SG75186A1 - Method for producing contact structures - Google Patents

Method for producing contact structures

Info

Publication number: SG75186A1
Authority: SG; Singapore
Prior art keywords: contact structures; producing contact; producing; structures; contact
Prior art date: 1998-11-30

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-11-30Priority claimed from US09/201,299external-prioritypatent/US6297164B1/en

1998-12-29Priority claimed from US09/222,176external-prioritypatent/US5989994A/en

1999-11-19Application filed by Advantest CorpfiledCriticalAdvantest Corp

2000-09-19Publication of SG75186A1publicationCriticalpatent/SG75186A1/en

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01022—Titanium [Ti]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01045—Rhodium [Rh]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Geometry (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Manufacturing & Machinery (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Measuring Leads Or Probes (AREA)

SG1999005775A1998-11-301999-11-19Method for producing contact structuresSG75186A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US09/201,299US6297164B1 (en)	1998-11-30	1998-11-30	Method for producing contact structures
US09/222,176US5989994A (en)	1998-12-29	1998-12-29	Method for producing contact structures

Publications (1)

Publication Number	Publication Date
SG75186A1true SG75186A1 (en)	2000-09-19

Family

ID=26896600

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG1999005775ASG75186A1 (en)	1998-11-30	1999-11-19	Method for producing contact structures

Country Status (5)

Country	Link
JP (1)	JP2000162241A (en)
KR (1)	KR100449308B1 (en)
DE (1)	DE19957326B4 (en)
SG (1)	SG75186A1 (en)
TW (1)	TW440897B (en)

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JP3773396B2 (en)	2000-06-01	2006-05-10	住友電気工業株式会社	Contact probe and manufacturing method thereof
US6343940B1 (en)*	2000-06-19	2002-02-05	Advantest Corp	Contact structure and assembly mechanism thereof
JP4743945B2 (en)*	2000-09-01	2011-08-10	株式会社神戸製鋼所	Manufacturing method of connection device
KR100576900B1 (en)	2001-01-29	2006-05-03	스미토모덴키고교가부시키가이샤	Contact probe, method of manufacturing the contact probe, and device and method for inspection
DE60236426D1 (en)	2001-04-13	2010-07-01	Sumitomo Electric Industries	CONTACT PROBE
KR100463308B1 (en)*	2002-10-29	2004-12-23	주식회사 파이컴	Vertical type electrical contactor and method for manufacturing its
CN100595598C (en)*	2003-11-14	2010-03-24	温特沃斯实验室公司	Die head with integrated assembly auxiliary device
CN100446355C (en)*	2005-02-03	2008-12-24	旺矽科技股份有限公司	micro-contact element
KR100852514B1 (en)	2006-07-31	2008-08-18	한국과학기술연구원	Perpendicular Type Probe for Test of Semiconductor, Probe Card with the Probes and Methods for Manufacturing the Probe Card
JP5096737B2 (en)	2006-12-14	2012-12-12	株式会社日本マイクロニクス	Probe and manufacturing method thereof
JP4916893B2 (en)	2007-01-05	2012-04-18	株式会社日本マイクロニクス	Probe manufacturing method
JP4916903B2 (en)	2007-02-06	2012-04-18	株式会社日本マイクロニクス	Probe manufacturing method
KR101006351B1 (en)	2008-05-09	2011-01-06	주식회사 엠아이티	Electrical conduction pin manufacturing method
KR100996613B1 (en)	2010-01-27	2010-11-25	(주)기가레인	Extraction method for probe pin
US20120176122A1 (en)	2010-03-30	2012-07-12	Yoshihiro Hirata	Contact probe, linked body of contact probes, and manufacturing methods thereof
KR101601302B1 (en)*	2010-08-31	2016-03-08	현대자동차주식회사	Device and method contolling outside mirror unfolding
KR102361397B1 (en)	2019-01-21	2022-02-10	(주)포인트엔지니어링	Probe pin having substrate and manufacturing method of probe card using the same
JPWO2020256132A1 (en)*	2019-06-21	2020-12-24
KR20220049203A (en)	2020-10-14	2022-04-21	(주)포인트엔지니어링	The Electro-conductive Contact Pin, Manufacturing Method thereof, Test device And Product and Method for manufacturing the product
KR20220069386A (en)	2020-11-20	2022-05-27	(주)포인트엔지니어링	Alignment Apparatus For the Electro-conductive Contact Pin
KR102519285B1 (en)	2021-02-22	2023-04-17	(주)포인트엔지니어링	The Electro-conductive Contact Pin, Manufacturing Method thereof
KR102509522B1 (en)	2021-02-22	2023-03-14	(주)포인트엔지니어링	The Transfering Method For The Prodcut or Electro-conductive Contact Pin
KR102490034B1 (en)	2021-02-26	2023-01-18	(주)포인트엔지니어링	Aligning Module and transfer method for the electro-conductive contact pin
KR102834990B1 (en)	2021-03-30	2025-07-17	(주)포인트엔지니어링	The Electro-conductive Contact Pin and Manufacturing Method thereof
KR20220135453A (en)	2021-03-30	2022-10-07	(주)포인트엔지니어링	The Electro-conductive Contact Pin and Manufacturing Method thereof
KR102549551B1 (en)	2021-04-06	2023-06-29	(주)포인트엔지니어링	The electro-conductive contact pin and inspection apparatus having the same electro-conductive pin and manufacturing method thereof
KR102577539B1 (en)	2021-04-09	2023-09-12	(주)포인트엔지니어링	The Electro-conductive Contact Pin and Manufacturing Method thereof
KR20220164899A (en)	2021-06-07	2022-12-14	(주)포인트엔지니어링	The Electro-conductive Contact Pin
KR20230001193A (en)	2021-06-28	2023-01-04	(주)포인트엔지니어링	The Electro-conductive Contact Pin and Manufacturing Method thereof
KR20230001190A (en)	2021-06-28	2023-01-04	(주)포인트엔지니어링	The Electro-conductive Contact Pin
KR20230032063A (en)	2021-08-30	2023-03-07	(주)포인트엔지니어링	Method of manufacturing metal product
KR102440982B1 (en)	2021-12-06	2022-09-07	주식회사 피엘아이	Pin auto-insertion system and pin auto-insertion method
KR102440984B1 (en)	2021-12-14	2022-09-07	주식회사 피엘아이	Pin automatic insertion system and pin automatic insertion method
CN118125373B (en)*	2024-05-06	2024-07-02	港华能源创科(深圳)有限公司	Preparation method of hydrogen sensor and hydrogen sensor

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US6184576B1 (en)*	1998-09-21	2001-02-06	Advantest Corp.	Packaging and interconnection of contact structure

1999
- 1999-11-19SGSG1999005775Apatent/SG75186A1/enunknown
- 1999-11-29JPJP11337754Apatent/JP2000162241A/enactivePending
- 1999-11-29KRKR10-1999-0053374Apatent/KR100449308B1/ennot_activeExpired - Fee Related
- 1999-11-29DEDE19957326Apatent/DE19957326B4/ennot_activeExpired - Fee Related
- 1999-11-30TWTW088120847Apatent/TW440897B/ennot_activeIP Right Cessation

Also Published As

Publication number	Publication date
KR20000035748A (en)	2000-06-26
JP2000162241A (en)	2000-06-16
KR100449308B1 (en)	2004-09-18
TW440897B (en)	2001-06-16
DE19957326A1 (en)	2000-05-31
DE19957326B4 (en)	2007-06-14

Publication	Publication Date	Title
SG75186A1 (en)	2000-09-19	Method for producing contact structures
HUP0102843A3 (en)	2004-03-01	Method for producing isoxazoline-3-yl-acyl benzene
GB9810722D0 (en)	1998-07-15	Method
GB9809414D0 (en)	1998-07-01	Method
EP0989460A4 (en)	2001-10-24	Pattern forming method
GB9809776D0 (en)	1998-07-08	Method
GB9819783D0 (en)	1998-11-04	Manufacturing method
HUP0001596A3 (en)	2002-01-28	Method for producing 5-aminomethyl-2-chloropyridines
GB9814055D0 (en)	1998-08-26	Method
GB9819764D0 (en)	1998-11-04	Method
GB9817266D0 (en)	1998-10-07	Method
GB9819769D0 (en)	1998-11-04	Method
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GB9813126D0 (en)	1998-08-19	Method
GB9804525D0 (en)	1998-04-29	Manufacturing method

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SG75186A1 - Method for producing contact structures - Google Patents

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