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JPS647559U - - Google Patents

Info

Publication number
JPS647559U
JPS647559UJP10167287UJP10167287UJPS647559UJP S647559 UJPS647559 UJP S647559UJP 10167287 UJP10167287 UJP 10167287UJP 10167287 UJP10167287 UJP 10167287UJP S647559 UJPS647559 UJP S647559U
Authority
JP
Japan
Prior art keywords
adapter
writing instrument
seal
attached
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10167287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP10167287UpriorityCriticalpatent/JPS647559U/ja
Publication of JPS647559UpublicationCriticalpatent/JPS647559U/ja
Pendinglegal-statusCriticalCurrent

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Description

Translated fromJapanese
【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は本考案の一実施例で、第
1図はその組立要領を示す説明図、第2図はこの
実施例におけるアダプターの平面図、第3図はそ
の縦断面図、第4図及び第5図は本考案の他の実
施例で、第4図はその実施例におけるアダプター
の縦断面図、第5図は同実施例における印章の側
面図である。 1:筆記具、2:キヤツプ、4:アダプター、
8:印章。
Figures 1 to 3 show an embodiment of the present invention, with Figure 1 being an explanatory diagram showing its assembly procedure, Figure 2 being a plan view of the adapter in this embodiment, and Figure 3 being a longitudinal sectional view thereof. 4 and 5 show another embodiment of the present invention, FIG. 4 being a longitudinal sectional view of an adapter in this embodiment, and FIG. 5 being a side view of a seal in the same embodiment. 1: Writing instrument, 2: Cap, 4: Adapter,
8: Seal.

Claims (1)

Translated fromJapanese
【実用新案登録請求の範囲】[Scope of utility model registration request] 筆記具のキヤツプ頂部に装着したアダプターと
同アダプターの頂部に着脱自在に取付けた平盤状
の印章とからなることを特徴とする筆記具用印章
A seal for a writing instrument characterized by consisting of an adapter attached to the top of the cap of the writing instrument and a flat stamp detachably attached to the top of the adapter.
JP10167287U1987-06-301987-06-30PendingJPS647559U (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP10167287UJPS647559U (en)1987-06-301987-06-30

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP10167287UJPS647559U (en)1987-06-301987-06-30

Publications (1)

Publication NumberPublication Date
JPS647559Utrue JPS647559U (en)1989-01-17

Family

ID=31330878

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP10167287UPendingJPS647559U (en)1987-06-301987-06-30

Country Status (1)

CountryLink
JP (1)JPS647559U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7151017B2 (en)2001-01-262006-12-19Semiconductor Energy Laboratory Co., Ltd.Method of manufacturing semiconductor device
US7348227B1 (en)1995-03-232008-03-25Semiconductor Energy Laboratory Co., Ltd.Semiconductor device and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS5858573B2 (en)*1977-01-261983-12-26株式会社荏原製作所 Operation control method for heat recovery heat pump type refrigerator

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS5858573B2 (en)*1977-01-261983-12-26株式会社荏原製作所 Operation control method for heat recovery heat pump type refrigerator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7348227B1 (en)1995-03-232008-03-25Semiconductor Energy Laboratory Co., Ltd.Semiconductor device and manufacturing method thereof
US7816195B2 (en)1995-03-232010-10-19Semiconductor Energy Laboratory Co., Ltd.Semiconductor device and manufacturing method thereof
US7151017B2 (en)2001-01-262006-12-19Semiconductor Energy Laboratory Co., Ltd.Method of manufacturing semiconductor device
US7361577B2 (en)2001-01-262008-04-22Semiconductor Energy Laboratory Co., Ltd.Method of manufacturing semiconductor device

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