發明第六實施例所示之高速模組7〇。該高速 模組70同樣具有單一之軟性電路板7〇〇及多數傳輸線 72,其中該傳輸線72係可以（但不限於）同軸線來實現。 而該咼速模組70與前述實施例所提供之高速模組6〇 異在於： ^ 該軟性電路板700係延伸設置於該電路基板1〇上表面 106之測試區102，並覆蓋該電路基板10之第-測試接點 12。同樣地，該軟性電路板7〇〇具有一接地層7〇2以及多 數訊號線704，其中各該訊號線7G4之—端係外露而形成 所謂的第二探針接點，且該接地層7G2之一端係同樣外露 而形成所謂的接地接點，其次，該接地層702以及各該訊 201243343 號線704係透過各該傳輸線72而間接地電性連接至該探針 組50之各該第二探針54。詳而言之，該等傳輸線72係延 伸於該電路基板10之上、下表面1〇6、1〇8之間，且各該 傳輸線72具有一金屬線722及與之電性絕緣之一地線 724,各該金屬線722之二端分別與該軟性電路板7〇〇之各 δ玄第一探針接點（亦即該訊號線704之外露部分）以及各 該第二探針54之金屬針542電性連接，而各該地線724 之二端則分別與該軟性電路板700之接地接點（亦即該接 地層702之外露部分）以及各該第二探針54之地線544(或 者金屬套）電性連接。如此，亦可達成本發明之目的。若 頻率的需求並沒有很高，在第二探針54的部份，可以只使 用金屬針542，而並不需要有地線544，此時，各該金屬線 722之二端分別與該軟性電路板7〇〇之各該第二探針接點 以及金屬針542電性連接，而各該地線724之二端則分別 與該軟性電路板7GG之接地接點錢__接地探針(圖未繪 示）電性連接。此外，可將其中的兩支該金屬針542組成一 組差動對喊騎’以祕倾差動赠u。㈣軟性電路 板700之接地層702，亦可以如第七圖所示，進一步與至 少一該第一測試接點12電性連接，該第一測試接點12接 收測試機台所提供之接地電位。 唯’以上所述者，僅為本發明之較佳可行實施例而已， 故舉凡應財發魏明纽巾料概圍所為之等效結構 變化，理應包含在本發明之專利範圍内。 17 201243343 【圖式簡單說明】 第-圖係本發明所提供第_紐實施例之觀示意圖； 第二圖係上述第-較佳實施例之局部底視示意圖； 第二圖係上述第一較佳實施例之結構示意圖； 第四圖係上述第一較佳實施例之局部頂視示意圖，表示軟 性電路板設於·基板上表面之結構示意圖； 第五圖係上述第四圖之5-5連線剖視示意圖； 第二圖係本發明所提供第二較佳實施例之局部頂視示意 圖，表示紐電路板餅電職板上絲之結構示意圖； 第七圖係上述第六圖之7_7連線剖視示意圖； 第八圖係本發明所提供第三健實酬之結構示意圖； 第九圖係本發贿提供第四較佳實關之結構示竟圖； 第十圖係本發明所提供第五較佳實施例之結構示i圖； 第十圖係本發㈣提供第六較佳實施例之結構示音圖。 【主要元件符號說明】 ^ 1探針卡 ' 6() ' 70高速模組 700軟性電路板 10電路基板 104探針區 108下表面 14第一探針接點 30、40、35、37 300、400、600、 302第二測試接點 304、404 通孔 102測試區 106上表面 12第一測試接點 16第一訊號線 402表層 306第二探針接點 201243343 308接地接點 32、42、602、702接地層 34、44、352、354、372、374、604、704 訊號線 35卜371上軟性電路板 355轉接器 36絕緣層 50探針組 52第一探針 542金屬針 56金屬片 624、724 地線 353、373下軟性電路板 375、62、72傳輸線 38金屬塊 500固定座 54第二探針 544地線 622、722金屬線 19201243343 VI. Description of the Invention: [Technical Field] The present invention relates to a probe card for high-speed testing, and more particularly to a probe card having an ancient speed module and a method of fabricating the same. > 'Q [Prior Art] With the demand for high-speed operation of technological electronic products, the integrated circuit components inside the electrical products are tested during wafer testing, except for the electronic component test pads. The spacing of the probe card enables precise alignment of the probe of the probe card in the two-touch test, and there is a concern about the high-speed operation requirements of the electronic component. The high-speed operation of the probe card circuit for the test characteristics of the individual electronic components. The test circuit provides the integrated circuit for the purpose of ensuring the quality of the product. However, the probe card manufacturer can generally mass-produce the test board system with a fixed position test contact 'requires the jumper structure as the signal transmission path between the 4 machine and the probe, only suitable for general The second signal transmission test; unless all the transmission structure is fully needled by the second or second member: the condition is designed to include the conditions of the specific transmission path in the high frequency test, otherwise the test is performed. Used in medium and low frequency bands and high frequency technology components. Even if the (4) fixed circuit layout is dedicated to the integrated circuit operation, the circuit layout is changed. The circular process product 'as long as the process electronic component transmission path is changed, the relative transmission of each signal in the electronic component is more 戍The signal transmission path of the low frequency band has a change of 201243343. The probe card manufacturer still has to redesign the probe card for the special board test corresponding to its circuit layout; for this reason, the probe card manufacturer has to spend considerable work. Time and production cost, especially when the process integrated circuit is more complicated and the circuit to be tested is more complicated, the relative special board production requires more labor and cost. Even if there is a detection system composed of a flexible wire suitable for transmitting high-frequency signals as proposed in Taiwan Patent Publication No. 1268882, the detection system is provided with an additional position on the circuit board to set the flexible wire to receive the high-frequency signal. Separate the test signals of the high frequency and general frequency bands provided by the test head of the test machine from different signal receiving positions, and have no effect. The circuit layout of the frequency band test sfl唬 needs to sacrifice the circuit occupied by the high frequency transmission path. Two and the flexible wires extend from the edge of the circuit board to the probes with high density of the array. 'For the micro-probe structure with specific requirements, the scratch (four) line is straightforward and the money is high. Resistance to the elastic direction of the probe; when the surface of the die has probes that touch the pads of different components at the same time, the miscontact force and the reaction force to the probe are completely different. After use, it will affect the elastic response force of different probes, causing the test plane of the probe tip to be uneven and causing partial test (4) excessive force or poor electrical contact. , The reliability of the electrical test wafers for integrated circuits. Furthermore, once each of the high-frequency components of the different conditions are needed, the test machine needs to output more high-frequency signals with the same condition, and the above detection system needs to be powered. The reverse edge receives the high-frequency signal from the test head at different positions with a flexible wire of more than a few radii; not only more flexible wires are completely inserted into the high-density probe 201243343 between the pins' elasticity of all the probes as long as the operation The process finance touches any—flexibility = greater resistance, and is completely misaligned or even damaged. The need for the wire will cause all probes to be tested. Re-maintenance and can not be electrical = how can the probe card manufacturer face the shortest delivery: the lower needle card, the body of the second:::r needle card manufacturer facing the ''probe The card and its production are to be supplied with a high-speed module card. The present invention provides a probe card for a high-speed module. The test card is provided with different words. Conducting an electrical test, where the circuit board has a central needle region and has a relative-upper surface and a lower surface, upper ==: there are t-number test points, the lower surface _= 1 machine 1 The pin contact 'the first test contact is used to transmit the above test port = the first job signal and is electrically connected to the first probe contact; the speed module ' is along the upper surface of the circuit substrate from the test The area is extended, and the circuit substrate is extended along the lower surface, and the high-speed flexible circuit is formed. The flexible circuit board is provided with a grounding 201243343 layer imaginary signal line, a plurality of second probe contacts and a plurality of grounding a grounding layer adjacent to the signal lines and juxtaposed and electrically connected to the testing machine 4妾i is also a private ^, each of the signal lines is used to transmit the second test point adjacent to the test machine, and the second probe contact is disposed at one end of each of the signal lines, and the grounding is connected to each " a second probe contact and electrically connected to the ground layer; and a remote probe set, wherein a plurality of first and second probes are electrically connected to the first probe of the circuit substrate Point, the second probe has a gold wire / and a ground wire or a metal sleeve electrically insulated from the same, the ground pin, the metal pins are adjacent to each other, and the metal sleeve surrounds the metal coaxially The metal pin is electrically connected to the second probe contact of the flexible circuit board, and the wire or the metal sleeve is electrically connected to the ground contact of the flexible circuit board. In addition, the purpose is to provide a probe with a high-speed module. Different test modules can be used to receive the test signals of different frequency years provided by the test machine. The shirt needs to sacrifice the circuit space of the lower frequency test. In order to achieve the pre-existing purpose of the present invention, a high-speed module is used to transmit the first and second numbers of different frequencies provided by the test machine to perform electrical functions on the circuit components to be measured. The probe card comprises: a circuit substrate having a bottom mm = and having a (four)-sulphur-lower surface, and a rainbow surface = μ region having a plurality of first-test contacts' the lower surface of the probe : , there are a plurality of first probe contacts, the first test signal of the first test probe is turned on and electrically connected to the first probe contact; the mussel high speed module 'm circuit The upper surface of the new layer is extended from the test area of 201243343. The circuit board is extended along the lower surface, and the high-speed mode is made of a circuit board. The flexible circuit board is provided with a plurality of signal lines. In order to pass the second job signal of the machine, the number of the silk circuit boards is the second measurement type and the at least one of the through holes. The measuring terminal fi± is connected to the signal line, and each of the second test contacts covers and is electrically insulated from the first test contact surface of the circuit substrate on the upper surface of the circuit substrate, at least the circuit substrate The first contact point passes through the through hole; and a probe set is provided with a plurality of first and second probes respectively electrically connecting the first probe contact of the circuit substrate and the signal of the practicable circuit board line. The method for fabricating a probe card with a high-speed module provided by the present invention includes the following steps: a. providing a circuit substrate having a test area located in the inner and outer rings and a probe area having opposite-upper surface and a lower surface. The upper surface of the stencil is provided with a plurality of first-job contacts, and the lower surface is provided with a plurality of first-probe contacts in the probe area, so that The first test contacts respectively have a first-to-probe contact point electrically-conductive; b. provide a flexible circuit board, and lay a plurality of second signal lines and a ground layer on the flexible circuit board The second signal lines are juxtaposed adjacent to the ground layer, and one end of each of the second signal lines is provided with a second test contact; c. testing one end of the flexible circuit board on the upper surface of the circuit substrate Each of the second test contacts is corresponding to and electrically insulated from the first test contact of the circuit substrate, and the circuit substrate and the flexible circuit 201243343 are stacked on the circuit board. Pick up money, at least - the first test contact through the The flexible circuit board is exposed; ... d. the flexible circuit board is fixed on the upper surface of the circuit substrate and extends along the surface of the / circuit board from the test area to the probe area of the circuit substrate to the lower surface; And, e. providing the first and second probes 'fixed to the probe region of the circuit substrate' such that the first probe is connected to the first probe contact of the circuit substrate, the second probe Having a metal pin and a tube electrically insulated from each other, wherein the ground wire is adjacent to the metal pin, the metal s is a metal needle, and the metal pin is electrically connected to the first signal of the flexible circuit board Line, the grounding layer of the ship's reliance on the gold circuit board. [Embodiment] Hereinafter, the structure and effect of several preferred embodiments of the present invention will be described in detail with reference to the drawings, wherein the simplified diagrams of the drawings are as follows: ^ A schematic diagram of the first preferred embodiment provided by the spine invention 2 is a partial bottom view of the first preferred embodiment; the second is a schematic structural view of the first preferred embodiment; and the fourth is a partial top view of the above-described preferred embodiment, the representative circuit The schematic diagram of the structure of the board on the surface of the electric board; the fifth figure is a schematic diagram of the 5th line of the fourth figure; the sixth picture is the partial top view of the present invention. A schematic diagram showing the structure of the electric bribe on the surface of the electric board; the seventh drawing is a schematic cross-sectional view of the 7th line of the sixth figure; the eighth drawing is a schematic diagram of the structure of the third embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 10 is a schematic structural view of a fifth preferred embodiment of the present invention; FIG. 10 is a schematic structural view of a fifth preferred embodiment of the present invention; - month see as the first to the fifth The probe card shown in the first preferred embodiment of the present invention is suitable for the electronic components operating in the middle and low frequency bands and the integrated circuit of the high speed electrical components operating in the higher ship. The Japanese yen's test machine can use the test signal of the lower test frequency and the higher test position to be tested by the card to the die to be tested on the integrated circuit wafer for electrical testing; The circuit board 10, at least the high-speed module 3G, and the probe set 5〇l, wherein the circuit board 1G can be divided into one of the inner and outer rings, the test 35102 and a probe area 1 〇4, and one of the upper surface 100 and the lower jaw facing the lower surface 108, the upper surface 106 is provided with a plurality of first first 拉拉田μ 硎忒 joints 12, the lower surface ι8 The first probe contact 14 is disposed in the area 104, and the first test is used to transmit the test signal of the test machine a筮··, the mouth of the mouth, and the multi-jump line. Structure or internal wiring 窜 窜 Ρ Ρ Ρ Ρ s s s s 号 号 与 与 s s s s s s s s s s 与 与 与 与 与The money point high-speed module 30 is used to transmit the second test of the test machine No. 201243343, which extends from the test area 1〇2 along the upper surface 1〇6 of the circuit board ίο. Further, the circuit board 1 is disposed and extends along the lower surface 1〇8 to the edge of the probe set 50, and the optimum number and position are configured according to the high frequency test requirements of the actual integrated circuit components; The module 3 can be made of a single flexible circuit board 3〇〇 as shown in this embodiment, extending over the circuit board 1 、 above and the lower surface 106, 108, so that the second test signal is on the flexible circuit board 3〇 The upper surface 1〇6, 1〇8 of the inner μ circuit board 10 is transferred between the test area (1) 2 and the wood needle area 104. Referring to the second to fifth figures, one end of the flexible circuit board 3 is stacked on the test area 1〇2 of the upper surface 1〇6 of the 5H circuit substrate 10, and is provided with a plurality of second test contacts 302 and at least a through hole, each of the second test contacts 302 covers the first test contact 12 of the circuit substrate 1 and is electrically insulated from the first test connection that is not covered by the second test contact 3〇2 I Point 12 is exposed to the through hole 304 of the flexible circuit board; therefore, the flexible circuit board 3 使 exposes the first test contact 12 through the through hole 304, so that the second test connection of the flexible circuit board 3〇0 'Point 302 is aligned with the first test contact 12, the sub-, 丨4 machine D and δ, the position of the high-frequency signal provided by the test head is maintained at the same position as the original first-test contact 12. The flexible circuit board 300 is provided with a ground 2 and a plurality of signal lines 34. The signal lines 34 are connected, and the second test connection is connected to the ground. The ground layer is adjacent to the ground layer and the phase is: S The edge layer 36' can be in accordance with the actual high-frequency transmission specification of the second test signal. The signal line 34 is separated from the connection 32 by a specific thickness of 36; the grounding layer 32 is electrically connected at least - the second test contact point, and the softness The circuit board - the through hole can be used to set - the metal block %, electrically connected to the first test contact 12 under the 201243343 through hole 304, so the flexible circuit board 300 can be replaced by at least one of the second test The contact 3〇2 causes the ground layer 32 to receive the ground potential provided by the test machine, and can also receive the ground potential through the metal block 38 in the through hole 3〇4 and through the first test contact 12 and the circuit substrate 1〇. The first signal line 16 is equipotential. Please refer to the second and third figures with reference to 'the other end of the flexible circuit board 3' extends to the probe area 1〇4 of the lower surface 108 of the circuit substrate 1 and a second probe contact corresponding to each signal line 34. 306 and one of the adjacent grounding contacts 3〇8, the second probe contact 3〇6 is located at the end of the signal line 34. The grounding contact 3〇8 is electrically connected to the grounding layer. Of course, the grounding contact 308 can be The conductive layer 36 is electrically connected to the ground layer 32 longitudinally or the local insulating layer 36 adjacent to the second probe contact 3Q6 is removed to form the exposed ground layer 32 to form a ground contact 3〇8, which may have the present invention. This is not the limit. Referring to the second and third figures, a plurality of first and second probes 52 and 54 are disposed on one of the probe holders 5, and the first probe 52 is electrically connected to the first substrate 52. The probe has no 14 and the second probe 54 is a high-frequency probe structure having a high-frequency transmission characteristic. As used in this embodiment, a metal pin 542 and a mutually insulated and electrically insulated ground-ground 544 can be used. Made of; of course, it can also be made of a coaxial transmission structure, which is made of a metal needle and a metal sleeve f, which can be achieved by the present invention. limit. The metal pin M2 is electrically connected to the second probe contact of the flexible circuit board. The ground wire (10) is electrically connected to the flexible circuit board, and the ground contact is repeated. Of course, in order to transmit the high frequency signal to the second probe 54, the ground potential can be maintained on the inter-frequency conduction loop of 201243343, and the material group can be further fixed, and a metal piece 56 and the second probe are disposed. The ground wire (10) of the 54 is electrically connected, and one of the probes 52 for electrically connecting the ground potential of the test machine to the die to be tested is electrically connected to the metal piece 56, or the metal piece is extended by %. The first probe 52 connected to the ground potential of the electronic component to be tested is directly electrically connected to the adjacent probe, and the effect of the present invention can be achieved. In summary, the probe card provided by the present invention can be connected to the first test signal provided by the first test contact 12 of the circuit substrate 10, and transmitted through the first signal of the circuit substrate K). The first probe 52 of the probe set 5 touches the electronic components in the normal middle and low frequency bands of the die to be tested; and the second test contact 302 provided by the flexible circuit board 3 (8) of the high speed module 30 can receive the test. The second test signal provided by the machine is aligned with the first test contact 12 of the circuit substrate 10 through one of the through holes 3〇4 provided in the flexible circuit board 3,, so that the test head of the test machine is provided high. The position of the frequency signal is maintained at the same position as the original first test contact 12, and the first test signal can still be received through the first test connection point 12 at the through hole 3〇4 without sacrificing the high frequency transmission path. Circuit space. When the flexible circuit board 300 transmits the second test signal, the ground potential is provided by the metal block provided by the at least one second test contact 3〇2 or one of the through holes 3〇4 to receive the ground potential provided by the test machine. The second test signal is transmitted to the ground layer 32 of the flexible circuit board 300 to maintain the high frequency transmission characteristic impedance of the second test signal in the high speed module 30. Therefore, the second probe 54 of the probe set 50 is touched. High-speed electrons operating in the high-frequency band of the die 12 201243343 ==_ Crystal_All the different operating frequency bands of the circuit board 1 = electrical test. What's more, the flexible circuit board structure can be used to make the circuit board 300 table, and the head w (four) shirts are clearly set with the flexible circuit board 300 to transmit the flute, the day w & Electrical _ Sense characteristics; connected to the signal line 34 inside the flexible circuit board 300 θ ′ can be based on the high-reliance transmission rules of the Hi-Fei electronic components, depending on the different parameters of the slabs (four) Xunxian 34 capacitors or Inductive characteristics. — 'Finding the 疋, the grounding layer 32 provided by the flexible circuit board 3 (8) of the above idle module 3 is mainly for receiving the ground potential provided by the test machine, so that the second job signal is transmitted in the flexible circuit board, The metal block 38 provided by the second test contact 302 or the through hole 3〇4 must be electrically connected to the test machine. Please refer to the sixth and seventh figures for the second preferred embodiment of the present invention. The flexible circuit board 4GG structure provided by the other embodiment has the same __ground layer ^ and a plurality of signal lines 44 as the above embodiment, except that the ground layer 42 of the flexible circuit board is The flexible circuit board is connected to the adjacent first-level contact 12 t, and the flexible circuit board 400 | surface is used to cover the surface layer 402 of the ground layer 42 on the side as will be provided in this embodiment. Partially removed, and the ground layer 42 is exposed at the edge, and electrically connected to the first test contact 12 adjacent to the side of the flexible circuit board 4GG, the ground layer 42 can pass through the first side of the flexible circuit board 4 邻近 adjacent to the first test Contact Ϊ2 receives the ground potential provided by the test machine; The grounding layer 42 is not disposed with the edge of the through hole 404 of the flexible circuit board 400. Therefore, the first test contact 12 can be electrically connected to the grounding layer 42 when the through hole 404 contacts the point contact of the testing machine. The insulating test does not affect the first test signal of the test machine received by the first test contact 12; therefore, the high speed module 40 provided in this embodiment can not only transmit the first test signal of the high frequency to the flexible circuit board 4 Moreover, the circuit transmission space of the electronic component test for the lower frequency band of the die to be measured is increased by the arrangement of the plurality of via holes. Furthermore, the high-speed module provided by the present invention can be made only by a single flexible circuit board as described in the above embodiment, and the signal line corresponding to the high-frequency signal transmission position is planned in the flexible circuit board according to the circuit layout of the integrated circuit wafer. Or a high-speed module 35, 37 provided in the third and fourth preferred embodiments of the present invention, as shown in the eighth and ninth embodiments, respectively, extending from the plurality of flexible circuit boards to the circuit substrate 10 The upper and lower surfaces 1〇6 and 1〇8, similarly to the above embodiments, enable the flexible circuit board to cover the first test contact 12 of the circuit substrate 1 and receive the second test signal provided by the test machine. The difference between the upper and lower surfaces 106, 108 of the circuit substrate 10 from the test area 1 〇 2 to the probe area 104 to the second probe 54 of the probe set 50 is only in the following: The upper and lower flexible circuit boards 35 are electrically connected to each other by an adapter 355. The adapter 355 can be a multi-matrix switching element for switching the signal line 352 of the upper flexible circuit board 351 to The signal line 354 of the lower flexible circuit board 353 is electrically conductive. The high-speed module 37 shown in FIG. 9 and the lower flexible circuit board 37 and 373 are electrically connected by a high-frequency transmission line 375 to jump the signal line 372 of the upper flexible circuit board 371 to the lower side. The signal line of the flexible circuit board 373 201243343 374 - is electrically conductive. ^The flexible circuit board of the speed wheel group 35% can be prepared in advance for the signal line 352, 354 (or 372, continent, and then according to the circuit layout of the actual product Wei Road (four), the upper and lower flexible circuit board 351 , 353 (or 371, 37 ^, ^ module production I. Corresponding transfer conduction 'acceleration probe card, although 'the above examples of the actual _ provided by the reliance group mainly in the second test of the transmission test 4 machine a signal extending from the test area 102 along the upper surface 1〇6 of the circuit substrate (7), and extending through the lower surface 108 to the edge of the probe set 5〇 after passing through the circuit substrate 10; The second test touches the high-speed module to ensure the transmission of the high-frequency signal (10) quality and because the high-speed module extends along the lower surface of the circuit substrate just below the probe area 104 by the flexible circuit board, so as not to affect the detection A high-density circuit configuration structure in the pin area 104. As for the speed of the probe card group, the amount of '1' can be as described in the third and fourth preferred embodiments described above. The fifth preferred embodiment of the present invention provides a one-way speed mode The group 6〇 has a flexible circuit board 6 (9) and a plurality of transmission lines 62, which differs from the preferred embodiment described above in that: a single 11 flexible circuit board 600 is mounted along the lower surface of the circuit board 1〇8 The needle region 104 extends to the edge of the probe set 50 for the second probe 54 of the probe set 5; the flexible circuit board 600 has one of the same ground layer 002 and a plurality of signal lines 604 as the above embodiment, and the ground layer 6〇2 and the signal line 6〇4 are electrically connected to the ground line 544 of the second probe 54 and the metal pin 542. The transmission line 62 extends above the circuit board 1〇, the lower surface 1〇6, 1〇8, 201243343 The transmission line 6 2 has a metal line 6 2 2 and a signal electrically insulated from one of the ground lines 624 ′ of the metal line 622 and the first test contact 12 of the circuit substrate 10 and the signal of the flexible circuit board 600 The wire 604 is electrically connected, and the two ends of the ground wire 624 are respectively electrically connected to the first test contact 12 of the circuit substrate 1 for receiving the ground potential of the test machine and the ground layer 602 of the flexible circuit board 600. The local speed module 60 provided in the embodiment is in the probe area 104 where the circuit board 1 is the most dense. The transmission lines 62 of the jumper structure are arranged to have a more flexible jumper configuration for the wafer test of the different process products of the integrated circuit wafer, and the flexible circuit board 600' disposed adjacent to the probe set 50 is not used. The probe card module process interferes with the high-density distribution of the probe structure 'to avoid the disadvantage that the probe detection system is easy to cause the probe to be damaged. According to the technical features disclosed in the above embodiments, the present invention can further provide the eleventh figure. The high speed module 7 is shown in the sixth embodiment. The high speed module 70 also has a single flexible circuit board 7 and a plurality of transmission lines 72, wherein the transmission line 72 can be implemented by, but not limited to, a coaxial line. The idling module 70 is different from the high-speed module 6 provided by the foregoing embodiment in that: the flexible circuit board 700 extends over the test area 102 of the upper surface 106 of the circuit substrate 1 and covers the circuit substrate. 10th - Test contact 12. Similarly, the flexible circuit board 7 has a ground layer 7〇2 and a plurality of signal lines 704, wherein the ends of the signal lines 7G4 are exposed to form a so-called second probe contact, and the ground layer 7G2 One end is also exposed to form a so-called ground contact. Secondly, the ground layer 702 and each of the lines 201243343 704 are indirectly electrically connected to each of the second of the probe sets 50 through the respective transmission lines 72. Probe 54. In detail, the transmission lines 72 extend over the circuit board 10 and between the lower surfaces 1〇6 and 1〇8, and each of the transmission lines 72 has a metal line 722 and is electrically insulated therefrom. a line 724, the two ends of each of the metal lines 722 are respectively connected to the δ 第一 first probe contacts of the flexible circuit board 7 (ie, the exposed portion of the signal line 704) and the second probes 54 The metal pins 542 are electrically connected, and the two ends of the ground wires 724 are respectively grounded with the flexible circuit board 700 (that is, the exposed portion of the ground layer 702) and the ground of each of the second probes 54. 544 (or metal sleeve) is electrically connected. Thus, the object of the invention can also be achieved. If the frequency requirement is not very high, in the portion of the second probe 54, only the metal pin 542 can be used, and the ground wire 544 is not needed. At this time, the two ends of the metal wires 722 are respectively associated with the softness. Each of the second probe contacts of the circuit board 7 and the metal pin 542 are electrically connected, and the two ends of each of the ground wires 724 are respectively connected to the ground of the flexible circuit board 7GG. The figure is not shown) electrical connection. In addition, two of the metal needles 542 can be grouped into a group of differential pairs of shoutings. (4) The ground layer 702 of the flexible circuit board 700 may be further electrically connected to at least one of the first test contacts 12 as shown in the seventh figure. The first test contact 12 receives the ground potential provided by the test machine. However, the above description is only a preferred embodiment of the present invention, and the equivalent structural changes of the company should be included in the patent scope of the present invention. 17 201243343 [Brief Description of the Drawings] The first drawing is a schematic view of the first embodiment of the present invention; the second drawing is a partial bottom view of the above-described first preferred embodiment; FIG. 4 is a partial top plan view showing the first preferred embodiment of the present invention, showing a schematic structural view of the flexible circuit board disposed on the upper surface of the substrate; and the fifth drawing is 5-5 of the fourth figure. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a partial top plan view showing a second preferred embodiment of the present invention, showing a schematic view of the structure of the wire on the circuit board of the circuit board; the seventh figure is 7-7 of the above sixth figure. A schematic cross-sectional view of the line; the eighth figure is a schematic diagram of the structure of the third healthy reward provided by the present invention; the ninth figure is a structural diagram showing the fourth best practice of the present bribe; The structure of the fifth preferred embodiment is provided. FIG. 10 is a structural diagram showing the structure of the sixth preferred embodiment. [Main component symbol description] ^ 1 probe card '6()' 70 high speed module 700 flexible circuit board 10 circuit substrate 104 probe area 108 lower surface 14 first probe contacts 30, 40, 35, 37 300, 400, 600, 302 second test contact 304, 404 through hole 102 test area 106 upper surface 12 first test contact 16 first signal line 402 surface layer 306 second probe contact 201243343 308 ground contact 32, 42, 602, 702 ground layer 34, 44, 352, 354, 372, 374, 604, 704 signal line 35 371 on the flexible circuit board 355 adapter 36 insulation layer 50 probe group 52 first probe 542 metal needle 56 metal Chips 624, 724 Ground 353, 373 Lower flexible circuit board 375, 62, 72 Transmission line 38 Metal block 500 Fixing block 54 Second probe 544 Ground wire 622, 722 Metal wire 19