SG97938A1 - Method to prevent die attach adhesive contamination in stacked chips - Google Patents

Method to prevent die attach adhesive contamination in stacked chips

Info

Publication number: SG97938A1
Authority: SG; Singapore
Prior art keywords: die attach; stacked chips; attach adhesive; prevent die; adhesive contamination
Prior art date: 2000-09-21

Micron Technology Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-09-21Application filed by Micron Technology IncfiledCriticalMicron Technology Inc

2000-09-21Priority to SG200005397ApriorityCriticalpatent/SG97938A1/en

2000-11-01Priority to US09/703,920prioritypatent/US6759307B1/en

2003-08-20Publication of SG97938A1publicationCriticalpatent/SG97938A1/en

2004-05-24Priority to US10/852,315prioritypatent/US7224070B2/en

2004-05-24Priority to US10/852,316prioritypatent/US7078264B2/en

Classifications

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- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

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Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
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Computer Hardware Design (AREA)
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Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Die Bonding (AREA)

SG200005397A2000-09-212000-09-21Method to prevent die attach adhesive contamination in stacked chipsSG97938A1 (en)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
SG200005397ASG97938A1 (en)	2000-09-21	2000-09-21	Method to prevent die attach adhesive contamination in stacked chips
US09/703,920US6759307B1 (en)	2000-09-21	2000-11-01	Method to prevent die attach adhesive contamination in stacked chips
US10/852,315US7224070B2 (en)	2000-09-21	2004-05-24	Plurality of semiconductor die in an assembly
US10/852,316US7078264B2 (en)	2000-09-21	2004-05-24	Stacked semiconductor die

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
SG200005397ASG97938A1 (en)	2000-09-21	2000-09-21	Method to prevent die attach adhesive contamination in stacked chips

Publications (1)

Publication Number	Publication Date
SG97938A1true SG97938A1 (en)	2003-08-20

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SG200005397ASG97938A1 (en)	2000-09-21	2000-09-21	Method to prevent die attach adhesive contamination in stacked chips

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US (3)	US6759307B1 (en)
SG (1)	SG97938A1 (en)

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Publication number	Publication date
US7078264B2 (en)	2006-07-18
US20040212082A1 (en)	2004-10-28
US6759307B1 (en)	2004-07-06
US7224070B2 (en)	2007-05-29
US20040212083A1 (en)	2004-10-28

Publication	Publication Date	Title
SG97938A1 (en)	2003-08-20	Method to prevent die attach adhesive contamination in stacked chips
AU2003207484A1 (en)	2003-07-30	Stacked die in die bga package
SG89386A1 (en)	2002-06-18	Semiconductor package including stacked chips
GB2395367B (en)	2005-05-25	Chip scale stacking system and method
AU3969701A (en)	2001-07-16	Integrated circuit die having bond pads near adjacent sides to allow stacking ofdice without regard to dice size
AU2003209057A1 (en)	2003-09-16	Stacked die semiconductor device
PT2911189T (en)	2020-05-11	Sheet to form a protective film for chips and process for producing semiconductor chips
SG87046A1 (en)	2002-03-19	Multi-chip module with stacked dice
SG120856A1 (en)	2006-04-26	Three dimensional package module
AU2001240743A1 (en)	2001-09-12	Novel dna chips
SG93192A1 (en)	2002-12-17	Face-to-face multi chip package
AU5136300A (en)	2000-12-05	Waiting prior to engaging in automated services
EP1271649A3 (en)	2004-04-28	Multi-die module and method thereof
SG87191A1 (en)	2002-03-19	Method for manufacturing semiconductor chips
PL358423A1 (en)	2004-08-09	Nutritional modules
AU1227102A (en)	2002-04-02	Chip removing tool
AU2002212271A1 (en)	2002-06-20	Chip removing tool
AU2003212966A1 (en)	2003-09-16	Stacked die semiconductor device
DE60224131D1 (en)	2008-01-31	Lead frame pack in chip size
AU2002212136A1 (en)	2002-03-13	Analysis chip
AU2002355361A1 (en)	2003-02-24	Improvements in or relating to encapsulation
IL166073A0 (en)	2006-01-15	Method for accommodating small minimum die in wirebonded area array packages
SG97946A1 (en)	2003-08-20	Method for manufacturing semiconductor chips
TW568351U (en)	2003-12-21	Packaging structure for stacking multiple chips on upper and lower surfaces
SG121702A1 (en)	2006-05-26	Stacked die in die bga package

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