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SG11201605542RA - Semiconductor substrate, semiconductor device and manufacturing method for semiconductor substrate - Google Patents

Semiconductor substrate, semiconductor device and manufacturing method for semiconductor substrate

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Publication number
SG11201605542RA
SG11201605542RASG11201605542RASG11201605542RASG11201605542RASG 11201605542R ASG11201605542R ASG 11201605542RASG 11201605542R ASG11201605542R ASG 11201605542RASG 11201605542R ASG11201605542R ASG 11201605542RASG 11201605542R ASG11201605542R ASG 11201605542RA
Authority
SG
Singapore
Prior art keywords
semiconductor substrate
semiconductor
manufacturing
semiconductor device
substrate
Prior art date
Application number
SG11201605542RA
Inventor
Kai Cheng
Original Assignee
Enkris Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enkris Semiconductor IncfiledCriticalEnkris Semiconductor Inc
Publication of SG11201605542RApublicationCriticalpatent/SG11201605542RA/en

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SG11201605542RA2014-01-072015-01-07Semiconductor substrate, semiconductor device and manufacturing method for semiconductor substrateSG11201605542RA (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
CN201410006568.4ACN103681992A (en)2014-01-072014-01-07Semiconductor substrate, semiconductor device and semiconductor substrate manufacturing method
PCT/CN2015/070251WO2015103976A1 (en)2014-01-072015-01-07Semiconductor substrate, semiconductor device and manufacturing method for semiconductor substrate

Publications (1)

Publication NumberPublication Date
SG11201605542RAtrue SG11201605542RA (en)2016-08-30

Family

ID=50318900

Family Applications (1)

Application NumberTitlePriority DateFiling Date
SG11201605542RASG11201605542RA (en)2014-01-072015-01-07Semiconductor substrate, semiconductor device and manufacturing method for semiconductor substrate

Country Status (8)

CountryLink
US (1)US10249788B2 (en)
EP (1)EP3093891B1 (en)
JP (1)JP2017507478A (en)
KR (1)KR20160104723A (en)
CN (1)CN103681992A (en)
DK (1)DK3093891T3 (en)
SG (1)SG11201605542RA (en)
WO (1)WO2015103976A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN103681992A (en)*2014-01-072014-03-26苏州晶湛半导体有限公司Semiconductor substrate, semiconductor device and semiconductor substrate manufacturing method
US10879134B2 (en)*2016-06-222020-12-29Intel CorporationTechniques for monolithic co-integration of silicon and III-N semiconductor transistors
DE102016013540A1 (en)*2016-11-142018-05-173 - 5 Power Electronics GmbH III-V semiconductor diode
JP6863423B2 (en)*2019-08-062021-04-21信越半導体株式会社 Substrates for electronic devices and their manufacturing methods
EP4442870A1 (en)*2021-12-012024-10-09Shin-Etsu Handotai Co., Ltd.Substrate for electronic device and production method therefor
JP7597081B2 (en)*2021-12-012024-12-10信越半導体株式会社 Substrate for electronic device and method for producing same
CN114759126B (en)*2022-06-132022-09-20江苏第三代半导体研究院有限公司Semiconductor device structure based on nitride single crystal substrate and preparation method thereof
CN116779688B (en)*2023-07-282025-01-28合肥安芯睿创半导体有限公司 A silicon carbide Schottky diode with a trench structure having a junction type P+ protection and a manufacturing method thereof

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS63193517A (en)*1987-02-061988-08-10Nec Corp Composite single crystal substrate
JPH07335511A (en)*1994-06-131995-12-22Nippon Telegr & Teleph Corp <Ntt> Bonded wafer
US5981400A (en)*1997-09-181999-11-09Cornell Research Foundation, Inc.Compliant universal substrate for epitaxial growth
US6333208B1 (en)*1999-07-132001-12-25Li Chiung-TungRobust manufacturing method for making a III-V compound semiconductor device by misaligned wafer bonding
US6984571B1 (en)*1999-10-012006-01-10Ziptronix, Inc.Three dimensional device integration method and integrated device
US6649287B2 (en)*2000-12-142003-11-18Nitronex CorporationGallium nitride materials and methods
US7348610B2 (en)*2005-02-242008-03-25International Business Machines CorporationMultiple layer and crystal plane orientation semiconductor substrate
CN101017864A (en)*2006-02-082007-08-15中国科学院半导体研究所Silicon base covariant underlay with the ultrathin carbon silicon middle layer and its preparing method
JP5009124B2 (en)*2007-01-042012-08-22コバレントマテリアル株式会社 Manufacturing method of semiconductor substrate
JP4888276B2 (en)*2007-08-092012-02-29三菱電機株式会社 Semiconductor wafer equipment
WO2010056083A2 (en)*2008-11-142010-05-20삼성엘이디 주식회사Vertical/horizontal light-emitting diode for semiconductor
CN102208337B (en)*2010-03-302014-04-09杭州海鲸光电科技有限公司Silicon-base compound substrate and manufacturing method thereof
US8298923B2 (en)*2010-10-272012-10-30International Business Machinces CorporationGermanium-containing release layer for transfer of a silicon layer to a substrate
JP2013247362A (en)*2012-05-292013-12-09Samsung Corning Precision Materials Co LtdMethod for manufacturing thin film bonded substrate for semiconductor element
CN103035496B (en)*2012-12-112016-03-23广州市众拓光电科技有限公司A kind of growth GaN film on a si substrate and its preparation method and application
CN102978695A (en)*2012-12-122013-03-20东莞市中镓半导体科技有限公司 Invisible Structure Substrate for Epitaxial Growth of Semiconductor Devices
CN103296066B (en)*2013-05-312015-09-16华南理工大学Growth GaN film on strontium aluminate tantalum lanthanum substrate and preparation method thereof, application
CN103681992A (en)*2014-01-072014-03-26苏州晶湛半导体有限公司Semiconductor substrate, semiconductor device and semiconductor substrate manufacturing method

Also Published As

Publication numberPublication date
EP3093891A1 (en)2016-11-16
KR20160104723A (en)2016-09-05
US10249788B2 (en)2019-04-02
DK3093891T3 (en)2019-05-06
WO2015103976A1 (en)2015-07-16
CN103681992A (en)2014-03-26
JP2017507478A (en)2017-03-16
US20160315220A1 (en)2016-10-27
EP3093891A4 (en)2017-01-25
EP3093891B1 (en)2019-03-06

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