201226791 六、發明說明： 【發明所屬之技術領域1 本發明是有關於一種散熱片，特別是有關於一種散熱 鈑金件及此散熱鈑金件之應用。 【先前技術】 發光二極體在工作時會伴隨產生高溫，先前技術常使 用風扇、散熱片、散熱鰭片，以降低發光二極體熱量之累 積。然而’隨者尺寸微小化與效能提升的需求下，發光二 極體需要更有效及方便之散熱方式。 舉例而言，輸入發光二極體的能量中，大約只有30% 的電能會被轉換成光源，而其他70%的電能則會被轉換成 熱量。當發光二極體在工作時，若沒有適時將熱量導出， 則會造成發光二極體的溫度升高，進而減弱了發光二極體 的發光亮度’甚至會造成發光二極體的損壞，也會縮短發 光二極體的使用壽命。 根據平面顯示器的市場趨勢，背光模組採用發光二極 體為背光源已成為主流，未來發光二極體電視會朝向大尺 寸且薄型化發展’所以側光式（side view type)發光二極 體之背光模組將是未來的研發重點。 通常而β上述为光模組的發光二極體所產生之廢熱 會過於集巾於平面顯示器之—侧，嚴重時，將導致發光二 極體之ΡΝ接面之溫度過高，進而造成發光二極體的損 壞，也會縮短發光二極體的使用壽命。 因此，業者針對上述問題提供兩種背光模組之習知散 熱結構。請參閱第丨圖所示，第丨圖繪示—種習知散熱結 201226791 構^之示意圖。第！圖之習知散熱結構ι〇提到 發光兀件12(Llghtbar)、一散熱塊13及 發光元件12放置於散熱塊13 導熱^組14。 背板11之-面上。導熱管’且兩相時放置於 熱管組14包含導熱管15及導執技士 A 1之另面。導 元件12工作時，發光元件12之、二/ 16 °如此，當發光 至背板11，背板11再將發光元件f熱塊Π傳遞 以便導熱管15將發光元件12 專至導熱管15’ 散熱效果。 “’進而產生 然而，此種散熱結構1〇仍需要提供導熱管支架 支稽並岐導熱管16，才能使導熱管組 ^ 之另面，不僅組裝程序繁雜，同時需另外準備導t管= 16，也增加材料成本及儲存成本。 两导…g支条 請參閱第2圖所示，第„ 》千1 羽士 會不另種習知散熱結構20 之不思圖。第2圖之習知散熱結構20提到-背板2卜一 發光元件Kaightbar)、- L型散熱塊23及一導敎管… 發光凡件22放置於L型散熱塊”之一端， 23之另端與導熱管25皆放置於背板21之同面上。：： 當發光7L件22工作時，發光元件22之熱能可經由L型散 熱塊23 #遞至背板21 ’背板21再將發光元件22之敎能 傳至導熱管25，以便導熱管25將發光㈣22之熱能傳送 出去’進而產生散熱效果。 相較於第1圖所提到之散熱結構1G，由於第2圖之發 光元件22所產生之熱能不需從背板21之-面完全通過背 板21之另面才能被傳遞至導熱f 25，故，第2圖所提到 之散熱結構20提供了較低之熱阻，以致提供較佳之散熱效[ 201226791 ο 率 散教=衫更狀散熱絲，業者仍賴顿更佳化之 为r之以同時兼顧熱傳性、結構強度及低成本的特性， 實屬田别重要研發課題之一， 進的目標。 力珉爲田刖相關領域亟需改 【發明内容】201226791 VI. Description of the Invention: [Technical Field 1 of the Invention] The present invention relates to a heat sink, and more particularly to a heat-dissipating sheet metal member and the use of the heat-dissipating sheet metal member. [Prior Art] Light-emitting diodes are accompanied by high temperatures during operation. Previously, fans, heat sinks, and heat-dissipating fins were often used to reduce the heat build-up of the light-emitting diodes. However, under the demand for miniaturization and performance improvement, the LED needs a more efficient and convenient way of dissipating heat. For example, only about 30% of the energy input into the LED will be converted into a light source, while the other 70% will be converted into heat. When the light-emitting diode is in operation, if the heat is not released in time, the temperature of the light-emitting diode will rise, and the light-emitting brightness of the light-emitting diode will be weakened, which may even cause damage to the light-emitting diode. Will shorten the life of the LED. According to the market trend of flat panel displays, backlight modules have become the mainstream with backlights. In the future, LEDs will be developed toward large size and thinner. So the side view type LEDs The backlight module will be the focus of future research and development. Generally, the waste heat generated by the above-mentioned light-emitting diode of the optical module may be too thick on the side of the flat display, and in severe cases, the temperature of the junction of the light-emitting diode will be too high, thereby causing the light-emitting two. Damage to the polar body also shortens the service life of the light-emitting diode. Therefore, the industry provides a conventional heat dissipation structure for two backlight modules in response to the above problems. Please refer to the figure in the figure. The figure is a schematic diagram of a conventional heat dissipation junction 201226791. The first! The conventional heat dissipation structure of the figure refers to a light-emitting element 12 (Llghtbar), a heat-dissipating block 13 and a light-emitting element 12 placed on the heat-dissipating block 13 heat-conductive group 14. On the back of the backboard 11 . The heat pipe 'and two phases are placed on the heat pipe group 14 including the heat pipe 15 and the other side of the guide technician A 1 . When the guiding element 12 is in operation, the light-emitting element 12 is two/16°. When the light-emitting element 12 is illuminated to the backing plate 11, the backing plate 11 transfers the heat-emitting element f to the heat-transfer tube 15 to transfer the light-emitting element 12 to the heat-conducting tube 15'. heat radiation. "'In turn, however, this kind of heat dissipation structure 1〇 still needs to provide the heat pipe support and the heat pipe 16 to make the heat pipe group ^ the other side, not only the assembly process is complicated, but also need to prepare the guide tube = 16, also Increase the cost of materials and storage costs. For the two guides ... g, please refer to Figure 2, the first „ ” 千 1 1 will not have a different kind of heat dissipation structure 20. The conventional heat dissipating structure 20 of Fig. 2 refers to a back plate 2, a light emitting element (Kaightbar), an L type heat dissipating block 23, and a guiding tube. The light emitting unit 22 is placed at one end of the L type heat dissipating block, 23 The other end and the heat pipe 25 are placed on the same surface of the back plate 21.: When the light-emitting 7L member 22 is in operation, the heat energy of the light-emitting element 22 can be transferred to the back plate 21 'back plate 21 via the L-shaped heat-dissipating block 23 The heat of the light-emitting element 22 can be transmitted to the heat-conducting tube 25, so that the heat-transfer tube 25 transmits the heat energy of the light-emitting (four) 22 to generate a heat-dissipating effect. Compared with the heat-dissipating structure 1G mentioned in FIG. 1, the light of the second figure The thermal energy generated by the component 22 does not need to pass from the other side of the backplane 21 through the other side of the backplane 21 to be transferred to the heat transfer f 25 . Therefore, the heat dissipation structure 20 mentioned in FIG. 2 provides a lower thermal resistance. In order to provide better heat dissipation [201226791 ο rate of education = shirts more heat-dissipating wire, the industry is still better to be r to take into account the heat transfer, structural strength and low cost characteristics, it is a field One of the important research and development topics, the goal of the advancement.
之應用，用Γ目的提供—種散熱鈑金件及此散熱鈑金件 之P-N接1 更佳之散熱效果，#此降低發光二極體 之溫度’進而降低發光二極體導致損壞之機率。 之庳用Μ之—目的提供—種餘鈑金件及此散熱鈑金件 本^：機會Γ方便組裝㈣，也免除增加材料成本及儲存成 ^發明之一實施態樣，散熱鈑金件用以接觸一發埶 四片^含^少一對折部、二第二片體、二第三片體及二第 片體。對折部一體成型地包含二第一片體，此些第一片 之側相互連接，此些第—片體之另側分別朝—相同方 »延伸’且此些第一片體相互緊貼。此些第二片體分別位 於此些第-片體之另側’且此些第二片體分別朝二相反方 向水平=延伸。此些第三片體分別一體成型地位於此些第 一片體遠離此些第一片體之一側，且分別朝此相同方向延 伸。此些第四片體分別一體成型地位於此些第三片體遠離 第二片體之一側，且分別朝此些相反方向水平地延伸。 本發明之另一實施態樣，係提供一具上述散熱飯金件 之散熱模組。散熱模組包含一上述散熱鈑金件及一發光模 組。發光模組位於散熱鈑金件之一側，包含一基板及多個[ 201226791 發光一極體。基板包含一第一表面、一第二表面與一第三 表面。第一表面接觸其令一第一片體，第二表面接觸其中 一第一片體，第三表面對應於第一表面。此些發光二極體 排列於基板的第三表面上。 ，本發明之又一實施態樣，係提供一具上述散熱鈑金件 之煮光模組。背光模組包含一背板、一上述之散熱模組、 至少一導熱管、一反射片、一導光板及至少一光學膜片。 散熱模組中之散熱鈑金件之此些第四片體分別固定於背板 上，^背板、第二片體及第三片體共構成一容置空間。一 導熱管部分地位於容置空間中，且接觸背板及第二片體。 反射片配置於其中—第二片體及背板上。導光板配置於反 射片上，且對應於發光模組之此些發光二極體。光學膜片 疊設於導光板遠離背板之一側。 本發明之再一實施態樣，係提供一具上述散熱鈑金件 之顯示器。顯示器包含一上述之背光模組及一液晶顯示面 板。液晶顯示面板位於光學膜片遠離導光板之一側。 綜上所述，本發明散熱鈑金件及此散熱鈑金件之應用 中，藉由散熱鈑金件之設計，可引導發光模組所發出之熱 能，不需經由背板，直接傳遞至導熱管，藉此提供更佳之 散熱途位。同時，藉由散熱鈑金件之設計，不僅支樓發光 模組，也可支撐反射片、導光板及光學膜片，降低另設支 撐反射片、導光板及光學膜片之元件之成本。 【實施方式】 以下將以圖示及詳細說明清楚說明本發明之精神，如 熟悉此技術之人員在瞭解本發明之實施例後，當可由本發[s] 7 201226791 明所教示之技術，加以改變及修掷，其並不脫離本發明之 精神與範圍。 請參閱第3圖。第3圖输示本發明散熱鈑金件剛於 一實施例中之外觀示意圖。 ' 本發明提出一種散熱鈑金件100。此實施例中，此散 熱鈑金件100呈立體狀，可由—狹長金屬板經反摺多次二 製成。此散熱鈑金件100至少分為一對折部11〇、二第二 片體120、二第三片體130及二第四片體14〇。對折部11〇、 第二片體120、第三片體130及第四片體14〇與上述之狹 長金屬板具有相同之延伸方向X。 對折部110係狹長金屬板對折後所形成之二第一片體 111 ’此些第一片體111之一側一體成型地相互連接，此些 第一片體111之另側分別共同朝一方向D1延伸，且此些^ 一片體111相互緊貼，使此些第一片體之間實質上保 持零間隙。 此些第二片體120分別一體成型地位於此些第一片體 111之另側，且分別背對地朝二相反方向D2、D3水平地延 伸。此些第二片體120可與此些第一片體1U可大致垂直， 但本發明不限於此。此些第三片體13〇分別一體成型地位 於此些第二片體120遠離第一片體U1之一側，且分別共 同朝此方向D1延伸。此些第四片體14〇分別一體成型地 位於此些第三片體130遠離第二片體12()之一侧，且分別 背對地朝此些相反方向D2 ' D3水平地延伸》 請參閱第4圖。第4圖繪示本發明應用此散熱鈑金件 100之散熱模組300於一實施例中之側視圖。 本發明之一實施例中’上述散熱鈑金件10〇係用以放[s] 8 201226791 置、接觸一發熱體，例如發光模組310。發光模組310放 置於散熱鈑金件100之一侧，並接觸散熱鈑金件1〇〇，故 發光模組310與散熱鈑金件100合稱為一散熱模組3〇〇。 如此，當發光模組310工作時，發光模組310所產生之熱 能可經由散熱鈑金件1〇〇散布至空氣中，以達散熱之效果。 由於此散熱鈑金件100是由一狹長金屬板經反摺多次 而成’散熱鈑金件100具有較多與空氣相接觸之表面積， 而且金屬板之厚度有限（可僅達數公釐），故，相較於第1 φ 圖之散熱塊12與第2圖之L型散熱塊23之厚度可達數公 分不等’散熱鈑金件100使發光模組31〇之熱能可快速地 &散熱鈑金件1〇〇之表面進行傳遞，以便將熱能散布至空 氣中，進而提供更佳之散熱效果。 具體而言，發光模組310包含一基板311及多個發光 二極體315。基板311呈板狀，包含一第一表面312、多個 第二表面313與一第三表面314。第一表面312與第三表 面314相互對應，此些第二表面313環繞第一表面Μ〕與 鲁第二表面314 ’且任一第二表面313同時鄰接第一表面312 與第二表面314之一側。此外，第一表面312與第三表面 314的面積均大於任一第二表面313的面積。此些發光二 . 極體us間隔地排列於基板311的第三表面314上。基板 311的第一表面312與第二表面313分別接觸散熱鈑金件 1〇〇同側之第一片體U1及第二片體12〇。如此，發光模紐 310之熱能可同時由散熱鈑金件1〇〇同侧之第一片體^ 及第二片體120傳入散熱鈑金件100，更可提高散熱模組 300之熱傳輸效能。 '' 需暸解的是，本發明不限制發光模組310之基板311 201226791 之種類，例如可為硬式印刷電路板（printed circuit board， PCB )、金屬基板（metal core printed circuit board， MCPCB )或軟式印刷電路板（flexible printed circuit board’ FPC)。本發明不限發光模組310與散熱鈑金件100 之固定方式，例如可藉由鎖固螺栓，將基板311鎖固於散 熱飯金件100之第一片體111上；或者，例如可藉由黏著 膠，將基板311貼合於散熱鈑金件100之第一片體ill之 表面上，或鎖固螺栓與黏著膠之組合。此外，本發明不限 制發光二極體315所採用之發光材料之種類，例如可為有 機材料、無機材料或有機材料與無機材料之組合。 請參閱第5圖。第5圖繪示本發明此散熱鈑金件1〇〇, 於又一實施例之側視圖。 當此又一實施例選擇以鎖固螺栓320而將發光模組 310之基板311鎖固於散熱飯金件1〇〇之其中一第一片體 111時’此散熱鈑金件100更包含多個穿孔112及多個鎖固 強化凸塊150。此些穿孔112間隔地位於於上述散熱鈑金 件100之對折部110，且沿此散熱鈑金件100之一延伸方 向X設置（第3圖）。各穿孔112皆同時貫穿此二第一片體 111。此些鎖固強化凸塊150分別貫設有一螺栓孔151。各 鎖固強化凸塊150分別間隔地固設於散熱鈑金件1〇〇之另 一第一片體111之表面上’且此些螺栓孔151分別__對 準穿孔112。 如此，當各鎖固螺栓320自發光模組310之基板311 經對折部110之之第一片體111之穿孔112而伸入螺栓孔 151時，各鎖固螺栓320將發光模組310之基板311鎖固 於散熱飯金件100上。由於鎖固強化凸塊15〇可強化對折『 201226791 σΡ U〇之結構，故，鎖固螺栓320便可更確實地涑 組熱磁町。確實地讓糊 將鎖例如可藉由沖壓、焊接或嵌人之方式’ 明不僅限S 固設於第一片體111上，然而，本發 於另第6圖。第6圖繪示本發明此散熱鈑金件200 200具有^1之側視圖。此另―實施例中，散熱鈑金件 220、二第y對折部21〇、一連接片體25〇、二第二片體 對折後各自、Λ體230及二第四片體測。各對折部210係 第一片體j成二第一片體211 ’每一對折部21〇之此二 朝一方向1之-側係-體成型地相互連接，其另側共同 第一片體延伸且此些第一片體211相互緊貼，使此些 Α丨之間實質上保持零間隙。 250之兩4片目=250位於此二對折部210之間，且連接片體 鄰近之二第〜侧並分別一體成型地連接此二對折部210較 地連接此二^體211。此些第二片體220分別一體成型 〜辦折部210較遠離之二第一片體211，且此些 第二片體220分別背對地朝二相反方肖D2、D3水平地延 伸。此些第二片體230分別一體成型地位於此些第二片體 220遠離此些第-片體211之一側，且分別共同朝此方向 D1延伸。此些第四片體24〇分別一體成型地位於此些第三 片體230遠離第二片體22〇之一侧，且分別背對地朝此些 相反方向D2、D3水平地延伸。 ί γν1 如此’當二上述之發光模組310分別背對地設置於此 二對折部210較遠離之二第一片體211時，由於此二對折 部210之間具有—間隔空間252，各發光模組310所產生 201226791 之熱能可另外與間隔空間252之空氣進行熱交換，以提高 散熱之效果。 更佳地，此另一實施例中，連接片體250可穿設有一 通氣孔251 ’通氣孔251可使此間隔空間252與一由第二 片體220及第三片體23〇所圍出之容置空間141相互接 通’有助間隔空間252的空氣與容置空間141的空氣的相 互對流’加強散熱之效果，另外，通氣孔251亦可使溫度 較為均勻’不會局部過熱。 請參閱第7圖及第8圖。第7圖繪示本發明應用此散 熱鈑金件100之背光模組4〇〇於一實施例中之侧視圖，為 了方便解釋’於圖中省略光學疊層。第8圖繪示本發明應 用此散熱鈑金件1〇〇之顯示器500於一實施例中之侧視圖。 本發明之另一實施例中，此散熱鈑金件1〇〇可應用於 一背光模組400上。背光模組400可包含一背板410、一 上述之散熱鈑金件1〇〇、一上述之發光模組310、一或多個 導熱管420及一光學疊層430。 散熱鈑金件1〇〇之第四片體140分別固定於背板410 籲上’使得背板41〇、第二片體120及第三片體130之間可 .共構成一容置空間141。各導熱管420容納於容置空間141 中’且至少接觸背板410及第二片體120。光學疊層430 依序可包含一反射片431 (reflective sheet)、一導光板432 (light guide)及一或多個光學膜片433 (例如增光膜、擴 散片或其組合等等）。反射片431同時配置於其中一第二片 體120及背板41〇上。導光板432疊設於反射片431遠離 背板410之一側，且其入光面434對應於發光模組310之 發光二極體315。光學膜片433疊設於導光板432遠離背[s] 201226791 板410之一側。 如此，相較於第丨圖之散熱塊13與第2圖之L蜇散熱 塊23’本發明散熱鈑金件100不僅可供放置發光模組310’ 也可兼提供放置光學疊層43〇’以便省略另設置支撐光學 疊層430之架體。 實際操作上，由於散熱鈑金件1〇〇之一第二片體120 需具有較大之面積以放置光源模組及光學疊層43〇，故， 散熱鈑金件100之與發光模組310同側的第二片體120之 φ 面積可大於與發光模組310不同側的第二片體120之面 積’然而本發明不限於此。 此外，散熱鈑金件100之此些第四片體丨40例如可以 藉由鎖固螺栓（圖中未示）而固定於背板41〇上，但，本 發明不限於此。 除了導熱管420分別接觸背板410及第二片體120 外，其他實施例中’導熱管420也可同時接觸其兩側之第 二片體130,更增加熱能傳導至導熱管420之途徑。此外， 一可選擇之選項中，各導熱管420更可藉由導熱膠（圖中 未示）分別接觸散熱鈑金件1〇〇。 • 具體而言，此另一實施例中，背板410包括一背板主 體411及多個放置平台412 (例如凸包）。背板主體411由 金屬材料所製成，較佳地，由具高熱傳導係數之金屬材料 所製成，例如銅（ 398 W/mK)、鋁（170 W/mK)等。放置 平台412分別間隔地且並列地凸設於背板主體411上，且 此些放置平台412共同支撐此光學疊層430 (第8圖）。放 置平台412可與背板主體411為一體成型，但是本發明不 限於此。另外，此些放置平台412與跟發光模組310同側[s 13 201226791 的第二片體120可共同支擇此光學疊層430。 如此，當發光模組310工作時，發光模組310所產生 之熱能可經由散熱鈑金件1〇〇之第四片體140傳導至背板 410,使得熱能可由背板41〇傳德至導熱管420或傳遞至空 氣中。 此外，各導熱管420可呈「L」字型’在此僅以虛線表 示其大致範圍。各導熱管420包含第一管體421與第二管 體422。第一管體421位於容置空間141中，且至少接觸 背板410及第二片體12〇。第二管體422可位於背板主體 411上’其一端連接第一管體421，另端並穿出散熱鈑金件 100靠近放置平台412之第三片體130。 此些導熱管420之第一管體421分別線性地排列於容 置空間141中，且此些導熱管420之第一管體421彼此可 不相接觸’有助於散熱。此些導熱管420之第二管體422 分別相互平行地位於任二放置平台412之間。 如此’當發光模組310工作時，發光模組310所產生 之熱能可經由散熱鈑金件1〇〇之第二片體12〇傳導至導熱 管420 ’使得熱能可由導熱管420之第一管體421、第二管 體422而傳遞出去。需說明的是，導熱管420内可含有微 篁液體’微量液體可因為在導熱管420之第一管體421吸 熱而成氣體，進而達到散熱的效果，氣體在第二管體422 冷卻成液體，液體因為導熱管420内部構造的作用原理（如 毛细現象）可又回到第一管體421協助散熱。另外，第二管 體422可往遠離發光模組31〇方向延伸，有助於提供良好 的冷卻效果。第二管體422的長度可依實際需求作調整。 此外’本發明之上述之背光模組4〇〇也可應用於一光[ 201226791 電裝置上。光電裝置之類 攝影機、照相機、筆艽括可攜式產品（如手機、 放器、電子信件=腦、賴機、手錶、音樂播 gg . ^ ςΛΛ 屋σσ (如影音放映器或類似之產品）、 fl電視、看板、投影機内之面板等。 notrr說’當上述之背光模組400應用於-顯示 ，〇_〇時’I員示器500包含一上述之背光模組4〇〇及一液 晶顯不面板510。液曰齡- 離導光板432之—侧ΒΓ面板51G位於光學膜片433遠 〇月少閱第2圖、第7圖及第9圖所示。第9圖繪示本 J此ί熱飯金件1G〇與第2®之^結K㈣ 7' 9圖的曲線“B分別是依據第2 ®之散熱結構The application, for the purpose of providing a kind of heat-dissipating sheet metal parts and the P-N of the heat-dissipating sheet metal part, has better heat dissipation effect, which reduces the temperature of the light-emitting diodes, thereby reducing the probability of damage caused by the light-emitting diodes.庳 庳 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 ^ ^ ^ The hairpin has four pieces of ^ containing less than one pair of folds, two second sheets, two third sheets and two first sheets. The folded portion integrally includes two first sheets, the sides of the first sheets being connected to each other, and the other sides of the first sheets are respectively extended toward the same side and the first sheets are in close contact with each other. The second sheets are located on the other side of the first sheet and the second sheets extend horizontally in opposite directions. The third sheets are integrally formed such that the first ones are away from one side of the first sheets and extend in the same direction. The fourth sheets are integrally formed such that the third sheets are away from one side of the second sheet and extend horizontally in opposite directions. According to another embodiment of the present invention, a heat dissipation module having the above-mentioned heat dissipation meal is provided. The heat dissipation module comprises a heat dissipation sheet metal member and a light emitting module. The light-emitting module is located on one side of the heat-dissipating sheet metal member, and comprises a substrate and a plurality of [201226791 light-emitting diodes. The substrate includes a first surface, a second surface and a third surface. The first surface contacts a first sheet, the second surface contacts one of the first sheets, and the third surface corresponds to the first surface. The light emitting diodes are arranged on the third surface of the substrate. In another embodiment of the present invention, a buffing module having the above-described heat dissipating sheet metal member is provided. The backlight module comprises a backplane, a heat dissipation module, at least one heat pipe, a reflection sheet, a light guide plate and at least one optical film. The fourth sheets of the heat-dissipating sheet metal parts of the heat-dissipating module are respectively fixed on the back board, and the second back sheet, the second sheet body and the third sheet body form a receiving space. A heat pipe is partially located in the accommodating space and contacts the back plate and the second body. The reflective sheet is disposed therein - the second sheet and the back sheet. The light guide plate is disposed on the reflective sheet and corresponds to the light emitting diodes of the light emitting module. The optical film is stacked on the side of the light guide plate away from the back plate. In still another embodiment of the present invention, a display having the above-described heat dissipating sheet metal member is provided. The display comprises a backlight module as described above and a liquid crystal display panel. The liquid crystal display panel is located on one side of the optical film away from the light guide plate. In summary, in the application of the heat-dissipating sheet metal part and the heat-dissipating sheet metal part of the invention, the heat energy emitted by the light-emitting module can be guided by the design of the heat-dissipating sheet metal part, and is directly transmitted to the heat-conducting tube without using the back-plate. This provides a better cooling path. At the same time, the design of the heat-dissipating sheet metal member not only supports the light-emitting module but also supports the reflection sheet, the light guide plate and the optical film, and reduces the cost of separately supporting the components of the reflection sheet, the light guide plate and the optical film. BRIEF DESCRIPTION OF THE DRAWINGS The spirit of the present invention will be clearly described in the following description and the detailed description of the present invention, as those skilled in the art, after the understanding of the embodiments of the present invention, can be carried out by the technique taught by the present invention [s] 7 201226791 Changes and modifications may be made without departing from the spirit and scope of the invention. Please refer to Figure 3. Fig. 3 is a view showing the appearance of the heat-dissipating sheet metal member of the present invention in an embodiment. The present invention proposes a heat dissipation sheet metal member 100. In this embodiment, the heat dissipation sheet metal member 100 is formed in a three-dimensional shape and can be formed by folding the metal sheet by a plurality of times. The heat dissipation sheet metal member 100 is at least divided into a pair of folded portions 11A, two second sheets 120, two third sheets 130, and two fourth sheets 14A. The folded portion 11A, the second sheet 120, the third sheet 130, and the fourth sheet 14'' have the same extending direction X as the above-mentioned elongated metal sheets. The two first sheets 111 of the first sheet body 111 are formed integrally with one another, and the other sides of the first sheets 111 are respectively oriented in one direction D1. Extending, and the pieces 111 are in close contact with each other such that substantially zero gaps are maintained between the first sheets. The second sheets 120 are integrally formed on the other side of the first sheets 111, and extend horizontally opposite to each other in opposite directions D2 and D3, respectively. The second sheets 120 may be substantially perpendicular to the first sheets 1U, but the invention is not limited thereto. The third sheets 13 are integrally formed in a position such that the second sheets 120 are away from one side of the first sheet U1 and respectively extend in the direction D1. The fourth sheets 14 are respectively integrally formed such that the third sheets 130 are away from one side of the second sheet 12 and extend horizontally opposite to each other in opposite directions D2 'D3. See Figure 4. FIG. 4 is a side view of the heat dissipation module 300 of the present invention using the heat dissipation sheet metal member 100 in one embodiment. In one embodiment of the present invention, the heat dissipating sheet metal member 10 is used for placing [s] 8 201226791 and contacting a heating element such as the light emitting module 310. The light-emitting module 310 is placed on one side of the heat-dissipating sheet metal member 100 and is in contact with the heat-dissipating sheet metal member. Therefore, the light-emitting module 310 and the heat-dissipating sheet metal member 100 are collectively referred to as a heat-dissipating module 3〇〇. Thus, when the light-emitting module 310 is in operation, the heat generated by the light-emitting module 310 can be dispersed into the air through the heat-dissipating sheet metal member 1 to achieve the heat-dissipating effect. Since the heat-dissipating sheet metal member 100 is folded back by a long and narrow metal plate, the heat-dissipating sheet metal member 100 has a surface area which is in contact with the air, and the thickness of the metal plate is limited (only a few millimeters). Compared with the heat dissipation block 12 of the 1st φ figure and the L type heat dissipation block 23 of the 2nd figure, the thickness of the heat dissipation block 23 can be several centimeters. The heat dissipation sheet metal 100 enables the heat of the light emitting module 31 to be quickly & The surface of the piece 1 is transferred to dissipate heat into the air to provide better heat dissipation. Specifically, the light emitting module 310 includes a substrate 311 and a plurality of light emitting diodes 315. The substrate 311 has a plate shape and includes a first surface 312, a plurality of second surfaces 313 and a third surface 314. The first surface 312 and the third surface 314 correspond to each other, and the second surface 313 surrounds the first surface Μ and the second surface 314 ′ and any second surface 313 abuts the first surface 312 and the second surface 314 simultaneously One side. Moreover, the areas of the first surface 312 and the third surface 314 are both larger than the area of any of the second surfaces 313. The light-emitting diodes are arranged at intervals on the third surface 314 of the substrate 311. The first surface 312 and the second surface 313 of the substrate 311 are respectively in contact with the first sheet U1 and the second sheet 12 of the same side of the heat-dissipating sheet metal member. In this way, the thermal energy of the light-emitting module 310 can be simultaneously introduced into the heat-dissipating sheet metal member 100 by the first sheet body and the second sheet body 120 on the same side of the heat-dissipating sheet metal member, and the heat transfer performance of the heat-dissipating module 300 can be improved. It is to be understood that the present invention does not limit the type of the substrate 311 201226791 of the light-emitting module 310, and may be, for example, a printed circuit board (PCB), a metal core printed circuit board (MCPCB) or a soft type. Flexible printed circuit board (FPC). The present invention is not limited to the fixing manner of the light-emitting module 310 and the heat-dissipating sheet metal member 100. For example, the substrate 311 can be locked on the first sheet body 111 of the heat-dissipating gold member 100 by means of a locking bolt; or, for example, Adhesive, the substrate 311 is attached to the surface of the first sheet ill of the heat-dissipating sheet metal member 100, or a combination of a locking bolt and an adhesive. Further, the present invention is not limited to the kind of the luminescent material used in the light-emitting diode 315, and may be, for example, an organic material, an inorganic material or a combination of an organic material and an inorganic material. Please refer to Figure 5. Fig. 5 is a side elevational view of the heat dissipating sheet metal member 1 of the present invention. When the further embodiment selects to lock the substrate 311 of the light-emitting module 310 to one of the first sheets 111 of the heat-dissipating gold foil member by the locking bolts 320, the heat-dissipating sheet metal member 100 further includes a plurality of The through hole 112 and the plurality of locking reinforcement bumps 150. The through holes 112 are spaced apart from each other in the folded portion 110 of the heat dissipation sheet metal member 100, and are disposed along one of the extending directions X of the heat dissipation sheet metal member 100 (Fig. 3). Each of the through holes 112 penetrates through the two first sheets 111 at the same time. The locking reinforcement bumps 150 respectively have a bolt hole 151. Each of the locking reinforcement bumps 150 is fixedly spaced apart from the surface of the other first sheet body 111 of the heat dissipation sheet metal member 1', and the bolt holes 151 respectively align the through holes 112. Thus, when each of the locking bolts 320 protrudes from the base plate 311 of the light-emitting module 310 through the through hole 112 of the first piece 111 of the folded portion 110 into the bolt hole 151, each of the locking bolts 320 will be the substrate of the light-emitting module 310. The 311 is locked to the heat-dissipating gold member 100. Since the locking reinforcement bump 15 〇 can strengthen the structure of the double-folding "201226791 σΡ U〇, the locking bolt 320 can more accurately set up the hot magnetic town. It is true that the lock can be fixed to the first body 111 by, for example, stamping, welding or embedding. However, this is also shown in Fig. 6. FIG. 6 is a side view of the heat dissipation sheet metal part 200 200 of the present invention. In the other embodiments, the heat-dissipating sheet metal member 220, the two-th y-folded portion 21A, the one-piece sheet body 25〇, and the second sheet-side body are folded, respectively, the body 230 and the second and fourth sheets are measured. Each of the pair of folded portions 210 is formed by the first sheet body j being the first sheet body 211'. The pair of folded portions 21 are formed in a direction-to-one direction, and the other side is integrally connected to the first sheet. And the first sheets 211 are in close contact with each other such that substantially zero gaps are maintained between the turns. Two of the two pieces 250 of 250 are located between the two folded portions 210, and the two adjacent sides of the connecting piece are connected to each other and integrally connected to the two folded portions 210 to be connected to the two bodies 211. The second sheets 220 are integrally formed by the first sheet body 211, and the second sheet bodies 220 are horizontally extended away from the opposite sides D2 and D3, respectively. The second sheets 230 are integrally formed in such a manner that the second sheets 220 are away from one side of the first sheets 211 and extend toward the direction D1. The fourth sheets 24 are integrally formed in such a manner that the third sheets 230 are away from the side of the second sheet 22 and extend horizontally oppositely to the opposite directions D2, D3, respectively. ί γν1 Thus, when the above-mentioned two light-emitting modules 310 are disposed opposite to each other, the two-folded portions 210 are separated from each other by the first sheet body 211, since each of the two-folded portions 210 has a space 252, each of the light-emitting portions The heat energy generated by the module 310 of 201226791 can additionally exchange heat with the air of the space 252 to improve the heat dissipation effect. More preferably, in this embodiment, the connecting body 250 can be provided with a venting hole 251. The venting hole 251 can surround the space 252 and the second piece 220 and the third piece 23 The accommodating spaces 141 are connected to each other 'the mutual convection of the air of the space 252 and the air of the accommodating space 141' to enhance the heat dissipation effect, and the vent hole 251 can also make the temperature uniform. Please refer to Figure 7 and Figure 8. Figure 7 is a side elevational view of the backlight module 4 of the present invention using the heat-dissipating sheet metal member 100 in an embodiment for convenience of explanation. The optical laminate is omitted in the drawings. Figure 8 is a side elevational view of the display 500 of the present invention using the heat-dissipating sheet metal member in one embodiment. In another embodiment of the present invention, the heat dissipation sheet metal member 1 can be applied to a backlight module 400. The backlight module 400 can include a backing plate 410, a heat dissipating sheet metal member, a light emitting module 310, one or more heat conducting tubes 420, and an optical stack 430. The fourth sheet body 140 of the heat-dissipating sheet metal member is fixed to the back sheet 410, so that the back sheet 41A, the second sheet 120, and the third sheet 130 can form an accommodation space 141. Each of the heat transfer tubes 420 is accommodated in the accommodating space 141 and contacts at least the back plate 410 and the second sheet 120. The optical stack 430 may sequentially include a reflective sheet 431, a light guide 432, and one or more optical sheets 433 (e.g., a brightness enhancement film, a diffusion sheet, or a combination thereof, etc.). The reflection sheet 431 is simultaneously disposed on one of the second sheets 120 and the back sheet 41. The light guide plate 432 is disposed on one side of the reflective sheet 431 away from the back plate 410, and the light incident surface 434 corresponds to the light emitting diode 315 of the light emitting module 310. The optical film 433 is stacked on the side of the light guide plate 432 away from the back [s] 201226791 plate 410. Thus, the heat dissipating sheet metal member 100 of the present invention can be used not only for the placement of the light-emitting module 310' but also for the placement of the optical layer stack 43' with respect to the heat-dissipating block 13 of the second drawing and the heat-dissipating block 23' of the second figure. The frame body supporting the optical laminate 430 is omitted. In actual operation, since the second sheet 120 of the heat-dissipating sheet metal member has a larger area to place the light source module and the optical layer 43〇, the heat-dissipating sheet metal member 100 is on the same side as the light-emitting module 310. The φ area of the second sheet 120 may be larger than the area of the second sheet 120 on the side different from the light emitting module 310. However, the invention is not limited thereto. Further, the fourth piece body 40 of the heat dissipation sheet metal member 100 may be fixed to the back plate 41A by, for example, a locking bolt (not shown), but the present invention is not limited thereto. In addition to the heat transfer tube 420 contacting the back plate 410 and the second sheet 120, the heat transfer tube 420 can also contact the second sheet 130 on both sides thereof in the other embodiments, thereby increasing the conduction of heat energy to the heat transfer tube 420. In addition, in an optional option, each of the heat pipes 420 can be respectively contacted with the heat-dissipating sheet metal member 1 by a heat-conductive adhesive (not shown). In particular, in this alternative embodiment, the backing plate 410 includes a backing plate body 411 and a plurality of placement platforms 412 (e.g., convex hulls). The backing plate main body 411 is made of a metal material, preferably made of a metal material having a high heat transfer coefficient such as copper (398 W/mK), aluminum (170 W/mK) or the like. The placement platforms 412 are respectively spaced apart and juxtaposed on the backplane body 411, and the placement platforms 412 collectively support the optical stack 430 (Fig. 8). The placement platform 412 can be integrally formed with the backing plate main body 411, but the present invention is not limited thereto. In addition, the placement platform 412 and the second wafer 120 on the same side as the illumination module 310 [s 13 201226791 can jointly support the optical laminate 430. Thus, when the light-emitting module 310 is in operation, the heat generated by the light-emitting module 310 can be conducted to the back plate 410 via the fourth sheet 140 of the heat-dissipating sheet metal member 1 so that the heat energy can be transferred from the back plate 41 to the heat pipe. 420 or pass to the air. Further, each of the heat transfer tubes 420 may have an "L" shape, and only the outline thereof is indicated by a broken line. Each of the heat transfer tubes 420 includes a first tube body 421 and a second tube body 422. The first tube body 421 is located in the accommodating space 141 and at least contacts the back plate 410 and the second sheet body 12A. The second tube body 422 may be located on the back plate main body 411. One end thereof is connected to the first tube body 421, and the other end is passed through the third sheet body 130 of the heat dissipation sheet metal member 100 near the placement platform 412. The first tubes 421 of the heat pipes 420 are linearly arranged in the accommodating space 141, respectively, and the first tubes 421 of the heat pipes 420 are not in contact with each other to facilitate heat dissipation. The second tubes 422 of the heat pipes 420 are respectively located between the two placement platforms 412 in parallel with each other. Thus, when the light-emitting module 310 is in operation, the heat generated by the light-emitting module 310 can be conducted to the heat-conducting tube 420 ′ via the second sheet 12 of the heat-dissipating sheet metal member 1 such that the heat can be applied to the first tube of the heat-conducting tube 420 421, the second tube body 422 is passed out. It should be noted that the heat pipe 420 may contain a micro-cylinder liquid. The micro-liquid may be formed by the heat absorption in the first pipe body 421 of the heat pipe 420, thereby achieving the heat dissipation effect, and the gas is cooled to the liquid in the second pipe body 422. The liquid can return to the first pipe body 421 to assist heat dissipation because of the action principle of the internal structure of the heat pipe 420 (such as capillary phenomenon). In addition, the second tube 422 can extend away from the illuminating module 31 to help provide a good cooling effect. The length of the second pipe body 422 can be adjusted according to actual needs. In addition, the backlight module 4 of the present invention can also be applied to a light [201226791 electric device. Cameras, cameras, pens, etc., such as optoelectronic devices, include portable products (such as mobile phones, radios, e-mails = brains, laptops, watches, music broadcasts gg. ^ 屋 σ σσ (such as video projectors or similar products) , fl TV, kanban, panel in the projector, etc. notrr said 'When the above-mentioned backlight module 400 is applied to - display, 〇 _ ' 'I's indicator 500 includes a backlight module 4 〇〇 and a liquid crystal The display panel 510. The liquid age - from the light guide plate 432 - the side panel 51G is located in the optical film 433, as shown in Fig. 2, Fig. 7, and Fig. 9. Fig. 9 shows the J The curve of the 1G 〇 and the 2nd о K (4) 7' 9 of the 饭 hot meal is based on the heat dissipation structure of the 2nd
以及f 7散熱結構所做之試驗結果。$ 9圖的曲線A 中之每fife ▲」代表著一發光模組31〇之各發光二極 體315、”1第2圖散熱結構之作用後所仍存有之溫度。第9 圖的曲線B中之每一符號「口」代表著一發光模組細上 之各發光-極體315經第7圖散熱結構之作用後所仍存 之溫度。 由第9圖可知，採用第2圖散熱結構下之各發光二極 體315之溫度大致平均處於攝氏66_69度之間，反觀，採 用本發明散熱鈑金件1〇〇之散熱結構下之各發光二極體 315之溫度大致平均處於攝氏64_67度之間。如此，由第9 圖可知，採用本發明散熱鈑金件100之散熱結構下之各發 光二極體315之溫度大致較採用第2圖散熱結構下之各^ 光二極體315之溫度低於攝氏2度。故，由此可推論，本 發明此散熱鈑金件100相較於第2圖散熱結構下可提供較 201226791 佳之散熱效果，同時，也可推論本發明此散熱鈑金件 之散熱效果優越於第1圖之散熱結構之散熱效果。 • 本發明所揭露如上之各實施例中，並非用以限定本發 =任何熟習此技藝者，在不脫離本發明之精神和範圍内， 田可作各種之更動與潤飾，因此本發明之保護範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 • At *為讓本發明之上述和其他目的、特徵、優點與實施例 顯易懂’所附圖式之詳細說明如下： 第1圖繪示一種習知散熱結構之示意圖。 第2圖綠示另種習知散熱結構之示意圖。 第3圖續·示本發明散熱飯金件於一實施例中之外觀示 思、圖。 第4圖繪示本發明應用此散熱鈑金件之散熱模組於一 貫施例中之側視圖。 % 第5圖繪示本發明此散熱鈑金件於另一實施例之側視 圏。 第6圖繪示本發明此散熱鈑金件於又一實施例之侧視 ， 圖〇 第7圖繪示本發明應用此散熱鈑金件之背光模組於一 貫施例中之側視圖。 第8圖繪示本發明應用此散熱鈑金件之顯示器於一實 靶例中之側視圖。 第9圖續'示本發明此散熱鈑金件與第2圖之散熱結構 之散熱效能示意圖。And the test results of the f 7 heat dissipation structure. Each fife ▲" in the curve A of the $9 graph represents the temperature of each of the light-emitting diodes 315 of the light-emitting module 31, and the temperature of the heat-dissipating structure of the second figure. Each symbol "port" in B represents the temperature remaining after the light-emitting body 315 of a light-emitting module is cooled by the heat-dissipating structure of FIG. It can be seen from FIG. 9 that the temperature of each of the light-emitting diodes 315 under the heat dissipation structure of FIG. 2 is approximately between 66 and 69 degrees Celsius, and in contrast, the light-emitting structures of the heat-dissipating structure of the heat-dissipating sheet metal of the present invention are used. The temperature of the polar body 315 is approximately on average between 64 and 67 degrees Celsius. Thus, it can be seen from FIG. 9 that the temperature of each of the light-emitting diodes 315 under the heat dissipation structure of the heat-dissipating sheet metal member 100 of the present invention is substantially lower than the temperature of each of the light-emitting diodes 315 of the heat-dissipating structure of FIG. degree. Therefore, it can be inferred that the heat dissipating sheet metal part 100 of the present invention can provide better heat dissipation effect than the 201226791 compared with the heat dissipating structure of FIG. 2, and it can be inferred that the heat dissipating effect of the heat dissipating sheet metal part of the invention is superior to that of the first figure. The heat dissipation effect of the heat dissipation structure. The present invention is not limited to the above-described embodiments, and any modifications and refinements can be made to the present invention without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS The following is a detailed description of the above-mentioned and other objects, features, advantages and embodiments of the present invention. FIG. 1 is a schematic view of a conventional heat dissipation structure. . Fig. 2 is a schematic view showing another conventional heat dissipation structure. Fig. 3 is a continuation of the appearance and diagram of the heat-dissipating rice cooker of the present invention in one embodiment. Fig. 4 is a side view showing the heat dissipating module of the present invention using the heat dissipating sheet metal member in a first embodiment. % Fig. 5 is a side view of the heat dissipating sheet metal member of the present invention in another embodiment. FIG. 6 is a side view of the heat dissipating sheet metal member according to another embodiment of the present invention. FIG. 7 is a side view of the backlight module of the present invention using the heat dissipating sheet metal member in a first embodiment. Figure 8 is a side elevational view of the display of the present invention using the heat-dissipating sheet metal member in a real target. Fig. 9 is a continuation of the heat dissipation performance of the heat dissipating sheet metal member of the present invention and the heat dissipating structure of Fig. 2.
201226791 【主要元件符號說明】 10、 20 :散熱結構 313 11、 21 :背板 314 12、 22 :發光元件 315 13、 23 :散熱塊 320 14 :導熱管組 400 15、25 :導熱管 410 16 :導熱管支架 411 100、100’ 、200:散熱鈑金件 412 110、 210:對折部 420 111、 211 :第一片體 421 112 :穿孔 422 120、220 :第二片體 430 130、230 :第三片體 431 140、240 :第四片體 432 141 :容置空間 433 150:鎖固強化凸塊 434 151 :螺栓孔 500 250 :連接片體 510 251 :通氣孔 A、 252 :間隔空間 C : 300 :散熱模組 D1 310 :發光模組 D2 311 :基板 X : 312 :第一表面 :第二表面 :第三表面 :發光二極體 :鎖固螺栓 :背光模組 :背板 :背板主體 :放置平台 :導熱管 :第一管體 :第二管體 :光學疊層 :反射片 :導光板 :光學膜片 :入光面 :顯示器 .液晶顯不面板 B :曲線 中心線 :方向 • D3 :相反方向 延伸方向201226791 [Description of main component symbols] 10, 20: heat dissipation structure 313 11, 21: backplane 314 12, 22: light-emitting elements 315 13, 23: heat-dissipating block 320 14: heat-conducting tube set 400 15, 25: heat-conducting tube 410 16 : Heat pipe bracket 411 100, 100', 200: heat dissipation sheet metal 412 110, 210: folded portion 420 111, 211: first sheet 421 112: perforation 422 120, 220: second sheet 430 130, 230: third Sheet 431 140, 240: Fourth sheet 432 141: accommodation space 433 150: Locking reinforcement bump 434 151: Bolt hole 500 250: Connection sheet 510 251: Vent hole A, 252: Space space C: 300 : Heat dissipation module D1 310 : Light-emitting module D2 311 : Substrate X : 312 : First surface: Second surface: Third surface: Light-emitting diode: Locking bolt: Backlight module: Back plate: Back plate body: Placement platform: Heat pipe: First pipe body: Second pipe body: Optical stack: Reflector: Light guide plate: Optical film: Light-in surface: Display. LCD display panel B: Curve center line: Direction • D3: Opposite direction