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TW200635493A - Spray cooling module for electronic device - Google Patents

Spray cooling module for electronic device

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Publication number
TW200635493A
TW200635493ATW094110220ATW94110220ATW200635493ATW 200635493 ATW200635493 ATW 200635493ATW 094110220 ATW094110220 ATW 094110220ATW 94110220 ATW94110220 ATW 94110220ATW 200635493 ATW200635493 ATW 200635493A
Authority
TW
Taiwan
Prior art keywords
spray
electronic device
cooling
sprayer
cooling module
Prior art date
Application number
TW094110220A
Other languages
Chinese (zh)
Other versions
TWI259053B (en
Inventor
Chin-Min Hsiung
Chin-Horng Wang
Chiung-I Lee
Szu-Wei Tang
Hui-Chuan Lu
Sway Chuang
Hui Chi Su
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res InstfiledCriticalInd Tech Res Inst
Priority to TW94110220ApriorityCriticalpatent/TWI259053B/en
Application grantedgrantedCritical
Publication of TWI259053BpublicationCriticalpatent/TWI259053B/en
Publication of TW200635493ApublicationCriticalpatent/TW200635493A/en

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Abstract

A spray cooling module for electronic devices with fluid spray cooling is provided. The spray cooling module includes a sprayer and a spray chamber. The sprayer has at least an actuator integrating a piezoelectric plate and a nozzle structure. A top surface of the sprayer is provided with at least an inlet for receiving cooling fluid. A bottom of the spray chamber contacts with a heating surface of the electronic device. The cooling fluid passes through the actuator to generate spray of the cooling fluid. The spray impinges upon the bottom of the spray chamber. The heat dissipated from the electronic device is rapidly carried away by change of the latent heat upon the cooling fluid is vaporized.
TW94110220A2005-03-312005-03-31Spray cooling module for electronic deviceTWI259053B (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
TW94110220ATWI259053B (en)2005-03-312005-03-31Spray cooling module for electronic device

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
TW94110220ATWI259053B (en)2005-03-312005-03-31Spray cooling module for electronic device

Publications (2)

Publication NumberPublication Date
TWI259053B TWI259053B (en)2006-07-21
TW200635493Atrue TW200635493A (en)2006-10-01

Family

ID=37765474

Family Applications (1)

Application NumberTitlePriority DateFiling Date
TW94110220ATWI259053B (en)2005-03-312005-03-31Spray cooling module for electronic device

Country Status (1)

CountryLink
TW (1)TWI259053B (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN105960145A (en)*2016-06-082016-09-21上海理工大学Enclosed spray cooling device with adjustable dip angle
US11432433B2 (en)2019-12-062022-08-30Frore Systems Inc.Centrally anchored MEMS-based active cooling systems
US11456234B2 (en)2018-08-102022-09-27Frore Systems Inc.Chamber architecture for cooling devices
US11503742B2 (en)2019-12-062022-11-15Frore Systems Inc.Engineered actuators usable in MEMS active cooling devices
US11765863B2 (en)2020-10-022023-09-19Frore Systems Inc.Active heat sink
US11796262B2 (en)2019-12-062023-10-24Frore Systems Inc.Top chamber cavities for center-pinned actuators
US11802554B2 (en)2019-10-302023-10-31Frore Systems Inc.MEMS-based airflow system having a vibrating fan element arrangement
US12029005B2 (en)2019-12-172024-07-02Frore Systems Inc.MEMS-based cooling systems for closed and open devices
US12033917B2 (en)2019-12-172024-07-09Frore Systems Inc.Airflow control in active cooling systems
US12089374B2 (en)2018-08-102024-09-10Frore Systems Inc.MEMS-based active cooling systems
US12193192B2 (en)2019-12-062025-01-07Frore Systems Inc.Cavities for center-pinned actuator cooling systems

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
TWI485006B (en)*2010-10-142015-05-21Microjet Technology Co LtdSingle-hole nozzle device
TWI413752B (en)*2011-07-192013-11-01Univ Nat Taiwan Science Tech Waste heat power generation module
CN108418545B (en)*2018-04-282024-12-06华南理工大学 A micro jet cooling plate with porous heat transfer surface and a manufacturing method thereof
CN109219326A (en)*2018-11-162019-01-15广东工业大学A kind of spraying radiator
TWI747076B (en)*2019-11-082021-11-21研能科技股份有限公司Heat dissipating component for mobile device
CN111511164B (en)*2020-03-302023-05-05西南电子技术研究所（中国电子科技集团公司第十研究所）Spray cooling phase-change heat sink integrated evaporative cooling device

Cited By (24)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN105960145A (en)*2016-06-082016-09-21上海理工大学Enclosed spray cooling device with adjustable dip angle
US11735496B2 (en)2018-08-102023-08-22Frore Systems Inc.Piezoelectric MEMS-based active cooling for heat dissipation in compute devices
US12089374B2 (en)2018-08-102024-09-10Frore Systems Inc.MEMS-based active cooling systems
US11456234B2 (en)2018-08-102022-09-27Frore Systems Inc.Chamber architecture for cooling devices
US11830789B2 (en)2018-08-102023-11-28Frore Systems Inc.Mobile phone and other compute device cooling architecture
US11784109B2 (en)2018-08-102023-10-10Frore Systems Inc.Method and system for driving piezoelectric MEMS-based active cooling devices
US11705382B2 (en)2018-08-102023-07-18Frore Systems Inc.Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices
US11710678B2 (en)2018-08-102023-07-25Frore Systems Inc.Combined architecture for cooling devices
US11802554B2 (en)2019-10-302023-10-31Frore Systems Inc.MEMS-based airflow system having a vibrating fan element arrangement
US11796262B2 (en)2019-12-062023-10-24Frore Systems Inc.Top chamber cavities for center-pinned actuators
US12137540B2 (en)2019-12-062024-11-05Frore Systems Inc.Centrally anchored MEMS-based active cooling systems
TWI786465B (en)*2019-12-062022-12-11美商弗瑞歐系統有限公司Centrally anchored mems-based active cooling systems
US11510341B2 (en)2019-12-062022-11-22Frore Systems Inc.Engineered actuators usable in MEMs active cooling devices
US11503742B2 (en)2019-12-062022-11-15Frore Systems Inc.Engineered actuators usable in MEMS active cooling devices
US11464140B2 (en)2019-12-062022-10-04Frore Systems Inc.Centrally anchored MEMS-based active cooling systems
US12320595B2 (en)2019-12-062025-06-03Frore Systems Inc.Top chamber cavities for center-pinned actuators
US12274035B2 (en)2019-12-062025-04-08Frore Systems Inc.Engineered actuators usable in MEMs active cooling devices
US11432433B2 (en)2019-12-062022-08-30Frore Systems Inc.Centrally anchored MEMS-based active cooling systems
TWI856425B (en)*2019-12-062024-09-21美商弗瑞歐系統有限公司Centrally anchored mems-based active cooling systems
US12193192B2 (en)2019-12-062025-01-07Frore Systems Inc.Cavities for center-pinned actuator cooling systems
US12033917B2 (en)2019-12-172024-07-09Frore Systems Inc.Airflow control in active cooling systems
US12029005B2 (en)2019-12-172024-07-02Frore Systems Inc.MEMS-based cooling systems for closed and open devices
US12167574B2 (en)2020-10-022024-12-10Frore Systems Inc.Active heat sink
US11765863B2 (en)2020-10-022023-09-19Frore Systems Inc.Active heat sink

Also Published As

Publication numberPublication date
TWI259053B (en)2006-07-21

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Legal Events

DateCodeTitleDescription
MM4AAnnulment or lapse of patent due to non-payment of fees
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