Movatterモバイル変換


[0]ホーム

URL:


MY147335A - An integrated packaged environmental sensor and roic and a method of fabricating the same - Google Patents

An integrated packaged environmental sensor and roic and a method of fabricating the same

Info

Publication number
MY147335A
MY147335AMYPI20097023AMYPI20097023AMY147335AMY 147335 AMY147335 AMY 147335AMY PI20097023 AMYPI20097023 AMY PI20097023AMY PI20097023 AMYPI20097023 AMY PI20097023AMY 147335 AMY147335 AMY 147335A
Authority
MY
Malaysia
Prior art keywords
environmental sensor
roic
fabricating
same
integrated packaged
Prior art date
Application number
MYPI20097023A
Inventor
Mohd Ismahadi Syono
Daniel Bien Chia Sheng
Lee Hing Wah
Original Assignee
Mimos Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos BerhadfiledCriticalMimos Berhad
Priority to MYPI20097023ApriorityCriticalpatent/MY147335A/en
Priority to PCT/MY2009/000196prioritypatent/WO2011053108A1/en
Priority to PCT/MY2010/000182prioritypatent/WO2011053110A2/en
Publication of MY147335ApublicationCriticalpatent/MY147335A/en

Links

Classifications

Landscapes

Abstract

AN INTEGRATED PACKAGED MICROCHIP (100) INCLUDING AT LEAST ONE ENVIRONMENTAL SENSOR (104) AND AT LEAST ONE READ-OUT INTEGRATED CHIP (ROIC) (102) IS PROVIDED, CHARACTERIZED IN THAT, THE INTEGRATED PACKAGED MICROCHIP (100) FURTHER INCLUDES AN ETCHED OPENING (108) OF THE ENVIRONMENTAL SENSOR (104) EXPOSED TO A SENSABLE ENVIRONMENT, USING AT LEAST ONE LAYER OF GLASS WAFER (101,106) AND AT LEAST ONE LAYER OF SILICON WAFER (107).
MYPI20097023A2009-10-272009-10-27An integrated packaged environmental sensor and roic and a method of fabricating the sameMY147335A (en)

Priority Applications (3)

Application NumberPriority DateFiling DateTitle
MYPI20097023AMY147335A (en)2009-10-272009-10-27An integrated packaged environmental sensor and roic and a method of fabricating the same
PCT/MY2009/000196WO2011053108A1 (en)2009-10-272009-11-19An integrated packaged environmental sensor and roic and a method of fabricating the same
PCT/MY2010/000182WO2011053110A2 (en)2009-10-272010-09-30An integrated packaged environmental sensor and roic and a method of fabricating the same

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
MYPI20097023AMY147335A (en)2009-10-272009-10-27An integrated packaged environmental sensor and roic and a method of fabricating the same

Publications (1)

Publication NumberPublication Date
MY147335Atrue MY147335A (en)2012-11-30

Family

ID=43922292

Family Applications (1)

Application NumberTitlePriority DateFiling Date
MYPI20097023AMY147335A (en)2009-10-272009-10-27An integrated packaged environmental sensor and roic and a method of fabricating the same

Country Status (2)

CountryLink
MY (1)MY147335A (en)
WO (2)WO2011053108A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN108501657A (en)*2018-06-042018-09-07泰铂(上海)环保科技股份有限公司A kind of novel and multifunctional engineering car air-conditioner and control method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5822473A (en)*1996-02-291998-10-13Texas Instruments IncorporatedIntegrated microchip chemical sensor
GB9710843D0 (en)*1997-05-281997-07-23Secr DefenceA thermal detector array
ATE499988T1 (en)*2000-03-022011-03-15Microchips Inc MICROMECHANICAL DEVICES AND METHODS FOR STORAGE AND SELECTIVE EXPOSURE OF CHEMICALS
EP1671375A4 (en)*2003-10-092009-11-25Ocas CorpBolometric infrared sensor having two layer structure and method for manufacturing the same
US7592594B2 (en)*2006-11-132009-09-22Raytheon CompanyMethod of construction of CTE matching structure with wafer processing and resulting structure

Also Published As

Publication numberPublication date
WO2011053108A1 (en)2011-05-05
WO2011053110A2 (en)2011-05-05
WO2011053110A3 (en)2011-08-18

Similar Documents

PublicationPublication DateTitle
EP2154714A3 (en)Temperature sensor with buffer layer
TWI340999B (en)Electronic devices, cmos image sensor device chip scale packages and fabrication methods thereof
WO2010012548A3 (en)Encapsulation, mems and method of selective encapsulation
TW200723511A (en)Semiconductor devices, CMOS image sensors, and methods of manufacturing same
TW200634946A (en)Device and method for fabricating double-sided SOI wafer scale package with through via connections
TW200634947A (en)Cavity structure for semiconductor structure
WO2013003784A3 (en)Process for a sealed mems device with a portion exposed to the environment
WO2007038144A3 (en)Radiation sensor device and method
SG171678A1 (en)Wafer level package integration and method
SG166749A1 (en)Integrated circuit system with through silicon via and method of manufacture thereof
WO2007139730A3 (en)Semiconductor input control device
SG148130A1 (en)Cmos image sensor chip scale package with die receiving through-hole and method of the same
ATE548687T1 (en) THREE-DIMENSIONAL DEVICE FOR INPUT FORCE CONTROL AND MANUFACTURING
TWI348020B (en)Semiconductor sensor device and manufacturing method thereof
WO2009044303A3 (en)Calibration substrate and calibration method
WO2009142391A3 (en)Light-emitting device package and method of manufacturing the same
WO2012100361A3 (en)Method for manufacturing a sensor chip comprising a device for testing it
WO2010117701A3 (en)Optical device with large thermal impedance
WO2007078686A3 (en)Method of polishing a semiconductor-on-insulator structure
WO2006112995A3 (en)Glass-based semiconductor on insulator structures and methods of making same
SG143242A1 (en)Imagine sensor package and forming method of the same
WO2010138267A3 (en)Thin semiconductor device having embedded die support and methods of making the same
TW200730007A (en)Organic light-emitting display device and manufacturing method of the same
WO2010048102A3 (en)Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
WO2011038423A3 (en)Cmos moems sensor device

[8]ページ先頭

©2009-2025 Movatter.jp