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JPS6454749A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS6454749A
JPS6454749AJP21199387AJP21199387AJPS6454749AJP S6454749 AJPS6454749 AJP S6454749AJP 21199387 AJP21199387 AJP 21199387AJP 21199387 AJP21199387 AJP 21199387AJP S6454749 AJPS6454749 AJP S6454749A
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
protrusions
semiconductor chip
highly accurate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21199387A
Other languages
Japanese (ja)
Inventor
Isamu Kitahiro
Shuji Kondo
Tatsuo Kikuchi
Yoshihisa Takase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co LtdfiledCriticalMatsushita Electric Industrial Co Ltd
Priority to JP21199387ApriorityCriticalpatent/JPS6454749A/en
Publication of JPS6454749ApublicationCriticalpatent/JPS6454749A/en
Pendinglegal-statusCriticalCurrent

Links

Classifications

Landscapes

Abstract

PURPOSE:To obtain a highly accurate and highly reliable semiconductor device by placing a semiconductor chip through an insulating substrate on one group of highly accurate metal leads, connecting the leads to fine metal wirings, and transfer molding them. CONSTITUTION:A thin resin plate 3 is attached to leads 1 having protrusions 6, and electrodes on a semiconductor chip 4 are connected to the leads 1 by fine metal wirings 5. Then, the leads except the protrusions 6 are sealed with resins 2, 7, shape and size are determined and cut. According to this structure, a small-sized and thin semiconductor device having high dimensional accuracy and reliability is obtained without complicated structure like a both-side substrate only by employing metal leads of special shape at part, and is freferably adapted for an IC.
JP21199387A1987-08-261987-08-26Semiconductor device and manufacture thereofPendingJPS6454749A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP21199387AJPS6454749A (en)1987-08-261987-08-26Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP21199387AJPS6454749A (en)1987-08-261987-08-26Semiconductor device and manufacture thereof

Publications (1)

Publication NumberPublication Date
JPS6454749Atrue JPS6454749A (en)1989-03-02

Family

ID=16615120

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP21199387APendingJPS6454749A (en)1987-08-261987-08-26Semiconductor device and manufacture thereof

Country Status (1)

CountryLink
JP (1)JPS6454749A (en)

Cited By (43)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH01171234A (en)*1987-12-251989-07-06Texas Instr Japan LtdSemiconductor device
JPH1154551A (en)*1997-08-041999-02-26Matsushita Electron CorpPlastic molded type semiconductor device and manufacture thereof
JPH11297750A (en)*1998-04-081999-10-29Matsushita Electron CorpSemiconductor device, manufacture thereof, and mounting of the semiconductor device
US6274927B1 (en)1999-06-032001-08-14Amkor Technology, Inc.Plastic package for an optical integrated circuit device and method of making
US6281568B1 (en)1998-10-212001-08-28Amkor Technology, Inc.Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6320251B1 (en)2000-01-182001-11-20Amkor Technology, Inc.Stackable package for an integrated circuit
US6404046B1 (en)2000-02-032002-06-11Amkor Technology, Inc.Module of stacked integrated circuit packages including an interposer
US6469369B1 (en)1999-06-302002-10-22Amkor Technology, Inc.Leadframe having a mold inflow groove and method for making
US6475827B1 (en)1999-10-152002-11-05Amkor Technology, Inc.Method for making a semiconductor package having improved defect testing and increased production yield
US6476478B1 (en)1999-11-122002-11-05Amkor Technology, Inc.Cavity semiconductor package with exposed leads and die pad
US6501161B1 (en)1999-10-152002-12-31Amkor Technology, Inc.Semiconductor package having increased solder joint strength
US6518659B1 (en)2000-05-082003-02-11Amkor Technology, Inc.Stackable package having a cavity and a lid for an electronic device
US6525406B1 (en)1999-10-152003-02-25Amkor Technology, Inc.Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en)1999-10-152003-04-29Amkor Technology, Inc.Semiconductor package leadframe assembly and method of manufacture
US6605866B1 (en)1999-12-162003-08-12Amkor Technology, Inc.Stackable semiconductor package and method for manufacturing same
US6616436B1 (en)1999-10-152003-09-09Amkor Technology, Inc.Apparatus for manufacturing semiconductor packages
US6627976B1 (en)1999-10-152003-09-30Amkor Technology, Inc.Leadframe for semiconductor package and mold for molding the same
KR100404062B1 (en)*2000-05-242003-11-03산요덴키가부시키가이샤Plate and method of manufacturing a semiconductor device
US6646339B1 (en)1999-10-152003-11-11Amkor Technology, Inc.Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en)1999-10-152004-01-13Amkor Technology, Inc.Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6677663B1 (en)1999-12-302004-01-13Amkor Technology, Inc.End grid array semiconductor package
US6696747B1 (en)1999-10-152004-02-24Amkor Technology, Inc.Semiconductor package having reduced thickness
US6730544B1 (en)1999-12-202004-05-04Amkor Technology, Inc.Stackable semiconductor package and method for manufacturing same
US6753597B1 (en)1999-12-162004-06-22Amkor Technology, Inc.Encapsulated semiconductor package including chip paddle and leads
US6756658B1 (en)2001-04-062004-06-29Amkor Technology, Inc.Making two lead surface mounting high power microleadframe semiconductor packages
US6833609B1 (en)1999-11-052004-12-21Amkor Technology, Inc.Integrated circuit device packages and substrates for making the packages
US6847099B1 (en)2003-02-052005-01-25Amkor Technology Inc.Offset etched corner leads for semiconductor package
US6853059B1 (en)1999-10-152005-02-08Amkor Technology, Inc.Semiconductor package having improved adhesiveness and ground bonding
US7192807B1 (en)2002-11-082007-03-20Amkor Technology, Inc.Wafer level package and fabrication method
US7361533B1 (en)2002-11-082008-04-22Amkor Technology, Inc.Stacked embedded leadframe
US7572681B1 (en)2005-12-082009-08-11Amkor Technology, Inc.Embedded electronic component package
US8154111B2 (en)1999-12-162012-04-10Amkor Technology, Inc.Near chip size semiconductor package
US8866278B1 (en)2011-10-102014-10-21Amkor Technology, Inc.Semiconductor device with increased I/O configuration
US8900995B1 (en)2010-10-052014-12-02Amkor Technology, Inc.Semiconductor device and manufacturing method thereof
US8981572B1 (en)2011-11-292015-03-17Amkor Technology, Inc.Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en)2012-03-292015-06-02Amkor Technology, Inc.Backside warpage control structure and fabrication method
US9082833B1 (en)2011-01-062015-07-14Amkor Technology, Inc.Through via recessed reveal structure and method
US9631481B1 (en)2011-01-272017-04-25Amkor Technology, Inc.Semiconductor device including leadframe with a combination of leads and lands and method
US9673122B2 (en)2014-05-022017-06-06Amkor Technology, Inc.Micro lead frame structure having reinforcing portions and method
US9691734B1 (en)2009-12-072017-06-27Amkor Technology, Inc.Method of forming a plurality of electronic component packages
US9704725B1 (en)2012-03-062017-07-11Amkor Technology, Inc.Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en)2012-03-292018-07-03Amkor Technology, Inc.Embedded component package and fabrication method
US10811341B2 (en)2009-01-052020-10-20Amkor Technology Singapore Holding Pte Ltd.Semiconductor device with through-mold via

Cited By (57)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH01171234A (en)*1987-12-251989-07-06Texas Instr Japan LtdSemiconductor device
JPH1154551A (en)*1997-08-041999-02-26Matsushita Electron CorpPlastic molded type semiconductor device and manufacture thereof
JPH11297750A (en)*1998-04-081999-10-29Matsushita Electron CorpSemiconductor device, manufacture thereof, and mounting of the semiconductor device
US6455356B1 (en)1998-10-212002-09-24Amkor TechnologyMethods for moding a leadframe in plastic integrated circuit devices
US6281568B1 (en)1998-10-212001-08-28Amkor Technology, Inc.Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6274927B1 (en)1999-06-032001-08-14Amkor Technology, Inc.Plastic package for an optical integrated circuit device and method of making
US6420204B2 (en)1999-06-032002-07-16Amkor Technology, Inc.Method of making a plastic package for an optical integrated circuit device
US6469369B1 (en)1999-06-302002-10-22Amkor Technology, Inc.Leadframe having a mold inflow groove and method for making
US6475827B1 (en)1999-10-152002-11-05Amkor Technology, Inc.Method for making a semiconductor package having improved defect testing and increased production yield
US6627976B1 (en)1999-10-152003-09-30Amkor Technology, Inc.Leadframe for semiconductor package and mold for molding the same
US6853059B1 (en)1999-10-152005-02-08Amkor Technology, Inc.Semiconductor package having improved adhesiveness and ground bonding
US6696747B1 (en)1999-10-152004-02-24Amkor Technology, Inc.Semiconductor package having reduced thickness
US6501161B1 (en)1999-10-152002-12-31Amkor Technology, Inc.Semiconductor package having increased solder joint strength
US6677662B1 (en)1999-10-152004-01-13Amkor Technology, Inc.Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6525406B1 (en)1999-10-152003-02-25Amkor Technology, Inc.Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en)1999-10-152003-04-29Amkor Technology, Inc.Semiconductor package leadframe assembly and method of manufacture
US6646339B1 (en)1999-10-152003-11-11Amkor Technology, Inc.Thin and heat radiant semiconductor package and method for manufacturing
US6616436B1 (en)1999-10-152003-09-09Amkor Technology, Inc.Apparatus for manufacturing semiconductor packages
US6833609B1 (en)1999-11-052004-12-21Amkor Technology, Inc.Integrated circuit device packages and substrates for making the packages
US6476478B1 (en)1999-11-122002-11-05Amkor Technology, Inc.Cavity semiconductor package with exposed leads and die pad
US6605866B1 (en)1999-12-162003-08-12Amkor Technology, Inc.Stackable semiconductor package and method for manufacturing same
US8154111B2 (en)1999-12-162012-04-10Amkor Technology, Inc.Near chip size semiconductor package
US6753597B1 (en)1999-12-162004-06-22Amkor Technology, Inc.Encapsulated semiconductor package including chip paddle and leads
US6730544B1 (en)1999-12-202004-05-04Amkor Technology, Inc.Stackable semiconductor package and method for manufacturing same
US6677663B1 (en)1999-12-302004-01-13Amkor Technology, Inc.End grid array semiconductor package
US6320251B1 (en)2000-01-182001-11-20Amkor Technology, Inc.Stackable package for an integrated circuit
US6404046B1 (en)2000-02-032002-06-11Amkor Technology, Inc.Module of stacked integrated circuit packages including an interposer
US6518659B1 (en)2000-05-082003-02-11Amkor Technology, Inc.Stackable package having a cavity and a lid for an electronic device
KR100404062B1 (en)*2000-05-242003-11-03산요덴키가부시키가이샤Plate and method of manufacturing a semiconductor device
US6756658B1 (en)2001-04-062004-06-29Amkor Technology, Inc.Making two lead surface mounting high power microleadframe semiconductor packages
US9054117B1 (en)2002-11-082015-06-09Amkor Technology, Inc.Wafer level package and fabrication method
US7192807B1 (en)2002-11-082007-03-20Amkor Technology, Inc.Wafer level package and fabrication method
US7247523B1 (en)2002-11-082007-07-24Amkor Technology, Inc.Two-sided wafer escape package
US7361533B1 (en)2002-11-082008-04-22Amkor Technology, Inc.Stacked embedded leadframe
US7420272B1 (en)2002-11-082008-09-02Amkor Technology, Inc.Two-sided wafer escape package
US10665567B1 (en)2002-11-082020-05-26Amkor Technology, Inc.Wafer level package and fabrication method
US9871015B1 (en)2002-11-082018-01-16Amkor Technology, Inc.Wafer level package and fabrication method
US6847099B1 (en)2003-02-052005-01-25Amkor Technology Inc.Offset etched corner leads for semiconductor package
US7572681B1 (en)2005-12-082009-08-11Amkor Technology, Inc.Embedded electronic component package
US11869829B2 (en)2009-01-052024-01-09Amkor Technology Singapore Holding Pte. Ltd.Semiconductor device with through-mold via
US10811341B2 (en)2009-01-052020-10-20Amkor Technology Singapore Holding Pte Ltd.Semiconductor device with through-mold via
US9691734B1 (en)2009-12-072017-06-27Amkor Technology, Inc.Method of forming a plurality of electronic component packages
US10546833B2 (en)2009-12-072020-01-28Amkor Technology, Inc.Method of forming a plurality of electronic component packages
US8900995B1 (en)2010-10-052014-12-02Amkor Technology, Inc.Semiconductor device and manufacturing method thereof
US9082833B1 (en)2011-01-062015-07-14Amkor Technology, Inc.Through via recessed reveal structure and method
US9978695B1 (en)2011-01-272018-05-22Amkor Technology, Inc.Semiconductor device including leadframe with a combination of leads and lands and method
US9631481B1 (en)2011-01-272017-04-25Amkor Technology, Inc.Semiconductor device including leadframe with a combination of leads and lands and method
US8866278B1 (en)2011-10-102014-10-21Amkor Technology, Inc.Semiconductor device with increased I/O configuration
US9947623B1 (en)2011-11-292018-04-17Amkor Technology, Inc.Semiconductor device comprising a conductive pad on a protruding-through electrode
US10410967B1 (en)2011-11-292019-09-10Amkor Technology, Inc.Electronic device comprising a conductive pad on a protruding-through electrode
US8981572B1 (en)2011-11-292015-03-17Amkor Technology, Inc.Conductive pad on protruding through electrode semiconductor device
US11043458B2 (en)2011-11-292021-06-22Amkor Technology Singapore Holding Pte. Ltd.Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode
US10090228B1 (en)2012-03-062018-10-02Amkor Technology, Inc.Semiconductor device with leadframe configured to facilitate reduced burr formation
US9704725B1 (en)2012-03-062017-07-11Amkor Technology, Inc.Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en)2012-03-292018-07-03Amkor Technology, Inc.Embedded component package and fabrication method
US9048298B1 (en)2012-03-292015-06-02Amkor Technology, Inc.Backside warpage control structure and fabrication method
US9673122B2 (en)2014-05-022017-06-06Amkor Technology, Inc.Micro lead frame structure having reinforcing portions and method

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