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SG11201504998SA - Thermally-conductive, electrically-conductive adhesive composition - Google Patents

Thermally-conductive, electrically-conductive adhesive composition

Info

Publication number
SG11201504998SA
SG11201504998SASG11201504998SASG11201504998SASG11201504998SASG 11201504998S ASG11201504998S ASG 11201504998SASG 11201504998S ASG11201504998S ASG 11201504998SASG 11201504998S ASG11201504998S ASG 11201504998SASG 11201504998S ASG11201504998S ASG 11201504998SA
Authority
SG
Singapore
Prior art keywords
conductive
thermally
electrically
adhesive composition
conductive adhesive
Prior art date
Application number
SG11201504998SA
Inventor
Ochi Mitsukazu
Akira IRIFUNE
Natsuko Ichikawa
Miyuki Harada
Rikia FURUSHO
Takeshi Kondo
Akihiko Okuda
Original Assignee
Kansai University
Tanaka Precious Metal Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai University, Tanaka Precious Metal IndfiledCriticalKansai University
Publication of SG11201504998SApublicationCriticalpatent/SG11201504998SA/en

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SG11201504998SA2012-12-272013-12-25Thermally-conductive, electrically-conductive adhesive compositionSG11201504998SA (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP2012284866AJP5642147B2 (en)2012-12-272012-12-27 Thermally conductive conductive adhesive composition
PCT/JP2013/084552WO2014104046A1 (en)2012-12-272013-12-25Thermally-conductive, electrically-conductive adhesive composition

Publications (1)

Publication NumberPublication Date
SG11201504998SAtrue SG11201504998SA (en)2015-07-30

Family

ID=51021126

Family Applications (1)

Application NumberTitlePriority DateFiling Date
SG11201504998SASG11201504998SA (en)2012-12-272013-12-25Thermally-conductive, electrically-conductive adhesive composition

Country Status (11)

CountryLink
US (1)US20150344749A1 (en)
EP (1)EP2940093B1 (en)
JP (1)JP5642147B2 (en)
KR (1)KR101775255B1 (en)
CN (1)CN104968746B (en)
MX (1)MX2015008249A (en)
MY (1)MY172479A (en)
PH (1)PH12015501480B1 (en)
SG (1)SG11201504998SA (en)
TW (1)TWI510595B (en)
WO (1)WO2014104046A1 (en)

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KR102827064B1 (en)*2023-03-272025-06-30한국전자기술연구원High heat-resistant epoxy adhesive composition comprising graphene material and manufacturing method thereof

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Also Published As

Publication numberPublication date
CN104968746B (en)2017-09-19
TWI510595B (en)2015-12-01
KR20150108844A (en)2015-09-30
JP5642147B2 (en)2014-12-17
PH12015501480B1 (en)2019-05-24
KR101775255B1 (en)2017-09-05
US20150344749A1 (en)2015-12-03
MX2015008249A (en)2016-09-19
EP2940093B1 (en)2017-11-22
PH12015501480A1 (en)2015-09-21
WO2014104046A1 (en)2014-07-03
JP2014125596A (en)2014-07-07
EP2940093A4 (en)2016-08-03
TW201435041A (en)2014-09-16
CN104968746A (en)2015-10-07
EP2940093A1 (en)2015-11-04
MY172479A (en)2019-11-26

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