200409153 五、發明說明（1) 一、【發明 本發明 導體封裝體 且防止在高 關於一種帶 體封裝體及 路和電源分 看電源分配 波，而且防 所屬之技術領域】 係有關於一種括你 所設置之電源上：當經由在印刷電路基板或半 速數位電路制漁漏之電磁波，而 狀線路型元件、使：m化；尤其係有 電路侧之特性阻抗低阻抗化，抑制 止在尚速數位電路激發之信號波形之劣化電 一、【先前技術】 一近年來，如手機所代表般，電子機器之小型化 =到強烈之要求。這些要求例如在切換式電源或數：： 號處理電路元件著使時鐘信號高速化達成，但是隨著。 路尤其電源電路之咼頻電流增大，電磁轄射之增大=上 號品質之降低變得顯著。因而，對於電源解耦合用之5_'仏 件&咼性能之要求愈來愈嚴苛。 - 向性能數位機器因高速動作之高速電路和 :、電路混合存在’向電源分配電路戌漏之電磁波之* 最近分布於自數百kHz至數十GHz之很寬之頻帶。又，$增 =基板裝載之比較大型之半導體積體電路之直流電源， 變成超過數十安培之大的位準。此外，電源分配 ^ 1所+ . - 格"如圖 w不’包含電源電路；及電源分配配線，供給 白啼》、江 〜w電路 曰电源電路所供給之電源。200409153 V. Description of the invention (1) 1. [Invent the conductor package of the present invention and prevent the power distribution wave from being viewed on a tape package, a circuit, and a power source, and prevent the technical field to which it belongs] On the set power supply: when the electromagnetic wave is leaked through the printed circuit board or the half-speed digital circuit, the line-shaped component is made into m; especially the characteristic impedance of the circuit side is lowered to suppress the current. Deterioration of the signal waveform excited by the fast digital circuit. [Previous technology] In recent years, as represented by mobile phones, the miniaturization of electronic equipment = to a strong demand. These requirements are achieved, for example, in switching power supplies or digital :: No. processing circuit elements to achieve high-speed clock signals, but with. In particular, the high-frequency current of the power supply circuit increases, and the increase of electromagnetic radiation = a decrease in the quality of the upper level becomes significant. Therefore, the requirements for 5_'s & 咼 performance for power supply decoupling are becoming more and more severe. -There are mixed high-speed circuits and high-speed circuits for high-performance digital devices. The electromagnetic waves leaked to the power distribution circuit * have recently been distributed in a wide frequency band from hundreds of kHz to tens of GHz. In addition, $ increasing = the DC power supply of a relatively large semiconductor integrated circuit mounted on a substrate becomes a level exceeding tens of amps. In addition, the power distribution ^ 1 + +-grid " as shown in Figure w does not include a power circuit; and power distribution wiring to supply Bai cry, Jiang ~ w circuit is the power supplied by the power circuit.
第6頁 200409153 五、發明說明（2) 浅漏之電磁波經由電源分配配線' '~ 電路傳播，對於自電源電路供給電源之ς他之電路向電源 電路板之電源分配配線附近一般因配'，路W起故障。在 漏之電磁波容易和多條信號配線轉人。=條信號配線，洩 令信號品質劣化，而且信號配線變I;，合之洩漏電磁波 之外部信號電纜傳播。然後，外部 3 ’員電流向數位機器 用，向空中放射高位準之不要之^ ^ ^電纜發揮天線之功 此外，在電源分配配線傳播之洩漏 過電源電路後，向商用交流電源線傳播，磁波之一部分通 發揮天線之功用，向空中放射高位準之’商用交流電源線 而，在電源分配配線傳播之洩漏電磁之電磁波。 之中途重複反射下前進，其一部分也傳 2源分配配線 信號波形劣化。 ’至信號配線，令 解決如上述之問題之根本對策如圖】 示電路之動作（例如切換式元件之切換’、’係使得因 波不向電源分配配線洩漏。因而，需要生之電磁 電路看電源分配電路時對於高頻之阻抗在電^ = 2 個頻帶很低。 $ 若自電晶體看之電源分配電路之阻抗係無限的 之值，電晶體所激發之電磁波不會在電源分配配線之入: 反射後侵入電源为配電路。 ' 為了使電，分配配線之阻抗變小，至目前為止使用的 係電容器。電容器作為在電氣•電子機器使用之元件之歷 史久，至目前為止各種形式的實用化。現在，開發將蒸&Page 6 200309153 V. Description of the invention (2) Shallow electromagnetic waves propagate through the power distribution wiring '~~ Circuits are generally distributed near the power distribution wiring of the power supply circuit board for the circuits that supply power from the power circuit to other circuits', Road W is malfunctioning. The leaked electromagnetic waves are easily transferred to multiple signal wiring. = Signal wiring, leakage degrades the signal quality, and the signal wiring becomes I; together, the external signal cable that leaks electromagnetic waves propagates. Then, the external 3 ′ electric current is used to digital equipment, which emits a high level to the air. ^ ^ ^ The cable exerts the function of the antenna. In addition, after the power transmission wiring leaks through the power circuit, it is propagated to the commercial AC power line. One part is to use the function of an antenna to radiate high-level 'commercial AC power lines' into the air, and leak electromagnetic waves that propagate through the power distribution wiring. Repeatedly reflected forward halfway, and a part of it also passed through the two source distribution wiring. The signal waveform deteriorated. 'To the signal wiring, the fundamental countermeasures to solve the above-mentioned problems are shown in the figure.' The operation of the circuit (such as the switching of switching elements), 'is to prevent the wiring from leaking to the power distribution wiring due to the wave. When the power distribution circuit is high-frequency, the impedance is very low in the electric band = 2. $ If the impedance of the power distribution circuit seen from the transistor is infinite, the electromagnetic waves excited by the transistor will not be in the power distribution wiring. In: Reflection into the power supply is a distribution circuit. 'In order to reduce the impedance of the distribution wiring, capacitors have been used so far. Capacitors have a long history as components used in electrical and electronic equipment. Practical. Now, development will steam &
第7頁 Μ 200409153 五、發明說明（3) 在構膜之陶竟材料疊層多層之構造之陶甍電容器，或 陽極、以直氧化皮用之金屬之多孔質形成體為 雷解w —八 皮膜為電介質體、以導電性高分子為固態 電解質之固態電解電容器等。 有作i;‘！電解電容器·^，已知在電介質體氧化皮臈上具 …力悲電解質之聚氮茂或其烷基置換體之固態電解電 成二:如^參照專利文獻1)或者在電介質體氧化皮膜上形 IΜ二，悲電解質之聚苯胺之固態電解電容器（例如參照 屮以义献。在24些電容器，因在固態電解質使用導電率 ，的咼2位數以上之導電性高分子，等價串聯電阻 電容值相同的也在至比以#高2位數以上 域為止具有效果。 可疋，坆些電容器因成為用以實現電荷之充放電功能 Μ 子構造，在超過10MHZ之高頻區域端子間之阻抗激 曰，不適於數位電路之電源分配電路用。因而，開發將多 j】，之$層陶瓷電容器晶片並聯之電容器陣列或疊層型 貫通電容器，但是在超過10MHZ之高頻區域難令高效率的 降低阻抗值。 而，為了應付向頻化，也檢討濾波器之構造，例如提 Ϊ由利用陶究電介質片夾住之蛇行導體及接地導體構成之 表面安裝型雜訊濾波器（例如參照專利文獻3)。圖2係表示 由陶瓷電介質片所夾住之蛇行導體及接地導體構成之該表 面女t型雜說濾波器之構造之剖面圖。 如圖2所示，以往之表面安裝型雜訊濾波器具有將第Page 7M 200409153 V. Description of the invention (3) Ceramic capacitors with multilayer structures of ceramic materials laminated on the film, or anodes, porous bodies made of metal for direct oxide scale, are the solution of the w-eight The film is a dielectric body, a solid electrolytic capacitor using a conductive polymer as a solid electrolyte, and the like. Contributing i; ’! Electrolytic capacitors. It is known that solid electrolytic electrolytes of polynitrogen or its alkyl substitution body of Lithium Electrolyte on the dielectric oxide scale: such as ^ refer to Patent Document 1) or on the dielectric oxide film. Polyimide solid electrolytic capacitors in the shape of IM. (For example, see Yi Yi Xian. In 24 capacitors, because of the use of conductive polymers in solid electrolytes, conductive polymers with a digit of two or more digits, equivalent series resistance. The same capacitance value also has an effect up to 2 digits higher than #. However, some capacitors have a sub-structure that is used to realize the charge and discharge function of electric charge. Impedance excitation is not suitable for the power distribution circuit of digital circuits. Therefore, the development of capacitor arrays or multilayer through-capacitors in which multi-layer ceramic capacitor chips are connected in parallel, but it is difficult to make it higher in high-frequency areas exceeding 10MHZ Reduce the impedance value of efficiency. In addition, in order to cope with the frequency, we also review the structure of the filter, such as the meandering conductor and the grounding conductor sandwiched by the ceramic dielectric sheet. A surface-mounted noise filter (see, for example, Patent Document 3). FIG. 2 is a cross-sectional view showing a structure of the surface female t-type noise filter composed of a meandering conductor and a ground conductor sandwiched by a ceramic dielectric sheet. As shown in Figure 2, the conventional surface-mounted noise filter has a
200409153 五、發明說明（4) 一電介質片110、第二電介質片12〇及第三電介質片13〇疊 層之構造’在第一電介質片11〇和第二電介質片12〇之界面 配置用於信號傳達之第一内部導體1U、蛇行導體115及第 二内部導體112 ’在第二電介質片12〇和第三電介質片13〇 之界面形成接地導體1 2 5，使得和蛇行導體11 5相向。 第一内部導體111之一端和第一信號用電極丨51連接， 第二内部導體112之一端和第二信號用電極152連接，在第 一内部導體111及第二内部導體112雙方之另一端之間連接 蛇行導體11 5。藉著照這樣構成，可得到高頻之雜訊吸收 特性比以往之由電感元件和電容元件組成之雜訊濾波器的 優異之雜訊濾波器。 而，在這種表面安裝型雜訊濾波器，將自例如第一信 號用電極1 5 1之一方之電極輸入之電氣信號濾波後，向另 一方（第二信號用電極1 5 2)輸出該濾波後之電氣信號。可 是’在本表面安裝型雜訊濾波器，分布常數性的形成之電 容利用接地導體125、蛇行導體115及在兩者之間疊層之電 介質片構成，因只用該分布電容在超過1〇MHz之高頻區域 難令阻抗值南效率的降低’精著將内部導體之一部分作為 蛇行導體’將電容和串聯電感組合，提高信號衰減效果。 又’為了使自電晶體等切換式元件看之電源分配電路 之阻抗無限的接近零’公開將電源分配電路設為低阻抗線 路之技術（例如參照專利文獻4 )’或利用固態電解電容哭 製造技術形成低阻抗線路之技術（例如參照專利文獻5): 在專利文獻4所公開之多層印刷電路基板具有以下之200409153 V. Description of the invention (4) A stacked structure of a dielectric sheet 110, a second dielectric sheet 120, and a third dielectric sheet 130. The configuration of the interface between the first dielectric sheet 110 and the second dielectric sheet 120 is used for The first internal conductor 1U, the meandering conductor 115, and the second inner conductor 112 'for signal transmission form a grounding conductor 125 at the interface between the second dielectric sheet 120 and the third dielectric sheet 130, so as to face the meandering conductor 115. One end of the first internal conductor 111 is connected to the first signal electrode 51, one end of the second internal conductor 112 is connected to the second signal electrode 152, and the other end of the first internal conductor 111 and the second internal conductor 112 is Between connection snake line conductor 11 5. By constituting in this way, it is possible to obtain a noise filter having a high frequency noise absorption characteristic superior to a conventional noise filter composed of an inductive element and a capacitive element. In this surface-mounted noise filter, an electric signal input from, for example, one of the first signal electrodes 1 51 is filtered, and then output to the other (second signal electrode 15 2). Filtered electrical signals. However, the surface-mounted noise filter has a distributed constant capacitance formed by the ground conductor 125, the meandering conductor 115, and a dielectric sheet laminated therebetween. In the high-frequency region of MHz, it is difficult to reduce the efficiency of the impedance. "Finely use a part of the internal conductor as a meandering conductor." Combine capacitors and series inductors to improve the signal attenuation effect. In addition, "in order to make the impedance of the power distribution circuit viewed from switching elements such as transistors infinitely close to zero," a technology for setting the power distribution circuit to a low impedance circuit (for example, refer to Patent Document 4) is disclosed, or it is manufactured using a solid electrolytic capacitor. Technology for forming a low-impedance line (for example, refer to Patent Document 5): The multilayer printed circuit board disclosed in Patent Document 4 has the following
第9頁 200409153 五、發明說明（5) 構造。 其特徵為，在設置了電源配線之電源層之上下兩側分 別經由第一絕緣材層將接地層疊層，再在其上下之一側戒 兩侧經由第二絕緣材層將設置了信號配線之信號層疊層而 成。藉著採用這種構造，對於在多層印刷電路基板裝載之 半導體1C或LSI等電路元件，在和個別的設置了低阻抗之 獨立電源之情況一樣之狀態，可供給直流電源，而且使得 可抑制來自電子機器之電磁輻射，不會妨礙在印刷電路基 板裝載之1C、LSI等電路元件之高速、高頻之動作。 # ^ ’在專利文獻5所公開之傳送線路型元件，在構造 上f著經由高電介質常數絕緣材料將由直徑比内部導體粗 =導電性材料構成之圓筒形之外部導體配備成同軸形，使 得^覆由V電性材料構成之内部導體之表面上，形成特性 :二，低之同轴線路。藉著將其在印刷電路基板之電源供 二、，U S I等南速•高頻電路元件之電源埠之間串聯的插 個％ ί =印刷電路基板所裝載之各高速·高頻電路元件 直漭雷二了低阻抗之獨立電源之情況一樣之狀態可供給 作5產Γ二，且對於自高速·高頻電路元件因高速切換動 向頻電權，令在傳送線路型元件内部產生 纜之高頻電源電i之流^供應線往裝置内之電源供應電 [專利文獻1] 寺△平4 56445唬公報（特開昭60-37114號公報）Page 9 200409153 V. Description of the invention (5) Structure. It is characterized in that the upper and lower sides of the power supply layer on which the power wiring is provided are respectively laminated with the ground through the first insulating material layer, and the signal wiring is provided on the upper and lower sides or on both sides with the second insulating material layer. The signal is laminated. By adopting this structure, it is possible to supply DC power to circuit components such as semiconductor 1C or LSI mounted on a multilayer printed circuit board in the same state as when a separate low-impedance independent power supply is provided, and to suppress The electromagnetic radiation of electronic equipment will not hinder the high-speed and high-frequency operation of circuit components such as 1C and LSI mounted on printed circuit boards. # ^ 'The transmission line-type element disclosed in Patent Document 5 has a structure in which a cylindrical outer conductor made of a thicker diameter than an inner conductor = a conductive material is provided through a high-dielectric constant insulating material to be coaxial, so that ^ Cover the surface of the inner conductor made of V electrical material, forming characteristics: two, low coaxial lines. By inserting it in series between the power supply port of the printed circuit board and the power supply ports of the South-speed and high-frequency circuit components such as USI,% ί = each high-speed and high-frequency circuit component mounted on the printed circuit board is straight Lei Er can provide low-impedance independent power supply in the same state. It can be supplied as 5 Γ, and for high-speed and high-frequency circuit components due to high-speed switching of the frequency power, so that high-frequency cables are generated in the transmission line type components Current of power supply i ^ Supply line supplies power to the power supply in the device [Patent Document 1] Tera-Ping 4 56445 Bulletin (Japanese Patent Laid-Open No. 60-37114)
200409153 五、發明說明（6)[專利文獻2]特開平3-355 1 6號公報 [專利文獻3] 特開平6-53046號公報 [專利文獻4 ]特開平200 1 -53449號公報 [專利文獻5 ]特開平2002-335 1 07號公報200409153 V. Description of the invention (6) [Patent Document 2] Japanese Patent Application Laid-Open No. 3-355 1 [Patent Literature 3] Japanese Patent Application Laid-Open No. 6-53046 [Patent Literature 4] Japanese Patent Application Laid-Open No. 200 1-53449 [Patent Literature 5] JP 2002-335 1 07
【發明内容】 發明欲解決之課顳 多 作 質 等 途 路 構 這 之 點 如上 層之構 用之金 體、以 ，作為 ，但是 型元件 造’在 因而 種功能 特性， 述所示， 造之陶瓷 屬之多孔 導電性高 至局頻區 未考慮由 構成，因 超過10MH ，在超過 之電容器 即無法使 開發將蒸鍍了金屬薄膜之陶瓷材料叠層 電容器，或在構造上以钽或鋁等具有 貝形成體為陽極、以其氧化皮膜為電八 分子為固態電解質之固態電解電容器；1 域為止可使用之電容器，用於各種： 電磁波傳送之觀點將這此雷 口早與招φ ^ 一电谷裔作為線 二κ現電何之充放電之功 γ z之尚頻區域阻抗激增。 知子 數百MHz之時鐘頻率^ ，具有無法實現在信號作，只要使用 在高頻之電源之内部=^生電路所設想 抗充分小之問題 又，為了濾除 雜訊也開發表面安裝 之濾波器，但是[Summary of the Invention] The point that the invention is intended to solve is that the temporal structure is more qualitative, and the path structure is the same as the upper layer of the gold body, with, as, but the type element is made of this kind of functional characteristics. Ceramics are not considered to have a composition with a porous conductivity as high as the local frequency region. Because the capacitors exceed 10MH, it is impossible to develop capacitors with a ceramic film laminated with a metal thin film if the capacitors exceed 10MH, or tantalum or aluminum is used in the structure. A solid electrolytic capacitor having a shell body as an anode and an oxide film as a solid electrolyte as a solid electrolyte; capacitors that can be used up to 1 domain for various purposes: The view of electromagnetic wave transmission has made this thunderbolt as early as possible. ^ ^ As a result of the electric current charging and discharging of line κ, the electric valley γ has a sharp increase in impedance in the frequency region. The clock frequency of hundreds of MHz is not realizable. As long as it is used inside a high-frequency power source, the problem of sufficiently low resistance as envisaged by the circuit is also developed. In order to filter out noise, surface-mounted filters have also been developed. ,but
2|)0409153 五、發明說明（7) 因難使阻抗值充分小，具有在替代電容器之使用上受到限 制，或者尤其在100MHz以上之高頻區域，具有難實現低阻 抗之問題點。 、 本發明鑑於上述之問題點，其主要目的在於提供雜訊 濾、波器之旁通元件、或用作解耦合元件之適於高速化、高 頻化之帶狀線路型元件、和該帶狀線路型元件一體化之 刷電路基板及半導體封裝體。 為達 特徵為具 金屬 電介 及導 具有閥作 申請 發明，其 具有 電性物質 在該 部分別設 線路輪入 申請 項之發明 成上述之 有·· ’具有表 質體皮膜 電性物質 用之金屬 專利範圍 中： 金屬構件 層接觸； 具有閥作 置輪出入 高頻電磁 專利範圍 ’其中， 1决課題之方式 目的’申請專利範圍第1項之發明，其 面積擴大之閥作用； ’在該具有闊作用之金屬之表面形成； 層，隔著該電介質體皮膜形成為包圍該 之周圍。 第2項之發明係在申請專利範圍第丨項之 ，輪送輸入之直流電力，配置成和該導 用之金屬之兩端部和該金屬構件之兩端 端子，向由該電介質體皮臈構成之傳送 波。 第3項之發明係在申請專利範圍 或2 該具有閥作用之金屬之剖面之形狀係矩 麵 第12頁 2004091532 |) 0409153 V. Description of the invention (7) Because it is difficult to make the impedance value sufficiently small, it has restrictions on the use of alternative capacitors, or it has a problem that it is difficult to achieve low impedance especially in high frequency regions above 100MHz. In view of the above problems, the present invention mainly aims to provide a noise filter, a bypass element of a wave filter, or a strip line type element suitable for high-speed and high-frequency use as a decoupling element, and the band. Brush circuit substrate and semiconductor package with integrated circuit-shaped components. In order to achieve the characteristics of the invention with a metal dielectric and a conductive valve, the invention has an electrical substance, and the invention of the line rotation application item in this department has become the above-mentioned "... In the scope of metal patents: the contact of metal component layers; having a valve for placing wheels in and out of high-frequency electromagnetic patents. Among them, the purpose of the method of determining the subject is to apply for the invention in the first scope of the patent, which has the function of expanding the area; A surface of a metal having a wide effect is formed; a layer is formed so as to surround the periphery through the dielectric body film. The invention of item 2 is the item 丨 in the scope of the patent application. The input DC power is configured to be connected to both ends of the conductive metal and both ends of the metal member to the dielectric body. Constituted transmission wave. The invention of item 3 is within the scope of the patent application or 2 The shape of the cross section of the valve-acting metal is a moment. Page 12 200409153
申請專利範圍第4項之發明係在申請專利範園楚9 形其該具有閥作用之金屬之剖面之形丄 申請專 項之發明， 申請專 項之發明， 箔。 申請專 項之發明， 主面朝同一 申請專 項之發明， 比橫寬尺寸 申請專 項之發明， 端部設置用 出端子，在 基板之通孔 申請專 之發明，其 之面積比該 積大。 利範圍第5項之發明係在申請專利範圍第1或2 該具有閥作用之金屬之剖面之形狀係環形。 利範圍第6項之發明係在申請專利範圍第丨或2 其中’將該具有閥作用之金屬形成為平板或 利範圍 其中， 方向屈 利範圍 其中， 大。 利範圍 其中， 以連接 該金屬 之一對 利範圍 中，該 電極引 第7項之發明係在申晴專利範圍第1或2 该具有閥作用之金屬在其兩端部附近自 曲或彎曲。 第8項之發明係在申請專利範圍第1或2 該具有閥作用之金屬之剖面之長度尺寸 ^ 9#項@之發明係在申請專利範圍第1或2 ΐ =有閥作用之金屬之長度方向之兩 構件=板之通孔之一對第-電極引 置用以連接印刷電路 第1 0項之發明係在申妹直 電極引出^ 專利範圍第9項 出端子之4印刷電路基板接觸 和该印刷電路基板不接觸之面 200409153 五、發明說明（9) _ 申請專利範圍第11項之發明係在申請專 之發明，其中： 月寸〜靶固弟2項 访嫌第一電極引出端子，和被載置於該金屬構件卜 該▼狀線路型元件之該具有閥作用之金屬之端 上之 該印刷電路基板相電性連接； 接’和 在該金屬構件一體形成和印刷雷其 電極引出端子； 卩^路基板相連接之第二 2該金屬構件一體形成之該第二電 该具有閥作用之金屬之兩端部所連接之該子和在 子形成帶狀線路型元件之4端子。 ^ 電極引出端 申請專利範圍第12項之發明係 之發明，其中·· 你Τ明寻刊靶圍第1 1項 該第一電極引出端子具有 $接用構件’和被載置於該 型疋件之該具有閥作用 =上^该▼狀線路 :刷電路基板上之配線相連：相；；：：體：；件’和該 連接用構件和該腳構件； 4體構件，連接該 件伟ί:第：機體構件連接之該連接用構件和兮第 -：ίί::體構件在長度方向之兩端部，-備腳構 機件大致垂直的連接之形狀； ”傷對於該第 iii構件—體形成之該第二電極引出端； 件，二；f體構件，和該金屬構件直接連接.具有 ;印：電路基板上之配線相連接弟二腳構 …機體構件係載置該帶狀線路 丨卞 < 該金屬構 第14頁 200409153 五、發明說明（10) 件之載置面在長度方向 側之端部連接； 該第二腳構件和該 致平行。 申請專利範圍第j 3 之發明，其中： 該第一電極引出端 一連接用構件，和被 型兀件之該具有閥作用 第一腳構件，和該 苐一機體構件，連接該 在該第一機體構件 件係該第一機體構 -機體構件大致 機體構件之相反側之面 在該金屬構件一體 該帶狀線路型元件之該 端部，在該載置面之同 連接成對於該载置面大 申晴專利範圍第1 4 之發明，其中： 該第一電極引出端 連接用構件，和被 型元件之該具有閥作用 之兩端部’和該载置面之同一長邊 機體構件連接’使得和該載置面大 項之發明係在申請專利範圍第丨丨項 子具有 載置於該金屬構件上之該帶狀線路 之金屬相連接； 印刷電路基板上之配線相連接；及 連接用構件和該腳構件； 連接之該連接用構件和該第一腳構 長度方向之兩端部，具備對於該第 連接之形狀，使得彼此成為該第一 形成之該第二電極引出端子係載置 金屬構件之載置面在長度方向之兩 一長邊侧之端部具有第二腳構件， 致平行。 項之發明係在申請專利範圍第丨丨項 子具有 載置於該金屬構件上之該帶狀線路 之金屬相連接；及第一機體構件，The invention of item 4 of the scope of patent application is in the form of a cross-section of the metal having a valve function in the patent application Fan Yuanchu 9 Application for a special invention, Application for a special invention, Foil. The patented invention that is applied for is mainly facing the same patented invention. The patented patented invention is larger than the horizontal width, and the terminal is provided with a terminal. The patented patented invention is applied to the through hole of the substrate, and its area is larger than that. The invention of item 5 of the benefit range is that the shape of the cross section of the metal having a valve action is circular in the scope of the patent application range 1 or 2. The invention of the sixth benefit range is in the patent application range number 丨 or 2 where ′ forms the metal having a valve action into a flat plate or a profit range, among which the direction profit range is large. Advantageous Range Among them, in order to connect the pair of metals, the invention of item 7 of the electrode is in the scope of Shen Qing patent No. 1 or 2. The valve-acting metal bends or bends near its two ends. The invention of item 8 is the length dimension of the cross section of the metal with a valve action in the scope of the patent application 1 or 2 ^ 9 # The invention of @ is the length of the metal in the patent application scope 1 or 2 ΐ = the length of the metal with a valve action The two components of the direction = one of the through holes of the board-the first electrode is used to connect the printed circuit. The invention of item 10 is derived from the straight electrode of Shenmei ^ The scope of patent No. 9 of the 4 terminals of the printed circuit board contacts and The non-contacting surface of the printed circuit board 200409153 V. Description of the invention (9) _ The invention in the 11th scope of the patent application is a patented invention, in which: 2 items from the moon inch to the target solid brother visit the lead terminal of the first electrode, It is electrically connected to the printed circuit board which is placed on the metal member and the end of the valve-shaped metal of the ▼ -shaped line-type component. Terminals: 2nd, 2nd circuit board connected to the 2nd, the metal member is integrally formed, the 2nd terminal of the second electric and the valve-acting metal is connected to the sub, and 4 terminals are formed on the sub to form a strip line type element. ^ The electrode terminal applies for the invention in the 12th invention of the patent scope, among which: you will find the target range of item 11. The first electrode terminal has a connection member and is placed in the type. The parts should have the valve function = up ^ the ▼ -shaped line: the wiring on the brush circuit board is connected: phase ;; :: body :; piece 'and the connecting member and the foot member; 4 body member, connecting the piece ί: The connection member connecting the body member and the first-: ί :: the shape of the connection between the two ends of the body member in the length direction, the foot-stand structure member is approximately vertical; "the injury to the third member —The second electrode lead-out formed by the body; pieces, two; f body members, and the metal members are directly connected. Has; printed: the wiring on the circuit board is connected to the two leg structure ... the body member is placed on the band Circuit 丨 卞 & The metal structure Page 14 200409153 V. Description of the invention (10) The end of the mounting surface of the piece in the length direction side is connected; the second leg member is parallel to the same. The invention, wherein: the first electrode lead-out connection structure And the first leg member with a valve function of the shaped member, and the first body member, connected to the surface of the first body member-the body member on the opposite side of the first body member to the body member The end of the strip line type element integrated with the metal member is connected to the mounting surface to form the invention of Dashenqing Patent No. 14 for the mounting surface, wherein: the first electrode lead-out terminal is connected By using a member, the two ends of the valved member having the valve action and the same long-side body member of the mounting surface are connected, so that the invention with the major item of the mounting surface is in the scope of the patent application. A metal phase connection having the strip line placed on the metal component; a wiring phase connection on a printed circuit board; a connection component and the foot component; a length direction of the connection component and the first leg structure connected Both end portions are provided with end portions having a shape for the first connection such that the mounting surfaces of the second electrode lead-out terminal system on which the metal members are placed are formed on the two long sides of the first direction. There is a second leg member, which is parallel. The invention of the item is the metal connection of the strip line carried on the metal member, and the first body member,
第15頁 200409153 五、發明說明（π) 和該印刷電路基板上之配線相連接； 該連接用構件和該第一機體構件在 接，使得對於該第一機體構件大致垂直；X向之端部連 在該金屬構件一體形成之該第二電極 該帶狀、線路型元件之該金制件之載置面==載置 端部、，在該載置面之同一長邊側之端部具有第=髀=兩 件，連接成對於該載置面大致垂直。 毒 申請專利範圍第i 5項之發明係在申 之發明，其中·· β〜乾圍弟1 1項 該第一電極引出端子具有 一連接用構件，和被載置於該金屬構件上之該册 型元件之該具有閥作用之今屬如 μ w狀線路 ^ ]邗用之金屬相連接；及第一機髅错彼 和該印刷電路基板上之配線相連接； ㈣構件， 使rSS構件和該機體構件在長度方向之端部連接， 使付對於该第一機體構件大致垂直； 挪丨運接， 在該金屬構件一體形成之該第二 該帶狀線路型元件之該金屬構件之載置面在二=載置 端部，在該載置面之大致中央區 在 接成對於該載置面大致垂、有弟一機體構件，連 °亥第電極引出端子和該第二電極引出端早邴要士产 該金屬構件之載士上电径w出鈿子配置成在 Φ長度方向大致成一直線。 叫3 第16項之發明係在巾請專利範圍第 之該第腳構Ζ之發明’其中’和該印刷電路基板接觸 之心腳構件和該第二腳構件之剖面之面積比和該印刷 第16頁 200409153Page 15 200309153 V. Description of the invention (π) Connected to the wiring on the printed circuit board; the connection member is connected to the first body member so that it is approximately perpendicular to the first body member; the end in the X direction The mounting surface of the gold piece of the second electrode, the strip-shaped, line-type component connected to the metal member integrally formed == the mounting end portion, which has an end portion on the same long side of the mounting surface. The two pieces are connected so as to be substantially perpendicular to the mounting surface. The invention of item i 5 of the scope of the patent application for poison is an invention of the application, among which β ~ dry siege 1 item 1 The first electrode lead-out terminal has a connecting member, and the metal member is placed on the metal member. The book-shaped element has a valve function such as a μ w-shaped circuit ^] metal connection; and the first machine is connected to the wiring on the printed circuit board; ㈣ member, the rSS member and The body members are connected at the ends in the length direction so as to be substantially perpendicular to the first body member; and transported, the metal member of the second strip-type line-type element formed integrally with the metal member is placed. The surface is at the end of the mounting surface. In the approximate central area of the mounting surface, the body is substantially perpendicular to the mounting surface, and there is a body component. The electrode terminal and the second electrode terminal are earlier. The electric diameter w on the carrier of the metal member produced by the company is arranged so as to be approximately straight in the length direction of Φ. The invention of item 3 is called the invention of the first leg structure in the patent claim. The “area” of the heart leg member in contact with the printed circuit board and the area ratio of the cross section of the second leg member and the printed part 16 pages 200409153
苐二機體構件 之剖 五、發明說明（12) 電路基板不接觸之該第一機體構件和該 面之面積為寬。 請專利範圍第1或2 ，該導電性物質層 申請專利範圍第1 7項之發明係在申 項或第11至15項中任一項之發明，其中 包含導電性高分子之層。 申請專利範圍第1 8項之發明係在申請專利範園 之發明，其中，該導電性高分子層係自以聚氮茂、产*項 茂、聚苯胺構成之族群所選擇之一種以上之化人从:硫 化合物之衍生物。 s者該(2) Sectional drawing of the body member 5. Explanation of the invention (12) The area of the first body member and the surface that the circuit board does not contact is wide. The scope of the patent claims 1 or 2, the invention of the conductive substance layer No. 17 of the scope of patent application is the invention of the application or any one of the clauses 11 to 15, which includes a layer of a conductive polymer. The invention in item 18 of the scope of patent application is an invention in the patent application park, in which the conductive polymer layer is selected from one or more species selected from the group consisting of polyazene, polyazene, and polyaniline. Human: a derivative of a sulfur compound. s
申請專利範圍第1 9項之發明係在申請專利範 之發明，其中，該導電性物質層具有該導電性言八乐1 7項 ># JQ J L ， 設於該電介質體皮膜側；及導電性膠層，在該 曰 子層上形成。 W電性高分 申請專利範圍第20項之發明係在申請專 之發明，其中，在該導電性膠層固接金屬構件。 申請專利範圍第21項之發明係在申請專範 項或第項中任一項之發明，其令，該具;二：1或 金屬係自以鋁、鈕及鈮構成之族群所選擇之金屬The invention of item 19 in the scope of patent application is an invention in the scope of patent application, in which the conductive substance layer has the conductivity of Yakuba 17 items ># JQ JL and is provided on the dielectric body film side; and conductivity A glue layer is formed on the sublayer. W Electrical high score The invention in claim 20 of the scope of patent application is a patented invention in which a metal member is fixed to the conductive adhesive layer. The invention claimed in the scope of patent application No. 21 is an invention in any one of the application specific scope or in the order, the order, the equipment; 2: 1 or the metal is a metal selected from the group consisting of aluminum, buttons and niobium
項戈第22項…係在申請專利範圍第1或 厘一明，其中，用樹脂將該具; 閥作=屬：該電介質體皮膜及該導電性物質層模製 申明專利範圍第2 3項之發明，其特徵·、 、 具有 $馬· 低阻抗線路型元件 具有在導體 間夾入電介質體皮膜Item 22 of Xiango ... is in the first or centimeter of the scope of patent application, in which the tool is made of resin; valve is equal to: the dielectric body film and the conductive substance layer are molded to declare the scope of patent No. 23 The invention is characterized in that it has a low-voltage line-type element and has a dielectric body film sandwiched between conductors.
200409153 五、發明說明（13) 之疊層體構造 第一電極引 印刷電 及 件之金 該 連 該印刷 該連接 在 件係該 一機體 該 第 件，和 該 構件之 邊侧之 該 致平行 中 具 低 之疊層 路基板作 第二電極 屬構件之 第一電極 接用構件 電路基板 用構件和 該第一機 第一機體 構件大致 第二電極 二機體構 該印刷電 第二機體 載置面在 端部連接 第二腳構 〇 晴專利範 有 阻抗線路 體構造， 在該電介 出端子， 電性連接 引出端子 兩端部， 引出端子 ，和該第 上之配線 該腳構件 體構件連 構件在長 垂直的連 引出端子 件，和該 路基板上 構件係載 長度方向 質：皮膜具有電介質損耗； 配置於該導體之其中一方，而和 品f置於冑置該％阻抗線路型元 而和印刷電路基板作電性連接； 具有 一導體相連接^ 仰逆筏，弟一腳構件，和 目、接，及第一機體構件，連接 ’ 接之該連接用構件和該第一腳構 度方向之兩端部’具備對於該第 接之形狀； 具有 至屬構件直接連接；及第二腳構 之配線相連接； 置4低阻抗線路型元件之該金屬 之兩端部，和該载置面之同一長 件和該機體構件連接，使得和該載置面大 圍第24項之發明’其特徵為： 型7L件，具有在導體間夹入電介質體皮膜 在該電介質體皮膜具有電介質損耗；第一200409153 V. Description of the invention (13) The laminated structure of the first electrode leads to the printing of electrical components and parts. The connection should be printed. The connection should be in the same body as the first piece and parallel to the sides of the component. The first electrode connection member with a low-layer laminated circuit board as the second electrode component and the circuit board member and the first machine first body member are roughly the second electrode two body structure. The printed electric second body mounting surface is at The end is connected to the second leg structure. The patented patent has an impedance line body structure. At the dielectric output terminal, the two ends of the lead-out terminal are electrically connected to the lead-out terminal. The long vertical lead-out terminal piece is connected to the component on the circuit board in the longitudinal direction: the film has a dielectric loss; it is arranged on one of the conductors, and the product f is placed on the% impedance line type and printed The circuit board is electrically connected; it has a conductor connected ^ upside down raft, one leg member, and mesh, connection, and the first body component, connection 'then the connection The component and the two ends of the first leg structure direction are provided with the shape of the first connection; have direct connection to the subordinate member; and the wiring of the second leg structure are connected; the 4 low-impedance line-type components of the metal The two ends are connected to the same long piece of the mounting surface and the body member, so that the invention of the 24th Dawei of the mounting surface is characterized by a type 7L piece with a dielectric body sandwiched between conductors. The film has a dielectric loss in the dielectric body film; the first
200409153200409153
電極引出端子，配 基板作電性連接，· 阻抗線路型元件之 作電性連接； 置於該導體之其中一 及苐二電極引出墙子 金屬構件之兩端部， 方，而和印刷電路 ，配置於載置該低 而和印刷電路基板 該第一電極引出端子具有 連接用構件，和該第—導體 該印刷電路基板上之配綠 接，第一腳構件，禾 該連接用槿# ^連接，及第一機體構件，連指 θ迓搔用構件和該腳構件；The electrode lead-out terminal is matched with the substrate for electrical connection, and the impedance line-type component is used for electrical connection; placed on one of the conductors and the two electrode lead-out ends of the metal member of the wall, the square, and the printed circuit, It is arranged on the lower circuit board and the first electrode lead-out terminal of the printed circuit board has a connection member, and the first conductor is provided with a green connection on the printed circuit board, and the first leg member is connected with a hibiscus. , And the first body member, and the θ 迓 搔 member and the foot member;
##ίϊ2二機體構件連接之該連接用構件和該第一腳揭 .' ^ 體構件在長度方向之兩端部，且備對;^該第 件大致垂直的連接之形狀，使得彼該第f 機體構件之相反侧之面； 。亥第一電極引出端子係載置該低阻抗線路型元件之該 金屬構件之载置面在長度方向之兩端部，在該載置面之同 長邊侧之端部具有第二腳構件，連接成和該載置面大致 平行。 申請專利範圍第2 5項之發明，其特徵為： 具有 低阻抗線路型元件，具有在導體間夾入電介質體皮膜 之豐層體構造，在該電介質體皮膜具有電介質損耗；第一·『 電極引出端子，配置於該導體之其中一方，而和印刷電路 基板作電性連接；及第二電極引出端子，配置於載置該低 阻抗線路型元件之金屬構件之兩端部，而和印刷電路基板 作電性連接；## ίϊ2 The connecting member and the first foot are connected by the two body members. ^ The two ends of the body member in the length direction are prepared, and the pair is roughly vertical. f The surface on the opposite side of the body component; The first electrode lead-out terminals are both ends in the longitudinal direction of the mounting surface of the metal member on which the low-impedance line-type component is mounted, and a second leg member is provided at the end on the same long side of the mounting surface. They are connected substantially parallel to the mounting surface. The invention of claim 25 in the scope of patent application is characterized by having a low-impedance line-type element, a layered structure with a dielectric body film sandwiched between conductors, and a dielectric loss in the dielectric body film; the first · "electrode The lead-out terminal is arranged on one of the conductors and is electrically connected to the printed circuit board; and the second electrode lead-out terminal is arranged on both ends of the metal member on which the low-impedance line-type component is placed, and the printed circuit The substrate is electrically connected;
200409153 五、發明說明（15) 該第—電極弓丨出端子具有 件，$$:::，和該第一導體相連接；及第-件和印刷電路基板上之配線相連 該連接用構件& $笛_ ^ _ 接成對於該第一機-=I :機體構件在長度方向 一々^示 機體構件大致垂直； 金屬H ί極弓1出端子係載置該低阻抗線路型 金屬構件之載置面在异辩 一長長度向兩端部，在該載 致垂ΐ 具有第二機體構件，連接成和該 ::專利範圍第26項之發明，其特徵為： 具有 之A::5 Ϊ路^元件’具有在導體間夾入電介 在該電介質體皮膜具有電介質損 引出鳊子’配置於該導體之其中一方，而和 m性連接；&第二電極引出端子，配置於 几、、’型凡件之金屬構件之兩端部，而和印刷 作電性連接； 该第一電極引出端子具有 連接用構件，和該第一導體相連接；及第一 件’和印刷電路基板上之配線相連接； 該連接用構件和該第一機體構件在長度方向 接成對於該第一機體構件大致垂直； 該第二電極引出端子係載置該低阻抗線路型 金屬構件之載置面在長度方向之兩端部，在該載 機體構 之端部連 元件之該 置面之同 載置面大 質體皮膜 耗；第一 印刷電路 載置該低 電路基板 機體構 之端部連 元件之該 置面之短200409153 V. Description of the invention (15) The first-electrode bow terminal has a piece, $$ :::, which is connected to the first conductor; and the first piece and the wiring on the printed circuit board are connected to the connection member & amp $ 笛 _ ^ _ Connected to the first machine-= I: the body member is shown in the length direction ^ indicates that the body member is approximately vertical; the metal H 1 pole bow 1 terminal system is used to load the low-impedance line-type metal member The surface is at the two ends of a long length of the objection, and there is a second body member at the carrier, which is connected to the invention of the :: scope of the patent, which is characterized by: A :: 5 具有The circuit element 'has a dielectric sandwiched between conductors, and has a dielectric loss extraction pin on the dielectric body film' is disposed on one of the conductors, and is connected to the m-type; & a second electrode lead-out terminal, disposed on a plurality of, ' The two ends of the metal member of the shaped part are electrically connected to the printing; the first electrode lead-out terminal has a connecting member and is connected to the first conductor; and the first piece and the wiring on the printed circuit board Phase connection; the connecting member and the first The body member is connected in the length direction so as to be substantially perpendicular to the first body member; the second electrode lead-out terminal is at both ends of the mounting surface on which the low-impedance line-type metal member is placed in the length direction. The mass of the mounting surface of the end-connected component is the same as that of the mounting surface; the first printed circuit is short on the mounting surface of the low-circuit substrate body structure.
第20頁 200409153 五、發明說明（16) =中央區域具有第二機體構件’連接成和該載置面大 致垂直； 該第一電極引出端子和續箆—雪4丨 觸丁〒Θ弟一電極引出端子配置成在 3金屬構件之載置面之長度方向大致成一直線。 申請專利範圍第27項之發明係在申請專利範圍第23或 24項之發日月，其中’和該印刷電路基板接觸之該第一腳構 件和該第二腳構件之剖面之面積比和該印刷電路基板不接 觸之該第一機體構件和該第二機體構件之剖面之 I。 … 申請專利範圍第2 8項之發明係在申請專利範圍第2 3至 26項中任一項之發明，其中，該低阻抗線路型元件利用樹 脂模製。 申請專利範圍第29項之發明，其特徵為： 具備 帶狀線路型元件，具有金屬，具有表面積擴大之閥作 用；電介質體皮膜，在該具有閥作用之金屬之表面形成； 導電性物質層，隔著該電介質體皮膜形成為包圍該具有閥 作用之金屬之周圍；及金屬構件，輸送輪入之直流電力； 在該具有闕作用之金屬之兩端部和該金屬構件之兩端部分 別設置輸出入端子； 基板； 在該基板上形成； 所設置之第一輸出 之弟-—輸出入端子 及第一電源配線和第二電源配線， 將在該具有閥作用之金屬之兩端部 入端子和在該金屬構件之兩端部所設置Page 20, 200409153 V. Description of the invention (16) = The second body member in the central area is connected to be approximately perpendicular to the mounting surface; the first electrode lead-out terminal and the continuation—Snow 4 丨 contact Ding Θ, the first electrode The lead-out terminals are arranged substantially linearly in the longitudinal direction of the mounting surface of the three metal members. The invention of item 27 in the scope of patent application is on the date of issue of item 23 or 24 of the scope of patent application, where the area ratio of the cross section of the first leg member and the second leg member in contact with the printed circuit board and the A cross section I of the first body member and the second body member that the printed circuit board does not contact. … The invention according to the 28th patent application scope is the invention according to any one of the 23rd to 26th patent scope, in which the low-impedance line-type element is molded with a resin. The invention according to item 29 in the scope of patent application is characterized in that: it is provided with a strip-line type element with a metal and a valve function with an enlarged surface area; a dielectric body film is formed on the surface of the metal with a valve function; a conductive material layer, It is formed so as to surround the periphery of the metal having a valve function through the dielectric body film; and a metal member, which transmits the DC electric power from the wheel; and is provided at both ends of the metal having a plutonium effect and both ends of the metal member, respectively. I / O terminals; base plate; formed on the substrate; the first output output brother --- the input / output terminal and the first power wiring and the second power wiring, will be inserted into the terminals at both ends of the metal having a valve function And provided at both ends of the metal member
200409153 五、發明說明（17) —--—_ 分別=二電=線和該第二電源配線連接。 申凊專利乾圍第30項之發明係钱 之發明，其中，將接受同—電壓之：：利範圍第29項 一起配置於該電路基板上， 4 /、八、、、σ之電路元件群 申請專利範圍第31項 淮^ ^條供給同一電源。 具有 只艾發明，其特徵為： 帶狀線路型元件，具有金 用；電介質體皮臈，在今:鸯八有表面積擴大之閥作 導電性物質層，隔著；電亥；屬之表面形成’· J用之金屬之周圍；及金屬構；，衿1為包圍該具有閥 在该具有閥作用之金屬 輸仫輪入之直流電力； 別設置輸出入端子； 端部和該金屬構件之兩端部分 基板，由絕緣材料構 及半導體晶片，梦5 3 ’ 該基材具有第—^雨基材上； 該基材上裝載之元件相連：接腳和第二連接用接腳，和在 該半導體晶片具有 ，、 將在該具有閥作用:^源配線和第二電源配線； 端部所設置之輸出 乂屬之兩端部和該金屬構件 半導之？電源'Si:與該基材之連接用接腳和該 曱明專利車色圍第^ 閥作用金屬形成制：之發明，其特徵為具有： 之金屬； 衣形成具有表面積擴大之閥作用 電’丨質體皮膜形出制 成衣程，在該具有閥作用之金屬之表 -----—-- 第22頁 200409153 五、發明說明（18) 面形成電介質體皮 導電性物質層 著該電介質體皮膜 貼合製程，將 引出端子之金屬構 基材和在至導電性 線路型元件進行位 屬構件及導線架和 及切斷製程， 二電極引出端子及 m ; 包^ ^程，形成導電性物質層， 圍該具有閥作用之;使得隔 在多種基材上 <金屬之周圍； 件和成為第_電極 ^ 了弟二電極 物質層形成製輕為止之導線架之 置對準後黏接，使得得到之帶狀 兮曰+ 便侍導電性物皙 :亥^有閥作用之金屬接觸；^層和金 藉著自該基材間隔既定之 導線架，製成罄灿綠A 離切斷該第 表成▼狀線路型元件。200409153 V. Description of the invention (17) —————_ Respectively = the second power line and the second power supply wiring connection. The 30th invention of the Shenquan patent is a money invention. Among them, it will accept the same voltage: the 29th scope of interest and be arranged on the circuit board together. 4 /, 8 ,,, σ circuit element group Article 31 of the scope of patent application provides the same power supply. There is only Ai invention, which is characterized by: a strip line type element with gold; a dielectric body skin, nowadays: a valve with an enlarged surface area as a conductive material layer, separated by; electricity; the surface of the genus is formed '· Around the metal used by J; and the metal structure; 衿 1 is the DC power that surrounds the valve with the metal input wheel with valve function; don't set the input and output terminals; the end and the two of the metal component The end part of the substrate is composed of an insulating material and a semiconductor wafer. The substrate has a first substrate on the first substrate; the components loaded on the substrate are connected: pins and second connection pins, and The semiconductor wafer has a valve function: the source wiring and the second power wiring; the two ends of the output metal set at the end and the metal member are semiconducting? Power supply 'Si: The pin for connection with the substrate and the 曱 Ming patented vehicle color enclosure ^ valve action metal formation: an invention characterized by having: metal; clothing forming valve action electricity with an enlarged surface area'丨 The plastid skin film is formed into a clothing process, and on the table of the metal having a valve function, page 22, 200409153 V. Description of the invention (18) A dielectric body skin conductive material is formed on the surface, Dielectric body film lamination process, the metal base material of the lead-out terminal and the conductive member and lead frame are cut and cut in the conductive circuit type component, the two-electrode lead-out terminal and m; The material layer has a valve function; it is separated on a variety of substrates < around the metal; pieces and become the first electrode ^ the second electrode material layer is formed until the light lead frame is aligned and stuck Connected to make the obtained band shape + conductive conductive material: Hai ^ metal with valve action; ^ layer and gold by the predetermined lead frame spaced from the substrate to make a bright green A cut Break this table into a ▼ -shaped line-type element.
四' 【實施方式】 itM之最佳竇协.你I 以下，參照圖面說明較佳之實施 定為以下之實施例。 仁本發明未限 實施例1 形狀ΓΛ表實闕之帶狀線路型元件之外觀 件在A Α，Ϊ 係表示圖3所示之印刷電路基板裝載構4 '[Embodiment] The best sinus association of itM. You will be described below with reference to the drawings. The preferred embodiment is the following embodiment. The present invention is not limited to Example 1. Appearance of a strip line type component having a shape ΓΛ, which is shown in FIG. 3, is shown in A Α, where Ϊ indicates a printed circuit board loading structure shown in FIG. 3
仔在A-Α線之剖面圖。 如圖3及圖4所示，在本發明之帶狀線路型元件，具備 $表面具有電介質體皮膜2〇之細長平板狀之具有閥作用、之 孟屬（以下稱為閥作用金屬）1 0，而且使得利用導電性物質 f 30經由電介質體皮膜20包覆閥作用金屬1〇和電介質體皮 膜20。在此，如圖3所示，本帶狀線路型元件i具備長度方Cross section of Aberdeen on line A-Α. As shown in FIG. 3 and FIG. 4, the strip line type element of the present invention includes a slender flat plate having a valve action and a valve body having a dielectric body film 20 on its surface (hereinafter referred to as a valve action metal) 1 0 In addition, the conductive material f 30 is used to cover the valve action metal 10 and the dielectric body film 20 through the dielectric body film 20. Here, as shown in FIG. 3, the strip-line type element i has a length side
第23頁 200409153 五、發明說明（19) 向之兩端部分位於大致同一直綠 / 用金屬10。 ，，次上之大致平面形狀之閥作 用金屬10例如由鋁構成。在圖3所示之例子，Π 30 * 1二之形狀係矩形’例如厚度係110 、長度係伐 3〇rain、寬度係i〇fflm。閥作用今屬 ^ 仅及係 形，#橢圓报七π卞ΓΓ 屬0之剖面形狀未限定為矩Page 23 200409153 V. Description of the invention (19) The two ends of the direction are located at approximately the same green / metal 10. The second, substantially planar valve-acting metal 10 is made of, for example, aluminum. In the example shown in FIG. 3, the shape of Π 30 * 12 is rectangular, for example, the thickness is 110, the length is 30 rain, and the width is ifflm. The valve action now belongs to ^ only the system shape, #ellipsis seven π 卞 ΓΓ The cross-sectional shape of the genus 0 is not limited to moments
==0屯或壞形也無妨。閥作用金屬10之表 J 面及月面、端面係利用在電解液中 ρ表 大至200倍而形成㈣狀之孔之金屬。電解㈣將表面積放 導電性物質層30形成為隖裟兩人 用金屬10之兩端之前端部分除外之皮蓋閥作 層30只要具有導電性，其材質等無特；限，，'Μ性物質 :2 :二氧化猛或氧化銅等半導體,：四‘ J:用各 硫畐瓦烯(tetrathiafuival 蒋：：：基醌和四 導電體。 电何移動絡合物等有機 尤其，在本導電性物質層3〇 ，二經基硫茂、聚笨胺、聚苯撐、或聚硫茂、聚 =撐乙烯、聚乙炔、聚甘菊環等導電性古，ς聚硫酿、聚 疋性之觀點其中尤其聚氮茂、 =刀子較好，由安 f較好。在本發明’聚氮茂、聚i茂、ΐ ?、及其衍生 如為在這些化合物附加了各種置換 ^本胺之衍生物例 共聚合的等。 、土的或和其他之高分子《 在本發明，這些導電性八 — 電子吸引性之化合物構成之摻：劑缸=:由電子供給性或 在&電性高分 200409153 五、發明說明（20) 子之摻雜劑上使用以往周知的。在這種摻雜劑上，例如有 礙氯、過氯酸陰離子等函素化合物、或芳香族瑞酸化合 物等作為路易斯酸作用者，或者如鋰或四乙基胺陽離子^ 之作為路易斯鹼作用者。 又 為了實現更低阻抗化，配置銅、銀、金、鋁等電阻小 之金屬板40，使得隔著導電性物質層3〇和閥作用金屬之一 側面或兩側面相向。在圖3所示之本實施例 二置成和長方體之一邊接觸，但是使得包圍(或：= 長方體也可。因導電性物質層30為很薄之膜狀，由於 令具有機械性強度、降低電阻等理由，、 住導電性物質層30之外侧。 风用金屬板圍 在本發明，構成導電性物質層3〇之這些導 八 之形成方法無特別限定。在形成電介 门刀 全屬10之矣品人 牡办成兔"負體皮膜20之閥作用 ” 10之表面（即電介質體皮膜上） ，開後令溶劑蒸發，或者導入形成導電性高 m〇u_er)和聚合觸媒後在閥作用金 接進订導電性高分子之聚合，可形成導電性高=表面直 又，關於和電路基路板或電子電路基板之 衣在電路基板使用^7^r t. ?| 妾 直接 等密封後使用=I引出電極後用樹脂或金屬殼 上，在本貫施例，在閥作用金屬構以仞 置第一電極引出端子9λ 9R 之長度方向之兩端部設 兩端部設置第-電&丨二^^又在金屬板40之長度方向之 2例如令間作用—全H出端，、3 B。第—電極弓丨出端子 J卞用至屬10向兩側突出後作為電極引出 200409153 五、發明說明（21) 也可利用焊接或壓接安裝。電極引出端子之形狀只要配合 在印刷電路基板等組裝之形態決定即可。 端子2A、3A如圖1所示，係用以接受自電源電路供給 之直流電源之端子對，端子2B、3B係用以供給LS][直流電 源之端子對。 ^ 电征5丨出端子2係用以形成比在第一電極引 出端子2A、2B和第二電極引出端子3A、3B之間形成之線路 電感大很多之線路電容之材料，因而，因線路阻抗變成很 小之值，圖3所不之本發明之實施例之帶狀線路型元件在 ^用上使得將因LSI電路内部之電晶體之切換等而產生之 #唬成分之高頻電磁波及自電源電路要侵入Lsi之 電磁波幾乎全反射。 & 外，在本發明之實施例，因端子2A、3A自看之帶# 件之特性和自端子2B、3B看之特性完全 之接受設為端子2B、3B，帶狀線路型元件之作： 也和上述相同。 τ < 1下用 在，發明，閥作用金屬（valve 之 限疋，在闕作用I厘7 1犬只热荷別 -、鎂等表面皮膜形成二=、 ::=;:料。在閥作用金屬等 鋁及鈮構成之族群所選擇之金屬較好。目以 又’閥作用金屬表面夕逮*人所— 無特別限定1如= 體皮膜20之形成方法也 之-化劑形成’或者直接將利用空氣氧化形用當== 0 Tun or bad shape is fine. The surface J, the moon, and the end face of the valve-acting metal 10 are metals in which a 表 -shaped hole is formed in the electrolyte with a ρ table as large as 200 times. Electrolysis: The surface-covering conductive material layer 30 is formed into a cover valve except for the front and back ends of the metal 10 for two people. As long as it has conductivity, its material is not special; Substances: 2: Semiconductors such as titanium dioxide or copper oxide ,: Tetra 'J: Tetrathiafuival (tetrathiafuival Jiang :: quinone and tetraconductors. Organic compounds such as electro mobile complexes, etc. Sexual material layer 30. Disulfide, polybenzylamine, polyphenylene, or polythiocene, poly = ethylene, polyacetylene, polychamomile ring and other conductive ancient, polysulfide, polyfluorinated viewpoint Among them, polyazolocene, = knife is preferred, and sulfonium f is preferred. In the present invention, 'polyazolocene, polyimide, hydrazone, and derivatives thereof are derived by adding various substitutions to these compounds. Examples of copolymerization, etc., in the soil or other polymers "In the present invention, these conductive eight-electron-attracting compounds are composed of dopants: agent tank =: from the electron supply or in the & electrical high score 200409153 V. Description of the invention (20) The dopants used in the past are known in the past. On the dopant, for example, functional compounds such as chlorine and perchlorate anions, or aromatic retinoic acid compounds can be used as Lewis acids, or lithium or tetraethylamine cations can be used as Lewis bases. In order to achieve a lower resistance, a metal plate 40 having a small resistance such as copper, silver, gold, and aluminum is arranged so that the side or both sides of the valve-acting metal are opposed to each other through the conductive material layer 30 and shown in FIG. In the second embodiment, it is placed in contact with one side of the rectangular parallelepiped, but the surrounding (or: = rectangular parallelepiped is also acceptable. Because the conductive material layer 30 is a thin film, for reasons such as mechanical strength and resistance reduction, etc., The outer side of the conductive material layer 30. The wind metal plate surrounds the present invention, and there is no particular limitation on the method of forming these guides constituting the conductive material layer 30. In the formation of dielectric gate knives, all of the 10 product manufacturers The surface of the rabbit " negative body film 20 " 10 " (on the dielectric body film), after the opening, the solvent evaporates, or the conductive catalyst is formed to form a high conductivity mou_er) and the polymerization catalyst is inserted into the valve action gold. Order Polymer polymer can form high conductivity = straight and straight surface. For circuit substrates or electronic circuit substrates, use it on circuit substrates ^ 7 ^ r t.? | 妾 Use directly after sealing = I lead-out electrode After the resin or metal shell is used, in the present embodiment, the first electrode lead-out terminal 9λ 9R is provided with two end portions at both ends in the longitudinal direction of the valve-acting metal structure. -Electric & 丨 二 ^^ In the length direction 2 of the metal plate 40, for example, the action between the two ends-full H, 3 B. The first-electrode bow 丨 the terminal J 卞 is used as the electrode 10 after protruding to both sides as the electrode lead 200409153 V. Description of the invention (21) It can also be mounted by soldering or crimping. The shape of the electrode lead-out terminal can be determined only by the type of assembly on the printed circuit board. Terminals 2A and 3A are terminal pairs used to receive DC power supplied from the power supply circuit, and terminals 2B and 3B are terminal pairs used to supply LS] [DC power. ^ Electricity 5 丨 Out terminal 2 is a material used to form a line capacitance that is much larger than the line inductance formed between the first electrode extraction terminals 2A, 2B and the second electrode extraction terminals 3A, 3B. Therefore, due to the line impedance It becomes a very small value. The strip line type device according to the embodiment of the present invention shown in FIG. 3 is used so that the high-frequency electromagnetic wave of the #blown component generated by the switching of the transistor in the LSI circuit and the like The electromagnetic wave that the power circuit intrudes into the Lsi is almost totally reflected. & In the embodiment of the present invention, the terminal 2A, 3A is self-seeing with the characteristics of the # pieces and the characteristics viewed from the terminals 2B, 3B are completely accepted as the terminals 2B, 3B, the strip line type components : Same as above. τ < 1 is used in the invention, the valve action metal (valve limit 阙, in the action I 7 7 1 dog heat charge-, magnesium and other surface film formation two =, :: = ;: material. In the valve The metal selected by the group consisting of aluminum and niobium, such as the action metal, is better. The purpose is to 'valve the action metal surface * by the people-no particular limitation 1 such as the formation method of the body film 20-the formation of chemical agents' or Direct use of air oxidation
第26頁 200409153 五、發明說明（22) ~ "- 般利用電解形成 作本發明之電介質體皮膜20也可。但， 電介質體皮膜。 之計金屬1〇之形狀也無特別限定，但是由特性阻抗 丁 w或加工上之勸寶占，設兔SIL 4cr ir^ .»» 長度方而1：六 1 ' 、 ”、、十板形狀（和閥作用金屬之 向正父之剖面形狀為長方） 彎曲的或部分折彎的等。’但疋也可使用 形。 也了 δ又為圓柱形或圓筒 在本發明也可使用將閥作用今屬 在擴面化之閥作用金屬i= 2面擴面化的。 板形狀的或在電解液中將簿電解；：、結體加工成平 又，如上述所示，在本；==钱謂。 電性物質層3。較好，但是將和^介二分子構成導 性物質層也可。此外，導電=刀子層上形成別種導電 可令直接接觸，j使用質和金屬板 例如’在導電性物質層30上,‘；用'::連接。 膜20直接接觸之導電性高分子層 體皮 m電性炭膠及在該導電性炭膠上 成之二重構造，可利用兮加_ ^ 又直t銀膠構 ^稱以了利用δ亥銀膠安裝金屬板 本貫施例之帶狀線路型元: 用金屬10 ’具有電介質體虔腺.，，. 牛構成’閥作 成經由電介質體皮膜20包圍閥作用：2質層30 ’配置 極二端2A、2B’設置於閥作用金屬1〇之不Ξ:位置， -對電極引出端子3A、3B’設置於導電性物質層=同：Page 26 200409153 V. Description of the invention (22) ~ "-Generally, the dielectric body film 20 of the present invention may be formed by electrolysis. However, the dielectric body film. The shape of the metal 10 is not particularly limited, but is determined by the characteristic impedance D or the persuasion on the processing, and the rabbit SIL 4cr ir ^. »» Length is 1: 6 1 ', ",, ten plate shape (The shape of the cross section of the valve acting metal to the positive father is rectangular) Bent or partially bent, etc. 'But 疋 can also be used. Also, δ is cylindrical or cylindrical. In the present invention, it can also be used. The valve action is now the valve action metal i = 2 surface expansion in the surface expansion. Plate shape or electrolysis in the electrolyte;:, the structure is processed into flat, as shown above, in the present; = = Money title. Electrical material layer 3. Better, but it is also possible to form a conductive material layer with ^ two molecules. In addition, conductivity = forming another kind of conductivity on the knife layer can make direct contact, j uses a quality and metal plate such as 'On the conductive material layer 30,'; ':' are connected. The conductive polymer layer body m electric carbon adhesive in direct contact with the film 20 and the double structure formed on the conductive carbon adhesive can be used Xi Jia _ ^ and straight silver plastic structure ^ is called the use of δ Hai silver glue to install metal plates in this embodiment of the strip line element: Made of metal 10 'with dielectric body gland. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,-,,,,,,,,,-,,,,,,,,,,,,, 20, 20, : Position,-Counter electrode lead-out terminals 3A, 3B 'are set on conductive material layer = same as:
第27頁 200409153Page 27 200409153
五、發明說明（23) 位置。藉著採用這種構造，因視在電介質損耗變大，可將 帶狀線路型元件之特性阻抗設成充分低，可防止自雜訊源 產生之電磁波侵入電源分配電路侧。 以下，詳細說明上述之實施例1之帶狀線路型元件之 製造實施例。此外，本發明未限定為本製造步驟。 在圖3及圖4所示之帶狀線路型元件，在閥作用金屬j 〇 上，使用利用蝕刻將表面積擴大至約2 〇 〇倍之厚度1 j 〇 之鋁箔。該鋁箔係寬1 0mm、長3 0mm。在該紹箔（閥作用金 屬1 0)之兩端部用由六說丙酸構成之氣石夕樹脂設置了遮罩 (圖上未示）後’將該鋁箔置於5質量％之硼酸銨水溶液'中， 以電壓1 0 V進行陽極氧化，洗淨及乾燥後得到具有由金屬 氧化皮膜構成之電介質體皮膜20之鋁箔。將該鋁箔浸泡於 0 · 0 5莫耳/升之硫酸水溶液中，量測靜電電容，係約 3 80 // F。此外，靜電電容之量測如圖5所示，在浸泡於硫 酸水溶液中之狀態進行。硫酸水溶液因導電率高並滲入^ 介質體皮膜之間隙，可正確的量測和電介質體皮膜^面積 成正比之靜電電容。此時，擔心硫酸水溶液之響應速度 ，，但是因量測頻率低至約12〇Hz，在這響應速度無問 通又在’谷液上未限定為硫酸水溶液，只要係具有導電 性之水溶液即可。 ， 其次，在玻璃製容器内，調整包含1〇質量％ 請之苯胺之水溶液後，將：了二= 屮。、及遮罩之閥作用金屬1 0浸泡於該水溶液中後取 ;/、欠在至/JEL之空氣中乾爍3 〇分鐘，接著，將閥作用5. Description of the invention (23) Location. By adopting this structure, since the apparent dielectric loss becomes large, the characteristic impedance of the strip line type element can be set sufficiently low, and electromagnetic waves generated from noise sources can be prevented from entering the power distribution circuit side. Hereinafter, a manufacturing example of the strip-line type element of the first embodiment described above will be described in detail. The present invention is not limited to the manufacturing steps. For the strip-line type element shown in FIGS. 3 and 4, an aluminum foil having a thickness of 1 j 〇 that is enlarged to a surface area of approximately 2000 times by etching is used on the valve-acting metal j 〇. The aluminum foil is 10 mm wide and 30 mm long. After a mask (not shown in the figure) was provided with a gas stone resin made of hexapropanoic acid at both ends of the foil (valve action metal 10), the aluminum foil was placed at 5% by mass of ammonium borate In the aqueous solution, anodization was performed at a voltage of 10 V, and after washing and drying, an aluminum foil having a dielectric body film 20 made of a metal oxide film was obtained. This aluminum foil was immersed in an aqueous solution of sulfuric acid of 0.5 mol / liter, and the electrostatic capacitance was measured, which was about 3 80 // F. In addition, as shown in Fig. 5, the electrostatic capacitance was measured while immersed in an aqueous sulfuric acid solution. The sulfuric acid aqueous solution has high conductivity and penetrates into the gap of the dielectric body film, and can accurately measure the electrostatic capacitance that is proportional to the area of the dielectric body film. At this time, I am worried about the response speed of the sulfuric acid aqueous solution, but because the measurement frequency is as low as about 120 Hz, there is no problem in this response speed and it is not limited to an aqueous solution of sulfuric acid on the valley, as long as it is an aqueous solution with conductivity. can. Secondly, in a glass container, after adjusting an aqueous solution containing 10% by mass of aniline, it will be: 2 = 屮. , And the valve action metal of the mask 10 is immersed in the aqueous solution and taken; /, dry in the air to / JEL for 30 minutes, and then, the valve action
200409153 五、發明說明（24) 金屬1 0浸泡於包含1 〇質量％之過二硫酸和丨〇質量％之對曱苯 續酸之水溶液後取出，再載置於空氣中2〇分鐘後，令苯胺 聚合。 。然後，利用水及曱醇洗淨該閥作用金屬10 ,在溫度 80 C之環境中令乾燥。重複此操作4次後，依次塗上導電 性炭膠、銀膠後完成導電性物質層3〇，用銀膠將由約1〇〇 从m之銅箔構成之金屬板40固接於導電性物質層3〇。鈇 後，將閥作用金屬10之兩端部浸泡於 係構 遮罩之樹脂之六氟丙酸溶解後除去。 7係構成 實施你丨2 使用圖6說明本發明之實施例2。本實施例之窄 件之構造和上述之實施例！之帶狀線路型元件 =相匕匕，在閥作用金屬1〇之剖面之形狀係大致正方充 。在本實施例之帶狀線路型元件之上述以外之構3 和貝施例1之帶狀線路型元件之構造相同。 實施例3 狀線ίΐ: Ϊ用！7:兒明本發'之實施例3。本實施例之。 之槿*兀之構化和上述之實施例1之帶狀線路型元件 比作用金屬10之剖面之形狀係圓形或橢丨 2上。在本貫施例之帶狀線路型元件之上述以外之4 以和只鉍例1之帶狀線路型元件之構造相同。200409153 V. Description of the invention (24) The metal 10 is immersed in an aqueous solution containing 10% by mass of persulfuric acid and 丨 0% by mass of p-benzoic acid and then taken out, and then placed in the air for 20 minutes. Aniline polymerization. . Then, the valve action metal 10 is washed with water and methanol, and dried in an environment of a temperature of 80 ° C. After repeating this operation 4 times, the conductive material layer 30 was sequentially coated with conductive carbon glue and silver glue, and then the conductive material layer 30 was completed. The silver plate was used to fix the metal plate 40 composed of copper foil of about 100 m to the conductive material. Layer 30. After that, both ends of the valve-acting metal 10 were immersed in the resin of the system mask, and hexafluoropropionic acid was dissolved and removed. 7-series configuration Implementing you 2 An embodiment 2 of the present invention will be described with reference to FIG. 6. The structure of the narrow part of this embodiment and the above embodiment! The strip line type element = phase dagger, the shape of the cross section of the valve action metal 10 is approximately square. The structure 3 of the strip line type element of this embodiment other than the above is the same as that of the strip line type element of Example 1. Example 3 Straight line ΐ: Use! 7: Erming Benfa's Example 3. This embodiment. The structure of the hibiscus and the structure of the strip-shaped element of the first embodiment described above is in a circular or elliptical shape. Except for the above-mentioned strip line type element of the present embodiment, the structure of the strip line type element except for the bismuth example 1 is the same.
200409153200409153
二構造相比，在閥作用金屬10之剖面之形狀係環形上不 同。即，使用圓筒形之閥作用金屬丨 線路型元件之上述以外之構造和奋浐仓"在本貝施例之贡狀 杜夕播，“s门 例1之帶狀線路型元 件之構造相同。 實施例5 其次，使用圖9說明本發明之實施例5。本實施例 狀f路型兀件之構造和上述之實施例丨之帶狀線路型元件 之構造相比，在閥作用金屬10之形狀上不同，相對於 尺：Η之長度尺寸L大4倍以上。即，藉著長度尺寸比剖面 之検見尺寸大，可令在功能上作為線路。㈣作用金心 上使用長度16Μ及32_、寬18^之金屬，構成2種帶狀線 路型元件。導電性物質層30由聚硫茂、炭膠及銀膠構成， 以形成電壓8V產生電介質體皮膜2〇。 將所得到之2種帶狀線路型元件之兩端分別和網路· 分析器連接後，量測電力透射特性S2 1，不考慮内部損 失’自實數部和虛數部之值求阻抗值，在長度16_型式， 在20MHz至200MHz之頻帶係稍平坦之自〇2mQs〇.8mQ， 在1MHz至1GHz也係ΙΟιηΩ以下。而，在長度32mm型式，更 良好，在7MHz至150MHz之頻帶係稍平坦之〇. lm Ω左右，在 2MHz至1GHz也係ΙΟπιΩ以下。 結果’付知兩種型式和係最一般性之高頻用電容器之 Ο.Ι/zF積層晶片陶莞電容器相比，都在自數具 有低2位數至3位數之阻抗。於是，得知本發明之實施例之 帶狀線路型元件和以往之電容器相比，尤其作為高性能數Compared with the two structures, the cross-sectional shape of the valve-acting metal 10 is different in a ring shape. That is, the use of a cylindrical valve-acting metal 丨 line-type element other than the above-mentioned structure and Fencang " in the tribute-shaped Du Xibo of this example, "S Gate Example 1 Structure of a strip-line type element Embodiment 5 Next, Embodiment 5 of the present invention will be described with reference to FIG. 9. The structure of the f-shaped element of this embodiment is compared with the structure of the strip-line element of the above-mentioned embodiment. The shape of 10 is different, relative to the ruler: the length dimension L is more than 4 times larger. That is, the length dimension is larger than the size of the cross section dimension, which can make it function as a circuit. The length of the core is 16M and A metal with a width of 32 mm and a width of 18 mm constitutes two kinds of strip-line type elements. The conductive material layer 30 is composed of polysulfuron, carbon glue, and silver glue to form a voltage of 8 V to generate a dielectric body film 20. The obtained 2 After the two ends of this strip line type element are connected to the network and analyzer, the power transmission characteristic S2 is measured, and the internal loss is not taken into account. The impedance value is calculated from the values of the real and imaginary parts. The frequency band between 20MHz and 200MHz is slightly flat. 2mQs0.8mQ is also less than 10mΩ at 1MHz to 1GHz, while it is better at a length of 32mm, and it is slightly flatter at about 0.1mΩ at 7MHz to 150MHz, and less than 10mΩ at 2MHz to 1GHz. Results 'It is known that the two types and the 0.1 / zF multilayer chip ceramic capacitors, which are the most general high-frequency capacitors, have low 2-digit to 3-digit impedances. So, we know that Compared with conventional capacitors, the strip line type device according to the embodiment of the invention is particularly high-performance.
第30頁 200409153Page 30 200409153
位機斋用具有極優異之阻抗特性。 f施例ft 八夂’使用圖1 〇說明本發明之實施例6。關於本實 例之帶狀線路型元件之構造，在閥作用金屬1(；之長本度貝方知向 之兩端部設置構成裝在印刷電路基板之通孔之形狀之一對 :二;丨出端子11及12，☆金屬板40之不同之位置設置構成 装在^刷電路基板之通孔之形狀之一對電極引出端子41 =绩=著照這樣構成，τ實現適於裝在印刷電路基板之帶 狀線路型元件。 Τ t施例7 ，久，使用圖11說明本發明之實施例7。關於本實施 J f狀線路型元件之構造，在閥作用金屬10之長度方向 =端部設置係適合表面安裝之象L字形之電極引出 ‘子11、1 2及4 1、4 2。此外，若不妁、、尸於本二—壯 將令雷& 2Ϊ山& 右不拘泥於表面女裝，不必 ^ Ϊ極引出端子限定為L字形，係具有多角形或半圓、 圓形等剖面之直的形狀也無妨。 宜—施例8 ，次，使用圖1 2說明本發明之實施例8。關於本實施 =之帶狀線路型元件之構造，在圖4之導電性物質層3〇由 =電性高分子層31、導電性炭膠層32及銀膠層33構成上 二她例1之帶狀線路型兀件不同。在本實施例之帶狀線路 罜兀件之上述以外之構造和實施例丨之帶狀線路型元 構造相同。 < 复^施例9 200409153 五、發明說明（27) 其次，說明本發明之實施例9。關於本實施例之帶狀 線路型元件之構造，在圖1 2之導電性物質層3〇自以聚氮 戊、聚硫戊、聚本構成之族群所選擇之一種以上之化人 物或者该化合物之竹生物構成上和實施例8之帶狀線路型 元件不同。在本實施例之帶狀線路型元件之上述以外之構 造和實施例8之帶狀線路型元件之構造相同。 實施例1 0 其次’說明本發明之實施例1 〇。關於本實施例之帶狀 線路型元件之構造’替代實施例8至9之帶狀線路型元件之 導電性炭膠層32和銀膠層33，用導電性膠層構成上不同。 在本實施例之帶狀線路型元件之上述以外之構造和實施例 8至9之帶狀線路型元件之構造相同。 實施例11 其次，說明本發明之實施例11。關於本實施例之帶狀 線路型元件之構造，在實施例i 0之帶狀線路型元件之導電 性膠層固接金屬板4 0上，和實施例1 〇之帶狀線路型元件不 同。在本實施例之帶狀線路型元件之上述以外之構造和實 施例1 0之帶狀線路型元件之構造相同。 κ 實施例1 2 其次，說明本發明之實施例1 2。關於本實施例之帶狀f 線路型元件之構造，在實施例1至丨丨之帶狀線路型元件係 f以组、紹及鈮構成之族群所選擇之金屬上上不同。在本 κ知例之帶狀線路型元件之上述以外之構造和實施例1至 11之帶狀線路型元件之構造相同。Positioning machine has excellent impedance characteristics. fExample ft 夂 八 夂 'A sixth embodiment of the present invention will be described with reference to FIG. 10. Regarding the structure of the strip-line type component of this example, one pair of shapes constituting the through-holes mounted on the printed circuit board are provided at the two ends of the valve action metal 1 (; Terminals 11 and 12 are set at different positions on the metal plate 40. One of the shapes of the through-holes mounted on the circuit board is provided as a pair of electrode lead-out terminals. 41 = Result = Photo structure, τ implementation is suitable for mounting on printed circuits. The strip line type element of the substrate. Example 7 of the invention will be described with reference to FIG. 11 for a long time. With regard to the structure of the J f shape line type element of this embodiment, in the length direction of the valve action metal 10 = end The installation is suitable for surface-mounted L-shaped electrodes, which lead to the sub-11, 1 2 and 4 1, 4 2. In addition, if you are not embarrassed, you will be buried in the second-strong will make Lei & 2 Ϊ 山 & right not stick to On the surface of women's clothing, it is not necessary to limit the L-shaped terminal to an L-shape, and it may be a straight shape having a polygonal shape, a semicircular, or a circular cross-section. Example 8. Regarding the structure of the strip line type component of this embodiment, The electrical material layer 30 is composed of an electrical polymer layer 31, a conductive carbon rubber layer 32, and a silver rubber layer 33. The strip-shaped circuit elements of the first example are different. In this embodiment, the strip-shaped circuit 罜The structure of the element other than the above is the same as the structure of the strip line element of the embodiment. ≪ Example 9 200409153 V. Description of the invention (27) Next, the embodiment 9 of the present invention will be described. The structure of the strip line type element is composed of one or more characters selected from the group consisting of polyazepine, polythiopentene, and polybenzyl, or the bamboo biological composition of the compound, in the conductive material layer 30 in FIG. 12. It is different from the strip line type element of Embodiment 8. The structure other than the above-mentioned strip line type element of this embodiment is the same as the structure of the strip line type element of Embodiment 8. Embodiment 10 Next, the present invention will be described. Example 1 0. Regarding the structure of the strip-line type element of this embodiment, the conductive carbon adhesive layer 32 and the silver layer 33 of the strip-line type element of Examples 8 to 9 are replaced with a conductive adhesive layer. It is different in this embodiment. The structure other than the above is the same as the structure of the strip line type element of Examples 8 to 9. Embodiment 11 Next, the eleventh embodiment of the present invention will be described. The structure of the strip line type element of this embodiment is described in the embodiment. The conductive adhesive layer of the strip line type element of i 0 is fixed on the metal plate 40 and is different from the strip line type element of Example 10. The structure and the structure of the strip line type element of this embodiment other than the above are The structure of the strip-line type element of Embodiment 10 is the same. Κ Embodiment 12 2 Next, the embodiment 12 of the present invention will be described. The structure of the strip-type f-line element of this embodiment is described in Embodiments 1 to 丨. The strip line type element f is different in the metal selected by the group consisting of group, Shao, and niobium. The structure of the strip line type element in this known example is the same as that of the strip line type element of Examples 1 to 11.
200409153 圖1 4說明 如圖1 4所 膜20，此 質層30。 物質層3 0 在閥作用 圍電介質 閥作用金 極引出端 介質體皮 二電極引 將閥作用 之本實施 自主面朝 朝同一方 因可使帶 可避開其 線路型元 曲或彎曲 或彎曲之 說明將上 電路基板 板具備疊 五、發明說明（28) 實施例1 3 其次，使用圖1 3及 施例之帶狀線路型元件 之形式形成電介質體皮 2 0之形式形成導電性物 介質體皮膜20及導電性 面黏貼金屬板40。又， 部配置絕緣物質6 0，包 30之兩端部。又，在比 部更端部側設置第一電 設置閥作用金屬1 〇、電 面之相反側之面設置第 照這樣在金屬板40 及導電性物質層3 0疊層 在本元件之兩端部附近 狀。於是，構件在面内 泡可簡單的製造，又， 之長度變短，在安裝時 施例，在對於裝載帶狀 内令帶狀線路型元件屈 基板面在上下方向屈曲 在此，參照圖1 5， 路型元件裝在疊層印刷 圖15所示之電路基 本發明之實施例1 3。本實 示，以夾入閥作用金屬10 外，以夾入電介質體皮膜 在按照閥作用金屬1 0、電 之順序疊層之疊層體之一 金屬10之表背雙面之兩端 體皮膜20和導電性物質層 屬1 0之設置絕緣物質之端 子11、12，在金屬板40之 膜20及導電性物質層30之 出端子41、42。 金屬10、電介質體皮膜20 例之帶狀線路型元件形成 同一方向屈曲或彎曲之形 向屈曲或彎曲時’利用浸 狀線路型元件之長度方向 他之零件。此外，在本實 件之裝載基板面垂直之面 ’但是設為令對於該裝載 形狀也可。 述之實施例1〜3之帶狀線 之電路構造。 層印刷基板30 3 ;帶狀線200409153 Figure 14 illustrates the film 20 and the layer 30 as shown in Figure 14. Material layer 3 0 In the role of the valve, the dielectric body acts on the gold electrode's lead-out terminal, the dielectric body skin, the two electrodes lead the valve's implementation to face the same side autonomously, because the band can avoid its line-shaped element or bend or bend. Description The upper circuit board is provided with a stack of five. Description of the invention (28) Example 1 3 Next, the dielectric body skin 20 is formed in the form of a dielectric body skin 20 using the form of a strip line type element shown in FIG. 13 and the embodiment. The film 20 and the conductive surface are adhered to the metal plate 40. In addition, both ends of the package 30 are provided with an insulating material 60 and a package 30. In addition, a first electric valve-acting metal 10 is provided on the side farther than the part, and a first side is provided on the side opposite to the electric surface. The metal plate 40 and the conductive material layer 30 are stacked on both ends of the element. Near the Ministry. Therefore, the component in-plane foam can be simply manufactured, and its length is shortened. In the installation, an example is used to bend the strip-shaped circuit component flexure board surface in the up-and-down direction. 5. The circuit-type component is mounted on the printed circuit board shown in FIG. This example shows that the valve body metal 10 is sandwiched, and the dielectric body film is sandwiched between the valve body metal 10 and the electrical body. One of the two layers of the metal body 10 is laminated on the front and back sides of the metal body film. 20 and the conductive substance layer 10 are terminals 10 and 12 provided with an insulating substance, and the film 20 of the metal plate 40 and the terminals 41 and 42 of the conductive substance layer 30 are provided. In the case of the metal 10 and the dielectric body film 20, the strip line type element is formed in the form of buckling or bending in the same direction. When buckling or bending is used, the parts in the length direction of the immersed line type element are used. It should be noted that the surface on which the substrate of the mounting substrate is perpendicular to the mounting surface of the object is not limited to this mounting shape. The circuit structure of the strip line of the first to third embodiments is described. Layer printed substrate 30 3; strip line
IM 第33頁 200409153 、發明說明（29) 路型元件，裝在該疊層印刷基板3 0 3之表面上 购、3Glb，分別和圖上未示之帶狀線路型電之原陽^線 出端子u、12連接;及圖上未示之帶狀線路型元== 引出端子41、42 ;電源配線301a、3〇lb和接地配 ^、 ^ 2分別在璺層印刷基板3 〇 3上使用銅等導電率高之材料 在疊層印刷基板303上裝載圖上未示之很多 自這些電路元件產生之高頻雜訊在電源配線3〇la、 入=、接地配線302a、302b重疊的在這些配線傳播，且 二雜路^件誤動作之問題。藉著在帶狀線路型元件内;將 在圖！r示之電路基板對於高頻雜訊 乍具有在咼頻之電路動作安定之特徵。 件靠ί的：ϊ路ί板裝載很多電路元件之情況，因電路元 近。在奸ϊ 源和受到該雜訊源影響之電路元件接 别—6況，也因插入電源配線及接地配線之帶狀線 使ΐ r局效率的濾除在電源配線及接地配線重疊之雜訊， 在高頻ϊ ϊ之帶狀線路型元件之電路基板可高密度的安事 社同頻動作之電路基板。 文衣 16所Jf載了帶狀線路型元件之疊層印刷電路基板如圖 可。在，t使用匯流排條供給各電路元件電源之構造也 央之F ^裝載之LSI之正下配置多個信號接腳，在基板中 流排:ϊ ΐΓ 兄’設置接受之基座（Pad)後，將匯 按照伽^ 土板連接。在圖16所示之實施例，在基板上叢截 、〇如3· 3V、2, 5V、1· 8V之供給電壓之電路元件，利 200409153 五、發明說明（30) 用匯流排條供給該基板電源。此外，使用了匯流排條之印 =電路基板之構造如圖丨7所示，係印刷電路基板疊層之構 造也可，係在一個基板上裝载供給不同之電源之電路元件 群’分別設置供給對應之電源之匯流排條也可。 層構造之匯流排條經由絕緣物固定於裝置，利用機架 接地連接電纜連接匯流排條之機架接地層體 地、。在圖18用立體圖表示該匯流排條例。在圖18機二接係 匯流排條，701係匯流排條固定用乙烯帶，7〇2係匯流排條 支撐件（支撐部），703係裝置框體機架接地，7〇4係機架接 地連接電缆。即用係絕緣物之匯流排條固定用乙烯帶7 〇玉 將匯流排條70 0固定於匯流排條支撐件7〇2，利用機架接地 連接電纜704連接匯流排條7〇〇之機架接地層和框體 地703。 〜丁仗 此外，在上述，以接地配線說明了和電源配線成對之 酉㈤己線，但是係負電源配線也可。此外，在上述，說明了在 ，層印刷基板3 0 3之表面安裝帶狀線路型元件之情況，但 疋在構成疊層印刷基板30 3之多層基板之中之内部之基板 表面安裝帶狀線路型元件也可得到一樣之效果。IM page 33, 200409153, description of the invention (29) Road-type components, installed on the surface of the laminated printed circuit board 3 03, 3Glb, respectively, and the original line of the strip line type electric power not shown in the figure Terminals u, 12 are connected; and strip line elements not shown in the figure == lead-out terminals 41, 42; power wiring 301a, 30 lb, and grounding ^, ^ 2 are used on the printed circuit board 303, respectively High-conductivity materials such as copper are mounted on the laminated printed circuit board 303. Many high-frequency noises generated from these circuit elements are not shown in the diagram. The power wiring 301a, input =, and ground wiring 302a, 302b overlap here. The problem of wiring propagation and misoperation of two miscellaneous circuits. By being in a strip line type component; will be in the picture! The circuit board shown by r has the characteristic of stable circuit operation at high frequencies for high-frequency noise. Relying on: The situation where many circuit components are loaded on the circuit board because the circuit elements are close. In the case of the treacherous source and the circuit components affected by the noise source—6 cases, because the strip line inserted into the power wiring and the ground wiring makes the 滤 r efficiency filter out the noise overlapping the power wiring and the ground wiring Circuit boards that can be operated at the same frequency by high-density Anshisha on circuit boards of high-frequency 线路 band-type line-type components. As shown in Figure 16, the JF 16 laminated printed circuit board on which strip-line type components are mounted. Now, the structure that uses the bus bar to supply power to each circuit element is also equipped with multiple signal pins directly under the F ^ mounted LSI, and the bus is placed in the substrate: ϊ ΐΓ Brother 'after setting the receiving base (Pad) , Connect the sink according to the ^^ soil plate. In the embodiment shown in FIG. 16, circuit elements with a supply voltage such as 3.3V, 2.5V, 1.8V, etc. are cut on the substrate. Substrate power. In addition, the structure of the printed circuit board using the busbar = circuit board is shown in Figure 丨 7. The structure of the printed circuit board stacking is also possible. The circuit element groups that supply different power supplies on one substrate are separately provided. It is also possible to supply the corresponding bus bar. The bus bar of the layer structure is fixed to the device through an insulator, and the rack ground connection cable is used to connect the rack ground layer of the bus bar. This busbar regulation is shown in a perspective view in FIG. 18. In Figure 18, the two-connected bus bar of the machine, the 701 series bus bar is fixed with vinyl tape, the 702 series bus bar support (supporting part), the 703 series device frame rack grounding, and the 704 series rack. Ground connection cable. That is, use the insulation tape to fix the bus bar with vinyl tape 〇 玉 to fix the bus bar 70 0 to the bus bar support 702, and use the rack ground connection cable 704 to connect the bus bar 700 Ground layer and frame ground 703. ~ Ding Zhuang In addition, although the ground wire is used to describe the pair of power lines with the power line, the negative power line may be used. In the above, the case where the strip-line type element is mounted on the surface of the multilayer printed circuit board 303 has been described. However, the strip-shaped line is mounted on the surface of the substrate inside the multilayer substrate constituting the multilayer printed circuit board 303. The same effect can be obtained with the type element.
在此，進一步說明用以在疊層印刷基板3 〇 3上安裝帶 元件之構造。纟實施例如圖19所示，在金屬板4〇 亡衣載▼狀線路型元件！，利用作為連接閥作用金屬1〇和 璺層印刷基板30 3上之配線之第一電極引出端子之導線架 500和在金屬板4〇所設置之第二電極引出端子取得帶狀 線路型元件和疊層印刷基板3〇3之電性連接。Here, a structure for mounting a tape component on the laminated printed circuit board 303 will be further described.纟 Example shown in Figure 19, ▼ -shaped line-type components are mounted on the metal plate 40! The strip-shaped component and the lead wire terminal 500 are used to connect the first electrode lead-out terminal of the wiring on the valve-acting metal 10 and the printed circuit board 303 and the second electrode lead-out terminal provided on the metal plate 40. Electrical connection of the laminated printed circuit board 303.
第35頁 200409153 五、發明說明（31) 置。以下詳述第一及第二電極引出端子之形狀及其安裝位 a #If，在電極引出端子之第一形態，與閥作用金屬1 0 ς二P刷基板3 〇 3作電性連接之導線架5 〇 〇如圖1 9所示， 機具Λ連接部5(η，和閥作用金屬10相連接；第一 ^ β I 、為導線架之腳之部分；及第一腳部5 0 3，和 二ς 4 ^路基板上之配線相連接。連接部5 0 1和第一腳 機_ > ί &機垂直的安裝，使用在第一 、又方向之兩端部相對於第一機體部5 0 2彼此 。又’在金屬板4〇設置第二機體部521，和 狀線路型元件之本體部51〇連接，·及第二電極引出 鈿子520，由和疊層印刷電路基板上之配 腳部522構成。和全屬妬4n夕士触如〔以 ^ 體部521係金屬Lt;;产二連接之-對第二機 狀绩改刑: 兩端部，設置於載置帶 狀線路型凡件之本體部510之上面之同一長邊侧。又， 體部Τ不是對於金屬板40垂直的連接，而安裝成隨 者通離和金屬板40之連接部自金屬板4〇之垂直方向朝長度 方向離開。即，如圖19所示，在自金屬板之寬产方 又 1—9所示之2方向）看金屬板4〇之情況，如圖2〇所又示，利; 一對第二機體部521安裝成變成「八」字形。又， 腳部522平行於金屬板40而安袭在第二機體部521。將弟-在具有這種構造之金屬板4〇上放上 =之：金：板40之未設置電極引出端子之金 度方向之另-方之端部側，w導線架黏在閥作用金们〇 200409153 五、發明說明（32) 在金屬板上裝載帶狀線路型元件， 屬板之端部所設置之第二電極 =導線架500和在金 =線路型元件。本帶狀線路型端子構造 榼製後配置於印刷電路基板上。此外圖21所不用樹脂 表示模製成型之部分，和印刷電路’，21所示之斜線部 部全部自模製封裝體之底面伸出。ς反之腳部之連接 端部分之連接部之面積取寬，電m腳部之終 刷電路基板接觸&面積比電極引出端之和印 未接觸之剖面之面積為寬，印 σ p刷電路基板 之接觸面積變寬…好的保持反和：極:丨出端子 了電極引出端子之帶狀線路型元㈣路 =時’制在斜方向設置之腳部緩和應：電=板= 20(A)表示自①方向觀察圖19所示之帶狀線路型元卜在青 視圖’ 4圖20⑻表示自②方向觀察_所示“ 狀線路型元件之情況之侧視圖。此外，在本第一形能， 一電極引出端子50 0及第二電極引出端子52〇之腳部、 522向外側變寬，但是係内側（在和第一連接部5〇1相同之 方向》又置）的也可。藉著知、這樣構成可令元件在電路基板 之安裝密度提高。 一 其次，在電極引出端子之第二形態，如圖22(A)所 不，裝在金屬板4 0之第二電極引出端子52〇之第二腳部522 和孟屬板4 0之本體部5 1 0直接連接。該第二腳部5 2 2設置成 和載置帶狀線路型元件之載置面之長度方向平行。在上述Page 35 200409153 V. Description of Invention (31). The shapes of the first and second electrode lead-out terminals and their installation positions a #If are described in detail below. In the first form of the electrode lead-out terminals, they are electrically connected to the valve-acting metal 1 0 and P brush substrate 3 〇3. As shown in FIG. 19, the frame 5 is connected to the valve Λ connection portion 5 (η, which is connected to the valve-acting metal 10; the first ^ β I is a part of the leg of the lead frame; and the first leg portion 503, It is connected to the wiring on the second circuit board. The connecting part 501 and the first machine are installed vertically, and the two ends of the first and second directions are used relative to the first body. Parts 502 are connected to each other. A second body part 521 is provided on the metal plate 40, and is connected to the main body part 51 of the linear circuit element, and the second electrode leads to the bobbin 520, and is laminated on the printed circuit board. It is composed of matching feet 522. It is all jealous 4n Xi Shi touches [with ^ body part 521 series metal Lt; The same long side of the upper surface of the main body portion 510 of the line-shaped ordinary pieces. Moreover, the body portion T is not connected vertically to the metal plate 40, but is installed so as to be separated from each other. The connecting portion of the metal plate 40 is separated from the vertical direction of the metal plate 40 in the length direction. That is, as shown in FIG. 19, the metal plate 4 is viewed from the wide production side of the metal plate and 2 directions shown in 1-9). In this case, as shown in FIG. 20 again, Lee; a pair of second body portions 521 are installed to become "eight". Further, the leg portion 522 is parallel to the metal plate 40 and is mounted on the second body portion 521. Put the brother-on the metal plate 40 with this structure = of: gold: the other side of the gold direction of the plate 40 without the electrode lead-out terminal, the w lead frame is stuck to the valve action gold 〇200409153 V. Description of the invention (32) A strip-line component is mounted on a metal plate, which is a second electrode provided at the end of the plate = lead frame 500 and gold = line-type component. This strip line type terminal structure is fabricated on a printed circuit board after fabrication. In addition, the resin not shown in Fig. 21 indicates the molded part, and the hatched portions shown in the printed circuit ', 21 all protrude from the bottom surface of the molded package. Conversely, the area of the connecting part of the connecting part of the foot is widened, and the area of the final brush circuit substrate contact & area of the electric foot is wider than the area of the cross section of the electrode lead-out which is not touched. The contact area of the substrate is widened ... good keeps the counter-polarity: pole: the strip-line type of the lead-out terminal leads the lead-out terminal type ㈣ 路 = 时 'system to ease the foot set in the oblique direction should be: electricity = board = 20 ( A) shows the strip line type element shown in FIG. 19 as viewed from the direction ① in a blue view '4 FIG. 20 ⑻ shows a side view of the case of the “line shape type element” as viewed from the direction ② as shown in FIG. 19. Formally, the foot portions 522 of the one electrode lead-out terminal 50 0 and the second electrode lead-out terminal 522 are widened to the outside, but the inside (in the same direction as the first connection portion 501) may be placed. By knowing this, the structure can increase the mounting density of the component on the circuit board. Second, the second form of the electrode lead-out terminal, as shown in Figure 22 (A), is mounted on the second electrode of the metal plate 40. The second leg portion 522 of the terminal 52 and the main body portion 5 1 0 of the Mon plate 4 0 directly Then Parallel longitudinal direction of the mounting surface of the second leg portion 522 is arranged and the mounting elements of the strip line type. In the
第37頁 200409153Page 37 200409153
^第一形態，第二電極引出端子52〇朝外側在斜方向變 寬，而在本形態因第二腳部522和金屬板40直接連接，往 外側之寬度變小，安裝密度變高。又，在本形態，藉著和 印刷電路基板上之配線令接觸之腳部儘量位於金屬之 正下，可令封裝上之安裝密度提高。又，在圖23(A)表示 對圖22(B)所示之狀態之帶狀線路型元件模製，自圖22^B) 所示之①方向觀察之情況之側視圖，在圖23(B)表示對圖 22(B)所示之狀態之帶狀線路型元件模製，自圖22(b)所示 之②方向觀察之情況之側視圖。如圖23所示，在本形態也 設計成腳之底面和模製件之底面大致相同或稍高（長）了在 高度方向充分利用。即，成為設法薄型化之構造。 其次，說明電極引出端子之第三形態。在本第三形 態，、如圖24(A)所示，將第一機體部5〇2及第二機體部521 裝成分別相對於連接部5〇1、金屬板4〇大致垂直。又，在 構造上，未具有在圖19所示之第一形態設置之腳部、 522。藉著採用這種形r，元件之形成變得容易❿且可使 金屬板及導線架之面積更小。又，因成為無腳部之構造， 往外侧之寬度變窄，安裝密度變高。又，在本形態，藉著 和印刷電路基板上之配線令接觸之腳部儘量位於金屬板4〇 之正下’ T令封裝上之安裝密度提高。χ，在圖25⑴表 不對圖24(B)所示之狀態之帶狀線路型元件模製，自圖 24(B)所示之①方向觀察之情況之侧視圖，在圖25(β)表示 對圖24(B)所不之狀態之帶狀線路型元件模製，自圖24(扪 所不之②方向觀察之情況之側視圖。如圖25所示，在本形^ In the first form, the second electrode lead-out terminal 52 is widened in an oblique direction toward the outside, and in this form, since the second leg portion 522 and the metal plate 40 are directly connected, the width toward the outside becomes smaller, and the mounting density becomes higher. In addition, in this form, by making contact with the printed circuit board so that the contacting feet are located under the metal as much as possible, the mounting density on the package can be increased. Fig. 23 (A) is a side view showing a case where the strip line type element in the state shown in Fig. 22 (B) is molded and viewed from the direction ① shown in Fig. 22 ^ B). B) A side view showing a state in which the strip-line type component in the state shown in FIG. 22 (B) is molded and viewed from the direction ② shown in FIG. 22 (b). As shown in Fig. 23, the bottom surface of the foot and the bottom surface of the molded part are also designed to be approximately the same or slightly higher (longer) in this form, and they are fully utilized in the height direction. In other words, it is a structure that has been made thinner. Next, a third embodiment of the electrode lead-out terminal will be described. In this third aspect, as shown in FIG. 24 (A), the first body portion 502 and the second body portion 521 are mounted substantially perpendicular to the connection portion 501 and the metal plate 40, respectively. In addition, the structure does not include the leg portion 522 provided in the first form shown in FIG. 19. By adopting this shape r, the formation of the element becomes easy, and the area of the metal plate and the lead frame can be made smaller. Furthermore, since it has a structure without legs, the width toward the outside becomes narrower, and the mounting density becomes higher. In addition, in this embodiment, the wiring contact with the printed circuit board allows the contacting leg portion to be located directly below the metal plate 40 as much as possible, thereby increasing the mounting density on the package. χ, in FIG. 25, a side view of a case where the strip line type component in the state shown in FIG. 24 (B) is molded is viewed from the direction ① shown in FIG. 24 (B), and is shown in FIG. 25 (β) Fig. 24 (B) shows the side view of the strip line type component in a state not shown in Fig. 24 (B), as shown in Fig. 25 (as shown in Fig. 25).
200409153 五、發明說明（34) 悲也設計成腳之底面和模製件之底面大致相同或稍高 (長），在鬲度方向充分利用。即，成為設法薄型化之構 造。 ^ 接著’說明電極引出端子之第四形態。在本第四形 恶’如圖26(A)所示，對於裝在金屬板4〇之第二電極引出 端子之第二機體部521，在金屬板4〇之長度方向之兩端部 相對於載置帶狀線路型元件之載置面之短邊在大致中央部 分設置腳部。藉著採用這種形態，可實現寬度小之小型形 =之4端子帶狀線路型元件。於是，本形態在係電路板上 成乎無女裝電路元件之面積之情況，也藉著 SIP(Single InUne Pa〇kage) , # ^ ^ g f =線路型兀件安裝，可高密度的安裝。此外，在圖”⑴ ^所示^狀態之帶狀線路型元件模製，自圖 對圖26(B)所示之狀態之帶狀線路型元 = 所示之②方向觀察之情況之側視圖。牛以自圖26(B) 此外，藉著依據以下所示之步驟製 型元件裝在疊層印刷電路基狀線路 簡化製程。 板之孟屬板4〇和導線架，可令 圖28所示之金屬板利用在兩 連接。又，如圖28所示，在美#σ又置之腳部和基材 在金屬板之長度方向之兩= = =；；金，。此外， 導線架。 ϋ 3卩同固疋之間隔配置 如圖29所示，在基材所忠壯—人ρ 斤女衣之金屬板黏接帶狀線路型 Η 第39頁 200409153200409153 V. Description of the invention (34) Sadness is also designed so that the bottom surface of the foot and the bottom surface of the molded part are approximately the same or slightly higher (long), which is fully utilized in the direction of the angle. That is, a structure that seeks to be thinner. ^ Next, a fourth embodiment of the electrode lead-out terminal will be described. In this fourth aspect, as shown in FIG. 26 (A), with respect to the second body portion 521 of the second electrode lead-out terminal mounted on the metal plate 40, the two end portions of the metal plate 40 in the longitudinal direction are opposite to each other. The short side of the mounting surface on which the strip line type component is mounted is provided with a leg portion at a substantially central portion. By adopting this form, it is possible to realize a small-sized, 4-terminal strip line type device having a small width. Therefore, this form has an area of almost no women's circuit components on the circuit board. It is also installed by SIP (Single InUne Pa〇kage), # ^ ^ g f = line type element, which can be installed with high density. In addition, in the figure "元件 ^", the strip line type element is molded, and the side view of the strip line type element in the state shown in Fig. 26 (B) = in the direction indicated by ② shown in the figure From Figure 26 (B) In addition, the manufacturing process is simplified by forming components on the laminated printed circuit base circuit according to the steps shown below. The board of the board 40 and the lead frame can be made as shown in Figure 28. The metal plate shown in the figure is used in two connections. Also, as shown in FIG. 28, the feet and the substrate in the beauty # σ are placed in two directions of the metal plate in the length direction of the metal plate. In addition, the lead frame. ϋ 3 卩 The interval configuration with the solid 疋 is shown in Figure 29. It is loyal to the base material—the metal plate of the female clothes is bonded to the strip line type. Page 39 200409153
元件後， 在距離基 件之腳部 斷後除去 樹脂毛邊 像這樣在 狀線路型 線路型元 自3 0所示 之情況之 狀線路型 視圖。 用樹脂 材既定 ，完成 在電極 。關於 連接了 元件後 件之製 之①方 側視圖 元件模 將所黏 之長度 圖3 0所 引出端 此步驟 多片金 ，切斷 程，提 向觀察 ，在圖 製，自 接之帶狀線路型元件模製。然後， 之位置切斷所模製之帶狀線路型元 示之帶狀線路型元件。此外，在切 子50 0、520之表面或間隙所附著之 ’可沿用半導體之組立製程。藉著 屬板40和導線架之組之基材黏接帶 ，極引出端子之腳部，可簡化帶狀 高量產性。此外，在圖31(A)表示 圖3 0所示之狀態之帶狀線路型元件 31 (B)表示對圖3〇所示之狀態之帶 圖30所示之②方向觀察之情況之側After the component, remove the resin burrs after breaking away from the foot of the base. This is the line-type view of the line-type line-type element from 30 as shown in this figure. The resin material is used to complete the electrode. Regarding the system of connecting the rear parts of the component ① side view of the component die will stick the length shown in Figure 30. This step has multiple pieces of gold, cutting process, upward observation, in the drawing, self-connected strip line Type element molding. Then, the position cuts off the strip line type element shown by the molded strip line type element. In addition, the semiconductor substrate assembly process can be used for the adhesion on the surfaces or gaps of the chips 50, 520. By using the base material adhesive tape of the plate 40 and the lead frame, the legs of the terminal are pulled out, which can simplify the strip-shaped high-volume production. In addition, FIG. 31 (A) is a side view of the strip line type element shown in FIG. 30, and FIG. 31 (B) is a side view of the tape shown in FIG. 30 as viewed in the direction of ② shown in FIG. 30.
此外，在此，舉例說明在帶狀線路型元件之兩端分別 設置一個第一及第二電極引出端子之構造，但是在帶狀線 路型元件之兩端反自設置多個電極引出端子5〇〇及52〇也 可。例如，如圖32所示，在閥作用金屬之長度方向之兩端 部分別設置一個電極引出端子5 0 0，在金屬板4〇之長度方 向及寬度方向之兩端部（即四角）分別設置第二電極引出端 子之第二機體部521也可。 又，如圖33所示，在金屬板4〇之四角分別設置第二電 極引出端子之第二機體部5 2 1，在構成帶狀線路型元件1之 閥作用金屬之長度方向之兩端部分別設置電極引出端子 5 0 0也可。 此外，如圖34或35所示，在設置多個電極引出端子之In addition, here is an example of a structure in which a first and a second electrode lead-out terminal are respectively provided at both ends of the strip line type element, but a plurality of electrode lead-out terminals 5 are provided at both ends of the strip line type element. 〇 and 52〇 are also available. For example, as shown in FIG. 32, an electrode lead-out terminal 500 is provided at both ends in the length direction of the valve-acting metal, and is provided at both ends (that is, four corners) of the metal plate 40 in the length direction and the width direction. The second body portion 521 of the second electrode lead-out terminal may be used. Further, as shown in FIG. 33, second body portions 5 2 1 having second electrode lead-out terminals are respectively provided at four corners of the metal plate 40, and at both ends in the longitudinal direction of the valve-acting metal constituting the strip-line type element 1 Do not set the electrode lead-out terminal 5 0 0. In addition, as shown in FIG. 34 or 35,
第40頁 200409153 五、發明說明（36) 情況，將電極引出端子配置成向帶狀線路型元件之寬度方 向突出也可。藉著在帶狀線路型元件之寬度方向配置電極 引出端子，可令對於電路板之安裝強度提高。在此，表示 幾種在帶狀線路型元件之端部配置2個電極引出端子之構 造’但是將電極引出端子配置3個以上當然也可。 又，在此表示將帶狀線路型元件内之線路安裝成相對 於電路板平行之例子，但是若變更第一及第二電極引出端 子500及520之形狀，也可適用於將帶狀線路型元件内之 線路安裝成相對於電路板垂直（即縱向安裝）之情況。Page 40 200409153 V. Description of the invention (36) In the case of arranging the electrode lead-out terminal to protrude in the width direction of the strip line type component. By arranging the electrode lead-out terminals in the width direction of the strip line type component, the mounting strength to the circuit board can be improved. Here, there are shown several configurations in which two electrode lead-out terminals are arranged at the ends of a strip-line type element. However, it is of course possible to arrange three or more electrode lead-out terminals. Here, an example in which the wiring in the strip-line type component is mounted parallel to the circuit board is shown. However, if the shapes of the first and second electrode lead-out terminals 500 and 520 are changed, it can also be applied to the strip-line type. The circuit inside the component is installed perpendicular to the circuit board (that is, installed vertically).
I 又，以上說明了將實施例卜丨3之帶狀線路型元件 金屬板40上後裝在印刷電路基板3〇3上之構造，但、 之線路型元件未限定為只有這些，只要係具 t 特徵之低阻抗線路型元件都可。 ^ 不之 =自解耗合對象之頻帶之電磁波看成、線 呈 係對象頻率之電磁波之波二有效線路長） ②自發生電磁波之電路看之對於線路 阻抗取充分低之值。 1疋件之两頻之 關於①，一般可說傳送線路在寬 之特性阻抗。在式⑴表示帶狀線路型元成固定 Zy。在可忽略電阻值R和電導〇之區域之特性阻抗 無關的由L和c決；t ^設計每單位長度阻抗和頻率 位長度之靜電電容C大之傳送線路，可實電感L小、每單 小、在寬頻率範圍特性阻抗小之元件。、頻率相依性I. In the above, the structure in which the strip-line type component metal plate 40 of Example 3 is mounted on the printed circuit board 30 is described above, but the line-type components are not limited to these, as long as the components are Low-impedance line-type components with t characteristics are available. ^ No = the electromagnetic wave in the frequency band of the self-consumption target is regarded as the line, and the wave length of the electromagnetic wave of the target frequency is the effective line length) ② From the circuit that generates the electromagnetic wave, the impedance of the line should be sufficiently low. About the two frequencies of 1 file About ①, generally speaking, the transmission line has a wide characteristic impedance. In formula (i), the strip line element becomes fixed Zy. In the region where the resistance value R and the conductance 0 can be ignored, the characteristic impedance is independent of L and c; t ^ Design a transmission line with a large electrostatic capacitance C per unit length impedance and frequency bit length. Small, small characteristic impedance in a wide frequency range. Frequency dependence
200409153 五、發明說明（37) lR + j ω\,._ iL V G+ j ωΟίΟ 其次，考察②。線路元件之阻抗如圖36所示，可用固 定之特性阻抗Ζ0之電路評價。線路元件之特性如圖3 6所 示以自埠1在埠2之透射特性表示。評價本電路之反射係 數Γ和透射係數Τ係散射矩陣[s]之元素sli*S2i，用下式 表示。 [S ]=. 2 Zy+ 1 -1 2 Zy 2 之y - 1 (2) 但，〜=¾ -綠Ϊ :弋表示線路元件之輸出入線路之特性阻抗，Zy是 7線路兀件之阻抗。因此，若係z。》Zy ’ Γ」；、τ“ 如在上傳^路之入口附近令輸入之高頻電磁波反射 成只：分；；計算線路之特性阻抗，〗 定值，在成分決定之值，因相對於頻率信 化。 h "發生頻率所引起之解耦合特性之劣， 心.:3上==:之^射係數τ之矩陣m之元* 射率和頻率之關係目。、“之！37係表示解耦合元件之， 200409153 五、發明說明（38) 路連接電容器後作為解耦合 — 係令電源分配電路之線路本身 h况之透射係數，實線 元件應用之情況之透射係數身；f卜配而：為解輕合 (dB)，橫軸表示頻率（GHz)。 縱軸表不透射率 比較將電容器和電源八两 射率和令電源分配電路心；：：：之線路連接之情況之透 透射率時，因令線路本；具有配線電容之情況之 在解輕合特性（即，據除率高電容的透射率比較小， 於是，以往使用電容哭；隹一 設為適當值後在線路本身奸 〜 （電合）、R(電阻） 實現。 路本身插人令具有解賴合特性之元件可 a在用以得到所要之解耦合特性之參數上有L、c、R， 但是因L·或R增加時發生邏輯電， 大等問題，需要藉著調整C調整解：二，生電源電壓變動增 欠，說明在+導體封裝體裝載上述之實施例卜 f狀線路型元件時之構造。 之 如圖38所示，在由絕緣物質構成之基材405上分別配 置帶狀線路型元件和半導體晶片40 3。在基材405所設置之 連接接腳之電源配線4 〇 1 a、接地配線4 〇 2 a和半導體晶片侧 之電源=線401b、接地配線4〇2b之間配置上述之實施例 1〜lj之帶狀線路型元件，在帶狀線路型元件之陽極電極引 出‘子11、1 2連接半導體晶片之電源配線4 〇 1 b和連接接腳 之電源配線4 01 a。又，在帶狀線路型元件之陰極電極引出200409153 V. Description of the invention (37) lR + j ω \, ._ iL V G + j ωΟίΟ Second, consider ②. The impedance of the line components is shown in Figure 36, which can be evaluated by a circuit with a fixed characteristic impedance Z0. The characteristics of the circuit components are shown in Fig. 36 as the transmission characteristics from port 1 to port 2. The reflection coefficient Γ and transmission coefficient T of the circuit are evaluated as sli * S2i of the scattering matrix [s], and are expressed by the following formula. [S] =. 2 Zy + 1 -1 2 Zy 2 of y-1 (2) However, ~ = ¾ -Green Ϊ: 弋 represents the characteristic impedance of the input and output lines of the line components, and Zy is the impedance of the 7 line components. Therefore, if it is z. 》 Zy 'Γ ”;, τ“ If the input high-frequency electromagnetic wave is reflected near the entrance of the uploading route: only; minute; Calculate the characteristic impedance of the line, 〖Fixed value, the value determined by the component, because it is relative to the frequency The inferiority of the decoupling characteristics caused by the frequency of occurrence, heart.:3 ==: of ^ the element of the matrix m of the radiance coefficient τ * the relationship between the emissivity and frequency. 37 is the decoupling element, 200409153 V. Description of the invention (38) The circuit is used as decoupling after the capacitor is connected — it is the transmission coefficient of the power distribution circuit line h, and the transmission coefficient of the solid line element application; f For example, in order to solve the light coupling (dB), the horizontal axis represents the frequency (GHz). The vertical axis shows the transmittance comparison. The capacitor and the power supply have two transmittances and the power distribution circuit core; ::: When the line transmittance in the case of line connection is caused by the line book; the case with wiring capacitance is lighter. The combination characteristics (that is, the high transmittance of the capacitor is relatively small. Therefore, capacitors have been used in the past; the first time is set to an appropriate value on the line itself ~ (coupling), R (resistance). The road itself is inserted Let the element with uncoupling characteristics have a, L, c, and R in the parameters used to obtain the desired decoupling characteristics, but due to the increase in L · or R, logic problems occur, and other problems need to be adjusted by C Adjustment solution: Second, increase or decrease in power supply voltage fluctuations, explain the structure when the + -conductor package is loaded with the f-shaped line element of the above embodiment. As shown in FIG. 38, on the base material 405 made of an insulating substance The strip line type element and the semiconductor wafer 40 are arranged separately. The power supply wiring 4 of the connection pins provided on the base material 405 〇1 a, the ground wiring 4 〇2 a, and the power supply of the semiconductor wafer side = line 401b, ground wiring 4 〇2b configuration In the strip line type device of Examples 1 to 1j, the sub-lines 11 and 12 of the anode electrode of the strip line type device are connected to the power supply wiring 4 〇1 b of the semiconductor wafer and the power supply wiring 4 01 a to the connecting pin. In addition, the cathode electrode of the strip line type device is led out.
I mI m
第43頁 200409153 五、發明說明（39) 和連接接腳 之 =子41 42連接半導體晶片之接地配線4 〇2b 接地配線402a。 產生之兩頻雜 在這些配線傳 著在半導體封 雜訊’圖3 8所 ’在高頻之電 明和電源配線 自在基材405上所裝載之半導體晶片4〇3 在電源配線401b、接地配線402b重疊後， :躲具有令電路元件誤動作之問題，但是藉 2Ϊ 5人之帶狀線路型元件之内部濾除該 體裝置對於高頻雜訊難發生誤動作 料，在上述，以接地配線說 成對之接地^線’但是係負電源配線也可。 。但，未限定 行各種變形後 上述之實施例係本發明之適合之實施例 實施：在不超出本發明之主旨之範圍内可進 利用性 之構件構成，^ = ^ s本發明之帶狀線路型元件由以下 質層，配置成辆=用至屬，具有電介質體皮膜；導電性物 圍；—對電極7該電介質體皮膜包含閥作用金屬之周 置。藉著㈣^設置於導電性物質層之不同之位 狀線路^ 1 構造，因視在電介質損耗變大，可將帶 生之電；^ = π之特性阻抗設成充分低，可防止自雜訊源產 <電磁波侵入電源分配電路側。 έ /在閥作用金屬上使用相對於其剖面尺寸4倍以上 、'、田又形狀之金屬之情況，可令發揮更良好之雜訊降低效Page 43 200409153 V. Description of the invention (39) and the connection pins = sub 41 42 The ground wiring 4 connecting to the semiconductor wafer 〇 2b The ground wiring 402 a. The two-frequency noise generated in these wirings is transmitted in the semiconductor sealing noise, as shown in Figure 38, at high frequency, and the power wiring is from the semiconductor wafer 403 mounted on the substrate 405. The power wiring 401b and the ground wiring 402b After the overlap, it avoids the problem of malfunctioning of circuit components, but it is difficult to cause malfunction of high-frequency noise by filtering the inside of a strip line type component of 2 to 5 persons. In the above, the ground wiring is said to be a pair Ground wire, but negative power wiring is also possible. . However, it is not limited that the above-mentioned embodiment is a suitable embodiment of the present invention after various modifications are performed: the component structure that can be used is within the scope of the subject of the present invention, ^ = ^ s The type element is composed of the following mass layers, configured as a vehicle = used genus, with a dielectric body film; a conductive body surrounding;-the counter electrode 7 The dielectric body film contains a valve-acting metal perimeter. With the structure of 位 ^ placed on the conductive material layer with different configuration ^ 1 structure, since the apparent dielectric loss becomes larger, the electrification can be carried out; the characteristic impedance of ^ = π is set sufficiently low to prevent self-inclusion The source < electromagnetic wave invades the power distribution circuit side. / When using a metal with a shape that is more than 4 times its cross-sectional size on the valve-acting metal, a better noise reduction effect can be achieved.
第44頁 200409153Page 44 200409153
使得只是浸 層之溶液就 實現可避開 又，藉 ?丨出端子和 導電性物質 進行位置對 線架和閥作 電極引出端 步驟可容易 作用金屬之兩端向一方方屈曲或彎曲， 極形成用之溶液或用以形成導電性材料 的製造帶狀線路型元件，而且可容易的 件之安裝形狀。 夕種基材上一體形成了設置了第一電極 二電極引出端子之導線架之基材和在至 製程為止之製程得到之帶狀線路型元件 接’使得導電性物質層和金屬構件及導 接觸，自基材間隔既定之距離切斷第一 線架’製成f狀線路型元件。利用這種 由4端子構造構成之帶狀線路型元件。 著令閥 泡於陽 可簡單 其他元 著將在 成為第 層形成 準後黏 用金屬 子及導 的製造It can be avoided only by the solution of the immersion layer. The terminal and conductive material can be used to position the wire frame and the valve as the electrode lead-out step. The two ends of the metal can be easily bent or bent to one side. The solution can be used to form a strip-line type element that can be used to form a conductive material, and the shape can be easily installed. The base material of the lead frame provided with the first electrode and the two electrode lead-out terminals is integrally formed on the base material, and the strip line type component obtained in the process up to the process is connected, so that the conductive material layer and the metal member and the conductive contact are in contact with each other. The first wire frame is cut off at a predetermined distance from the substrate to make an f-shaped line-type element. This type of strip-line component is used, which consists of a 4-terminal structure. It is easy to make the valve soaked in the sun. Other elements will be formed after the first layer is formed.
第45頁 200409153 圖式簡單說明 一~" 五、【圖式簡單說明】 圖1係用以說明自構成L s I之切換元件產生之電力對電 源分配配線之影響之圖。 圖2係表示以往之表面組裝型濾波器之一例之剖面 圖。 圖3係表示本發明之實施例之帶狀線路型元件之外觀 形狀之立體圖。 圖4係表示圖3所示a - A，剖面之剖面圖。 圖5係用以說明鋁片之靜電電容之量測方法之圖。 圖6係表示本發明之實施例2之帶狀線路型元件之剖面 圖。 圖7係表示本發明之實施例3之帶狀線路型元件之剖面 圖。 圖8係表示本發明之實施例4之帶狀線路型元件之剖面 圖0 圖9係表示本發明之實施例5之帶狀線路型元件之剖面 圖。 ， 圖1 〇係表示本發明之實施例6之帶狀線路型元件之剖 面圖。Page 45 200409153 Brief description of the drawings I ~ " 5. Brief description of the drawings Figure 1 is a diagram for explaining the influence of the power generated by the switching elements constituting L s I on the power distribution wiring. Fig. 2 is a sectional view showing an example of a conventional surface-mounted filter. Fig. 3 is a perspective view showing an appearance shape of a strip-line type element according to an embodiment of the present invention. Fig. 4 is a cross-sectional view showing a-A, cross section shown in Fig. 3. FIG. 5 is a diagram for explaining a method for measuring the electrostatic capacitance of an aluminum sheet. Fig. 6 is a sectional view showing a strip-line type device according to a second embodiment of the present invention. Fig. 7 is a sectional view showing a strip-line type device according to a third embodiment of the present invention. Fig. 8 is a sectional view showing a strip-line type device according to a fourth embodiment of the present invention. Fig. 9 is a sectional view showing a strip-line type device according to the fifth embodiment of the present invention. FIG. 10 is a cross-sectional view showing a strip line type device according to a sixth embodiment of the present invention.
圖11係表示本發明之實施例7之帶狀線路型元件之剖 面圖。 圖1 2係表示本發明之實施例8之帶狀線路型元件之 面圖。 σ 圖13係表示本發明之實施例9之帶狀線路型元件之剖Fig. 11 is a sectional view showing a strip-line type element according to a seventh embodiment of the present invention. Fig. 12 is a plan view showing a strip line type device according to an eighth embodiment of the present invention. σ FIG. 13 is a cross-sectional view showing a strip line type device according to Embodiment 9 of the present invention
200409153 圖式簡單說明 面圖。 圖1 4係在圖1 3之B - B ’線之剖面圖。 圖1 5係表示將本發明之帶狀線路型元件裝載於疊房 刷電路基板之情況之構造之立體圖。 9 I7 圖1M系表示設置匯流排條將帶狀線路型元 層印刷電路基板之情況之構造圖。 ，戰於豐 圖1 7係圖1 6所示疊層印刷電路基板之剖面圖。 圖1 8係表示匯流排條之構造圖。 圖19係表示將帶狀線路型元件裝載於疊層印刷電 板k形成之電極引出端子之第一形態圖。 基 圖20(A)〜（B)係表示自元件之長度方向及 察圖19所示之帶狀線路型元件之側視圖。 万向規 圖21係表示利用樹脂將圖19所示之帶狀線 製之外觀形狀圖。 I凡件拉 圖22(A)〜（B)係表示將帶狀線路型元件裝載於遇 刷電路基板時形成之電極引出端子之第二形態圖^層印 圖23(A)〜（B)係表示自元件之長度方向及寬度 察圖22所示之帶狀線路型元件之側視圖。 又σ硯 圖24(A)〜（Β)係表示將帶狀線路型元件裝載於最 刷電路基板時形成之電極引出端子之第三形態圖、。且層印 圖25(A)〜（Β)係表示自元件之長度方向及寬度方 察圖24所示之帶狀線路型元件之側視圖。 。硯 圖26(A)〜（Β)係表示將帶狀線路型元件裝載於最 刷電路基板時形成之電極引出端子之第四形態圖。ιΡ200409153 Schematic description Fig. 14 is a sectional view taken along the line B-B 'in Fig. 13. Fig. 15 is a perspective view showing a structure of a case where the strip-line type component of the present invention is mounted on a laminated circuit board. 9 I7 Fig. 1M is a structural diagram showing a case where a bus bar is used to form a strip line type element-layer printed circuit board. Fig. 17 is a sectional view of the laminated printed circuit board shown in Fig. 16. Fig. 18 is a structural diagram showing a bus bar. Fig. 19 is a diagram showing a first embodiment of an electrode lead-out terminal formed by mounting a strip-line type component on a laminated printed circuit board k. Figs. 20 (A) to (B) are side views showing the longitudinal direction of the element and the strip-line type element shown in Fig. 19. Gimbal Figure 21 is a diagram showing the appearance of a strip line shown in Figure 19 using a resin. Figure 22 (A) ~ (B) shows the second form of the electrode lead-out terminal formed when the strip-line type component is mounted on the circuit board when it is brushed. ^ Layer prints 23 (A) ~ (B) FIG. 22 is a side view showing a strip line type component shown in FIG. 22 from the longitudinal direction and width of the component. Figs. 24 (A) to (B) are diagrams showing the third configuration of the electrode lead-out terminal formed when the strip-line type component is mounted on the most printed circuit board. In addition, the overprinted figures 25 (A) to (B) are side views of the strip line type element shown in FIG. 24 when the length direction and width of the element are shown. .砚 Figs. 26 (A) to (B) are diagrams showing the fourth configuration of the electrode lead-out terminal formed when the strip-line type component is mounted on the most printed circuit board. ιΡ
第47頁 200409153 圖式簡單說明 察s=u)之(:)Λ表示自元件之長度方向及寬度方向觀 家圖26所不之▼狀線路型元件之侧梘圖。 ㈣，ί示為了形成帶狀線路型元件而在基材上連續 、連接夕個金屬板和導線架之狀態圖。 圖29係表示在圖^ , 德用掛日y制士 8所不之基材上黏貼帶狀線路型元件 後用树月曰权衣日守之外觀形狀圖。 斷腳：二：ί:Ϊ接金屬板和導線架後按照既定之長度切 畊腳之可狀線路型疋件之外觀形狀圖。 突圖3圖Ο3，)二Β)/系表示自元件之長度方向及寬度方向觀 H 3 (I 線路型元件之情況之構造^ 圖3 2 (A )〜（B )係表不將第二電極 帶狀線路型元件之構造圖。 弓丨出鈿子5又成夕條之 多條係表示將第一及第二電極引出端子設成 夕條之▼狀線路型元件之構造圖。 圖34(A)〜（Β)係表示在寬度方向引出 子之帶狀線路型元件之構造圖。 電★引出為 圖35(A)〜（Β)係表示在寬度方向引出 引出端子之帶狀線路型元件之構造圖。 及第一電極 圖3 6係用以計算在線路之反射乂 等價電路圖。 ’、Γ和透射係數丁之 圖37係表示解耦合元件之透射率和頻 圖38係將本發明之帶狀線路型裝 導二。 體之情況之立體圖。 什衷戟於+導體封裝 200409153 圖式簡單說明 元件符號說明： 1〜帶狀線路型元件 2、 2A、2B〜第一電極引出端子（端子） 3、 3A、3B〜第二電極引出端子（端子） 1 0〜閥作用金屬 11、12〜第一電極引出端子 20〜電介質體皮膜 30〜導電性物質層 3 1〜導電性高分子層 3 2〜導電性炭膠層 3 3〜銀膠 4 0〜金屬板 41、42〜第二電極引出端子 6 0〜絕緣物質 7 0〜印刷電路基板 7 1 a、71 b〜正極電源配線 7 4 a、7 4 b〜負極電源配線 7 9〜絕緣層 80〜半導體封裝體 8 1 a、7 8 b〜正極電源配線 8 4 a、8 4 b〜負極電源配線 8 5〜半導體晶片 8 6〜連接腳 8 9〜絕緣層Page 47 200409153 Brief description of the diagram Check s = u) (:) Λ represents the side view of the ▼ -shaped line-type component, which is not shown in Figure 26, as viewed from the length and width directions of the component. Alas, the state diagram of the continuous connection of a metal plate and a lead frame on a substrate in order to form a strip-line type element. FIG. 29 is a diagram showing the appearance and shape of a tape-line-type component after a tape-shaped component is pasted on a substrate of FIG. Broken foot: Two: ί: After connecting the metal plate and the lead frame, cut out the shape of the shapeable line-shaped piece of the foot according to the predetermined length. Figure 3, Figure 03, (2) B) / shows the structure of the component in the length and width directions H 3 (I line type component structure) Figure 3 2 (A) ~ (B) is the second The structure diagram of the electrode strip line type element. The multiple lines of the bow 5 and the stripe 5 show the structure of the ▼ line type element with the first and second electrode lead-out terminals set as the line. Figure 34 (A) ~ (B) are the structural diagrams of the strip-line type components that lead out in the width direction. Electrical ★ Extensions are shown in Figure 35 (A) ~ (B) are the strip-line type that lead out the terminals in the width direction. The structure diagram of the element and the first electrode figure 36 are the equivalent circuit diagrams used to calculate the reflection 在 on the line. Figure 37 shows the transmittance and frequency diagram of the decoupling element. The invention of the strip-line type mounting guide 2. A perspective view of the body. It is a good idea + conductor package 200409153 The diagram briefly explains the component symbol description: 1 ~ strip-line type component 2, 2A, 2B ~ the first electrode lead-out terminal (Terminals) 3, 3A, 3B ~ Second electrode lead-out terminals (Terminals) 1 0 ~ Valve operation Metal 11, 12 ~ First electrode lead-out terminal 20 ~ Dielectric body film 30 ~ Conductive material layer 3 1 ~ Conductive polymer layer 3 2 ~ Conductive carbon glue layer 3 3 ~ Silver glue 4 0 ~ Metal plates 41, 42 ~ Second electrode lead-out terminal 6 0 ~ Insulating substance 7 0 ~ Printed circuit board 7 1 a, 71 b ~ Positive power supply wiring 7 4 a, 7 4 b ~ Negative power supply wiring 7 9 ~ Insulation layer 80 ~ Semiconductor package 8 1 a, 7 8 b ~ Positive power supply wiring 8 4 a, 8 4 b ~ Negative power supply wiring 8 5 ~ Semiconductor wafer 8 6 ~ Connection pin 8 9 ~ Insulation layer
第49頁 200409153 圖式簡單說明 110〜第一電介質體片 111〜第一内部導體 11 2〜第二内部導體 11 5〜蛇行導體 120〜第二電介質體片 123、124〜在電氣上絕緣之間隔 1 2 5〜接地導體 130〜第三電介質體片 1 5 1〜第一信號用電極 152〜第二信號用電極 iP.49 200409153 Schematic illustration of 110 to first dielectric body sheet 111 to first inner conductor 11 2 to second inner conductor 11 5 to meander conductor 120 to second dielectric body sheet 123, 124 to electrically insulated intervals 1 2 5 to ground conductor 130 to third dielectric body sheet 1 5 1 to first signal electrode 152 to second signal electrode i
第50頁Page 50
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002259309 | 2002-09-04 | ||
| JP2003045089 | 2003-02-21 |
| Publication Number | Publication Date |
|---|---|
| TW200409153Atrue TW200409153A (en) | 2004-06-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092124127ATW200409153A (en) | 2002-09-04 | 2003-09-01 | Strip line element, printed circuit board carrying member, circuit board, semiconductor package and method for forming same |
| Country | Link |
|---|---|
| US (2) | US7315226B2 (en) |
| JP (1) | JPWO2004023597A1 (en) |
| TW (1) | TW200409153A (en) |
| WO (1) | WO2004023597A1 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI402640B (en)* | 2006-06-03 | 2013-07-21 | Electro Scient Ind Inc | Method and apparatus for automatically processing multiple applications in a predetermined order to affect multi-application sequencing |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100696205B1 (en)* | 2005-08-26 | 2007-03-20 | 한국전자통신연구원 | Optical Modules and Optical Module Packages |
| JP4667214B2 (en)* | 2005-11-18 | 2011-04-06 | Ｎｅｃトーキン株式会社 | Bottom electrode type solid electrolytic capacitor |
| JP4912324B2 (en)* | 2005-12-26 | 2012-04-11 | 三洋電機株式会社 | Electrical circuit device |
| WO2007086210A1 (en)* | 2006-01-25 | 2007-08-02 | Nec Corporation | Multilayer strip line capacitive element |
| WO2008108350A1 (en)* | 2007-03-08 | 2008-09-12 | Nec Corporation | Capacitance element, printed circuit board, semiconductor package, and semiconductor circuit |
| US8493744B2 (en)* | 2007-04-03 | 2013-07-23 | Tdk Corporation | Surface mount devices with minimum lead inductance and methods of manufacturing the same |
| JP2009065059A (en)* | 2007-09-07 | 2009-03-26 | Nippon Chemicon Corp | Solid electrolytic capacitor and connection structure for solid electrolytic capacitor to mounting substrate |
| JP4952456B2 (en)* | 2007-09-07 | 2012-06-13 | 日本ケミコン株式会社 | Connection structure of solid electrolytic capacitor to mounting board |
| JP2009070972A (en)* | 2007-09-12 | 2009-04-02 | Nippon Chemicon Corp | Structure for connecting capacitor to mounting board |
| US7999388B2 (en)* | 2007-09-24 | 2011-08-16 | Research Triangle Institute | Preventing breakage of long metal signal conductors on semiconductor substrates |
| JP5211909B2 (en)* | 2008-07-22 | 2013-06-12 | 富士通株式会社 | Leadframe design support device, leadframe design support method, and leadframe design support program |
| TWI347810B (en)* | 2008-10-03 | 2011-08-21 | Po Ju Chou | A method for manufacturing a flexible pcb and the structure of the flexible pcb |
| US7829390B2 (en)* | 2008-11-20 | 2010-11-09 | Azurewave Technologies, Inc. | Packaging structure of SIP and a manufacturing method thereof |
| JP2010177514A (en)* | 2009-01-30 | 2010-08-12 | Tdk Corp | Multilayer electrolytic capacitor and method for manufacturing the same |
| US8212634B2 (en)* | 2009-06-04 | 2012-07-03 | International Business Machines Corporation | Vertical coplanar waveguide with tunable characteristic impedance design structure and method of fabricating the same |
| US9760885B1 (en) | 2010-03-23 | 2017-09-12 | Amazon Technologies, Inc. | Hierarchical device relationships for geolocation-based transactions |
| JP5796195B2 (en)* | 2011-01-12 | 2015-10-21 | パナソニックＩｐマネジメント株式会社 | Solid electrolytic capacitor |
| JP5734075B2 (en)* | 2011-04-21 | 2015-06-10 | Ｎｅｃトーキン株式会社 | Solid electrolytic capacitor |
| US9965768B1 (en) | 2011-05-19 | 2018-05-08 | Amazon Technologies, Inc. | Location-based mobile advertising |
| US10084310B1 (en)* | 2016-02-08 | 2018-09-25 | National Technology & Engineering Solutions Of Sandia, Llc | Low-inductance direct current power bus |
| JP6710085B2 (en) | 2016-03-31 | 2020-06-17 | 株式会社村田製作所 | Solid electrolytic capacitor |
| JP6925577B2 (en)* | 2016-03-31 | 2021-08-25 | 日本蓄電器工業株式会社 | Solid electrolytic capacitors |
| JP6790628B2 (en)* | 2016-09-10 | 2020-11-25 | 株式会社村田製作所 | Solid electrolytic capacitors and their manufacturing methods |
| WO2018051520A1 (en)* | 2016-09-16 | 2018-03-22 | 日本蓄電器工業株式会社 | Electrode member for electrolytic capacitor and electrolytic capacitor |
| CN109716469B (en) | 2016-09-16 | 2021-06-04 | 日本蓄电器工业株式会社 | Electrode parts for electrolytic capacitors and electrolytic capacitors |
| WO2018051522A1 (en)* | 2016-09-16 | 2018-03-22 | 日本蓄電器工業株式会社 | Three-dimensional structure |
| TWI715962B (en)* | 2018-04-06 | 2021-01-11 | 韓國科學技術院 | Waveguide for transmission of electromagnetic wave signals |
| CN111446607B (en)* | 2020-05-20 | 2024-04-30 | 中车长春轨道客车股份有限公司 | Multifunctional processing device for line number pipe |
| JP7028481B2 (en)* | 2020-12-28 | 2022-03-02 | 日本蓄電器工業株式会社 | Electrode members for electrolytic capacitors and electrolytic capacitors |
| CN114994962B (en)* | 2022-06-14 | 2025-09-23 | Nano科技(北京)有限公司 | Electrode transmission line and silicon-based electro-optical modulator including the same |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59132629U (en)* | 1983-02-25 | 1984-09-05 | 日本電気株式会社 | solid electrolytic capacitor |
| JP2631896B2 (en) | 1989-06-30 | 1997-07-16 | 日東電工株式会社 | Solid electrolytic capacitor and method of manufacturing the same |
| JP2640866B2 (en)* | 1989-11-28 | 1997-08-13 | マルコン電子株式会社 | Method for manufacturing solid electrolytic capacitor |
| JPH0456445A (en) | 1990-06-25 | 1992-02-24 | Mitsubishi Electric Corp | Test system for network system |
| JPH0653046A (en) | 1992-07-27 | 1994-02-25 | Mitsubishi Materials Corp | Noise filter |
| US5500629A (en)* | 1993-09-10 | 1996-03-19 | Meyer Dennis R | Noise suppressor |
| JP2761377B2 (en)* | 1995-08-30 | 1998-06-04 | 株式会社移動体通信先端技術研究所 | coaxial cable |
| JP3056079B2 (en)* | 1996-07-30 | 2000-06-26 | 富山日本電気株式会社 | Chip type solid electrolytic capacitor |
| JP3637163B2 (en) | 1996-10-01 | 2005-04-13 | 本田技研工業株式会社 | Energy storage power supply |
| JP3206735B2 (en) | 1998-01-29 | 2001-09-10 | ティーディーケイ株式会社 | Ceramic capacitors |
| EP0929087B1 (en)* | 1998-01-07 | 2007-05-09 | TDK Corporation | Ceramic capacitor |
| JP2000150304A (en)* | 1998-11-13 | 2000-05-30 | Pfu Ltd | Structure of surface mount electronic components and capacitors |
| JP3267274B2 (en) | 1999-08-13 | 2002-03-18 | 日本電気株式会社 | Multilayer printed circuit board |
| JP3232562B2 (en) | 1999-10-22 | 2001-11-26 | 日本電気株式会社 | Electromagnetic interference suppression component and electromagnetic interference suppression circuit |
| JP2001223140A (en)* | 2000-02-08 | 2001-08-17 | Nippon Chemicon Corp | Tantalum solid electrolytic capacitor and method of manufacturing it |
| TW516054B (en)* | 2000-05-26 | 2003-01-01 | Matsushita Electric Industrial Co Ltd | Solid electrolytic capacitor |
| JP3856671B2 (en) | 2000-08-30 | 2006-12-13 | Ｎｅｃトーキン株式会社 | Distributed noise filter |
| TW499793B (en)* | 2000-08-30 | 2002-08-21 | Nec Tokin Corp | Distributed constant type noise filter |
| JP2002184651A (en)* | 2000-09-29 | 2002-06-28 | Nippon Chemicon Corp | Method of manufacturing chip-type solid electrolytic capacitor |
| JP2002335107A (en) | 2001-05-08 | 2002-11-22 | Nec Corp | Transmission line type component |
| JP2003101311A (en) | 2001-09-20 | 2003-04-04 | Nec Corp | Shielded strip line type element |
| TWI279080B (en)* | 2001-09-20 | 2007-04-11 | Nec Corp | Shielded strip line device and method of manufacture thereof |
| JP3674693B2 (en)* | 2001-10-09 | 2005-07-20 | 日本電気株式会社 | Shield stripline type element and manufacturing method thereof |
| JP4084605B2 (en)* | 2002-05-31 | 2008-04-30 | Ｎｅｃトーキン株式会社 | Transmission line type noise filter |
| JP3756129B2 (en)* | 2002-06-11 | 2006-03-15 | Ｎｅｃトーキン株式会社 | Transmission line type noise filter |
| KR100635699B1 (en)* | 2002-07-31 | 2006-10-17 | 엔이씨 도낀 가부시끼가이샤 | Transmission line type noise filter with reduced heat generation even when large dc current flows therein |
| US7061772B2 (en)* | 2002-08-05 | 2006-06-13 | Nec Tokin Corporation | Electronic circuit with transmission line type noise filter |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI402640B (en)* | 2006-06-03 | 2013-07-21 | Electro Scient Ind Inc | Method and apparatus for automatically processing multiple applications in a predetermined order to affect multi-application sequencing |
| Publication number | Publication date |
|---|---|
| WO2004023597A1 (en) | 2004-03-18 |
| JPWO2004023597A1 (en) | 2006-01-05 |
| US20080053692A1 (en) | 2008-03-06 |
| US20060164189A1 (en) | 2006-07-27 |
| US7315226B2 (en) | 2008-01-01 |
| Publication | Publication Date | Title |
|---|---|---|
| TW200409153A (en) | Strip line element, printed circuit board carrying member, circuit board, semiconductor package and method for forming same | |
| Hong et al. | Optically invisible antenna integrated within an OLED touch display panel for IoT applications | |
| CN101202152B (en) | Coil component | |
| CN101313439B (en) | Coaxial vias in printed circuit boards for high-speed signal designs | |
| JP3980658B2 (en) | Thin film capacitor forming method, thin film capacitor manufacturing method, thin film bypass capacitor manufacturing method, and thin film capacitor | |
| US9705194B2 (en) | Antenna module | |
| TW200840133A (en) | Triplate line/waveguide converter | |
| CN101627450A (en) | Capacitance element, printed circuit board, semiconductor package, and semiconductor circuit | |
| US20050016746A1 (en) | Ground shield structure | |
| JP2009283688A (en) | Paired low-characteristic impedance power source line and ground line structure | |
| US7948355B2 (en) | Embedded resistor devices | |
| CN100397702C (en) | Parallel flat linear components, circuit boards | |
| JP2010171601A (en) | Low impedance-loss line structure | |
| Liang et al. | Integrated passive device fabricated and chip‐on‐board packaged filter employing mixed electric–magnetic coupling scheme | |
| JP2009252754A (en) | Circuit, circuit designing method, and circuit component | |
| US12142837B2 (en) | Ultra-thin, gain-enhanced antenna-on-chip and method | |
| Wang et al. | A unified model for on-chip CPWs with various types of ground shields | |
| WO2012043795A1 (en) | Circuit board, power supply structure, method for manufacturing circuit board, and method for manufacturing power supply structure | |
| US7242265B2 (en) | Element of parallel flat plate line type, a circuit board | |
| JPWO2006093296A1 (en) | Transmission line type noise filter, manufacturing method thereof, and printed circuit board | |
| JP2010193190A (en) | Low impedance loss line structure | |
| Wu et al. | A theoretical investigation of the resonance damping performance of magnetic material coating in power/ground plane structures | |
| JP2010028519A (en) | Digital circuit system | |
| JP2014236048A (en) | Loss line structure, and application system | |
| JP2010028520A (en) | Lossy line component |