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SG143060A1 - Wire loop, semiconductor device having same and wire bonding method - Google Patents

Wire loop, semiconductor device having same and wire bonding method

Info

Publication number
SG143060A1
SG143060A1SG200502904-6ASG2005029046ASG143060A1SG 143060 A1SG143060 A1SG 143060A1SG 2005029046 ASG2005029046 ASG 2005029046ASG 143060 A1SG143060 A1SG 143060A1
Authority
SG
Singapore
Prior art keywords
wire
semiconductor device
same
bonding method
loop
Prior art date
Application number
SG200502904-6A
Inventor
Mizuho Shirato
Hiromi Fujisawa
Tadahisha Akita
Original Assignee
Kaijo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo KkfiledCriticalKaijo Kk
Priority to SG200502904-6ApriorityCriticalpatent/SG143060A1/en
Publication of SG143060A1publicationCriticalpatent/SG143060A1/en

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Abstract

Wire loop, semiconductor device having same and wire bonding method A wire loop includes a wire (3) connecting a first bonding point (A) and a second bonding point (Z) therethrough, wherein an additional wire loop (P) is formed after wire bonding at the second bonding point (Z) without cutting the wire (3) and the additional wire loop (P) is bonded to the second bonding point (Z) or to the vicinity thereof while part of the wire (3) is crushed. Fig. 1A
SG200502904-6A2005-05-102005-05-10Wire loop, semiconductor device having same and wire bonding methodSG143060A1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
SG200502904-6ASG143060A1 (en)2005-05-102005-05-10Wire loop, semiconductor device having same and wire bonding method

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
SG200502904-6ASG143060A1 (en)2005-05-102005-05-10Wire loop, semiconductor device having same and wire bonding method

Publications (1)

Publication NumberPublication Date
SG143060A1true SG143060A1 (en)2008-06-27

Family

ID=39615553

Family Applications (1)

Application NumberTitlePriority DateFiling Date
SG200502904-6ASG143060A1 (en)2005-05-102005-05-10Wire loop, semiconductor device having same and wire bonding method

Country Status (1)

CountryLink
SG (1)SG143060A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20220199571A1 (en)*2020-12-232022-06-23Skyworks Solutions, Inc.Apparatus and methods for tool mark free stitch bonding

Citations (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
DE3621917A1 (en)*1986-06-301988-01-07Bosch Gmbh RobertMethod for producing electrical connections inside semiconductor components and electrical connection for semiconductor components
JPH01276729A (en)*1988-04-281989-11-07Nec Kansai LtdWire bonding
JPH0215137A (en)*1985-06-201990-01-18Accmulatorenfab Sonnenschein GmbhLead-calcium alloy and production thereof
JPH04255237A (en)*1991-02-071992-09-10Fujitsu Ltd Manufacturing method of semiconductor device
TW456012B (en)*2000-01-272001-09-21Advanced Semiconductor EngSemiconductor wire bonding method preventing wire sweeping
EP1422014A1 (en)*2002-11-212004-05-26Kaijo CorporationSemiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method
US6815836B2 (en)*2003-03-242004-11-09Texas Instruments IncorporatedWire bonding for thin semiconductor package
JP2005019778A (en)*2003-06-272005-01-20Shinkawa LtdWire bonding method
US20050072833A1 (en)*2003-10-022005-04-07Wong Yam MoMethod of forming low wire loops and wire loops formed using the method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH0215137A (en)*1985-06-201990-01-18Accmulatorenfab Sonnenschein GmbhLead-calcium alloy and production thereof
DE3621917A1 (en)*1986-06-301988-01-07Bosch Gmbh RobertMethod for producing electrical connections inside semiconductor components and electrical connection for semiconductor components
JPH01276729A (en)*1988-04-281989-11-07Nec Kansai LtdWire bonding
JPH04255237A (en)*1991-02-071992-09-10Fujitsu Ltd Manufacturing method of semiconductor device
TW456012B (en)*2000-01-272001-09-21Advanced Semiconductor EngSemiconductor wire bonding method preventing wire sweeping
EP1422014A1 (en)*2002-11-212004-05-26Kaijo CorporationSemiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method
US6815836B2 (en)*2003-03-242004-11-09Texas Instruments IncorporatedWire bonding for thin semiconductor package
JP2005019778A (en)*2003-06-272005-01-20Shinkawa LtdWire bonding method
US20050072833A1 (en)*2003-10-022005-04-07Wong Yam MoMethod of forming low wire loops and wire loops formed using the method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20220199571A1 (en)*2020-12-232022-06-23Skyworks Solutions, Inc.Apparatus and methods for tool mark free stitch bonding
US12142595B2 (en)*2020-12-232024-11-12Skyworks Solutions, Inc.Apparatus and methods for tool mark free stitch bonding

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