201221349 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種被覆件及其製造方法，尤其涉及一種具 有抗指紋層的被覆件及該被覆件的製造方法。 【先前技術】 - [0002] 隨著3C電子產品的使用越來越頻繁，消費者對產品的外 觀亦有了越來越高的要求。除了要求其色彩美觀、手感 舒適，還要求其表面具有較好的耐磨性、抗刮傷性、以 及抗指紋性。 〇 [_3] 為了提高金屬表面的抗指紋性，美國專利US006736908 公開了一種抗指紋化的金屬表面處理液。該表面處理液 含有特殊有機樹脂’可溶性釩化物，以及可溶性金屬化 合物，其含有Zn、Ti、Mo、W、Μη及Ce中至少一種金屬 元素，經此處理液處理的金屬表面具有良好的抗指紋性 。係然，所述特殊的有機樹脂成分結構複雜，難以製造 ，且易對環境造成污染。因此’開發一種能實現抗指紋 Q 效果且易於製造、無環境污染的抗指紋塗層實為必要。 【發明内容】 [0004] 有鑒於此，有必要提供一種環保的、易於製造的具有抗 指紋層的被覆件。 [0005] 另外，還有必要提供一種上述被覆件的製造方法。 [0006] 一種被覆件，包括基體及形成於該基體上的抗指紋層’ 該抗指紋層包括依次形成於基體上的苐一二氧化二紹層 、第一氮化鋁層及氮氧化銘層。 099141305 表單編號A0101 第3頁/共11頁 0992071866-0 201221349 [0007] [0008] [0009] [0010] [0011] [0012] [0013] [0014] [0015] [0016] 一種被覆件的製造方法，包括以下步驟： 提供基體； 藉由直流磁控濺射鍍膜法於基體上形成抗指紋層，形成 該抗指紋層包括如下步驟： 以氧氣為反應氣體，以鋁靶為靶材，於所述基體上形成 第一三氧化二鋁層； 以氮氣為反應氣體，以鋁靶為靶材，於所述第一三氧化 二鋁層上形成第一氮化鋁層； 以氧氣及氮氣為反應氣體，以鋁靶為靶材，於所述第一 氮化铭層上形成氮氧化紹層。 所述的被覆件藉由在基體表面依次濺射形成第一三氧化 二鋁層、第一氮化鋁層及氮氧化鋁層以實現抗指紋的功 能，該方法簡單易行，且不需要使用有毒的有機物，對 環境及人體健康無害。 【實施方式】 請參閱圖1，本發明一較佳實施例的被覆件100包括基體 10及形成於該基體10上的透明的抗指紋層30。 所述基體10可由金屬材料或非金屬材料製成。該金屬材 料可包括不銹鋼、鋁、鋁合金、銅、銅合金、鎂合金等 。該非金屬材料可包括塑膠、陶瓷、玻璃、聚合物等。 該被覆件100可為3C電子產品的殼體 '傢倶、廚房用具或 其他裝潢件。 所述抗指紋層30包括依次形成於該基體1 0上的第一三氧 099141305 表單編號A0101 第4頁/共11頁 0992071866-0 201221349 [0017] Ο .' [0018] [0019] ❹ [0020] [0021] 099141305 化二銘（Α12〇3)層31、第一氮化鋁（Α1Ν)層32及氮氧 化鋁層（A10N )層35。優選地，在本較佳實施例中，所 述抗指紋層30還包括形成於第一 A1N層32與A1 ON層35之 間的第二Al2〇3層33及第二A1N層34。所述第二A1 〇層 2 3 33與第一 A1N層32直接結合，第二A1N層34與A10N層35 直接結合。 該抗指紋層30可藉由直流磁控濺射鍍膜法形成。所述第 一 Al2〇3層31的厚度為〇·2〜〇.8em，所述第一 A1N層32 、第二Al2〇3層33及第二A1N層34的厚度均為〇. 〇5〜〇. 2 #ra，所述A10N層3 5的厚度為〇. 〇5〜〇. 1 //Hi。 . ... 所述的抗指紋層30除具有抗指紋功能之外，該抗指紋層 30中的N元素還可增強該抗指紋層3 〇的緻密性，從而還可 使該抗指紋層30具有較好的耐腐蝕性能。 可以理解的，在沉積該抗指紋層3〇之前還可鍍覆一顏色 層2 0，以增強該被覆件1 〇 〇的美觀性。所述抗指紋層3〇形 成於該顏色層20上。 本發明一較佳實施例的製造所述被覆件丨00的方法主要包 括如下步驟： 提供一基體10，將基體10放入盛裝有乙醇或丙酮溶液的 超聲波清洗器中進行震動清洗’以除去基體1 〇表面的雜 質和油污等。清洗完畢後烘乾備用。 對經上述處理後的基體1 〇的表面進行電漿清洗，進一步 去除基體10表面的油污，以改善基體10表面與後續塗層 的結合力。該電漿清洗的具體操作及工藝參數為：將基 第5頁/共π頁 表單編號A0101 0992071866-0 [0022] 201221349 體10放入一直流磁控濺射鍍膜機（圖未示）的鍍膜室内 的工件架上，對該鍍膜室進行抽真空處理至真空度為8. 〇 xl(T1Pa，以500〜800sccm的流量向鍍膜室通入純度為 99· 999%的氬氣’對基體10表面進行電漿清洗，清洗時 間為 5 ~ 1 0 m i η。 [0023] [0024] [0025] 完成上述電漿清洗後’採用磁控濺射的方式在該基體i 〇 上形成一抗指紋層30。優選的，該抗指紋層30包括依次 形成於該基體10上的第一 Al2〇3層31、第一 A1N層32、第 二A1 203層33、第二A1N層34及A10N層35。形成該抗指紋 層30包括如下步驟： (1 )向所述鍍膜室中通入流量為2〇〇〜500sccm的工作氣 體氬氣’再向鍍膜室中通入流量為50〜300sccm的純度為 Θ9. 99%的反應氣體氧氣；開啟已置於所述鍍膜室内的鋁 把的電源’設置其功率為2〜5kw ’對基體1〇施加-50 — 1 50V的偏壓’加熱鍍膜室至5〇〜3〇ot (即濺射溫度 為50〜300t )，沉積第一六12〇3層31。沉積該第一 A、、 層31的時間為6〇~240min。 (2 )#止通入氧氣’保持氬氣的流量、鋁乾的電源功率 、濺射溫度及施加於基體1〇上的偏壓不變，向鍍膜室内 通入流量為50〜15〇sccm的純度為99· 9999%的反應氣體 氮軋，於所述第一Al2〇3層31上沉積第一A1N層32。沉積 該第一A1N層32的時間為5〜30min。 09914J305 表單編號A0】01 0992071866-0 [0026] 1 於所述第—A1N層32上沉積第二Al2〇3層33。沉積 該第二Λ、。1層33的工藝與沉積第一A 31的工藝類 L 〇 201221349 似，不同的係，沉積第二A190Q層33的時間為20〜60min L ο [0027] (4)重複所述步驟（2)，以於所述第二Al90q層33上沉 L 〇 積第二A1N層34。 [0028] (5)於所述第二A1N層34上沉積A10N層35，其具體操作 及步驟為：保持氬氣流量、氮氣流量、銘乾的電源功率 、濺射溫度及施加於基體10上的偏壓不變，向鍍膜室内 通入流量為50~30〇3(^111的純度為99.9999%的反應氣體 氧氣，沉積A10N層35。沉積該A10N層35的時間為 5〜30min ° [0029] 可以理解的，所述步驟（3 )及步驟：（4 )可以省略， A10N層35直接形成於第一 A1N層32的表面。 [0030] 關閉負偏壓及靶材的電源，停止通入氬氣、氮氣及氧氣 ，待所述抗指紋層30冷卻後，向鍍膜室内通入空氣，打 開鍍膜室門，取出鍍覆有抗指紋層30的基體10。 [0031] 可以理解的，在沉積該抗指紋層30之前還可於基體10表 面鍍覆一顏色層20，以增強該被覆件100的美觀性。 [0032] 相較於習知技術，所述的被覆件100藉由在基體10表面依 次錢射形成第一 Al2〇3層31、第一 A1N層32、第二Al2〇3 層33、第二A1N層34及A10N層35以實現抗指紋的功能， 該方法簡單易行，且不需要使用有毒的有機物，對環境 及人體健康無害。 【圖式簡單說明】 [0033] 圖1為本發明較佳實施例的被覆件的剖視圖。 099141305 表單編號A0101 第7頁/共11頁 0992 201221349 【主要元件符號說明】 [0034] 被覆件：100 [0035] 基體：10 [0036] 顏色層：2 0 [0037] 抗指紋層：30 [0038] 第一三氧化二鋁層：31 [0039] 第一氮化鋁層：32 [0040] 第二三氧化二鋁層：33 [0041] 第二氮化鋁層：34 [0042] 氮氧化鋁層：35 099141305 表單編號A0101 第8頁/共Π頁 0992071866-0201221349 VI. Description of the Invention: [Technical Field] The present invention relates to a coated member and a method of manufacturing the same, and, in particular, to a coated member having an anti-fingerprint layer and a method of manufacturing the coated member. [Prior Art] - [0002] With the increasing use of 3C electronic products, consumers are increasingly demanding the appearance of products. In addition to its aesthetically pleasing color and comfortable hand, it also requires good surface abrasion resistance, scratch resistance, and anti-fingerprint properties. 〇 [_3] In order to improve the anti-fingerprint property of the metal surface, US Patent No. 006736908 discloses an anti-fingerprint metal surface treatment liquid. The surface treatment liquid contains a special organic resin 'soluble vanadium compound, and a soluble metal compound containing at least one metal element of Zn, Ti, Mo, W, Μη and Ce, and the metal surface treated by the treatment liquid has good anti-fingerprint Sex. As a result, the special organic resin component has a complicated structure, is difficult to manufacture, and is easily polluted to the environment. Therefore, it is necessary to develop an anti-fingerprint coating that can achieve anti-fingerprint Q effect and is easy to manufacture and free from environmental pollution. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide an environmentally-friendly, easy-to-manufacture coated member having an anti-fingerprint layer. Further, it is also necessary to provide a method of manufacturing the above-described covering member. [0006] A covering member comprising a base body and an anti-fingerprint layer formed on the base body. The anti-fingerprint layer comprises a tantalum dioxide layer, a first aluminum nitride layer and a nitrogen oxide layer formed on the substrate in sequence. . 099141305 Form No. A0101 Page 3 / 11 Page 0992071866-0 201221349 [0007] [0009] [0010] [0012] [0016] [0016] [0016] [0016] A cover manufacturing The method comprises the steps of: providing a substrate; forming an anti-fingerprint layer on the substrate by a DC magnetron sputtering coating method, and forming the anti-fingerprint layer comprises the following steps: using oxygen as a reaction gas, using an aluminum target as a target, Forming a first aluminum oxide layer on the substrate; using nitrogen as a reaction gas, using an aluminum target as a target, forming a first aluminum nitride layer on the first aluminum oxide layer; reacting with oxygen and nitrogen The gas, with the aluminum target as a target, forms a layer of nitrogen oxide on the first nitride layer. The coating member is formed by sequentially sputtering a first aluminum oxide layer, a first aluminum nitride layer and an aluminum oxynitride layer on the surface of the substrate to realize an anti-fingerprint function. The method is simple and easy to use, and does not need to be used. Toxic organic matter is harmless to the environment and human health. [Embodiment] Referring to Figure 1, a covering member 100 according to a preferred embodiment of the present invention includes a base 10 and a transparent anti-fingerprint layer 30 formed on the base 10. The base 10 may be made of a metallic material or a non-metallic material. The metal material may include stainless steel, aluminum, aluminum alloy, copper, copper alloy, magnesium alloy, and the like. The non-metallic material may include plastic, ceramic, glass, polymer, and the like. The cover member 100 can be a housing for a 3C electronic product, a kitchen utensil, a kitchen appliance, or other decorating member. The anti-fingerprint layer 30 includes a first trioxane 099141305 sequentially formed on the substrate 10. Form No. A0101 Page 4 / 11 pages 0992071866-0 201221349 [0017] Ο . ' [0018] [0019] ❹ [0020 [0021] 099141305 Hua Erming (Α12〇3) layer 31, first aluminum nitride (Α1Ν) layer 32 and aluminum oxynitride layer (A10N) layer 35. Preferably, in the preferred embodiment, the anti-fingerprint layer 30 further includes a second Al 2 3 layer 33 and a second A 1 N layer 34 formed between the first A1N layer 32 and the A1 ON layer 35. The second A1 layer 2 3 33 is directly bonded to the first A1N layer 32, and the second A1N layer 34 is directly bonded to the A10N layer 35. The anti-fingerprint layer 30 can be formed by a DC magnetron sputtering coating method. The thickness of the first Al2〇3 layer 31 is 〇·2~〇.8em, and the thicknesses of the first A1N layer 32, the second Al2〇3 layer 33 and the second A1N layer 34 are all 〇. 〇5~ #. 2 #ra, the thickness of the A10N layer 3 5 is 〇. 〇5~〇. 1 //Hi. The anti-fingerprint layer 30 has an anti-fingerprint function, and the N element in the anti-fingerprint layer 30 can also enhance the compactness of the anti-fingerprint layer 3, so that the anti-fingerprint layer 30 can also be made. Has good corrosion resistance. It can be understood that a color layer 20 can be plated before depositing the anti-fingerprint layer 3 to enhance the aesthetics of the coated member 1 . The anti-fingerprint layer 3 is formed on the color layer 20. The method for manufacturing the covering member 00 according to a preferred embodiment of the present invention mainly comprises the following steps: providing a substrate 10, and placing the substrate 10 in an ultrasonic cleaner containing an ethanol or acetone solution for vibration cleaning to remove the substrate. 1 杂质 surface impurities and oil stains. After cleaning, dry and set aside. The surface of the substrate 1 which has been subjected to the above treatment is subjected to plasma cleaning to further remove the oil stain on the surface of the substrate 10 to improve the adhesion of the surface of the substrate 10 to the subsequent coating. The specific operation and process parameters of the plasma cleaning are as follows: the base page 5 / total π page form number A0101 0992071866-0 [0022] 201221349 body 10 is placed in the continuous flow magnetron sputtering coating machine (not shown) coating On the workpiece rack in the room, the coating chamber is evacuated to a vacuum degree of 8. 〇xl (T1Pa, a flow rate of 500·800 sccm is applied to the coating chamber to a purity of 99·999% of argon gas) to the surface of the substrate 10. The plasma cleaning is performed, and the cleaning time is 5 ~ 10 0 η. [0025] [0025] After the above plasma cleaning is completed, an anti-fingerprint layer 30 is formed on the substrate i by magnetron sputtering. Preferably, the anti-fingerprint layer 30 comprises a first Al 2 〇 3 layer 31, a first A1N layer 32, a second A1 203 layer 33, a second A1N layer 34 and an A10N layer 35 which are sequentially formed on the substrate 10. The anti-fingerprint layer 30 comprises the following steps: (1) introducing a working gas argon gas having a flow rate of 2 〇〇 to 500 sccm into the coating chamber, and then introducing a flow rate of 50 to 300 sccm into the coating chamber to a purity of Θ9. 99% of the reaction gas oxygen; turn on the power of the aluminum that has been placed in the coating chamber to set its power 2~5kw ' Apply a bias of -50 to 50V to the substrate 1〇' to heat the coating chamber to 5〇~3〇ot (ie, the sputtering temperature is 50~300t), deposit the first six 12〇3 layer 31. Deposition The time of the first A and the layer 31 is 6 〇 to 240 min. (2) #止入入氧' The flow rate of maintaining argon gas, the power supply of aluminum dry, the sputtering temperature and the bias voltage applied to the substrate 1〇 The first A1N layer 32 is deposited on the first Al2〇3 layer 31 by introducing a reaction gas nitrogen rolling having a flow rate of 50 to 15 〇sccm and a purity of 99·9999% into the coating chamber. The time of the A1N layer 32 is 5 to 30 min. 09914J305 Form No. A0] 01 0992071866-0 [1] A second Al2〇3 layer 33 is deposited on the first A1N layer 32. The second layer is deposited. The process of 33 is similar to the process class L 〇 201221349 of depositing the first A 31, and the time of depositing the second A190Q layer 33 is 20 to 60 min. [0027] (4) repeating the step (2) to Depositing a second A1N layer 34 on the second Al90q layer 33. [0028] (5) depositing an A10N layer 35 on the second A1N layer 34, the specific operation and steps of which are: maintaining argon flow ,nitrogen The flow rate, the power supply power of the stem, the sputtering temperature, and the bias voltage applied to the substrate 10 are constant, and a flow rate of 50 to 30 〇 3 is passed into the coating chamber (the purity of the reaction gas is 99.9999%), and the deposition of A10N is performed. Layer 35. The time for depositing the A10N layer 35 is 5 to 30 min. [0029] It is understood that the step (3) and the step: (4) may be omitted, and the A10N layer 35 is directly formed on the surface of the first A1N layer 32. [0030] Turning off the negative bias and the power of the target, stopping the introduction of argon, nitrogen and oxygen. After the anti-fingerprint layer 30 is cooled, air is introduced into the coating chamber, the coating chamber door is opened, and the plating is removed. The base 10 of the fingerprint layer 30. [0031] It can be understood that a color layer 20 can be plated on the surface of the substrate 10 before the anti-fingerprint layer 30 is deposited to enhance the aesthetics of the covering member 100. [0032] Compared with the prior art, the covering member 100 forms a first Al2〇3 layer 31, a first A1N layer 32, a second Al2〇3 layer 33, and a second by sequentially firing on the surface of the substrate 10. The A1N layer 34 and the A10N layer 35 are used for anti-fingerprint function. The method is simple and easy, and does not require the use of toxic organic substances, and is harmless to the environment and human health. BRIEF DESCRIPTION OF THE DRAWINGS [0033] FIG. 1 is a cross-sectional view of a coated member in accordance with a preferred embodiment of the present invention. 099141305 Form No. A0101 Page 7 / Total 11 Page 0992 201221349 [Description of Main Component Symbols] [0034] Covering: 100 [0035] Base: 10 [0036] Color Layer: 2 0 [0037] Anti-fingerprint layer: 30 [0038] First aluminum oxide layer: 31 [0039] First aluminum nitride layer: 32 [0040] Second aluminum oxide layer: 33 [0041] Second aluminum nitride layer: 34 [0042] Aluminum oxynitride Layer: 35 099141305 Form No. A0101 Page 8 / Total Page 0992071866-0