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SG92654A1 - Method and system for testing integrated circuit devices at the wafer level - Google Patents

Method and system for testing integrated circuit devices at the wafer level

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Publication number
SG92654A1
SG92654A1SG9904662ASG1999004662ASG92654A1SG 92654 A1SG92654 A1SG 92654A1SG 9904662 ASG9904662 ASG 9904662ASG 1999004662 ASG1999004662 ASG 1999004662ASG 92654 A1SG92654 A1SG 92654A1
Authority
SG
Singapore
Prior art keywords
integrated circuit
wafer level
circuit devices
testing integrated
testing
Prior art date
Application number
SG9904662A
Inventor
Dasgupta Sumit
Srikrishnan Kris
Gene Walther Ronald
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IbmfiledCriticalIbm
Publication of SG92654A1publicationCriticalpatent/SG92654A1/en

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SG9904662A1998-09-291999-09-17Method and system for testing integrated circuit devices at the wafer levelSG92654A1 (en)

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US16282698A1998-09-291998-09-29

Publications (1)

Publication NumberPublication Date
SG92654A1true SG92654A1 (en)2002-11-19

Family

ID=22587288

Family Applications (1)

Application NumberTitlePriority DateFiling Date
SG9904662ASG92654A1 (en)1998-09-291999-09-17Method and system for testing integrated circuit devices at the wafer level

Country Status (3)

CountryLink
KR (1)KR100313185B1 (en)
CN (1)CN1249534A (en)
SG (1)SG92654A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP4234244B2 (en)*1998-12-282009-03-04富士通マイクロエレクトロニクス株式会社 Wafer level package and semiconductor device manufacturing method using wafer level package
KR100389905B1 (en)*2001-03-222003-07-04삼성전자주식회사Capacitive device array and fabricating method thereof
US6882546B2 (en)*2001-10-032005-04-19Formfactor, Inc.Multiple die interconnect system
KR101918608B1 (en)2012-02-282018-11-14삼성전자 주식회사Semiconductor package
CN103197227A (en)*2013-03-252013-07-10西安华芯半导体有限公司Wafer testing method used for design analysis purpose
US12270853B2 (en)2022-10-132025-04-08SanDisk Technologies, Inc.Semiconductor wafer configured for single touch-down testing
CN116338442B (en)*2023-05-302023-08-04深圳市微特精密科技股份有限公司Boundary scanning test system and self-detection method of DUT

Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4288911A (en)*1979-12-211981-09-15Harris CorporationMethod for qualifying biased integrated circuits on a wafer level
WO1982002603A1 (en)*1981-01-161982-08-05Robert Royce JohnsonWafer and method of testing networks thereon
EP0405586B1 (en)*1989-06-301997-03-26Kabushiki Kaisha ToshibaSemiconductor device and method of burning in the same
US5654588A (en)*1993-07-231997-08-05Motorola Inc.Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
US5898186A (en)*1996-09-131999-04-27Micron Technology, Inc.Reduced terminal testing system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4288911A (en)*1979-12-211981-09-15Harris CorporationMethod for qualifying biased integrated circuits on a wafer level
WO1982002603A1 (en)*1981-01-161982-08-05Robert Royce JohnsonWafer and method of testing networks thereon
EP0405586B1 (en)*1989-06-301997-03-26Kabushiki Kaisha ToshibaSemiconductor device and method of burning in the same
US5654588A (en)*1993-07-231997-08-05Motorola Inc.Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
US5898186A (en)*1996-09-131999-04-27Micron Technology, Inc.Reduced terminal testing system

Also Published As

Publication numberPublication date
CN1249534A (en)2000-04-05
KR20000022722A (en)2000-04-25
KR100313185B1 (en)2001-11-07

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