| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07854496AJP3261970B2 (ja) | 1996-04-01 | 1996-04-01 | 導電性ボールの搭載装置および搭載方法 |
| JP96-78544 | 1996-04-01 | ||
| JP22092896AJP3303684B2 (ja) | 1996-08-22 | 1996-08-22 | 導電性ボール搭載装置及び導電性ボール搭載方法 |
| JP96-220928 | 1996-08-22 |
| Publication Number | Publication Date |
|---|---|
| KR970072227Atrue KR970072227A (ko) | 1997-11-07 |
| KR100262844B1 KR100262844B1 (ko) | 2000-09-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970010904AExpired - Fee RelatedKR100262844B1 (ko) | 1996-04-01 | 1997-03-27 | 도전성 보올의 탑재장치 및 방법 |
| Country | Link |
|---|---|
| US (1) | US5890283A (ko) |
| KR (1) | KR100262844B1 (ko) |
| TW (1) | TW370480B (ko) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100453689B1 (ko)* | 1997-12-30 | 2005-02-23 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지제조용볼범핑시스템의자동볼싸이즈필터링장치및그방법 |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100268632B1 (ko)* | 1996-03-08 | 2000-10-16 | 야마구치 다케시 | 범프형성방법 및 장치 |
| US6105245A (en)* | 1997-02-17 | 2000-08-22 | Nippon Steel Semiconductor Corporation | Method of manufacturing a resin-encapsulated semiconductor package |
| JP2850901B2 (ja) | 1997-06-02 | 1999-01-27 | 日本電気株式会社 | ボール配列治具及びその製造方法 |
| US6107181A (en)* | 1997-09-08 | 2000-08-22 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| US5985694A (en)* | 1997-09-29 | 1999-11-16 | Motorola, Inc. | Semiconductor die bumping method utilizing vacuum stencil |
| JPH11340695A (ja)* | 1998-05-25 | 1999-12-10 | Sony Corp | 組立装置 |
| US6325272B1 (en)* | 1998-10-09 | 2001-12-04 | Robotic Vision Systems, Inc. | Apparatus and method for filling a ball grid array |
| JP3932501B2 (ja)* | 1998-12-01 | 2007-06-20 | 澁谷工業株式会社 | ボールマウント装置 |
| JP3024113B1 (ja)* | 1999-01-27 | 2000-03-21 | 株式会社日鉄マイクロメタル | 金属球配列方法及び配列装置 |
| TW451359B (en)* | 1999-03-16 | 2001-08-21 | Matsushita Electric Industrial Co Ltd | Mounting equipment and mounting method of conductive balls |
| JP3283026B2 (ja)* | 1999-04-30 | 2002-05-20 | 新光電気工業株式会社 | ボール状端子の吸着装置及びボール状端子の搭載方法 |
| JP4598240B2 (ja)* | 1999-06-24 | 2010-12-15 | アスリートFa株式会社 | ボール搭載装置及びボール搭載方法 |
| US6484927B1 (en)* | 1999-11-05 | 2002-11-26 | Delaware Capital Formation Corporation | Method and apparatus for balling and assembling ball grid array and chip scale array packages |
| AT410499B (de)* | 2000-10-31 | 2003-05-26 | Datacon Semiconductor Equip | Einrichtung zur führung eines linear bewegbaren werkzeuges |
| US6769596B1 (en)* | 2002-11-15 | 2004-08-03 | Qlogic Corporation | Method and system for reworking ball grid arrays |
| WO2004107432A1 (ja)* | 2003-05-29 | 2004-12-09 | Fujitsu Limited | 電子部品の実装方法、取外し方法及びその装置 |
| US8671561B2 (en)* | 2007-05-24 | 2014-03-18 | Shinko Electric Industries Co., Ltd. | Substrate manufacturing method |
| KR101944396B1 (ko)* | 2017-04-25 | 2019-02-01 | (주)에스에스피 | 반도체패키징용 플럭스툴 |
| CN109623080A (zh)* | 2019-01-24 | 2019-04-16 | 合肥巨动力系统有限公司 | 一种高效率扁线电机绕组端部焊接装置及焊接工艺 |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4292116A (en)* | 1978-04-18 | 1981-09-29 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on a printed circuit board |
| US5729894A (en)* | 1992-07-21 | 1998-03-24 | Lsi Logic Corporation | Method of assembling ball bump grid array semiconductor packages |
| US5284287A (en)* | 1992-08-31 | 1994-02-08 | Motorola, Inc. | Method for attaching conductive balls to a substrate |
| US5467913A (en)* | 1993-05-31 | 1995-11-21 | Citizen Watch Co., Ltd. | Solder ball supply device |
| JP2916086B2 (ja)* | 1994-10-28 | 1999-07-05 | 株式会社日立製作所 | 電子部品の実装方法 |
| JP3079921B2 (ja)* | 1994-11-28 | 2000-08-21 | 松下電器産業株式会社 | 半田ボールの搭載装置および搭載方法 |
| US5547740A (en)* | 1995-03-23 | 1996-08-20 | Delco Electronics Corporation | Solderable contacts for flip chip integrated circuit devices |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100453689B1 (ko)* | 1997-12-30 | 2005-02-23 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지제조용볼범핑시스템의자동볼싸이즈필터링장치및그방법 |
| Publication number | Publication date |
|---|---|
| KR100262844B1 (ko) | 2000-09-01 |
| TW370480B (en) | 1999-09-21 |
| US5890283A (en) | 1999-04-06 |
| Publication | Publication Date | Title |
|---|---|---|
| KR970072227A (ko) | 도전성 보올의 탑재장치 및 방법 | |
| KR970077081A (ko) | 다이-본딩 장치 | |
| CN102163541B (zh) | 芯片焊接装置 | |
| KR100214098B1 (ko) | 도전성볼의 탑재장치 및 탑재방법 | |
| JP3803465B2 (ja) | 導電性ボールの移載装置および移載方法 | |
| JPH0463084U (ko) | ||
| US4638937A (en) | Beam lead bonding apparatus | |
| JPH02190000A (ja) | プリント基板のバックアップ装置 | |
| AU2003278181A1 (en) | Mounting component for floor strip | |
| JP3376875B2 (ja) | 導電性ボールの移載装置および移載方法 | |
| CN211660834U (zh) | 一种汽车大梁连接支架冲压成型装置 | |
| CN108140601A (zh) | 芯片分离装置与芯片分离方法 | |
| JP3803439B2 (ja) | 導電性ボールの搭載装置および搭載方法 | |
| KR100377087B1 (ko) | 캐리어테이프와그제조방법및제조장치 | |
| JP3613170B2 (ja) | 基板の下受け装置および下受け方法 | |
| CN214928018U (zh) | 一种用于丝印加工的按钮快速压紧治具 | |
| CN209381399U (zh) | 一种产品侧面贴合辅料的装置 | |
| JPS58120114U (ja) | 駆動チエン装置 | |
| KR910007432Y1 (ko) | 피압착체의 압착장치 | |
| KR960044023A (ko) | 전자부품장착기의 흡착높이 제어장치 | |
| JP3303684B2 (ja) | 導電性ボール搭載装置及び導電性ボール搭載方法 | |
| JPH07308881A (ja) | 板状ワークの把持装置 | |
| KR200333547Y1 (ko) | 반도체 소자의 픽업장치 | |
| JPH06342997A (ja) | 実装装置 | |
| ATE54705T1 (de) | Fussbodenplatte fuer doppelboeden. |
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application | St.27 status event code:A-0-1-A10-A12-nap-PA0109 | |
| PA0201 | Request for examination | St.27 status event code:A-1-2-D10-D11-exm-PA0201 | |
| R17-X000 | Change to representative recorded | St.27 status event code:A-3-3-R10-R17-oth-X000 | |
| PG1501 | Laying open of application | St.27 status event code:A-1-1-Q10-Q12-nap-PG1501 | |
| PN2301 | Change of applicant | St.27 status event code:A-3-3-R10-R13-asn-PN2301 St.27 status event code:A-3-3-R10-R11-asn-PN2301 | |
| R18-X000 | Changes to party contact information recorded | St.27 status event code:A-3-3-R10-R18-oth-X000 | |
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection | St.27 status event code:A-1-2-D10-D21-exm-PE0902 | |
| T11-X000 | Administrative time limit extension requested | St.27 status event code:U-3-3-T10-T11-oth-X000 | |
| P11-X000 | Amendment of application requested | St.27 status event code:A-2-2-P10-P11-nap-X000 | |
| P13-X000 | Application amended | St.27 status event code:A-2-2-P10-P13-nap-X000 | |
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration | St.27 status event code:A-1-2-D10-D22-exm-PE0701 | |
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment | St.27 status event code:A-2-4-F10-F11-exm-PR0701 | |
| PR1002 | Payment of registration fee | St.27 status event code:A-2-2-U10-U11-oth-PR1002 Fee payment year number:1 | |
| PG1601 | Publication of registration | St.27 status event code:A-4-4-Q10-Q13-nap-PG1601 | |
| PR1001 | Payment of annual fee | St.27 status event code:A-4-4-U10-U11-oth-PR1001 Fee payment year number:4 | |
| PR1001 | Payment of annual fee | St.27 status event code:A-4-4-U10-U11-oth-PR1001 Fee payment year number:5 | |
| PR1001 | Payment of annual fee | St.27 status event code:A-4-4-U10-U11-oth-PR1001 Fee payment year number:6 | |
| PR1001 | Payment of annual fee | St.27 status event code:A-4-4-U10-U11-oth-PR1001 Fee payment year number:7 | |
| PR1001 | Payment of annual fee | St.27 status event code:A-4-4-U10-U11-oth-PR1001 Fee payment year number:8 | |
| PR1001 | Payment of annual fee | St.27 status event code:A-4-4-U10-U11-oth-PR1001 Fee payment year number:9 | |
| R17-X000 | Change to representative recorded | St.27 status event code:A-5-5-R10-R17-oth-X000 | |
| R18-X000 | Changes to party contact information recorded | St.27 status event code:A-5-5-R10-R18-oth-X000 | |
| FPAY | Annual fee payment | Payment date:20090424 Year of fee payment:10 | |
| PR1001 | Payment of annual fee | St.27 status event code:A-4-4-U10-U11-oth-PR1001 Fee payment year number:10 | |
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee | St.27 status event code:A-4-4-U10-U13-oth-PC1903 Not in force date:20100509 Payment event data comment text:Termination Category : DEFAULT_OF_REGISTRATION_FEE | |
| PC1903 | Unpaid annual fee | St.27 status event code:N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text:Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date:20100509 | |
| PN2301 | Change of applicant | St.27 status event code:A-5-5-R10-R13-asn-PN2301 St.27 status event code:A-5-5-R10-R11-asn-PN2301 |