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TW200632334A - Coplanar test board - Google Patents

Coplanar test board

Info

Publication number
TW200632334A
TW200632334ATW094107167ATW94107167ATW200632334ATW 200632334 ATW200632334 ATW 200632334ATW 094107167 ATW094107167 ATW 094107167ATW 94107167 ATW94107167 ATW 94107167ATW 200632334 ATW200632334 ATW 200632334A
Authority
TW
Taiwan
Prior art keywords
dut
substrate
testing pads
high frequency
coplanar
Prior art date
Application number
TW094107167A
Other languages
Chinese (zh)
Other versions
TWI260416B (en
Inventor
Hung-Hsiang Cheng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor EngfiledCriticalAdvanced Semiconductor Eng
Priority to TW94107167ApriorityCriticalpatent/TWI260416B/en
Application grantedgrantedCritical
Publication of TWI260416BpublicationCriticalpatent/TWI260416B/en
Publication of TW200632334ApublicationCriticalpatent/TW200632334A/en

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Abstract

A coplanar test board includes a substrate, a plurality of testing pads, and a plurality of conductors. The testing pads are disposed on a first surface of the substrate. Each testing pads has a plane for a coplanar contact of a high frequency probe. The conductors are disposed on a second surface of the substrate and electrically connected to the corresponding testing pads through a plurality of vias of the substrate. Each conductor has a concave surface to contact a plurality of spherical electrodes of a DUT (Device Under Test). In order to test the DUT, the concave surfaces of the conductors contact the spherical electrodes of the DUT. A high frequency probe can test the DUT though the testing pads. Accordingly, the coplanar test board can prevent the damage of the DUT made by the high frequency probe and reduce contamination of the high frequency probe and it could be used repeatedly.
TW94107167A2005-03-092005-03-09Coplanar test boardTWI260416B (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
TW94107167ATWI260416B (en)2005-03-092005-03-09Coplanar test board

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
TW94107167ATWI260416B (en)2005-03-092005-03-09Coplanar test board

Publications (2)

Publication NumberPublication Date
TWI260416B TWI260416B (en)2006-08-21
TW200632334Atrue TW200632334A (en)2006-09-16

Family

ID=37874752

Family Applications (1)

Application NumberTitlePriority DateFiling Date
TW94107167ATWI260416B (en)2005-03-092005-03-09Coplanar test board

Country Status (1)

CountryLink
TW (1)TWI260416B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
TWI453425B (en)*2012-09-072014-09-21Mjc Probe IncApparatus for probing die electricity and method for forming the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
TWI453425B (en)*2012-09-072014-09-21Mjc Probe IncApparatus for probing die electricity and method for forming the same

Also Published As

Publication numberPublication date
TWI260416B (en)2006-08-21

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Legal Events

DateCodeTitleDescription
MM4AAnnulment or lapse of patent due to non-payment of fees

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