KR101253991B1 - Adhesive composition for flexible print circuit board and adhesive film using the same - Google Patents
Adhesive composition for flexible print circuit board and adhesive film using the sameDownload PDFInfo
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- KR101253991B1 KR101253991B1KR1020110130408AKR20110130408AKR101253991B1KR 101253991 B1KR101253991 B1KR 101253991B1KR 1020110130408 AKR1020110130408 AKR 1020110130408AKR 20110130408 AKR20110130408 AKR 20110130408AKR 101253991 B1KR101253991 B1KR 101253991B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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Abstract
Translated fromKoreanDescription
Translated fromKorean본 발명은 연성인쇄회로기판용 점착제 조성물 및 이를 이용한 연성인쇄회로기판용 점착필름에 관한 것으로서, 보다 상세하게는 종래에 열경화성 접착 필름으로 보강판을 부착하여 요구 물성을 확보하기 위해서는 프레스 기기를 이용해 반드시 고온에서 1시간 정도의 후 경화(post cure) 공정이 필요했던 것을 특유의 점착제와 이를 이용한 점착 필름으로 대체함으로써 공정 간소화는 물론 초기 점착력, 부착력이나 리플로우(reflow) 특성 등의 요구 물성을 모두 만족하는 연성인쇄회로기판용 점착제 조성물 및 이를 이용한 연성인쇄회로기판용 점착필름에 관한 것이다.The present invention relates to a pressure-sensitive adhesive composition for a flexible printed circuit board and a pressure-sensitive adhesive film for a flexible printed circuit board using the same, and more specifically, in order to secure the required physical properties by attaching a reinforcing plate with a thermosetting adhesive film in the prior art, By replacing the need for a post cure process at a high temperature for about 1 hour with a unique adhesive and an adhesive film using the same, it not only simplifies the process but also satisfies all the required properties such as initial adhesive force, adhesion, and reflow characteristics. It relates to an adhesive composition for a flexible printed circuit board and an adhesive film for a flexible printed circuit board using the same.
일반적으로, 플렉시블 프린트 배선판(이하, '연성회로기판' 또는 'FPCB'라고도 함.)에는 여러 가지 보강재가 전자부품의 고정 및 보강과 같은 용도로 사용되고 있다. 이러한 종류의 적용은 기판 위의 전자 부품을 장착시키는데 있어서 보강재의 강한 접착력뿐만 아니라 높은 내열성이 요구된다.In general, a flexible printed wiring board (hereinafter, also referred to as a "flexible circuit board" or "FPCB") is used for various reinforcing materials, such as fixing and reinforcing electronic components. This kind of application requires high heat resistance as well as strong adhesion of the reinforcement in mounting the electronic components on the substrate.
이러한 보강재료로서는 금속판, 유리섬유 강화 에폭시 시트, 폴리에스테르계 보강판, 폴리이미드 보강판 등이 일반적으로 많이 사용되고 있다. 또한 연성회로기판은 대부분 내열성 및 수치안정성이 우수한 폴리이미드 필름으로 구성되어 있어서 특히 폴리이미드와의 접착력이 우수하여야 한다. 또한, 보강판 접착시에는 예전의 경우, 장시간에 걸쳐서 고온, 고압 프레스 하에서 접착이 이뤄지지만 점차 프레스 접착시간을 단축하는 추세이다.As such a reinforcing material, a metal plate, a glass fiber reinforced epoxy sheet, a polyester-based reinforcing plate, a polyimide reinforcing plate, and the like are generally used. In addition, since the flexible circuit board is mostly composed of a polyimide film having excellent heat resistance and numerical stability, it should be particularly excellent in adhesion with the polyimide. In addition, when bonding the reinforcing plate, in the past, the bonding is performed under a high temperature and high pressure press for a long time, but gradually the press bonding time is a trend.
또한, 최근의 FPC 실장에서는 환경 부하를 저감시키기 위해서 무연 땜납을 사용하지만, 무연 땜납의 용융온도는 납 땜납에 비해 높아, 땜납의 용융 공정에서 리플로우 로의 설정온도를 높게 해야 하기 때문에 높은 내열성을 요구하고 있다.In addition, in recent FPC implementations, lead-free solder is used to reduce environmental load. However, the melting temperature of lead-free solder is higher than that of lead solder, and high heat resistance is required because the set temperature of the reflow furnace is high in the solder melting process. Doing.
이와 같은 용도에 사용되는 접착 시트에는, 예를 들면 에폭시 수지와 에폭시 수지의 경화제와의 혼합물을 경화성분으로서 접착력 개선이나 열가소성을 부여하기 위해 아크릴로나이트릴 부타디엔 고무(acrylonitrile butadiene rubber) 등의 열가소성 성분을 배합한 에폭시 수지계 조성물이 넓게 사용된다. 이와 같은 에폭시 수지계 조성물은 고온, 고압 하에서 장시간 프레스 시에는 고내열성으로 양호한 기재 접착력을 가지지만 조성물 중의 과반수가 에폭시 수지 및 그 경화제가 차지하게 되고 또한 프레스 시간을 5분 이하로 하는 속프레스(quick press)조건에서는 우수한 접착력과 내열성을 얻을 수 없다. 프레스 시간 단축을 위해서 경화촉진제를 일정량 투입하는 경우에도 약간의 개선효과는 얻을 수 있으나 한계가 있다는 문제점이 있었는바, 이러한 문제점을 해결하기 위해 한국 특허공개공보 제 2011-0087760호에는 "이소시아네이트 말단기를 가진 우레탄 고분자와 실리콘 변성 디아민 공중합물로서, 실리콘기를 가지지 않는 디아민과 실리콘 변성 디아민의 공중합물인 실리콘 변성 디아민 공중합물의 반응에 의해 얻어진 산가가 3-30mg KOH/g이고, Si함량이 500~12,000ppm인 실리콘 변성 폴리우레탄 우레아 수지 및 실리콘 변성 에폭시 화합물을 포함하는 연성회로기판용 열경화성 접착제 조성물"을 기재하고 있다.In the adhesive sheet used for such a use, for example, a thermoplastic component such as acrylonitrile butadiene rubber in order to improve the adhesive strength or impart thermoplasticity by using a mixture of an epoxy resin and a curing agent of an epoxy resin as a curing component. The epoxy resin composition which mix | blended this is widely used. Such an epoxy resin composition has high heat resistance and good substrate adhesion when pressed for a long time under high temperature and high pressure, but a majority of the composition is occupied by an epoxy resin and its curing agent and a press time of 5 minutes or less. ), Excellent adhesion and heat resistance are not obtained. Even if a certain amount of curing accelerator is added to shorten the press time, a slight improvement can be obtained, but there is a problem that there is a limit. To solve such a problem, Korean Patent Publication No. 2011-0087760 discloses a "isocyanate end group. A urethane polymer having a silicone-modified diamine copolymer having an acid value of 3-30 mg KOH / g obtained by the reaction of a silicone-modified diamine copolymer which is a copolymer of a diamine having no silicone group and a silicone-modified diamine, and having a Si content of 500 to 12,000 ppm. A thermosetting adhesive composition for a flexible circuit board comprising a silicone-modified polyurethane urea resin and a silicone-modified epoxy compound.
그러나 위 특허뿐만 아니라 종래에는 연성인쇄회로기판(FPCB)에 보강판 부착 시 열경화성 접착필름이 사용되어 요구되는 물성을 만족시키기 위해서는 프레스(press) 기기를 이용해 고온, 고압으로 일정 시간 압착한 이후 반드시 고온에서 1시간 이상의 후 경화(post cure) 공정이 필요하였다. 이는 업체의 생산 능력(capacity)과 직결되어 후 경화 조건을 최소화하려는 연구가 진행되고 있는 실정이다.However, in addition to the above patent, in order to satisfy the required physical properties by using a thermosetting adhesive film when attaching a reinforcement plate to a flexible printed circuit board (FPCB), it is necessary to press a high temperature and a high pressure using a press machine for a certain period of time. A post cure process of more than 1 hour was required. This is a situation in which research is being conducted to minimize post-curing conditions in direct connection with a company's production capacity.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출한 것으로서, 본 발명의 목적은The present invention has been made to solve the above problems, the object of the present invention is
종래에 열경화성 접착 필름으로 보강판을 부착하여 요구 물성을 확보하기 위해서는 프레스 기기를 이용해 반드시 고온에서 1시간 정도의 후 경화(post cure) 공정이 필요했던 것을 특유의 점착제와 이를 이용한 점착 필름으로 대체함으로써 공정 간소화는 물론 초기 점착력, 부착력이나 리플로우(reflow) 특성 등의 요구 물성을 모두 만족하는 연성인쇄회로기판용 점착제 조성물 및 이를 이용한 연성인쇄회로기판용 점착필름을 제공하고자 하는 것이다.In order to secure the required properties by attaching a reinforcing plate with a thermosetting adhesive film, by replacing the one with a pressure-sensitive adhesive and a pressure-sensitive adhesive film using a press machine, a post cure process is required at a high temperature for about 1 hour. It is to provide a pressure-sensitive adhesive composition for a flexible printed circuit board and a flexible film for a flexible printed circuit board using the same, as well as simplifying the process, satisfying all the required physical properties such as initial adhesion, adhesion, or reflow characteristics.
본 발명의 상기 및 다른 목적과 이점은 바람직한 실시예를 설명한 하기의 설명으로부터 보다 분명해 질 것이다.These and other objects and advantages of the present invention will become more apparent from the following description of a preferred embodiment thereof.
상기 목적은, 폴리디메틸실록산 검(polydimethylsiloxane gum)과 실리케이트 레진(silicate Resin)으로 이루어진 과산화물 경화형 감압 점착제인 것을 특징으로 하는 연성인쇄회로기판용 점착제 조성물에 의해 달성된다.The above object is achieved by a pressure-sensitive adhesive composition for a flexible printed circuit board, which is a peroxide cured pressure-sensitive adhesive made of polydimethylsiloxane gum and silicate resin.
여기서, 상기 과산화물 경화형 감압 점착제는 상기 폴리디메틸실록산 검 100중량 대비 상기 실리케이트 레진 140 내지 200중량부를 포함하는 것을 특징으로 한다.Here, the peroxide curable pressure-sensitive adhesive is characterized in that it comprises 140 to 200 parts by weight of the silicate resin relative to 100 weight of the polydimethylsiloxane gum.
또한 상기 목적은 기재필름과, 상기 기재필름의 일면에 형성된 점착층으로서, 상기 연성인쇄회로기판용 점착제 조성물로 도포된 점착층을 포함하는 것을 특징으로 하는 연성인쇄회로기판용 점착필름에 의해 달성된다.In addition, the above object is achieved by a pressure-sensitive adhesive film for a flexible printed circuit board comprising a base film and an adhesive layer formed on one surface of the base film, the pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition for a flexible printed circuit board. .
여기서, 상기 점착층 상에 불소계 이형 필름이 라미네이션되어 있는 것을 특징으로 한다.Here, the fluorine-based release film is laminated on the adhesive layer.
본 발명에 따르면, 프레스 공정과 후 경화 공정을 생략할 수 있어 공정 간소화는 물론 부착력, 초기 점착력 및 리플로우(reflow) 특성 등 요구 물성도 모두 만족하는 등의 효과를 가진다.According to the present invention, it is possible to omit the pressing step and the post-curing step, and the effect of simplifying the process as well as satisfying all the required properties such as adhesion, initial adhesive force, and reflow characteristics.
도 1은 본 발명의 일 실시예에 따른 연성인쇄회로기판용 점착필름의 단면도.1 is a cross-sectional view of an adhesive film for a flexible printed circuit board according to an embodiment of the present invention.
이하, 본 발명의 실시예와 도면을 참조하여 본 발명을 상세히 설명한다. 이들 실시예는 오로지 본 발명을 보다 구체적으로 설명하기 위해 예시적으로 제시한 것일 뿐, 본 발명의 범위가 이들 실시예에 의해 제한되지 않는다는 것은 당업계에서 통상의 지식을 가지는 자에 있어서 자명할 것이다.Hereinafter, the present invention will be described in detail with reference to embodiments and drawings of the present invention. These examples are only presented by way of example only to more specifically describe the present invention, it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples. .
본 발명에 따른 연성인쇄회로기판용 점착제 조성물은 폴리디메틸실록산 검(polydimethylsiloxane gum)과 실리케이트 레진(silicate Resin)으로 이루어진 과산화물 경화형 감압 점착제인 것을 특징으로 한다.The pressure-sensitive adhesive composition for a flexible printed circuit board according to the present invention is characterized in that the peroxide cured pressure-sensitive adhesive made of polydimethylsiloxane gum and silicate resin.
상기 폴리디메틸실록산 검(polydimethylsiloxane gum)과 상기 실리케이트 레진(silicate Resin)은 당업계에 잘 알려진 물질이므로 상세한 설명은 생략하기로 한다.Since the polydimethylsiloxane gum and the silicate resin are well known in the art, detailed descriptions thereof will be omitted.
또한 본 발명에 따른 연성인쇄회로기판용 점착제 조성물의 상기 과산화물 경화형 감압 점착제는 상기 폴리디메틸실록산 검 100중량 대비 상기 실리케이트 레진 140 내지 200중량부를 포함하는 것을 특징으로 한다. 상기 실리케이트 레진이 140 중량부 미만인 경우에는 초기 점착력이 너무 높아 가접 등의 작업이 불가능하고 또한 반대로 상기 실리케이트 레진이 200중량부를 초과하는 경우에는 초기 점착력이 너무 낮아져 가접 등의 작업이 불가능하기 때문에 상기 실리케이트 레진의 중량은 상기 범위를 하는 것이 가장 바람직하다.In addition, the peroxide curable pressure-sensitive adhesive of the pressure-sensitive adhesive composition for a flexible printed circuit board according to the present invention is characterized in that it comprises 140 to 200 parts by weight of the silicate resin relative to 100 weight of the polydimethylsiloxane gum. When the silicate resin is less than 140 parts by weight, the initial adhesive force is too high, so that the operation such as temporary welding is not possible, and conversely, when the silicate resin exceeds 200 parts by weight, the initial adhesive force is too low and the operation such as temporary welding is impossible. The weight of the resin is most preferably in the above range.
또한 본 발명에 따른 연성인쇄회로기판용 점착필름은, 도 1에 도시된 바와 같이, 기재필름(이형지)과 상기 기재필름의 일면에 형성된 점착층으로서 상기 연성인쇄회로기판용 점착제 조성물로 도포된 점착층을 포함하는 것을 특징으로 한다.In addition, the adhesive film for a flexible printed circuit board according to the present invention, as shown in Figure 1, a base film (release paper) and an adhesive layer formed on one surface of the base film, the adhesive applied to the adhesive composition for a flexible printed circuit board It characterized in that it comprises a layer.
바람직하게는 상기 점착층 상에 불소계 이형 필름이 라미네이션되어 있는 것을 특징으로 한다.Preferably, the fluorine-based release film is laminated on the adhesive layer.
본 발명에 따른 연성인쇄회로기판용 점착필름은 일정한 중량의 상기 폴리디메틸실록산 검과 상기 실리케이트 레진을 혼합한 다음 고형분이 20 내지 40%가 되도록 용매를 첨가한 후 마그네틱 바를 이용하여 상온에서 교반한 후 이형필름 위에 건조 후 일정한 점착층의 두께가 되도록 코팅한 다음 이형지를 라미네이션하여 제조한다. 이렇게 제조된 연성인쇄회로기판용 점착필름은 도 1과 같은 구성을 가진다.In the adhesive film for flexible printed circuit board according to the present invention, after mixing the polydimethylsiloxane gum and the silicate resin of a certain weight and then adding a solvent so that the solid content is 20 to 40%, after stirring at room temperature using a magnetic bar After drying on the release film is coated to a certain thickness of the adhesive layer is prepared by laminating the release paper. The adhesive film for a flexible printed circuit board thus manufactured has a configuration as shown in FIG. 1.
이렇게 제조된 연성인쇄회로기판용 점착필름은 다음과 같은 물성이 요구되고 있다.The adhesive film for a flexible printed circuit board thus manufactured is required to have the following physical properties.
첫째, 통상 연성인쇄회로기판용 점착필름의 부착력은 필름에 의해 부착된 보강판의 유지력을 측정하는 것으로 통상 6.0 N/cm 이상의 강도가 요구되고 있고, 둘째, 연성인쇄회로기판의 경우에는 보강판을 부착한 후 각종 반도체 패키지들을 실장하게 되는데 최근에는 무연남땜 리플로우 공정이 보편화되어 있어 보강판 부착용 점착필름도 리플로우 공정 조건을 견딜 수 있는 내열성이 요구되고 있으며, 셋째, 통상 업계에서는 보강판과 접착필름을 1차 라미네이션한 후 연성인쇄회로기판 위에 자동 혹은 수동으로 가접하여 2차 라미네이션을 진행하는데 이 때 접착필름이 일정 수준 이상의 초기 점착력이 있지 않으면 2차 라미네이션 시에 보강판의 밀림 현상이 발생하게 되고, 또한 너무 높을 경우에는 가접 작업이 어렵게 되므로 통상적으로 업계에서는 50gf 이상 150gf 이하의 초기 점착력 값을 요구하고 있다.First, the adhesive force of the pressure-sensitive adhesive film for flexible printed circuit board is to measure the holding force of the reinforcing plate attached by the film, and generally requires strength of 6.0 N / cm or more. Second, in the case of the flexible printed circuit board, the reinforcing plate is used. After attaching, various semiconductor packages are mounted. In recent years, lead-free solder reflow process is common, and adhesive film for reinforcement plate is also required to be heat resistant to withstand the reflow process conditions. After the first lamination, the film is automatically or manually welded onto the flexible printed circuit board to proceed with the second lamination. At this time, if the adhesive film does not have a certain initial level of adhesive force, the reinforcement of the reinforcement plate may occur during the second lamination. In addition, if it is too high, the temporary work is difficult, so in the industry usually 50g Initial adhesive force values of f or more and 150gf or less are required.
본 발명에 따른 연성인쇄회로기판용 점착제 조성물 및 이를 이용한 연성인쇄회로기판용 점착필름에 따르면, 종래에 열경화성 접착 필름으로 보강판을 부착하여 요구 물성을 확보하기 위해서는 프레스 기기를 이용해 반드시 고온에서 1시간 정도의 후 경화(post cure) 공정이 필요했던 것을 특유의 점착제와 이를 이용한 점착 필름으로 대체함으로써 공정 간소화는 물론 부착력이나 리플로우(reflow) 특성 등의 요구 물성을 모두 만족한다. 이에 대해서는 아래 실시예와 비교예를 통해 보다 상세히 설명한다.According to the pressure-sensitive adhesive composition for a flexible printed circuit board according to the present invention and the pressure-sensitive adhesive film for a flexible printed circuit board using the same, in order to secure the required physical properties by attaching a reinforcing plate with a thermosetting adhesive film conventionally, a press machine must be used at a high temperature for 1 hour. By replacing the need for a post cure process with a specific adhesive and a pressure-sensitive adhesive film using the same, it satisfies all the required properties such as adhesion and reflow characteristics as well as the process simplification. This will be described in more detail through the following examples and comparative examples.
이하, 실시예와 비교예를 통하여 본 발명의 구성 및 그에 따른 효과를 보다 상세히 설명하고자 한다. 그러나, 본 실시예는 본 발명을 보다 구체적으로 설명하기 위한 것이며, 본 발명의 범위가 이들 실시예에 한정되는 것은 아니다.Hereinafter, the configuration and effects of the present invention will be described in more detail with reference to Examples and Comparative Examples. However, this embodiment is intended to illustrate the present invention in more detail, and the scope of the present invention is not limited to these examples.
[실시예 1 내지 5][Examples 1 to 5]
실시예 1 내지 5는 아래 표 1의 조성과 같이 점착제 조성물을 혼합한 후 고형분이 30%가 되도록 자일렌(Xylene) 용매를 혼합하였다. 다음으로 마그네틱 바를 이용하여 상온에서 30분 동안 교반한 후 38㎛의 불소계 이형필름 위에 건조 후 점착층의 두께가 25㎛이 되도록 코팅한다. 이때 건조 조건은 65℃/5min이고, 이후 불소계 이형지를 라미네이션하여 도 1과 같이 점착필름을 제조하였다. 즉 본 실시예들은 모두 프레스 공정과 후 경화 공정을 생략한 것이다.Examples 1 to 5 were mixed with a xylene solvent so that the solid content is 30% after mixing the pressure-sensitive adhesive composition as shown in Table 1 below. Next, after stirring for 30 minutes at room temperature using a magnetic bar and then coated on a 38㎛ fluorine-based release film and the thickness of the adhesive layer to 25㎛. At this time, the drying condition is 65 ℃ / 5min, and then laminated with a fluorine-based release paper to prepare an adhesive film as shown in FIG. That is, all of the embodiments omit the pressing process and the post curing process.
[[비교예Comparative example 1 내지 4] 1 to 4]
비교예 1, 2는 아래 표 2의 조성과 같이 점착제 조성물을 혼합한 후 고형분이 30%가 되도록 자일렌(Xylene) 용매를 혼합하였다. 다음으로 마그네틱 바를 이용하여 상온에서 30분 동안 교반한 후 38㎛의 불소계 이형필름 위에 건조 후 점착층의 두께가 25㎛이 되도록 코팅한다. 이때 건조 조건은 65℃/5min이고, 이후 불소계 이형지를 라미네이션하여 도 1과 같이 점착필름을 제조하였다. 그리고 종래의 기술에서 사용되는 소니社의 D3410 제품을 비교예 3과 4로 하되, 비교예 3은 프레스 공정과 후 경화 조건을 생략한 것이고 비교예 4의 경우에는 프레싱 공정과 후 경화 공정을 모두 거친 것을 대상으로 하였다.In Comparative Examples 1 and 2, the pressure-sensitive adhesive composition was mixed as in the composition of Table 2 below, and the xylene solvent was mixed so that the solid content was 30%. Next, after stirring for 30 minutes at room temperature using a magnetic bar and then coated on a 38㎛ fluorine-based release film and the thickness of the adhesive layer to 25㎛. At this time, the drying condition is 65 ℃ / 5min, and then laminated with a fluorine-based release paper to prepare an adhesive film as shown in FIG. In addition, Sony's D3410 product used in the prior art as Comparative Examples 3 and 4, Comparative Example 3 omits the pressing process and the post-cure conditions, in the case of Comparative Example 4 went through both the pressing process and the post-cure process The object was made.
상기 실시예 1 내지 5 및 비교예 1 내지 4에 따른 연성인쇄회로기판용 점착필름을 사용하여 다음과 같은 실험예를 통해 물성을 측정하고 그 결과를 다음 표 3에 나타내었다.Physical properties of the flexible printed circuit boards according to Examples 1 to 5 and Comparative Examples 1 to 4 were measured through the following experimental examples, and the results are shown in Table 3 below.
[실험예][Experimental Example]
(1) 부착력(1) adhesion
실시예 1 내지 5와 비교예 1 내지 3은 제조된 각각의 점착필름의 이형필름과 이형지를 제거하고 한쪽 면은 연성인쇄회로기판의 폴리이미드(polyimide, SKCKOLON PI社 LN100)면에 다른 한 면은 글라스 에폭시(Glass Epoxy) 보강판이 되도록 하여 120℃/1.5mpm의 조건으로 라미네이션 한다. 이후 보강판 쪽을 고정한 후 5cm/min의 속도로 180도 Peel 강도를 측정하였다.Examples 1 to 5 and Comparative Examples 1 to 3 remove the release film and the release paper of each of the adhesive films prepared, and one side of the polyimide (SKIMOL, LN100) of the flexible printed circuit board Laminate under the condition of 120 ℃ / 1.5mpm to make glass epoxy reinforcement plate. After fixing the side of the reinforcing plate was measured the Peel strength 180 degrees at a speed of 5cm / min.
한편, 비교예 4는 종래 기술과 같은 방법으로 라미네이션된 샘플을 160℃/1hr/30kgf의 조건으로 프레스 한 후 160℃/1hr의 조건으로 후 경화를 한 후 동일 조건으로 180도 Peel 강도를 측정하였다.Meanwhile, in Comparative Example 4, the laminated sample was pressed in the same manner as in the prior art, and then cured at 160 ° C / 1hr / 30kgf, and then cured at 160 ° C / 1hr. .
(2) 리플로우 평가(2) reflow evaluation
부착력 측정 시와 동일한 조건과 방법으로 각각의 샘플을 제작한 후 연성인쇄회로기판이 납땜조를 향하도록 하여 288℃로 설정된 납땜조에 10초 동안 띄워 놓은 후 들뜸(void) 발생 여부를 관찰하였다.Each sample was manufactured under the same conditions and methods as in the measurement of adhesion force, and the flexible printed circuit board was placed in the solder bath set at 288 ° C. for 10 seconds to observe the occurrence of voids.
(3) 초기 점착력의 평가(3) Evaluation of Initial Adhesion
각각 제조된 점착필름을 2cm X 6cm의 크기로 자른 후 이형필름과 이형지를 모두 제거하고 한 면을 샘플 받침대에 양면테이프로 고정시킨 후 텍키니스(tackiness) 측정기를 이용하여 초기 점착력을 측정하였다.Each prepared adhesive film was cut to a size of 2cm X 6cm, and then both the release film and the release paper were removed, and one side was fixed with a double-sided tape on a sample pedestal, and the initial adhesive force was measured using a tackiness meter.
N/cmAdhesion
N / cm
(gf)Initial adhesion
(gf)
상기 표 3에서 볼 수 있듯이, 본 발명에 의해 제조된 점착필름은 프레스 공정과 후 경화 공정을 생략하여도 연성인쇄회로기판용 점착필름의 요구 물성, 즉 6.0 N/cm 이상의 부착력, 리플로우 공정 조건을 견딜 수 있는 내열성 및 50gf 내지 150gf의 초기 점착력 값을 모두를 만족한다. 반면 상기 폴리디메틸실록산 검 100중량 대비 상기 실리케이트 레진 130중량부로 조성물을 구성한 비교예 1 및 상기 폴리디메틸실록산 검 100중량 대비 상기 실리케이트 레진 210중량부로 조성물을 구성한 2의 경우에는 부착력과 초기 점착력에서 요구 물성을 충족하지 못하고, 또한 종래의 접착필름으로 프레스 공정과 후 경화 조건을 생략하여 평가한 비교예 3의 경우에는 요구 물성이 충족되지 않음을 확인할 수 있으며 비교예 4의 경우에는 요구 물성을 모두 만족하지만 프레싱 공정과 후 경화 공정을 모두 거친 상태이다.As can be seen in Table 3, the pressure-sensitive adhesive film prepared according to the present invention is required physical properties of the pressure-sensitive adhesive film for flexible printed circuit board, that is, the adhesion force of 6.0 N / cm or more, even if the pressing process and the post-curing process is omitted It satisfies both the heat resistance to withstand and the initial adhesive strength value of 50gf to 150gf. On the other hand, in the case of Comparative Example 1 composed of 130 parts by weight of the silicate resin with respect to 100 weight of the polydimethylsiloxane gum and 2 of the composition of 210 parts by weight of the silicate resin with respect to 100 weight of the polydimethylsiloxane gum required properties in the adhesion and initial adhesive force In the case of Comparative Example 3 evaluated by omitting the pressing process and post-curing conditions with the conventional adhesive film, and also not satisfied, it can be confirmed that the required physical properties are not satisfied. Both the pressing process and the post-curing process have passed.
본 명세서에서는 본 발명자들이 수행한 다양한 실시예 가운데 몇 개의 예만을 들어 설명하는 것이나 본 발명의 기술적 사상은 이에 한정하거나 제한되지 않고, 당업자에 의해 변형되어 다양하게 실시될 수 있음은 물론이다.It is to be understood that the present invention is not limited to the above embodiments and various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.
101: 기재필름(이형지)102: 점착층
103: 이형필름
101: base film (release paper) 102: adhesive layer
103: release film
Claims (4)
Translated fromKorean폴리디메틸실록산 검(polydimethylsiloxane gum)과 실리케이트 레진(silicate Resin)으로 이루어진 과산화물 경화형 감압 점착제인 것을 특징으로 하는 연성인쇄회로기판용 점착제 조성물.In the pressure-sensitive adhesive composition for a flexible printed circuit board,
Adhesive composition for a flexible printed circuit board, characterized in that the peroxide curable pressure-sensitive adhesive consisting of polydimethylsiloxane gum (silicate Resin).
상기 과산화물 경화형 감압 점착제는 상기 폴리디메틸실록산 검 100중량 대비 상기 실리케이트 레진 140 내지 200중량부를 포함하는 것을 특징으로 하는, 연성인쇄회로기판용 점착제 조성물.The method of claim 1,
The peroxide curable pressure-sensitive adhesive is characterized in that it comprises 140 to 200 parts by weight of the silicate resin relative to 100 weight of the polydimethylsiloxane gum, pressure-sensitive adhesive composition for a printed circuit board.
상기 기재필름의 일면에 형성된 점착층으로서, 제 1항 또는 제 2항에 따른 연성인쇄회로기판용 점착제 조성물로 도포된 점착층을 포함하는 것을 특징으로 하는, 연성인쇄회로기판용 점착필름.Base film,
An adhesive layer formed on one surface of the base film, characterized in that it comprises an adhesive layer coated with the pressure-sensitive adhesive composition for a flexible printed circuit board according to claim 1, wherein the adhesive film for a flexible printed circuit board.
상기 점착층 상에 불소계 이형 필름이 라미네이션 되어 있는 것을 특징으로 하는, 연성인쇄회로기판용 점착필름.The method of claim 3,
The adhesive film for flexible printed circuit board, characterized in that the fluorine-based release film is laminated on the adhesive layer.
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| KR1020110130408AKR101253991B1 (en) | 2011-12-07 | 2011-12-07 | Adhesive composition for flexible print circuit board and adhesive film using the same |
| CN2012101020855ACN103146338A (en) | 2011-12-07 | 2012-04-09 | Adhesive composition for flexible print circuit board and adhesive film using the same |
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| US10426044B2 (en)* | 2015-12-18 | 2019-09-24 | Dic Corporation | Thermosetting adhesive sheet, reinforcement-part-equipped flexible printed circuit, method for manufacturing reinforcement-part-equipped flexible printed circuit, and electronic device |
| CN113597088B (en)* | 2021-07-22 | 2022-08-26 | 深圳市华鼎星科技有限公司 | Circuit material, preparation method and circuit board thereof |
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| KR20050111363A (en)* | 2003-03-17 | 2005-11-24 | 다우 코닝 코포레이션 | Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength |
| KR100708441B1 (en)* | 2005-12-30 | 2007-04-18 | 주식회사 케이씨씨 | Silicone composition |
| KR20080085141A (en)* | 2005-11-15 | 2008-09-23 | 테사 악티엔게젤샤프트 | Use of double-sided pressure sensitive adhesive tapes for bonding in the manufacture of electronic products |
| KR20110075035A (en)* | 2008-10-29 | 2011-07-05 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Electron Beam Cured, Nonfunctionalized Silicone Pressure Sensitive Adhesive |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7560166B2 (en)* | 2005-12-28 | 2009-07-14 | 3M Innovative Properties Company | Adhesive article, composite article, and methods of making the same |
| KR20080037183A (en)* | 2006-10-25 | 2008-04-30 | 실리콘밸리(주) | Thermally Conductive Adhesive |
- 2011
- 2011-12-07KRKR1020110130408Apatent/KR101253991B1/enactiveActive
- 2012
- 2012-04-09CNCN2012101020855Apatent/CN103146338A/enactivePending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050111363A (en)* | 2003-03-17 | 2005-11-24 | 다우 코닝 코포레이션 | Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength |
| KR20080085141A (en)* | 2005-11-15 | 2008-09-23 | 테사 악티엔게젤샤프트 | Use of double-sided pressure sensitive adhesive tapes for bonding in the manufacture of electronic products |
| KR100708441B1 (en)* | 2005-12-30 | 2007-04-18 | 주식회사 케이씨씨 | Silicone composition |
| KR20110075035A (en)* | 2008-10-29 | 2011-07-05 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Electron Beam Cured, Nonfunctionalized Silicone Pressure Sensitive Adhesive |
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| CN103146338A (en) | 2013-06-12 |
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