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TW200949022A - Surface treating method for housing - Google Patents

Surface treating method for housing
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Publication number
TW200949022A
TW200949022ATW97120037ATW97120037ATW200949022ATW 200949022 ATW200949022 ATW 200949022ATW 97120037 ATW97120037 ATW 97120037ATW 97120037 ATW97120037 ATW 97120037ATW 200949022 ATW200949022 ATW 200949022A
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TW
Taiwan
Prior art keywords
outer casing
metal layer
surface treatment
treatment method
nickel metal
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TW97120037A
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Chinese (zh)
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TWI369420B (en
Inventor
Jong-Yi Su
Cheng-Shin Chen
Yueh-Feng Lee
Chuan-Long Chen
Ren-Ning Wang
Run-Yi Chen
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Fih Hong Kong Ltd
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Priority to TW097120037ApriorityCriticalpatent/TWI369420B/en
Publication of TW200949022ApublicationCriticalpatent/TW200949022A/en
Application grantedgrantedCritical
Publication of TWI369420BpublicationCriticalpatent/TWI369420B/en

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Abstract

A surface treating method for housing is as follows: provide one substrate and plate one first non-nickel plating on it. Then sprinkle to the said first non-nickel plating with granules to make it be rough on the surface. After this, plate one second non-nickel plating on the said first non-nickel plating.

Description

Translated fromChinese

200949022 九、發明說明: 【發明所屬之技術領域】 • 本發明係關於一種外殼之表面處理方法,特別係關於 種使該外设表面具有亞光效果之表面處理方法。 【先前技術】 %知對手機、數碼相機、個人數位助理、筆記本電 腦等可攜式電子裝置之塑膠外殼通常會進行電鑛處理 以使外殼表面具有金屬效果。隨著人們對裝飾性外觀件 β之外觀品質要求越來越高,通常之高亮度、高硬度之金 屬質感表面已不再為人們追求之主要方向,越來越多之 人們開始青睞於具亞光效果之金屬外觀,如由霧鎳電鍍 工藝所製成之金屬電鍍層,該電鍍層之表面為似錦緞般 之霧面,其一方面外觀高雅,另一方面其表面產生之金 屬光澤柔和,可減低光之反射,人眼注視後不易疲勞。 然而由霧鎳電鍍工藝所製得之電鍍層中含有鎳,鎳為一 ❺種人體不友好元素,使時間過長會引起人們皮膚過 敏,對人體之健康產生危害。因此,該含鎳之產品很難 具市場競爭力。 【發明内容】 鑒於此,有必要提供一種可使外殼具有亞光效果且對 人體友好之表面處理方法。 一種外殼之表面處理方法,其包括如下步驟: 提供一外殼基體; 在該外殼基體上電鍍第一非鎳金屬層; 7 200949022 對該第一非鎳金屬層進行喷砂處理使其形成亞光效 果; ’ 在該第一非鎳金屬層上電鍵第二非鎳金屬層。 相較於習知技術,本發明外殼之表面處理方法既可使 外殼表面形成亞光之效果或霧面效果,又可使產品中不含 對人體有害之鎳金屬,其產品更具有市場競爭力。 【實施方式】 本發明較佳實施方式外殼之表面處理方法包括如下 ©步驟: 提供一外殼基體。該基體可為塑膠殼體,該塑膠可選 自為丙稀猜-丁 二稀-苯乙稀 (Acrylonitrile-Butadiene-Styrene,ABS)或丙烯腈-丁二烯_ 苯乙稀與聚碳酸醋(Polycarbonate, PC)之混合物。該基體 亦可為金屬破體’如不錄鋼、鈦合金、鎮合金或铭合金殼 體等。 所述外殼基體為塑膠殼體時,對該外殼基體進行表面 金屬化處理,使該外殼基體之表面轉化為可導電之表面, 以便於後續之電鍵。 對外殼基體之表面金屬化處理方法可為物理方法,如 利用真空鍍膜法在基體表面鍍覆一金屬層,該金屬層為銅 或其他非鎳金屬層。 所述表面金屬化處理之方法亦可為化學方法,如使用 含銅或其他非鎳金屬之溶液在外殼基體上沉積一金屬 層。在使用化學法對外殼基體表面進行金屬化處理時,首 8 200949022 先對外殼基體之表面進行蝕刻處理,使其表面粗糙化。該 餘刻處理可藉由使用含鉻酸、鉻硫混酸 * (chromschwefelsaure)或者高錳酸鉀之腐蝕劑對基體表面 •進行腐蝕來實現,也可採用等離子加工或用氧化^蝕法來 實現。 蝕刻後之外殼基體經酸洗或鹼洗中和殘餘之蝕刻液 後,再用清水沖洗,並進一步對該外殼基體進行活化處 理。活化處科,將外殼基體浸潰於一含有⑽、聚酿胺 Ο酸及貴金屬離子(如把離子)之活化劑溶液中一定時間。 活化處理後該外殼基體之表面上沉積有點狀分佈之貴金 屬(如鈀)。 活化處理後再將外殼基體置於含銅之溶液中進行浸 ,’使銅金屬橋架沉積於點狀分佈之把金屬之間,以使外 殼基體之表面全部被銅金屬所覆蓋,形成一導電層。 ±將所述金屬外殼基體或表面金屬化處理後之塑膠外 參=基體電鑛-第—_金屬層,該第—非鎳金屬層可為銅 席。電錢時所用電錢液可為硫酸銅或焦碟酸銅溶液,陽極 為銅金屬。該第一非鎳金屬層之厚度可在1〇〜5(^瓜之 其可通過調節電嫂之電流大小及電錄時間來加以控 —"將所述形成有第—非銻金屬層後之外殼基體進行第 3鈍化處理。為了防止第—非鎳金屬層之銅金屬在空氣 氧化形成黑色之敦化物而影響到後續之製程,對該第一 1錦金屬層之銅金屬需進行第—次鈍化保護處理,使銅金 9 200949022 屬表面形成一不活潑之氧化物保護膜。鈍化時所用鈍化溶 液可為鉻酸或鉻酸鹽。 磉 4 將所述純化後之外殼基體進行喷砂處理。喷砂處理在 噴石>'機内進行,該喷砂機包括一喷搶。所述喷砂機内裝 有石英砂與水之混合物,工作過程中該石英砂與水之混合 物被高壓氣體壓入喷砂機之喷槍内,經喷槍喷出後射向外 忒基體上,使該外殼基體上第一非鎳金屬層表面產生均勻 微細之凹點,從而產生磨砂效果及亞光效果。所述喷砂處 理後,第一非鎳金屬層表面上被石英砂粒擊中形成凹點之 部位之鈍化保護膜層被破壞。 所述喷砂處理完成後,對該外殼基體再進行第二次鈍 化處理。嘴妙處理後,外殼基體之第一非錄金屬層表面上 被石英砂粒擊中形成凹點之部位之鈍化保護膜層被破 壞,使外殼基體表面之電鍍銅金屬暴露於空氣中。為了防 止7金屬在空氣中氧化形成黑色之氧化物而影響到後續 ❾程,對該銅金屬進行第二次鈍化保護處理,使暴露於 空氣中之銅金屬表面形成一不活潑之氧化膜。鈍化時所用 純化溶液可為鉻酸或鉻酸鹽。 對所述經過第二次鈍化處理後之外殼基體進行活化 處理,以除去形成於外殼基體上之氧化膜。該活化處理之 方法為將所述外殼基體置於鹼性溶液,如氫氧化鈉溶液中 進行電解。 對所述活化處理後之外殼基體進行除石英砂處理,以 除去殘留於外殼基體表面之石英砂顆粒。所述除石英砂處 200949022 理方法可為將該外殼基體置於氫氟酸中浸潰一定時間,將 石英砂顆粒溶解而除去。 ; 所述外殼基體除石英砂處理完成後進行水洗清潔。 在清潔後之外殼基體上電鍍第二非鎳金屬層。該第二 非錦金屬層形成於具有磨砂及亞光效果之第一非鎳金屬 層上。該第二非錄金屬層可為纪金屬層或銅錫合金金屬 層’其厚度可在2〜8μιη之間。在該第二非鎳金屬層表面, 可再電鍍一表面裝飾層’如鉻金屬層,以滿足產品耐腐 ❹钱、耐磨性能及外觀之要求。該鉻金屬層之厚度可在〇1 〜2μιη之間。由於第一非鎳金屬層具有磨砂亞光效果,該 第二非錄金屬層及表面裝飾層形成於第一非鎳金屬層後 亦具有磨砂及亞光效果。 相較於習知技術,本發明較佳實施方式外殼之表面處 理方法既可使外殼表面形成磨砂及亞光之霧面效果,又可 使產品中不含對人體有害之鎳金屬,其產品更具有市場競 爭力。 〇 【圖式簡單說明】 無 【主要元件符號說明】 無 11200949022 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a surface treatment method for an outer casing, and more particularly to a surface treatment method for imparting a matt effect to the surface of the peripheral device. [Prior Art] % The plastic case of portable electronic devices such as mobile phones, digital cameras, personal digital assistants, and notebook computers is usually subjected to electro-mine treatment to make the surface of the casing have a metallic effect. As people's appearance quality requirements for decorative appearance parts β are getting higher and higher, the metal surface of high brightness and high hardness is no longer the main direction of people's pursuit, and more and more people are beginning to favor it. The metallic appearance of the light effect, such as the metal plating layer made by the fog nickel plating process, the surface of the plating layer is a damask-like matte surface, which on the one hand has an elegant appearance, on the other hand, the metal luster on the surface thereof is soft, It can reduce the reflection of light, and it is not easy to fatigue after the human eye is watching. However, the electroplated layer prepared by the fog nickel electroplating process contains nickel, which is a kind of unfriendly element of the human body, which makes the skin too sensitive and harmful to human health. Therefore, the nickel-containing product is difficult to be competitive in the market. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a surface treatment method which can make a light-emitting effect of a casing and is human-friendly. A surface treatment method for an outer casing, comprising the steps of: providing a casing base; plating a first non-nickel metal layer on the casing base; 7 200949022 blasting the first non-nickel metal layer to form a matt effect The second non-nickel metal layer is electrically bonded to the first non-nickel metal layer. Compared with the prior art, the surface treatment method of the outer casing of the invention can not only form a matt effect or a matte effect on the surface of the outer casing, but also can not contain nickel metal harmful to the human body in the product, and the product is more competitive in the market. . [Embodiment] The surface treatment method of the outer casing of the preferred embodiment of the present invention includes the following steps: A housing base is provided. The substrate may be a plastic casing, and the plastic may be selected from the group consisting of Acrylonitrile-Butadiene-Styrene (ABS) or Acrylonitrile-Butadiene-Benzene and Polycarbonate ( A mixture of Polycarbonate, PC). The substrate may also be a metal breakage such as a non-recorded steel, a titanium alloy, a town alloy or an alloy shell. When the outer casing base is a plastic casing, the outer casing base is subjected to surface metallization treatment to convert the surface of the outer casing base into an electrically conductive surface to facilitate subsequent electrical contacts. The metallization treatment of the surface of the outer casing base may be a physical method such as plating a metal layer on the surface of the substrate by vacuum coating, the metal layer being copper or other non-nickel metal layer. The surface metallization process can also be a chemical process such as depositing a metal layer on the outer shell substrate using a solution containing copper or other non-nickel metal. When the surface of the outer shell substrate is metallized by chemical method, the surface of the outer shell substrate is first etched to roughen the surface. This residual treatment can be achieved by etching the surface of the substrate using an etchant containing chromic acid, chrome-sulfur mixed acid or potassium permanganate, or by plasma processing or by oxidation. After etching, the outer shell substrate is neutralized by acid pickling or alkali washing, and then rinsed with water, and the shell substrate is further activated. In the activation section, the outer shell substrate is immersed in an activator solution containing (10), polyacrylic acid, and noble metal ions (e.g., ions) for a certain period of time. After the activation treatment, a precious metal such as palladium is deposited on the surface of the outer shell substrate. After the activation treatment, the outer shell substrate is placed in a copper-containing solution for immersion, and the copper metal bridge is deposited between the points of the metal, so that the surface of the outer shell substrate is completely covered with copper metal to form a conductive layer. . The plastic outer surface of the metal outer casing base or surface is metallized to the base metallization-first metal layer, and the first non-nickel metal layer may be a copper mat. The electro-money liquid used in the electric money may be copper sulfate or copper discoate solution, and the anode is copper metal. The thickness of the first non-nickel metal layer can be controlled from 1 〇 to 5 (which can be controlled by adjusting the current magnitude of the electric sputum and the recording time)-" after the formation of the first non-ruthenium metal layer The shell substrate is subjected to a third passivation treatment. In order to prevent the copper metal of the first non-nickel metal layer from being oxidized in the air to form a black dynasty, which affects the subsequent process, the copper metal of the first brocade metal layer needs to be subjected to the first The passivation protection treatment forms an inactive oxide protective film on the surface of copper gold 9 200949022. The passivation solution used in passivation can be chromic acid or chromate. 磉4 The purified outer shell substrate is sandblasted. The blasting process is carried out in a blasting machine, which includes a spray blasting machine. The blasting machine is provided with a mixture of quartz sand and water, and the mixture of quartz sand and water is pressed by high pressure gas during operation. In the spray gun of the sand blasting machine, after being sprayed out by the spray gun, it is shot on the outer base body, so that the surface of the first non-nickel metal layer on the outer shell of the outer shell produces uniform and fine pits, thereby producing a matte effect and a matt effect. After sandblasting The passivation protective film layer on the surface of the first non-nickel metal layer hit by the quartz sand particles to form a pit is destroyed. After the sandblasting process is completed, the shell substrate is subjected to a second passivation treatment. After that, the passivation protective film layer on the surface of the first non-recording metal layer of the outer casing base which is hit by the quartz sand particles to form the pits is destroyed, and the electroplated copper metal on the surface of the outer casing base is exposed to the air. In order to prevent the 7 metal from being in the air The oxidation of the black oxide forms a black oxide which affects the subsequent process, and the copper metal is subjected to a second passivation protection treatment to form an inactive oxide film on the surface of the copper metal exposed to the air. The purified solution used in the passivation may be Chromic acid or chromate. The shell substrate after the second passivation treatment is activated to remove the oxide film formed on the outer shell substrate. The activation treatment is performed by placing the outer shell substrate alkaline. Performing electrolysis in a solution such as sodium hydroxide solution. The activated shell substrate is subjected to quartz sand treatment to remove residual surface of the outer shell substrate. Quartz sand granules. The method of removing quartz sand at 200949022 may be that the outer shell substrate is immersed in hydrofluoric acid for a certain period of time, and the quartz sand granules are dissolved and removed. Performing a water washing cleaning. A second non-nickel metal layer is plated on the cleaned outer casing substrate. The second non-gold metal layer is formed on the first non-nickel metal layer having a matte and matte effect. The second non-recording metal layer The metal layer or the copper-tin alloy metal layer may have a thickness of between 2 and 8 μm. On the surface of the second non-nickel metal layer, a surface decorative layer such as a chrome metal layer may be electroplated to meet the corrosion resistance of the product. The thickness of the chrome metal layer may be between 〇1 and 2μιη. Since the first non-nickel metal layer has a matte matte effect, the second non-recording metal layer and the surface decorative layer Formed on the first non-nickel metal layer also has a matte and matt effect. Compared with the prior art, the surface treatment method of the outer casing of the preferred embodiment of the present invention can not only form a frosted surface and a matte matte surface effect, but also can prevent the product from containing nickel metal harmful to the human body, and the product thereof is more Competitive in the market. 〇 [Simple diagram description] None [Main component symbol description] None 11

Claims (1)

Translated fromChinese
200949022 十、申請專利範圍 1. 一種外殼之表面處理方法 提供一外殼基體; 其包括如下步驟: 在該外殼基體上電鍍第一非鎳金屬層; ^該第-_金制進行切處理使其形成亞光效 2. ❹ 3. 4.200949022 X. Patent application scope 1. A surface treatment method for an outer casing provides a casing base body; the method comprising the steps of: electroplating a first non-nickel metal layer on the outer casing base; ^ the first-gold system is cut to form Sub-light effect 2. ❹ 3. 4.5. 6. 在該第-非鎳金屬層上電鍍第二非鎳金屬層。 :申f專利範圍第1項所述之外殼之表;處理方 法’其中所述外殼基體為塑膠殼體。 如申請專利範圍第2項所述之外殼之表面處理方 法’其中所述外殼基體錢前使用真空鍵膜法在外殼 基體表面鍍覆一銅或非鎳金屬層。 如申請專利範圍第2項所述之外殼之表面處理方 法,其中所述外殼基體電鍍前使用化學方法在外殼基 體表面沉積一金屬層,該方法包括以下步驟:將該外 殼基體表面粗化;活化處理該外殼基體表面;在活化 後之外殼基體表面化學沉積銅或非鎳金屬層。 如申請專利範圍第1項所述之外殼之表面處理方 法’其中所述第一非鎳金屬層為銅金屬層。 如申請專利範圍第1項所述之外殼之表面處理方 法’其中所述第一非鎳金屬層在喷砂處理前進行鈍化 處理。 如申請專利範圍第1項所述之外殼之表面處理方 法’其中所述外殼基體喷砂後電鍍第二非鎳金屬層前 12 200949022 對該外殼基體分別推> ^ ^ 引進仃鈍化、活化及除殘留石英砂之 處理。 、 ;8.如申”月專利範圍第i項所述之外殼之表面處理方 • 法’其中所述第二非錦金屬層為把金屬層或銅踢合金 金屬層。 、 9.如申请專利範圍第8項所述之外殼之表面處理方 法,其中所述第二非錄金屬層上還電鑛有一鉻金屬表 面裝飾層。 Φ 10.如申請專利範圍第1項所述之外殼之表面處理方 法’其中所述外殼基體為金屬殼體,該金屬材料為不 錄鋼、欽合金、鎮合金或銘合金中之任一種。 φ 135. 6. Electroplating a second non-nickel metal layer on the first non-nickel metal layer. The table of the outer casing described in claim 1 of the patent application; the processing method wherein the outer casing base is a plastic casing. The surface treatment method of the outer casing as described in claim 2, wherein the outer casing base is coated with a copper or non-nickel metal layer on the surface of the outer casing base by a vacuum bonding method. The surface treatment method of the outer casing according to claim 2, wherein the outer shell substrate is chemically deposited on the surface of the outer shell substrate by a metal layer, the method comprising the steps of: roughening the surface of the outer shell substrate; The outer surface of the outer casing is treated; a copper or non-nickel metal layer is chemically deposited on the surface of the activated outer casing substrate. The surface treatment method of the outer casing as described in claim 1, wherein the first non-nickel metal layer is a copper metal layer. The surface treatment method of the outer casing as described in claim 1 wherein the first non-nickel metal layer is passivated prior to the blasting treatment. The surface treatment method of the outer casing according to claim 1, wherein the outer casing base is blasted and the second non-nickel metal layer is plated. 12 200949022 Pushing the outer casing base respectively ^ ^ ^ Introduction of passivation, activation and In addition to the treatment of residual quartz sand. 8. The surface treatment method of the outer casing described in item i of the patent scope of the application of the invention is as follows: wherein the second non-metal layer is a metal layer or a copper alloy metal layer. The surface treatment method of the outer casing according to the item 8, wherein the second non-recording metal layer further comprises a chrome metal surface decorative layer on the second non-recording metal layer. Φ 10. The surface treatment of the outer casing as described in claim 1 The method [wherein the outer casing base is a metal casing, and the metal material is any one of no steel, alloy, alloy or alloy. φ 13
TW097120037A2008-05-302008-05-30Surface treating method for housingTWI369420B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
TWI448586B (en)*2011-12-202014-08-11Apple IncMetal surface and process for treating a metal surface
US9663869B2 (en)2011-08-182017-05-30Apple Inc.Anodization and plating surface treatments

Cited By (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US9663869B2 (en)2011-08-182017-05-30Apple Inc.Anodization and plating surface treatments
TWI448586B (en)*2011-12-202014-08-11Apple IncMetal surface and process for treating a metal surface
US9683305B2 (en)2011-12-202017-06-20Apple Inc.Metal surface and process for treating a metal surface

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