201037327 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種可群組化測試之晶片預燒機台，尤 指一種針對半導體積體電路晶片之預燒測試設備。 【先前技術】 一些電子元件、或晶片封裝體，如積體電路，常以小 型化電子元件之形式安裝於由若干主從電路元件構成之電 路中’以形成連續完整電路之功能。其中，為確保積體電 10 15 路模組在使用時的可靠性，在其被安裝或使用之前都要進 行預燒測試。亦即，對積體電路模組進行長時間的高溫運 作’可使原本就存在有缺陷之積體電路模組加速儘快失 效，從而將有缺陷之積體電路模組篩選並淘汰掉，此即稱 為預燒（Burn-in)測試。 ”、、而，目前一般的晶片預燒機台在以提高產能的前提 之下均以大容量進行開發，亦即在單一測試爐體内設置 大量的測試插槽。如此’在進行大批相同規格之電子元件、 或，片進行測試時，故然'可以大幅提高產能效率。但是， 隨者需求的轉變，當面臨少量多樣之 預燒機台變得反而在㈣成本及時^ 的 旰a之 目刖 測1日# . 奴的頂現機台在面臨少量多樣的產品 必項π吐同一測試爐體内僅能测試單一種產品，而且 法i途力，輯，也就是說—但開始進行預燒測試後，是益 …入新的W進行喊，也無法停止其中部份的測 20 201037327 ==途要加入新的、或停止部份的，而整個測試爐 份後再重新Γ件必須要全部同步停測，待加人後或停止部 二執行測試。據此’不但耗費時間、及成本，對 於產能、及效率方面均不甚理想。 5 【發明内容] ❹ 10 15 Ο 20 本發明為-種可群組化測試之晶片預燒機台，包括： 複數個延伸板'複數片預燒板、—參數資料庫、及—主控 模組。其中，每-延伸板包括有—微控制器、—記憶體、 及測式插槽。且每—延伸板上之微控制器分別電性麵接 同在延伸板上的記憶體、及測試插槽◊又，複數個延 伸板中包括有被群組化S —第—群組之至少—延伸板。 f外，每一預燒板包括有一邊接頭、及複數晶片測試 座，每一預燒板上之邊接頭分別電性耦接至同在一預燒板 上的複數晶片測試座。複數片預燒板之邊接頭係分別對應 插置入複數個延伸板之測試插槽内並彼此電性接觸，且複 數晶片測試座上承載有複數個待測晶片。此外，參數資料 庫儲存有一第一組參數，其第一組參數是對應提供給第一 群組内之延伸板作測試用。 再者，主控模組分別電性連接至複數個延伸板、及參 數資料庫。主控模組擷取參數資料庫中之第一組參數並將 其存入對應之第一群組内之延伸板的記憶體内。主控模組 更驅動控制第一群組内之延伸板的微控制器依據第一組參 數針對其對應插設之預燒板上的複數晶片測試座進行預燒 5 201037327 測試。據此，本發明俾能同時進行同種或不同種產品之測 試，也可隨時增測或停測部份測試晶片，以提高產能效率、 及節省大量成本。 其中，本發明之主控模組可透過傳送一第一旗標至複 5數個延伸板中至少其__，以指定其屬於上述第一群組。其 第-旗標可由延伸板上之微控制器存入其記憶體内，或由 各延伸板上设有一手動開關以手動設定為屬於哪一群組， 例如DIP撥動開關、按紐開關、或其他等效設定裝置等。又， 本發明可更包括有一輸入介面係電連接至主控模組，第一 10組參數係透過輸入介面輸入並儲存至參數資料庫。而輸入 介面可以是網路、匯流排、鍵盤、或其他等效的輸入裝置。 再且，本發明可包括有一測試腔室，其中，對應插設 於第一群組之延伸板的預燒板是容設於同一個測試腔室 内。測試腔室主要用以提供同一測試環境如溫度、壓力等。 15此外，測試腔室内可另包括有一溫度控制模組，其係電性 連接至主控模组，而溫度控制模組又可包括加熱器、冷卻 器’用以提供不同環境溫度。當然，測試腔室也可加壓、 或抽真空裝置，用以提供不同壓力環境。當然，本發明亦 可包括有至少二測試腔室，其中對應插設於第一群組之延 20伸板的預燒板可分別容設分佈於至少二不同測試腔室内。 亦即，同一群組之延伸板並不侷限設置於同一測試腔室 内，可分屬不同測試腔室。 ，二而本發明之複數個延伸板十可更包括有被群組化 為一第二群組之至少一延伸板，而參數資料庫可更儲存有 201037327 5 Ο ίο 15 Ο 20 一第二組參數，其第二組參數是對應提供給該第二群組内 之延伸板作測試用。其中，主控模組擷取參數資料庫中之 第二組參數並將其存人對應之第二群_线伸板的記憶 體内，且主控模組更驅動控制第二群組内之延伸板的微控 制器依據第二組參數針對其對應插設之預燒板上的複數晶 片測試座進行預燒測試。亦即，本發明並不僅侷限於單一 規格產品之群組測試，其可同時進行多個不同規格產品之 不同群組的測試。 其中，本發明之主控模組可更透過傳送一第二旗標至 複數個延伸板中至少其一，以指定其屬於上述第二群組。 而第二旗標並由延伸板上之微控制器存入其記憶體内，抑 或由各延伸板上設有一手動開關以手動設定為屬於哪一群 組’例如DIP撥動開關、按紐開關、或其他等效設定裝置等。 同樣地’本發明可包括有一測試腔室，其中，對應插 設於第一群組之延伸板的預燒板、以及對應插設於第二群 組之延伸板的預燒板，均容設於同一個測試腔室内。抑或， 可包括有至少二測試腔室，其中，對應插設於第一群組之 延伸板的預燒板是容設分佈於至少二不同測試腔室内，對 應插設於第二群組之延伸板的預燒板是容設分佈於至少二 不同測試腔室内。或者是，該第一群組容設於同一個測試 腔室内，第二群組容設於另一個測試腔室内，有利於分開 管理。 【實施方式】 7 201037327 請同時參閱圖1、圖2、及圖3，圖1係本發明可群組化 測試之晶片預燒機台一較佳實施例之整體設備示意圖，圖2 係本發明一較佳實施例之局部放大示意圖，圖3係本發明一 較佳實施例之系統架構圖。圖中顯示有複數個延伸板 5 21(extension board)，而每一延伸板21包括有一微控制器 2Π、一記憶體212、及一測試插槽213(slot)。其中，每一延 伸板21上之微控制器211分別電性耦接至同在一延伸板21 上的s己憶體212、及測試插槽213。而且，複數個延伸板21 中包括有已被群組化為一第一群組G1之至少一延伸板 10 G11、及一第二群組G2之至少一延伸板G2i。 再者，複數片預燒板3中之每一預燒板3皆具有一邊接 頭32(edge connector)、及複數晶片測試座33(socket)。而每 一預燒板3上之邊接頭32分別電性耦接至同在一預燒板3上 的複數晶片測試座33。其中，複數片預燒板3之邊接頭32係 15 分別對應插置入複數個延伸板21之測試插槽213内並彼此 電性接觸，且複數晶片測試座33上承載有複數個待測晶片 31。亦即，預燒板3主要用以承載待測晶片31，其插入延伸 板21之測試插槽213内，以進行預燒測試。 再且’圖1中另顯示有四測試腔室，本實施例將以其中 20 二測試腔室6,7進行說明。其中，對應插設於第一群組G1之 延伸板G11的預燒板3是容設分佈於不同測試腔室6,7内；對 應插設於第二群組G2之延伸板G21的預燒板3同樣是容設 分佈於不同測試腔室6,7内。當然，第一群組G1也可容設於 同一個測試腔室6内，第二群組G2可容設於另一個測試腔室 201037327 5 Ο ίο 15 〇 20 7内，有利於分開管理。此外，測試腔室6,7内分別設置有一 溫度控制模組61，71，其係電性連接至主控模組5，溫度控制 模組61，71包括有加熱器611,711、冷卻器612,712。亦即， 溫度控制模組61主要用以提供加熱或冷卻測試腔室6,7内之 環境溫度，以符合各種溫度之測試條件。據此，測試腔室 6,7内亦可另外包括加壓、或抽真空裝置，用以提供不同壓 力環境，或其他環境參數裝置。 另外，參數資料庫4(parameter database)則儲存有一第 一組參數41、及一第二組參數42,第一組參數41是對應提 供給第一群組G1内之延伸板G11作測試用，第二組參數42 疋對應提供給第二群組G2内之延伸板G21作測試用。詳言 之，第一組參數41、及第二組參數42的内容係分別針對第 一群組G1内之延伸板GI1、及第二群組G2内之延伸板g21 所對應插置之預燒板3上所承載之待測晶片31的種類或規 格為對象，其内容即為其所欲進行的預燒測試内容，其可 以疋腳位所對應輸入之電位、或電流，並量測相對應之輸 出電位、或電流，或是讀寫資料、運算處理等相關測試内 容。 此外，圖3中另顯示一主控模組5，其是分別電性連接 至複數個延伸板21、參數資料庫4、輸入介面8、及輸出裝 置9。其中，上述第一組參數41 '及一第二組參數42係透過 輸入介面8輸入並儲存至參數資料庫4，其可以是網路、匯 流排、鍵盤、或其他等效的輸入裝置。而輸出裝置9可以是 顯示螢幕、列印裝置等。首先，透過輸入介面8或其他方式 9 201037327 進行群組化，亦即主控模組5分別透過傳送一第一旗標fi、 及一第二旗標f2至複數個延伸板21中至少其一，用以指定 其屬於上述第一群組G1、及第二群組。 其中，上述第一旗標fl、及第二旗標？2並由對應之延伸 5板011021上之微控制器211存入其記憶體212内。抑或，以 各延伸板21上設有一手動開關24,25以手動設定為屬於哪一 群組，例如DIP撥動開關或按鈕開關…等。接著，主控模組 5擷取參數資料庫4中之第一組參數41、及第二組參數42並 將其分別存入對應之第一群組G1内之延伸板G1丨、及第二 10 群組G2之至少一延伸板G21的記憶體212内。主控模組5更 驅動控制第一群組G1内之延伸板G11、及第二群組α2之至 少一延伸板G21的微控制器211，並依據第一組參數41、及 第二群組G2針對其對應插設之預燒板3上的複數晶片測試 座33進行預燒測試。 15 請參閱圖4 ’圖4係本發明可群組化測試之晶片預燒機 台一較佳實施例之預燒測試流程圖。本實施例測試步驟如 下，首先先進行群組化，其可透過輸入裝置8進行群組化編 組，並同時輸入第一組參數41、及第二組參數42至參數資 料庫4(步驟S905)。接著，主控模組5擷取參數資料庫4中之 20 第一組參數41、及第二組參數42並將其分別存入對應之第 一群組G1内之延伸板G11、及第二群組G2之至少一延伸板 G21的記憶體212内（步驟S910)。 此時’可決定是否再增加測試群組（步驟S915)。若已 無需再增加測試群組，接下來便開始進行預燒測試，其運 201037327 作如下，主控模組5驅動控制第一群組G1内之延伸板G1 j、 及第二群組G2之至少一延伸板G21的微控制器211，並依據 第一組參數41、及第二群組G2針對其對應插設之預燒板3 上的複數晶片測試座33進行預燒測試（步驟S920)。當然，在 5 進行預燒測試的同時可隨時增加測試群組、或終止測試群 組中部分延伸板21測試的進行。最後’測試結束時，會輸 出測試結果至輸出裝置9(步驟S925)。 上述實施例僅係為了方便說明而舉例而已，本發明所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 10 於上述實施例。 【圖式簡單說明】 圖1係本發明一較佳實施例之整體設備示意圖。 圖2係本發明一較佳實施例之局部放大示意圖。 15 圖3係本發明一較佳實施例之系統架構圖。 圖4係本發明一較佳實施例之預燒測試流程圖。 ◎ 【主要元件符號說明】 21，G11，G21 延伸板 211 微控制器 212 記憶體 213 測試插槽 24,25手動開關 3 預燒板 31 待測晶片 32 邊接頭 33 測試座 4 參數資料庫 41 第一組參數 42 第二組參數 201037327 5 主控模組 61,71溫度控制模組 612,712冷卻器 9 輸出裝置 Ϊ2 第二旗標 G2 第二群組 6,7 測試腔室 611,711加熱器 8 輸入介面 f 1 第一旗標 G1 第一群組 12201037327 VI. Description of the Invention: [Technical Field] The present invention relates to a wafer pre-burning machine that can be group tested, and more particularly to a burn-in test device for a semiconductor integrated circuit chip. [Prior Art] Some electronic components, or chip packages, such as integrated circuits, are often mounted in a circuit composed of a plurality of master-slave circuit elements in the form of miniaturized electronic components to form a continuous and complete circuit. Among them, in order to ensure the reliability of the integrated circuit module, it is required to perform the burn-in test before it is installed or used. That is to say, the long-term high-temperature operation of the integrated circuit module can accelerate the failure of the integrated circuit module which is already defective, thereby screening and eliminating the defective integrated circuit module. It is called the Burn-in test. Moreover, the current general wafer pre-burning machine is developed with large capacity under the premise of increasing production capacity, that is, a large number of test slots are set in a single test furnace body. When the electronic components, or the chips are tested, it is possible to greatly increase the productivity efficiency. However, when the demand changes, when a small number of pre-burning machines are faced, the cost is changed in time.刖测1日#. The slave's top machine is faced with a small variety of products. π spit can only test a single product in the same test furnace body, and the method is a way, and it means, but it starts to advance. After the burning test, it is beneficial to enter the new W to shout, and can not stop part of the test 20 201037327 == way to join the new, or stop part, and the entire test furnace and then re-engagement must be All the synchronous stop tests, after the addition of people or stop the second part of the test. According to this, not only is time and cost, it is not ideal for productivity and efficiency. 5 [Summary of the Invention] ❹ 10 15 Ο 20 The present invention is - can be group The wafer pre-burning machine of the test comprises: a plurality of extension plates 'a plurality of pre-burning plates, a parameter database, and a main control module. Among them, each extension plate includes a micro-controller, a memory And the test slot, and each of the microcontrollers on the extension board is electrically connected to the memory on the extension board and the test slot, and the plurality of extension boards include the grouped S - at least - extension of the first group - f, each pre-burning plate includes a side joint, and a plurality of wafer test sockets, each of which is electrically coupled to the same pre-burning a plurality of wafer test sockets on the board. The side joints of the plurality of pre-burning boards are respectively inserted into the test sockets of the plurality of extension boards and electrically connected to each other, and the plurality of wafer test sockets carry a plurality of wafers to be tested In addition, the parameter database stores a first set of parameters, and the first set of parameters is correspondingly provided for testing the extension boards in the first group. Furthermore, the main control modules are electrically connected to the plurality of extension boards respectively. And parameter database. The main control module takes parameters The first set of parameters in the database is stored in the memory of the extension board in the corresponding first group. The main control module drives the microcontroller that controls the extension board in the first group according to the first The group parameters are pre-fired 5 201037327 for the corresponding plurality of wafer test sockets on the corresponding pre-burning plates. According to the invention, the invention can simultaneously test the same kind or different kinds of products, and can also increase or stop the measurement at any time. The test module is used to improve the productivity and save a lot of cost. The main control module of the present invention can transmit a first flag to at least five of the plurality of extension boards to specify that it belongs to the above a group whose flag can be stored in its memory by a microcontroller on the extension board, or by a manual switch on each extension board to manually set which group it belongs to, such as a DIP toggle switch, Button switch, or other equivalent setting device. Moreover, the present invention may further include an input interface electrically connected to the main control module, and the first 10 sets of parameters are input through the input interface and stored in the parameter database. The input interface can be a network, a bus, a keyboard, or other equivalent input device. Still further, the present invention can include a test chamber in which the pre-fired plates corresponding to the extension plates of the first group are housed in the same test chamber. The test chamber is primarily used to provide the same test environment such as temperature, pressure, and the like. In addition, the test chamber may further include a temperature control module electrically connected to the main control module, and the temperature control module may further include a heater and a cooler to provide different ambient temperatures. Of course, the test chamber can also be pressurized, or vacuumed to provide a different pressure environment. Of course, the present invention may also include at least two test chambers, wherein the pre-burning plates corresponding to the extension plates of the first group may be respectively disposed in at least two different test chambers. That is to say, the extension plates of the same group are not limited to be disposed in the same test chamber, and can be divided into different test chambers. And the plurality of extension boards of the present invention may further comprise at least one extension board grouped into a second group, and the parameter database may further store 201037327 5 Ο ί ο 15 Ο 20 a second group The parameter, the second set of parameters is corresponding to the extension board provided in the second group for testing. The main control module captures the second set of parameters in the parameter database and stores them in the memory of the second group _ line extension board, and the main control module drives the control in the second group. The microcontroller of the extension board performs a burn-in test on the corresponding plurality of wafer test pads on the corresponding inserted burn-in board according to the second set of parameters. That is, the present invention is not limited to group testing of a single specification product, which can simultaneously test different groups of products of different specifications. The master control module of the present invention can further transmit at least one of the plurality of extension boards by transmitting a second flag to the second group. The second flag is stored in the memory by the microcontroller on the extension board, or a manual switch is provided on each extension board to manually set which group to belong to, such as a DIP toggle switch, a button switch. , or other equivalent setting device, etc. Similarly, the present invention may include a test chamber in which pre-burning plates corresponding to the extension plates of the first group and pre-burning plates corresponding to the extension plates inserted in the second group are accommodated. In the same test chamber. Or, the method may include at least two test chambers, wherein the pre-burning plates corresponding to the extension plates of the first group are disposed in at least two different test chambers, corresponding to the extension of the second group The pre-burning plates of the plates are arranged to be distributed in at least two different test chambers. Alternatively, the first group is housed in the same test chamber, and the second group is housed in another test chamber to facilitate separate management. [Embodiment] 7 201037327 Please refer to FIG. 1 , FIG. 2 , and FIG. 3 simultaneously. FIG. 1 is a schematic diagram of an overall device of a preferred embodiment of a wafer calcining machine capable of group testing according to the present invention, and FIG. 2 is a schematic diagram of the present invention. A partially enlarged schematic view of a preferred embodiment, and FIG. 3 is a system architecture diagram of a preferred embodiment of the present invention. The figure shows a plurality of extension boards 5 21 (extension board), and each extension board 21 includes a microcontroller 2 , a memory 212 , and a test slot 213 (slot). The microcontroller 211 on each of the extension boards 21 is electrically coupled to the s-resonance 212 and the test socket 213 on the extension board 21, respectively. Moreover, the plurality of extension boards 21 include at least one extension board 10 G11 that has been grouped into a first group G1, and at least one extension board G2i of a second group G2. Further, each of the plurality of pre-burning plates 3 has an edge connector 32 and a plurality of wafer test sockets 33 (sockets). The edge connectors 32 on each of the pre-burning plates 3 are electrically coupled to the plurality of wafer test sockets 33 on the same pre-burning plate 3, respectively. The side connectors 32 of the plurality of pre-burning plates 3 are respectively inserted into the test slots 213 of the plurality of extension plates 21 and electrically connected to each other, and the plurality of wafer test pads 33 are loaded with a plurality of wafers to be tested. 31. That is, the burn-in board 3 is mainly used to carry the wafer 31 to be tested, which is inserted into the test slot 213 of the extension board 21 for the burn-in test. Further, there are four test chambers shown in Fig. 1, and this embodiment will be described with 20 test chambers 6, 7. The pre-burning plate 3 corresponding to the extension plate G11 of the first group G1 is disposed in different test chambers 6, 7; and the pre-burning corresponding to the extension plate G21 inserted in the second group G2 The plates 3 are also housed in different test chambers 6, 7. Of course, the first group G1 can also be accommodated in the same test chamber 6, and the second group G2 can be accommodated in another test chamber 201037327 5 Ο ί 15 15 〇 20 7 to facilitate separate management. In addition, temperature control modules 61, 71 are respectively disposed in the test chambers 6, 7 and are electrically connected to the main control module 5, and the temperature control modules 61, 71 include heaters 611, 711 and coolers 612, 712. That is, the temperature control module 61 is mainly used to provide an ambient temperature for heating or cooling the test chambers 6, 7 to meet various temperature test conditions. Accordingly, the test chambers 6, 7 may additionally include pressurization, or vacuuming means, to provide different pressure environments, or other environmental parameter devices. In addition, the parameter database 4 stores a first set of parameters 41 and a second set of parameters 42. The first set of parameters 41 is correspondingly provided to the extension board G11 in the first group G1 for testing. The second set of parameters 42 疋 corresponds to the extension plate G21 provided in the second group G2 for testing. In detail, the contents of the first set of parameters 41 and the second set of parameters 42 are respectively pre-fired for the extension plate GI1 in the first group G1 and the extension plate g21 in the second group G2. The type or specification of the wafer 31 to be tested carried on the board 3 is the object, and the content thereof is the burn-in test content of the desired test, which can input the potential or current corresponding to the pin position, and measure the corresponding corresponding The output potential, or current, or related test content such as reading and writing data, arithmetic processing. In addition, a main control module 5 is additionally shown in FIG. 3, which is electrically connected to a plurality of extension boards 21, a parameter database 4, an input interface 8, and an output device 9, respectively. The first set of parameters 41' and the second set of parameters 42 are input through the input interface 8 and stored in the parameter database 4, which may be a network, a bus, a keyboard, or other equivalent input device. The output device 9 can be a display screen, a printing device, or the like. First, grouping is performed through the input interface 8 or other manners 9 201037327, that is, the main control module 5 transmits at least one of the first flag fi and the second flag f2 to the plurality of extension boards 21 respectively. For specifying that it belongs to the first group G1 and the second group. Among them, the first flag fl and the second flag? 2 and the microcontroller 211 on the corresponding extension 5 board 01101 is stored in its memory 212. Or, a manual switch 24, 25 is provided on each extension plate 21 to manually set which group it belongs to, such as a DIP toggle switch or a push button switch. Then, the main control module 5 captures the first set of parameters 41 and the second set of parameters 42 in the parameter database 4 and stores them in the corresponding extension plate G1丨 and the second in the corresponding first group G1. 10 At least one of the groups G2 is in the memory 212 of the extension board G21. The main control module 5 further drives the microcontroller 211 of the extension board G11 in the first group G1 and the extension board G21 of the second group α2, and according to the first group parameter 41 and the second group. G2 performs a burn-in test for the plurality of wafer test sockets 33 on the correspondingly inserted pre-burning plates 3. 15 Referring to FIG. 4' FIG. 4 is a flow chart of a burn-in test of a preferred embodiment of the wafer calcining station of the present invention. The test procedure of this embodiment is as follows. First, grouping is performed, which can be grouped by the input device 8, and simultaneously input the first group parameter 41 and the second group parameter 42 to the parameter database 4 (step S905). . Then, the main control module 5 captures the first set of parameters 41 and the second set of parameters 42 of the parameter database 4 and stores them in the corresponding extension group G11 and the second in the first group G1. At least one of the groups G2 extends into the memory 212 of the board G21 (step S910). At this time, it can be decided whether or not to increase the test group (step S915). If it is no longer necessary to add a test group, the burn-in test is started, and the operation of 201037327 is as follows. The main control module 5 drives and controls the extension board G1 j in the first group G1 and the second group G2. The at least one microcontroller 211 of the extension board G21 performs a burn-in test on the corresponding plurality of wafer test sockets 33 on the corresponding pre-burning board 3 according to the first group parameter 41 and the second group G2 (step S920). . Of course, at the same time as the pre-burn test, the test group can be added at any time, or the test of the partial extension plate 21 in the test group can be terminated. At the end of the final 'test, the test result is output to the output device 9 (step S925). The above-described embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic diagram of an overall apparatus in accordance with a preferred embodiment of the present invention. 2 is a partially enlarged schematic view of a preferred embodiment of the present invention. 15 is a system architecture diagram of a preferred embodiment of the present invention. 4 is a flow chart of a burn-in test according to a preferred embodiment of the present invention. ◎ [Main component symbol description] 21, G11, G21 extension board 211 Microcontroller 212 Memory 213 Test slot 24, 25 manual switch 3 Pre-burning board 31 Chip to be tested 32 Edge joint 33 Test socket 4 Parameter database 41 A set of parameters 42 The second set of parameters 201037327 5 Main control module 61, 71 temperature control module 612, 712 cooler 9 Output device Ϊ 2 Second flag G2 Second group 6, 7 Test chamber 611, 711 Heater 8 Input interface f 1 first flag G1 first group 12