201005840 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電鍍方法，尤指由焊球面傳電流之無導線 電鍍方法。 【先前技術】 目前電子產品均逐漸改採環保材質進行封裝，而為達成無錯 (Leadfree)甚至無鹵素環保材之需求，對於IC載板的可靠度要求 β 曰益嚴苛。若銲錫改採無鉛材料，會導致銲錫熔點相對提高不少， 使得對載板可靠度、耐熱度等的要求也隨之提高不少。所以對各 1C封裝廠商而言，又有許多因更高温製程環境所帶來的問題需要 --克服。 為求電性加強及減少雜^1，目前載板皆改為無導電線之設 計，但打金線區(wire bonding)仍須以電鍍鎳金以達較佳接著性。 雖打線區亦可用化學鎳金(或厚化金)製作但目前評比其可靠度不 ❷佳。所以，對既為無導線設計又須以電鑛鎳金方式製作打線區塊， 大都以GPP (Full body gold)程序製作。 然而，在進行GPP程序前，由於電鍵鎮金層均是在形成防焊 漆(SM)如先形成的，故SM底下所佔電鍍鎳金層面積相對較大。 由於SM和金面之間的附著性較差，所以在對可靠度、耐熱度要 求越來越高的今天，以往的製作方式似已不足。 此外，無導電線電鍍(NPL)製程方法除了流程相當繁複外，在 進行鍍薄銅需特殊機器設備，且鍍薄銅後蝕刻之參數較難控制， 常會發生Micro Short或經可靠度實驗時造成Micr〇 sh〇rt而產生不 201005840 可收拾的結果。 種先形錢緣層(例如光阻層)然後才形成電 上述問題的產生。，縣無雜電歡就顯麵，可完全避免 【發明内容】 ❹ 方牛，之主要目的在提供一種由谭球面傳電流之無導線電鍍 今僅先在焊塾面上形成電路層，並經由焊球面上的電鍍 ^曰將電錢電流傳至焊墊面的電路層（已在其周圍用絕緣層(可 ==焊_或光_)_)，峨此在電闕贿球面上的電鑛 金^上形成保護層(電齡）。如此—來，因為魏金是在絕緣層 4被开v成使得在焊塾面上(已連接有晶粒)的絕緣層之下不會 有電鑛金，可防止絕緣層從電鍵金上脫落，提高產品的可靠度。 基於上述目的，本發㈣嬋球面傳電流之無導線電鐘方法， 首先提供載板，此載板的焊塾面和焊球面的表面上、載板的導通 孔的壁面上’均已形成電鍍金屬層，並可藉著電鑛金屬層使焊藝 面和焊球面彼此電性導通。接著，僅圖案化焊墊面上電鍛 ， 而形成第-電路層。然後’形成絕緣層於第—電路層周圍，但仍 曝露出部分第-電路層。最後’經由焊球面上的電鑛金屬層將電 錢電流傳至驗面的第-電路層’而藉此在第—電路層仍曝露出 的部分上形成第一保護層。 關於本發明之優點與精神可以藉由以下的發明詳述及所附圖 式得到進一步的瞭解。 【實施方式】 201005840 · 請參閱第一A〜一F圖，本發明由焊球面傳電流之無導線電鍍 方法之示意圖。如第一A圖所示，在進行本發明的方法前，必須 先藉著習知技術準備基板10。在已覆蓋有薄化銅面的基板1〇上， 利用雷射或機械鑽孔方式鑽出導通孔5(PinThr〇ughH〇le，pTH)。 然後在基板10的焊墊面(bump side)和焊球面(ballSide)的表面上、 基板10的導通孔5的壁面上形成電鑛金屬層12。 在本發明由焊球面傳電流之無導線電鍍方法中，主要僅先在 ❹焊墊面上形成第-電路層7a(如第- A圖所示），然後由於第一電 路層7a與基板1〇的焊球面上的電鍍金屬層12彼此電性相通，而 經由如第-c圖所示之焊球面上的電鑛金屬層12將電鍍電流傳至 焊墊面的第-電路層7a(已在其周圍用絕緣層14包圍），而藉此在 第-電路層7a與烊球面上的電錢金屬層12上形成第一保護層 16(電鍍金）’如第-C圖所示。接著如同習知技術一般，在焊塾 面(bump side)上的第一電路層7a貼附晶粒(die)。為了進一步保護 電鑛金屬層12,可在第—保護層16上電鐘形成—第二保護 粵 曰如此一來，因為電鑛金是在絕緣層Μ之後才被形成，使得在 焊墊面上(已連接有晶粒)的絕緣層14之下不會有電錢金可防止 絕緣層14從電鍍金上脫落，提高產品的可靠度。 如第一D圖所示，為了製作出如第一F圖所示之第二線 7b，先去除絕緣層14，並如第_ E圖所示，在焊塾面 護層18、基板K)之上完全覆蓋有絕緣層2()，但是钟球面;的 第,保護層18、基板10上則選擇性覆蓋有絕緣層2〇。換言之， 在焊球面上卿成的絕騎2G可選雜曝露蛛料帛 18的部份，而曝露出準備被去除的電鍍金屬層12。最終，去除電 201005840 以形成第二 鍍金屬層12，而曝露出基板ίο，同時去除絕緣層2〇 線路層7b ’如第一 F圖所示。 上述第一保護層16、第二保護層18可為電鐵金、 -劑或光 述組合其中之-，而絕緣層14、絕緣層2G (如)可為防焊=錄和上 阻劑。 、且5 藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本 發明之特徵與精神，而並非以上述所揭露的較佳具體實施例來對 本發明之範疇加以限制。相反地，其目的是希望能涵蓋各種改變 及具相等性的安排於本發明所欲申請之專利範圍的範疇内。 【圖式簡單說明】 第一 A〜一 F圖為本發明由焊球面傳電流之無導線電鍍 方法之示意圖。 【主要元件符號說明】 5導通孔 ❹ 7a、7b線路層 1〇基板 12電鍍金屬層 14、20絕緣層 16第一保護層 18第二保護層201005840 IX. INSTRUCTIONS: TECHNICAL FIELD OF THE INVENTION The present invention relates to an electroplating method, and more particularly to a method of electroless plating by a solder ball surface. [Prior Art] At present, electronic products are gradually being changed to environmentally-friendly materials for packaging, and in order to achieve the requirements of leadfree or even halogen-free environmentally friendly materials, the reliability requirements for IC carrier boards are severe. If the solder is changed to lead-free materials, the solder melting point will be relatively increased, which will increase the reliability and heat resistance of the carrier. Therefore, for each 1C package manufacturer, there are many problems that need to be overcome due to the higher temperature process environment. In order to improve the electrical properties and reduce the number of impurities, the current carrier boards are changed to non-conductive lines, but the wire bonding must still be plated with nickel gold for better adhesion. Although the wire-punching area can also be made of chemical nickel gold (or thick gold), its current rating is not good. Therefore, for both the non-wire design and the electro-mineral nickel gold production of the wire block, most of them are produced by the GPP (Full body gold) program. However, before the GPP process, since the bond gold layer is formed first in the formation of the solder resist (SM), the area of the plated nickel gold layer under the SM is relatively large. Due to the poor adhesion between the SM and the gold surface, the current production methods seem to be insufficient in the demand for higher reliability and heat resistance. In addition, the non-conductive plating (NPL) process method requires a special machine in the process of plating thin copper, and the parameters of etching after thin copper plating are difficult to control, often resulting in Micro Short or reliability test. Micr〇sh〇rt produces a result that is not available for 201005840. A pre-formed money edge layer (such as a photoresist layer) is then formed to generate electricity. County, no miscellaneous electric joy to face, can be completely avoided [invention content] ❹ Fang Niu, the main purpose is to provide a ballless electroplating current from Tan spherical surface, today only form a circuit layer on the soldering surface, and through Electroplating on the surface of the solder ball transfers the electricity current to the circuit layer on the pad surface (the insulation layer (=========================================================================== A protective layer (electrical age) is formed on the gold deposit. So—because Wei Jin is opened in the insulating layer 4 so that there is no electric gold deposit under the insulating layer on the soldering surface (with the die connected), which prevents the insulating layer from falling off the key gold. Improve product reliability. Based on the above purpose, the method of the fourth embodiment of the present invention provides a carrier board in which the soldering surface of the carrier board and the surface of the solder ball surface and the wall surface of the via hole of the carrier board are formed with plating. The metal layer and the conductive metal surface and the solder ball surface are electrically connected to each other by the electric metal layer. Next, only the patterned pad surface is electrically forged to form a first circuit layer. Then, an insulating layer is formed around the first circuit layer, but a portion of the first-circuit layer is still exposed. Finally, the electric current is transferred to the first circuit layer of the surface by the electro-mineral metal layer on the surface of the solder ball, whereby the first protective layer is formed on the portion where the first circuit layer is still exposed. The advantages and spirit of the present invention will be further understood from the following detailed description of the invention. [Embodiment] 201005840 · Please refer to the first A to F diagram, which is a schematic diagram of a wire-free plating method for transferring current from a solder ball surface. As shown in Fig. A, the substrate 10 must be prepared by conventional techniques prior to carrying out the method of the present invention. On the substrate 1 covered with the thinned copper surface, the via hole 5 (PinThr〇ugh H〇le, pTH) is drilled by laser or mechanical drilling. Then, an electric metal layer 12 is formed on the surface of the bump side and the ball surface of the substrate 10 on the wall surface of the via hole 5 of the substrate 10. In the wireless plating method of the present invention for transferring current from a solder ball surface, the first circuit layer 7a (as shown in FIG. A) is mainly formed only on the surface of the germanium pad, and then the first circuit layer 7a and the substrate 1 are The electroplated metal layers 12 on the surface of the solder balls are electrically connected to each other, and the electroplating current is transmitted to the first circuit layer 7a of the pad surface via the electro-mineral metal layer 12 on the solder ball surface as shown in FIG. The insulating layer 14 is surrounded by the periphery thereof, whereby the first protective layer 16 (electroplated gold) is formed on the first circuit layer 7a and the electric money metal layer 12 on the spherical surface as shown in FIG. Next, as in the prior art, a die is attached to the first circuit layer 7a on the bump side. In order to further protect the electro-mineral metal layer 12, an electric clock can be formed on the first protective layer 16 - the second protection is the same as the electric gold is formed after the insulating layer is formed, so that the surface is on the pad There is no electricity money under the insulating layer 14 (with the die connected) to prevent the insulating layer 14 from falling off the plating gold, thereby improving the reliability of the product. As shown in the first D diagram, in order to fabricate the second line 7b as shown in the first F-graph, the insulating layer 14 is first removed, and as shown in Fig. E, in the solder mask 18, the substrate K) The insulating layer 2 is completely covered with the insulating layer 2 (), but the insulating layer 18 and the substrate 10 are selectively covered with the insulating layer 2 . In other words, the portion of the solder ball that is formed on the surface of the solder ball is exposed to the portion of the solder paste metal layer 12 that is to be removed. Finally, the power 201005840 is removed to form the second metallization layer 12, while the substrate ίο is exposed, while the insulating layer 2 线路 the wiring layer 7b' is removed as shown in the first F. The first protective layer 16 and the second protective layer 18 may be a combination of an electric iron, a catalyst or a photo-, and the insulating layer 14 and the insulating layer 2G may be, for example, a solder resist and a resist. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS The first A to F diagrams are schematic diagrams of the method of conducting a wire-free plating method for transferring current from a solder ball surface. [Main component symbol description] 5 via hole ❹ 7a, 7b circuit layer 1 germanium substrate 12 plated metal layer 14, 20 insulating layer 16 first protective layer 18 second protective layer