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JPS6461638A - Semiconductor pressure sensor - Google Patents

Semiconductor pressure sensor

Info

Publication number
JPS6461638A
JPS6461638AJP62219524AJP21952487AJPS6461638AJP S6461638 AJPS6461638 AJP S6461638AJP 62219524 AJP62219524 AJP 62219524AJP 21952487 AJP21952487 AJP 21952487AJP S6461638 AJPS6461638 AJP S6461638A
Authority
JP
Japan
Prior art keywords
pressure
chip
stem
measured
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62219524A
Other languages
Japanese (ja)
Inventor
Shogo Asano
Kazuhiko Mizojiri
Takashi Morikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co LtdfiledCriticalMatsushita Electric Industrial Co Ltd
Priority to JP62219524ApriorityCriticalpatent/JPS6461638A/en
Publication of JPS6461638ApublicationCriticalpatent/JPS6461638A/en
Pendinglegal-statusCriticalCurrent

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Abstract

PURPOSE:To measure two absolute values of different pressure at the same time by fitting a semiconductor chip which has two pressure sensing diaphragms to a stem which has two through holes and thus forming two pressure application parts. CONSTITUTION:The two pressure sensing diaphragms 6a and 6b are formed on the semiconductor single crystal chip 4. Through holes 16a and 16b, and 17a and 17b are formed in a pedestal 3 formed of a material which has nearly the same coefficient of heat expansion with the chip 4 and the stem 1, and the lower part of the hole 17b serves as a pressure conducting pipe 2. This chip 4 is fitted to the stem 1 through the pedestal 13, and then two pressure application parts are formed and a vacuum chamber 13 is formed at the upper part. The atmospheric pressure is measured by one application part and, for example, air suction manifold pressure is measured by the other, so that the two absolute values of different pressure can be measured at the same time.
JP62219524A1987-09-021987-09-02Semiconductor pressure sensorPendingJPS6461638A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP62219524AJPS6461638A (en)1987-09-021987-09-02Semiconductor pressure sensor

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP62219524AJPS6461638A (en)1987-09-021987-09-02Semiconductor pressure sensor

Publications (1)

Publication NumberPublication Date
JPS6461638Atrue JPS6461638A (en)1989-03-08

Family

ID=16736829

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP62219524APendingJPS6461638A (en)1987-09-021987-09-02Semiconductor pressure sensor

Country Status (1)

CountryLink
JP (1)JPS6461638A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH03200034A (en)*1989-12-281991-09-02Matsushita Electric Ind Co Ltd semiconductor pressure sensor
JPH03200035A (en)*1989-12-281991-09-02Matsushita Electric Ind Co Ltd semiconductor pressure sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH03200034A (en)*1989-12-281991-09-02Matsushita Electric Ind Co Ltd semiconductor pressure sensor
JPH03200035A (en)*1989-12-281991-09-02Matsushita Electric Ind Co Ltd semiconductor pressure sensor

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