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MY121750A - Chip components mounting apparatus - Google Patents

Chip components mounting apparatus

Info

Publication number
MY121750A
MY121750AMYPI98002986AMYPI9802986AMY121750AMY 121750 AMY121750 AMY 121750AMY PI98002986 AMYPI98002986 AMY PI98002986AMY PI9802986 AMYPI9802986 AMY PI9802986AMY 121750 AMY121750 AMY 121750A
Authority
MY
Malaysia
Prior art keywords
chip components
template
circuit board
printed circuit
mounting apparatus
Prior art date
Application number
MYPI98002986A
Inventor
Shuichi Munakata
Yoshikazu Inamura
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co LtdfiledCriticalAlps Electric Co Ltd
Publication of MY121750ApublicationCriticalpatent/MY121750A/en

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Classifications

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Abstract

IN A CHIP COMPONENTS MOUNTING APPARATUS OF THE INVENTION, CHIP COMPONENTS RECEIVED IN A PLURALITY OF HOPPERS ARE DROPPED ONTO A TEMPLATE AND ARE ARRANGED IN ORDER, THEN THE TEMPLATE IS CONVEYED UP TO THE POSITION JUST UNDER A SUCTION UNIT, WHERE THE CHIP COMPONENTS ARE SUCKED FROM THE TEMPLATE BY MEANS OF SUCTION NOZZLES OF THE SUCTION UNIT, AND THE CHIP COMPONENTS THUS CHECKED ARE MOUNTED ONTO A PRINTED CIRCUIT BOARD AT PREDETERMINED POSITIONS. IN THIS CHIP COMPONENTS MOUNTING APPARATUS, THE CHIP COMPONENTS MOUNTING POSITIONS ON THE PRINTED CIRCUIT BOARD ARE DIVIDED TO A PLURALITY OF GROUPS, RETAINING HOLES ARE FORMED IN THE TEMPLATE SO AS TO BE DISTRIBUTED IN TWO-DIMENSIONAL DERECTIONS GROUP AND IN CORRESPONDING RELATION TO THE CHIP COMPONENTS MOUNTING POSITIONS, AND THE PRINTED CIRCUIT BOARD IS MOVED IN TWO-DIMENSIONAL DIRECTIONS BY MEANS OF A THIRD CARRIER TO MOUNT THE SUCKED CHIP COMPONENTS ONTO THE PRINTED CIRCUIT BOARD AT THE PREDETERMINED POSITIONS.(FIG. 5)
MYPI98002986A1997-07-011998-06-30Chip components mounting apparatusMY121750A (en)

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP17592897AJP3512598B2 (en)1997-07-011997-07-01 Chip component mounting device

Publications (1)

Publication NumberPublication Date
MY121750Atrue MY121750A (en)2006-02-28

Family

ID=16004710

Family Applications (1)

Application NumberTitlePriority DateFiling Date
MYPI98002986AMY121750A (en)1997-07-011998-06-30Chip components mounting apparatus

Country Status (5)

CountryLink
JP (1)JP3512598B2 (en)
KR (1)KR100300837B1 (en)
CN (1)CN1104833C (en)
GB (1)GB2326980B (en)
MY (1)MY121750A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
KR101051498B1 (en)*2002-09-302011-07-22소니 주식회사 Electronic component positioning method and device
KR101000004B1 (en)2004-12-242010-12-09미래산업 주식회사 Part mounting method
CN110139500B (en)*2019-05-282021-11-23铜陵金基科技有限公司SMT chip mounter and chip mounting production process thereof
US12187549B2 (en)*2019-06-052025-01-07Fuji CorporationParts supply apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS5694800A (en)*1979-12-281981-07-31Taiyo Yuden KkMethod and device for mounting electronic part
US4528747A (en)*1982-12-021985-07-16At&T Technologies, Inc.Method and apparatus for mounting multilead components on a circuit board
US4548667A (en)*1984-03-281985-10-22Wical Robert MPlanned coordinate component placement system
KR920002278B1 (en)*1988-02-151992-03-20다이요유덴 가부시끼가이샤 Mounting device for circuit parts without lead wire

Also Published As

Publication numberPublication date
JP3512598B2 (en)2004-03-29
JPH1126989A (en)1999-01-29
KR19990013480A (en)1999-02-25
CN1208323A (en)1999-02-17
CN1104833C (en)2003-04-02
KR100300837B1 (en)2001-09-06
GB9810318D0 (en)1998-07-15
GB2326980B (en)2002-01-16
GB2326980A (en)1999-01-06

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