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SG11201505841XA - Photonic device structure and method of manufacture - Google Patents

Photonic device structure and method of manufacture

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Publication number
SG11201505841XA
SG11201505841XASG11201505841XASG11201505841XASG11201505841XASG 11201505841X ASG11201505841X ASG 11201505841XASG 11201505841X ASG11201505841X ASG 11201505841XASG 11201505841X ASG11201505841X ASG 11201505841XASG 11201505841X ASG11201505841X ASG 11201505841XA
Authority
SG
Singapore
Prior art keywords
manufacture
device structure
photonic device
photonic
Prior art date
Application number
SG11201505841XA
Inventor
Gurtej Sandhu
Roy Meade
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology IncfiledCriticalMicron Technology Inc
Publication of SG11201505841XApublicationCriticalpatent/SG11201505841XA/en

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SG11201505841XA2013-02-262014-02-12Photonic device structure and method of manufactureSG11201505841XA (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
US13/776,836US9005458B2 (en)2013-02-262013-02-26Photonic device structure and method of manufacture
PCT/US2014/016009WO2014133760A1 (en)2013-02-262014-02-12Photonic device structure and method of manufacture

Publications (1)

Publication NumberPublication Date
SG11201505841XAtrue SG11201505841XA (en)2015-09-29

Family

ID=50179960

Family Applications (1)

Application NumberTitlePriority DateFiling Date
SG11201505841XASG11201505841XA (en)2013-02-262014-02-12Photonic device structure and method of manufacture

Country Status (8)

CountryLink
US (2)US9005458B2 (en)
EP (1)EP2962139B1 (en)
JP (1)JP6244380B2 (en)
KR (1)KR101842758B1 (en)
CN (1)CN105026966B (en)
SG (1)SG11201505841XA (en)
TW (2)TWI499817B (en)
WO (1)WO2014133760A1 (en)

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US9768330B2 (en)*2014-08-252017-09-19Micron Technology, Inc.Method and optoelectronic structure providing polysilicon photonic devices with different optical properties in different regions
US9606068B2 (en)2014-08-272017-03-28Pacific Biosciences Of California, Inc.Arrays of integrated analytical devices
DE112016000309T5 (en)*2015-01-082017-09-28Acacia Communications, Inc. Horizontal coupling to silicon waveguides
WO2016149397A1 (en)2015-03-162016-09-22Pacific Biosciences Of California, Inc.Integrated devices and systems for free-space optical coupling
CN114691585B (en)2015-05-072023-10-13加利福尼亚太平洋生物科学股份有限公司Multiprocessor pipeline architecture
US10365434B2 (en)2015-06-122019-07-30Pacific Biosciences Of California, Inc.Integrated target waveguide devices and systems for optical coupling
US10416381B1 (en)2016-12-232019-09-17Acacia Communications, Inc.Spot-size-converter design for facet optical coupling
US10571633B1 (en)2016-12-232020-02-25Acacia Communications, Inc.Suspended cantilever waveguide
US20180372872A1 (en)*2017-06-232018-12-27Kabushiki Kaisha ToshibaPhotodetector, method of manufacturing photodetector, and lidar apparatus
US10466514B1 (en)*2018-11-062019-11-05Globalfoundries Inc.Electro-optic modulator with vertically-arranged optical paths
US11169328B2 (en)*2019-09-202021-11-09Taiwan Semiconductor Manufacturing Co., Ltd.Photonic structure and method for forming the same
US11175451B2 (en)*2019-09-262021-11-16Intel CorporationMechanisms for refractive index tuning semiconductor photonic devices
US11262500B2 (en)*2019-12-022022-03-01Renesas Electronics CorporationSemiconductor device and including an optical waveguide and method of manufacturing the same
CN111239900B (en)*2020-03-182022-03-29联合微电子中心有限责任公司Forming SiO based on wafer bonding2Method for realizing spot-size conversion by waveguide and spot-size converter
EP3916760B1 (en)2020-05-282024-07-03Imec VZWA method for producing an undercut in a 300 mm silicon-on-insulator platform
US11409037B2 (en)*2020-10-282022-08-09Globalfoundries U.S. Inc.Enlarged waveguide for photonic integrated circuit without impacting interconnect layers
US11803009B2 (en)*2022-02-252023-10-31Globalfoundries U.S. Inc.Photonics structures having a locally-thickened dielectric layer

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US6712983B2 (en)*2001-04-122004-03-30Memsic, Inc.Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same
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ITMI20070062A1 (en)*2007-01-182008-07-19St Microelectronics Srl PROCESS OF MANUFACTURE OF AN INTEGRATED OPTICAL DEVICE
US7920770B2 (en)2008-05-012011-04-05Massachusetts Institute Of TechnologyReduction of substrate optical leakage in integrated photonic circuits through localized substrate removal
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Also Published As

Publication numberPublication date
CN105026966A (en)2015-11-04
EP2962139A1 (en)2016-01-06
TWI574069B (en)2017-03-11
US9568674B2 (en)2017-02-14
CN105026966B (en)2019-10-01
KR101842758B1 (en)2018-03-27
TW201443499A (en)2014-11-16
JP6244380B2 (en)2017-12-06
US20140241682A1 (en)2014-08-28
US20150192737A1 (en)2015-07-09
WO2014133760A1 (en)2014-09-04
EP2962139B1 (en)2019-09-25
JP2016509262A (en)2016-03-24
US9005458B2 (en)2015-04-14
KR20150113095A (en)2015-10-07
TWI499817B (en)2015-09-11
TW201539073A (en)2015-10-16

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